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EK-BA200-DG-001
August 1987
93 pages
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BA200 Series Module Design Guide
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EK-BA200-DG
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001
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BA200 Series Module Design Guide Order Number. EK-BA200-DG-001 digital equipment corporation maynard, massachusetts First Edition, August 1987 The information in this document is subject to change without notice and should not be construed as a commitment by Digital Equipment Corporation. Digital Equipment Corporation assumes no responsibility for any errors that may appear in this document. The software, if any, described in this document is furnished under a license and may be used or copied only in accordance with the terms of such license. No responsibility is assumed for the use or reliability of software or equipment that is not supplied by Digital Equipment Corporation or its affiliated companies. Copyright ©1987 by Digital Equipment Corporation. All Rights Reserved. Printed in U.S.A. Flexcon is a trademark of Flexcon Company, Inc. Krylon is a registered trademark of Borden, Inc. Q-Tip is a registered trademark of Chesebrough-Pond’s, Inc. Ultra-Flex is a registered trademark of Intertherm, Inc. 3-M 209 is a registered trademark of Minnesota Mining and Manufacturing Company. 3-M 213 is a trademark of Minnesota Mining and Manufacturing Company. The following are trademarks of Digital Equipment Corporation: EduSystem IAS MASSBUS UNIBUS VAX VAXcluster VMS DECsystem-10 PDP VT DECSYSTEM-20 PDT DECwriter RSX Bflg fln DEC DEC/CMS DEC/MMS DECnet DECUS DIBOL RSTS - E 2 Preface | Chapter 1 ix Basic Concepts of the BA200 Series Enclosures 1.1 Description. 1.2 Electrical Current Flow Within the BA200 Series 1.2.1 . . ... ... . .. . 1-1 .. ... ... 1-3 Isolating Sources of Current . . .. .. ... ... ........ 1-4 1.3 How the BA200 Series Provides EMI Shielding ... ... ... 1-5 14 What is a Bulkhead? . . . .. ... ... e e 1-6 1.5 Bulkhead Features . ... ...................... . 1-8 Chapter 2 Designing BA200 Series Modules 2.1 Adapting Modules Without External /O . . . . . ... ... ... 2-2 2.2 Adapting Modules With External I/O, LEDs, or Switches . . . 2-5 2.2.1 Recessed Versus Flush Handles 2.3 . ... ............. 2-6 Designing New Modules . . ... ................... 2-10 2.3.1 Reducing EMI Generation 2.3.2 Choosing and Placing I/O Connectors 2.3.2.1 . ......... e . . ... .. ...... Preferred Interconnect Design . . . ... ... ... ..... 2.3.3 Filters 2.3.4 Design Example . . . .. ................... ... Chapter 3 . . ... .. . . . . 2-11 2-14 2-14 2-15 2-15 Attaching Connectors, LEDs and Switches to Modules 3.1 Modules Without External I/O . . .. ... .. .. ... ...... 3-1 3.2 Modules With External I/O, LEDs or Switches .-/ . . ... ... 3-3 Using the H3651 Bulkhead Product Kit . . .. ... ...... 3-3 3.2.1 3.2.1.1 Mounting Connectors . . . ... ................ 3-5 3.2.2 Using Other Bulkhead Product Kits (H3652 - H3655) . . .. Drilling the BA200 Series Bulkheads . . . . ... ... ... 3-11 3-11 Cleaning the Bulkheads . .................... Retouching the Bulkheads . . . . ................ 3-11 Additional Considerations . . . .. ... ............... 3.3 Labeling the Bulkheads . ...................... 3.3.1 WhenToUseaGapPFiller ..................... 332 3-11 3-12 3-12 3-13 3.3.3 Before InstallingaModule . . . .................. 3-15 334 WhenToUseaGrantCard .................... 3-15 3.2.2.1 3.2.2.2 3.2.2.3 Chapter 4 Product Kits 41 H3650 - Bulkhead Evaluation Kit . . . .. .. ... ......... 4-2 4.2 H3651 - Bulkhead Assembly Kit . . ................. 4-4 4.3 H3652-H3655 : Other Bulkhead Product Kits . . . .. ... ... 4-6 4.3.1 H3652 - Recessed Handle . .................... 4-7 4.3.2 H3653 -FlushHandle . . ... .. ................. 4-8 4.3.3 H3654 - Double Cover. .. 4-9 4.3.4 H3655 - Single Cover . . ...................... 4-10 4.4 H3656-Dual FillerPanel . . . ... ... ... ............ 4-11 45 H3657-GapFillerKit. 4-12 Chapter 5 5.1 . . ... .. .. . .. .. ....................... Using Product Kits Using Space Behind the Double Cover .............. 5-1 . ... ..................... 5-1 5.1.1 Product Description 5.1.2 Approach . . ..... ... ... .. . . L 5.2 Adapting Existing Modules 5.2.1 Product Description 5.2.2 Approach ... ... ... ... .. . . . 5-1 . ..................... 5-4 .. ....................... 5-4 o 5-4 5.3 Designing With Non-Standard 1/O Connectors, Switches and LEDs . . . . 5-6 5.3.1 Product Description ......................... 5-6 532 Approach ......... ... . ... . . oo o 5-7 5.4 Adapting a Module WithI/Oand LEDs . ............. 5-8 5.4.1 Product Description ......................... 5-8 542 Approach ......... ... . ... ..o 5-8 v , 5.5 Adapting a Module Without External /IO - 5.5.1 5.5.2 5.6 . . .. ... ...... 5-10 Product Description . . ... O 5-10 Approach . .. ... ... .. ..., UsingaDual FillerPanel . . .. ... ... 5-10 ... ........... 5-11 5.6.1 Product Description . . U 5-11 5.6.2 Approach . ... ... ... . ..., 5-11 Appendix A Appendix B BA200 Series Power Supply (H7868) Backplane in the BA200 Series B.1 Grant Continuity and the BA200 Series Backplane . . ... .. B-1 B.2 Description of the BA213 Backplane, . . ... ........... B-3 Load Module (Systems with Two Power Supplies) . . . .. B-4 B.2.1 Glossary Index Figures 1-1 BAZ213 Enclosure: Example of BA200 Enclosure . . . ... ... 1-2 1-2 Current Paths Within a BA200 Series Enclosure . .. ... ... 1-3 . ............... 1-4 ... ...... ... ... ... ... ........... 1-5 1-3 Etch Grounding of a BA200 Module 1-4 Faraday Shield 1-5 TypesofBulkheads . .......................... 1-6 1-6 Examples of BA200 Series Handles and Covers . . . . ... . 1-7 2-1 Flush Handleand Module . . . .. .................. 2-2 2-2 Single Cover and Quad-Height Module ... ........... 2-3 2-3 Single Cover and Dual-Height Module . . . . .. ... ... ... 2-4 2-4 Double Cover and Quad-Height Modules . . . . ......... 2-5 2-5 Clearances For BA200 Series Bulkheads . . ... ... ...... 2-7 2-6 RecessedHandle . .. ... ..... ... ... ............ 2-8 2-7 FlushHandle 2-9 ........ .. ... ... ... ... ... ....... 2-8 Current Paths Within a BA200 Series Enclosure . . . ... . .. 2-11 2-9 Etch Grounding of a BA200 Module . ........... ... . 2-12 2-10 Right Angle Connector on Module ... .............. 2-14 .. ... ... 2-15 2-11 Cross Sectionof Handle . . ... ...... ... ... 3-1 Module Dimensions . . . . ... .. .o i e 3-2 3-2 Adapter Plates in Bulkhead Assembly Kit . . . ... ....... 3-4 Recessed Handle With Adapter Plates . . . ... ... ...... 3-5 3-4 Dimensions and Locations of 9-Pin Connector Holes . . . .. 3-6 3-5 15-Pin Adapter Plates and Holes . . . . . e 3-7 3-6 25-Pin Adapter Platesand Holes . . . . .. ............. 3-8 3-7 37-Pin Adapter Plates and Holes . . . . . e 3-9 3-8 Holes for Two 50-Pin Connectors . ... .............. 3-10 3-9 Dimensions of a Bulkhead Label . . . . . ... ........... 3-13 3-10 Gap Fillerand Flush Cover . ... .................. 3-14 4-1 Contents of Bulkhead Evaluation Kit (H3650). .. ... ... .. 4-3 4-2 Contents of Bulkhead Assembly Kit (H3651) . . ....... .. 4-5 4-3 Recessed Handle Kit Contents (H3652) ... ... ... .... .. 4-7 4-4 Flush Handle Kit Contents (H3653) . . . ... ... ... ..... 4-8 4-5 Double Cover Kit Contents (H3654) .. .............. 4-9 4-6 Single Cover Kit Contents (H3655) ... .............. 4-10 4-7 Dual Filler Panel Kit Contents (H3656) . . . ... ... ...... 4-11 4-8 Gap Filler Kit Contents (H3657) . . ... .............. 4-12 5-1 Double Coverand Modules . . . . . ... .............. 5-2 5-2 Double Cover and Printed Circuit Board . ... ... ... ... 5-3 5-3 Quad-Height Module . .. ....................... 5-4 5-4 Recessed Handle and Quad-Height Module . ... ... .. .. 5-5 5-5 Quad-Height Communication Module . . . ... ... ...... 5-6 5-6 Handle of Module . . ... .. ... .. ... ... ... 5-7 5-7 Module With Three LEDs, Fuse and Ribbon Cable . . . . . . . ... 5-8 5-8 Module Rivetedto Handle . . . . .. ... ... ........... 5-9 5-9 Single Coverand Module 5-10 . .. ... ................. 5-10 Flush Handle and Dual-Height Module ... ........... 5-11 B-1 BA123 Series Backplane Grant Continuity . . . . ... ... ... B-1 B-2 BA200 Series Backplane Grant Continuity . . . . ... ... ... B-2 B-3 BA213 Backplane . . . ... ... ..o B-3 Vi Tables 2-1 Sourcesof Noise . . . ...... ... 3-1 Adapter Plates for the BA200 Series .. .............. 3-3 3-2 Materials Required for Bulkhead Labels . .. ... ..... ... 3-12 3-3 Design Format for Bulkhead Labels . . . ... ........... 3-12 4-1 Bulkhead Evaluation Kit - H3650 . . . .. ... ........... 4-2 ... ... ... ... ..... 2-10 4-2 Bulkhead Assembly Kit - H3651 . .. ................ 4-4 4-3 BA200 Coversand Handles . . . . .. ................ 4-6 4-4 Recessed Handle - H3652 . ... ... ................ 4-7 4-5 Flush Handle-H3653 . . . .. ... .................. 4-8 4-6 Double Cover - H3654 . . ....................... 4-9 4-7 Single Cover - H3655 . . . .......... ... ... ........ 4-10 4-8 Dual Filler Panel - H3656 . . . . . .. e 4-11 4-9 Gap Filler Kit - H3657 . . . . ... ... ... ... .......... 