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EK-MIC11-TM-002

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297 pages

Original

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Document:	MicroPDP-11 Systems Technical Manual
Order Number:	EK-MIC11-TM
Revision:	002
Pages:	297
Original Filename:	EK-MIC11-TM-002_MicroPDP11_Systems_Technical_Manual_Sep85.pdf

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EK-MIC11-TM-002

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MicroPDP-11
Systems
Technical Manual

Prepared by Educational Services
of Digital Equipment Corporation

1st Edition, June 1985
2nd Edition, September 1985

The material in this manual is for informational purposes and is subject to change
without notice.
Digital Equipment Corporation assumes no responsibility for any errors that may
appear in this manual.

FCC Notice: This equipment generates, uses, and may emit radio frequency
energy. The equipment has been type tested and found to comply with the limits
for a Class A computing device pursuant to SUbpart J of Part 15 of FCC Rules,
which are designed to provide reasonable protection against such a commercial
environment. Operation of this equipment in a residential area may cause interference in which case, the user, at his own expense, may be required to take measures to correct the interference.
Printed in U.S.A.
The manuscript for this book was created on a VAX-ll/780 system and, via a
translation program, was automatically typeset by Digital's DECset Integrated Publishing System. The book was produced by Educational Services Development and
Publishing in Marlboro, MA.

The following are trademarks of Digital Equipment Corporation.
~DmDDmDTM

MicroVAX

DEC
DECmate
DECUS
DECwriter
DIBOL
MASSBUS
MicroPDP-ll

PDP
P/OS
Professional
Q-Bus
Rainbow
RSTS

RSX
RT
UNIBUS
VAX
VMS
VT
Work Processor

Contents
Introduction
Chapter 1

BA23 Enclosure

1.1
1.2
1.2.1
1.2.2
1.3
1.3.1
1.3.2
1.4
1.5
1.5.1
1.5.2
1.6
1.7

INTRODUCTION .................................................................. 1-1
BA23-A FRAME .................................................................... 1-2
BA23-A Bezels ................................................................... 1-3
Air Circulation ................................................................... 1-3
FRONT CONTROL PANEL .................................................. 1-4
Control Panel Printed Circuit Board .................................. 1-6
LTC DIP Switch Unit.. ...................................................... 1-7
MASS STORAGE ................................................................... 1-8
BACKPLANE ASSEMBLy ..................................................... 1-8
Mass Storage Signal Distribution Panel............................ 1-8
Q22-Bus Backplane. .................. ..... ......... .............. ........ ..... 1-10
POWER SUPPLY AND FANS ............................................... 1-13
REAR I/O DISTRIBUTION PANEL.. .................................... 1-18

Chapter 2

MicroPDP-ll Base Systems

2.1
2.2
2.2.1
2.2.2
2.2.3
2.2.4

INTRODUCTION .................................................................. 2-1
KDJII-B CPU MODULE ....................................................... 2-2
KDJII-B LEDs .................................................................. 2-6
KD]11-B Baud Rate Select Switch .................................... 2-6
KDJII-B DIP Switch ......................................................... 2-7
KDJll-B Location in MicroPDP-ll/73 and
MicroPDP-ll/83 Systems .............................................. 2-8
KD]11-B AUTOMATIC BOOT MODE .................................. 2-9
KDJII-B DIALOG MODE ...................................................... 2-10
Entering Dialog Mode ....................................................... 2-10
Dialog Commands .............................................................. 2-11
KDJII-B SETUP MODE ....................................................... 2-12

2.3
2.4
2.4.1
2.4.2
2.5

iii

Contents
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5
2.5.6
2.5.7
2.5.8
2.5.9
2.5.10
2.5.11
2.5.12
2.5.13
2.5.14
2.5.15
2.6
2.6.1
2.6.2
2.6.3
2.7
2.8
2.9
2.9.1
2.9.1.1
2.9.1.2
2.10
2.10.1
2.10.2
2.10.3
2.10.4
2.10.5
2.10.6
2.10.7
2.10.8

Setup Command 1: Exit.. ................................................... 2-12
Setup Command 2: List/Change Parameters
in Setup Table ................................................................ 2-12
Setup Command 3: List/Change Boot Translation
in Setup Table ................................................................ 2-17
Setup Command 4: List/Change Automatic Boot
Selection in Setup Table ................................................ 2-18
Setup Command 5: Reserved ............................................ 2-19
Setup Command 6: List/Change Switch Boot Selection
in Setup Table ................................................................ 2-19
Setup Command 7: List Boot Programs ............................ 2-19
Setup Command 8: Initialize the Setup Table ................... 2-19
Setup Command 9: Save Setup Table into EEPROM ........ 2-19
Setup Command 10: Load EEPROM Data into
Setup Table .................................................................... 2-19
Setup Command 11: Delete EEPROM BooL .................... 2-20
Setup Command 12: Load an EEPROM Boot into
Memory .......................................................................... 2-20
Setup Command 13: Edit/Create an EEPROM BooL ....... 2-20
Setup Command 14: Save Boot into EEPROM ................. 2-21
Setup Command 15: Enter ROM ODT .............................. 2-21
KDF11-BE CPU AND KDF11-BF CPU ASSEMBLIES ......... 2-22
KDFII-BE ......................................................................... 2-24
KDF11-B Baud Rate Select Switches ................................ 2-29
KDF11-B Location in a MicroPDP-11/23 System ............. 2-29
KDFII-B AUTOMATIC BOOT MODE ................................. 2-30
KDF11-B CONSOLE DIALOG MODE .................................. 2-31
MSVll-P MEMORY MODULE (-PK, -PL) ........................... 2-32
Expansion (CSR and Starting Addresses) .......................... 2-34
CSR Address ................................................................. 2-34
Starting Address ........................................................... 2-34
MSV11-JD (M8637-D) AND MSV11-JE (M8637-E)
MEMORY MODULES ........................................................ 2-35
Error Correction ................................................................ 2-36
Battery Backup .................................................................. 2-37
Private Memory Interconnect (PMI) ................................. 2-38
Location of the MSVll-JD, -JE Memory .......................... 2-38
Jumper Setting ................................................................... 2-39
MSV11-JD, JE Switch Settings .......................................... 2-39
Memory Address Switch Settings...................................... 2-40
CSR Address Switch Settings ............................................ 2-42

Contents
2.10.9
2.11
2.12
2.12.1
2.12.2
2.13
2.13.1
2.13.2
2.13.3

MSV11-JD, JE LEDs ......................................................... 2-43
RQDX1, RQDX2, AND RQDX3 DISK CONTROLLERS ....... 2-44
RQDX1-E (M7512) AND RQDX2-E (M7513) EXTENDER
MODULES ......................................................................... 2-46
RQDX1-E (M7512) Extender Module ............................... 2-47
RQDXE (M7513) Extender Module .................................. 2-48
TQK50 (M7546) TAPE CONTROLLER ............................... 2-51
Unit Number DIP Switch .................................................. 2-52
Revision Level DIP Switch ................................................ 2-53
TQK50 LEDs ..................................................................... 2-53

Chapter 3

System Options

3.1
3.1.1
3.1.2
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
3.2.8
3.2.9
3.2.10
3.2.11
3.2.12
3.2.13
3.3
3.3.1
3.3.2
3.3.2.1
3.3.2.2
3.3.3
3.3.3.1
3.3.3.2
3.3.4
3.3.5
3.4
3.4.1
3.4.2

INTRODUCTION .................................................................. 3-1
Ordering Options ............................................................... 3-1
Module Configuration ........................................................ 3-2
COMMUNICATIONS ............................................................. 3-4
DEQNA Ethernet Interface ............................................... 3-4
DHV11 Asynchronous Multiplexer .................................... 3-6
DLVE1 Asynchronous Line Interface ................................ 3-9
DLVj1 Asynchronous Interface ......................................... 3-13
DMV11 Synchronous Controller. ....................................... 3-16
DPV11 Synchronous Interface .......................................... 3-20
DRV11 Parallel-Line Interface .......................................... 3-24
DRV11-B DMA Interface .................................................. 3-27
DRV11-J High-Density Parallel Interface .......................... 3-30
DUV11 Synchronous Serial-Line Interface ........................ 3-32
DZQ11 Asynchronous Multiplexer - (Four Lines) ............. 3-35
DZV11 Asynchronous Multiplexer. .................................... 3-38
LPV11 Interface Module ................................................... 3-41
MASS STORAGE ................................................................... 3-44
RC25 Disk Subsystem ....................................................... 3-44
RD51, RD52, and RD53 Disk Drives ................................ 3-46
Factory Configuration ................................................... 3-46
Disk Formatting ............................................................ 3-49
RQDX1, RQDX2, and RQDX3 Disk Controllers ............... 3-51
RQDX1-E (M7512) Extender Module ........................... 3-53
RQDXE (M7513) Extender Module .............................. 3-55
RX50-AA Diskette Drive ................................................... 3-56
RL02 Disk Subsystem ....................................................... 3-57
BACKUP DEVICES ............................................................... 3-59
TQK25-EP Tape Drive Subsystem .................................... 3-59
TQK50-KA Tape Drive Subsystem ................................... 3-61
v

Contents

Chapter 4

Configuration

4.1
4.2
4.3
4.3.1
4.3.2
4.4
4.5
4.6

CONFIGURATION RULES ................................................... 4-1
MODULE PHYSICAL PRIORITy ......................................... 4-1
EXPANSION SPACE ............................................................. 4-2
Backplane ........................................................................... 4-2
Rear I/O Distribution PaneL ............................................ 4-2
POWER REQUIREMENTS ................................................... 4-3
BUS LOAD ............................................................................ 4-3
MODULE CSR ADDRESSES AND INTERRUPT
VECTORS .......................................................................... 4-3
Floating CSR Address ........................................................ 4-6
Floating Address Guidelines .............................................. 4-8
CONFIGURATION EXAMPLES ........................................... 4-9
Base System Configuration ................................................ 4-9
Advanced System Configuration ........................................ 4-10
PREPARE THE SETUP TABLE AND THE OPERATING
SySTEM ............................................................................. 4-12

4.6.1
4.6.2

4.7
4.7.1
4.7.2
4.8

Chapter 5

Diagnostics

5.1
5.2
5.3
5.3.1
5.3.2
5.4
5.4.1
5.4.2
5.4.3
5.5
5.6

INTRODUCTION .................................................................. 5-1
STARTUP SELF-TEST ......................................................... 5-1
KDJll-B TESTING PROCEDURE ........................................ 5-2
KDJ11-B Messages ............................................................ 5-4
KDJll-B Console Terminal Messages ............................... 5-6
KDFll-B TESTING PROCEDURES ..................................... 5-8
KDF11-B Messages ........................................................... 5-8
KDFll-B Diagnostic LEDs ................................................ 5-9
KDF11-B System HalL ..................................................... 5-10
CONSOLE EMULATOR MODE ............................................ 5-10
KDJll-B AND KDFll-B OCTAL DEBUGGING
TECHNIQUE (ODT) .......................................................... 5-11
USER TEST DISKETTES ..................................................... 5-12
User-Friendly Diagnostics ................................................. 5-12
Field Service Diagnostics ................................................... 5-13
Field Service Test Diskettes ............................................. 5-13
OTHER DIAGNOSTIC MEDIA ............................................. 5-14
TESTING WITH THE DEC/XII RUN-TIME
EXERCISER ....................................................................... 5-14
Run-Time Exerciser Messages .......................................... 5-14

5.7

5.7.1
5.7.2

5.7.3
5.8
5.9
5.9.1

Contents

5.9.1.1
5.9.1.2
5.9.1.3
5.9.2
5.9.3
5.10
5.10.1
5.10.2
5.10.3
5.10.4
5.11

System Error Messages ................................................ 5-15
Data Error Messages .................................................... 5-15
Status Error Message ................................................... 5-16
Selecting and Deselecting Program Modules...... .............. 5-16
Expanding the Run-Time Exerciser........................ .... ....... 5-17
TESTING WITH THE XXDP+ PROGRAMS ........................ 5-17
XXDP+ Messages .............................................................. 5-18
Starting a Program ............................................................ 5-19
Restarting a Program.......................... .............................. 5-19
Modifying a Diagnostic Program ....................................... 5-19
TROUBLESHOOTING THE BA23 ENCLOSURE ................ 5-21

Chapter 6

FRU Removal and Replacement Procedures

6.1
6.2
6.3
6.4
6.4.1
6.4.2
6.4.3
6.5
6.6
6.7
6.8
6.9
6.10

INTRODUCTION .................................................................. 6-1
CONTROL PANEL REMOVAL ............................................. 6-6
RX50 DISKETTE DRIVE REMOVAL .................................. 6-8
RD5n FIXED DISK DRIVE REMOVAL. ............................... 6-10
RD51 Disk Drive Read/Write Board Removal .................. 6-12
RD52 Main Printed Circuit Board RemovaL .................... 6-16
RD53 Disk Drive Read/Write Board Removal .................. 6-20
BACKPLANE ASSEMBLY REMOVAL ................................. 6-22
POWER SUPPLY (H7864-A/H7864) REMOVAL.. ................ 6-27
REAR COOLING FAN REMOVAL ....................................... 6-30
FRONT FAN REMOVAL ...................................................... 6-32
MODULE REMOVAL ............................................................ 6-36
REAR I/O INSERT PANEL REMOVAL ............................... 6-40

Appendices
Appendix A Backplane Pin Assignments
Appendix B Logical Unit Number Designation
Appendix C Formatting a MicroPDP-ll System
Appendix D Configuration Worksheet
Appendix E TK50 Extended Diagnostics
Appendix F RQDXE (M7513) Jumper Configurations

Index
vii

Contents
FIGURES

1-1
1-2
1-3
1-4
1-5
1-6
1-7
1-8
1-9
1-10
1-11
1-12
1-13
1-14
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
3-9
3-10
3-11
3-12

viii

Floor-Stand BA23 Enclosure ................................................................ 1-1
BA23-A Frame ..................................................................................... 1-2
BA23 Removable Bezels ....................................................................... 1-3
Air Flow ............................................................................................... 1-4
BA23 Front Control Panel... ...... ..... .... ... .... ..... .... .... ....... ................... .... 1-5
Control Panel with PC Board .... ... ...... ... ... ...... .... ... ....... .................. ...... 1-7
Backplane Assembly (Front View from Control Panel Side) ................ 1-8
Internal Cabling in a BA23 Enclosure ... ........ .... ........ ....... ........... ......... 1-9
Backplane.. ..... ....... ...... ...... ........... ... ..... ........ .... .... ... ........ ..... .............. ... 1-11
Backplane Grant Continuity.......... ................ .............. ...... ... ................. 1-12
Location of Power Supply ..................................................................... 1-13
Power Supply (Rear View) ................................................................... 1-17
Rear I/O Distribution Panel (KDJ11-B SLU Display Panel Shown) ...... 1-18
I/O Insert Panels and Adapter Plate .................................................... 1-19
KDJII-B SLU Display Panel ................................................................ 2-3
KDJII-B Internal Cabling ..................................................................... 2-3
KDJII-B Module Layout ...................................................................... 2-5
KDFII-BE SLU Panel .......................................................................... 2-23
KDFII-BE CPU Module ...................................................................... 2-25
MSVII-P Module Layout ..................................................................... 2-32
MSV11-JD, -JE Memory Module .......................................................... 2-36
+5 V Jumper Connections .................................................................... 2-37
+5 VBB Battery Backup Jumper Connections ...................................... 2-37
PMI/Q22-Bus Interface ........................................................................ 2-38
RQDXl and RQDX2 Controller Modules ............................................. 2-45
RQDXI-E Module ................................................................................. 2-48
TQK50 (M7546) Jumpers and Switches ............................................... 2-52
DEQNA Module Layout... ..................................................................... 3-4
DEQNA Internal Cabling ...................................................................... 3-5
DHVll Module Layout ........................................................................ 3-7
DHVll Internal Cabling ....................................................................... 3-8
DLVEI Module Layout ........................................................................ 3-9
DLVEI Internal Cabling ....................................................................... 3-12
DLVj1 Module Layout.. ........................................................................ 3-14
DLVJl Internal Cabling ........................................................................ 3-15
DMVll Module Layout ........................................................................ 3-18
DMV11 Internal Cabling ...................................................................... 3-19
DPVll Module Layout ......................................................................... 3-21
DPVll Internal Cabling ....................................................................... 3-23

Contents

3-13
3-14
3-15
3-16
3-17
3-18
3-19
3-20
3-21
3-22
3-23
3-24
3-25
3-26
3-27
3-28
3-29
3-30
3-31
3-32
3-33
3-34
3-35
3-36
3-37
3-38
3-39
4-1
4-2
4-3
4-4
4-5
5-1
5-2
6-1
6-2
6-3
6-4
6-5
6-6

DRV11 Module Layout.. ....................................................................... 3-24
DRV11 Internal Cabling ....................................................................... 3-26
DRV11-B Module Layout ..................................................................... 3-26
DRV11-B Internal Cabling .................................................................... 3-29
DRV11-j Module Layout ...................................................................... 3-30
DRV11-j Internal Cabling ..................................................................... 3-31
DUV11 Module Layout ........................................................................ 3-32
DUV11 Internal Cabling ....................................................................... 3-34
DZQ11 (M3106) Module Layout .......................................................... 3-35
DZQ11 (M3106) Internal Cabling ......................................................... 3-37
DZV11 Module Layout ......................................................................... 3-38
DZV11 Internal Cabling ....................................................................... 3-40
LPV11 Module Layout ......................................................................... 3-41
LPV11 Internal Cabling ........................................................................ 3-43
RC25 Disk Subsystem .......................................................................... 3-45
M7740 Module Layout ......................................................................... 3-45
RD51 Disk Drive and Shunt jumper .................................................... 3-47
RX50 Diskette Drive ............................................................................ 3-49
RQDX1 and RQDX2 Module Layouts .................................................. 3-52
RQDX1-E jumper Locations ................................................................. 3-54
RX50 Diskette Drive ............................................................................ 3-56
RL02 Disk Drive Subsystem ................................................................ 3-57
RLV12 Module Layout ......................................................................... 3-58
TK25 Tape Drive ................................................................................. 3-59
M7605 Module Layout ......................................................................... 3-60
TQK50 Tape Drive Sybsystem ............................................................ 3-62
M7546 Module Layout ......................................................................... 3-63
Configuration Worksheet ..... '" .............................................................. 4-5
Cable Connections for the Base System ............................................... 4-9
Base System ......................................................................................... 4-10
Cable Connections for an Advanced Configuration ............................... 4-11
Advanced System ................................................................................. 4-11
Error Message Screen.......................................................................... 5-7
Troubleshooting Flowchart ................................................................... 5-22
BA23 Enclosure FRUs ......................................................................... 6-5
Remove the Control Panel. ................................................................... 6-7
RX50 Diskette Drive RemovaL ........................................................... 6-9
RD5n Removal (RD51 Disk Drive Shown) ........................................... 6-11
Set the RD52 jumper Clip ................................................................... 6-12
RD51 Disk Drive Skid Plate RemovaL ............................................... 6-13

Contents
6-7
6-8
6-9
6-10
6-11
6-12
6-13
6-14
6-15
6-16
6-17
6-18
6-19
6-20
6-21
6-22
6-23
6-24
6-25
6-26
6-27
6-28
6-29
6-30
6-31
6-32
A-I
F-l
F-2
F-3
F-4
F-5
F-6
F-7
F-8

RD51 Disk Drive Allen Screws and Connector P5 Removal ............... 6-13
RD51 Disk Drive Connectors P6, P7, P8, and P4 ............................... 6-14
DIP Shunt Pack Setting ........................................................................ 6-15
Remove the Slide Plate ........................................................................ 6-16
Remove the 2-Pin Connector and Screws ............................................ 6-17
Remove the Front BezeL .................................................................... 6-17
Remove Phillips Screws from Heatsink ................................................ 6-18
Remove the MPCB ............................................................................... 6-19
RD53 Read/Write Board RemovaL ..................................................... 6-21
Accessing the Backplane ...................................................................... 6-23
Removing Cables and Modules ............................................................. 6-25
Removing Access Cover and Screws .................................................... 6-26
Removing the Backplane ...................................................................... 6-26
Power Supply RemovaL ....................................................................... 6-28
Remove Power Supply and Fan Connector .......................................... 6-29
Install Rear Fan Power Cable .............................................................. 6-30
Rear Cooling Fan Power Cable Position ............................................... 6-30
Remove the Fan from the Chassis ....................................................... 6-31
Install the Rear Fan ............................................................................. 6-32
Disconnect the Front Cooling Fan ........................................................ 6-33
Remove the Front Cooling Fan ............................................................ 6-34
Connect the Front Fan Power Cable and Fan Guard ........................... 6-34
Install Replacement Fan ....................................................................... 6-35
Module Removal ................................................................................... 6-37
Quad-Height Module Ejector Levers .................................................... 6-39
Rear I/O Insert Panel Removal ............................................................ 6-41
Quad-Height Module Contact Finger Identification .............................. A-I
Three Possible Disk Drive Arrangements (Factory Setting) ................ F-2
Three Fixed Disk Drives with an RQDXE (Arrangement 1) ............... F-3
An RX50 and a Fixed Disk Drive with an RQDXE .............................. F-4
An RX50 and two RD5n Disk Drives with an RQDXE
(Arrangement 1) ............................................................................... F-5
A Fixed Disk Drive and an RX50 in a BA23-A Expansion Box ........... F-6
An RX50 and Two Fixed Disk Drives (Arrangement 2) ...................... F-7
Two Fixed Disk Drives and an RX50 (Arrangement 3) ....................... F-8
Three Fixed Disk Drives (Arrangement 2)F-9

Contents
TABLES

1-1
1-2
1-3
1-4
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
2-15
2-16
2-17
2-18
2-19
2-20
2-21
2-22
2-23
2-24
2-25
2-26
2-27
2-28
2-29
2-30
2-31
2-32
2-33
3-1
3-2
3-3

MicroPDP-ll Systems Dimensions and Weights .................................. 1-2
Front Control Panel Controls and Indicators ........................................ 1-5
R7864-A (Rev20) Power Supply Specifications .................................... 1-15
R7864 (RevI2) Power Supply Specifications ....................................... 1-16
KDJ11-B Factory Setting ..................................................................... 2-5
Baud Rate/Mode Select Switch ............................................................ 2-6
KDJll Settings for Switches 2, 3, and 4 ............................................. 2-7
Switch Settings for Switches 6, 7, and 8 ............................................. 2-8
Setup Mode Commands ........................................................................ 2-12
KDJll-B Setup Default Parameter Values ........................................... 2-13
ROM Code Mode Selections ................................................................. 2-14
PMG Count Settings ............................................................................. 2-15
Clock Signal Sources ............................................................................ 2-15
ROM Addresses Disabled ..................................................................... 2-16
ROM ODT Commands .......................................................................... 2-21
KDFll-BE Module Factory Jumper Configuration ............................... 2-26
KDFII-BE Module Factory Switch Configuration ................................ 2-27
KDFll-BE Diagnostic/Bootstrap Switch Settings ................................ 2-27
KDFll-B Baud Rate Switch Settings ................................................... 2-29
MSVll Memory Modules .................................................................... 2-32
MSVll-P Factory Jumper Configuration .............................................. 2-33
MSVll-P CSR Configuration ............................................................... 2-34
MSVll-P Starting Address Configuration ............................................ 2-35
MSVll-JD, -JE Memory Modules ........................................................ 2-36
MSVll-JD, -JE Jumper Configurations ................................................ 2-39
MSVll-JD, -JE Starting Memory Address Selection ........................... 2-41
Common Memory Starting Address ..................................................... 2-42
CSR Address Selection ......................................................................... 2-43
RQDXn Factory Jumper Configuration ................................................. 2-46
RQDXI-E Factory Configuration .......................................................... 2-47
Three Possible Arrangements Using the RQDXE ................................ 2-49
RQDXE Jumper Setting (Factory Configuration) ................................. 2-49
Four Fixed Disks With an RQDXE. ...................................................... 2-50
RQDXE Configuration for Three RD5n Disk Drives ........................... 2-50
M7546 Fixed CSR Address .................................................................. 2-51
Unit Number Switch Pack Settings ...................................................... 2-52
Revision Level Switch Pack .................................................................. 2-53
CSR Addresses and Interrupt Vectors ................................................. 3-5
DRVll CSR Address ........................................................................... 3-7
DRVll Interrupt Vector ...................................................................... 3-8
xi

Contents

3-4
3-5
3-6
3-7
3-8
3-9
3-10
3-11
3-12
3-13
3-14
3-15
3-16
3-17
3-18
3-19
3-20
3-21
3-22
3-23
3-24
3-25
3-26
3-27
3-28
3-29
3-30
3-31
3-32
3-33
3-34
3-35
3-36
3-37
3-38
3-39
3-40
4-1
4-2
4-3
4-4
4-5
xii

DLVEI Fixed CSR Addresses .............................................................. 3-10
DLVEI Interrupt Vector ...................................................................... 3-10
DLVEI Jumper Factory Setting ........................................................... 3-11
DLVEI Baud Rate Selection ................................................................ 3-12
DL VJl CSR Address ............................................................................ 3-13
DLVJI Interrupt Vector ....................................................................... 3-14
DMVll Versions .................................................................................. 3-16
DMVll Interfaces ................................................................................ 3-16
DMVll CSR Address ........................................................................... 3-17
DMVll Interrupt Vector ..................................................................... 3-17
DPVll CSR Address ............................................................................ 3-22
DPVll Interrupt Vector ...................................................................... 3-22
DRVll CSR Address ........................................................................... 3-25
DRVll Interrupt Vector ...................................................................... 3-25
DRVII-B CSR Address ........................................................................ 3-28
DRVII-B Interrupt Vector .................................................................. 3-28
DRVII-J CSR Address ......................................................................... 3-31
DUV11 CSR Address ........................................................................... 3-33
DUVll Interrupt Vector ...................................................................... 3-33
DZQll CSR Address ............................................................................ 3-36
DZQll Interrupt Vector ...................................................................... 3-36
DZV11 CSR Address ............................................................................ 3-39
DZVll Interrupt Vector ...................................................................... 3-39
LPV11 CSR Address ............................................................................ 3-42
LPVll Interrupt Vector ....................................................................... 3-42
LPV11 Jumper Configuration ............................................................... 3-42
M7740 CSR Address ............................................................................ 3-44
RD51 DIP Shunt Pack Factory Setting ................................................ 3-48
RQDX CSR Address ............................................................................. 3-53
RQDXI-E Factory Configuration .......................................................... 3-54
RQDXE Jumper Setting (Factory Configuration) ................................. 3-55
RQDXE Configuration for Three Fixed Disk Drives ............................ 3-55
RLV12 CSR Address ............................................................................ 3-58
RL V12 Interrupt Vector ...................................................................... 3-58
M7605 CSR Address ............................................................................ 3-61
M7605 Interrupt Vector ...................................................................... 3-61
M7546 CSR Address ............................................................................ 3-63
Order of Modules in the BA23 Backplane ............................................ 4-2
Current and Power Limits .................................................................... 4-3
Power Requirements, Bus Loads, I/O Panel... ...................................... 4-4
Address/Vector Worksheet ................................................................... 4-6
Floating CSR Address Chart ................................................................ 4-7

Contents
5-1
5-2
5-3
5-4
5-5
5-6
5-7
6-1
6-2
A-I
A-2
A-3
A-4
A-5
A-6
A-7
A-8
B-1
B-2
B-3
B-4
D-l
D-2
E-l
E-2
E-3
F-l
F-2
F-3
F-4

Self-Test Listing ................................................................................... 5-2
KD]11-B Self-Test and Boot/Diagnostic ROM Messages ..................... 5-4
KDJ11-B Self-Test and Boot/Diagnostic ROM Messages ..................... 5-9
List of LED Self-Test Display Codes ................................................... 5-10
Console ODT Commands ...................................................................... 5-12
Select/Deselect Commands................................................................... 5-16
XXDP+ Diagnostic Programs ............................................................... 5-18
Field Replaceable Units ........................................................................ 6-2
RD51 Jumper Configuration ................................................................. 6-15
KDJ11-B (M8190)/KDF11-BE (M8189) Module Backplane Pin
Assignments (Rows A and B) ........................................................... A-2
KDJ11-B (M8190)/KDF11-BE (M8189) Module Backplane Pin
Assignments (Rows C and D) ........................................................... A-2
MSV11-PK (M8067) Module Backplane Pin Assignments
(Rows A and B) ................................................................................. A-3
MSV11-PK (M8067) Module Backplane Pin Assignments
(Rows C and D) ................................................................................ A-3
DZV11-A (M7957) Module Backplane Pin Assignments
Rows A and B) .................................................................................. A-4
DZV11-A (M7957) Module Backplane Pin Assignments
(Rows C and D) ................................................................................ A-4
RQDXl (M8369) Module Backplane Pin Assignments
(Rows A and B) ................................................................................. A-5
RQDXl (M8639) Module Backplane Pin Assignments
(Rows C and D) ................................................................................ A-5
Disk Unit Designation .......................................................................... B-1
RQDX Standard Logical Unit Number Configuration ........................... B-3
RQDX Logical Unit Number Jumper Configuration ............................. B-4
RQDX Unit Number and Jumper Format.. ........................................... B-4
Sample Worksheet for Generating CSR Addresses .............................. D-3
Blank Worksheet for Generating CSR Addresses ................................ D-4
Error Printout Commands .................................................................... E-ll
Sample Messages and Their Source ..................................................... E-11
Data Reliability Test Status Drive Errors ............................................ E-12
RQDXE Jumper Setting (Factory Configuration) ................................. F-2
RQDXE Jumper Setting for Three RD5n Disk Drives
(Arrangement 1) ............................................................................... F-3
RQDXE Jumper Setting for an RX50 and Fixed Disk Drive ................ F-4
RQDXE Jumper Setting for an RX50 and Two Fixed Disk Drives
(Arrangement 1) ............................................................................... F-5

xiii

Contents

F-5
F-6
F-7
F-8

xiv

RQDXE jumper Setting for a Fixed Disk Drive and an RX50 in a
BA23-A Expansion Box ..................................................................... F-6
RQDXE jumper Setting for an RX50 and Two Fixed Disk Drives
(Arrangement 2) ............................................................................... F-7
RQDXE jumper Setting for Two Fixed Disk Drives and an RX50
(Arrangement 3) ............................................................................... F-8
RQDXE jumper Setting for Three Fixed Disk Drives
(Arrangement 2) ............................................................................... F-9

Introduction
This manual is one of a set that describes the MicroPDP-ll systems in a BA23
enclosure and is intended for an experienced user. The MicroPDP-ll System
Owner's Manual (EK-MICll-OM) describes the unpacking, installation, checkout,
and normal operation of the MicroPDP-ll systems.
The KDJll-BC CPU User's Guide (EK-KDJEB-UG) describes the use and operation
of the KDJll-B CPU module. The KDFll-BA CPU User's Guide (EK-KDFEB-UG)
describes the use and operation of the KDFll-B CPU module. The MicroPDP-ll
System Illustrated Parts Breakdown (EK-OLCP5-IP) shows the mechanical breakdown of the MicroPDP-ll in the BA23 mounting enclosure. The MicroPDP-ll
Systems Service Maintenance Guide (EK-MICll-SG) provides instructions on field
service maintenance and on how to troubleshoot down to the field replaceable unit
(FRU) level.

Notes, Cautions, and Warnings
Any notes, cautions, and warnings that appear in this manual are defined as:
• NOTE - contains general information.
• CAUTION - contains information to prevent damage to equipment.
• WARNING - contains information to prevent personal injury.

Related Documents*
MicroPDP-ll Systems Owner's Manual
MicroPDP-ll Systems Service Maintenance Guide
MicroPDP-ll System Illustrated Parts Breakdown
KDJll-BC CPU User's Guide
KDFll-BA CPU User's Guide
RQDXl Controller Module User's Guide
Microcomputer Interfaces Handbook
Microcomputer and Memories Handbook

EK-MICII-0M
EK-MICl1-SG
EK-OLCP5-IP
EK-KDJIB-UG
EK-KDFEB-UG
EK-RQDXI-UG
EB-20175-20
EB-18451-20

* The text of this document contains additional references to Digital documents.
xv

Introduction

You can order these documents from:
Digital Equipment Corporation
Accessories and Supplies Group
P.O. Box CS2008
Nashua, NH 03061
Attention: Documentation Products

Glossary Location
Glossary references are located in the glossary of common computing terms found
in your owner's manual for your system. This glossary contains some, but not all,
of the following acronyms.