4-12 B-1 Backplanes . . . .. ... ... . ... L B-4 ... vii Preface Intended Audience This guide is written for hardware engineers who design modules for the BA200 Series of microsystem enclosures. It assumes knowledge of basic electronics concepts and terminology. It does not assume knowledge of the BA200 Series or other Digital products. This guide is designed to accompany several Bulkhead Product Kits that allow engineers to design modules for the BA200 Series. It first explains concepts specific to the BA200 Series. Knowledge of these concepts and the appropriate use of the kits is interrelated. This guide describes each of the kits. This guide shows how to do the following: * Modify modules that do not connect to external I/O devices * Modify modules that connect to external I/O devices ®* Design new modules for the BA200 Series enclosures * Mount I/O connectors on bulkheads e Mount I/O connectors on modules. Organization This document is organized into five chapters and two appendices. @ | “Chapter"ll presents an overview of the BA200 Series. It shows how the BA200 Series differs from other microsystem enclosures. This chapter explains how BA200 Series enclosures are designed to minimize the Electromagnetic Interference (EMI) emitted by a module. It explains the role of bulkheads in reducing EMI. Chapter 2 describes how to adapt modules designed for other enclosures and how to create new modules for BA200 Series enclosures, It describes how to choose the proper bulkheads for modules with or without external 1/O. It also shows how to create new module layouts for BA200 Series enclosures. Chapter 3 describes the manufacturing issues associated with BA200 Series modules. This chapter shows where to drill pin holes on the modules for different kinds of connectors. It also explains how to drill holes on the bulkheads for connectors, switches and LEDs. Chapter 4 describes the Bulkhead Product Kits currently available from Digital. It provides a complete parts list for each kit. Chapter 5 provides examples of how to select the appropriate bulkhead for a particular application. Appendix A provides a description of the power supply of BA200 Series enclosures. Appendix B provides a description of the backplane of BA200 Series enclosures. A glossary of terms is included in the back of this guide. The first use of each glossary entry is italicized within the chapters of this guide. Related Documents This guide does not describe the MicroVAX or MicroPDP-11. For more information on these systems, see the MicroPDP-11 Maintenance Addendum or the MicroVAX Systems Maintenance Guzde The following documents may be ordered from Digital: Order Number Technical Manual AZ-FI11A-MC MicroPDP-11 Systems Maintenance Guide MicroPDP-11 Maintenance Addendum EK-00000-AC Industrial MicroPDP-11/53 Installation EK-134AA-IN Industrial MicroPDP-11/53 Operation EK-135AA-OP Industrial MicroPDP-11/53 Troubleshooting Industrial MicroPDP-11/53 Technical Information ~ b EK-136AA-TS EK-137AA-TM Industrial MicroPDP-11/83 Installation EK-O32AA-IN Industrial MicroPDP-11/83 Operation EK-O76AA-OP Industrial MicroPDP-11/83 Troubleshooting EK-110AA-TS Industrial MicroPDP-11/83 Technical Information EK-O78AA-TM Industrial PDP Maintenance Addendum EK-152AA-MA MicroVAX Systems Maintenance Guide EK-001AA-MG Factory Systems Site Prep Guide EK-O74AA-SP Factory Systems Customer Services EK-O31AA-SV Xi Terminology This guide uses the following terms as they are here defined. Term Meaning | A line of microsystem enclosures that house the MicroVAX The BA213 and BA214 are examples or MicroPDP-11. BA200 Series of the BA200 Series. A cover or handle that helps contain electrical noise that a sys- Bulkhead Cover tem generates. | A bulkhead that is not attached to a module. Handle A bulkhead that is attached to a module. Module A printed nifies circuit board. The term BA200 module sig- a module that is designed specifically for a BA200 Se- ries enclosure. These and other terms are defined in the glossary. The first use of each glossary entry is italicized within the chapters of this guide. - Measurements All physical dimensions listed in this guide are shown in inches unless otherwise indicated. Xii Chapter 1 Basic Concepts of the BA200 Series Enclosures The BA200 Series is a family of microsystem enclosures. Each of the enclosures has a six- or twelve-slot Q22-bus backplane and one or two modular power supplies. 1.1 Description BA200 Series enclosures can be mounted vertically, in a rack or on the wall. For example, the BA213 mounts vertically inside a cabinet such as Digital’s H994 cabinet, using a BA213-RA rackmount kit. The BA200 Series card cage is designed so that all modules, cables, and options can be accessed from the front (Flgure 1-1). The module bulkheads are designed for easy system access and maintenance, and provide containment of elecfromagnetic interference (EMI) emissions, Basic Concepts of the BA200 Series Enclosures 1-1 Figure 1-1: BA213 Enclosure: Example of BA200 Enclosure i Pl HEH i 1 |1 - ; i it ;[ i 1-2 BA200 Series Module Design Guide 1.2 Electrical Current Flow Within the BA200 Series BA200 Series enclosures have design features that reduce EMI emissions from the system. These features are best explained through an understanding of electrical current paths within the enclosure. Figure 1-2 shows three current paths within the enclosure: (1) the current that passes along the I/O cable; (2) the current flow through the module logic board; (3) the current flow through the electrical shield. The recommended strategy for reducing EMI within the card cage is to isolate the sources of current from one another. Figure 1-2: Current Paths Within a BA200 Series Enclosure L CABLE — FARADAY . — @ SHIELD I/0 GROUND LOGIC GROUND MA-0976-87 Basic Concepts of the BA200 Series Enclosures 1-3 gt 1.2.1 Isolating Sources of Current The logic and I/O grounds must be isolated before the sources of current can be isolated. Leaving a high impedance path between the logic and I/O grounds isolates the grounds. A low impedance path between the I/O ground and the handle ground must also be left. Figure 1-3 shows where the etches on a module should be placed. Note where paths of high and low impedance are located. There are additional strategies that isolate the sources of current in a BA200 Series enclosure. These strategies are discussed in Chapter 2. Figure 1-3: Etch Grounding of a BA200 Module HANDLE GROUND RELATIVELY P LOW 1 IMPEDANCE I/O0 GROUND RELATIVELY HIGH «—g— |MPEDANCE LOGIC GROUND —__1| MA-0975-87 1-4 BA200 Series Module Design Guide 1.3 How the BA200 Series Provides EMI | Shielding In addition to reducing EMI, the BA200 Series enclosures help contain noise generated by the system. The traditional method of providing overall EMI shielding is the Faraday shield, shown in Figure 1-4. This design helps ensure that noise generated by the antenna effect or any other effect will remain within the enclosure. Figure 1-4: Faraday Shield SYSTEM BOX SYSTEM BOX SHIELDED CABLE MA-0970-87 The bulkhead design uses the concept of the Faraday Shield to form a grounded electrical shield that complies with EMI regulations by (1) keeping frequencies generated by the system inside the enclosure, and (2) keeping radio frequencies out of the enclosure. The bulkheads supplied in the Bulkhead Product Kits (see Chapter 4) provide one way of ensuring that a module is properly shielded. The design of the BA200 Series bulkheads allows for the attachment of 1/O connectors, LEDs, and switches to the bulkhead. Openings can be made in the bulkhead for these items provided they follow the constraints described in Chapter 4. Deviations from these constraints require the use of a filtered connector. The BA200 Series bulkheads also reduce EMI emissions by eliminating the need for internal cabling. emissions. Internal cables are a common source of EMI Basic Concepts of the BA200 Series Enclosures 1-5 1.4 What is a Bulkhead? A bulkhead is a handle that is attached to a module or a cover that is not attached to a module. A bulkhead provides EMI emissions containment for a slot in a card cage. Bulkheads attached to modules can be either recessed or flush. Bulkheads that are not attached to modules can be either single or double width. This guide identifies the four kinds of bulkheads as follows: e Recessed handle ¢ Flush handle e Single cover ¢ Double cover Figure 1-5 shows the types of bulkheads used in a BA200 Series enclosure. Figure 1-5: Types of Bulkheads BULKHEAD y L/ Y HANDLE COVER v i | RECESSED ] | | FLUSH SINGLE WIDTH DOUBLE WIDTH (H3653) (H3655) (H3654) v Jv \ BLANK PRE-CUT (H3652) (H3651) MA-1036-87 1-6 BA200 Series Module Design Guide Note that bulkheads include both handles and covers. There are two types of handles - recessed and flush. Recessed handles are further classified as blank or pre-cut. There are two types of covers - single width and double width. All covers are flush and blank, never recessed or pre--cut. All handles are single width. | Figure 1-5 shows the product kit numbers that contain the corresponding bulkheads. See Chapter 4 for more information on the product kits. Figure 1-6 shows the bulkheads used by the BA200 series. Each bulkhead has two captive quarter-turn phillips screws to hold it in the card cage. Each handle has release levers to help install or remove the module from the card cage. Each handle also has a reserved area at its upper end for the module | @ W (A I J Examples of BA200 Series Handles and Covers v Figure 1-6: [ number. FLUSH HANDLE RECESSED HANDLE SINGLE COVER DOUBLE COVER (H3653) (H3652) (H3655) (H3654) MA-1087-86A Basic Concepts of the BA200 Series Enclosures 1-7 1.5 Bulkhead Features BA200 Series bulkheads are designed to provide the following: ¢ EMI emissions shielding e Added rigidity to the module e Space for I/O connectors o A location for module identification and labeling for switches, LEDs and connectors e A latching mechanism for module insertion and extraction ¢ Windows for module diagnostic LEDs and switches ¢ Low impedance bonding between I/O transceiver ground and chassis ground o 1-8 Space for interface/adaptive circuitry. BA200 Series Module Design Guide Chapter 2 Designing BA200 Series Modules This chapter first describes how to modify modules that are used in other Digital enclosures. It explains the requirements for bulkheads that are different from those used in other Digital enclosures. Second, this chapter explains the proper layout for modules designed for BA200 Series enclosures, and offers guidelines for reducing EMI emissions. Design considerations differ for modules with and without external I/O connectors. For example, it is easy to adapt for use in the BA200 Series, a module without external I/O connectors. Adapting a module with external I/O connectors requires more planning and designing an entirely new module requires even more planning. This chapteris divided into three sections. * Adapting Modules Without External I/O * Adapting Modules With External 1/O, LEDs, or Switches ¢ Designing New Modules Whether adapting or creating a module, refer to Section B.1 in Appendix B. This appendix contains essential information on grant continuity and the BA200 Series backplane. Designing BA200 Series Modules 2-1 2.1 Adapting Modules Without External 1/0O This section describes how to adapt existing modules from other computer enclosures for use in the BA200 Series enclosures. It is relatively easy to adapt modules without external I/O from other enclosures. When adapting a non-1/O module for the BA200 Series, a cover or a handle must be used with the module. Using a handle makes installation and removal of the module easier. The non-1/O quad-height module must be riveted to a flush handle at four places. Figure 2-1 shows how a module is attached to a flush handle (Kit H3653). (See Chapter 4 for positioning drill holes.) Figure 2-1: Flush Handle and Module i 2-2 BA200 Series Module Design Guide MA-0982-87A A cover can be used with a non-I/O module. A quad-height module without Q22-bus signals in rows C and D can be installed in the BA200 backplane. The slot can be covered with a BA200 Series cover. Figure 2-2 shows how a cover (Kit H3655) and a module are used. Figure 2-2: Single Cover and Quad-Height Module | ks T i F q 5 ‘ MA-0983-87A Designing BA200 Series Modules 2-3 A single cover can be used with a dual-height module and dual filler panel (Kit H3656). Figure 2-3 shows how to use these components together. i Figure 2-3: Single Cover and Dual-Height Module it i 1t i i [ [ B B . | = i | | ! i | MA-1244-86D See Chapter 4 for more information on the covers and handles that can be used in the BA200 Series microsystem enclosures. 2-4 BA200 Series Module Design Guide 2.2 Adapting Modules With External 1/0, LEDs, or Switches Adapting a module with external /O involves many of the same considerations as adapting a module without external I/O. However, there are additional issues that must be considered when adapting modules with external I/0O. This section deals specifically with these concerns. When adapting a module with one or more I/O connectors, a BA200 Series cover or a handle can be used. Depending on the module type, either a single cover (Kit H3655) or a double cover (Kit H3654) can be used. When a double cover is used (Kit H3654) with two modules requiring an I/O connector, a connector hole must be drilled in the cover. (See Chapter 3 for information on how to drill bulkheads.) Figure 2-4 shows how the double cover looks after a hole has been drilled. Figure 2-4: Double Cover and Quad-Height Modules MA-0979-87A Designing BA200 Series Modules 2-5 2.2.1 Recessed Versus Flush Handles When using a handle, determine whether to use a flush handle (Kit H3653) or a recessed handle (Kit H3652). The use of one or the other depends on the kind of I/O connectors the module requires. Connectors on BA200 Series bulkheads must adhere to certain clearances. Depending on whether a bulkhead is flush or recessed, its connectors and switches must fall within the clearances shown in Figure 2-5. An existing module must be adapted with these clearances in mind. External cabling must not exceed 1.57 inches in depth (4.00 cm) on a flush handle or 2.6 inches (6.5 cm) in depth on a recessed handle. External cabling must be kept within these limits. If the module requires a bulky external cable and connector, a recessed handle must be used to provide the necessary clearance. The recessed handle reduces the space between the connector on the module and the connector on the handle. Figure 2-5 also shows the maximum clearances between a module and a cover. If circuitry or a connector is required on a cover, it must not exceed these clearances. 2-6 BA200 Series Module Design Guide Figure 2-5: Clearances For BA200 Series Bulkheads 1.575 — | CONNECTOR CLEARANCE FOR FLUSH fl ’ N \’- g N N\ §~ 2.600 N CONNECTOR N N N FOR § N > ‘ CLEARANCE RECESSED I fl C \ N N \ \ \ \ N \ N N \ N o} O . | 0.7 IN.—> 1.1 IN. ——>| MA-0972-87 Designing BA200 Series Modules 2-7 Figure 2-6 shows one way of making a module with a recessed handle easier to manufacture and maintain. When long internal cables are needed, use Ultra-Flex type cables instead of ribbon cables. Ultra-Flex cables do not interfere with air-flow inside the enclosure. Ultra-Flex is also more rugged and withstands more scratching from adjacent modules. Figure 2-6: Recessed Handle MA-1244-86B 2-8 BA200 Series Module Design Guide A flush handle allows enough clearance for attaching the internal cable from the module I/O connector to the bulkhead I/O connector. This allows easy manufacturing and maintenance. The use of a flush bulkhead, however, limits the clearance for external cabling to 1.57 inches (4.00 cm). This type of bulkhead should be used only for modules that need small or lower profile external I/O cables. Figure 2-7 shows how a flush handle is used with a small external cable. Figure 2-7: Flush Handle = 16 Ay CONNECTOR | — 12 ONMODUL?}: \ 0] o = °s D | = D ® N N [ [ T Ry ] I f / CONNECTOR ON HANDLE X I_._ q | :z/ c J INTERNAL CABLE MA-1090-868B Designing BA200 Series Modules 2-9 2.3 Designing New Modules This section is helpful in designing a new module or creating a new layout for an existing module. This section is also helpful in modifying the layout of a module with external 1/O. As described in Chapter 1, the design strategy for the BA200 Series enclosures relies on containment of radiations and emissions rather than overall shielding with a Faraday shield. The recommended design strategy also depends on reducing or eliminating radiations and emissions. Table 2-1 lists and describes the kinds of noise that an effective design will | reduce or eliminate. Table 2-1: Sources of Noise Noise Source Description Power supply noise This appears in the supply voltage/ground and may get propagated to the /O lines via the driver or receiver. The solution is to decouple the driver/receiver power input to the low impedance path to the ground plane. Signal rise time This can be a noise source if the signals are fast enough. The solution is to control the slew rate of an integrated circuit to an acceptable value. Antenna effect This is the noise Common mode noise This is caused by signal reference/return being some- up by the etch runs thing other than a perfectly low impedance to the chassis. This causes high frequency noise that appears in the communication driver and receiver lines. The solution is to tie the reference/return of the driver and receiver to a low impedance plane that is also tied by a low impedance path to the chassis. 2-10 picked from the driver and receiver to the I/O connector. The solution is to keep these etch runs short. BA200 Series Module Design Guide 2.3.1 Reducing EMI Generation One of the goals of BA200 Series module design is to reduce EMI. One way of achieving this is to isolate the current sources. To isolate the current sources, the electrical current paths within the enclosure need to be understood. Figure 2-8 shows three current paths within the enclosure: (1) the current that passes along the I/O cable; (2) the current flow through the module logic board; (3) the current flow through the electrical shield. The recommended strategy for reducing EMI within the card cage is to isolate the sources of current from one another. Figure 2-8: Current Paths Within a BA200 Series Enclosure [‘ CABLE FARADAY prssdenseany @ SHIELD /0 GROUND LOGIE GROUND M | IR | BN | B MA-0976-87 Designing BA200 Series Modules 2-11 The logic and I/O grounds must be isolated from each other before the sources of current can be isolated. Leave a high impedance path between the logic and I/O grounds to isolate the grounds. Also, leave a low impedance path between the 1/O ground and the handle ground. Figure 2-9 shows where the etches on a module should be placed. Note where paths of high and low impedance are located. Figure 2-9: Etch Grounding of a BA200 Module HANDLE GROUND RELATIVELY 5 221 _LOW |IMPEDANCE /O GROUND RELATIVELY HIGH <—g— | MPEDANCE LOGIC GROUND —_ ¢/ MA-0975-87 2-12 BA200 Series Module Design Guide There are additional strategies that isolate the sources of current in a BA200 Series enclosure. The following guidelines should be observed when laying out a module: Do not use a solder mask for the ground etch along the handle on Side 2. When a mask is not used, increased contact area with the handle is provided to ensure the lowest impedance path between I/O and chassis ground. Do not use a solder mask on Side 1 around the connector mounting area. When a mask is not used, increased contact area is provided to form the lowest impedance path. . Use any unused area between the module and the bulkhead handle as a ground etch. Make multiple feedthrough holes between Side 1, Side 2 and the inner layer chassis ground plane. Place decoupling capacitors for the drivers, receivers, and protection devices between the handle ground strip and the power pins. Try to keep the I/O etch from extending more than 1.5 inches from the transceiver chip to the I/O connectors. Do not extend the I/O etch more than 3 inches from the transceiver chip. This ensures that I/O is isolated from logic circuitry. Do not run the etch from the I/O area to the logic area except in order to utilize the transceiver circuits. Do not run high frequency lines across the area on the ground. If a module is being debugged with an extender module, provide a method for the I/O ground to connect to the logic ground. Designing BA200 Series Modules 2-13 2.3.2 Choosing and Placing I/0 Connectors As emphasized in Chapter 1, a module should be designed to minimize EMI as much as possible. The type and location of I/O connectors helps reduce the amount of EMI produced in the module. 