Acronyms Used in this Document
Note that
• Signal names
• Acronyms displayed in messages
• Acronyms used by diagnostic programs
are not included in the following list.
ANSI
ASCII

APC
BCSR
BOT
CCITT
CIS
CPU
CSR
CSRA
DDCMP
DIP
DMA
DMSCP
DU
DUP
ECC
EEPROM
XVI

American National Standards Institute
American Standard Code for Information Interchange (a standard
code of 7- or 8-bit coded characters used in the transmission of
data for processing)
Assembled program count
Boot control and status register
Beginning of tape
Comite Consultatif Internationale de Telephonie et Telegraphie
(International Telephone and Telegraph Consultative Committee)
Commercial instruction set
Central processing unit
Control status register
Control status register address
Digital data communication message protocol
Dual in-line package
Direct memory access
Disk mass storage control protocol
Disk unit
Diagnostic utilities protocol
Error correction code
Electrically erasable programmable read only memory

Introduction

EIA
EIS
EOT
EPROM
ERR
FP
FPP
FRU
I/O
IP
LED
LOE
LSB
LSI
LTC
LUN
MMU
MOS
MPCB
MSB
MSCP
ODT
PC
PMG
PMI
PP
PROM
PSW
RAM
RDY
ROM
SA
SDLC
SLU
SYS ERR
TMSCP
UART
UQSSP
VOLT SEL
WR
WRT PROT

Electronic Industries Association
Extended instruction set
End of tape
Erasable programmable read only memory
Error
Floating-point
Floating-point processor
Field replaceable unit
Input/output
Initialize polling (usually refers to an address in the CSR)
Light emitting diode
Loop-on-error
Least significant bit
Large-scale integration
Line time clock
Logical unit number
Memory management unit
Metallic oxide semiconductor
Main printed circuit board
Most significant bit
Mass storage control protocol
Octal debugging technique
Printed circuit
Processor mastership grant
Private memory interconnect
Purge and poll (refers to a diagnostic procedure)
Programmable read only memory
Processor status word
Random access memory
Ready
Read only memory
Starting address (refers here to a location within the CSR)
Synchronous data-link control
Serial line unit (associated here with a CPU module)
System error
Tape mass storage control protocol
Universal asynchronous receiver/transmitter (refers to a device
that performs parallel-to-serial and serial-to-parallel conversion)
U/Q-Bus storage systems protocol
Voltage select
Wrap (refers to a bit in the control status register)
Write-protect
XVII

BA23 Enclosure
1.1

INTRODUCTION

The BA23 micro systems enclosure (Figure 1-1) supports the MicroPDP-ll computer systems and a wide variety of hardware options. The fan-cooled enclosure
operates in an open office environment and includes the following major
components:
• BA23-A frame

• Backplane

• Front control panel

• Power supply and fans

• Mass storage area

• Rear I/O distribution panel

Chapter 2 discusses the contents of typical MicroPDP-ll, MicroPDP-ll/73, and
MicroPDP-ll/83 systems.

Figure 1-1

Floor-Stand BA23 Enclosure

1-1

BA23 Enclosure

1.2

BA23-A FRAME

The BA23-A frame (Figure 1-2) houses the power supply and the backplane assembly. It also provides space for two 13.3-cm (5-1/4-in) mass storage devices.

Figure 1-2

BA23-A Frame

The BA23-A frame mounts in a rack or in a floor-stand. The floor-stand model can
convert to tabletop use. Table 1-1 shows the dimensions and weights of the various
configurations.

Table 1-1

MicroPDP-ll Systems Dimensions and Weights
Model
Specification
Floor-Stand
Tabletop
Rackmount
Height
Width
Depth
Weight

1-2

64.2 em
(24.5 in)
25.4 em
(10 in)
72.6 em
(28.6 in)
31.75 kg
(701b)

17.7 cm
(7 in)
56.2 em
(22.13 in)
72.6 em
(28.6 in)
29.5 kg
(65 lb)

13.3 em
(5.2 in)
48.25 em
(19 in)
64.3 cm
(25.3 in)
24 kg
(53 lb)

BA23 Enclosure

1.2.1

BA23-A Bezels

A removable bezel covers the front of the BA23-A frame. The floor-stand and
tabletop models also have a removable rear bezel (Figure 1-3).

Figure 1-3
1.2.2

BA23 Removable Bezels

Air Circulation

The BA23-A frame contains two fans
• One above the control panel
• One above the power supply
which draw air from the bottom of the enclosure (Figure 1-4).

1-3

BA23 Enclosure

Figure 1-4 Air Flow
1.3

FRONT CONTROL PANEL

The front control panel of the enclosure contains the system controls and indicators
(Figure 1-5); Table 1-2 describes their functions.

1-4

BA23 Enclosure

~D~DD~D
Micro

BEVNT
ENABLE

PDP-ll/73

I
0

•

AC POWER
ON/OFF
SWITCH

DC OK

Run

Halt

Restart

GG
0 G

RESTART
ENABLE

Fixed disk 0

Wrtte Protect

Figure 1-5

Table 1-2
Control/
Indicator
I/O

DC OK

Run

Ready

BA23 Front Control Panel

Front Control Panel Controls and Indicators
Position/
Description
Condition
In/Lit

Rocker switch with integral red indicator. Lights
red when system ac power is on.

Out/Unlit

System ac power is off.

Lit

Green LED. Lights when all dc voltages are
present and within tolerance.

Unlit

The Q22-Bus BDCOK (dc bus power is OK) signal
is negated.

Lit

Green LED. Lights when the CPU is executing in
run mode.

Unlit

The CPU is in console mode.

1-5

BA23 Enclosure

Table 1-2
Control!
Indicator
Halt

Front Control Panel Controls and Indicators (Cont.)
Position!
Description
Condition
Out/Unlit

Push-on/push-off button with integral red LED.
Normal position for running user software.

In/Lit

Red LED. Stops normal software operation. Puts
the CPU in console mode and the system accepts
only console commands (see Chapter 2,
MicroPDP-ll Base Systems).

Restart

Momentary-contact pushbutton. When pressed
(and enabled), causes a power-down/power-up
sequence to be simulated, to restart CPU
operation. Press and release the Halt button
twice before resetting the system.

Fixed Disk 0
Write-Protect

Ready

1.3.1

Out/Unlit

Push-on/push-off button with integral yellow LED.
Normal operation. Enables disk read and write
operations.

In/Lit

Lights yellow. Data cannot be written to the disk
(data can be read from the disk).

Out/Lit

Push-on/push-off button with integral green LED.
Prevents fixed disk read and write operations.

In/Unlit

Normal operation. Lights green. Enables disk
reads and writes.

Control Panel Printed Circuit Board

The control panel printed circuit (PC) board lies behind the molded plastic front
control panel. This board provides access to +5 V and +12 V test points and to a
line time clock (LTC) switch.
The PC board also contains the system buttons, LEDs, and a 20-pin connector Q1)
for the backplane assembly cable. A bracket on the rear of the molded front panel
holds the system power On/Off switch.

1-6

BA23 Enclosure

1.3.2

LTC DIP Switch Unit

The LTC DIP (dual in-line package) switch unit has two switches labeled 1 and 2
(Figure 1-6). Setting switch 1 to OFF enables the Q22-Bus BEVENT timing signal
and allows the LTC to function under software control. Switch 1 is referred to as
the BEVENT Enable switch.
Setting switch 2 (Restart/Enable) to ON allows the front control panel Restart
switch to function as described in Table 1-2. Setting the Restart/Enable switch to
OFF disables the front control panel Restart switch.

POWER ON/OFF SWITCH

~DmDDmD
Micro
LTC SWITCH

SWITCH 1

PDP-11/73

--------Rce
DC OK

0
SWITCH 2

PC
BOARD

I
0

Halt

---,

0
Restart

20-PIN
CONNECTOR

~ ~

ON PC
BOARD

Fixed Disk 0

Write Protect

TEST
POINTS

Ready

~ ~
---------

I
I
_--1

WIDE FRONT PLASTIC COVER NOT SHOWN

Figure 1-6 Control Panel with PC Board

1-7

BA23 Enclosure

1.4

MASS STORAGE

The front bezel covers two slots uSed for mounting standard 13.3-crn (5-1/4 in)
mass storage devices. The top (or right) slot usually contains an RX50 diskette
drive. This slot can also accommodate a TK50 tape drive. A fixed disk drive can
also be installed in this slot (see the caution below). This slot is referred to as port
1. The bottom (or left) slot usually contains a fixed disk drive. This slot is referred
to as port o.
CAUTION
Never install more than one fixed disk drive in a BA23-A enclosure. Damage to the system could result.
1.5

BACKPLANE ASSEMBLY

The backplane assembly (Figure 1-7) consists of three major parts:
• BA23-A mass storage signal distribution panel
• Sheet metal mounting bracket
• Q22-Bus backplane

~IF
1,;,[
J7

J7 FIXED DISK 0

JlO

jI:::::::::::::::::::::U

*ON BACKPLANE (SIDE 2)
FRONT CONTROL PANEL CONNECTION

Figure 1-7
1.5.1

Backplane Assembly (Front View from Control Panel Side)

Mass Storage Signal Distribution Panel

The RX50 diskette drive and RD51, RD52, or RD53 fixed disk drive, installed in
the BA23-A enclosure, connect to the mass storage signal distribution panel. Figure
1-8 shows the internal cabling setup for the BA23-A enclosure.

1-8

BA23 Enclosure

NOTES:
1.
CONNECTORS J1 AND J2 ARE LOCATED
ON THE BACKPLANE (H9278-A)
ASSEMBLY.
2.
IF DISK DRIVE IS NOT PRESENT, THE
POWER CABLE CONNECTOR SHOULD BE
PLUGGED INTO J3 ON THE DISTRIBUTION
PANEL.
3.
IF DISK DRIVE IS NOT PRESENT, THE
POWER CABLE CONNECTOR SHOULD BE
PLUGGED INTO J4 ON THE DISTRIBUTION
PANEL.
4.
THE REAR FAN CABLE IS AN INTEGRAL
PART OF THE H7864 POWER SUPPLY.
5.
THE CABLE IS AN INTEGRAL PART OF THE
7020695-01 ASSEMBLY.

DISTRIBUTION PANEL
7019986-00

VIEW A-A
2 PLACES

REAR FAN
1217556-01

POWER
SUPPLY
UNIT
3020444-00
OR
3021749-01

FRONT FAN
1217556-01

7020449-00
SEE NOTE 3

7020451-1 C

RD51
OR
RD52

Figure 1-8

RX50

FRONT
CONTROL
PANEL
7020695-01

Internal Cabling in a BA23 Enclosure

1-9

BA23 Enclosure
The signal distribution panel carries the signals from an RQDX controller module
installed in the Q22-Bus backplane. Six connectors on the signal distribution panel
provide the following functions:
• J6 Removable Disk 1+2 - provides the signals to an RX50 diskette drive. An
RX50 diskette drive contains two disk units. When a fixed disk drive is present,
the ROM code usually labels these as disk unit 1 (DUl) and disk unit 2 (DU2).
• J7 Fixed Disk 0 and J2 Fixed Disk 0 - provide the signals to a fixed disk drive
installed in port 0 (left slot) of the BA23-A enclosure. This is the first fixed disk
drive to be booted, and the ROM code usually labels it as disk unit 0 (DUO).
• Jl Fixed Disk 1 and J5 Fixed Disk 1 - provide the signals to a fixed disk drive
installed in port 1 (right slot) of the BA23-A enclosure. This is the second fixed
disk drive to be booted, and the ROM code usually labels it as disk unit 1
(DUl).
CAUTION
Never install more that one fixed disk drive in a BA23-A enclosure. Damage to the system could result.

• J4 - provides the signals to the control panel printed circuit (PC) board from the
mass storage signal distribution panel.
A TK50 tape drive, installed in the BA23 enclosure, connects directly to its
TQK50 controller module with a ribbon cable. This cable passes through the access
door on the signal distribution panel and under the Q22-Bus backplane.
1.5.2

Q22-Bus Backplane

The backplane implements the extended LSI-11 bus, which uses 22-bit addressing
to support up to 4 megabytes of main memory. This bus is commonly referred to
as the Q22-Bus.
The Q22-Bus backplane supports a maximum of 38 ac loads and 20 dc loads. The
ac loading is the amount of capacitance a module presents to a bus signal line; one
ac load equals 9.35 picofarads (pF). The dc loading is the amount of dc leakage a
module presents to a bus signal line; one dc load is approximately 105
microamperes (J.lA). The backplane itself presents 7 ac loads and no dc loads.
Four connectors on side 2 of the backplane (Figures 1-7 and 1-8) provide the
following functions:
• ]1 - provides the connection for the power supply backplane cable which carries

the dc power and signals from the power supply.
• J2 - provides the signals to the control panel printed circuit board from an
installed CPU module.
• J3 and ]4 - provide for termination of the mass storage power cable when no
mass storage device is present.
1-10

BA23 Enclosure

The backplane has an eight-layer printed circuit board that is arranged as follows:
1
2
3
4
5
6
7
8

Signal
Signal
+5 Vdc from power supply regulator
Ground
Ground
+12 Vdc from power supply regulator
Signal
Signal

Chapter 4 discusses the configuration rules for the backplane. Appendix A discusses
the backplane pin assignments for the most commonly used modules.
The backplane contains four rows of connectors identified as A, B, C, and D. Each
row contains eight slots for inserting modules. Figure 1-9 shows the connectors
that supply the Q22-Bus signal to the modules.

J3D

H7864
POWER
CONNECTOR
A

022

J1
1

J4D

022

022
022
022

022

I:J -

CONTROL

~PANEL

CONNECTOR

XZl
SIDE 1

XZ2

XZ3

XZ4

DODD

NOTES:
1. CONNECTORS Jl, J2, J3, AND J4 ARE MOUNTED ON SIDE 2.
2. XZ1~4 ARE BACKPLANE TERMINATOR SOCKETS. THE SIP TERMINATION RESISTORS MOUNTED IN
XZ1~4 MUST BE REMOVED WHEN EXPANDING BEYOND THIS BACKPLANE.
3. J3 AND J4 ARE NOT POWER SOURCES. THEY ARE USED TO SUPPLY POWER TO THE BACKPLANE
WHEN THE RD51·A FIXED DISK DRIVE OR RX50-AA DISKETTE DRIVE IS NOT INSTALLED.

Figure 1-9

Backplane

1-11

BA23 Enclosure

The C and D rows of slots 1, 2, and 3 provide an interconnection between the
three slots. This interconnection is referred to as the CD bus. Any dual-height
module installed in slots 1 through 3 must be inserted in rows A and B.
The backplane accommodates dual- or quad-height Q22-Bus-compatible modules.
Figure 1-10 shows the grant continuity lines for the Q22-Bus interrupt. Slots 4
through 8 carry the Q22-Bus signal in rows C and D as well as rows A and B.
C

C-D

NOTE:
C+D 11-31 ~ CD INTERCONNECT
OTHERS ~ Q22 FORMAT

Figure 1-10 Backplane Grant Continuity
You can install two dual-height Q22-Bus modules in slots 4 through 8. If you install
only one dual-height module in a slot, you must install a grant continuity card
(M9047 or G7272) in the adjacent rows (A or C). The grant continuity card carries
the Q22-Bus signal to the next row or slot. If you install only one dual-height
module in slot 8, you must install it in rows A and B.

1-12

BA23 Enclosure
1.6

POWER SUPPLY AND FANS

The power supply (Figure 1-11) features protection against excess voltages, currents, and temporary fluctuations in the ac power supply.
POWER SUPPLY

Figure 1-11

Location of Power Supply

The BA23-A enclosure has one of two possible power supplies:
• H7864 (Rev. 12), a 230-W unit that supplies +5 Vdc at 4.5 A to 36.0 A and
+ 12 Vdc at 0.0 A to 6.0 A.
• H7864-A (Rev. 20), a 230-W unit that supplies +5 Vdc at 4.5 A to 36.0 A and
+12 Vdc at 0.0 A to 7.0 A.
Both power supplies provide power to the backplane, the fixed disk drive, and the
diskette drive.
It also generates three system control signals to the backplane. The power supply
asserts two of these signals, BDCOK Hand BPOK H, when the system power is
stable. The third signal, BEVENT L, is an external line clock interrupt request to
the CPU. The LTC switch on the control panel PC board enables the BEVENT L
signal.

The power supply also includes two fan outputs (+ 10 Vdc at 0.45 A) for the front
and rear dc fans. The fan voltages can be increased to + 12 Vdc by changing a
power supply jumper. However, the KDJll-B and KDFll-B module thermal and
acoustical specifications are based on the + 10-V setting. The required fan power
does not affect the 230-W output specification.

1-13

BA23 Enclosure
NOTE
MicroPDP-11/83 systems contain only the H7864-A (Rev. 20)
power supply.

Older versions of the BA23 enclosure may have the H7864 power supply (Rev.
12). The difference in the +12 Vdc output current becomes important when you
configure a system (see Chapter 4, Configuration). If it becomes necessary to
replace a power supply, it must be replaced with an identical model (see Chapter 6,
FRU Removal and Replacement Procedures).
See Table 1-3 for the specifications for the H7864-A power supply (Rev. 20
DIGITAL P.N. 30-21749-00). See Table 1-4 for the specifications for the H7684
power supply (Rev. 12 DIGITAL P.N. 30-20444-00).
The rear of the power supply contains a connector for remote power control (Figure 1-12). An ac input connector provides compatibility with international line
cords. A circuit breaker protects the input power line. The voltage select (VOLT
SEL) switch selects two ranges:
• 120 V =

88-128 Vac

• 240 V = 176-256 Vac

1-14

BA23 Enclosure

Table 1-3
H7864-A (Rev. 20) Power Supply Specifications
+5 Vdc Output
Voltage

+5.1 Vdc ±2.5%

Current

36.0 Adc max.
4.5 Adc min.

Excess current
(must trip)

37.0 A min. (averaged over 1 ms min.)
42.0 A max. (averaged over 1 ms min.)

Ripple and noise

50 MV peak-to-peak max.

+12 Vdc Output
Voltage

+12.1 Vdc ±2.5%

Current

7.0 Adc max.
0.0 Adc min.

Normal excess current
(must trip)

7.2 A min. (averaged over 1 s)
8.0 A max. (averaged over 1 s)

Startup excess current
(must trip)

13.0 A for 3 s

Startup excess current
(must not trip)

9.0 A for 10 s min.
10.0 A for 5 s min.
11.5 A for 1 s min.

Ripple and noise

75 MV peak-to-peak max.

1-15

BA23 Enclosure

Table 1-4
H7864 (Rev. 12) Power Supply Specifications
+5 Vdc Output
Voltage

+5.1 Vdc ±2.5%

Current

36.0 Adc max.
4.5 Adc min.

Excess current
(must trip)

36 A min. (averaged over 1 ms min.)
44 A max. (averaged over 1 ms min.)

Ripple and noise

50 MV peak-to-peak max.

+12 Vdc Output
Voltage

+12.1 Vdc ±2.5%

Current

6.0 Adc max.
0.0 Adc min.

Normal excess current
(must trip)

9.5 A min. (averaged over 1 s)
13.0 A max. (averaged over 1 s)

Startup excess current
(must trip)

13.0 A for 3 s

Startup excess current
(must not trip)

9.0 A for 10 s min.
10.0 A for 5 s min.
11.5 A for 1 s min.

Ripple and noise

75 MV peak-to-peak max.

1-16

BA23 Enclosure

VOLTAGE
SELECTOR
SWITCH

CIRCUIT
BREAKER

AC
INPUT

REMOTE
POWER
CONNECTOR

Figure 1-12

Power Supply (Rear View)

The rear fan power cable is an integral part of the H7864-A and H7864 power
supplies.
The front of the power supply (Figures 1-7 and 1-8) contains four connectors that
provide the following functions:
• J7 - provides the power signal for the front control panel.
• J8 - provides the signals for the mass storage power cable. The mass storage
power cable terminates in J3 on the backplane assembly if an RX50 diskette
drive or TK50 tape drive is not present, and in J4 if a fixed disk is not present.
• J9 - provides the power and signals for the backplane power cable. The backplane power cable terminates in Jl of the backplane assembly.
• ]10 - provides the signal for the front fan power cable.

1-17

BA23 Enclosure
1.7

REAR I/O DISTRIBUTION PANEL

External devices connect to the system through the rear I/O distribution panel of
the BA23 enclosure.
Each module that connects to an external device comes with an internal cable, a
filter connector, and an insert panel. Together these three items are referred to as
a cabinet kit. Chapter 3 provides cabinet kit information for modules that support
external devices.
The filter connectors mount in the insert panels and the insert panels are installed
in cutouts in the rear I/O distribution panel. The BA23 rear I/O distribution panel
provides a place to install up to six insert panels, two of which can contain 50-pin
connector insert panels.
Figure 1-13 shows the rear I/O distribution panel with a typical insert panel
installed. It also shows the serial line unit (SLU) display panel of the KDJll-B or
KDFll-B CPU module, which is usually installed in the top (or left) cutout.
CONSOLE SLU
INSERT·DISPLAY
PANEL

TYPICAL, OPTIONAL
PATCH AND FILTER
PANEL

REMOVABLE METAL
INSERT

50-PIN CONNECTOR
EXPANSION SLOTS

Figure 1-13

1-18

Rear I/O Distribution Panel (KDJll-B SLU Display Panel Shown)

BA23 Enclosure
The rear I/O distribution panel has six cutouts as follows:
• Two of type A: 1.6 X 8.1 cm (0.6 X 3.2 in)
• Four of type B: 6.2 X 8.1 cm (2.5 X 3.2 in)
Insert panels correspond to the following I/O distribution panel cutouts:
• Type A: 2.5 X 10.1 cm (1 X 4 in)
• Type B: 6.6 X 8.2 cm (2.6 X 3.2 in)
In addition, a removable bracket between the third and fourth cutout permits
installation of three more type A insert panels by installing an adapter plate. Figure
1-14 shows typical type A and type B insert panels and the adapter plate.

Figure 1-14 I/O Insert Panels and Adapter Plate

1-19

MicroPDP-ll Base Systems
2.1

INTRODUCTION

A MicroPDP-ll/73 base system contains a KD]ll-BC (MS190) or KD]ll-BB
(MS190-AB) CPU module, an MSVll-P memory module, and an RQDXn controller
module supporting mass storage devices. A TQK50 controller module supporting a
TK50 tape drive may also be present.
A MicroPDP-ll/83 base system contains a KDJll-BF (MS190-AE) CPU module, an
MSVII-JD or MSVII-JE memory module, and an RQDXn controller module supporting mass storage devices. A TQK50 controller module supporting a TK50 tape
drive may also be present.
A MicroPDP-ll/23 base system contains a KDFll-B CPU module, an MSVll-P
memory module, and an RQDXn controller module supporting mass storage
devices. A TQK50 controller module supporting a TK50 tape drive may also be
present.
This chapter includes the following descriptions:
• KD]ll-B module*
Baud rate select switch
Connection to the front control panel
Switch setting
Jumper setting
Features and use of KD]ll dialog mode
• KDFll-B module*
Baud rate select switch
Connection to the front control panel
Switch setting
Jumper setting
Features and use of KDFll console dialog mode

* KDJll-B and KDFll-B mean any version of the module.
2-1

MicroPDP-11 Base Systems

• MSVll-P memory module
Jumper setting
Pin setting
• MSVII-J memory module
Jumper setting
Switch setting
• RQDXn controller, RQDXI-E, and RQDXE extender modules
Jumper setting
Switch setting
• TQK50 controller module
Jumper setting
Switch setting
NOTE
Chapter 3, System Options, contains descriptions of various
Q22-Bus communications, mass storage, and backup devices.
2.2

KDJ11-B CPU MODULE

The KDJll-B module connects to a cabinet kit (DIGITAL P.N. CK-KDJIB-KB)
containing a console serial line unit (SLU) panel (Figure 2-1) and two cables. The
SLU panel is installed in the rear I/O distribution panel of the BA23 enclosure. The
two cables connect the module to the SLU panel. These cables carry the signals
from the module to the following:
• Baud rate select switch
• Light display
• Console terminal connector
A ribbon cable, installed in J2 on the backplane assembly, carries the CPU signals
to the 20-pin connector on the front control panel. Controls and indicators on the
front control panel allow you to control CPU operations. Chapter 1, BA23 Enclosure, contains a discussion of these controls and indicators. Figure 2-2 is a diagram
of the KDJ11-B internal cabling installed in a BA23 enclosure.

2-2

MicroPDP-11 Base Systems
WHEN DECIMAL POINT IS
LIT, DC POWER IS ON

DISPLAY OF
ERROR DETECTION/
DIAGNOSTIC STATUS
CODE

BAUD RATE
SELECT SWITCH

BAUD

3840o _ _ 0
'920o _ _ '
960o _ _ 2
480o _ _ 3
240o _ _ 4
120o _ _ 5

CONNECTOR FOR
BAUD RATE
SELECT AND
LED DISPLAY

60o _ _ 6

30o _ _ 7
0000000000000
000000000000

VIEW FROM OUTSIDE
(AT REAR OF BA23 BOX)

Figure 2-1

CONNECTOR FOR
CABLE TO CONSOLE
SWITCH

KDJll-B SLU Display Panel

TI
o
c=:::J~
J2

Figure 2-2

KDJll-B Internal Cabling

2-3

MicroPDP-11 Base Systems
The KDJll-B is a quad-height processor module for Q22-Bus systems. The following options are available:
• KDJll-BB: 15 MHz without FP* (FP upgrade available)
• KD]l1-BC: 15 MHz without FP (FP upgrade not available)
• KD]l1-BF: 18 MHz with FP and PMI (private memory interconnect)

The KDJll-B CPU modules include the following features:
• PDP-ll instruction set, including extended instruction set (EIS)
• Four interrupt levels
• Memory management
• 8 Kbytes of cache memory
• 32-Kbyte boot and diagnostic facility with LED indicators
• Console SLU (serial line unit)
• Line frequency clock
The KDJll-B CPU modules contain two EPROMs and one EEPROM (electrically
erasable PROM). The EPROMs contain self-test diagnostics and boot codes. The
EPROMs also contain a dialog mode program that allows selection of boot devices
and other parameters from the console terminal. These settings are stored in an
EEPROM so that they are not lost when the system is switched off. The general
uses of the EPROMs and the EEPROM are as follows:
• EPROM (16,348 by 16 bits in 2 EPROMs)
Power-up diagnostics for CPU and memory
Bootstrap programs
EEPROM setup program
• EEPROM (2,048 or 8,192 by 8 bits in 1 EEPROM)
Hardware parameters
Boot device selection
Foreign language text
Optional customer bootstrap programs
See Sections 2.4 and 2.5 for further information.

* FP (floating-point) instruction set
2A

MicroPDP-11 Base Systems
Figure 2-3 shows the location of a dual in-line package (DIP) switch, diagnostic
LEDs, connectors, and jumpers on the board. The DIP switch (E83) enables the
baud rate select switch on the SLU display panel (Section 2.2.2).
Table 2-1 lists the factory setting for the E83 DIP switch (Section 2.2.3) and the
three jumpers. These jumpers are for manufacturing and factory test purposes
only.
CONNECTOR
FOR CABLE TO
CONSOLE
SLU

01 P SWITCH FOR
BAUD RATE SELECT AND

0000000
Wl0
TPll 0-=-<> TPl 0

E117

ROM

~===:(HI BYTE)
E116

ROM

~==:; (La BYTEj
EllS

EEPROM

Eao
GATE

ARRAY

W40
TP40 o-cJ<l 0 TP42
TP4l
E35
GATE
ARRAY
W20

TP20 o-c:J--o

0 TP22

TP21

Figure 2-3

KDJll-B Module Layout

Table 2-1
KDJU-B Factory Setting
Setting
Switch I Jumper
E83
WI0
W20
W40

All off
Between TPI0 and TPll
Between TP20 and TP21
Between TP40 and TP41

2-5

MicroPDP-11 Base Systems

2.2.1

KOJ11-B LEOs

Seven LEDs on the KDJ11-B provide status information. The green LED indicates
the presence of +5 Vdc and +12 Vdc. The six red LEDs show error detection and
diagnostic status codes. These codes are also shown in octal format on the SLU
display panel. Refer to Chapter 5, Section 5.3, for definitions of the codes and
detailed diagnostic information.
2.2.2

KOJ11-B Baud Rate Select Switch

The baud rate select switch on the SLU display panel has 15 positions (Figure 2-1).
It performs the following operations:
• Displays the settings (numbers 0-15) above the switch.
• Selects a baud rate (positions 0-7) and causes the system to boot as specified by
the settings in the EEPROM (Section 2.3).
• Selects (positions 8-15) the same baud rate as positions 0-7, but puts the system into dialog mode (Section 2.4).
Table 2-2 lists the switch settings, baud rate, and display mode.

Table 2-2
Baud Rate/Mode Select Switch
Switch Settings
EEPROM
Dialog
Selects
Automatic
Baud Rate
Mode
Boot Mode
38400
19200
9600
4800
2400
1200
600
300

10
11
12
13
14
15

3t
4
5
6
7

* Factory setting
t Most Digital Equipment Corporation terminals are set to 4800 baud.

2-6

MicroPDP-11 Base Systems

2.2.3 KDJ11-B DIP Switch
Figure 2-3 shows the location of the DIP (dual in-line package) switch. It contains
eight switches that can be used to:
• Set the SLU baud rate.
• Set the boot device.
The normal setting for all eight switches is off. The SLU baud rate switch and the
dialog mode settings stored in the EEPROM control these functions.
Setting switch 1 to ON disables the console terminal. This setting is for factory use
only.*
Switches 2, 3, and 4 select the boot device. The dialog mode features described in
Section 2.5.6 allow you to define a boot device for different combinations of these
switch settings. Table 2-3 lists the KD]l1 settings for switches 2, 3, and 4 and
their functions.
Table 2-3
Switch
2
3
Off
Off
Off
Off
On
On
On
On

Off
Off
On
On
Off
Off
On
On

KDJ11 Settings for Switches 2, 3, and 4

Function

Off
On
Off
On
Off
On
Off
On

Boot automatically according to the dialog mode settings.
Boot device l.
Boot device 2.
Boot device 3.
Boot device 4.
Boot device 5.
Boot device 6.
If switch 1 is off, power-up to ODT.
If switch 1 is on, run self-test diagnostics in a loop.

When switch 5 is off, the system enters dialog mode on power-up. Use switches 5
through 8 to set the baud rate if no SLU display panel is present.
Use switches 6, 7, and 8 to set the baud rate when the baud rate rotary switch is
disconnected from the CPU module. When the rotary switch is connected, it interferes with the operation of these switches unless it is set to 7 or 15. Likewise,
these three DIP switches interfere with the proper operation of the rotary switch
unless they are all set to OFF.

* This feature is not implemented at this time.
2-7

MicroPDP-11 Base Systems

Table 2-4 shows the switch settings for switches 6, 7, and 8 and their corresponding baud rates.

Table 2-4
Switch
6
On
On
On
On
Off
Off
Off
Off
2.2.4

Switch Settings for Switches 6, 7, and 8
7

Baud Rate

On
On
Off
Off
On
On
Off
Off

On
Off
On
Off
On
Off
On
Off

38400
19200
9600
4800
2400
1200
600
300

KDJ11-B Location in MicroPDP-11/73 and MicroPDP-11/83 Systems

A MicroPDP-ll/73 system uses the KDJll-BC or KDJll-BB CPU module and one
or more MSVll-P memory modules (Section 2.6). Data transfers between the CPU
and memory use the Q-Bus protocol.
Always install the KDJll-BC or KDJll-BB CPU module in the first slot of the
backplane assembly. The MSVll-P memory module(s) must be installed in the
slot(s) immediately following the CPU module.
A MicroPDP-ll/83 system uses the KD]11-BF CPU module and one or more
MSVll-JD or MSVll-JE memory modules (Section 2.7). Data transfers between
the CPU and memory use the private memory interconnect (PM!) protocol resident
on the KDJll-BF CPU. All other communications, whether originated by the CPU
or other bus masters, use the Q-Bus protocol. PMI is implemented through the CD
Bus on the backplane.
Always install the KDJll-BF CPU in slot 2 or 3 of a BA23 enclosure backplane.
The MSVll-JD or MSVll-JE memory module(s) MUST be installed immediately
in front (lower slot number) of the CPU. There can be no open slot between the
CPU and memory, nor can there be an open slot preceding the memory module.
No other boards can be inserted in the CD rows of slots 1 through 3 in a BA23-A
enclosure. If the MSVll-JD or -JE memory is installed following the KDJll-BF
CPU, the CPU and memory communicate using the Q-Bus protocol.

2-8

MicroPDP-11 Base Systems

2.3

KDJ11-B AUTOMATIC BOOT MODE

When set to the factory configuration, the KDJl1-B automatically runs the diagnostic self-test every time the system is turned on or restarted.
Typing <CTRL> C during self-test stops the test and causes the system to
attempt to boot as if the self-test had completed successfully.
After successful completion of the startup self-test (described in Section 5.2), the
ROM code loads the first 105 bytes of the EEPROM into memory beginning at
location 2000. This area in memory is referred to as the setup table. The factory
setting of the setup table (Section 2.5.2) initiates automatic boot mode, which then
directs the system to take one of the following actions:
• Boot from one or more of the previously selected devices.
• Enter dialog mode (Section 2.4).
• Enter console emulator mode (sometimes called halt mode). (See Section 5.5.)
The factory setting of the EEPROM code searches for and identifies available mass
storage control protocol (MSCP) devices (units 0-7) and other available devices. It
attempts to boot from the available devices in the following order:
• MSCP devices with removable media (RX50)
• MSCP devices with fixed media (RD5X)
• RLOl/RL02
• TSV05/TK25
NOTE
You can change this sequence of devices with the automatic
boot setup command (described in Section 2.5.4).
If no boot able medium is found, the system displays a message like this:
Testing in progress· Please wait

1 2 345 6 7 8 9
Waiting for media to be loaded, or drive to go ready
Press the RETURN key when ready to continue

2-9

MicroPDP-11 Base Systems

This message indicates that the system has entered dialog mode and is waiting for
user input.
If you load bootable media and press the Return key, the system returns to
automatic boot mode and boots the appropriate device.

Typing <CTRL> P while the system is booting causes the system to stop the boot
process and enter dialog mode.
If you press the Return key (without first loading media), the system displays the
following message:
Message 07
None of the selected devices were bootable
Press the RETURN key when ready to continue or to
list boot messages:

2.4

KDJ11-B DIALOG MODE

Dialog mode allows you to perform the following operations:
• Change CPU parameters.
• Select the boot source.
• Display a listing of all boot programs.
• Enter a bootstrap program.
• List all memory and occupied register locations in the system.
• Cause the startup self-test to run in a loop.
• Enter ROM ODT.
2.4.1

Entering Dialog Mode

The system enters dialog mode if:
• No bootable medium is available, and you follow the steps in Section 2.3.
• You type <CTRL> P or <CTRL> C during the startup self-test.
• The EEPROM is programmed to enter dialog mode.
• The baud rate select switch is set to a position from 8 to 15.