2.3.2.1 Preferred Interconnect Design To further reduce EMI, select I/O connectors that reduce or eliminate internal cabling. Right angle printed circuit board (PCB) mount-type connectors do not require internal cabling. Figure 2-10 shows a right angle connector located on a module. Figure 2-10: Right Angle Connector on Module (PR MA-0981-87A A right angle PCB mount-type connector reduces noise reception and transmission by reducing the length of etch runs and internal cables. In addition, this type of connector increases reliability because it is attached directly to the bulkhead. 2-14 BA200 Series Module Design Guide 2.3.3 Filters BA200 Series modules that are properly laid out and referenced may not require a filtered connector. However, the drivers and receivers may require a filter for electrostatic discharge (ESD). The use of a filtered connector is recommended in older designs. A filtered connector helps reduce the effects of ESD and helps form the shield for keeping internally generated noise in the enclosure and externally generated noise out. Typically, a filter with one feedthrough capacitor per line is sufficient. In addition, make sure that all I/O connectors, LEDs, and switches are close enough to the I/O etch. 2.3.4 Design Example Figure 2-11 shows a module that was planned using the guidelines in this section. It shows a design that isolates the different sources of current in the enclosure. e All I/O chips and protection devices reference the I/O (transceiver) ground. ° Logic ground is separated from the I/O (transceiver) ground. e The module I/O connector, handle ground, and I/O ground are all connected to the handle. The large area of etch overlapped by the handle provides a low impedance path to I/O ground. Figure 2-11: Cross Section of Handle RIVET HOLES /O CHIPS HANDLE GROUND SIGNAL LINES LOGIC GROUND \ \ \ /" -\ EET——sT ~|1-||-}| ——— U | 1| ISOLATION BARRIER Ig INNER LAYER I/0 (CHASSIS) GROUND FEEDTHROUGH HOLES MA-1097-87 Designing BA200 Series Modules 2-15 Chapter 3 g Connectors, LEDs and Switches to Modules Chapter 2 showed how to modify or create a module for the BA200 Series enclosures. Chapter 4 describes the Bulkhead Product Kits that are available for BA200 Series modules. This chapter shows how to use the kits with modules that are modified or created for the BA200 Series enclosures. This chapter also continues the discussion presented in Chapter 1 on the BA200 Series twofold design strategy - (1) containing noise within the enclosure, and (2) reducing EMI as much as possible. The material presented in this chapter is consistent with these goals. The use of the Bulkhead Product Kits differs for modules with and without external I/O connectors. For example, it is relatively easy to use a single cover (H3655) to cover an empty slot or a module without external 1/O. Preparing a bulkhead for a module with an I/O connector, a LED or a switch requires more planning. Selecting and preparing a bulkhead for an entirely new module requires even more planning. This chapter is divided into two sections. ¢ Modules Without External I/O o Modules With External 1/0O, LEDs, or Switches 3.1 Modules Without External 1/0 A module without external I/O does not require a pre-cut bulkhead. A cover or a handle can be used on a module without external I/O. If the module has a LED or switch, then the bulkhead that is used must be drilled. Section 3.3 explains how to drill a bulkhead. If the module does not require a drilled bulkhead, then a bulkhead from one of the kits can be used without modifications. Attaching Connectors, LEDs and Switches to Modules 3-1 The physical dimensions of a module designed for the BA200 Series are identical to the quad-height module used in the standard Q22-bus card cage. If a single cover (H3655) or a double cover (H3654) is used, the module does not have to be drilled. If a handle is used, the module must have four eyelets for its mounting. Punch these with an eyelet machine at proper line pressure. Figure 3-1 shows the dimensions of a module and rivet holes. It also shows where to drill the holes. Each of the rivet holes must be .142 +.000/-.005 inches in diameter. Figure 3-1: < Module Dimensions 10.00 IN. +,003 bt = 5.250 IN. £.003 legs l 4.750 IN. +.003 - .225 IN. £.003 -5 "— l %Z':/// /'///////"////)//////////////‘//////////////////////////////////////%;{/ //q;/// ///////////I////////////////////////////////"//////'////////////y/’%(/?’. . /7. /s 223 g i St .174 IN. +.008 MA.0971-87 3-2 BA200 Series Module Design Guide 3.2 Modules With External 1/0, LEDs or Switches There are basically two approaches for mounting connectors on bulkheads. The Bulkhead Assembly Kit (H3651) provides a pre-cut recessed handle and several adapter plates for different kinds of connectors. Using the Bulkhead Assembly Kit eliminates the need for drilling holes for several classes of connectors. The other approach requires that one of the other bulkheads (H3652 - H3655) be cut out for an I/O connector. 3.2.1 Using the H3651 Bulkhead Product Kit This section describes how to use the Bulkhead Assembly Kit on a BA200 Series module. It shows how to mount adapter plates onto the pre-cut recessed handle that is supplied in the Bulkhead Assembly Kit (H3651). Table 3-1 lists the five kinds of plates that can be mounted on the pre-cut recessed handle supplied in the Bulkhead Assembly Kit. Table 3-1: Adapter Plates for the BA200 Series Plate Purpose 9-pin connector Use for a 9-pin D-sub connector. 15-pin connector Use for a 15-pin D-sub connector. 25-pin connector Use for a 25-pin D-sub connector. 37-pin connector Use for a 37-pin D-sub connector. Cover Use to cover an empty hole in the handle. Without an adapter plate, a 50-pin IEEE connector can be used on the recessed handle. Attaching Connectors, LEDs and Switches to Modules 3-3 Figure 3-2 shows the adapter plates that are included in the Bulkhead Assembly Kit (H3651). Figure 3-2: Adapter Plates in Bulkhead Assembly Kit J l COVER PLATE T o © 449 [ l 225 T B I > 2.326 e 2.500 - 225 449 | 15 PIN D-SUB I 2925 ) .188 O e l‘— 1 .134——‘ 819 1.312—> 25 PIN D-SUB l , I 37 PIN D-SUB I | ~! 2.950 I 375 !: 750 T O OQ < )0 1.852 o) e 549 O OC:)O 984 [e) ——.983 MA-0949-87 3-4 BA200 Series Module Design Guide 3.2.1.1 Mounting Connectors Mount the adapter plate that the I/O connector requires. Each adapter plate in the kit has screw holes that line up with holes on the recessed handle. To reduce EMI, the module I/O connectors should be located at their proper positions on the module. The following illustrations show how the different adapter plates are mounted on the recessed handle, and where the module I/O connectors should be placed on the module. Connectors of different sizes can be placed on the same module. The illustrations also show where holes for mounting right angle connectors need to be drilled on the module. | Figure 3-3 shows two 9-pin adapter plates mounted on a recessed handle. Adapter plates like these two help contain the electronic noise that is generated inside the enclosure. Figure 3-3: Recessed Handle With Adapter Plates [ @ MA-1037-87 Attaching Connectors, LEDs and Switches to Modules 3-5 Figure 3-4 shows where to drill holes on a module with two 9-pin connectors. (Use the same dimensions and one of the locations if only one 9-pin connector is needed, or if a 9-pin connector and another connector described in this section are needed.) Figure 3-4: Dimensions and Locations of 9-Pin Connector Holes - .581 4 PLCS 8.828 +.005 2.378 ——1 .3156 3PLCS 1 “i 1.125 - ‘._ ¥ le——.71 2 PLCS’ 8 | N:fii/ GROUND ETCH N\ _AREA FARSIDE ANDNEARSIDE FOR .120 £.003 DIA (2 HOLES) HANDLE GROUNDING 047 + .003 DIA (9 HOLES) /[-.112 +.002 <-.278* 3 EQ. SP. AT .109 +£.002 ——ir . <—.1804 PLCS FAR SIDES = 327 REF TOL. NON-CUM < — . 984 | 4 EQ. SP. AT .109 £ .002 =,438 REF TOL. NON-CUM A DETAIL 3-6 ETCH ON NEAR AND .065 +.002 — |t .200 2 PLCS FREE OF b - 7T g [.330 (2 CONN.) BA200 Series Module Design Guide MA-1038-87 Figure 3-5 shows a recessed bulkhead with two 15-pin adapter plates attached to it. Figure 3-5 also shows the dimensions and locations of the holes that must be drilled on the module. Figure 3-5: 15-Pin Adapter Plates and Holes 2 ADAPTER PLATES 5 6814 PLCS 316 3PLCS .330 +£.005 2.214 l (2 CONN.) ey —0{ 1.125 *—— 1 ] | P e - <718 2 PLCS \_ GROUND ETCH AREA ' SEE DETAIL A _ FARSIDE AND NEARSIDE FOR HANDLE GROUNDING .120 +.003 D!A 12 HOLES .047 £.003 D1A 15 HOLES .112 £.002 e—.200 2 PLCS FREE OF ETCH ON — NEAR AND FAR SIDES —»{ |«—.180 4 PLCS o], 312 —— 278 4———7 EQ. SP. AT .109 £ .002 =.,783 REF TOL. NON-CUM — la— 055 + .002 - je——8 EQ. SP. AT .109 .002 =.854 REF TOL. NON-CUM DETAIL A MA-1039-87 Attaching Connectors, LEDs and Switches to Modules 3-7 Figure 3-6 shows where to drill holes for modules requiring two 25-pin connnectors. Figure 3-6: 25-Pin Adapter Plates and Holes 2 ADAPTER PLATES [ emeorermmssnmrimr vt @[ | | [0 o Joof 5814 PLCS .315 3 PLCS .......‘......".:..’. _?__ ! SEE DETAIL A oo e 8.198 d'| 1.125 ,__ A __/ _ ” ettt t——— | e o o () > .330 £ .005 l (2 CONN.) 1.948 —— \ N ! —— 718 2 PLCS GROUND ETCH AREA ] - FARSIDE AND NEARSIDE .120 £ .003 DIA (2 PLCS) FOR HANDLE GROUNDING .047 £ .003 DIA (25 HOLES) e J.HZLOOZ 200 2 PLCS FREE OF ETCH ON NEAR AND FAR SIDES ~—.180 4 PLCS ra——1.852 Faee 274 12 EQ. SP. AT .109 £ .002 =1.308 REF TOL. NON-CUM, 055 + .002 e DETAIL A 3-8 [¢——————11 EQ. SP. AT .109% .002 = 1.199 REF TOL. NON-CUM. BA200 Series Module Design Guide MA-1040-87 Figure 3-7 shows a recessed handle that has two 37-pin adapter plates mounted on it. It also shows where to drill pin holes for the two 37-pin connectors. Figure 3-7: 37-Pin Adapter Plates and Holes 2 ADAPTER PLATES 316 3PLCS A ' SIS SIS T__ : ol 5,871 , | 5814 PLCS |' S ESSLLS LI LI SITS SISLILLEIILY LTI S, o noooo'--ooaoc-oooo i ] 30P0DODIPDIDO0IS0D D Al 1 P LS II LSS P LS LI IS SIS AT £ i ‘m Yoo cof Neo cof m 5.4 5. .330 £.005 - l (2 CONN.) LISLI II S i + ? I GROUND ETCH AREA SEE DETAIL A N_FARSIDE AND 120 003 DIA (12 HOLES) NEARSIDEFOR .047 + .003 DIA (37 HOLES) 112 £.002 — e $-0-0-0-6-0-0-0-0-6-0-0-0-0-0-0-© 916-0-6-6-6-0-6-6-6-0-0-6-6-0-0-0-6{¢ fa— 2,500 e St 200 2 PLCS FREE OF ETCH ON NEAR AND T FAR SIDES ——= — 180 4 PLCS [t D] D a— 18 £EQ. SP. AT .109 £ .002 = 1,962 REF TOL. NON-CUM —| e e | DETAIL A (55 +.002 —17 EQ. SP. AT .109 £ .002 = 1.853 REF TOL. NON-CUM MA-1041-87 Attaching Connectors, LEDs and Switches to Moduies 3-9 Figure 3-8 shows where to drill holes for two 50-pin connectors. Figure 3-8: Holes for Two 50-Pin Connectors 2 5.850 . ——-1 950 .1880|A.\ | prmmm—— \ . @ l g , B & t 5602 + L— 312 | 250 ¢ .825+.010 < l ‘@" A L SEE DETAIL B |e—o l / 10.436 > 10.000 5.848 < jof b 4 133 DIA 4PLCS 31 3PLCS +.002 ..007 180 TYP i \ —.225 5.250 e 4.750 : ~—{ 1396 174 + .008 (e— | 4PLCS - ‘—T— % 150 [ Y O b— |— , i GROUND ETCH AREA I \.038 DIA 2 HOLES REF FARSIDE AND NEARSIDE ‘ FOR HANDLE GROUNDING i +.002 -.007 L | 125 DIA 2 HOLES SEE DETAIL A HF-O-60-0000-00006666660060060600009 .085 +.002 T D 24 EQUAL SPACES 0.085 + .003= 2.040 TDL. NON-CUM — 5 /_ 125 R 2 PLCS ‘/ »|le—.045 2 PLCS 5 @) 02R MAX(TYP) 2.950+.005 12 PLCS — .138 £.003 DIA 454+ 003 , LED 11-17373-0-0 170 + .004 £ .003 DIA 150 HOLES .038 " I 220 + .005 BOTH CONN, 2.950 + .005 005 : DETAIL B 2 PLCS DETAIL A 2 PLCS 3-10 BA200 Series Module Design Guide MA-1042-.87 3.2.2 Using Other Bulkhead Product Kits (H3652 - H3655) The use of connectors other than those discussed in the previous section requires cutting holes in the bulkhead. This section describes how-to drill holes on the bulkhead for connectors, LEDs, and cables. It also discusses any touch-up that is needed to contain noise within the enclosure. 3.2.2.1 Drilling the BA200 Series Bulkheads As discussed in Chapter 2, holes can be drilled in the BA200 Series bulkheads for I/O connectors, LEDs, and cables. When a BA200 Series bulkhead is drilled, use any standard drilling or punching machine. (The bulkheads are made of a zinc/aluminum alloy and may require cutting oils on their surface.) \ Because a bulkhead my be scratched or nicked during drilling, protect the surfaces during rework with a masking tape, such as 3-M 209 or 213 tapes that are supplied by 3-M Industrial Tape Division. Apply the tape just prior to rework. Marks for dimensions of any holes can be made on the tape. Remove the tape after rework. 3.2.2.2 Cleaning the Bulkheads After drilling or cutting out a bulkhead, remove any cutting oils that may have been used for the rework. Use a solvent, such as alcohol, that will not destroy the plating. Wipe the surfaces with care because the chromate conversion coating on the plated surface has very little abrasion resistance. Do not wipe the surface of the plating with any abrasive material. 3.2.2.3 Retouching the Bulkheads A bulkhead may need touch-up before it can be used in a BA200 Series enclosure. Some damage to plated surfaces can result from poor handling practices. This damage is most often cosmetic, in the form of scratches. Because of its finish, it is unlikely that the surface can be repaired to its original form. After a bulkhead is drilled, the side walls of the holes or cutouts are unplated. The unplated sidewalls do not present a functional problem because the cutout will be loaded with a connector or switch. The side walls should not be used to make a shield contact. Attaching Connectors, LEDs and Switches to Modules 3-11 Although no touch-up is required, a touch-up paint such as Krylon Silver can be used. Using a Q-Tip, apply the paint to the side walls of the cutouts. The paint is a good electrical insulator. Be careful not to paint the surfaces around the cutout. Paint on the surfaces around the cutout would interfere with contact with the installed connector. The plating on all the bulkheads is zinc with a "blue bright” zinc chromate. Use this plating if any rework is necessary. 3.3 Additional Considerations This section describes labeling and installation considerations. 3.3.1 Labeling the Bulkheads Each single bulkhead has two indented areas, one near its top and the other near its bottom. A double cover has four indented areas, two near its top and two near its bottom. In both cases, the area at the top is reserved for the module name. The area at the bottom is reserved for the revision number. After a module is designed or modified, label it for future reference. To create labels like those used by Digital, the materials described in Table 3-2 are required. Table 3-2: Materials Required for Bulkhead Labels Material Type Base 2 mil computer imprintable polyester, 3M-7880, Flex- Adhesive 1 mil permanent pressure sensitive acrylic. Liner Easy release liner. con PM-200-W MT/C. The label should be black on a white background. Table 3-3 shows the established design format for bulkhead labels. Table 3-3: Design Format for Bulkhead Labels Row Information Example! 1 Option number CXB16 2 Option variation -M 3 Module number M3116 4 Module variation -YB IExamples in this table refer to Figure 3-9. 3-12 BA200 Series Module Design Guide Figure 3-9 shows the dimensions of a bulkhead label. Note that the information on the label appears on the rows shown in Table 3-3. Figure 3-9: Dimensions of a Bulkhead Label CE[; 0°+0° 30 30' ; PIEARAD. .060in +.005 __>“._ .30in -M -7(10in *005 M3116 .060in +.005 T 9 P ——ol ln— .b50in *.005 MA-1095-87 3.3.2 When To Use a Gap Filler When installing a flush handle or cover to the left of a recessed handle, a gap filler (Kit 3657) must be attached to the flush handle to help contain EMI. Without the gap filler, circuitry on the recessed handle module is exposed. The gap filler (Kit 3657) has four sets of finger stock that provide an effective chassis ground between the handles. Attaching the gap filler is relatively easy. Flush handles and covers have screw holes at the top and bottom of each side for the installation of the gap filler. Figure 3-10 shows how the screw holes line up between the gap filler and a flush handle. Attaching Connectors, LEDs and Switches to Modules 3-13 A gap filler must also be attached to a cover on either side of a recessed handle. Figure 3-10 shows how a gap filler is mounted on a cover. Gap Filier and Flush Cover Figure 3-10: EOS CLIP 1/4 INCH \ SCREW - EMI _ CLIPS EMI CLIPS ASSEMBLY GAP FILLER 1/4 INCH SCREW \ " * /,/ / Eoscup \Q/.a Q L\/ M ~ GAP FILLER ASSEMBLY MOUNTED ON SINGLE COVER MA-0589-87A 3-14 BA200 Series Module Design Guide 3.3.3 Before Installing a Module To help comply with EMI regulations, bulkheads are equipped with transient protection EOS and EMI clips. These clips provide ground through the Before installing a module, perform the following module bulkhead. procedure to help guarantee that the clips are in good condition: 1. Ensure that there is no residue or corrosion on the EOS and EMI clips located on the module bulkhead. If there is residue, remove it with isopropyl alcohol or other approved mild cleaners. Also, ensure that the EOS and EMI clips on the gap filler assembly are free of residue and corrosion. 2. Ensure that the EOS and EMI clips on the bulkhead are in an arch shape. When depressed slightly, they should return to their original shape. 3. If any clip is missing, broken, distorted or corroded, replace it with EOS clip P/N 12-26922-01 or EMI clip P/N 12-26340-01. 3.3.4 When To Use a Grant Card As stated in Section 2.1, the backplane on BA200 Series enclosures has a Q22-bus on AB slots only. When designing a quad-height module, make sure that all Q22-bus signals are on AB fingers of the board. If there is an empty slot between the slots that are used, insert a grant card (M304/) into the siot. A grant card assures signal continuity in the backplane. Attaching Connectors, LEDs and Switches to Modules 3-15 Chapter 4 Product Kits This chapter provides descriptions of the different BA200 Series Bulkhead Product Kits available from Digital. (INone of these kits provide the hardware or tools necessary for riveting modules, or for drilling or plating bulkheads.) Digital sells the following Bulkhead Product Kits: H3650 - Bulkhead Evaluation Kit H3651 - Bulkhead Assembly Kit H3652 - Recessed Handle H3653 - Flush Handle H3654 - Double Cover H3655 - Single Cover H3656 - Dual Filler Panel H3657 - Gap Filler Kit Before beginning to assemble any of the kits, identify each of the parts it contains. If a part is missing, contact your Digital Sales Representative. Product Kits 4-1 4.1 H3650 - Bulkhead Evaluation Kit The Bulkhead Evaluation Kit is for individuals who do not know which kind of bulkhead to use with a module. This kit contains each of the other kits that are available from Digital, as Table 4-1 shows. This kit is intended to help engineers determine the Bulkhead Product Kit best suited for their application. Table 4-1: Bulkhead Evaluation Kit - H3650 Description Quantity H3651 - Bulkhead Assembly Kit 1 H3652 - Recessed Handle 1 H3653 - Flush Handle 1 @ H?3654 - Double Cover 1 [5] H3655 - Single Cover 1 [6] H3656 '- Dual Filler Panel 1 H3657 - Gap Filler Kit 1 BA200 Series Module Design Guide (EK-BA200-DG) 1 Part IThese kits are not included separately in the H3650). They are included in the H3651. 