2-10

MicroPDP-11 Base Systems
2.4.2

Dialog Commands

Dialog mode has the six commands HELP, BOOT, LIST, SETUP, MAP, and TEST.
Three other functions are present: <CTRL> R (redisplay current input line),
<CTRL> U (clear current input line), and delete.
Select a command by typing the first letter of the command.

HELP - Displays a one-screen help file that briefly describes each command.
BOOT - Allows you to select the boot source. To select the source, enter the
device mnemonic followed by a unit number (for example, DUl). The program
assumes decimal unit numbers. To specify the unit number as an octal value, type
/0 after the unit number (DUl/0). You can also assign a nonstandard CSR address
by typing / A after the unit number (DUI/A). When you use both of these switches,
do not repeat the slash; for example, type DUI/OA.
NOTE
Typing B immediately followed by pressing the Return key
causes the ROM code to check for an off-board ROM at address
17773000. When an off-board ROM exists and its first location is
not zero, the ROM code disables the internal code and jumps to
address 17773000 of the off-board ROM.

LIST - Displays a list of all the boot programs available in the ROM and
EEPROM. The list includes the device name, unit number range, source of the
program, and device type.
SETUP - Causes the system to enter setup mode. This mode allows you to
access and change the operating parameter settings and any bootstrap programs
stored in the EEPROM. Setup mode consists of 15 commands (Table 2-5). (See
Sections 2.5.1 through 2.5.15 for a description of each command.)
MAP - Searches for, identifies, and lists all memory in the system and all occupied register locations in the system I/O page.

TEST - Causes the ROM code startup self-test to run continuously in a loop. Use
this command for troubleshooting and analyzing intermittent CPU problems.
<CTRL> C exits the loop.

2-11

MicroPDP-11 Base Systems

2.5

KDJ11-B SETUP MODE

Table 2-5 lists the setup mode commands. A discussion of the features of each
setup command follows the table. Refer to the KDJll-BC CPU User's Guide for
more information. Enter these commands by using the command numbers.
Table 2-5
Command
1
2
3
4

5
6
7

8
9
10
11

12
13
14
15

Setup Mode Commands
Description
Exit.
List/change parameters in setup table.
List/change boot translation in setup table.
List/change terminal setup message in setup table.
Reserved.
List/change switch boot selection in setup table.
List boot programs.
Initialize setup table.
Save setup table into EEPROM.
Load EEPROM data into setup table.
Delete EEPROM boot.
Load an EEPROM boot into memory.
Edit/create an EEPROM boot.
Save boot into EEPROM.
Enter ROM ODT.

NOTE
ROM ODT is different from J11 micro ODT. (See Section 5.6 for a
discussion and listing of J11 micro ODT hardware commands.)
2.5.1

Setup Command 1: Exit

This command returns you to dialog mode; same as <CTRL> C.
2.5.2

Setup Command 2: List/Change Parameters in Setup Table

During system power-up, the ROM program code copies the setup parameters into
memory starting at address 2000. This area in memory is called the setup table.
You can use this table to set 15 CPU parameters (letters A-O). The ROM code
prints out the current status of all parameters, repeats the first parameter, and
then prompts you for input.

2-12

MicroPDP-11 Base Systems

To advance to a parameter you want to change, keep pressing the Return key
until you reach the parameter you want, or go directly to the parameter by typing
the letter shown in the setup table menu. To change a parameter, type in the new
value and press the Return key. Type 1\ or - to back up to the previous parameter. If there is no change, press the Return key to advance to the next selection.
Use <CTRL> Z to exit.
This command does not save these values in the setup table in the EEPROM. Use
setup command 9 to save the setup table into the EEPROM. Table 2-6 shows the
default values of the parameters.

Table 2-6

KDJU-B Setup Default Parameter Values
Values

Enable halt on break
Disable user-friendly format
ANSI video terminal (1)
Power-up 0= Dialog 1 = Automatic
Restart
0= Dialog 1 = Automatic
Ignore battery
PMG count
Disable clock CSR
Force clock interrupts
J: Clock o = Power supply 1 = 50 Hz
K: Enable ECC test
L: Disable long memory test
M: Disable ROM 0= No 1 = Dis 165
N: Enable trap on halt
0: Allow alternate boot block
A:
B:
C:
D:
E:
F:
G:
H:
I:

0= No
0= No
0= No
2 = ODT
2 = ODT
0= No
0= No
0= No
2 = 60 Hz
0= No
0= No
2 = Dis 173
0= No
0= No

1 = Yes
1 = Yes
1 = Yes
3 = 24
3 = 24
1 = Yes
(0-7)
1 = Yes
1 = Yes
3 = 80 Hz
1 = Yes
1 = Yes
3 = Both
1 = Yes
1 = Yes

Default
=0
= 1
=1
=1
= 1
=0
=7
=0
=0
=0
= 1
=0
=0
=0
=0

A: Enable halt on break - When this parameter is set to 0 (the default setting),
a break condition from the console terminal is ignored. When set to 1, the processor halts when you press the break key on the console terminal.
B: Disable user-friendly format - When this parameter is set to 0 (the default
setting), it sends user-friendly messages to the console terminal. This parameter is
ordinarily used with automatic boot mode.

2-13

MicroPDP-11 Base Systems

c: ANSI video terminal - This parameter is set to 1 (the default setting) when
the console terminal is an ANSI video terminal such as a VT220. The delete key
erases the previous character on the screen. For a hard-copy console or a nonANSI video terminal such as the VT52, this parameter is set to o. The delete key
enters a slash character (/).
0: Power-up mode and E: restart mode - (Two separate parameters) When
the ROM code starts, it determines if the Power-Up or the Restart switch was
activated. In either case, the ROM code selects the mode as shown in Table 2-7.

Table 2-7
Value

ROM Code Mode Selections
Mode

Enters dialog mode at completion of the diagnostics.

Enters automatic boot mode at completion of diagnostics and tries to
boot a previously selected device (default setting).

Enters on-line debugging technique (ODT) mode at completion of a
limited set of tests. The ROM code executes a halt instruction and
passes control to 111 micro ODT (see Section 5.6).

Enters 24 mode. The ROM code loads the processor status word
(PSW) with the contents of location 26 and then jumps (passes
control) to the address stored in location 24. You can use this mode
to recover from a power failure when battery backup memory or
nonvolatile memory is present.

F: Ignore battery - The ROM program uses this parameter only when power-up
or restart mode (see D and E) is set to 3 (24 mode). When this parameter is set to
o (the default setting), the memory battery OK signal must be present to execute
24 mode. You can set this parameter to 1 to ignore the memory battery OK signal
if you have nonvolatile memory.
G: Processor mastership grant (PMG) count - You must change the default
setting (0) of this parameter to 7 for normal operation. Do not set this parameter
to o.

This parameter sets the PMG count in the boot control and status register (BCSR).
The PMG count allows the processor to perform a memory transfer and thus
execute instructions periodically during DMA transfers. Table 2-8 shows how often
the processor can perform a memory transfer during a DMA.

2-14

MicroPDP-11 Base Systems

Table 2-8
Value

o
1
2
3
4

5
6
7

PMG Count Settings
Time for Counter
to Overflow

Disabled
0.4 ~s
0.8 ~s
1.6 ~s
3.2 ~s
6.4 ~s
12.8 ~s
25.6 ~s

H: Disable clock CSR - When this parameter is set to 0 (the default setting), the
clock CSR can interrupt the system. When the parameter is set to 1, the clock
CSR is disabled at address 17777546.
I: Force clock interrupts - When this parameter is set to 0 (the default setting),
the clock requests interrupts only when the clock CSR is enabled (see default value
H). If you set this parameter to 1, the clock unconditionally requests interrupts
when the processor priority is 5 or less. Whenever you change the setting to 1,
you must always disable the clock CSR.

J: Clock select - This parameter determines the source of the clock signal as
shown in Table 2-9.
Table 2-9
Value

Clock Signal Sources
Source

Clock signal from backplane pin BR1 (power supply
normally drives this signal at 50 Hz or at 60 Hz, the
default setting).
Clock signal generated internally at 50 Hz.
Clock signal generated internally at 60 Hz.
Clock signal generated internally at 800 Hz.

1
2
3

K: Enable ECC test - When this parameter is set to 1 (the default setting), the
power-up and self-test run the error correction code (ECC) memory test if the
memory is of the ECC type (bit 4 or the memory CSR is a read/write bit). When
this parameter is set to 0, the ROM code bypasses the ECC test. This parameter
is reserved for future use.

2-15

MicroPDP-11 Base Systems
L: Disable long memory test - When this parameter is set to 0 (the default
setting), it runs a memory address shorts data test on all available memory. When
this parameter is set to 1, it bypasses the memory address shorts data test for all
memory above 256 Kbytes.
M: Disable ROM - The boot ROM occupies two 256-word blocks in the I/O
address space. This parameter allows you to disable the ROM after a device boots,
and to free this address space for use by special-purpose peripheral devices. Table
2-10 lists the ROM addresses that can be disabled.

Table 2-10
ROM Addresses Disabled
Parameter
Value
ROM Addresses Disabled
0*
1

2
3

None
17765000-17765777
17773000-17773777
17765000-17765777 and 17773000-17773777

* Default setting
N: Enable trap on halt - When this parameter is set to 0 (the default setting),
the processor enters micro ODT if it executes a halt instruction while in kernel
mode. When this parameter is set to 1, the processor jumps to location 4 if it
executes a halt instruction while in kernel mode.
0: Allow alternate boot block - The boot ROM code checks for boot able media
on a device by loading the boot block from the device into memory and testing it.
When this parameter is set to 0 (the default setting), the ROM code considers the
medium bootable if the word at location 0 is between 240 and 277, and the word
at location 2 is between 400 and 777. If the medium is bootable, the ROM code
jumps to location 0 of the boot block.

When set to 1, the ROM code considers the medium boatable if the word at
location 0 is any nonzero number. Some non-Digital Equipment Corporation operating systems may require a setting of 1 to boot properly.

2-16

MicroPDP-11 Base Systems
2.5.3

Setup Command 3: List/Change Boot Translation in Setup Table

This command lists the contents of the translation table and allows you to specify
nonstandard addresses for boot devices. It provides the following functions:
• Allows devices to be booted using nonstandard addresses.
• Allows CSR address changes when two or more devices share the same address.
• Allows multiple MSCP devices with different controllers to boot.
• Handles multiple controllers of the same type.
When the boot ROM code attempts to boot from a device, it uses the standard
CSR address for that device unless a different address has been specified.
The following example shows a system with these devices:
• RD52 fixed disk drive
• RX50 dual diskette drive
• RC25 fixed and removable disk drives
To change an entry, type the device name, the unit number, and the CSR address.
Press the Return key to proceed to the next entry. Type <CTRL> Z to return to
the setup mode prompt.
The RX50 and RD52 use an RQDX controller module at the standard CSR address
of 17772150. The RC25 controller module also uses a standard CSR address of
17772150. Since two devices cannot use the same CSR address, the CSR jumpers
on one module must be changed (Section 3.1.2). In such a case, the RC25 controller is set to respond to a nonstandard address of 177760500.
The RD52 is unit 0 and the RX50 is units 1 and 2. The RC25 contains two drives,
so it has two unit numbers. On its front panel, the RC25 has a unit number select
plug that is set for units 4 and 5 (the first unit number of an RC25 is always an
even number). Since the RC25 has two unit numbers, the translation table has two
entries:

2-17

MicroPDP-11 Base Systems

TT1
blank
Device name
= DU
Unit number
= 4
CSR address
= 17760500
TT1
DU4 address 17760500
TT2
blank
Device name
= DU
Unit number
= 5
CSR address
= 17760500
TT2
DU5 address 17760500
TT3
blank
Device name
2.5.4

Press the Return key for no change

Setup Command 4: List/Change Automatic Boot Selection in Setup Table

This command allows you to select the devices to be tried by the automatic boot
sequence. The table allows up to six entries. For each entry, you specify the device
mnemonic, the unit number, and the order to try to boot the devices. There are
three special single-letter device names:
A: MCSP automatic boot. Causes the ROM code to find up to eight MSCP devices
(units 0-7) at the standard CSR address. The ROM code first tries each removable
medium device in turn and then tries each fixed medium device.
You must select MSCP devices with nonstandard CSR addresses (setup command
3) individually.
B: An off-board boot. Causes the ROM code to boot from an off-board ROM at
address 17773000. The code checks that the ROM exists and that the first word is
not zero. Then it disables the internal code and jumps to address 17773000 of the
off-board ROM.
NOTE
Device name B implements a method of supporting non-Digital
Equipment Corporation boot devices on the Q22-Bus.

E: Exit automatic boot. Signals the ROM code that there are no other devices to
try. Follow the last device to be tried with this entry when fewer than six devices
exist.

2-18

MicroPDP-11 Base Systems

2.5.5

Setup Command 5: Reserved

This command is reserved for future use.
2.5.6

Setup Command 6: List/Change Switch Boot Selection in Setup Table

This command allows you to define the value of switches 2, 3, and 4 of the E83
DIP switch in order to select a specific boot device. You can use this command to
specify boot devices for six combinations of these switches. When these three
switches are set to OFF (the default setting), the EEPROM selects the boot
device.
When switch 5 is set to OFF and the baud rate select switch is set to 8 or greater,
the ROM code overrides any settings for switches 2, 3, and 4, and it enters dialog
mode.
2.5.7

Setup Command 7: List Boot Programs

This command displays a list of all the. boot programs in the two EPROMs and the
EEPROM. It displays the device mnemonic, unit number range, source of the program (EPROM or EEPROM), and a short device description. (Same as the dialog
mode's LIST command.)
2.5.8

Setup Command 8: lnitialize the Setup Table

This command sets the current parameters of the setup table in memory to the
default values. It does not affect the contents of the EEPROM itself. To save these
values in the EEPROM you must execute the save command (setup command 9).
2.5.9

Setup Command 9: Save Setup Table into EEPROM

This command copies the parameter values of the setup table in memory to the
EEPROM. This is the only command that actually writes anything into the first
105 bytes of the EEPROM.
2.5.10

Setup Command 10: Load EEPROM Data into Setup Table

This command restores the setup table in memory with the values actually stored
in the EEPROM.

2-19

MicroPDP-11 Base Systems
2.5.11

Setup Command 11: Delete EEPROM Boot

This command allows you to delete custom boot programs that you have stored in
the EEPROM. It prompts you for the device name of the EEPROM boot to be
deleted. The ROM code then searches for the first boot program in the EEPROM.
If the ROM code finds the boot program, it deletes the program and moves all of
the following boot programs up to use the space made available by the deleted
program.
2.5.12

Setup Command 12: Load an EEPROM Boot into Memory

This command allows you to load an EEPROM boot program into memory to
examine or edit it. The ROM code prompts you for the device name of the
EEPROM boot.
2.5.13

Setup Command 13: Edit/Create an EEPROM Boot

This command allows you to create a new EEPROM boot program or to edit a
program previously loaded with setup command 12. Use this command to change
the following:
• Device name: Designated by the firmware for the device; for example, disk
unit (DU).
• Device description: Usually the physical name of the device. The maximum
length allowed for this description is 11 characters and spaces.
• Allowable unit number range: The highest unit number defines the allowable
range of valid unit numbers for the device.
• Beginning address of the program in memory: First location of the program in memory.
• Ending address of the program in memory: The address of the last byte of
code used in memory.
• Starting address of the program: The address to which the ROM code
passes control.
The command lists the available space in the EEPROM for boots and prompts for
entries. After you have made all changes, the ROM code then enters ROM ODT to
allow you to enter the boot program (see setup command 15). You must use setup
command 14 to save any changes you have made.

2-20

MicroPDP-11 Base Systems

2.5.14

Setup Command 14: Save Boot into EEPROM

This is the only command that actually writes a boot from memory into the
EEPROM. Other commands only change a copy of the boot program that resides in
memory. When saving a boot program into EEPROM, the device name of the
program must not match the name of a program already existing in the EEPROM.
If two or more programs are written into the EEPROM with the same name, only
the first one is boot<:tble.
2.5.15

Setup Command 15: Enter ROM OOT

This command puts you into ROM ODT. The ROM code opens the address defined
by the beginning address of the program. ROM ODT is not the same as 111 micro
ODT.
The only allowable addresses in ROM ODT are the addresses of memory from
0-28 Kbytes (0-00157776). You cannot access any other addresses or the I/O
page from ROM ODT. Table 2-11 provides the ROM ODT commands. (Refer to
the KDJll-BC CPU User's Guide for further information.)
Table 2-11
Command

ROM ODT Commands
Symbol
Use

Slash

Prints contents of specified address location or
prints contents of last opened location. If opened
location is an odd number, prints only the contents
of the byte.
If location is even, mode is even. If location is odd,

mode is byte.
Assumes leading zeros. Uses only the last six octal
digits.
Examples:
ROM ODT > 200/1000000
ROM ODT > 1001/240
ROM ODT > 77777750020/100000
ROM ODT > 77770000/
ROM ODT >

; Open location 200
; Open byte location 1001
; Open location 00150020
; Illegal location > 157776

2-21

MicroPDP-11 Base Systems

Table 2-11
Command

ROM ODT Commands (Cont.)
Symbol
Use

RETURN

<CR>

Closes an open location.

LINE FEED

<LF>

Closes an open location and then opens the next
location. If in word mode, increment by 2; if in byte
mode, increment by 1.

Period
Up arrow

Alternate character for line feed. This command is
useful when the terminal is a VT220.
/\

Minus

Closes an open location and then opens the previous
location. If in word mode, decrement by 2; if in byte
mode, decrement by 1.
Alternate character for up arrow. Useful when the
terminal is a VT200.

Delete

DELETE

Deletes the previous character typed.

CTRL Z

/\Z

Exit ROM ODT and return to setup mode.

2.6

KDF11-BE CPU AND KDF11-BF CPU ASSEMBLIES

The KDFll-BE and KDFll-BF CPU modules connect to a cabinet kit containing a
console serial line unit (SLU) panel and two cables (Figure 2-4). The SLU is
installed in the rear I/O distribution panel of the BA23 enclosure. The two cables
carry the signals from the module to the following:
• Baud rate select switch
• Console terminal connector (AO console)
• Additional device connector (AI)

2-22

MicroPDP-11 Base Systems

A ribbon cable, installed in J2 on the backplane assembly, carries the CPU signals
to the 20-pin connector on the front control panel. Controls and indicators on the
front control panel allow you to control CPU operations. (Chapter 1 discusses these
controls and indicators.)
A discussion of the KDFll-BE CPU module follows. For a discussion of the
KDFll-B modules, refer to the KDFll-BA CPU User's Guide.

AO (CONSOLE)

1f)5~~~~~A~'l\\

ROTARY
SWITCH

0
1
2
3
4
5
6
7

BAUD RATE
50
1800
B
75
9
2000
110
10 2400
134.5
11 3600
150
12 4800
300
13 7200
600
14 9600
1200
15 19200

ROTARY
SWITCH

Figure 2-4 KDFll-BE SLU Panel

2-23

MicroPDP-11 Base Systems

2.6.1

KDF11-BE

The KDF11-BE module is a quad-height processor module for Q22-Bus systems. It
includes the following features:
• Four interrupt levels
• Memory management unit (MMU) chip
• Socketed (removable) boot/diagnostic ROMs
• Line frequency clock
• Two 40-pin chip sockets for installing an optional floating-point processor (FPP)
chip and/or a commercial instruction set (CIS) chip
• Five LEDs for power and diagnostic status
The KDF11-BE module contains numerous jumpers and two dual in-line package
(DIP) switch units, Sl (E102) and S2 (E114). The jumpers and switches allow you
to select various module features. Figure 2-5 shows the location of these jumpers
and switches, as well as the chip socket and LED locations.
The KDF11-BE CPU module is installed in the first slot of the BA23 backplane.
Five LEDs on the KDF11-BE module provide status information. The single green
LED indicates the presence of +5 Vdc. The red LEDs show error detection and
diagnostic status codes. (Refer to Section 5.4.2 for a description of these four
diagnostic LEDs.)
Table 2-12 shows the factory configuration of the jumpers. Table 2-13 shows the
factory configuration for the two switch packs.
When a KDF11-BA is upgraded in the field (new ROMs installed) to a KDF11-BE
or BF CPU, the second switch (E114) controls the SLU baud rate as shown in
Table 2-12.
The input control for the diagnostic/boot ROM is the eight DIP switches Sl-l
through Sl-8 (E102). All unimplemented switch configurations cause a message to
be printed and control passes to the console dialog routine. Table 2-14 shows the
bootstrap switch settings.

2-24

MicroPDP-11 Base Systems

COMMERCIAL INSTRUCTION
SET (KDFll-BB OPTION)
J45

COMMERCIAL
INSTRUCTION
SET

J43

+5 V PWR ON LED

.., J7

~~~-+=::::==
_ _--::J:;;;

'" J6

.:::J27
__ J26

J38~

J37
J35 J25
J36
'5::J34
J32
J33
J3l
J30
J29 ~_ _-"'"
52
J28----11---ti<i
SLUl
SLU2

I I

111DALI
00
L _ _ _ _---'

E114

E102

co 8 EI IDAl07

ROM/EPROM
SOCKET
(HI BYTE)
E127 15,08
ROM/EPROM
SOCKET
(LO BYTE)
E126 07,00

J24
.. J23
UOJ22

~J19
~J18
J15:--.,'1,,---J17
J14--"::-"J18
J13 -tI>O

W2 W1
ocoooc:>o

.--J5

~J4
-""'J3

J12~

J11

Jl 0

NOTES,
1. INSTALLED JUMPERS SHOW THE MicroPDP-11 CONFIGURATlON_.
2. WHEN 8 K EPROMS OR 8 K MASKED ROMS ARE USED, J23 IS CONNECTED TO J24.
3_ WHEN 2 K EPROMS ARE USED, J23 IS CONNECTED TO J22. WHEN 2 K MASKED ROMS ARE
USED, J23 IS CONNECTED TO J24.

Figure 2-5

KDFll-BE CPU Module

2-25

MicroPDP-11 Base Systems

The XXDP diagnostic monitor boots only from the standard CSR address (772150)
at this time.

Table 2-12
Jumpers

KDF11-BE Module Factory Jumper Configuration
State
Function

]4-]5

Disables the CPU halt feature from the console serial line
unit (SLU) Break key on the terminal.

]6-]7

(For manufacturing use only.)

]8-]9

(For manufacturing use only.)

]18-]19

Enables CPU power-up mode: bootstrap from location
773000.

]20-]21

(For manufacturing use only.)

]23-]24*

Is used with 8 K masked ROMs or 8 K EPROMs 022-]23
must be removed).

]26-]27

Connects output of console serial line drive to the serial
line.

]29-]30

(One-stop bit for console SLU port.)

]34-]35

Connects LINMF(1)H to the SLU UART reset input.

]37-]38

(One-stop bit for second SLU port.)

]41-]42*

Disables DIP switches S2-1 to S2-4; enables baud rate
rotary switches to select console SLU baud rate.

]44-]42*

Disables DIP switches S2-5 to S2-8; enables baud rate
rotary switches to select second SLU baud rate.

Provides bus grant continuity for the BIAK signal.

Provides bus grant continuity for the BDMG signal.

* These jumpers are out for a KDFll-BA module (PDP-llf23 PLUS). All other jumpers are
In.

2-26

MicroPDP-11 Base Systems

Table 2-13
KDF11-BE Module Factory Switch Configuration
Switch
State
Function
SI-8
SI-7
SI-6
SI-5
SI-4
SI-3
SI-2
SI-1

On
On
Off
Off
On
On
On
On

ANSI mode console terminal.
Do quick verify memory diagnostic.

Select MSCP automatic boot.

The factory configuration of ]41 to ]42 In and of ]44 to ]45 In disables the S2
switch pack SLU baud rate. When S2 is disabled, use the two 16-position baud rate
select switches on the SLU panel to select the baud rate. The factory setting for
S2 follows.
S2-8
S2-7
S2-6
S2-5
S2-4
S2-3
S2-2
S2-1

Off
Off
Off
On
Off
Off
Off
On

Table 2-14
Switch
Setting
8 7 6 5

Second SLU set for 9600 baud.

Console SLU set for 9600 baud.

KDF11-BE Diagnostic/Bootstrap Switch Settings

Function

1
0

Factory setting.
Inhibit power-on automatic boot.
Console terminal is not an ANSI mode SCOPE.
Console terminal is an ANSI mode SCOPE.
Inhibit QUICK VERIFY MEMORY
DIAGNOSTICS.
Execute QUICK VERIFY MEMORY
DIAGNOSTICS.
Select TS05 drive 0 or TK25.
Select TU58 drive o.

1 1
X X
0 X
1 X
X 0

1
0

X X X X X
X X X X X
X X X X X

X
X*
X

X X X X X

X
X

0
0

0
1

2-27

MicroPDP-11 Base Systems

Table 2-14
Switch
Setting
8 7 6 5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X

X 0
X
X
X
X
X
X
X
X
X
X
X

KDFII-BE Diagnostic/Bootstrap Switch Settings (Cont.)

Function

0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1

1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1

1
0
1
0
1
0
1
0
1
0
1
0
1*
0
1
0
1

1
1
1

0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1

Select TU58 drive 1.
Select RXOI drive o.
Select RXOI drive 1.
Select RX02 drive o.
Select RX02 drive 1.
Select MSCP drive o.
Select MSCP drive 1.
Select MSCP drive 2.
Includes RD5I,
Select MSCP drive 3.
RD52, and RC25.
Select MSCP drive 4.
Select MSCP drive 5.
Select MSCP drive 6.
Select MSCP autoboot.
Select RLOI/RL02 drive o.
Select RLOI/RL02 drive 1.
Select RLOI/RL02 drive 2.
Select RLOI/RL02 drive 3.
Select DEQNA unit O.
Select DEQNA unit 1.
(Reserved for future devices.)
(Reserved for future devices.)
(Reserved for future devices.)

0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1

X
X
X
X
X
X
X

0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0

X
X
X
X
X
X
X
X
X

X
X
X
X
X
X
X
X
0

1
1
1
1
1
1
1
1
1

0
1
1
1
1
1
1
1
1

1
0
0
0
0
1
1
1
1

1
0
0
1
1
0
0
1
1

1
0
1
0
1
0
1
0
1

ot
It
0

Select DECnet DUVll.
Select DEC net DLVll-E.
Select DEC net DLVll-F.
Unused.
Unused.
Unused.
Unused.
Loop self-test but do not execute memory
diagnostic.
Loop self-test and memory diagnostic.

o = Off

* Factory configuration

1 = On
X = Does not matter

t For KDFll-BF only

2-28

MicroPDP-11 Base Systems
2.6.2

KDF11-B Baud Rate Select Switches

The baud rate select switches on the SLU insert panel have the following features:
• Have 16 positions each (Figure 2-4).
• Display the setting (numbers 0-15) above the switches.
• Select a baud rate (positions 0-15) and cause the system to be in automatic boot
mode.
Table 2-15 shows the switch setting and corresponding baud rate.

Table 2-15
Switch
Setting
0
1
2
3
4
5
6
7
2.6.3

KDF11-B Baud Rate Switch Settings
Baud
Switch
Baud
Setting
Rate
Rate
50
75
110
134.5
150
300
600
1200

8
9
10
11
12
13
14
15

1800
2000
2400
3600
4800
7200
9600
19200

KDF11-B Location in a MicroPDP-11/23 System

A MicroPDP-11/23 system uses the KDF11-B CPU module and one or more
MSV11-P memory modules (Section 2.9). Data transfers between the CPU and
memory use the Q-Bus protocol.
Always install the KDF11-B module in the first slot of the backplane assembly. The
MSV11-P memory module(s) must be installed in the slot(s) immediately following
the CPU module.

2-29

MicroPDP-11 Base Systems

2.7

KDF11-B AUTOMATIC BOOT MODE

When set to the factory configuration, the KDFll-BE and the KDFll-BF automatically run diagnostic self-tests (described in Section 5.2). These tests run every time
the system is turned on or restarted.
Typing <CTRL> C during the self-test stops the self-test and causes the system
to attempt to boot as if the self-test had completed successfully.
After successful completion of the startup self-test, the ROM code directs the
system to take one of the following actions:
• Boot from one or more previously selected devices.
• Enter console dialog mode (Section 2.8).
• Enter console emulator mode (Section 5.5).
The ROM code searches for and identifies available mass storage control protocol
(MSCP) devices (units 0-7) and other available devices. It attempts to boot from
the available devices in the following order:
• MSCP devices with removable media (RX50)
• MSCP devices with fixed media (RD5n)
• Other devices
The system boots when a bootable medium is found. If no boot able medium is
found, the system displays a message similar to the following:
ERROR UNIT DUO
ERR 16 NOT BOOT ABLE
WISH TO Rf:BOOT [Y,(N)]?

This message indicates that the system has entered dialog mode and is waiting for
user input.
If you load bootable media, type Y, and press the Return key, the system returns

to automatic boot mode and boots the appropriate device.
Typing <CTRL> P while the system is booting causes the system to stop the boot
process and enter console dialog mode.

2-30

MicroPDP-11 Base Systems

If you respond to the message above by typing N and pressing the Return key, or
by entering a <CTRL> P, the system displays the console dialog mode menu as
follows:
128 KW MEMORY

KDF11 B-BE ROM V06X

CLOCK ENABLED

BOOT
HELP
MAP
DIAGNOSE
Press RETURN to select BOOT
Use cursor controls "UP ARROW" or "DOWN ARROW" to select function
Use CTRL/W to reset menu

2.8

KDF11-B CONSOLE DIALOG MODE

The system enters console dialog mode if the following conditions exist:
• The system fails to find a boatable device.
• You enter <CTRL> P while the system is booting.
The console dialog mode and menu include the following commands:
BOOT - Allows you to select the boot source. To select a boot source, use a
device name and unit number mnemonic (DUO), an octal unit number (you must
enter the 10 switch) or a nonstandard CSR address (you must enter the I A
switch).

HELP - Displays a one-screen help file that provides a brief description of each
command.
MAP - Lists CPU options installed on the module. Also searches for, identifies,
and lists all memory in the system, and all occupied register locations in the system
I/O page.
DIAGNOSE - Executes an extended memory test that takes approximately 25
minutes for 128 Kbytes words of memory.
LIST - Displays (only on non-ANSI terminals) a listing of all boatable devices
present on the system. The listing includes the device name, unit number range,
source of the program, and a very short device description. (This list function is
part of the BOOT command on ANSI terminals.)

2-31

MicroPDP-11 Base Systems

2.9

MSV11-P MEMORY MODULE (-PK, -PL)

The MSVII-P memory is a quad-height module that occupies the slot adjacent to
the CPU. This module contains 64 K MOS chips that provide storage for IS-bit
words (16 data bits and 2 parity bits). It also contains parity control circuitry and a
control status register (CSR). Table 2-16 shows the memory modules and their
storage capacity.

Table 2-16
Model
MSVll-PK
MSVll-PL

MSV11 ME!mory Modules
Module
Memory
Number
Capacity
MS067-K
MS067-L

256 Kbytes
512.9 Kbytes

The MSVll-P memory module is configured by means of jumpers and wire-wrap
pins. The -PK and -PL models have the same factory configuration. Figure 2-6
shows the location of jumpers and wire-wrap pins and Table 2-17 describes their
functions.

454344

n
6 7

r.I

r" 3
r .... -·4
l..g

L_-.l0
0
0

r.~

,.. .. 14

~ :$

I L.16
I
I

21n
r2322

V0.r-: U

r-c-·15

STARTING
~~
oM ADDRESS

0
0

L--"13

JUMPERS

W15

--=--

W13--=W4

--=--

W'1·

W14
o
W12

W10

• W3 •

Figure 2-6

2-32

MSVll-P Module Layout

MicroPDP-11 Base Systems

Two LEDs indicate module status. When lit, a green LED indicates +5 Vdc present
on the module; when lit, a red LED indicates the detection of a parity error.

Table 2-17
Jumpers

MSVII-P Factory Jumper Configuration
Jumpered Pins
State

WI
W2
W3
W4
W5

I
I

W9
WI0
Wll
W12
W13
W14
W15

Ground pins

I
I

R
R
R

I
R
R

to Y
to 9
to 10
to 7
to 15
to 16
to 23
to 45

I
I
I
I
I
I
I

to E
to E
to E
to E

R
R
R
R

to R

R
R
R
R

B
C

to Y
W to Y
X to Y

U
Y

2
3
4
6
13
14
22
44

M to R
N to R
P to R

8
21
E

State*

R
R
R

* I = Inserted
R = Removed

2-33

MicroPDP-11 Base Systems

2.9.1

Expansion (CSR and Starting Addresses)

Additional MSVll-P modules can be added for system expansion. Each memory
module added to a system requires a specific configuration. This is done by repositioning jumpers on the module's wire-wrap pins.
Each memory module added to the Q22-Bus must be configured to provide two
addresses:
• CSR address
• Starting address
2.9.1.1 CSR Address - Figure 2-6 shows the CSR address jumpers on the
MSVll-P. Table 2-18 lists the CSR address and corresponding jumper configurations for each memory module added to the system. The table is applicable to both
the -PK and the -PL models.
2.9.1.2 Starting Address - The starting address depends on the amount of memory already in the system. Table 2-19 lists the jumper configuration for additional
MSVll-P modules. For further information, refer to the MSVll-P User's Guide
(EK-MSVOP-UG-001).

Table 2-18
Board No.
in System

MSVll-P CSR Configuration
Pins to
CSR Address
Wire-Wrap
(x = 177721)

None
A to E
B to E
A to B, B to E
C to E
A to C, C to E
B to C, C to E
A to B, B to C, C to E

3
4
5
6
7

2-34

xOO
x02
x04
x06
x10
x12
x14
x16

MicroPDP-11 Base Systems

Table 2-19
MSVll-P Starting Address Configuration
MSVll-PL (512-Kbyte increments)
Pins to Wire-Wrap
Board No. in System
1

None
V to Y
W to Y
V to Y, W to Y
X to Y
X to Y, V to Y
X to Y, W to Y
X to Y, W to Y, V to Y

3
4
5
6
7
8

MSVll-PK (256-Kbyte increments)
1
2

3
4
5
6
7
8
2.10

None
P to R
V to Y
V to Y, P to R
W to Y
W to Y, P to R
W to Y, V to Y
W to Y, V to Y, P to R

MSV11-JD (M8637-D) AND MSV11-JE (M8637-E) MEMORY MODULES

The MSVll-JD, -JE (Figure 2-7) is a metal oxide semiconductor (MOS), random
access memory (RAM). The module has:
• Error detection and correction (ECC) to increase reliability
• A control and status register (CSR) to store status and error information
• Battery backup, available by resetting a jumper on the module
• Support for private memory interconnect (PMI) protocol and normal Q22-Bus
protocol
• Four jumpers and two switch packs
• Starting addresses on 8 KW boundaries
• Two LEDs
The board can be configured half or fully populated with 256 K dynamic RAMs.
Maximum memory capacity is 2 MB using 256 K RAMs.

2-35

MicroPDP-11 Base Systems

CSR ADDRESS
SWITCH (SP2)

~'1 ~ ADDRESS
MEMORY

TEST
CONNECTOR

~ ~ W1

SWITCH (SP1)

DATA
GATE
ARRAY

ADDRESS
GATE
ARRAY

f{It ~
W4

Figure 2-7

MSVll-JD, -JE Memory Module

The MSVll-JD and MSVll-JE memories are quad-height Q22-Bus modules that
occupy the slot(s) immediately prior to the KDJll-BF CPU in the backplane assembly. They are available in the factory configuration shown in Table 2-20.

Table 2-20
Option
Number
MSVII-JD
MSVII-JE

MSVII-JD, -JE Memory Modules*
Module
Designation
Description
M8637-D
M8637-E

1 MB ECC using 256 K dynamic RAMs
2 MB ECC using 256 K dynamic RAMs

* MSVll-JB, -JC modules are used on MicroPDP-ll/84 Unibus systems only. They cannot
be used on Q22-Bus systems.

The memory starting address can be set in any 8 KW boundary within the 2048
KW extended address space. The extended address space contains 22 address lines.
2.10.1

Error Correction

The MSVll-JD, -JE contains ECC logic which detects and corrects single-bit errors
and detects double-bit errors. Detecting and correcting single-bit errors is transparent to the master device accessing the memory.

2-36

MicroPDP-11 Base Systems
2.10.2

Battery Backup

The MSVll-JD, -JE memory module has input for two sources of +5 V power.
These inputs are designated +5 VBB (on battery-backup power systems) and +5 V
(on non-battery-backup power systems).
NOTE
The BA23 enclosure does not support battery backup.

In battery support mode, power is used only to refresh the MOS storage array so
that battery backup and data retention time is maximized. A green LED on the
module stays on as long as a +5 VBB is available. Modules are shipped in a nonbattery-backup configuration (Figure 2-8). Figure 2-9 shows the jumper connection
that supports battery backup.

~ BATTERY
BACK UP
~ SYSTEM

MSV11-J MODULE
CONNECTOR D

Figure 2-8

+5 V Jumper Connections

MSV11-J MODULE

CONNECTOR D

Figure 2-9

+5 VBB Battery Backup Jumper Connections

2-37

MicroPDP-11 Base Systems

2.10.3

Private Memory Interconnect (PMI)

The MSVll-JD, -JE memories are designed for Q22-Bus systems and support the
PMI protocol of the KDJll-BF processor. The PMI bus is specifically designed for
and used in MicroPDP-ll/83 Q22-Bus systems.
The MicroPDP-ll/83 systems use the KDJll-BF CPU module, one or more
MSVll-JD or MSVll-JE memory modules, and a selection of Q22-Bus compatible
devices. Data transfers between the KDJll-BF CPU and the MSVll-JD or -JE
memory using the PMI protocol resident on the CPU. All other communications,
whether originated by the CPU or other bus masters, use the Q22-Bus protocol.
2.10.4

Location of the MSV11-JD, -JE Memory

The location of the MSVll-JD, -JE in the BA23 backplane determines the protocol
used between the KDJll-BF processor and the memory module (Figure 2-10). To
use the PMI protocol, the MSVll-JD, -JE must be located immediately in front
(lower slot number) of the CPU; otherwise, the memory and CPU communicate
with the Q22-Bus protocol. There must be no open slot between memory and the
CPU.
CAUTION
Static charges can damage the MOS memory chips. Be careful
how you handle the module and where you lay it down.
When you install or remove the memory module, make sure
there is no dc voltage applied to the module.

If the green LED is on, the module is receiving +5 V or +5 VBB power. The
power source must be off before you remove or replace a memory module.

MSV11-J
MEMORY

KDF11-BF
CPU

Figure 2-10

2-38

Q22-BUS
DEVICES

PMI/Q22-Bus Interface

MicroPDP-11 Base Systems
2.10.5

Jumper Setting

The four factory installed jumpers (Figure 2-7), WI through W4, establish the
configuration of the module. Table 2-21 summarizes the possible MSVll-JD, -JE
jumper configurations.
Table 2-21
Jumper

MSV11-JD, JE Jumper Configurations
Description

WI In
WI Out

Reserved for Digital use only
256 K dynamic RAMs

W2 In
W2 Out

Half populated module
Fully populated module

W3, W4 mounted
left-right (Figure 2-7)

+5 VBB battery-backup system
(See Note.)

W3, W4 mounted
up-down (Figure 2-6)

+5 V system
(Factory configuration)

NOTE
The BA23 enclosure does not support battery backup.
2.10.6

MSV11-JD, -JE Switch Settings

The MSVll-JD, -JE modules contain two switch packs. One is an 8-switch DIP
(dual in-line package) and one is a 4-switch DIP. The 8-switch DIP selects the
starting memory address on an 8 KW boundary. The 4-switch DIP selects the CSR
starting address. One of 16 possible CSR addresses may be selected.

2-39

MicroPDP-11 Base Systems

2.10.7

Memory Address Switch Settings

The memory address switch (SPI in Figure 2-7) is an 8-switch DIP. The switch
settings are shown in Table 2-22. The table is divided into three columns as
follows:
• The decimal switch setting in 8 K increments
• The octal equivalent
• The actual switch settings shown in binary
The least four significant switch settings (5 through 8) of the memory address
switch (SPl) represent 8 K increments as shown in the upper half of Table 2-22.
Switch settings 1 through 4 are all Os in this portion of the table and do not come
into play until 128 K is reached.
For example, if these switch settings (5 through 8) are Os, a memory address of 0
is represented. This assumes that switches 1 through 4 are also O.
If switch setting 8 is a 1 (all others being Os), the memory address increments by
8K.
If switch setting 7 is a 1 (all others being Os), the memory address increments by
another 8 K.

The lower half of the table represents increments of 128 K until 2 M is reached.
Switch settings 4 through 8 come into play here. Each increment of these switch
settings represents an increase of 128 K.
For example, if switch setting 4 is a 1 and switch settings 3 through 1 are Os, a
starting memory address range of 128 K to 248 K is selected.
The specific memory starting address selected within that range is determined by
switch settings 5 through 8 (indicated by Xs in the lower half of Table 2-22).

2-40

MicroPDP-11 Base Systems

Table 2-22
Decimal
(K Word)

MSVll-JD, -JE Starting Memory Address Selection
Switch Setting (SPl)
1 2 '3 4 5 6 7 8
Octal

0
8
16
24
32
40
48
56
64
72
80
88
96
104
112
120

00000000
00040000
00100000
00140000
00200000
00240000
00300000
00340000
00400000
00440000
00500000
00540000
00600000
00640000
00700000
00740000

0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0

0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1

0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1

0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1

0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1

000-120
128-248
256-376
384-504
512-632
640-760
768-888
896-1016
1024-1144
1152-1272
1280-1400
1408-1528
1536-1656
1664-1784
1792-1912
1920-2040

00000000-00740000
01000000-01740000
02000000-02740000
03000000-03740000
04000000-04740000
05000000-05740000
06000000-06740000
07000000-07740000
10000000-10740000
11000000-11740000
12000000-12740000
13000000-13740000
14000000-14740000
15000000-15740000
16000000-16740000
17000000-17740000

0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1

0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1

0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1

0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1

X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X

1 = Switch on

o = Switch off
X = Switch can be either on or off
2-41

MicroPDP-11 Base Systems

Table 2-23 shows the most common configurations for the MSVll-JD and MSVllJE memory address switches.
Table 2-23
Starting
Address

Common Memory Starting Address
SW2 Switches
1 2 3 4 5 6 7 8

MSVll-JD
0
1 Mbyte
2 Mbytes
3 Mbytes

0
0
1
1

0
1
0
1

0
0
0
0

0
1

0
0

MSVll-JE
0
2 Mbytes

2.10.8

CSR Address Switch Settings

The control and status register of the MSVll-JD, -JE allows program control of
certain ECC functions and it contains diagnostic information if an error has
occurred. The CSR is a 16-bit register and has an assigned address. The CSR can
be accessed through the Q22-Bus or PMI protocol.
ECC is performed only on memory accesses and is not used when accessing the
CSR.
There is one CSR per memory module. Each CSR can be assigned to one of 16
predetermined addresses which range from 17772100 to 17772136 for 22-bit
systems.
The CSR address switch (Figure 2-7) is a 4-switch DIP which allows selection of
one of these 16 CSR addresses. Table 2-24 shows the possible CSR address.

2-42

MicroPDP-11 Base Systems

Table 2-24
22-Bit CSR
Address
17772100
17772102
17772104
17772106
17772110
17772112
17772114
17772116
17772120
17772122
17772124
17772126
17772130
17772132
17772134
17772136

CSR Address Selection
Switch Setting
1 2 3 4
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1

0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1

0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1

0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1

1 = Switch on

o = Switch off
2.10.9

MSV11-JO, -JE LEOs

Two LEDs on the MSV11-JD, -JE modules indicate power and error conditions
(Figure 2-7). The green LED indicates that the module is receiving +5 V or +5
VBB from the power supply or battery backup. The power source must be off
before you remove or replace a memory module.
The red LED indicates the detection of an uncorrectable single or double error
when the module is in a read/write cycle or in diagnostic mode. Refer to the
MSV11-J MOS Memory User's Guide (EK-MSV1J-UG-001) for further details.

2-43

MicroPDP-11 Base Systems
2.11

RQDX1, RQDX2, AND RQDX3 DISK CONTROLLERS

The RQDXn modules (M8639, M8639-YB, and M8639-YA) connect to a cabinet kit
(CK-RQDX1 or CK-RQDX2) that contains the necessary cables to provide the signals for disk drives installed in the system.
The optional RQDX1-E (M7512) and RQDXE (M7513) extender modules (Section
2.12) and their associated cables provide the RQDX controller signals to any external drive connected to the host.
The RQDXn controllers provide the interface for fixed disk and diskette drives to
the Q22-Bus. These intelligent controllers have onboard microprocessors. Data
transfers using direct memory access (DMA). Programs in the host system communicate with the controller and drives using the mass storage control protocol
(MSCP).
These controllers can control a maximum of four drive units. Each fixed disk drive
counts as one disk unit (DU). Each RX50 counts as two disk units.
NOTE
A BA23 enclosure used as a host or as an expansion box
supports only one internal fixed disk drive.

• The RQDX1 controls a maximum of two fixed disk drives and an RX50 diskette
drive.
• The RQDX2 controls a maximum of four fixed disk drives, or two fixed disk
drives and an RX50 diskette drive.
NOTE
An RQDX1 controller must be the last module installed in the
BA23 backplane.

Figure 2-11 shows the jumper and LED locations for the RQDX1 and RQDX2
controllers. The starting address of all RQDX modules is fixed at 17772150. The
starting address of a second RQDXn module installed in the system is a floating
address and must be set (refer to Chapter 4, Configuration). Table 2-25 lists the
factory configuration.
Four LEDs on the RQDX modules provide diagnostic information. Refer to the
RQDXl Controller Module User's Guide (EK-RQDX1-UG) for information.

2-44

MicroPDP-11 Base Systems
08

010