4-2 BA200 Series Module Design Guide Figure 4-1 shows the different components of the Bulkhead Evaluation Kit. Figure 4-1: Contents of Bulkhead Evaluation Kit (H3650) ASSY. PANEL, GAP FILLER ASSY. of DUAL FILLER PANEL MA-1044-87 Product Kits 4-3 4.2 H3651 - Bulkhead Assembly Kit The Bulkhead Assembly Kit contains a recessed handle that is plated and pre-cut with holes that accommodate two standard 50-pin connectors. The kit also includes adapter plates for standard 9-, 15-, 25-, and 37-pin D-sub connectors. If only one connector is to be used, the kit has a cover plate for the remaining hole. The kit also contains a gap filler (H3657), and a dual filler panel (H3656), if they are needed. Table 4-2 lists the contents of the kit. Table 4-2: Bulkhead Assembly Kit - H3651 Description Quantity Handle, recessed, pre-cut 1 Gap filler assy kit (H3657) 1 Dual filler panel (H3656) 1 Cover 1 [5] Adapter plate, 9-pin connector 2 B Adapter plate, 15-pin connector 2 7] Adapter plate, 25-pin connector 2 8] Adapter plate, 37-pin connector 2 [9] Insulator strip 2 Label kit 1 Screw pph 4-40 x 0.25 4 Nut, 4-40 4 Washer, lock internal tooth #4 4 Key 3] 12 4-4 BA200 Series Module Design Guide Figure 4-2 shows the contents of the Bulkhead Assembly Kit. Contents of Bulkhead Assembly Kit (H3651) DUAL FILLER PANEL N\, BULKHEAD ASSEMBLY = Figure 4-2: PANEL GAP FILLER ASSEMBLY MA-1099-87 Product Kits 4-5 4.3 H3652-H3655 : Other Bulkhead Product Kits special I/O needs. The These kits are designed for individuals who have and assembled but plated y alread are kits contain handles or covers that which have not been drilled. e the dual filler panel (H3656) Unlike the H3651, these kits do not includ d, these kits must be ordered neede are they If ). or the gap filler (H3657 separately. (See Section 4.4 and Section 4.5.) Table 4-3 describes the four basic variations of the bulkheads. Table 4-3: BA200 Covers and Handles Description Contents Part Number Recessed Handle H3652 Flush Handle H3653 would inUsed when a recessed handle 1/O conterfere with the module circuitry or also riv- Double H3654 Used to cover two backplane slots. ' Single H3655 Covers one backplane slot. ! Cover Cover . This style is The handle is riveted to the module BA200 modall for handle ed preferr the ules with external I/O connectors. The flush handle is nector. eted to the module. ' a module with a recessed handle, you must at11f this type of cover is installed nextEMIto complia nce. tach a gap filler (H3657) to maintain 4-6 BA200 Series Module Design Guide 4.3.1 H3652 - Recessed Handle This kit contains a recessed handle. Table 4-4 lists the contents of the H3652 kit. Table 4-4: Recessed Handle - H3652 Part Description Quantity [1] Recessed handle 1 2] Insulator strip 2 Label kit 1 Figure 4-3 shows the contents of the kit. Figure 4-3: Recessed Handle Kit Contents (H3652) MA-1048-87 Product Kits 4-7 4.3.2 H3653 - Flush Handle This kit contains a flush handle. Table 4-5 lists the contents of the H3653 kit. | Table 4-5: Part [2] Flush Handle - H3653 Description Quantity Flush handle 1 Insulator strip 2 1 Label kit Figure 4-4 shows the contents of the kit. Figure 4-4: Flush Handle Kit Contents (H3653) MA-1047-87 4-8 BA200 Series Module Design Guide 4.3.3 H3654 - Double Cover This kit contains a double cover. Table 4-6 lists the contents of the H3654 kit. Table 4-6: Double Cover - H3654 Part Description Quantity [1] Double cover 1 2] Label kit 2 Figure 4-5 shows the contents of the kit. [ \ (WA J Double Cover Kit Contents (H3654) % N\ Figure 4-5: V/ / MA-1045-87 Product Kits 4-9 4.3.4 H3655 - Single Cover This kit contains a single cover. Table 4-7 lists the contents of the H3655 kit. Table 4-7: Single Cover - H3655 Part Description Quantity 1 Single cover 1 2] Label kit 1 Figure 4-6 shows the contents of the kit. Figure 4-6: Single Cover Kit Contents (H3655) /////f /) //,_/ I,,/, MA-1046.87 4-10 BA200 Series Module Design Guide 4.4 H3656 - Dual Filler Panel This panel is placed on the backplane for support when using dual-height modules. The panel functions as physical support only, and has no electrical characteristics. A dual filler panel must be used with a dual-height module in order to ensure proper air flow. Table 4-8 lists the contents of the H3656 kit. Table 4-8: Dual Filler Panel - H3656 Part Description Quantity [1] Dual filler panel 1 Figure 4-7 shows the contents of the kit. Dual Filler Panel Kit Contents (H3656) \ Figure 4-7: v MA-1051-87 Product Kits 4-11 4.5 H3657 - Gap Filler Kit This kit contains the gap filler assembly. The gap filler is needed when a recessed bulkhead is placed to the right of a flush handle, or on either side of a cover in a BA200 Series enclosure. The gap filler supplied is plated and ready to be installed. Its use helps the enclosure comply with EMI regulations. Table 4-9 lists the contents of the H3657 kit. Table 4-9: Part Gap Filler Kit - H3657 Description Quantity Gap filler assembly 2 Figure 4-8 shows the contents of the kit. Figure 4-8: Gap Filler Kit Contents (H3657) | MA-1049-87 4-12 BA200 Series Module Design Guide Chapter 5 Using Product Kits The examples in this chapter explain how to use available product kits in the design of modules for BA200 enclosures. Each example provides a product description that is followed by a suggested approach for solving the module design problems. 5.1 Using Space Behind the Double Cover This first example shows how to use the space behind the double cover to attach circuitry and save space on the module. 5.1.1 Product Description The product consists of two quad-height modules connected by a private bus, in this case a ribbon cable from one module to the other. The product communicates to the external world by a serial line. The product also requires a baud rate switch and a two-digit seven segment display that the user or field service can access. 5.1.2 Approach One approach is to attach the segment display, switch, and serial line connector to a small PCB that gets mounted directly on the bulkhead. Such an approach offers the advantage of placing the drivers close to the display and the transceivers close to the connector, thus reducing noise problems and freeing additional space on the module. The ideal bulkhead for this approach is a double cover (Kit H3654). The double cover provides space to mount the PCB and eliminates the need for two covers. Using Product Kits 5-1 A good way to connect the bulkhead circuitry to the modules is to use a small (for example, 4 inch) ribbon cable that is soldered on the bulkhead PCB andis connected to the module by a Berg connector. See Figure 5-1. When the connector type on the module has been set, the modules are ready for layout. Refer to Chapter 2 for information on module layout. Figure 5-1: Double Cover and Modules <:::::::> D ‘/ MODULE NUMBER LABEL (IF INSTALLED) Py fl A 8 BAUD RATE [, SELECT SWITCH —_| /E:::] MY-BOARD DISPLAY =] SERIAL I/0CONNECTOR MA-0979-87 5-2 BA200 Series Module Design Guide Mount the PCB onto the double cover by using standard drilling and riveting techniques. To do this, drill four holes for the standoffs on the cover, as shown in Figure 5-2. Drill holes for access to the Baud Rate switch, display, and serial connector. See Chapter 3 for information on how to drill holes on the bulkhead. After drilling, touch up the cover to prevent corrosion (see Chapter 3) and assemble it. Screw the PCB onto the cover. Figure 5-2: Double Cover and Printed Circuit Board STANDOFF ® SWITCH ~_ b = DISPLAY CONNECTING CABLE MA.0373-87 Using Product Kits 5-3 5.2 Adapting Modules This second example shows how to adapt a module to a BA200 Series enclosure and save unnecessary cutting and assembling, and touch-up work. For information on adapting existing modules, see Chapter 2. 5.2.1 Product Description The product consists of a quad-height module with a 37-pin I/O connector. 5.2.2 Approach The most economic approach is to use the H3651 kit. This kit provides a precut recessed handle. Use a right angle PCB mount 37-pin D-sub connector on the module. Then rivet the module to the handle. Use an adapter plate to insert the connector through the handle. Cover the unused hole in the bulkhead with a cover plate. Figure 5-3 shows the quad-height module with the right angle 37-pin D-sub connector. Figure 5-3: Quad-Height Module T g | MA-0381-87A 5-4 BA200 Series Module Design Guide Figure 5-4 shows the recessed handle and quad-height module. Figure 5-4: Recessed Handle and Quad-Height Module BLANK COVER PLATE 37 PIN D-SUB CONNECTOR PLATE MA-1241-86A Rivet the module to the bulkhead so that when it is installed in a BA200 Series enclosure, its fingers fit in the A and B Q22-bus sockets. If the recessed handle is placed to the right of a flush handle, or on either side of a cover, attach a gap filler onto the flush handle or cover. (See Section 4.5.) Using Product Kits 5-5 5.3 Designing With Non-Standard 1/O Connectors, Switches and LEDs This third example shows how to use a product kit with a module that requires non-standard I/O connectors, switches, and LEDs. 5.3.1 Product Description The product consists of one quad-height combination communication module with a serial line right angle D-sub connector, two MM] connectors, one selection switch and two LEDs. Figure 5-5 shows the module. Note that a right angle D-sub connector was used in the module design. This type of connector is designed to extend through the hole that will be drilled in the handle. Figure 5-5: Quad-Height Communication Module S | MA-0981-87 5-6 BA200 Series Module Design Guide 5.3.2 Approach One approach is to use a recessed handle (H3652) because holes can be drilled into this handle to fit the MM] connectors and because the right angle D-sub connector will extend through the pre-cut connector hole. Figure 5-6 shows the recessed handle after it has been drilled to accommodate the MM]J connectors and the right angle D-sub connector. Handle of Module [ ~ of| 1 00 @g |S [ FFITHFFFTFFFIPM ig| ]® | [] oo it o—— Figure 5-6: MA-0980-87 In Figure 5-6, note that the LEDs and selection switch are positioned at the top of the board so that the serial and MM] connector cables do not interfere with access to them. The serial connector is positioned above the MM]J connectors and away from the bottom of the handle because the right angle serial connector cable is very rigid and inflexible at its base. The serial connector would be obstructed by the bottom protrusion of the recessed handle if it were positioned too close to the bottom of the handle. The module label has been silk-screened onto the handle. for more information on labeling modules. See Chapter 3 Using Product Kits 5-7 5.4 Adapting a Module With 1/O and LEDs This fourth example shows how to use a product kit to adapt an existing module with I/O and LEDs. 5.4.1 Product Description The product is a communications module with three LEDs and an I/O ribbon cable connector located at the edge of the module. Figure 5-7 shows the module. Module With Three LEDs, Fuse and Ribbon Cable I 001 [ = Figure 5-7: 11 LEDS [ F MA-0983-87 5.4.2 Approach One approach, in order to avoid re-layout of the module, is to choose a flush handle (H3653), and route an Ultra-Flex cable from the I/O connector on the board to a connector hole on the handle. An Ultra-Flex cable is used to route the cable to the handle because it covers less surface area of the board and allows better air flow. Holes must also be drilled into the handle (H3653) for the LEDs. Note also that the module handle (H3653) must be drilled in order for it to fit on the module. 5-8 BA200 Series Module Design Guide Since this approach uses a flush handle, there will be some clearance between the handle and the LEDs located on the board. In this case, pipes should be added to the LEDs so that their light can be seen desplte the clearance. Figure 5-8 shows the handle. Figure 5-8: Module Riveted to Handle MA-0982-87 Using Product Kits 5-9 5.5 Adapting a Module Without External 1/0 This fifth example shows how to adapt a module without external I/O. 5.5.1 Product Description The product is an existing memory board without I/O connectors. 5.5.2 Approach The best approach is to choose a single cover (H3655). Because there are no I/O connectors, it is not necessary to drill holes into this cover. Figure 5-9 shows the single cover. Insert the module into the backplane and cover its slot with the single cover. Figure 5-9: Single Cover and Module i~ i C _ C _ 5-10 BAZ200 Series Module Design Guide 5.6 Using a Dual Filler Panel This sixth example shows how to use a dual filler panel in order to support a dual-height module. 5.6.1 Product Description The product is a dual-height module. 5.6.2 Approach Because the product is a dual-height module, a dual filler panel must be riveted to a flush or recessed handle. Select the handle that is appropriate for the enclosure. The dual filler panel provides support to the module and allows for proper air flow within the enclosure. Figure 5-10 shows a dual-height module and dual filler panel riveted to a flush handle. Figure 5-10: Flush Handle and Dual-Height Module 124 MA-1043-87A Using Product Kits 5-11 Appendix BA200 Series Power Supply A (H7868) The BA200 Series enclosures come with one or two modular power supplies. Each power supply plugs directly into the backplane via a 56-pin connector. Each power supply delivers the following maximum current. 7.0 amps at +12 Vdc 33.0 amps at +5 Vdc The combined maximum current at + 12 Vdc and + 5 Vdc must not consume more than 230 watts of power for each supply. In the BA213 enclosure, an ac line filter distributes ac input power to the two power supplies. The filter is under the left power supply area. Each power supply has a 12-hole (6-pin) ac input power connector at its base. The two power supplies provide power to the following areas. Primary power supply Backplane slots 1 through 6, two mass storage de- vices, and two dc fans under the card cage Expansion power supply Backplane slots 7 through 12, and a third and fourth mass storage device Each power supply also has a power indicator, CPU Restart switch, and circuit breaker on the front. The power supply enters and completes a shutdown sequence whenever the BPOK H signal is negated. When BPOK H is asserted high on the Q22-bus, the power system is in a state to allow normal system operation. Any of the following conditions negate BPOK H. ¢ Fan failure or other cause of overheating, triggering an over-temperature sense. ¢ An overcurrent condition e Input voltage greater than 132 Vrms or less than 88 Vrms In systems with two power supplies, BPOK H and BDCOK H are parallel. If one power supply starts to shut down and the other supply is still operating, BPOK H and BDCOK H are negated through a low from the power supply that is shutting down. BA200 Series Power Supply (H7868) A-1 Appendix Backplane in the BA200 Series This appendix describes the BA200 Series backplane. The first section describes the grant continuity in the BA200 Series backplane. The second section describes the physical characteristics of the backplane. B.1 Grant Continuity and the BA200 Series Backplane A module from a different enclosure must be compatible with the BA200 Series backplane grant continuity. Figure B-1 shows the backplane grant continuity of the BA123 enclosure. Note that slots 5 through 12 carry the Q22-Bus signal in rows C and D, and in rows A and B. Figure B-1: BA123 Series Backplane Grant Continuity FRONT OF SYSTEM SLOTS 13 12 11 10 9 8 7 6 5 @ | P | P | Peo=p | v a 7 ) - “ REAR OF 4 3 2 1 ] o SYSTEM A B R o) W men) | Geeguml) | Cmumm) h--‘ C S D MR-14068 MA-0984-87 Backplane in the BA200 Series B-1 Figure B-2 shows the backplane grant continuity of the BA200 Series. Only rows A and B carry the Q22-bus signal in the BA200 backplane. This means that modules that carry Q22-bus signals in the C and D rows cannot be installed in the BA200 Series. If the module you want to adapt carries signals in the C and D rows, the module must be laid out again so that it carries Q22-bus signals only in the A and B rows. Section 2.3 contains information for designers who need to re-layout a module so that the C and D rows do not carry Q22-bus signals. This section also describes how to reduce the amount of EMI a module generates. The design of the BA200 Series backplane also means that a dual-height module must be installed only in rows A and B. A plastic filler panel (Kit H3656) must be installed to provide extra support for a dual-height Q22-bus module in a BA200 backplane. The plastic filler panel plugs into the CD rows below the module. The plastic panel has a fitted groove along the top edge to support the dual-height module above it. The plastic panel also ensures proper air flow inside the enclosure. Figure B-2: BA200 Series Backplane Grant Continuity FRONT OF SYSTEM 13 12 11 10 9 8 SLOTS 7 6 5 4 3 2 1 MA-0985-87 B-2 BA200 Series Module Design Guide Description of the BA213 Backplane The BA213 has a 12-slot, quad-height backplane (Figure B-3). The backplane isa26.3 cm X 40.7 cm (11.9 in X 16 in) assembly with 24 press-pin connector blocks. The space between each backplane slot is 2.4 ¢m (0.95 in). The backplane’s printed circuit board is a one-layer, two-sided etch board. The backplane implements the Q22-bus on the AB rows of each slot. The CD rows of all slots are interconnected. In slots 1 through 3, this connection provides the microsystem memory interconnect. The backplane is bounded and cannot be expanded. It supports 35 equivalent ac loads and 20 dc loads from all the modules installed in the backplane. An ac load is the amount of capacitance a module presents to a bus signal line. One ac load equals 9.35 picofarads (pf). A dc load is the amount of dc leakage a module presents to a bus signal line. One dc loadis approximately 105 microamperes (uA). The backplane presents 5.6 ac loads to the Q22 bus. Figure B-3: BA213 Backplane TO SIGNAL DISTRIBUTION ‘2, POWER = AT\ POWER — IT I I I ¢ ALY A YT \ ‘ PEEEERE - 2\ rEEEPrE . AN LY!PIIII’.FPP’EMZ/; T ol adud \\ \ T TIT T 3 ! ! \ i\l > K=Y, > \ \J O\ LY (DI ITITITI XTI AL \Qvrzpurrrrp:rwx; LT T T A 24 d\ ]u-rzt‘-rrrrfeuzz; Y ¢ rr7ANg]u-tu‘-‘.-rrrzrzw;/ (T T T T T T=, 4 4 o\ i fTTIT T IF ol s oddud (ITTIITIITTIT I T A Y s L @ rr N W PAPPPPFEPEELLE; A YSy T raT I IIIIN \ R B . 