~~~=b~~

LUN7 : : : : : : : : 0

ROOX1

A12

-=- -=-

LUN7 :::::::: 0

RQOX2

0::0
W4

Figure 2-11

RQDXl and RQDX2 Controller Modules

2-45

MicroPDP-11 Base Systems

Table 2-25

RQDXn Factory Jumper Configuration

Module Starting
No.
Address
1

17772150
Variable

I = Installed = 1

A12 All AIO A9 AS A7 A6 A5 A4 A3 A2 +-- Add. Bits
(Jumpers)
I

R R R I

R I

(Factory)

R = Removed = 0

Logical unit number (LUN) jumpers 1-8 are removed. See Appendix B for a discussion of LUN designations and the RQDX disk unit numbering scheme.
The interrupt vector for the RQDX modules is set under program control. The
first RQDX module is assigned a fixed interrupt vector of 154. If a second RQDX
module is installed, its interrupt vector is variable (refer to Chapter 4).

2.12

RQDX1-E (M7512) AND RQDXE (M7513) EXTENDER MODULES

The optional dual-height RQDX1-E and RQDXE extender modules carry the
RQDXl, RQDX2, and RQDX3 controller module signals to external MSCP devices.
Install the M7512 and M7513 modules in rows A and B of the slot directly below
the RQDX1, RQDX2, or RQDX3 controller module. Use the following guidelines
when you install an RQDX1-E extender module:
• Install the RQDX1-E (M7512) in the same backplane directly below the RQDX1
controller module.
• Be sure the extender module is the last module installed in the BA23 backplane.
Use the following guidelines when you install an RQDXE extender module:
• Install the RQDXE (M7513) in the same backplane directly below the RQDX2
controller module.
• Neither the RQDX2, RQDX3, nor the RQDXE module needs to be the last
module installed in the backplane.
To install RD5n fixed disk drives with the RQDXn and extender modules:
• Always place the first RD5n (RDO) in port 0 of the enclosure containing the
RQDXn controller module.
• Set the device select switch to 3 (DUO) on any RDn installed in port O. (This
applies to the host system and to any expansion box or subsystem.)

2-46

MicroPDP-11 Base Systems

• Set the device select switch to 4 (DUl) on any RDn installed in port 1. (This
applies to the host system and to any expansion box or subsystem.)
• Do not set the device select switch to 1 or 2 on any RDn. These switch settings
are reserved for RX50 diskette drives.
Refer to Appendix B, Logical Unit Number Designations, for further information.
2.12.1

RQOX1-E (M7512) Extender Module

Use the RQDXI-E extender module when you have an RQDXl controller module
and you want to add a subsystem or a second fixed disk drive in an expansion box.
The RQDXl controller supports two fixed disk drives and one RX50 diskette drive.
NOTE

A BA23 enclosure used as a host or as an expansion box
supports only one fixed disk drive per enclosure.

Figure 2-12 shows the jumper locations on the M7512 module. Table 2-26 provides
the RQDXI-E factory configuration of these jumpers. Use this configuration with
dual BA23 systems or with a BA23JRD5n subsystem arrangement. The factory
configuration is set to connect the expansion unit to connector J3. For further
information, refer to the RQDXl Controller Module User's Guide (EK-RQDXI-UG).

Table 2-26

RQDXI-E Factory Configuration*

Factory
Configuration

Jumpers

Function

WI-W4

Must be installed.
(For manufacturing use only.)

WI-W4

JDI-JD2
JRXI-JDX2

Factory set, do not
change.

JDl to JRXI
JD2 to JRX2

JBI-JBS
JAI-JAS
JC1-]CS

JAI to]Cl
JA2 to]C2
JA3 to JB3
JA4 to JB4
JA5 to JB5
JA6 to JB6
JA7 to JC7
JAS to JCS

2-47

MicroPDP-11 Base Systems

J J J

L~--J~-:-l--/]

BAC

• • ·1
• • ·2

:::! C'~--J-:-::3:----/]
• •• 6 '--_ _ _~_ _ __ _ . l

• •• 7
• •• 8
W1--,
W2--'

W3-----1W4-----1-

DDX

•• ·1
•• ·2

C'--J2~d"3

Figure 2-12
2.12.2

RJ R

RQDX1-E Module

RQDXE (M7513) Extender Module

Use the RQDXE extender module when you have an RQDX2 controller module and
you want to add a subsystem or another fixed disk drive in an expansion box. The
RQDX2 module supports four fixed disk drives or two fixed disk drives and an
RX50 diskette drive.
The M7513 module has three 50-pin connectors that have the following functions:
• ]1 connects to the backplane.

• J2 connects directly to the RQDX2 controller module.
• J3 provides the connection to an external distribution panel.
Table 2-27 shows three typical fixed disk and RX50 arrangements using the
RQDX2 and the RQDXE extender module. The factory jumper configuration supports all three arrangements shown.
Table 2-28 shows the RQDXE factory configuration. This configuration supports
one RX50 and two RD5n disk drives. This configuration can be used with dual
BA23 systems or with a BA23/RD5n subsystem.

2-48

MicroPDP-11 Base Systems
NOTE
Subsystems, available from Digital, contain a disk or tape drive
and their own power supply. They are designed to communicate
with the host computer through an extender module installed in
the host's backplane.

Refer to Appendix F for additional jumper settings for the RQDXE extender
module.
Table 2-27
Three Possible Arrangements Using the RQDXE
Option
Orientation
No.
Arrangement
Port 0
Port 1
I
2
3

Host box*
Expansion box

RDO
RDI

RX50
Xt

Host
Expansion box

RDO
RDI

X
X

Host
Subsystem

RDO
RDI

RX50

~
~

Front panel
Front panel
Front panel
Front panel
Front panel
Front panel

* The term host is used to indicate the enclosure in which the RQDX2 or RQDX3 controller resides.
t X implies that the port is empty or contains a device not supported by the RQDX controller.
Table 2-28
RDYand
WRT PROT
Al to A3
BI to B3

RQDXE Jumper Setting (Factory Configuration)
External
Drive
Drive
Port SEL
SEL
ACK
EI to E2*
FI to F3
F2 to F4*
H3 to H4*

K2 to K4

L1 to L3*
L4 to M2

Internal
Port SEL
NI to N2
N4 to P2*

* These jumpers are installed to avoid floating inputs on the M7513.

2-49

MicroPDP-11 Base Systems

Table 2-29 shows a configuration using the RQDXE (M7513) with three fixed disk
drives. Table 2-30 shows the RQDXE jumper setting to support three RD5n disk
drives. Use this configuration with a BA23-A enclosure and dual subsystems.
Four Fixed Disks with an RQDXE
Table 2-29
Port 1
Arrangement
Port 0
Host
Dual subsystem (only)
Table 2-30
RDYand
WRT PROT
Cl to C2
C3 to C4
Dl to D2
D3 to D4

RDO

RD12

RD2

Orientation
Front panel
Front panel

RQDXE Configuration for Three RD5n Disk Drives
External
Internal
Drive
Drive
Port SEL
Port SEL
SEL
ACK
El to E2*
E4 to F2
F3 to HI
H3 to H4*

Kl to K2
K3 to K4

L3 to L4
Ml to M2

* These jumpers are installed to avoid floating inputs on the M7513.

2-50

Nl to N2
PI to P2

MicroPDP-11 Base Systems

2.13 TQK50 (M7546) TAPE CONTROLLER
The TQK50 (M7546) controller comes with a cabinet kit which contains the cable
necessary to provide the signals for a TK50 tape drive installed in the system.
The TQK50 controller provides the interface for a TK50 tape drive to the
Q22-Bus. This intelligent controller has onboard microprocessors. Data transfers
using direct memory access (DMA). Programs in the host system communicate
with the controller and tape drive using the mass storage control protocol (MSCP).
A TQK50 can control one TK50 tape drive. Any additional TK50 tape drives
installed in the system require additional TQK50 controllers.
Your system's owner's manual contains TK50 operating instructions.
Figure 2-13 shows the jumpers, switches, and LEDs for the TQK50 controller. The
CSR (control status register) address for this module is 17774500. The interrupt
vector is set to 260 and is under program control. Table 2-31 shows the factory
configuration of the jumpers.

Table 2-31

M7546 Fixed CSR Address

Module Factory A12 All A10 A9 AS A7 A6 A5 A4 A3 A2 -Add. Bits
Number Address
(Jumpers*)
1

1774500 I

(Factory)

= Jumper installed
R = Jumper removed

* The jumper nearest the module fingers is A2.
The starting address of any additional TQK50 modules installed in an individual
system is a floating address of 17760nnn and is set using the jumpers. The floating
address of the M7546 module starts at 17760404 and increments by 4; for example, 17760404, 17760410, 17760414.

2-51

MicroPDP-11 Base Systems
REV
LEVEL
NUMBER

SWITCH BITS

0
1
2
3
4
5

0
1
0
1
0
1

0
0
1
1
0
0

0
0
0
0
1
1

0
0
0
0
0
0

JUMPER PACK
(FACTORY SETTING)
CSR ADDRESS

774500

0= SWITCH OPEN
1 = SWITCH CLOSED

1 - OFF
2 - OFF
3 - OFF
4 - OFF
5 - OFF
6 - OFF
7 - OFF
8 - OFF

Figure 2-13
2.13.1

TQK50 (M7546) Jumpers and Switches

Unit Number DIP Switch

The unit number DIP switch must be set to correspond to the jumper setting.
Table 2-32 shows the unit number switch pack settings and the unit number name.
Table 2-32
Address
of Jumper
Setting
774500
760nnn
760nnn
760nnn

o = Switch open
1 = Switch closed

2-52

Unit Number Switch Pack Settings
Unit No.
Switch Pack Bits
1 2 3 4 5 6 7 8
0
1
0
1

0
0
1
1

0
0
0
0

Unit
Number
Name
MUO (first TK50)
MU1 (second TK50)
MU2 (third TK50)
MU3 (fourth TK50)

MicroPDP-11 Base Systems

2.13.2

Revision Level DIP Switch

Make sure the revision level DIP switch matches the revision level of the module.
The revision level is stamped on the back of the module; Table 2-33 shows the
switch setting.
Table 2-33
Revision
Level No.
0
1 (A)

Revision Level Switch Pack
Switch Bits
1 2 3 4 5 6 7
0
1
0
1
0
1

2 (B)

3 (C)
4 (D)
5 (E)

0
0
1
1
0
0

0
0
0
0
1
1

0
0
0
0
0
0

8
0
0
0
0
0
0

o = Switch open
1 = Switch closed

2.13.3

TQKSO LEOs

Two LEDs, located on the front of the module, indicate module status. The first
(left) LED indicates the status of the module. This LED blinks on (red) and then
off when the system is turned on and the module is working properly. The second
(right) LED indicates the status of the TK50 tape drive. This LED blinks on (red)
and then off when the TK50 tape drive is installed and working properly.
Appendix E, TK50 Extended Diagnostics, provides diagnostic information for field
service personnel.

2-53

System Options
3.1

INTRODUCTION

This chapter describes the options currently supported by the BA23 enclosure.
These options, as well as commonly used peripheral devices, are broken down into
the following categories:
• Communications
• Mass storage devices
• Backup devices
Each option section includes configuration setups and a description of the cabinet
kit required to install the module. Detailed documentation for each device is also
listed.
NOTE
Current and bus loads for the following options are listed in
Chapter 4.
3.1.1

Ordering Options

Option order numbers differ depending on whether an option is to be installed at
the factory or by the customer as an upgrade after delivery.
A factory-installed system option includes a base module, internal cabling, and I/O
filter connectors. For example,
Factory installed:

DRVll-BP

To upgrade a system, a base module and the appropriate cabinet kit must be
ordered. For example,
Field upgrade:

DRVll-B
CK-DRVIB-KB

Base module
Cabinet kit

3-1

System Options

3.1.2

Module Configuration

Each module in a system has a control and status register (CSR) address and an
interrupt vector, which must be set when you install the module. The CSR address
and the interrupt vector are either fixed or floating (variable).
A fixed address or vector means that there is an address location reserved in
memory for the address or vector of that particular module. Modules with fixed
addresses and vectors are shipped with the correct configuration for use as the
first module of that type. If you use two modules of the same type, the factory
setting for the second module must be changed.
A floating address or vector is assigned a location within an octal range. The exact
address or vector within the range depends on what other modules are in the
system. The ranges are as follows:
• Floating CSR address: (1776)0010-(1776)3776
• Floating interrupt vector: (00000)300-(00000)777
Chapter 4 provides guidelines for determining variable starting address and interrupt vector settings.
The address and vector settings are usually configured by means of switches or
jumpers on the module. For example, the 22-bit setting for a starting address of
17761540 is as follows:
21 20 19 18 17 16 15 14 13 12 11 10 9
1 1 1 1 1 1 1 1 1 000 1
1

3-2

1 0

000

1 o
o o

System Options

It is not necessary to change bits 21-13. It is only necessary to change bits
A12-A2 to set the CSR address within a typical range. A typical switch setting
shows the following switches:

Switch
Setting ~

A12 All A10
000

A9
1

A6
1

Add. bits

* If A12 is set to a 1, this would be a 7.
Similarly an interrupt vector of 320 is typically configured using only the following
bits:
Switch
Setting

V8 V7 V6 V5 V4 V3
o 1 1 0 1 0

Vector Bits

NOTE
The switch layout for different modules varies. The line below
the switch setting for each module shows the octal boundaries.

3-3

System Options

3.2
3.2.1

COMMUNICATIONS
DEQNA Ethernet Interface

Factory installed:

DEQNA-KP

Module number:

M7504

Field upgrade:

DEQNA-M
CK-DEQNA-KB

Base module
Cabinet kit

The cabinet kit includes a type A filter connector and a cable that connects it to
the module.
The DEQNA is a dual-height module used to connect a Q-Bus system to a local
area network (LAN) based on Ethernet. The Ethernet is a communications system
that allows data exchange between computers within a moderate distance (2.8 km
or 1.74 mi). The DEQNA can transmit data at a rate of 1.2 Mbytes per second
through coaxial cable. It should be the highest priority DMA device on the
Q22-Bus, that is, the DMA device nearest to the CPU. For high Ethernet traffic,
an additional DEQNA may be installed.
Configure the module by using the three jumpers, WI through W3 (Figure 3-1).

IW3

IWl
:W2

Figure 3-1

3-4

DEQNA Module Layout

System Options

Jumper 1 (WI) determines the CSR address assignment. If you install two
DEQNAs, move jumper WI of the second DEQNA onto the second DEQNA position. These addresses are fixed.
The interrupt vector is written into a read/write register by software. No hardware
configuration is required. Jumpers 2 and 3 are set at the factory and do not need
to be changed.
The DEQNA CSR addresses and interrupt vectors are as shown in Table 3-l.

Table 3-1
Module No.
1
2

CSR Addresses and Interrupt Vectors
CSR Address
Interrupt Vector

17774440
17774460

120
Floating

Figure 3-2 shows the internal cabling for the DEQNA module.
For further information, refer to the DEQNA User's Guide (EK-DEQNA-UG-OOl).

Figure 3-2

DEQNA Internal Cabling

3-5

System Options

For further information, refer to the DEQNA User's Guide (EK-DEQNA-UG-001).
3.2.2

DHV11 Asynchronous Multiplexer

Factory installed:

DHV11-AP

Module number:

M3104

Field upgrade:

DHV11-M
CK-DRV11-AB

Base module
Cabinet kit

The cabinet kit includes two type B filter connectors and two cables that connect
them to the module.
The DRV11 (Figure 3-3) is an asynchronous multiplexer that provides support for
up to eight serial lines, for data communications. It is a quad-height module with
the following features:
• Full modem control
• DMA or silo output
• Silo input buffering
• Split speed
The DHV11 is compatible with the following modems:
• Digital modems: DF01, DF02, and DF03
• Bell modems: 103, 113, 203C, 202D, and 212

3·6

System Options

LOW CHANNELS (0-3)

HIGH CHANNELS (4-7)
DIAGNOSTIC LED

ADDRESS ADDRESS AND
SELECT
VECTOR SELECT

GG
D

BACKPLANE CONNECTORS

Figure 3-3

DRV11 Module Layout

Set the CSR address and interrupt vector by using the two DIP switches, E58 and
E43 (Figure 3-3). The CSR address and interrupt vector are floating. Tables 3-2
and 3-3 show the two settings.

Table 3-2

CSR
Address

DHVll CSR Address
A12 All AlO A9 A8
E58
1
2
4
5
3

A4
E43
1

17760440
17760460

0
0

1
1

0
0

1
1

0
1

0
0

f--

Add. Bits

f--

Switches

1 = Switch on

o = Switch off

3-7

System Options

Table 3-3

DHVll Interrupt Vector

Vector
Setting

V7
E43-3

V6
4

V5
5

V4
6

V3
7

300
310

0
0

1
1

0
0

0
1

1
1

Switch

1 = Switch closed

o = Switch open
The actual address and vector of the DHVll depend on what other modules you
install in the system. Chapter 4 provides guidelines for setting the address and
vector.
Figure 3-4 shows the cabling setup.
For further information, refer to the DHVll Technical Manual
(EK-DHVII-TM-OOl).

Figure 3-4
3-8

DHVll Internal Cabling

System Options

3.2.3

DLVE1 Asynchronous Line Interface

Factory installed:

DLVE1-DP

Module number:

M8017

Field upgrade:

DLVE1-M
CK-DLVE1-DB

Base module
Cabinet kit

The cabinet kit includes a type A filter connector and a cable that connects the
module to the connector. The external BC05C-X (X = length in feet) modem cable
must be ordered separately.
The DLVE1 (formerly DLV11-E) is a dual-height module that connects a Q-Bus to
a serial communications line. The DLVE1 (Figure 3-5) offers the following
features:
• Full modem control - Bell 103, 113, 202C, 202D, and 212 modem compatible
• Jumper or program-selectable baud rates
• Split transmit and receive baud rates
• Provisions for user-supplied external clock inputs for baud rate control

-B

R/B

ld
RS

Figure 3-5

DLVE1 Module Layout

3-9

System Options

Configure the module using the jumpers shown in Figure 3-5. The CSR addresses
for two DL VEl modules are fixed. Table 3-4 lists the settings. The interrupt
vector is floating. Table 3-5 shows the factory setting of the interrupt vector.

Table 3-4
DLVEI Fixed CSR Addresses
Module Starting
A12 All AIO A9 A8 A7 A6 A5 A4 A3
Number Address
1
1
2

17775610
17776500
17776510

R
I
I

I
I
I

I
R
R

R
I
I

R
R
R

Add. Bits
(Jumpers)

I (Factory*)
R (1st option)
I (2nd option)

I = Inserted = 1
R = Removed = 0

* The factory setting is for use with a modem.
Table 3-5
DLVEI Interrupt Vector
Factory
V8 V7 V6 V5 V4 V3
Setting
300

Vector Bits
(Jumpers)

I = Inserted = 1
R = Removed = 0

NOTE
The actual setting of the interrupt vector of the DLVE1 depends
on the other modules in the system. Chapter 4 provides guidelines for determining the interrupt vector.

Table 3-6 lists the factory setting of the other jumpers on the module.

3-10

System Options

Table 3-6
DLVEI Jumper Factory Setting
Jumper Settings
RO
R1
R2
R3
TO
T1
T2
T3
Sl

f}~ote 1) EP

HCNote

1
2
PB
C
C1
S
Sl

I
R
R
R
R
R
I
R
R

(Note 2)
(Note 4)
(Note 4)
(Note 5)
(Note 5)

H
B
-B
FD
RS
FB

R
R
R
R
I
R
EF R
MT R
M R
M1 R

I = Inserted
R = Removed
Notes
1. Sets the receiver and transmitter baud rates to 110 baud (common speed). See
Table 3-7 for other settings.
2. .Programmable baud rate is disabled.
3. Sets transmitter baud rate to 9600 if split speed is used.
4. Common speed is enabled.
5. Split speed is disabled.
Table 3-7 lists the jumper settings required for other baud rates. Set transmit and
receive jumpers separately when split speed is enabled.

System Options

Table 3-7
DLVEI Baud Rate Selection
Receive Jumpers -->
R3
R2
Transmit Jumpers -->
T3
T2

Rl
Tl

RO
TO

Baud
Rate

50
75
110
134.5
150
300
600
1200
1800
2000
2400
3600
4800
7200
9600

I
I
I
I
I
I
I
I

I
I
I
I

I
I

R
R
R
R

I
I

R
R

R
R
R
R
R
R
R

I
I
I
I

I
I

R
R

I
R

R
R
R

I
I

R
R

I
R
R
R
R

Figure 3-6 shows the internal cabling.
For further information, refer to the DL Vll-E and DL Vll-F Asynchronous Line
Interface User's Manual (EK-DLVll-OP). This describes the same module, but
uses the old name.
I/O DISTRIBUTION
PANEL
A

MB017
ASYNCHRONOUS LINE
INTERFACE

A
B

'-="'---~V

Figure 3-6

3-12

DLVEl Internal Cabling

System Options

3.2.4 DLVJ1 Asynchronous Interface
Factory installed:

DLVJl-LP

Module number:

M8043

Field upgrade:

DLVJl-M
CK-DLVll-LB

Base module
Cabinet kit

The cabinet kit contains a type B filter connector and a cable that connects it to
the module.
The DLVj1 (formerly DLVll-J) is a dual-height module that connects a Q-Bus to
up to four Asynchronous serial lines, for data communications. The serial lines
must conform to EIA and CCITT standards. The DLVj1 transmits and receives
data from a peripheral device over EIA "data leads only" lines that do not use
control lines. Data is moved under program control along the four independent
serial lines.
Configure the DLVj1 module by using the jumpers shown in Figure 3-7. The CSR
address for two DLVj1 modules are fixed. Table 3-8 lists the factory setting for
the CSR addresses.
Table 3-8
DLVJ1 CSR Address
Module Starting
Number Address A12 All AIO A9

1
2

17776500 I-x
17776540 I-x

I-x
I-x

O-x
O-x

I-x
I-x

R
R

x-h
x-h

O-x (Factory)
I-x

Add. Bits

R = Jumper removed = 0
x-h = Jumper inserted between pins x and h
O-x = 0
I-x = I

3-13

System Options

The interrupt vector is floating. The factory configuration is shown in Table 3-9.