2 SUPPLY ETT ITTITTIIN T ' B SUPPLY CONNECTOR MA-1086-86 Backplane in the BA200 Series B-3 There are two variations of the BA213 backplane, for systems with and without mass storage devices (see Table B-1). The two backplanes are not interchangeable. At present, all microsystem systems use the backplane | that supports mass storage devices. Table B-1: 'Backplanes Backplane Part Number Mass storage 70-23712-01 Description Connects to the signal distribution board via a ribbon cable. This cable carries the DCOK, POK, +5 Vdc and signal ground lines for the DC OK LED and disk activity lights on the front of the system. The 10-pin cable connector is on the upper-right of the backplane. The backplane also has two 56-pin edge board connectors. The primary connector near slot 1 supplies power to The expanbackplane slots 1 to 6. sion connector near slot 12 power to backplane slots 7 to 12. No mass storage 70-23712-02 supplies Does not have connectors for the signal distribution board or a second power supply. Jumpers between slots 6 and 7 bring +5 and +12 Vdc to slots 7 to 12. The backplane also has a 4-pin power connector on the right side for the two dc fans below the card cage. B.2.1 Load Module (Systems with Two Power Supplies) Some BA200 systems that use two power supplies need a quad-height load module (M9060-YA) installed in the backplane (one of slots 7 through 12). e e Systems with 3 or 4 mass storage devices, and with no Q22-bus modules in slots 7 through 12. Systems with 1 or 2 mass storage devices, and with Q22-bus modules in any of slots 7 through 12. The load module loads the +5 Vdc output of the second power supply to the required continuous minimum current of 5 amps. If the minimum current of 5 amps is not reached, the power supply enters an error mode and shuts down the system. Install the load module after the last Q22-bus module. B-4 BA200 Series Module Design Guide Glossary 1.5 inch rule The guideline for module layout that says that an I/O etch should not be longer than 1.5 inches. BA200 Series A line of system enclosures that include the BA213 and BA214. BA200 Series Module A module specifically designed to be used in one of the BA200 Series enclosures. Bulkhead Handle or cover over a module that provides the physical barrier or shield between the inside of the box and the outside world. Connector A device that connects an I/O cable to I/O signals on a module. Cover A bulkhead that is not attached to a module. Double A bulkhead that spans two BA200 Series enclosure slots. Dual-height module A module with two sets of fingers that utilize two sockets in a backplane row of four connectors. EMI Electromagnetic Interference such as power supply noise, noise generated from the antenna effect, and common mode noise. ESD Electro-Static-Discharge. ESD can destroy logic circuitry. Glossary-1 - Feedthrough hole A hole on a module that goes through all layers. Flush A handle that is flush against the BA200 enclosure exterior. Grant card A device inserted in a backplane to ensure a continuity of Q22-bus signals. Handle A bulkhead that is attached to a module. Handle 1/O connector An I/O connector that is mounted on a handle. I/0 ground The etch on a module with a low impedance path to the handle ground, and a high impedance path to the logic ground. MMJ Modified modular jack. This jack looks like a telephone jack. Module A printed circuit board. A module is not necessarily attached to a handle. Module /O connector An I/O connector that is mounted on a module. NEMA National Flectrical Manufacturers Association. Noise Unwanted electrical signals that can be generated from a power supply, logic circuitry, or a communications line. Noise containment Keeping noise within the BA200 enclosure. Q22-bus A bus that passes 16-bit data with 42 bidirectional lines and 2 unidirectional lines. Glossary-2 Quad-height module A module with four sets of fingers that utilize four sockets in a backplane row of four connectors. Recessed A handle that is recessed from the BA200 Series enclosure exterior. Rework The process of drilling or doing touch-up on a bulkhead. Right angle connector A connector that attaches at a right angle to the BA200 module from a handle. designs. This is the recommended connector for new BA200 module Side 1 The populated side of a module. Side 2 The side of a module opposite side 1. Single A bulkhead that spans one BA200 Series enclosure slot. Glossary-3 Index A adapter plates, 4-4 adapting I/O modules, 2-5 adapting non-1/0 modules, 2-2 adding pipes to LEDs, 5-9 antenna effect, 1-5, 2-10 attaching connectors, 3-3 blank recessed handle, advanced example, 5-7 bulkhead, 5-1 bulkhead, definition, 1-2 Bulkhead Assembly Kit, 4-4 Bulkhead Evaluation Kit, 4-2 Bulkhead Product Kits, 4-1 bulkheads, advantages, 1-5 bylkheads, containment, 1-5 bulkheads, diagram, 1-7 BA123 Series backplane grant continuity, B-1 BA123 Series backplane grant continuity line, B-1 BA200 enclosure ac line filter, A-1 card cage, module handles, 1-5 filler plate, 4-6 H3600-SA, 4-6 load module, B-4 power supply, A-1 BA200 Series, current paths, 1-3, 2-11 BA200 Series backplane grant continuity, B-2 BA200 Series backplane grant continuity line, B-2 BA213 enclosure ac, dc loads, B-3 backplane, B-3 backplane grant continuity, B-3 covers, handles, 1-7 BA213-RA rackmount kit, 1-1 backplane BA213 enclosure, B-3 Berg connector, 5-2 bulkheads, drilling, 1-5 bulkheads, illustration, 1-7 bulkheads, kinds, 1-2 bulkheads, uses, 1-8 bulkheads and EMI shielding, 1-5 C card cage, 1-1 cleaning bulkheads, 3-11 clearance for bulkheads, 2-6 common mode noise, 2-10 connector, 5-1 cover, 5-1 cutting oils, use of, 3-11 D damage to plated surfaces, 3-11 decoupling capacitors, 2-13 designing modules, 2-10 dimensions of 15-pin holes, 3-6 dimensions of 25-pin holes, 3-8 dimensions of 37-pin holes, 3-9 dimensions of 9-pin holes, 3-6 double, 5-1 Double Cover, 4-9 double cover, advanced use,-5-1 index-1 drilling bulkheads, 3-11 drilling eyelet holes, 3-2 Dual Filler Panel, 4-11 dual-height module, 2-4, 5-1 E Electromagnetic Interference, 1-1 EMI, 1-1, 5-1 ESD, 5-1 eyelet holes, 3-2 1/0 etch, restrictions, 2-13 1/O ground, 5-2 1.5 inch rule, 5-1 Internal cabling, Ultra-flex, 2-6 isolating current paths, 1-3, 2-11 L label areas, 3-12 labeling a bulkhead, 3-12 low impedance path, 1-3, 2-11 F Faraday shield, 1-5 feedthrough hole, 5-2 filtered connector, 2-14 filtering ESD, 2-14 flush, 5-2 flush handle, advanced example, 5-9 G M9047, 3-15 M9060-A, B-4 maximum lead protrusion of Side 2, 3-2 MM], 5-2 MM] connectors, 5-7 module, 5-2 module I/O connector, 5-2 Gap Filler, 4-12 grant card, 3-15, 5-2 grant continuity, 3-15 BA213, B-3 mounting 15-pin connectors, 3-7 mounting 25-pin connectors, 3-8 mounting 37-pin connectors, 3-9 mounting 9 pin connectors, 3-5 grounded conductive material, 1-5 N H NEMA, 5-2 noise, 5-2 H3650, 4- noise containment, 5-2 H3651, 4- O H3652, 4- - H3654, 4H3655, 4- S H3656, 4- S H3653, 4- H3657, 4-1 H994 computer cabinet, 1-1 handle, 5-2 handle I/O connector, 5-2 high impedance path, 1-3, 2-11 other documentation, 1-1 P PCB mount type connector, advantages, 2-14 Power supply BA200 enclosure, A-1 power supply noise, 2-10 preventing damage to bulkheads, 3-11 1/O connectors, 2-14 index-2 Q Side 1, 5-3 Side 2, 5-3 Q22-bus, 5-2 Q22-bus backplane, 1-1 quad-height module, 5-3 R recessed, 5-3 signal rise time, 2-10 - silver touch-up paint, 3-12 single, 5-3 Single Cover, 4-10 single cover, advanced example, 5-10 Single flush handle, 4-8 reducing EMI, 1-3, 2-11 Single recessed handle, 4-7 reducing EMI by design, 2-11 sources of noise, 2-10 removing and installing bulkheads, 1-1 U retouching bulkheads, 3-11 rework, 5-3 right angle connector, 2-14, 5-3 right angle D-sub connector, 5-7 rivets on a handle, 2-2, B-3 Ultra-flex, 2-6 unplated side walls, 3-11 unplated surfaces, 3-11 use of cover or handle, 2-2, B-3 using a cover or handle, 2-5 S using adapter plates, 3-3 shielding from EMI, 1-1 using a grant card, 3-15 using a gap filler, 3-13 Index-3 BA200 Series Module Design Guide READER’'S COMMENTS EK-BA200-DG-001 Your comments and suggestions will help us in our efforts to improve the quality of our publications. 1. How did you use this manual? (Circle your response.) (a) Installation (c) Maintenance (e) Training (b) Operation/use (d) Programming (f) Other (Please specify.) 2. Did the manual meet your needs? Yes 1 No O Why? 3. Please rate the manual on the following categories. (Circle your response.) Excellent Good Fair Poor Unacceptable Accuracy 5 4 3 2 1 Clarity Completeness 5 5 4 4 3 3 2 2 1 1 Table of Contents, Index 5 lllustrations, examples 5 Overall ease of use 5 X 4 3 2 1 4 3 2 1 4 3 2 1 4. What things did you like most about this manual? 5. What things did you like /east about this manual? 6. Please list and describe any errors you found in the manual. Page Description/Location of Error Name ‘ Job Title Street Company City Department State/Country Telephone Number Postal (ZIP) Code - Date THANK YOU FOR YOUR COMMENTS AND SUGGESTIONS. Please do not use this form to order manuals. Contact your representative at Digital Equipment Corporation or (in the USA) call our DECdirectTM department at this toll-free number: 800-258-1710. © 1987 by Digital Equipment Corporation. MYO FOLD HERE AND TAPE. DO NOT STAPLE. d nnan No Postage Necessary if Mailed in the United States BUSINESS REPLY MAIL FIRST CLASS PERMIT NO. 33 MAYNARD, MA POSTAGE WILL BE PAID BY ADDRESSEE DIGITAL EQUIPMENT CORPORATION Educational Services/Quality Assurance 12 Crosby Drive BUO/EOS8 Bedford, MA 01730-1493 USA FOLD HERE AND TAPE. DO NOT STAPLE. ", - fimfiw?yfi,iaaan T
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