Table 3-9
DLVJ1 Interrupt Vector
Factory
Setting
VB
V7
V6
V5
V4
300

x-h

Vector Bits

O-x

x-h = Jumper inserted between pins x and h = 1
O-x = Jumper inserted between 0 and h = 0

NOTE

The actual interrupt vector depends on the other modules in the
system. Chapter 4 provides guidelines for determining the interrupt vector.

NNMM

;;;z;;;z

N····

x ••••
M_

~R23
YWKVN

·iiiTl~
•
1; L

Z 0 1 23
0000

0000

• •

R10~
~r:

n: III! Ir: :~r: II! I~r:!f! I ~

L; ;l; • uL; .1.; .ul.; .1; .ul.; ;L; • 0
EDSP

EDSP

Figure 3-7

3-14

EDSP

DLVJl Module Layout

System Options

Figure 3-8 shows the internal cabling.
For further information, refer to the DLVll-] User's Guide (EK-DLVU-UG).

Figure 3-8 DLV]1 Internal Cabling

3-15

System Options

3.2.5 DMV11 Synchronous Controller
The DMVll is a quad-height module that supports:
• Full-duplex or half-duplex operations
• DMA
• Point-to-point communications
• Multipoint communications
It is available in four system options, each of which has a different interface capability. The option you choose depends on the interface requirements of your system. Table 3-10 lists the four system options and their corresponding upgrade
components. Table 3-11 lists the interface for each system option, and the appropriate external cable.

Table 3-10
System
Option
DMV11-AP
DMVll-BP
DMVll-CP
DMVll-FP

Table 3-11
System
Option
DMVll-AP
DMVll-BP
DMVll-CP
DMVll-FP

DMVll Versions
Upgrade
(Base Module
Model
+ Cabinet Kit)
Number
DMVll-M +
CK-DMVll-AB
DMVll-M +
CK-DMVll-BB
DMV11-M +
CK-DMVll-CB
DMVll-M +
CK-DMV11-FB

1/0
Insert
Type

MB053

J2 (of 2)

1 X B (2 X 3)

MB053

]1 (of 2)

1 X A (1 X 4)

MB064

J1 (of 1)

1 X B (2 X 3)

MB053

J2 (of 2)

1 X B (2 X 3)

DMV11 Interfaces
Interface

External
Cable

RS-232-C/CCITT V.2B
CCITT V.35/DDS
Integral modem
RS-423-A/CCITT V.24

BC22E or BC22F
BC17E*
BC55S or BC55T
BC55D

* Cable included in the -BA cabinet kit

3-16

Module
Connector

System Options

The -BP and -CP cabinet kits contain type A filter connectors and a cable that
connects them to the module.
The DMVll-CP, the version with the integral modem, is an M8064 module. All
other versions are M8053 modules.
Configure the CSR address and interrupt vector of the DMVll by using the
switches shown in Figure 3-9. The CSR address and interrupt vector are both
floating. Tables 3-12 and 3-13 show the factory setting.
Table 3-12

DMVll CSR Address
A12 All AIO A9 A8 A7 A6 A5 A4 A3
-Add. Bits
E53 (M8053)
E54 (M8053)
E58 (M8064)
E59 (M8064)

Factory
Setting

177760340

<--

Switches

1 = On = Closed
0= Off = Open

Table 3-13

DMVll Interrupt Vector
V8
V7
V6
V5
E54
(M8053)
E59
(M8064)

<--

Vector Bits

Factory
Setting

<--

Switches

300

1 = On = Closed
0= Off = Open

NOTE
The actual setting depends on the other modules in the system.
Chapter 4 provides guidelines for setting the CSR address and
interrupt vector.

Figure 3-10 shows the internal cabling setup for the M8064 and M8053 modules.
For jumper settings of various modems and additional information, refer to the
DMVll Synchronous Controller Technical Manual (EK-DMVll-TM-001).

3-17

System Options

M8064

IE59J
~

'--C

---,1 ,--C

_J2

----11

_Jl

M8063

~
~

Figure 3-9

3-18

DMVll Module Layout

System Options

Figure 3-10

DMVll Internal Cabling
3-19

System Options

3.2.6

DPV11 Synchronous Interface

Factory installed:

DPVII-AP

Module number:

M8020

Field upgrade:

DPVll-M
CK-DPVll-AB

Base module
Cabinet kit

The cabinet kit includes a type A filter connector and a cable that connects it to
the the module.
The DPVll is a dual-height module that connects the Q-Bus to a modem, using a
synchronous serial-line. The serial-line conforms to the following EIA standards:
• RS-232-C
• RS-423-A
• RS-422-A
EIA compatibility is provided for use in local communications only (timing and data
leads only). The DPVll is intended for character-oriented protocols, such as
Digital Data Communications Message Protocol (DDCMP), or for communication
protocols that are bit-oriented, such as Synchronous Data Link Control (SDLC).
Configure the CSR address and interrupt vector of the DPVll using the jumpers
shown in Figure 3-11.

3-20

System Options

{523

21~ 20

W18

A 011
010

g~
07
J1

1
26
28

121314151617
000000

,","m
{
VECTOR
300

g01

]

440045
42 043
400 41

380039
360037

"'"

'"'''CO
ADDRESS {
320033
17760100

Figure 3-11

DPV11 Module Layout

300031
W29 ,.

3-21

System Options

The CSR address and interrupt vector are both floating. Tables 3-14 and 3-15
show the factory setting.

Table 3-14
DPVll CSR Address
Factory A12 All A10 A9 A8 A7 A6 A5 A4 A3 <- Add. Bits
Setting W31 W30 W36W33 W32 W39 W38 W37W34 W35 <- Pin
17760010

I = Jumper inserted between pin Wxx and pin 29 (ground)
R = Jumper removed

Table 3-15
DPV11 Interrupt Vector
Factory
V8
V7
V6
V5
Setting
W34
W42
W41
W40

300

V4
W44

V3
W45

<<-

Vector Bits
Pin

I = Jumper inserted between pin Wxx and pin 46 (ground)
I = 1
R = Jumper removed = 0

NOTE
The actual settings depends on the other modules in the system. Chapter 4 provides guidelines for setting the CSR address
and interrupt vector.

Figure 3-12 shows the internal cabling.
For further information, refer to the DPVll Synchronous Interface User's Manual
(EK-DPV11-UG).

3-22

System Options

Figure 3-12

DPVll Internal Cabling

3-23

System Options

3.2.7

DRV11 Parallel-Line Interface

Factory installed:

DRVll-LP

Module number:

M7941

Field upgrade:

DRVll
CK-DRV1B-KB

Base module
Cabinet kit

The cabinet kit includes two type A filter connectors and two cables that attach
them to the module.
The DRVll (Figure 3-13) is a dual-height module that provides 16 I/O lines,
corresponding to the 16 data lines of the Q22-Bus.

VECTOR JUMPERS

I
I

::;

ADDRESS JUMPERS

I
S;

Figure 3-13

3-24

DRV11 Module Layout

O~N

0').--.-- .....

..:..:..:..:

IIII
I III "

System Options

The CSR address of two DRV11 modules are fixed and are set using jumpers A12
to A3 (Figure 3-13). Table 3-16 lists the factory jumper configuration.

Table 3-16
DRVll CSR Address
Module Starting
A12 All AI0 A9 A8 A7 A6 A5 A4 A3
Number Address
1
2

17767770
17767760

R
R

R R R R R R R
RRRRRRI

Add. Bits
(Jumpers)
factory

I = Inserted = 0
R = Removed = 1

The interrupt vector is floating. Table 3-17 shows the factory configuration.

Table 3-17
DRVII Interrupt Vector
Factory
V8
V7
V6
V5
Setting
300

Vector Bits
(Jumpers)

I = Inserted = 0
R = Removed = 1

NOTE

The actual setting depends on the other modules in the system.
Chapter 4 provides guidelines for setting the interrupt vector.

3-25

System Options

A
I/O DISTRIBUTION
PANEL

A
J1

M7941
PARALLEL
LINE UNIT

Figure 3-14

V
A
B
V

DRVll Internal Cabling

Figure 3-14 shows the internal cabling layout.
For further information, refer to the DRVll User's Manual (EK-ADVll-OP).

3-26

System Options

3.2.8

DRV11-B DMA Interface

Factory installed:
Module number:
Field upgrade:

DRVll-BP
M7950
DRVll-B
CK-DRVlB-KB

Base module
Cabinet kit

The cabinet kit includes two type A filter connectors and two cables that connect
them to the module.
The DRV11-B is a quad-height module that supports DMA. This module makes it
possible to transfer data directly between system memory and an external I/O
device. The module is programmed by the CPU to move variable length blocks of
8- or 16-bit data words to or from specified locations in the system memory.
NOTE
The DRV11-B is an 18-bit device. It can only provide DMA to the
first 256 Kbytes of memory in a system.

Configure the DRVll-B CRS address and interrupt vector using the DIP switches
S2 and Sl, respectively (Figure 3-15).

ADDRESS
SWITCHES

VECTOR
SWITCHES

Figure 3-15

DRVll-B Module Layout
3-27

System Options

The CSR address of two DRVll-B modules are fixed. Table 3-18 lists the settings.
Table 3-18

DRVll-B CSR Address
A12 All A10 A9 A8 A7 A6 A5 A4 A3
Module Starting S2
Number Address 1
4 5 6 7 8 9 10
2
3

1
2

772410
772420

1
1

0
0

1
1

0
0

1
1

0
0

1
0

0
1

Add. Bits

Switches

(factory)

1 = On = Closed

o = Off = Open

The interrupt vector for the first DRV11-B is fixed. If you install a second
DRVll-B, it has a floating vector. Chapter 4 provides guidelines for setting the
floating vector. Table 3-19 lists the interrupt vector settings.
Table 3-19

DRVll-B Interrupt Vector
V8 V7 V6 V5
Module Interrupt Sl
Number Vector
2
3
4
5
1
1
124
0
0
0
2
floating
0= Open = Off
1 = Closed = On

* Switch 1 must be open.

3-28

Vector Bits

6
1

7
0

8
1

Switches*
(Factory)

System Options

1/0 DISTRIBUTION
PANEL

V
A

TI
TI

M7950
LSI-11 DMA
INTERFACE

Figure 3-16

V
A

v
A

n[]

$D
0

1J=1
@oD

DRVll-B Internal Cabling

Figure 3-16 shows the internal cabling.
For further information, refer to the DRVll-B Interface User's Manual
(EK-DRVlB-OP-001).

3-29

System Options

3.2.9

DRV11-J High-Density Parallel Interface

Factory installed:

DRVll-]P

Module number:

M8049

Field upgrade:

DRV11-]
CK-DRVl]-KB

Base module
Cabinet kit

The cabinet kit contains 2 type A 50-pin connectors and two cables that connect
them to the module.
The DRV11-] (Figure 3-17) is a dual-height module that connects a Q-Bus to 64
I/O lines. These lines are organized as four 16-bit ports, A through D. Data line
direction is selectable under program control for each 16-bit port.
A
E2
J1
E10

XE9

OW11

a::

W9"tl~W6

W8'i1fY'W7

W3]8fY'W5

W4~[Y'W2
W1

'-----y-----J
ADDRESS SELECTION

Figure 3-17

3-30

DRVll-] Module Layout

10 W10

System Options

The interrupt vector is set under program control, eliminating the need for jumperdefined vectors. The CSR address of the module is fixed and is set with jumpers
WI through W9. Table 3-20 lists the factory configuration for the CSR address.

Table 3-20

DRVll-J CSR Address
AI2 All AIO A9 A8 A7 A6 AS A4
Module Starting
Number Address
WI W2 W3 W4 WS W6 W7 W8 W9
1
2

17764160
17764140

R
R

I
I

R
R

Bus Lines

Jumper

x
x

I = Installed = 1
R = Removed = 0

Figure 3-18 shows the internal cabling layout for this module.
For further information, refer to the DRVll-] Interface User's Manual
(EK-DRVl]-UG).

Figure 3-18

DRVll-] Internal Cabling
3-31

System Options

3.2.10

DUV11 Synchronous Serial-Line Interface

Factory installed:
Module number:
Field upgrade:

DUVll-AP
M7951
DUV11-M
CK-DUV11-AB

Base module
Cabinet kit

The cabinet kit includes a type A filter connector and a cable that connects it to
the module.
The DUVll (Figure 3-19) is a quad-height module that is used to connect any
Q-Bus CPU to a Bell 201 synchronous modem or equivalent. It has the following
features:
• Is designed for applications using character-oriented protocols.
• Controls a modem for half- or full-duplex operation.
• Transmits data at rates up to 9600 baud per second.
• Interfaces synchronous and asynchronous communications data.

OPTION
SWITCHES

ADDRESS AND
VECTOR SWITCHES

Figure 3-19

3-32

DUVll Module Layout

System Options

The CSR address and interrupt vector of the DUV11 are both floating and are
configured using DIP switches E38 and E39 (Figure 3-19). Tables 3-21 and 3-22
list the factory settings.

Table 3-21
Factory
Setting

DUVll CSR Address
A12 All AlO A9 A8 A7 A6 A5 A4 A3
E38
E39
1
2
1
2
3
4
5 6
7 8

17760010

Add. Bits

Switches

1 = Switch on

o = Switch off
Table 3-22
DUVll Interrupt Vector
V8 V7 V6 V5 V4 V3
Factory E39
Setting 3
4
5
6
8
7
440

++-

Vector Bits
Switches

1 = Switch on

o = Switch off
NOTE

The actual setting depends on the other modules in the system.
Chapter 4 provides guidelines for setting the CSR address and
interrupt vector.

Figure 3-20 shows the internal cabling layout for the module.

3-33

System Options

A
V

A
M7951
LSI SYNCHRONOUS
INTERFACE BOARD

I/O DISTRIBUTION
PANEL

D"'

Figure 3-20

A
V

DUVll Internal Cabling

For further information, refer to the DUVll Synchronous Serial Line Interface
Technical Manual (EK-DUVll-TM-OOl).

3-34

System Options

3.2.11

DZQ11 Asynchronous Multiplexer - (Four Lines)

Factory installed:

DZQ11-M

Model number:

M3106

Upgrade:

DZQ11-M
CK-DZQ11-DB

Base module
Cabinet kit

The cabinet kit includes one type B filter connector and a cable that connects it to
the module.
The DZQ11 (Figure 3-21) is a dual-height module that connects the Q22-Bus to up
to four asynchronous serial lines. It includes the following features:
• Conforms to the RS-232-C and RS423-A interface standards.
• Permits dial-up (auto-answer) operation with modems using full-duplex operations such as Bell models 103, 113, 212, or equivalent.

VECTOR

SW'TCH-PA~D

ADDRESS

SWtTCH-PA~D

Figure 3-21

DZQ11 (M3106) Module Layout

3-35

System Options

Configure the DZQll using DIP switches E28 and E13. The CSR address and
interrupt vector of the DZQ11 are both floating. Tables 3-23 and 3-24 list the
factory settings.

Table 3-23
CSR
Address

DZQ11 CSR Address
A12 All A10 A9 A8 A7 A6 A5 A4 A3
E28
1
2
3
4
5
6
7
8
9
10

17760010
17760100

0
0

o
o

o 0 0
000

0
1

o
o

Vector Bits

Switches

0
0

Add. Bits

Switches

o = Switch on
1 = Switch off

Table 3-24
DZQll Interrupt Vector
V8 V7 V6 V5 V4 V3
Vector E13
Setting 1
2
4
6
3
5
300
310

0
0

1
1

0
0

0
1

1 = Switch on

o = Switch off
E13 switch 7 is not used. E13 switch 8 must be on, and E13 switch 9 and 10 must
be off for normal operation.

3-36

System Options

Figure 3-22 shows the internal cabling for the DZQl1.

Figure 3-22

DZQl1 (M3106) Internal Cabling

3-37

System Options

3.2.12

DZV11 Asynchronous Multiplexer

Factory installed:

DZVll-DP

Model number:

M7957

Field upgrade:

DZVll-M
CK-DZVll-DB

Base module
Cabinet kit

The cabinet kit includes one type B filter connector and a cable that connects it to
the module.
The DZVll (Figure 3-23) is a quad-height module that connects a Q22-Bus to up
to four asynchronous serial-lines. It includes the following features:
• Conforms to the RS-232 interface standard.
• Permits dial-up (auto-answer) operation with modems using full-duplex
operations.

L--_-----', L-~

_------'

'--------_--'I ?'-_---'
W12

TT1,

W13

W14

A12

W10

W11

~J,

Figure 3-23

3-38

W15

W16

ID~~~~~~~~~I

Irr~~~~nnol

ADDRESS SWITCHES

VECTOR
SWITCHES

DZVll Module Layout

System Options

Configure the DZV11 using 16 jumpers and 2 DIP switches. The CSR address and
interrupt vector of the DZV11 are both floating. Tables 3-25 and 3-26 list the
factory settings.

Table 3-25
CRS
Address

DZVll CSR Address
A12 All AI0 A9 AS A7 A6 A5 A4 A3
E30
1
2
4
7
9
10
S
3
5
6

17760100
17760110

0
0

1
1

0
0

;- Add. Bits
;- Switches

0
1

1 = Switch on

o = Switch off
Table 3-26
VS
Vector E2
Setting 1

DZV 11 Interrupt Vector
V7 V6 V5 V4 V3

;- Vector Bits

;- Switches

300
310

1
1

0
0

0
1

0
0

1 = Switch on

o = Switch off
NOTE
The actual settings depend on the other modules in the system.
Chapter 4 provides guidelines for setting floating CSR
addresses and interrupt vectors.

Figure 3-24 shows the internal cabling layout for the module.
For further information, refer to the DZVll Asynchronous Multiplexer Technical
Manual (EK-DZV11-TM).

3-39

System Options

Figure 3-24

3-40

DZVll Internal Cabling

System Options

3.2.13

LPV11 Interface Module

Factory installed:

LPVll-AP (includes LP25 lineprinter)
LPVll-BP
LPVll-EP (includes LP26 lineprinter)
LPVll-FP

Module number:
(controller)

M8027

Field upgrade:

LPVll-A (base module for LP25)
LPVll-B
LPVll-E (base module for LP26)
LPVll-F
CK-LPVIA-KA

Cabinet kit

The LPVll is a dual-height module that controls the flow of data between the
Q22-Bus and a lineprinter. It is configured using jumpers (Figure 3-25),
W13
n -______

Wll

~W.~12~lrO----------------------------------,
-~
~~ ~j:g~~
V2

M>V2

V50-1
V6 <>l

M>V5
M>V6

'~~"

W14

F~'

F-\ V7
W7

o--1a::::JM>
c>--<l

A3-O
A4

M>A4

W4~5<>-1HlA5
WS
<Hc:JJHl

<>-----<>
P

0- A6-o

Hl A7
0- AS-O

o-A9-<>
"'A10'"
"'All'"
<>A12<>

NOTE:
0= WIRE WRAP PIN,

Figure 3-25

LPVll Module Layout

3-41

System Options

The CSR address and interrupt are both fixed. Tables 3-27 and 3-28 list the
factory configuration. Table 3-29 lists the factory setting of the other jumpers on
the module. Figure 3-26 shows the internal cabling setup.

Table 3-27
LPVII CSR Address
Factory
Al2 All AIO A9 A8 A7 A6 A5 A4 A3
Setting
17777514

Add. Bits
(Jumpers)

I = Installed = 0
R = Removed = 1

Table 3-28
Factory
Setting

LPVll Interrupt Vector
V8
V7
V6
V5
Wl4
V7
Wl3
Wl2

200

I = Installed = 0
R = Removed = 1

Table 3-29
Jumper

LPVII Jumper Configuration
State

D
W7
P
W8

I
I

F-

R
R

T
R = Removed
I = Installed

3-42

R
I

V3
WIO

V2
W9

Add. Bits
Jumper

System Options

Figure 3-26

LPVll Internal Cabling

3-43

System Options

3.3
3.3.1

MASS STORAGE
RC25 Disk Subsystem

The RC25, a standalone mass storage device, has a capacity of 52 Mbytes. It
contains two 8-inch, double-sided disks. One disk is fixed and one is removable.
Each disk has a capacity of 26 Mbytes. The same spindle drives both disks.
Factory installed:

RQC25-AA

Field upgrade:

RC25-DA
KLESI-QA

(Tabletop drive with cartridge
and cabling kit)

The KLESI-QA cabling kit provides the connection between the disk drive and the
enclosure. It contains one type A filter connector, a cable that connects it to the
controller module (M7740), and a round cable that connects the RC25 to the I/O
distribution panel.
Figure 3-27 shows the cabling for the RC25 disk subsystem.
The CSR address of the M77 40 adapter module is fixed and is configured using a
DIP switch, E58 (Figure 3-28). Table 3-32 lists the factory setting. The interrupt
vector is set under program control.

Table 3-30
Factory
Setting

M7740 CSR Address
A12 All AI0 A9 A8 A7 A6 A5 A4 A3
E44
1
2
3
4
10
5
6
7
8
9

17772150

Add. Bits

Switches

1 = Switch on

o = Switch off
NOTE
The M7740 and M8639 (RQDX controller) are both MSCP
devices. All MSCP devices have a CSR address of 17772150. If
you install more than one MSCP device in a system, you must
change the CSR address of one of them. Set the CSR address
of the second device within the floating range. The new address
of the second device must be entered into the KDJ11-BC translation table (see Section 2.5.3).

3-44

System
t"
_ _0"rP",lons

ADAPTER
MODULE

INTERFACE
CABLE

Figure 3-27

RC25 Disk Su bsystem

Figure 3-28

M7740 Module Layout

3-45

System Options

3.3.2

RDS1, RDS2, and RDS3 Disk Drives

Factory installed:

RD5nQ-AA (disk kit) n = 1 or 2

Field upgrade:

Same as factory installed option.

An RD5nQ-AA kit includes the following:
• RD5n-A: Disk drive
• 17-00282-00: 20-pin cable to signal distribution panel
• 17-00282-00: 34-pin cable to signal distribution panel
The RD51, RD52, and RD53 are fixed disk drives with formatted capacities of 11
Mbytes, 31 Mbytes, and 71 Mbytes, respectively.
When you install these drives in port 0 (left mass storage slot), the two disk drive
signal cables connect to J2 and J7 on the signal distribution panel. When you install
these drives in port 1 (right mass storage slot), the two disk drive signal cables
connect to]1 and J5 on the signal distribution panel. The disk drive power cable
connects to J8 on the power supply and to the disk drive (see Sections 1.5.1 and
1.6).
CAUTION
Only one fixed disk drive can be installed in a BA23-A
enclosure.
3.3.2.1 Factory Configuration - The read/write printed circuit board on the

RD51 has a DIP shunt jumper consisting of seven breakable metal strips
(Figure 3-29). Table 3-31 lists the setting for the jumpers.

3-46

System Options

Figure 3-29

RD51 Disk Drive and Shunt Jumper

3-47

System Options

Table 3-31
Pin Numbers

RD51 DIP Shunt Pack Factory Setting
Pin Numbers
Pin Connection
Pin Connection

1 to 16
2 to 15
3 to 14
4 to 13

Not used
In
In
In

5 to 12
6 to 11
7 to 10
8 to 9

Out
In
Out
Out

The RD52 read/write printed circuit board has five pairs of pins (Figure 3-30). To
configure an RD52 drive as DUO (port 0), place the jumper clip on DS3. To
configure an RD52 drive as DU1 (port 1), place the jumper clip on DS4.
The RD53 read/write printed circuit board has four switches at its rear edge
numbered as follows:
REAR OF DRIVE
432
1
To configure an RD53 as drive DUO (installed in port 0), depress switch 3. To
configure the RD53 as DUI (installed in port 1), depress switch 4.

3-48

System Options

FRONT OF DRIVE

0R9ll0
° 0
00 °
DS1
I DS3 I
o

DS2

o
o

DS4

REAR OF DRIVE
FRONT
OF
DRIVE

REAR
OF
DRIVE

Figure 3-30

RD52 Disk Drive and Jumpers

3.3.2.2 Disk Formatting - Replacement disk drives must be formatted with the
ZRQB?? binary program to be compatible with the RQDXn controller module. This
program is provided by the XXDP+ diagnostic software system, which is on the
field service test diskettes. Use version 5 or later to format an RD52 disk drive.

3-49

System Options

The disk formatting procedure is as follows:
NOTE
Write down the serial number of the fixed disk drive before
installing it. You will need it during the formatting procedure.
Symbols:

<CR>= carriage return
example of a correct answer
<>
(L)
answer with a letter (Y or N)
(D)
answer with a one-digit number
(A)
answer with an alphanumeric
(def)
default - <CR> enters the listed response

XXDP+ PROMPT

YOUR RESPONSE
<CR> after each response

R ZRQB??
DRSDO
ZRQB-C-O
RD51/52 DISK FORMATTER
UNIT IS RQDXl/2 DISK DRIVE
SUBSYSTEM
RSTRT ADR AAAAAA
DR>
CHANGE HW (L)?

STA
N

CHANGE SW (L)?

ENTER DATE <MM-DD-YYYY> (A)?

(Use the format shown.)

Enter unit to format <0>: (D)?

(Enter the unit number assigned to the drive
to be formatted.)

Use existing bad block information
<N>: (L) (N)?

Use down line-load (L) N?

N (def)

Continue if bad block information is
inaccessible (L) N?

N (def)

Enter 8 character serial number (A)?

(Enter the serial number of the RD51/52.)

Enter date in MM-DD-YY format (A)?

(Use the format shown.)

Format begun
Format completed, X revectored LBNs
RDRX EOP 1
o total errs

(This will take about 30 minutes.)

For further information refer to the RD52-D, -R Fixed Disk Drive Subsystem
Owner's Manual and the llC23-UE/llC23-UC RD52 Upgrade Installation Guide.

3-50

System Options

3.3.3

RQDX1, RQDX2, and RQDX3 Disk Controllers

Factory installed:

CK-RQDX1-KA
CK-RQDX2-KA
CK-RQDX3-KA

Field upgrade:

Same as factory installed option.

Module number:

M8639 (RQDX1)
M8639-YB (RQDX2)
M8639-YA (RQDX1)

An RQDXn controller kit includes the following:
• RQDXn controller module
• BC02D-ID 50-pin cable, RQDX to signal distribution panel
Optional RQDX1-E (M7512) and RQDXE (M7513) extender modules and their
associated cables (Sections 3.3.3.1 and 3.3.3.2) provide the RQDXn controller signals to external drives connected to the host.
The RQDXn controllers provide the interface for fixed disk and diskette drives to
the Q22-Bus. These intelligent controllers have onboard microprocessors. Data
transfers using DMA. Programs in the host system communicate with the controller and drives using MSCP.
An RQDXn can control a maximum of four drives. Each fixed disk counts as one
drive. Each RX50 counts as two drives. You can have only two RQDX controllers
in a system.
NOTES
The RQDX1 controls a maximum of two fixed disk drives and an
RX50. The RQDX2 controls a maximum of four fixed disk drives,
or two fixed disk drives and an RX50.
If an RQDX1 controller is used, it must be the last module in the
backplane.
CAUTION
Only one fixed disk drive can be installed in a BA23-A
enclosure.

Figure 3-31 shows the jumper and LED locations for the RQDX controllers.

System Options

010

~~~=bt::::::.J..C:::/========:::1:::...-(

LUN7 : : : : : : : : 0

RODX1

A12

-=- -=-

010

t--=~rb~~~

LUN7 : : : : : : : : 0

RODX2

0::0
W4

Figure 3-31

3-52

RQDX1 and RQDX2 Module Layouts

System Options

The CSR address of the RQDXn modules is fixed. Table 3-32 lists the factory
setting.

Table 3-32
RQDX CSR Address
Module Starting A12 All AIO A9 A8 A7 A6 A5 A4 A3 A2 -- Add. Bits
Number Address
(Jumpers)
1
2

17772150
Floating

R R R I

R I

<--

Factory

I = Installed = 1
R = Removed = 0

Logical unit number (LUN) jumpers 1 - 8 are removed.
The interrupt vector for the RQDXn modules is set under program control. The
first RQDXn module is assigned a fixed interrupt vector of 154. If a second
RQDXn module is installed, its interrupt vector is floating.
NOTE
All MSCP devices have a CSR address of 17772150. If you
install more than one MSCP device in a system, you must
change the CSR address of one of them. Set the CSR address
of the second device within the floating range. If the devices is
to be booted, the new address of the second device must be
entered into the KDJ11-B translation table (see Section 2.5.3).

For further information, refer to the RQDXl Controller Module User's Guide
(EK-RQDX1-UG).
3.3.3.1 RQDX1-E (M7512) Extender Module - Use the RQDX1-E extender
module when you have an RQDX1 controller and want to add a subsystem or
additional MSCP devices in a BA23 expansion box.

Figure 3-32 shows the jumper locations on the RQDX1-E module. Table 3-33
provides the factory configuration of these jumpers. Use this configuration with
dual BA23 systems or with a BA23-A subsystem arrangement. The factory configuration is set to connect the expansion unit of the subsystem to connector J3.

3-53

System Options

~NM

...,ceX· ••
..., 0

..., a: 0

••

•

..... NMoo:;tLt><er-....a:>

..., u· • • • • • • •

..., «. . . . . . ..

...., co· • • • • • .. •

Figure 3-32

Table 3-33

RQDXI-E Jumper Locations

RQDXI-E Factory Configuration
Factory
Configuration

Jumpers

Function

WI-W4

Must be installed.
(For manufacturing use only.)

WI-W4

JDI-JD2
JRXI-JDX2

Factory set; do not change.

JDI to JRXI
JD2 to JRX2

JBI-JBB
JAI-JAB
JCI-JCB

JAI to Jel
JA2 to JC2
JA3 to JB3
JA4 to JB4
JA5 to JB5
JA6 to JB6
JA7 to JC7
JAB to JCB

For further information, refer to the RQDXl Controller Module User's Guide
(EK-RQDXI-UG).

3-54

System Options

3.3.3.2 RQOXE (M7513) Extender Module - Use the RQDXE extender module when you have an RQDXZ or RQDX3 controller module and want to add a
subsystem or additional MSCP devices in a BAZ3-C expansion box.
NOTE
A BA23-C enclosure, used as the host or as an expansion box,
supports only one fixed disk drive per enclosure.
Three fixed disk drives are permissible when the RQDXZ or RQDX3 controller and
RQDXE extender modules are used with a BAZ3-A enclosure and two subsystems.
Table 3-34 shows the factory configuration of the RQDXE extender module. The
configuration supports two fixed disk drives. Table 3-35 shows the jumper setting
to support three fixed disk drives. Refer to Chapter Z, Section Z.IZ, for guidelines
and Appendix F for additional configurations.

Table 3-34
RDYand
WRT PROT

RQDXE Jumper Setting (Factory Configuration)
External
Internal
Drive
Drive
Port SEL
Port SEL
SEL
ACK

Al to A3
Bl to B3

*El to EZ
Fl to F3
*FZ to F4
*H3 to H4

KZ to K4

*L1 to L3
L4 to MZ

Nl to NZ
*N4 to PZ

* These jumpers are installed to avoid floating inputs on the M7513.
Table 3-35
RDYand
WRT PROT

RQDXE Configuration for Three Fixed Disk Drives
External
Internal
Drive
Drive
Port SEL
Port SEL
SEL
ACK

Al to A3
Bl to B3
CZ to C4
DZ to D4

*El to EZ
Fl to F3
HI to HZ
*H3 to H4

Kl to K3
KZ to K4

L3 to Ml
L4 to MZ

Nl to NZ
*N4 to PZ

* These jumpers are installed to avoid floating inputs on the M7513.

3-55

System Options

3.3.4

RX50-AA Diskette Drive

The RX50 (Figure 3-33) is a random access, dual-diskette storage device that uses
two single-sided 5-1/4-in. RX50K diskettes. It has a total formatted capacity of 818
Kbytes (409 per diskette). The RX50 has two access doors and slots for diskette
insertion. A light next to each diskette slot indicates when the system is reading or
writing to the diskette in that slot.
A ribbon cable connects the RX50 to the signal distribution panel. Another cable
connects the RX50 to the power supply.

NOTE
Only one RX50 drive can be used with one RQDX controller
module.

Figure 3-33

3-56

RX50 Diskette Drive

System Options

3.3.5

RL02 Disk Subsystem

Factory installed:
Module number:
(controller)
Field upgrade:

RLV22-AP
M806l
RL02-AK
CK-RLVIA-KA

Disk drive
Cabinet kit

The cabinet kit contains the RLV12 controller module, a type A filter connector
and a cable to connect it to the module.
The RL02 disk drive is a rack-mountable, removable-media mass storage device.
Removable disks placed into the RL02 disk drive can store 10.4 Mbytes of formatted data each. The RL02 disk drive subsystem (Figure 3-34) consists of the disk
drive and a cabinet kit.

Figure 3-34

RL02 Disk Drive Subsystem

The RL V12 controller (Figure 3-35) is a quad-height module that transfers data
between the Q22-Bus and the RL02 using DMA.

3-57

System Options

M11-+5V
M12-A3
M13-A4
M14-A5

-=-

~~~: ~~

M10 M9 M8 M7 M6 M5 M4 M3
VB
V7 V6 V5 V4 V3 V2 VEe

M17 _ A8

~~~:~~O C:i::~D

M20 - A11
M21 - A12
M22-- GND

-=--=-

Figure 3-35

•

E23

RLV12 Module Layout

The CSR address and interrupt vector are fixed. Tables 3-36 and 3-37 list the
factory settings.
Table 3-36
RLV12 CSR Address
Factory
A12 All AIO A9 A8 A7 A6 A5 A4 A3 +- Add. Bits
Setting
M21M20M19M18M17M16M15M14M13M12 +- Jumpers
1
o o 1 o
1 = Jumper connected to ground (pin M22)

17774400 1

1
o
o
1
1 = Jumper connected to ground (pin M22)

o = No connection

RLV12 Interrupt Vector
Table 3-37
Factory V8
V7
V6
V5
V4
Setting MIO M9
M8
M7
M6
160

V3
M5

V2
M4

+-Vector Bits
+-Jumpers

0= No connection

For further information, refer to the RLOljRL02 Disk Subsystem User's Guide
(EK-RL012-UG-002).

3-58

System Options

3.4
3.4.1

BACKUP DEVICES
TQK25-EP Tape Drive Subsystem

The TQK25 is a streaming tape drive that uses magnetic tape cartridges for
backup data storage. The TQK25 is a standalone unit that can be placed on top of
the system enclosure.
The TQK tape drive subsystem (Figure 3-36) consists of the following two major
components:
• TK25 drive
• LSI-ll CPU cabinet kit (TQK25-CP)

LJ...-_ _ _ _,..

ADAPTER
MODULE

INTERFACE
CABLE

Figure 3-36

TK25 Tape Drive Subsystem

3-59

System Options

The drive contains the tape mechanism and the supporting electronics.
The LSI-ll CPU cabinet kit contains the following:
• Installation guide
• M7605 adapter module
• Ribbon cable (internal)
• External cable
• Type A filter connector
The M7605 adapter module (Figure 3-37) provides the interface between the tape
drive and the Q22-Bus.

LED

ADDRESS~

ADAPTER
SWITCH ISW21

VECTOR
/'--'
SWITCHES {SWll

Figure 3-37

3-60

M7605 Module Layout

System Options

The CSR address and interrupt vector for the M7605 adapter module are both
fixed and are set using DIP switches SW1 and SW2 (Figure 3-37). Tables 3-38 and
3-39 list the settings.

Table 3-38
M7605 CSR Address
Factory
SW2
Setting
1
234
17772520

Switches

Table 3-39
M7605 Interrupt Vector
V8
V7
V6
V5
V4
V3
Factory SWI
Setting 1
2
4
3
5
6
224

V2
<-

Switches

7
1

0= Switch on
1 = Switch off

For further information, refer to the following documents:

TK Tape Drive Subsystem User's Guide (EK-OTK25-UG)
TK25 Tape Drive Customer Installation Guide (EK-T25TD-IN)
TQK25 Q-Bus CPU Kit Installation Guide (EK-T25QA-IN)
3.4.2

TQKSO-KA Tape Drive Subsystem

Factory installed:

TK50-AA (tape drive with cartridge)
TQK50-AA controller module and signal cable.

Field upgrade:

Same as factory installed option.

NOTE
Both parts must be ordered for a complete subsystem.

The TQK50 (Figure 3-38) is a streaming tape drive subsystem that provides 100
Mbytes of backup data storage. The media is magnetic tape cartridges.

3-61

System Options

ADAPTER
MODULE

Figure 3-38

TQK50 Tape Drive Subsystem

The TK50 tape drive contains the tape mechanism with supporting electronics.
The M7546 controller module provides the interface between the TK50 tape drive
and the Q22-Bus.
Figure 3-39 shows the location of two DIP switches on the controller module. Use
these DIP switches to configure the following:
• Hardware revision level (set at the factory)
• Unit number

3-62

System Options

g-LED'S

UNIT
NUMBER
HARDWARE
~
REVISION
'-..
UIIIIIIIII

'WIIIIIIII

LEVEL

ADDRESS
JUMPE RS '--... ••••••••••

Figure 3-39

M7546 Module Layout

The CSR address is fixed and is set using jumpers (Figure 3-39). Table 3-40 lists
the settings.

Table 3-40
M7546 CSR Address
Factory
A12 All AIO A9 A8 A7 A6 A5 A4 A3 A2 ;,- Add. Bits
Setting
(Jumpers*)
17774500

I = Jumper installed
R = Jumper removed

* The jumper nearest the module fingers is A2.
The interrupt vector is under program control.
The CSR address for a second module installed in the system is a floating address.
The first floating address is 17760404.
For further information, refer to the TQK50 Tape Drive Subsystem Owner's
Manual (EK-OTK50-0M).

3-63

Configuration
4.1

CONFIGURATION RULES

When you configure the BA23 backplane, you must consider the following factors:
• Module physical priority
• Backplane and I/O distribution panel expansion space
• Power requirement
• Bus loads
• Module CSR addresses and interrupt vectors
4.2

MODULE PHYSICAL PRIORITY

The order in which you place modules in the backplane affects system performance. Install modules according to the following rules:
• Install the KDFll-B, KD]ll-BB, and KDJll-BC CPU in slot 1.
• Install MSVll-P memory module(s) following the KDFll-B, KDJll-BB, and
KDJll-BC CPU.
• Install the KD]ll-BF CPU in slot 2 or 3.
• Install the MSVII-JD and MSVII-JE memory module(s) immediately preceding
the KDJll-BF CPU.
• Install dual-height modules in the A/B rows of slots 1 through 3. No grant
continuity card is necessary.
• Install dual-height modules in either the A/B or C/D rows of slots 4 through 8.
The opposite row must contain either another dual-height module or a grant
continuity card (M9047 or G7272) in rows A or C.
• Install modules following the CPU and memory using the sequence shown in
Table 4-1.

4-1

Configuration

Table 4-1
Order of Modules in the BA23 Backplane
Order Type of Device Option
Module
Comments
1

Communications

DEQNA
DPVll
DRVll-J
DRVll-B

M7504
M8020
M8049
M7950

Lineprinter

LPV11

M8027

Communications

DLVE1
DLVJ1
DZV11
DHVll
DMVll-M
DMVll-N
DUVll

M8017
M8043
M7957
M3104
M8053
M8064
M7951

Tape controller

TQK25
TQK50

M7605
M7951

Disk controller

KLESI
RLV12

M7740
M8061

MSCP controller

RQDX1
RQDX2

M8639
Last occupied slot
M8639-YB

4.3

EXPANSION SPACE

Ethernet
Synchronous
General purpose - no silos

Asynchronous - no silos
Asynchronous - no silos
Asynchronous - with silos
Asynchronous - with silos
Synchronous - DMA
Synchronous - DMA
Bisynchronous

When you configure your system, you must consider both the amount of space
available in the backplane and the rear I/O distribution panel.
4.3.1

Backplane

The BA23 backplane has eight slots available for you to install Q22-Bus compatible
modules. The configuration examples in this chapter show the slots occupied by
modules and the number of open slots remaining.
4.3.2

Rear 1/0 Distribution Panel

The rear I/O distribution panel contains two type A (1 x 4) and four type B
(2 X 3) cutouts for mounting I/O panel inserts. You can convert the bottom two
type B cutouts to provide for three additional type A cutouts. Figure 4-1 provides a
configuration worksheet to keep track of the number of available inserts.

4-2

Configuration
4.4

POWER REQUIREMENTS

Use the configuration worksheet (Figure 4-1) to keep track of the total current and
power used to be sure you do not overload the system. The current is measured at
+5 and +12 Vdc. The current and power requirements of each module must not
exceed the limits shown in Table 4-2. Table 4-3 lists the current drawn by the
Q22-Bus and the type of insert used for each module.
Table 4-2
Current and Power Limits
Systems Containing
H7864-A Power Supply
Current:
Power:
4.5

+ 5 Vdc = 36 amps
+12 Vdc = 7 amps

230 watts

System Containing
H7864 Power Supply
Current:
Power:

+ 5 Vdc = 36 amps
+12 Vdc = 6 amps

230 watts

BUS LOAD

Use the configuration worksheet (Figure 4-1) to keep track of the number of ac
loads for each Q22-Bus module. Subtract the bus loads of each module from a total
of 30 ac loads.
4.6

MODULE CSR ADDRESSES AND INTERRUPT VECTORS

Modules must be set to the correct CSR address and interrupt vector. Use Table
4-4 to determine the correct settings. You must observe the following rules:
• Check off all the options to be installed in the system.
• If there is a V in the vector column, the device has a floating vector. Assign a
vector to each option to be installed, starting at 300 and continuing in the
following sequence:

300, 310, 320, 330, 340, 350, 360, 370,
• If your system has a KDFll module, the floating vectors begin at 310.
• If there is an F in the address column, the device has a floating CSR address.
Use Table 4-5 to determine the correct addresses for these devices.
NOTE
If a module has a floating vector and CSR address, additional
modules of the same type also have a floating vector and CSR
address.

4-3

Configuration

Table 4-3

Power Requirements, Bus Loads, I/O Panel

Option

Module

Current
+5 V +12 V

KDJII-BC
KDFll-BE
MSVll-PK
MSVll-PL
DEQNA-KP
DPVll-DP
DRVll-JP
DRVll-BP
DRVll-LP
LPVll-XP
DLVEI-DP
DLVJI-LP
DZVll-DP
DHVll-AP
DMVII-AP
DMVII-BP
DMVII-CP
DMVll-FP
DUVll-DP
TQK25-KA
TQK50
KLESI-QA
RLVI2-AP
RQDXl
RQDX2
RX50-AA
RD51-A
RD52-A
TK50-AA

M8190
M8189
M8067-K
M8067-L
M7504
M8020
M8049
M7950
M7941
M8027
M8017
M8043
M7957
M3104
M8053-MA
M8053-MA
M8064-MA
M8053-MA
M7951
M7605
M7546
M7740
M8061
M8639-YA
M8639-YB

4-4

5.5
5.5
3.45
3.6
3.5
1.2
1.8
1.9
0.9
0.8
1.0
1.0
1.2
4.3
3.4
3.4
3.35
3.4
1.2
4.0
2.2
3.0
5.0
6.4
6.4
0.8
1.0
1.0
1.5

0.1
0.1

0.5
0.3

1.5
0.25
0.39
0.48
0.38
0.38
0.26
0.38
0.39

0.10
0.25
0.25
1.8
1.8
1.8
2.5

Bus Loads
ae
de
2.3
2.3
2.0
2.0
2.2
1.0
2.0
3.3
2.8
1.4
1.6
1.0
3.9
2.9
2.0
2.0
2.0
2.0
3.0
2.0
2.0
2.3
2.7
2.0
2.0

1.1
1.1
1.0
1.0
0.5
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0

I/O Inserts
A=1x4
B=2x3
lxB
lxB

lxA
lxA
2xA
2xA
2xA
lxA
lxA
1X B
lxB
2xB
lxB
lxB
lxA
lxB
lxA
lxA
lxA
lxA
lxA

Configuration

CURRENT (AMPSI
OPTION

PANEL INSERTS

AC BUS
LOADS

1x 4

2x3

+12

USED AVAILABLE USED AVAILABLE USED AVAI LABLE USED AVAILABLE USED AVAILABLE
SLOT
NUMBERS

MAXIMUM

36.0

29.0

TOTAL OF
THISCOLUMNx 12=

WATTS AT 12 V

TOTAL OF
THISCOLUMNx5-

WATTSAT5V

7.0

CPU
1 DOUBLE

1 DOUBLE
1 QUAD OR
2 DOUBLES
1 QUAD OR
2 DOUBLES

1 QUAD OR
2 DOUBLES
1 QUAD OR
2 DOUBLES

1 QUAD OR
2 DOUBLES
D 15K UNIT NO.1

D ISK UNIT NO.2

,--,

L-.J

Figure 4-1

TOTAL WATTS
(MUST BE 230 OR LESSI

Configuration Worksheet

4-5

Configuration

Table 4-4

Option

Address/Vector Worksheet
Octal
Check
Unit if in
Size in
Module No.
System Bytes

KDJll-BC
MSVll-PL
MSVll-PL
MSVII-PL
MSVll-PL
DEQNA
DEQNA
DPVll
DRVll-JP
DRVll-JP
DRVll-B
DRVll-B
LPVl1
DLVEI
DLVj1
DLVJl
DZVll
DHVll
DMVII-CP
DUVll
TQK25
TQK50
TQK50
KLESI-QA
RLV12
RQDXl,2

M8190
M8067
M8067
M8067
M8067
M7504
M7504
M8020
M8049
M8049
M7950
M7950
M8027
M80l7
M8043
M8043
M7957
M3104
M8064
M7951
M7605
M7546
M7546
M7740
M8061
M8639

4.6.1

1
1
2
3
4
1
2
1
1
2
1
2
1
1
1
2
1

Vector

X
X

1
1
1
1
2
1
1
1

CSR Address (N=l77)
N72100 start add.=O

10
10

10
10
10

10
20
20
10

4
10
10
4

120
120
V
V
V
124
V
200
V
V
V
V
V
V
V
224
260
260
154
160
154

N72102 start add.=512
N72104 start add.=1024
N72106 start add.=1536
N74440
N74460

F
N64120
N64140
N72410
N72420
N77514
N75610

N76500
N76510

F
F
F
N60440
N72520

N74500
N60404
N72150

N74400
N72150

Floating CSR Addresses

Table 4-5 shows the floating CSR address for some common combinations of
devices that require reconfiguration.
Check off all the devices in the system you want to reconfigure and find the
column in Table 4-5 that makes the best match. In most cases, if you do not install
a device listed in the middle of the column, the address of the device that follows
changes.

4-6

Configuration
Observe the following rules:
• Check the box for each module installed in the system.
• Find the column that corresponds to all the installed modules, where:
number = installed
* number = may be installed or not
NOTE
When an address is preceded by an *, the address of the following device(s) does not change.

• Assign the floating CSR address according to the numbers shown in Table 4-5.
The address is 17760nnn. The numbers in the figure are the last three digits of
the address for the module.
Substitute numbers given in Table 4-5 for the nnn in address 17760nnn to find the
floating CSR address.

Table 4-5
Option

Floating CSR Address Chart
Common Configurations

DZQ/V 1

100

DZQ/V 2

*110

110

*110

110

DZQ/V 3

*120

DPVll

*270

DMVll

*270

120
*310

*330

*310

*330

340

360

374

414

*504

504

540

320

2nd MSCP

334

*354

354

2nd TK50

*404

*444

DHVll1

440

500

DHVll 2

460

520

120

4-7

Configuration

4.6.2

Floating Address Guidelines

If the system you wish to configure does not resemble any of the common
configurations shown in Table 4-5, refer to the following list and Appendix D,
Configuration Worksheet, for directions or contact your field service representative
for help.

• The first DUVll CSR address is 17760040.
• The first DZVll CSR address is 17760100 if no DUVlls are present.
• The first DPVll CSR address is 17760270 if no DUVlls or DZVlls are
present.
• The first DMVll CSR address is 17760320 if no DUVlls, DZVlls, or
DPV11s, are present.
• The first disk MSCP CSR address is always 17772150.
• The second disk MSCP CSR address is 17760334 if no DUVlls, DZVlls,
DPVlls, or DMVlls are present.
• The first tape MSCP CSR address is always 17774500.
• The second tape MSCP CSR address is 17760404 if no DUVlls, DZVlls,
DPV11s, or DMV11s are present and no more than one disk MSCP is present.
• The first DHVll CSR address is 17760440 if no DUVlls, DZVlls, DPVlls,
or DMV11s are present and no more than one disk MSCP is present and no
more than one tape MSCP is present.

4-8

Configuration
4.7

CONFIGURATION EXAMPLES

The BA23 enclosure can be used in a variety of configurations. The following
examples show typical base and advanced systems.
4.7.1

Base System Configuration

Figure 4-2 shows the cabling layout of a base system in the following sequence:
Backplane ----. Cabinet kit ----. I/O distribution panel
Figure 4-3 shows the backplane setup for a base system, which can be expanded at
a later time.
BACKPLANE
(54·71507)

M8190
2

M8067·LA

M3104

M8639·YB

CABINET
KIT

I/O PANEL

EXTERNAL
CABLE

CK·KDJ1 B·KA

BC22D·10

CK·DHV11·AA

BC22D·10

EXTERNAL
DEVICE

TERMINAL NO.1

TERMINAL NO. 2-5

1700861·01

5
6

20-PIN
17-000282-01

SIGNAL
DISTRIBUTION
PANEL
34-PIN
17-00867-01
34-PIN
17-000-286-01

Figure 4-2

Cable Connections for the Base System

4·9

Configuration
MASS STORAGE DEVICE:

RX50
RD52

BACKPLANE
SLOT NO.

I/O CUTOUTS
(STANDARD I/O)

ROW
C

A
1

KDJ 11 ~BC (QUAD) CPU

MSV11~PL (QUAD) 512 KB MEMORY

DHV11 (QUAD) 8- LINE MULTIPLEXER

RQDX1 (QUAD) RD/RX CONTROLLER

(1 x4)
2

(2 x 3)
4
1

6
7
8
TOTAL USED:
AVAILABLE:

Figure 4-3

4.7.2

-0 - -32

Base System

Advanced System Configuration

Figure 4-4 shows the cabling layout for an advanced system configuration in the
following sequence:
Backplane

--t

Cabinet kit --t 1/0 distribution panel --t External cable --t External device

Figure 4-5 shows the expandability of the BA23 enclosure. It includes the following
features:
• 1 Mbyte of main memory
• An RD52 fixed-disk drive
• An eight-line asynchronous multiplexer
• A DEQNA module to connect to Ethernet
• An LPVll module for the LP25 printer
• A TQK50 tape controller for backup and restore

4-10

Configuration
EXTERNAL
DEVICE

I/O PANEL
BC22D-10

CK-KDJB-KA

TERMINAL # 1

CK DEQNA-KA

H4000 TRANSCEIVER

CK-LPVA-K

LP25 PRINTER

I TK50 TAPE DRIVE

TQK50-AB
BC22D-10

CK DHV11-AA

TERMINAL 2 TO 9

SIGNAL DISTRIBUTION PANEL

34-PIN
17-00285-02
34-PIN
1 7 -00286-00

Figure 4-4

Cable Connections for an Advanced Configuration

MASS STORAGE DEVICE:
BACKUP DEVICE:

RX50
RD52
TQK50-AA

BACKPLANE
SLOT NO.

I/O CUTOUTS
(STANDARD I/O)

ROW
A

KDJ11-BC (QUAD) CPU

MSV11-PL (QUAD) 512 KB MEMORY

(1 x4)
2

(2 x 3)

4
1

MSV11-PL (QUAD) 512 KB MEMORY

DEQNA NET (DUAL)

LPV11 PRT (DUAL)

I
I

M9047 GRANT CARD

TQK50 CONT (DUAL)

DHV11 (QUAD) 8- LINE MULTIPLEXER

RQDX1 (QUAD) RD/RX CONTROLLER

-TOTAL USED:
AVAILABLE

Figure 4-5

--3

Advanced System

4-11

Configuration

4.8

PREPARE THE SETUP TABLE AND THE OPERATING SYSTEM

When your system is fully configured:
• Enter any devices you want to boot in the translation table (see Chapter 2,
MicroPDP-ll Base Systems, Section 2.5.3).
• Prepare your operating system.
To prepare your operating system to recognize the devices installed in the system,
perform a one-time SYSGEN (system generation) or CONFIG (configure) operation.
Refer to the operating system software documentation for instructions.

4-12

Diagnostics
5.1

INTRODUCTION

This chapter describes the following topics:
• St~rtup self-test (Section 5.2)
• KDJI1-B (M8190) testing procedures and messages (Section 5.3)
• KDFll-B (M8189) testing procedures and messages (Section 5.4)
• Console emulator mode (Section 5.5)
• ODT (Octal Debugging Technique) commands (Section 5.6)
• Tests that can be loaded from user diskettes (Section 5.7)
• Troubleshooting procedures with DEC/XlI Run Time Exerciser (Section 5.9)
• Troubleshooting procedures with XXDP+ Diagnostic Programs (Section 5.10)
• Troubleshooting procedures for the BA23 enclosure (Section 5.11)
5.2

STARTUP SELF-TEST

The factory configuration of the KDJll-B and KDFll-B modules is set for automatic self-test and boot mode. This test runs each time the system is turned on or
restarted, and tests the:
• CPU
• Memory
• Connections between both CPU and memory modules and the Q22-Bus.
It begins by testing a small portion of the CPU module and then by progressively
testing more and more of the base system. The system enters automatic boot
mode on successful completion of the start-up test (see Chapter 2). When the selftest discovers an error or failure, the system displays a message. Refer to Section

5-1

Diagnostics

5.3.1 for an explanation of the KDJll-B messages. Refer to Section 5.4.1 for an
explanation of the KDFll-B messages. Section 5.11 provides a flowchart to help
you isolate a failing FRU (field replaceable unit).

5.3

KDJ11-B TESTING PROCEDURE

The self-test program contains 40 separate parts beginning with test 77 and counting down to 30 octal. The SLU display panel displays the number of the current
self-test. The SLU panel also displays boot messages (27 to 00 octal). Table 5-1
provides a summary of these tests and messages.

Table 5-1 KDJU-B Self-Test and Boot Diagnostic ROM Messages
Number Description
77
76

75
74
73
72
71
70
67
66
65
64

63
62
61
60

57
56
55
54
53

52
51
50
47
46
45 to 31
30

5-2

CPU hung or Halt switch on at power-on or restart
First CPU pretests, memory management unit (MMU) register tests
Turn MMU on and run MMU tests and CPU tests

Power-up to on-line debugging technique (ODT)
Power-up to 24/26
EEPROM checksum test
CPU ROM and page addressing test
Miscellaneous CPU and extended instruction set (EIS) tests
SLU 1 - check all four registers
SLU 2 - check receivers and transmitters maintenance mode
SLU 3 - check interrupts and errors in maintenance mode
Test MMU abort logic
Standalone CPU cache mode tests (memory off)
Line clock test
Floating-point processor (FPP)
CPU commercial instruction set (CIS) test
Standalone mode exit - check address 1776000 for guaranteed timeout

Memory sizing test
Check for memory at address 0
Test memory from 0 to 4 Kbytes
Cache test using memory
Memory data byte tests for all memory
Parity and error correcting code (ECC) for all memory
Memory address line shorts for all memory

Test exit - test completed successfully

Diagnostics

Table 5-1 KDJl1-B Self-Test and Boot Diagnostic ROM Messages (Cont.)
Number Description
27
26
25
24
23
22
21
20
17
16
15
14
13
12
11
10
07
06
05
04
03
02
01
00

Spare - not used
Spare - not used
Reserved - Not used by ROM code. This code is driven by the MDM
module on UNIBUS systems. Do not use it, even if system is Q-Bus
DECNET boot (DLVll-E/F of DUVll) waiting for a reply from host
XON not received after XOFF - To correct type CTRL Q
Xmit ready bit never sets in DLART transmit CSR
Drive error
Controller error
Boot device selection was invalid (i.e., AA)
Invalid unit number selected
Nonexistent drive
Nonexistent controller
No tape
No disk
Invalid boot block
Drive not ready
For Q-Bus only. No bootable device found in automatic boot mode
Console disable by switch 1 = On and no force dialog. For V6.0 only,
APT break received and ROM code has entered ODT
Spare
Dialog mode
Off board ROM boot in progress
EEPROM boot in progress
CPU ROM boot in progress
Control transferred from ROM code to booted device. The display
blanks when it receives a code of 00

* These are UNIBUS tests, not run on Q22-Bus systems.

5-3

Diagnostics

5.3.1

KOJ11-8 Messages

Normally the system displays a message in three locations:
• The console terminal - displays a number and brief message. An example of a
message is shown in Section 5.3.2. Table 5-2 shows the boot/diagnostic
messages.
• The SLU display panel - displays a two-digit octal code.
• The M8190 module - displays a message on the red diagnostic LEDs on the
rear edge of the module. The top three LEDs (looking into the card-cage)
represent the octal MSB and the lower three LEDs represent the octal LSB.
When all three display locations are working, the system displays the same information in all locations. If the console terminal is not working, refer to the SLU
display panel for information. If the SLU is not working, refer to the module itself.
Sometimes, the console terminal displays a message in the format:
000100
@
The number (000100, in this example) is the octal address of the next instruction
to be executed. The @ sign indicates that the system has halted and passed control
to the console emulator mode. Make sure that the Halt button is not in, and then
restart the system using the restart button. If the system halts again, the CPU is
faulty and should be replaced.

Table 5-2
KDJll-B Self-Test and Boot/Diagnostic ROM Messages
Error Number
Probable FRU Failure
177 to 100
77

73
61
54
53
52
50

(Subtract 100, and refer to the codes below.)
Halt switch, M8190, power supply.
Not a failure; selected mode is ODT.
Clock from power supply.
Memory module.

47
46
23
Any other
number

5-4

Console terminal not ready due to XOFF received from
terminal while attempting to print a message.
M8190

Diagnostics
Before removing and replacing the recommended FRU, boot from the diagnostic
software and verify the fault using the diagnostic software.
To boot from a diagnostic diskette, you must restart the built-in diagnostics after
the test that found the error. To do this:
• Remove all removable media containing user data.
• Write-portect all other on-line data storage devices (devices containing fixed
media).
NOTE
Restarting testing after the test that found the fault is only suggested when attempting to boot write-protected media containing software diagnostics. In this case, a/l other on-line data storage devices must be write-protected to prevent possible data
loss.

• Install the boatable diagnostic.
• Type <CTRL> 0 followed by a 4 and <Return> to restart the testing. This
restarts the built-in diagnostics.
If this restart procedure fails, the diagnostic diskettes cannot be loaded to verify
the error and the failing FRU. In this situation, replace the FRU recommended by
the Table 5-2 listing.

5-5

Diagnostics

5.3.2

KDJ11-8 Console Terminal Messages

When an error occurs during the self-test, the system displays a message on the
console terminal. Figure 5-1 shows an example of such a message.
These messages contain the following information:
1.

An error number - this is the number of the self-test that failed and is typically an octal number from 30 to 77. Sometimes the system displays an octal
number from 130 to 177. The system displays this exception when an "unexpected trap to location XXX" error occurs. In this case, the failing self-test is
the number minus 100.

An error description - this is a one-line description of the error.

The "see troubleshooting documentation" message.

The address of the error - this address information locates the error to the
ROM address itself and the address in the program listing.

The contents of RO to R6 of register set 0 and the contents of kernel PAR 3.

For some memory tests, the system displays the expected data, found data
(wrong data), and faulty memory address.

A command line with up to four user-selectable options showing how to continue the system testing. These options include:
•

Rerun the test once and, if it passes, continue with all remaining tests.

•

Loop on failing test continuously. To stop this loop, type <CTRL> C.
When stopped, the system then displays the total number of successful
passes and total number of error passes.

•

Map memory and I/O page - available for tests 56 to 30. Helps locate a
misconfigured or failing memory module in the system.

•

Advance to next test - allows the user to restart the system testing after
the failing test.
NOTE

Use the "Advance to next test" command only when attempting to boot
write-protected media containing software diagnostics. Write-protect all
other on-line data storage to prevent its possible loss.
Even if the system does not display the "Advance to next test" command, you can
call it by typing <CTRL> 0 followed by 4 and the Return key.

5-6

Diagnostics

TESTING IN PROGRESS - PLEASE WAIT
MEMORY SIZE IS 256 K BYTES
9 STEP MEMORY TEST
STEP 1 2 3 4 5 6 7 8
ERROR 46
MEMORY CSR ERROR
SEE TROUBLESHOOTING DOCUMENTATION

ERROR PC = 173436
RO = 060000
R4 = 100000

PAGE = 15

R1 = 052525
R5 = 040000

PROGRAM LISTING ADDRESS = 015436
R2=172100
R6 = 172300

COMMAND

DESCRIPTION

1
2
3
4

RERUN TEST
LOOP ON TEST
MAP MEMORY AND 1/0 PAGE
ADVANCE TO THE NEXT TEST

R3 = 172344
PAR3 = 010000

TYPE A COMMAND THEN PRESS THE RETURN KEY:

Figure 5-1

Error Message Screen

5-7

Diagnostics
5.4

KDF11-B TESTING PROCEDURES

Normally the system displays a message in two locations:
• On the console terminal
• On the KDFll-B module LEDs
The console terminal display has the following format:
nn <a message>
(where nn is a number from 00 to 23)
Some errors cause the system to halt any type of program. In this case, control
passes to the console emulator mode. This mode allows you to simulate error
conditions using ODT commands (Section 5.6).
5.4.1

KDF11-B Messages

If any part of the self-test or boot diagnostics fails, the console terminal displays a
message consisting of a number and a brief message. Table 5-3 describes the
possible failure and a recommended action.

For example, if the system fails to boot, the console terminal displays a message
similar to the following:
ERROR UNIT DUO
ERR 16 NOT BOOTABlE
ERROR UNIT DU2
ERR NOT BOOT ABLE
ERROR UNIT DU1
ERR 16 NOT BOOT ABLE
WISH TO REBOOT [Y,(N)]?

5-8

Diagnostics

Table 5-3

KDFll-B Self-Test and Boot Diagnostic ROM Messages
Description and
Recommended FRU I Action
Number Message

01
02
03
04
05
06
07
08
09
10
11
12

NO MEMORY
FATAL MEMORY FAULT
MEMORY FAULT
MMU ABORT
TRAP 4
TRAP 10
TRAP 14
TRAP 20
POWER FAIL
TRAP 30
TRAP 34
NONEXISTENT
CONTROLLER

DRIVE NOT READY

14
15
16

DRIVE ERROR
CONTROLLER ERROR
NOT BOOT ABLE

NO DISK

NO TAPE

NONEXISTENT UNIT

20
21
22

ROM E126 BAD
ROM E127 BAD
NO FORCED PARITY

Errors 01 through 11 indicate a
faulty CPU or memory module. First
replace CPU module. Retry. If fault
remains, replace memory module.

Boot device as specified by SI not found.
Check setting of S1. Retry. If error remains,
replace controller module.
Make sure a diskette is in the drive. Make
sure the fixed disk is on-line.
Check the diskette and diskette drive.
Replace controller module.
No bootable operating system. Install
operating system.
Install diskette or disk containing bootable
operating system.
System is accessing tape drive with no tape.
Mount tape.
Boot device as specified by switch SI not
found. Check setting. Retry. If error remains,
replace controller module.
Replace CPU boot ROM E126.
Replace CPU boot ROM E127.
See description errors 01 through 11
(CPU and memory errors).

5.4.2 KDF11-B Diagnostic LEOs
If a program fails and the console terminal does not display any messages, check
the LEDs on the KDFII-B module for the diagnostic code. Table 5-4 identifies the
possible errors.

5-9

Diagnostics

Table 5-4
Display
in Octal

List of LED Self-Test Display Codes

Diagnostic/boot ROM not executing. Cleared by ROM code before
transferring control to secondary boot.
If not halt, then CPU test, else CPU error.
If not halt, then MEMORY test, else MEMORY error.
Waiting for XON.
Waiting for console input.
Boot device status error.
Invalid boot block.
DECnet waiting for response from host.
DECnet waiting for message completion.
DECnet processing received message.
If not halt, then MMU test, else MMU error.
Error in first 8KW of memory. Fatal error.
Scope loop.
Extended MEMORY test in progress.
MAP function in progress.
System hung, halt switch on, or not power-up mode 2.
Set by hardware reset.

01
02

03
04
05
06
07

10
11

12
13
14
15

16
17

Definition

KDF11-B System Halt

5.4.3

Sometimes the console terminal displays a message in the format:
000100
@

The number (000100, in this example) is the octal address of the next instruction
to be executed. The @ sign indicates that the system has halted and passed control
to the console emulator mode. Use the boot ROM listing for the contents of the
instruction at which the processing stopped. Check the CPU diagnostic LEDs for
additional diagnostic information.
5.5

KDJ11-B AND KDF11-B CONSOLE EMULATOR MODE

The system enters console emulator mode when any of the following occurs:
• The programs execute a halt instruction.
• You press the Halt button on the control panel.

5-10

Diagnostics

This mode of operation replaces the use of control switches and indicators for
communicating directly with the system. When you type commands on the keyboard, the system displays responses on the console terminal instead of lighting
indicators on the control panel. When the system halts and enters console emulator
mode, it displays the following on the console terminal:
nnnnnn
@

The number nnnnnn is the octal location of the next instruction to be executed, and
the @ is the ODT prompt character. At this point you can examine or modify the
contents of the system's registers and memory by entering ODT commands. The
use of ODT commands is explained in Table 5-5. Refer to the Microcomputer and
Memories Handbook (EB-1845I-20) for a more detailed description.
A portion of the microcode on the KDJl1-B and KDF11-B modules emulates the
capability normally found on a programmer's console. The CPU interprets streams
of ASCII characters from the console terminal as console commands. The KDFII-B
modules micro ODT accepts I8-bit addresses, allowing it to access 248 Kbytes of
memory and the 8-Kbyte I/O page. The KDJ1I-B modules micro ODT accepts 22bit addresses, allowing it to access 4088 Kbytes of memory and the 8-Kbyte I/O
page.
5.6

KDJ11-B AND KDF11-B OCTAL DEBUGGING TECHNIQUE (ODT)

ODT (octal debugging technique) functions only when the system is in console emulator mode. ODT consists of a group of commands and routines for finding error
conditions and for simple communication with the system. ODT helps you debug
object programs interactively. Express all addresses, registers, and memory location contents in octal notation. Letters and symbols make up the ODT command set.
The hardware-implemented ODT command set is a subset of commands in a larger
software-implemented ODT program. The hardware program, residing on KDJ11-B
and KDF11-B modules, serves primarily to diagnose hardware problems. The system's response to ODT commands helps trace events occurring in the system.
NOTE
The hardware ODT commands can modify programs; therefore,
remove master diskettes before using ODT.

Table 5-5 lists the basic ODT commands. Both F11 micro ODT and J11 micro
ODT use these commands. F11 micro ODT uses I8-bit addressing only. J11 micro
ODT uses 22-bit addressing only.

5-11

Diagnostics

Table 5-5
Command
Slash
Carriage
Return
Line feed

Console OnT Commands
Symbol Function

<CR>

Prints the contents of a specified location.
Closes an open location.

Internal
Register
Designator

$ or R

Closes an open location and then opens the next
contiguous location.
Opens a specific CPU register.

Processor
Status Word
Designator
Go
Proceed
Binary dump
(Reserved)

Opens the PS; must follow a $ or R command.

Starts execution of a program.
Resumes execution of a program.
(For manufacturing use only.)
Is reserved for use by Digital Equipment Corporation.
(Causes the CPU to execute a microcode routine that,
in effect, does nothing.)

5.7

<LF>

P
CTRL/S
H

USER TEST DISKETTES

The user test diskette set contains the user-friendly diagnostic diskettes and the
field service diagnostic diskettes.
5.7.1

User-Friendly Diagnostics

Two user-friendly diagnostic diskettes provide you with an easy way to verify the
operation of the entire system. These diskettes have the following labels:
• Micro-l1 User Test 1
• Micro-l1 User Test 2
The complete kit has the DIGITAL P.N. ZYA03-P3.
Load the first diskette into the first diskette drive, and a blank diskette into the
second diskette drive. To run the tests, select T from the menu.

5-12

Diagnostics
If the tests find no errors, the system displays as "test passed" message and
testing is complete.
If the tests detect an error, the system automatically prompts you to install the
second diskette and to run additional diagnostics. These additional tests locate the
FRU that has failed. Refer to your MicroPDP-ll Systems Owner's Manual, Chapter 4, Troubleshooting, for additional information.
5.7.2

Field Service Diagnostics

The user test diskettes also contain a field service diagnostic menu. You can access
this menu by typing F at the main user diagnostic menu. The system test can now
be looped for 10 minutes or until you stop it by typing <CTRL> C. When stopped,
the console terminal displays status and error information.
This menu also allows you access to the XXPD+ monitor. Once in the monitor, you
can type H to access an XXDP+ on-line help file.
NOTE
Only trained service personnel familiar with XXDP+ software
should access the XXDP+ monitor or use the field service diskettes described in Section 5.7.3.
5.7.3

Field Service Test Diskettes

A set of field service diskettes is provided for use by trained service personnel.
These diskettes use the XXDP+ software system to isolate a failing FRU. The
complete kit has the DIGITAL P.N. ZYA04-P3.
XXDP+ includes the program modules necessary to build a run-time exerciser for
the entire system (including system options). Independent device diagnostics are
also included.
An on-line help file is available on all diskettes under the name FILES.TXT. To
access this help file, type H when in the XXDP+ monitor. All diskettes also contain
a directory of all program modules. To access this directory, type D.
For more information on the diagnostic system, refer to:
• DEC/Xll User's Manual (AC-F053-MC)
• DEC/Xll Cross Reference Manual (AC-F055C-MC)
• XXDP+/SUPR User's Manual (AC-F348A-MC)
• XXDP+ DEC/Xll Programming Card (EK-OXXDP-MC)

5-13

Diagnostics
NOTE
XXDP+ (also called version 1) is being revised and rewritten.
This major revision changes the implementation of many XXDP+
monitor features. The revision of XXDP+ will soon be in the field
service diskette set included with the system. Do not attempt to
use this new version of XXDP software without first reviewing
the changes.
5.8

OTHER DIAGNOSTIC MEDIA

Bootable diagnostics are available for TK25 streaming tape drives. Order Digital
P.N. AU-T995A-MC for a TK25-compatible diagnostic cartridge. Bootable diagnostics are also available for RC25 disk drives. Order Digital P.N. BK-T996A-MC for
RC25-compatible removable disk media
5.9

TESTING WITH THE DEC/X11 RUN-TIME EXERCISER

The DEC/XlI run-time exerciser consists of a group of program modules. Each
module tests a specific component of your MicroPDP-ll system. When the runtime exerciser detects an error, it displays a message describing the circumstances
of the error. Determine which system component failed and then:
• Run the appropriate XXDP+ diagnostic program.
• Look up the error call in the listing for the specific program module to determine what operation was in progress when the error occurred.
• Examine the parameter of the failure (processor status word, stack pointer,
program counter, etc.).
You can modify program modules to:
• Halt on different errors.
• Provide different status displays.
• Run alone or with selected other programs.
You can use ODT (Section 5-6) to examine system registers and memory locations.
5.9.1

Run-Time Exerciser Messages

The run-time exerciser provides displays of three basic types of messages:
• System errors
• Data errors
• Status errors
5-14

Diagnostics

5.9.1.1 System Error Messages - The program modules display a system
error in the following format: SYS ERR. The DECjXll run-time exerciser displays
a system error message when it detects one of the following:
• A bus error trap (to location 4)
• A reserved instruction trap (to location 10)
• A queue overflow
If a system error occurs, run the program modules individually. If all modules pass,
run them in groups until the failure returns. Refer to Section 5.9.2 for directions.

5.9.1.2 Data Error Messages - The first line of a data error message ends
with the words DATA ERROR. The program modules display data errors in the
following format:
ROAAO PC XXX XXX APC YYYYYY PASS# NNNNN. ERR# NNNNN. DATA ERROR
CSRA AAAAAA SIB BBBBBB WAS WWWWWW WRADR DDDDDD RDADR EEEEEE

where:
• RQAAO is the name of the failing program test module (listed as XRQAAO.OB]
in the directory).
• PC XXXXXX is the physical address of the program call that causes the message (program counter).
• APC YYYYYY is the assembled program count of the program call.
• PASS# NNNNN. is the pass number (decimal) during which the error occurred.
• ERR# NNNNN. is the error count (decimal) for the current run.
• CSRA AAAAAA is the address of the control and status register of the failing
device.

• SIB BBBBBB is the expected data (SIB, or "should be," data).
• WAS WWWWWW is the bad data.
• WRADR DDDDDD is the address of the expected data (SIB, or "should be,"
data).
• RDADR EEEEEE is the address of the bad data.

5-15

Diagnostics
You can rerun the DEC/Xll modules individually or run the appropriate XXDP+
program. If you want to examine the message further, find the APC (assembled
program count) value in the program listing. The APC location display contains the
program call that caused the error message.
5.9.1.3 Status Error Message - This message is in the same general format as
the data error message. You can recognize a status error message by the absence
of SYS ERR or DATA ERROR in the first line.

This message includes a STATC value where the value is the contents of the
status register of the failing device. Like a data error, a status error can be traced
to a listing by looking up the location given for the APC.
The status error message does not include:
• The SIB ("should be") message
• The WAS (bad data) message
5.9.2

Selecting and Deselecting Program Modules

You can run programs individually or in groups by using the Select and Deselect
commands. These commands allow you to:
• Deselect program modules one at a time.
• Deselect all modules and then select only the desired modules.
These commands operate only within the system exerciser program. They cannot
be executed without first starting the exerciser. Table 5-6 shows the commands
and their function.

Table 5-6
Command

Select / Deselect Commands
Function

.SEL<CR>
.SEL RQAAO<CR>
.DES<CR>
.DES RQAAO<CR>

5-16

Selects all modules for execution .
Selects only the RQAAO program module. The program
name must be typed as it appears in the listing.
Deselects all modules .
Deselects only the RQAAO module .

Diagnostics
You can obtain the status of a module (selected or deselected) by using the MAP
command. This command instructs the monitor program to display a list of resident
modules with their starting addresses and status. For example:
MAP<CR>
CPAFO AT 017752 STAT 040020
CPBGO AT 021502 STAT 040020
RQAAO AT 023242 STAT 150000

The second most significant octal digit of the STAT (status) message indicates
whether or not a module is selected .
• When the number is 0, 1, 2, or 3, the module is deselected.
• When the number is 4, 5, 6, or 7, the module is selected.
Refer to the DEC/Xll User's Manual (AC-F053-MC) for further information.
5.9.3

Expanding the Run-Time Exerciser

Each system has a run-time exerciser designed for that system's configuration. If
you expand your system, you must rebuild the exerciser in order to test the added
components.
You must rebuild the exerciser, rather than just add to it, because it is an interactive system of programs. Rebuilding involves selecting the program modules appropriate to the new hardware and including them with the existing program modules
in a new exerciser. Refer to the DEC/Xll User's Manual (AC-F053-MC) for further information.
5.10

TESTING WITH THE XXDP+ PROGRAMS

The set of field service diskettes provided with your MicroPDP-ll system include
the XXDP+ diagnostic programs. Refer to Table 5-7 for a partial list of these
programs. These diskettes also contain other XXDP+ programs for testing additional options.

5-17

Diagnostics

Table 5-7
XXDP+ Diagnostic Programs
XXDP+ Program Name
Title
JKDB??
JKDA??
JKL5??
VMA8??*
VMSA??
VDZA??
VDZB??
ZRQA??
ZRQB??t
OKDA??

KDFll basic instruction test
KDFll MMU test
KDFIIB CPU cluster test
KDFll BOOT/ROM test
Q-Bus 22-bit address memory test
DZVll test: part one
DZVll test: part two
RD/RX performance exerciser
RD51 formatter program
KD]ll CPU and cache test

* Revision of VM8A?? must be version FO or later.
t This program also contains the RD52/RD53 formatter program on version 5 or later of
the field service diskettes.

The XXDP+ diagnostic software helps to isolate failures by testing the function of
the selected FRU. The system reports the results of a test on a pass/fail basis.
You can modify the XXDP+ programs to perform specific functions. Modification of
these programs requires careful study of the program listings and the
XXDP+/SUPR User's Manual (AC-F348A-MC). This manual describes the commands available under the various XXDP+ utility programs and lists specific program modifications and procedures.
The following paragraphs describe some of the more common operations.
5.10.1

XXDP+ Messages

The XXDP+ diagnostic programs do not use a universal format for messages. The
large number of parameters tested makes a variety of formats necessary. Most
formats display:
• Several octal words, which provide the parameters at the time of the error
• A mnemonic indicating what occurred
The tables or error directories of the individual program listings reference these
program-specific mnemonics.

5-18

Diagnostics

5.10.2

Starting a Program

To start a program, type R and the first four letters of the name followed by??
Press the Return key. The program prompts you for responses. The question
marks allow any revision of the program to run.
5.10.3

Restarting Programs

You can configure the XXDP+ diagnostic programs to:
• Run continuously,
• Halt at the end of a pass, and/or
• Halt (or loop) on selected errors.
You can halt a program by pressing the Halt button. You can then enter appropriate ODT commands or restart the program by typing the restart address given in
the program listing. For example:
@200G

When a diskette boots and you enter the XXDP+ monitor, the system displays the
restart address in the monitor heading. If the diagnostic program has not overwritten the memory locations, return to the monitor by typing this restart address.
If the diagnostic program has overwritten the memory locations of the XXDP+
monitor program, reboot the diskette to return to the monitor.

5.10.4

Modifying a Diagnostic Program

You can modify diagnostic programs to perform specialized diagnostic functions.
The individual program listings explain what to modify for each purpose. Modifying
a program requires the use of ODT commands to change the contents of certain
locations.
The following example changes the memory exerciser program to perform a loopon error. The program listing directs you to change software switch register 176
to 1000.
• Load the program with the L command instead of the R command .
.L VMSA??<CR>

The system loads the program into memory and displays the . (period) prompt.
The program is not executed at this time.

5-19

Diagnostics
• Press the Halt· button on the control panel. This places the system in console
emulator mode where control passes to the ODT program. The system displays
the ODT @ prompt.
• Open location 176.by typing 176 and pressing the I (slash) key. The system
displays the present contents of that location.

@176/000000
• Type the number specified by the program listing after the zeros (in this case,
1000).

@176/000000 1000<CR>
@
• Type 176/ again to make sure the change has been made. Press the Return
key.

@176/0010000<CR>
@

• Start the program at location 200 with the ODT Go command.

@200G
The system displays the program name and executes the program. When testing
is complete, the system displays END PASS and starts another pass.
• Press the Halt button to terminate the program. This returns control to the
ODT program.
• Press the Halt button again to exit from console emulator mode. Then press
the Restart button, which passes control back to the XXDP+ monitor program.
Modifying the program by this method affects only the system's memory; it does
not change the program on the diskette. Therefore it is not necessary to restore
the contents of the location after the program is completed.

5-20

Diagnostics
5.11

TROUBLESHOOTING THE BA23 ENCLOSURE

The startup diagnostics automatically run the CPU and memory module self-tests.
Table 5-1 and 5-3 lists the number produced by this testing and a probable FRU
failure. The user test and field service diskettes provide further testing of the
system. To isolate the problem to a failing FRU, follow the flowchart shown in
Figure 5-2. Refer to Chapter 6, FRU Removal and Replacement Procedures, for
the appropriate removal and replacement procedures.

5-21

(J1

05"

1'0

::J

o
IS MACHINE
}
OPERATIVE?
CAN CUSTOMERS RUN
THEI R SOFTWARE?

- --

HAVE CUSTOMER
}
RUN SYSTEM ERROR
LOG (AVAILABLE FOR
RT, RST$, RSXj TO

---

IS
DeOK
LED
ON

YES

(fJ

CHECK,
AC WALL SOCKET

NO
--

GET A LIST OF ERRORS

{

AC LINE CORD
AC CIRCUIT BREAKER
ON POWER SUPPLY
AC POWE R SWITCH

~USPECT

NO
BAD H7864
- - - POWER SUPPLY. REMOVE
AND REPLACE H7864.

RESTART SYSTEM
1NE TIME CLOCK SIGNAL AND TEST
BEVENT (ll, DC OK AND
P OK ARE POWER SUPPLY
OUTPUTS

NQ __ rREPLACE H7864

l!'0WER SUPPLY

YES

BAD DC OK
LED ON FRONT

Figure 5-2

Troubleshooting Flowchart (Sheet 1 of 2)

LOOK ON CPU SLU PANEL

OR MODULE FOR ERROR

NO
-

NUMBER IN LEOS ALSO,
SUSPECT CPU PATCH AND
FILTER PANEL TERMINAL
CABLE

') YES

.1 ~~~?x~~~ORI~~LATE
FAILING SUBSYSTEM

DIAGNOSE CPU/MEMORY/
LOAD DEVICE FAILURE.
RESET

CHECK BASIC SYSTEM CONFIGURATION
(MODULE JUMPERS, SWITCH SETTINGS, ETC)

- CPU
- MEMORY MODULE
- MB639 DISK CONTROLLER

DATA ERROR - SUSPECT BAD MEDIA
DRIVE ERROR - SUSPECT BAD RX50 THEN BAD MB639 CONTROLLER
CONTROLLER ERROR - SUSPECT BAD MB639 THEN BAD RX50 AFTER
CHECKING M8659 CONTROLLER LEDS

REPLACE SUSPECTED FRU AND RESTART

REMOVE/REPLACE
CPU Ma190

* DOES THE "FAIL TO
BOOT" MESSAGE
INDICATE ONE OF THE
FOLLOWING ERRORS:
, DATA ERROR
2 DRIVE ERROR
3 CONTROLLER ERROR

RUN INDIVIDUAL
DIAGS FOR 3 PASSES
EACH SUBUNIT:
- CPU
- MEMORY
- DZV·"
- RD/RX SUBSYSTEM
- OTHER OPTIONS

REMOVE/REPAIR/
RETEST AND
RETURN SYSTEM
TO CUSTOMER

...J

03"

co
~

N
c.u

.-+

Figure 5-2

Troubleshooting Flowchart (Sheet 2 of 2)

a"
en

FRU Removal and Replacement Procedures
6.1

INTRODUCTION

This chapter describes the removal and replacement procedures for the field
replaceable units (FRUs) in the BA23 enclosure. Figure 6-1 shows the major FRUs
as seen from the front of the enclosure. Table 6-1 lists FRUs and their part
numbers.
CAUTION
Static electricity can damage modules installed in the BA23
enclosure and in mass storage devices. Always use a grounded
wrist strap (DIGITAL P.N. 29-11762-00) and grounded work surface when you access any internal part of your microcomputer
system.
NOTE
Only qualified service technicians should perform any of these
removal and replacement procedures.

This chapter presents FRU procedures from the front to the rear of the enclosure.
NOTE
Unless otherwise specified, replace FRUs by reversing the order
of the removal procedures.

6-1

FRU Removal and Replacement Procedures

Table 6-1

Field Replaceable Units

Component

Order
DIGITAL P.N.

H7864 power supply
H7864-A power supply
Power supply ac power cable with ac switch
Dc fan
Dc fan power cable
Backplane assembly
Q22-Bus backplane
Signal distribution panel
Backplane dc power cord
Diskette drive
RX/RD power cable
RD51 fixed disk drive
RD52 fixed disk drive RD52-AA t
or
RD51 read/write module
RD52 read/write module
RD51 DIP shunt
RX50 signal cable
RD5n signal cable (20 wire)
RD5n signal cable (34 wire)
Front control panel
Control panel cable
630QA patch panel
SLU cable 10 pin
LED cable 20 pin

30-20444-00*
30-21749-01*
70-20434-01
12-17556-01
70-20449-00
70-19986-00
H9278-A
54-15633-00
70-20450-01
RX50-AAt
70-20435-1K
RD51-AAt
30-21721-02t
30-23227 -02t
29-24665-00
29-24992-00
29-24115-00
17-00285-02
17 -00282-00
17-00286-00
70-22007 -01
70-20451-1C
54-17644-01
17-00624-01
17-00712-02

6-2

FRU Removal and Replacement Procedures

Table 6-1

Field Replaceable Units (Cont.)

Component

Order
DIGITAL P.N.

Adapter plate
I/O distribution panel
Front bezel (rack mount)
Front bezel (floor/table)
Rear bezel
Pedestal (floor)
Enclosure plastic skins
Rack mount kit
Chassis support kit
Loopback connectors
KDFll-BE
KDF11-BP
KDJll-BC
MSV11-PK
DZV11
DZV11 cabinet kit
DLVJ1
DLVJ1 cabinet kit
DEQNA
DEQNA cabinet kit
RQDX1
RQDX2
Grant card
or

74-28684-01
70-19979-00
74-29501-01
74-29559-0
74-27560-0
74-27012-0
70-20469-01
70-22025-01
70-20761-01
12-15336-00
M8189
M8189
M8190
M8067
M7957
CK-DZVll-DB
M8043
CK-DLV]1-LB
M7504
CK-DEQNA-KB
M8639
M8639-YA
M9047
G7272

* A replacement power supply must have the same part number as the power supply you
removed.

t If you are adding one of these drives to a previously diskless system, you need to use the
RX50Q-AA, RD51Q-AA, and RD52Q-AA options. These options contain the drive and the
signal cables.

6-3

FRU Removal and Replacement Procedures

NOTES
1. Connectors J1 and J2 are located on the backplane (H9278-A)
assembly.
2. If the disk drive is not present, the power cable connector should
be plugged into J3 on the distribution panel.
3. If the disk drive is not present, the power cable connector should
be plugged into J4 on the distribution panel.
4. The rear fan cable is an integral part of the H7864 power supply.
5. The cable is an intergral part of the 7020695-01 assembly.
6. For four-slot MicroPDP-11/SV systems, the backplane part number
is H9278-B.

6-4

FRU Removal and Replacement Procedures
VIEW A-A
2 PLACES

REAR FAN
1217556-01

DISTRIBUTION PANEL
7019986-00

POWER
SUPPLY
UNIT
3020444-00
OR
3021749-01

FRONT FAN
1217556-01

7020449-00
SEE NOTE 3

RD51
OR
RD52

RX50

Figure 6-1

FRONT
CONTROL
PANEL
7020695-01

BA23 Enclosure FRUs

6-5

FRU Removal and Replacement Procedures

6.2

CONTROL PANEL REMOVAL

Use the following procedure to remove the control panel (Figure 6-2).
1. Unplug the ac power cord from the wall socket.

2. Remove the front plastic cover by holding each end and pulling the cover away
from the system.
3. Remove the front chassis retaining bracket.
4. Push the subsystem forward.
5. Remove the sUbsystem storage cover.

6. Remove the four screws retaining the control panel assembly.
7. Disconnect the 20-pin connector from the control panel.
8. Remove the power supply connector from J7 on the power supply.
To install a replacement control panel, use the following procedure:
1. Reverse steps 1 through 8.

2. Make sure the LTC switch and the Restart/Enable switch on the control panel
printed circuit board are set properly (see Chapter 1, BA23 Enclosure, Section
1.3.2).

6-6

FRU Removal and Replacement Procedures

-J

Figure 6-2 Remove the Control Panel
6-7

FRU Removal and Replacement Procedures

6.3

RXSO DISKETTE DRIVE REMOVAL

Use the following procedure to remove the RX50 diskette drive (Figure 6-3).
NOTES
The diskette drive is a single field replaceable unit (FRU). Do not
disassemble the diskette drive or remove any of the printed circuit boards. All adjustments must be made in a special test
configuration.
Only use formatted RXSOK diskette available from Digital Equipment Corporation and its licensed distributors.

1. Remove both covers and the ac power cord.

2. Remove the front chassis retaining bracket.
3. Push the subsystem forward.
4. Remove the subsystem storage cover.
5. Disconnect the signal cable and the dc power cable from the diskette drive by
pulling straight up on the connectors.
6. Push down on the release tab, slide the RX50 diskette drive forward, and
remove the drive.
NOTE
Remove the cardboard shipping insert from a newly installed
RXSO diskette drive.

6-8

FRU Removal and Replacement Procedures

Figure 6-3

RX50 Diskette Drive Removal

6-9

FRU Removal and Replacement Procedures

6.4

RDSn FIXED DISK DRIVE REMOVAL

Use the following procedure to remove an RD5n fixed disk drive (Figure 6-4).
CAUTION
Handle any fixed disk drive with care. Dropping or bumping the
drive can damage the disk surface.
NOTES
Package any disk drive to be returned in the replacement disk
drive's shipping carton. If the shipping carton is not available,
one may be ordered (DIGITAL P.N. 99-9004S-01).
You must format a newly installed RDSn disk drive before testing the system and using the drive. Refer to Appendix C for
formatting instructions for your system.
1. Remove both covers and the ac power cord.

2. Remove the front chassis retaining bracket.
3. Push the subsystem forward.
4. Remove the subsystem storage cover.
CAUTION
The RDS1 fixed disk drive has an exposed head positioner flag
on the front right side. DO NOT touch this area. Doing so can
cause the head positioner flag to rotate, resulting in damage to
the drive.
NOTE
An RDS2 disk drive does not have an exposed head positioner
flag.

5. Remove the power plug and two ribbon cables from the RD5n drive.
6. Push down on the release tab, slide the RD5n disk drive forward, and remove
the drive.

6-10

FRU Removal and Replacement Procedures

7. To configure an RD52 drive as DUO, make sure the jumper clip is set at DS3
(Figure 6-5). To configure an internal RD52 drive as DUl, place the jumper clip
on DS4.
8. To configure an RD53 drive as DUO, depress switch 3. To configure an RD53
drive as DUl, depress switch 4. The switch pack is located on the rear edge of
the RD53 read/write board.

Figure 6-4

RD5n Removal (RD5l Disk Drive Shown)

6-11

FRU Removal and Replacement Procedures

...

FRONT OF DRIVE

o 0R9llo

mJ
DS! I DS3 I
REAR OF DRIVE

DS2

DS4

...

REAR OF DRIVE

Figure 6-5 Set the RD52 Jumper Clip
NOTE
Only format a fixed disk drive when you replace a complete
RD5n drive assembly. Refer to Appendix C for instructions.

Write-protect any other RD5n disk drives that may be present before you format a
newly installed RD5n disk drive. Remember to write-enable these additional RD5n
disk drives when formatting the new RD5n disk drive is complete.
6.4.1

RD51 Disk Drive Read/Write Board Removal

The RD51 read/write board is the only part of an RD51 drive that is replaceable.
Always try replacing the read/write board before you replace an entire RD51 disk
drive.

1. Remove the four Phillips screws retaining the skid plate. Set the skid plate aside
(Figure 6-6)
2. Using a 3/32-inch Allen wrench, remove the four screws that hold the
read/write printed circuit board to the fixed disk drive (Figure 6-7).
3. Disconnect connector P5 from the side of the board.

6-12

FRU Removal and Replacement Procedures

DO NOT
TOUCH

Figure 6-6

Figure 6-7

RD51 Disk Drive Skid Plate Removal

RD51 Disk Drive Allen Screws and Connector P5 Removal

6-13

FRU Removal and Replacement Procedures

4. Disconnect connectors P6, P7, and P8 from the front of the read/write printed
circuit board (Figure 6-8).
5. Disconnect connector P4, a 2-wire connector found on the rear of the read/write
printed circuit board next to the dc power connector.
6. Remove the fixed disk drive read/write board.
7. Make sure the jumper configuration of the 14-pin DIP shunt pack matches the
listing in Table 6-2.

Figure 6-8

6-14

RD51 Disk Drive Connectors P6, P7, P8, and P4

FRU Removal and Replacement Procedures

Table 6-2
RD51 Jumper Configuration
Pin Numbers
Pin Connection
1 to 16

Not used*

2 to 15
3 to 14
4 to 13
5 to 12
6 to 11
7 to 10
8 to 9

In
In
In
Out

Out
Out

* Place the 14-pin DIP jumper pack in the rear 14 receptacles
of the 16-pin socket (Figure 6-9).

•

REAR OF DRIVE

87_
6_
5_
4_
3
2_
1

[IJ
[IJ

a:J
[I]

a:J
a:J
cr:J

-9
_10
_11
_12

_13
_14
_15
16

-~:ED

FRONT OF DRIVE

REAR
OF
DRIVE

Figure 6-9

DIP Shunt Pack Setting

NOTE

You do not need to format an RD51 disk drive when you only
replace the read/write board.
6-15

FRU Removal and Replacement Procedures

6.4.2

RD52 Main Printed Circuit Board Removal
NOTES
Replace the main printed circuit board (MPCB) only on RD52
disk drives with a DIGITAL P.N. of 30-21721-02.
Screws located on the slide plate and MPCB are different sizes.
Make sure you reinstall the screws in their proper location.

1. Remove the four Phillips screws retaining the slide plate and ground clip. Set
the slide plate aside (Figure 6-10).

Figure 6-10

Remove the Slide Plate

2. Unplug the 2-pin connector (Figure 6-11).
3. Remove the two Phillips screws that attach the front bezel to the drive.

6-16

FRU Removal and Replacement Procedures

Figure 6-11

Remove the 2-Pin Connector and Screws

4. Remove the front bezel by pulling it away from the drive. The bezel is held in
place with pop fasteners (Figure 6-12).

Figure 6-12

Remove the Front Bezel

6-17

FRU Removal and Replacement Procedures

5. Remove the three Phillips screws from the heatsink, grounding strip, and the
corner opposite the heatsink (Figure 6-13).

Figure 6-13

Remove Phillips Screws from Heatsink

6. Lift the MPCB straight up until it clears the chassis. This disconnects P4, a
12-pin fixed plug (Figure 6-14).
7. Disconnect P5, a 10-pin connector.

6-18

FRU Removal and Replacement Procedures

Figure 6-14

Remove the MPCB

6-19

FRU Removal and Replacement Procedures

6.4.3

RD53 Disk Drive Read/Write Board Removal

The RD53 read/write board is the only part of an RD53 drive that is replaceable.
Always try replacing the board before you replace an entire RD53 disk drive.
1. Remove the four Phillips screws retaining the slide plate and ground clip. Set

the slide plate aside (Figure 6-15).
2. Loosen the two captive screws holding the board in place.
3. Rotate the board upward (the board pivots in hinge slots at the front of the
drive). Tilt the board until it comes to rest against the outer frame. Be careful
not to strain any connectors or cables.
4. Disconnect the motor control board connector J8 and the preamplifier board
connector J9 from the read/write board. Handle with care.
5. Lift the read/write board out of the hinge slots.
NOTE

Make sure to set the jumpers and switches for the new board to
the same position as the old one.

6-20

FRU Removal and Replacement Procedures

READ/WRITE BOARD

MOTOR
CONTROL BOARD

Figure 6-15

RD53 Read/Write Board Removal

6-21

FRU Removal and Replacement Procedures

6.5

BACKPLANE ASSEMBLY REMOVAL

To remove the backplane assembly, use the following procedure:
1. Remove the front and rear covers and all cables. Label them for reinstallation
later.

2. Remove the rear retaining bracket and slide the subsystem completely out
through the back.
3. Remove both the subsystem storage cover and the Q22-Bus module cover
(Figure 6-16).

6-22

FRU Removal and Replacement Procedures

Figure 6-16

Accessing the Backplane

6-23

FRU Removal and Replacement Procedures

4. Open the rear I/O panel assembly by loosening the two captive screws. Disconnect any cables attached to the I/O panel. Label them for reinstallation
later. Note the orientation of the red stripe on any cables you remove.
5. Remove all modules (Figure 6-17). Refer to Section 6.9 for instructions,
6. Remove the cowling (if present) from the front fan.
7. Remove any RX50 and RD5n disk drives that may be present (see Sections
6.3 and 6.4).
8. Remove the RX50 and RD5n disk drive signal cables from 16,12, and 17 on
the signal distribution panel.
9. Remove all power supply connectors and front control panel connectors from
11, ]4, and 12 on the signal distribution panel and from 19 on the power supply.

FRU Removal and Replacement Procedures

Figure 6-17

Removing Cables and Modules

6-25

FRU Removal and Replacement Procedures

10. Loosen the two screws retaining the small access cover. Remove the cover
and disconnect the cable from side two of the backplane (Figure 6-18).
11. Remove the four screws holding the backplane assembly to the chassis.

Figure 6:18 Removing Access Cover and Screws
12. Pivot the CD side of the backplane assembly 45 degrees toward the rear and
lift it straight up (Figure 6-19).

Figure 6-19 Removing the Backplane

6-26

FRU Removal and Replacement Procedures

6.6

POWER SUPPLY (H7864-A/H7864) REMOVAL

To remove the power supply (Figure 6-20), use the following procedure:
NOTE
The H7864-A and H7864 power supplies are not adjustable, nor
do they contain replaceable printed circuit boards. The +5 Vdc
and +12 Vdc regulators are fixed. Voltage tolerance is +5.1 Vdc
(±2.5%)for the +5 Vdc regulator, and +12.1 Vdc (±2.5%) for the
+12 Vdc regulator. Ripple is 50 mV peak-to-peak at +5 Vdc, and
75 mV peak-to-peak at +12 Vdc.

1. Remove the front and rear covers and all cables.

2. Remove the rear chassis retaining bracket and slide the subsystem completely
out through the back.
3. Remove the subsystem storage cover.
4. Remove the fan cowling and cowling holder (if present).
5. Disconnect the backplane power connector from J9 on the power supply and ]1
on the signal distribution panel.
6. Disconnect the mass storage power connector from J8.
7. Disconnect the front fan power connector, and the front control panel power
connector, from]10 and J7. These connectors are keyed and have a locking
assembly.
8. Remove the five screws holding the power supply to the chassis.
9. Lift the power supply assembly out of the chassis and rest it on top of the
Q22-Bus modules cover (Figure 6-21).
10. Disconnect the power connector from the rear cooling fan.

FRU Removal and Replacement Procedures

Figure 6-20 Power Supply Removal

6-28

FRU Removal and Replacement Procedures

Figure 6-21

Remove Power Supply and Fan Connector

To install a replacement power supply, use the following procedure:
1. Place the replacement power supply on top of the Q22-Bus module cover and
connect the rear fan power cable.
CAUTION
The rear fan power cable is not keyed. Observe the polarity of
the connector. The curve of the connector must match the curve
of the fan housing (Figure 6-22).

6-29

FRU Removal and Replacement Procedures

Figure 6-22

Install Rear Fan Power Cable

2. Place the power supply in position. Make sure you route the rear fan cable over
the top of the rear fan (Figure 6-23).
3. Reverse steps 1 through 8 of the removal procedure to finish installing the
power supply.

-\MI
. . .~
~

o
____________

Figure 6-23
6.7

----

Rear Cooling Fan Power Cable Position

REAR COOLING FAN REMOVAL

To remove the rear cooling fan (Figure 6-24), use the following procedure:
1. Remove the front and rear covers and all cables.

2. Remove the rear retaining bracket and remove the subsystem from the
enclosure.
3. Remove the power supply unit and disconnect the rear fan power connector
(refer to Section 6.6).
4. Remove the four screws and spacers that hold the fan to the chassis and remove
the fan.

6-30

FRU Removal and Replacement Procedures

Figure 6-24

Remove the Fan from the Chassis

To install a rear replacement fan, use the following procedure:
1. Relocate the four screws and place the fan guard on the screws. Make sure the
cross members of the fan guard face the inside of the unit (Figure 6-25).

2. Place the spacers on the screws and secure the fan. Make sure the fan is
oriented as shown. The airflow must be away from the power supply.
3. Reverse steps 1 through 3 of the removal procedure.
CAUTION
The rear fan power cable is not keyed. Observe the polarity of
the connector. The curve of the connector must match the curve
of the fan housing as shown in Figure 6-22.

6-31

FRU Removal and Replacement Procedures

Figure 6-25
6.8

Install the Rear Fan

FRONT FAN REMOVAL

To remove the front fan (Figure 6-26), use the following procedure:
1. Disconnect the ac power cable and remove the front cover.

2. Remove the front retaining bracket and push the subsystem forward.
3. Remove the subsystem storage cover.
4. Remove the front fan cowling (if present).
5. Disconnect the front fan power cord from ]10 on the power supply and from the
fan.

6-32

FRU Removal and Replacement Procedures

Figure 6-26

Disconnect the Front Cooling Fan

6. Remove the four screws and spacers that hold the fan and fan guard to the
chassis and remove the fan (Figure 6-27).

6-33

FRU Removal and Replacement Procedures

Figure 6-27

Remove the Front Cooling Fan

To install a replacement front fan, use the following procedure:

1. Remove the power cable and fan guard (if present) from the intake side of the
old fan and fit them to the replacement fan (Figure 6-28).
CAUTION
The front fan power cable is not keyed. Observe the polarity of
the connector. The curve of the connector must match the curve
of the fan housing as shown in Figure 6-28.

Figure 6-28

6-34

Connect the Front Fan Power Cable and Fan Guard

FRU Removal and Replacement Procedures

2. Relocate the four screws and place the fan guard on the screws. Make sure the
cross members of the fan guard face the inside of the unit (Figure 6-29).
3. Place the spacers on the screws and secure the fan. Make sure the fan is
oriented as shown. The airflow must be away from the mass storage area.
4. Reverse steps 1 through 6 of the removal procedure to finish installing the front
cooling fan.

Figure 6-29

Install Replacement Fan

6-35

FRU Removal and Replacement Procedures

6.9

MODULE REMOVAL

To remove modules from the BA23-A enclosure (Figure 6-30), use the following
procedure:
CAUTION
Static electricity can damage modules. Always use a grounded
wrist strap and grounded work surface when working with or
around modules.

Remove and install modules carefully to prevent damage to module components,
other modules, or possibly changing the switch settings.
Replacement modules come wrapped in special antistatic packaging material. A
silica gel packet is also included to prevent damage from moisture. Use this antistatic packaging material and silica gel packet to protect any modules you store,
transport, or return.
If you install dual-height modules in slots 1, 2, or 3 of the BA23-A backplane, you
must install them in rows A and B.
If you install dual-height modules in slots 4 through 8 of the BA23-A backplane,
you must install a grant continuity card (M9407) in rows A or C if a second dualheight module is not installed in the same slot.

6·36

FRU Removal and Replacement Procedures

Figure 6-30

Module Removal

6-37

FRU Removal and Replacement Procedures

1. Remove the ac power cable from the wall outlet.

2. Remove the rear cover and all cables. Label all cables for reinstallation later.
3. Loosen the two screws retaining the rear I/O panel assembly. Swing the assembly open and remove the ground strap screws.
4. Disconnect any cables attached to the back of the I/O panel assembly. Note their
specific location and the orientation of the red stripe on each cable.
5. Slide the modules partially out of the backplane and remove any cables that are
present. Note the orientation of the red stripe on each cable.
6. Remove the module from the chassis.
NOTE
Q22-Bus quad-height modules have levers at each end used to
lock the module in place and to assist in releasing the module
from the backplane. Figure 6-31 shows the operation of these
ejector levers.

6-38

FRU Removal and Replacement Procedures

Figure 6-31

Quad-Height Module Ejector Levers

To install modules, use the following procedure:
1. Make sure you set the jumper and switch configuration of the replacement

modules correctly. Check the setting agamst the old module or refer to the
user's or installation guide supplied with the new module (also see Chapter 3,
System Options).
2. Reverse step 1 through 6 of the removal procedure.
3. Retest the system to confirm that the system is working correctly. Refer to
Chapter 3, Troubleshooting, of your system owner's manual for instructions.

6-39

FRU Removal and Replacement Procedures

6.10

REAR I/O INSERT PANEL REMOVAL

To remove a rear 1/0 insert panel (Figure 6-32), use the following procedure:
1. Remove the ac power cord for the wall outlet.

2. Remove the rear cover and all cables attached to the insert that is to be
removed. Label the cables for reinstallation later.
3. Loosen the two screws retaining the rear I/O panel assembly. Swing the assembly open and remove the ground strap screws.
4. Disconnect any cables attached to the insert panel. Note the orientation of the
red stripe on each cable (not shown).
5. Remove the four screws holding the insert panel to the rear 1/0 panel assembly
and remove the insert.

6-40

FRU Removal and Replacement Procedures

Figure 6-32

Rear I/O Insert Panel Removal

6-41

Appendix A
Backplane Pin Assignments
Digital Equipment Corporation's plug-in modules, including those installed in the
MicroPDP-ll systems, all use the same contact (pin) identification system. Figure
A-I shows the contact finger identification for a typical quad-height module. Each
connector contains 36 lines (18 lines on each side of the printed circuit board).
Tables A-I to A-8 list the backplane pin assignments for modules installed in the
MicroPDP-ll systems.

~IN

PIN( '

AAI

AA2
ROW A
AV2
v'

AVI
'--J

BAI

BA2
ROWB
BV2
v'

BVI

CAl

CA2
ROWC
CV2

CVI

'-J
SIDE I
COMPONENT SIDE

DA2

DAI
ROW 0
DVI

'-J

Figure A-I

DV2

Quad-Height Module Contact Finger Identification

A-1

Backplane Pin Assignments
KDJll-B (M8190)/KDFll-BE (M8189) Module Backplane Pin
Assignments (Rows A and B)
B Connector:
Bus Pin
A Connector:
Side 1
Side 2
Side 1
Side 2
BDCOK H
BIRQ5 L
A
+5 V
+5 V
BPOK H
BIRQ6 L
B
BDALl6 L
GND
BDALl8 L
GND
C
BDALl9 L
+12 V
D
BDALl7 L
+12 V
BDAL02 L
E
BDOUT L
BDAL20 L
SRUN L
BRPLY L
BDAL21 L
BDAL03 L
F
PUP CDl] L
BDAL04 L
H
SRUN L
BDIN L
]
BDAL05 L
GND
BSYNC L
GND
BWTBT L
BDAL06 L
K
BIRQ4 L
BDAL07 L
L
BDAL08 L
GND
MCENB H
GND
M
BIAK L
BSACK L
BDAL09 L
BDMRL
N
BIRQ7 L
BDALlO L
P
BHALT L
BBS7 L
BE VENT L
BDALll L
R
BREF L
BDMGO L
BDALl2 L
S
BDALl3 L
BINIT L
GND
T
GND
BDALOO L
BDALl4 L
U
BDALOI L
BDALl5 L
V
+5 V
- Pins not used.
Table A-I

Table A-2
Bus Pin
A
B
C
D
E
F
H

KDJll-B (M8190)/KDFll-BE (M8189) Module Backplane Pin
Assignments (Rows C and D)
C Connector:
D Connector:
Side 1
Side 2
Side 1
Side 2
+5 V
+5 V
GND

GND

K
L
M
N
P
R
S
GND
T
U
V
- Pins not used.

A-2

BIAKI L
BIAKO L
BDGMI L
BDGMO L
GND

Backplane Pin Assignments
Table A-3
Bus Pin
A
B
C
D
E
F
H

MSVll-PK (M8067) Module Backplane Pin Assignments
(Rows A and B)
A Connector:
B Connector:
Side 2
Side 1
Side 2
Side 1
BDCOK
H
+5
V
+5 V
BDALl6 L
DBALl7 L
+5 V BBU

GND
+12 V
BDOUT L
BRPLY L
BDIN L
BSYNC L
BWTBT L

BDALl8 L
BDALl9 L
BDAL20 L
BDAL21 L

GND
+12 V
BDAL02 L
BDAL03 L
BDAL04 L
BDAL05 L
BDAL06 L
BDAL07 L
BDAL08 L
BDAL09 L
BDALlO L
BDALl1 L
BDALl2 L
BDALl3 L
BDALl4 L
BDALl5 L

GND
GND
-5 V MEAS*
REF KILL
K
L
-5 V MARGIN*
BIAKI Lt
GND
GND
M
N
BIAKO Lt
P
BBS7 L
BDMGI Lt
BREF L
R
S
+12 V BBU
BDMGO Lt
T
GND
BINIT L
GND
SA16K:j:
U
BDALOO L
+5 V BBU
BDALOl L
V
+5 V
- Pins not used.
* Must be hardwired on backplane or damage to MOS device may result.
t Hardwired via etch on module.
:j: When SA16K (starting address 16 K) jumper is removed, there is no connection to this
pin (used in memory test only).
Table A-4
Bus Pin
A
B
C
D
E
F
H

MSVll-PK (M8067) Module Backplane Pin Assignments
(Rows C and D)
D Connector:
C Connector:
Side 1
Side 2
Side 1
Side 2
+5 V

K
L
M
N
P
R
S
T
U

BIAKI L*
BIAKO L*
BDGMI L*
BDGMO L*

- Pins not used.
* Jumpered on module.

A-3

Backplane Pin Assignments
Table A-5
Bus Pin
A
B
C
D
E

DZVll-A (M7957) Module Backplane Pin Assignments
(Rows A and B)
A Connector:
B Connector:
Side 1
Side 2
Side 1
Side 2
BDCOK H
+5 V
+5 V

F
H
J
K
L
M
N
P
R
S
T

GND

V
- Pins not used.

Table A-6
Bus Pin

A
B
C
D
E
F

GND
+12 V
BDOUT L
BRPLY L
BDIN L
BSYNC L
BWTBT L
BIRQ L
BIAKI L
BIAKO L
BBS7 L
BDMGI L
BDMGO L
BINIT L
BDALOO L
BDALOI L

+5 V

DZVll-A (M7957) Module Backplane Pin Assignments
(Rows C and D)
C Connector:
D Connector:
Side 1
Side 2
Side 1
Side 2
+5 V

K
L
M
N
P
R
S
T

U
V
- Pins not used.
* Jumpered on module.

A-4

GND

GND
+12 V
BDAL02 L
BDAL03 L
BDAL04 L
BDAL05 L
BDAL06 L
BDAL07 L
BDAL08 L
BDAL09 L
BDALlO L
BDAL11 L
BDAL12 L
BDAL13 L
BDAL14 L
BDAL15 L

BIAKI L*
BIAKO L*
BDGMI L*
BDGMO L*

Backplane Pin Assignments
RQDXl (M8369) Module Backplane Pin Assignments
(Rows A and B)
Bus Pin
A Connector:
B Connector:
Side 1
Side 2
Side 1
Side 2
A
+5 V
+5 V
B
BPOK L
C
BDALl6 L
GND
BDALl8 L
GND
D
DBALl7 L
BDALl9 L
+12 V
+12 V
E
BDOUT L
BDAL02 L
BDAL20 L
F
BRPLY L
BDAL21 L
BDAL03 L
H
BDIN L
BDAL04 L
BSYNC L
BDAL05 L
GND
GND
J
K
BDAL06 L
BWTBT L
L
BIRQ4 L
BDAL07 L
M
GND
BIAKI L
GND
BDAL08 L
BIAKO L
BSACK L
BDAL09 L
N
BDMR L
P
BDALlO L
BBS7 L
R
BDALll L
BREF L
BDMGI L
BDMGO L
BDALl2 L
S
T
GND
BDALl3 L
BIN IT L
GND
U
BDALOO L
BDALl4 L
V
BDAL01 L
BDAL15 L
+5 V
- Pins not used.
Table A-7

Table A-8
Bus Pin
A
B
C
D
E
F
H
J
K
L
M
N
P
R
S

RQDXl (M8639) Module Backplane Pin Assignments
(Rows C and D)
C Connector:
D Connector:
Side 1
Side 2
Side 1
Side 2
+5 V
+5 V
GND

GND
GND

GND
U
V
- Pins not used.
* Jumpered on module.

GND

GND
BIAKI L*
BIAKO L*

GND

BDGMI L*
BDGMO L*
GND

A-5

l"ogk~a~

B.1

Appendix B
lJnH Number Designation

DISK UNIT NUMBER DESIGNATION

The microcode of the first RQDX1, RQDX2, or RQDX3 module labels the associated disk units as DUO, DU1, DU2, and DU3. Table B-1 shows these disk unit
designations for the MicroPDP-ll and PDP-ll/23 PLUS systems when add-on disk
units are associated with the system. Make sure you label each disk unit. Drive
unit labels come with the base computer system.
An RQDX1 module supports only two fixed disk drives and one RX50 diskette
drive.
An RQDX2 module supports only four fixed disk drives or two fixed disk drives and
one RX50 diskette drive.

Table B-1
Disk Unit Designation
Disk Drive(s)
MicroPDP-11

PDP-ll/23 PLUS

Internal RX50

DUO,DU1

N/A

Internal RX50
and
Add-On RX50

DUO,DU1

N/A

DU2,DU3*

N/A

Internal RX50
and
Internal RD5n

DU1,DU2

N/A

DUO

N/A

Internal RX50
and
Internal RD5n
with
Add-On RD5n

DU2,DU3

N/A

DUO

N/A

DU1

N/A

8-1

Logical Unit Number Designation

Table B-1
Disk Unit Designation (Cont.)
Disk Drive(s)
MicroPDP-11
PDP-ll/23 PLUS

No internal
Add-On RX50t

N/A

DUO,DUI

Add-On RD5n

N/A

DUO

No internal
Add-On RX50
and RX50

N/A
N/A

DUO,DUI
DU2,DU3

No internal
Add-On RX50
and RD51/52

N/A
N/A

DUl,DU2
DUO

No internal
Add-On RD5n
and RD5n

N/A
N/A

DUO
DUI

No internal
Add-On RD5n
and RD5n
and RX50

N/A
N/A
N/A

DUO
DUI
DU2,DU3

No internal

* Refer to the RQDXl Owner's Manual for correct jumper settings. Jumper setting should
be done by trained field service personnel.

t Refer to the llC23-UC, llC23-UE Upgrade Installation Guide for specific requirements
for PDP-ll/23 PLUS systems.

8-2

Logical Unit Number Designation

B.2

LOGICAL UNIT NUMBERS (LUN)

The logical unit numbers and the LUN jumpers provide for future expansion capability of more than one RQDX module per system. Jumpers on the RQDX controller module select the LUN. These jumpers determine the lowest unit number
assigned to any RD5n and RX50 disk drives present in the system.
The RQDX module automatically sizes the logical unit configuration during initialization of the system to determine how many of the four possible units are actually
present. The microcode automatically assigns disk unit numbers to any drives that
are present. An RX50 diskette drive is two units. Table B-2 shows the standard
LUN jumper configuration.

Table B-2
RQDX Standard Logical Unit Number Configuration
LUN Jumper
State
Unit Number
LUN 0
LUN 1
LUN 2
LUN 3
LUN 4
LUN 5
LUN 6
LUN 7

Out
Out
Out
Out
Out
Out
Out
Out

0-3*

* Indicates that logical unit numbers 0-3 are assigned to this controller module. The controller automatically determines if less than four logical units are present. The system
software displays these as DUO-DU3 on the screen.

The LUN jumper format allows you to set the starting number anywhere from
zero and up. Only one jumper setting per module is allowed. Use the format in
Table B-3 to configure a module with a starting LUN of other than zero.

B-3

Logical Unit Number Designation

RQDX Logical Unit Number Jumper Configuration
Table B-3
Jumper Setting
First Unit
7
4
3
2
1
0
6
5
1)
2
Number
(128
64
32
16
8
4
0
0
0
0
0
0
0
0
0
0

0
0
0
0
0
0
0
0
0
0

0
0
0
0
0
0
0
0
1
1

0
0
0
0
1
1
1
1
0
0

0
0
1
1
0
0
1
1
0
0

0
1
0
1
0
1
0
1
0
1

0
1
2

3
4
5
6

7
8
9

Table B-4 shows an example of unit number designation when LUN jumper 4 is
installed.

Table B-4
Jumper
Installed
4

8-4

RQDX Unit Number and Jumper Format
Unit Number
Specified
16 = first unit
17 = second unit
18 = third unit
19 = fourth unit

Appendix C
Forrnatting a MicroPDP-ll System
C.1

PROCEDURE

Before you start this procedure, make sure you write-protect any other fixed disk
drives present in the system.
(User responses are in bold.)
Insert the Field Service Test Diskette 4 (CZXD4DO) in drive. Press the Return
key.
Type R ZRQB?? after the. (period) prompt. Press the Return key.
This runs the diagnostic program. The question marks allow any revision of the
program to be used. When formatting an RD52 make sure you have Version 5 or
later. Earlier versions format the RD52 or RD53 as though they were an RD51
(11 Mbytes).
A response similar to the following appears on the terminal.
DR>

You must respond to this prompt with a command to run the program.
Type START. Press the Return key. Then answer the following question.
CHANGE HW (L)?

This is a program that answers hardware question and is prebuilt to format unit 0
with default answers.
Type N (no). Press the Return key.
CHANGE SW (L)

This program answers software questions.
Type N. Press the Return key.
ENTER DATE (in mm-dd-yy format) (A)?

Type the current date. For example, 06-15-85. Press the Return key.

C-1

Formatting a MicroPDP-11 System

ENTER UNIT NUMBER TO FORMAT <0>

This is usually either drive unit 0 or 1. Type 0 if you are formatting the first fixed
disk drive installed on the system. Type 1 if you are formatting the second disk
drive installed on the system. See Appendix B, Logical Unit Number Designations,
for additional information.
TYJ3e 0 or 1. Press the Return key.
USE EXISTING BAD BLOCK INFORMATION?

This activates the reformat mode - reads the manufacturer's information on the
disk and cylinder.
Type Y (yes). Press the Return key.
NOTE
The program takes approximately 12 minutes to complete. The N
(no) response takes approximately 30 minutes to complete.
CONTINUE IF BAD BLOCK INFORMATION IS INACCESSIBLE

Type Y (yes). Press the Return key.
ENTER A NON-ZERO SERIAL NUMBER:

Type your serial number (located on the top of the disk drive). Press the Return
key.
The system displays a message similar to the following;
FORMAT BEGUN

After about 12 minutes, the system displays a completion message similar to the
following;
FORMAT COMPLETED

Remove the diskette.
If formatting is not successful, the system displays a message when the error

occurs.
C.2

FORMATTING HELP AND INFORMATION

The following is a list of messages generated by the formatter, their probable
cause, and what to do. Errors 1, 2, and 3 occur almost immediately; error 4 can
occur up to 1 minute after starting; error 5 from 1 to 10 minutes; and errors 6
and 7, after 10 minutes.

C-2

Formatting a MicroPDP-11 System

(1) UNIT IS NOT WINCHESTER OR CANNOT BE SELECTED,

Unit selected is either unavailable or is an RX50. Check to make sure the fixed
disk is not write-protected.
Make sure the jumper on the disk drive is set correctly (see Chapter 6, FRU
Removal and Replacement Procedures).
(2) INITIAL FAILURE ACCESSING FCT(2)

The Format Control Table cannot be read. Try Reconstruct mode; see Section C.3
for information. If that fails, replace the disk.
(3) FACTORY BAD BLOCK INFORMATION IS INACCESSIBLE

Occurs only in reformat mode when bad block data is not accessible. Run in Reconstruct mode; see Section C.3 for information.
(4) SEEK FAILURE DURING ACTUAL FORMATTING

There is a hardware error. Check for hardware problems.
(5) REVECTOR LIMIT EXCEEDED

The disk is bad. Replace the disk.
(6) RCT WRITE FAILURE

Write to disk failed after successful formatting and surface analysis. Check
write-protect status.
(7) FAILURE CLOSING FCTS

Disk is marked as unformatted.
C.3

FORMATTING MODE

Three questions select the type of format mode that is run; reformat, restore, or
reconstruct mode. In order the three questions are:
1. Use existing bad block information?

2. Down-line load?
3. Continue if bad block information is inaccessible?
The first two questions determine which mode is run. The second question does
not appear unless the first question is answered N (no). An answer of N to question 3 causes the diagnostic to stop and print a message if a bad spot is found.

C-3

Formatting a MicroPDP-11 System

• REFORMAT MODE - If your answer to question 1 is Y, no further questions
are asked. The format program reads the manufacturer's bad blocks from a
block on the disk. It then formats all of the disk except for these bad blocks.
This takes about 12 minutes. If it fails, try restore mode.
• RESTORE MODE - If your answer to question 1 is N, the program asks you
to type in a list of the bad blocks. It then formats all of the disk except for the
bad blocks you specify. You can input the bad blocks using the list that comes
with the drive. It asks you for the serial number. This number is found on the
top of the RD52 disk drive. The program only allows you to type in the last
eight digits of the serial number. Restore mode takes about 15 minutes.
• RECONSTRUCT MODE - If you answer N to both questions 1 and 2, the
program searches the disk and identifies all of the bad blocks. It does not use
the manufacturer's bad block information. It then formats all of the disk except
for the bad blocks it identified. This takes about 30 minutes.

C-4

Appendix D
Configuration Worksheet
0.1

INTRODUCTION

This appendix provides instructions and a sample worksheet for generating floating
CSR addresses for modules installed in Q-Bus systems. Samples are shown in Table
D-1 of the following systems:

Sample 1 CSR

Sample 2 CSR

Sample 3

CSR

DPV11
MSCP
DHV11
DMSCP*
DHV11

DZV11
DPV11
DMV11
DPV11
DMV11
DMSCP
TMSCPt
DHV11

1st DZV11
2nd DZV11
3rd DZV11

17760100
17760110
17760120

17760270
17760334
17760520
17760374
17760540

17760100
17760310
17760340
17760330
17760360
17760414
17760540

* DMSCP - Disk mass storage control protocol device.
t TMSCP - Tape mass storage control protocol device.

Table D-2 is a blank worksheet for you to copy and use when you determine the
configuration of a system.
0.2

INSTRUCTIONS

Use the following procedure for generating floating CSR addresses for Q-Bus
systems.
Table D-1 is ranked from 1 to 34 where rank one is the highest rank. The octal
value for each rank is located in the column labeled Octal Size (in bytes). Use the
following rules when you are adding octal values of 20 and 40.

0-1

Configuration Worksheet

0.2.1

Rules for Adding Octal Values of 20 and 40

1. When the octal value of a rank is 20, you can only enter an address of nOO, n20,
n40, or n60. Enter the next possible address for that rank (see the examples in
Table D-l), at ranks 11 and 12, 23 and 24, and 30 and 31.
2. When the octal value of a rank is 40, you can only enter an address of nOO or
n40. Enter the next possible address for that rank. See the example in
Table D-1 at ranks 26 and 27.
0.2.2

Procedure

1. Find the highest ranking module with a floating CSR to be installed in the

system; assign this module its first possible floating address. Table D-1 shows
the CSR address of installed modules in brackets ([ D.
2. If you are installing more than one module of the same type, assign a CSR
address to each additional module. Determine these CSR addresses by adding
the octal value for that module to the previous address you assigned.
Table D-1, sample 3, shows the CSR addresses for three DZV11 mbdules installed
in a system.
3. Assign a "blank" value after the last module of each type that you install.
Determine the "blank" value by adding the octal size value for that module to
the last address you have assigned for the module. "Blank" values are shown in
braces ({ }) (see the entries at rank 8, Table D-1).
4. Add the octal size value of the next lower rank to the "blank" value and enter
the sum. This number becomes your new working number. Make sure you
observe the rules for octal values of 20 and 40.
5. Add the octal size value for each rank as you move down the list to the next
module you are installing in your system. Observe the rules for octal values of
20 and 40.
6. If the sum of your working number and the next octal size value exceeds n74,
the next entry starts the next block of 100s. For example, if the sum equals
280, your next entry is 300.

D-2

Configuration Worksheet

Table D-l

Sample Worksheet for Generating CSR Addresses
First
Octal
First
Possible
Size
Rank
(in
Fixed
Floating
Sample
Sample
No.
Module Address
bytes) 1
2
Address

Sample

17760010

17760020

17760030

17760040

17760050

17760060

17760070

17760100

[100]{llO} [100]{llO} [120]{130}

17760110

120

140

17760120

130

150

17760130

140

160

17760140

160

200

17760150

17760160

200

220

17760200

220

240

17760210

230

250

17760220

240

260

17760230

250

270

17760240

260

300

17760250

270

310

17760260

300

320

17760270

[270]{300} [310]{320} [330]{340}

17760300

310

330

17760320

320

[340]{360} [360]{400}

17760330

330

370

17760334

[334]{340} [374]{400} [414]{420}

DUVII

DZV11

N/A

17774400

N/A

17777170

DPV11

N/A

23
24

DMV11

N/A

25
26

DMSCP

17772150

170

210

350
410

0-3

Configuration Worksheet
Sample Worksheet for Generating CSR Addresses (Cont.)
First
Octal
First
Possible
Size
(in
Rank
Sample
Fixed
Floating
Sample
Sample
No.
Module Address
Address
bytes) 1
2
3

Table D-l

17760340

400

440

17760360

420

460

17760400

460

500

17760404

464

504

[504]{51O}

17760420

500

520

17760440

[520]{540} [540]{560} [540]{560}

17760500

600

17760540

640

TMSCP

17774500

31
32

0.3

DHV11

N/A

BLANK WORKSHEET

Use this table to configure your system if it does not match the common configurations shown in Table 4-5, Chapter 4, Configuration.
Table D-2

Blank Worksheet for Generating CSR Addresses
First
Octal
First
Possible
Size
(in
Rank
Fixed
Floating
Module Address
bytes) Sample
No.
Address

17760010

17760020

17760030

17760040

17760050

17760060

17760070

DUV11

N/A

17760100

17760110

17760120

17760130

0-4

DZV11

N/A

Configuration Worksheet
Table D-2

Blank Worksheet for Generating CSR Addresses (Cont.)
First
Octal
First
Possible
Size
(in
Rank
Fixed
Floating
No.
Module Address
bytes) Sample
Address

17760140

17760150

17760160

17760200

17760210

17760220

17760230

17760240

17760250

17760260

17760270

17760300

17760320

17760330

17760334

17760340

17760360

17760400

17760404

17760420

17760440

17760500

17760540

17774400

17777170

DPVll

N/A

23
24

DMVll

N/A

25
26

DMSCP

TMSCP

17772150

17774500

31
32

DHVll

N/A

0-5

Appendix E
TK50 Extended Diagnostics
E.1

INTRODUCTION

Troubleshooting the TK50 tape drive generally involves one or more of the
following:
• Running the system user test.
• Running the program from the system boot/diagnostic ROM.
• Running the extended field service tests.
Refer to your system owner's manual for user test instructions. Refer to Chapter
2, MicroPDP-ll Base Systems, and Chapter 5, Diagnostics, for system
boot/diagnostic ROM test descriptions and procedures.
This appendix provides the following information:
• Extended testing of the tape drive.
• Extended test user interface and message format.
• Extended test descriptions.
E.2

EXTENDED TESTING OF THE TAPE DRIVE

When you turn on your TK50 subsystem or run the user test, you may see one or
more messages displayed on your terminal. The TK50 level 1 microdiagnostics run
at power-up and are contained in the host processor. The program is responsible
for testing the controller module and initializing and reporting results of the level 2
microdiagnostics that reside in the TQK50 controller ROMs. The TK50 level 2
microdiagnostics test basic drive functions.
These tests can also be started by the host and run under the XXDP+ supervisor.
The following sections provide information for extended testing of the TK50 tape
drive using the field service diagnostics provided with the host system or with the
TK50 tape drive.

E-1

TK50 Extended Diagnostics

If a fault occurs:

• Call your service representative or
• Run the XXDP+ diagnostic tests to isolate the failing component.
NOTE
These procedures require extensive knowledge of the XXDP+
diagnostic software and should only be carried out by trained
service representatives.

Use the following tests to isolate faults related to the TK50 tape drive or the
M7546 tape controller module:
• CZTKAn*

Functional Diagnostics/Verify Mode runs the Levell
microdiagnostics and tests power-up and the controller.
Functional Diagnostics/Execute Mode runs the level 2
microdiagnostics and tests the TK50 drive.

• CZTKBn*

Data Reliability Test runs under the XXDP+ supervisor. It tests
error rate overtime and detects functional faults. It does not test to
the FRU level.

* n = revision letter.
A brief discussion of each of these test starts at Section E.5. Refer to your system's technical manual for directions and a general discussion of the XXDP+
Supervisor and the DEC/XlI run-time exerciser. For additional information on the
diagnostic system, refer to:
• DECjXll User's Manual (AC-F053-MC).
• DECjXll Cross-Reference Manual (AC-F055C-MC).
• XXDP+/SUPR User's Manual (AC-F348A-MC)
E.3

CXTKA USER INTERFACE

When you run these tests under the XXDP+ Supervisor, the program prompts you
for answers to the following hardware questions. These questions allow you to
establish certain operational parameters of the program.

E-2

TK50 Extended Diagnostics

E.3.1

Hardware Questions

This set of questions must be answered when the program is first started.
CHANGE HARDWARE (L)? - Answer yes for the first pass of the program.
This question is asking if you want to reconfigure the unit under test. No is the
default.
NUMBER OF UNITS (D) - Enter 1-n where n is the total number of units being
tested.
UNIT X - Enter 1 , 2, or 3 ...
The program repeats these questions the number of times you specify by your
response to the NUMBER OF UNITS question. Enter only one number in response
to the UNIT X question.
BASE ADDRESS (0) - Enter the CSR address for the module being tested.
The first module in the system has a CSR address of 17774500. Additional modules have a floating CSR address of 17760nnn.
VECTOR (0) - Enter 260
UNIT NUMBER - Enter the MSCP specified unit number for each unit; for example, MUO, MUl.
E.3.2

Software Questions

Answering the software questions is optional. Use a <CR> or <CTRL/Z> to obtain
the default values. Most of the optional functionality of the program is either
handled automatically by the program or through established procedures provided
by the XXDP+ Supervisor. For example, the program bypasses the level 2
microdiagnostics if no cartridge is present in the drive.
If you want to change the default settings for these questions, refer to the XXDP+
software documents for information.
E.4

CZTKA MESSAGE FORMAT

The TK50 diagnostic programs display messages in two formats as shown in the
following examples:

E-3

TK50 Extended Diagnostics

E.4.1

Format 1

Host level 1 testing programs use:
CZTKA DVC FTL ERR eee ON UNIT II TST tt SUB ss PC; XXXXXXX
SA REG CONTENTS INCORRECT
IN INIT SEQUENCE STEP #: n
SA EXPECTED: YYYYYY SA RECEIVED: ZZZZZZ
*****FAILING FRU: CNTL
• eee
• II
•
•
•
•
•
•

A discrete error number defined by the program.
The logical unit number assigned to the unit-in-error when you
answered the hardware question.
tt
= The test number during which the error occurred.
ss
= The subtest number.
XXX XXX = The program location of the error call.
n
= The step number of the UQSSP (UjQ-Bus storage system
protocol) initialization sequence that detected the error condition.
YYYYYY = The expected contents of the SA register for this step.
ZZZZZZ = The actual SA register contents.

E.4.2

=
=

Format 2

Controller level 2 testing programs use:
CZTKAA DEV FTL ERR eee ON UNIT II TST tt SUB ss PC: XXXXXX
DRIVE COULD NOT OVERWRITE
FAILING U-DIAG #:6
TRACK: nn PHYS. BLK: pppppp ERR TYP: YYY RETRIES: rr
DRIVE ERROR BYTE: ddd
******FAILING FRU: DRV
• eee
• II
•
•
•
•
•
•
•
•

A discrete error number defined by the program.
The logical unit number assigned to the unit-in-error when you
answered the hardware question.
tt
The test number during which the error occurred.
ss
The subtest number.
XXXXXX = The program location of the error call.
nn
= Logical track number where the error occurred.
pppppp = Physical block number at which the error occurred.
YYY
= The type of error as defined by the TK50 diagnostic error log
specification.
rr
= The number of retries, if any, while trying to overcome the error.
ddd
= The drive error condition detected by the drive. This line is not
included if no drive error is detected.

E-4

=
=

TK50 Extended Diagnostics

E.S CZTKA FUNCTIONAL DIAGNOSTIC/VERIFY MODE
(LEVEL 1 MICRODIAGNOSTICS) TEST DESCRIPTIONS

The following test descriptions have the following points in common:
• Ali errors listed in the test descriptions cause the unit to be dropped from the
test.
• Scope loops return to the beginning of the test containing the error if the
operator has chosen to loop-on-error (LOE flag set).
E.S.1

Test 1: Existence Verification Test

Test 1 verifies the existence of the IP and SA registers by addressing them. An
error here could be caused by:
• An incorrect address setting in the controller DIP switch setting.
• Faulty controller logic.
• An operator error in specifying a base address (the CSR address).
E.S.2

Test 2: SA Register Wrap Test

Test 2 sets the WR (wrap) bit, enters the diagnostic wrap mode, and then writes
and reads a floating 1 pattern to and from the SA register. The sequence repeats
with a floating 0 pattern.
A failure to echo the written data results in a callout to the controller. If loop-onerror is set, the program loops on the failing write and read.
E.S.3 Test 3: Initialization Test and Power-Up Microdiagnostics

Test 3 disables the interrupts and then:
• Verifies that all step transitions occur within the allotted time.
• Verifies that all host supplied information is correctly echoed by the controller.
• Verifies that no interrupts occur as a result of the step transitions.
• Verifies that no interrupts occur at the vector assigned to the unit.
A failure in this test indicates a failing controller.

E-5

TK50 Extended Diagnostics

E.S.4 Test 4: Vector and Interrupt Level Test

Test 4 repeats test 3 but with interrupts enabled to test the TQK50 controller
vector and interrupt level. This test verifies that an interrupt occurs at each step
transition.
A failure in this test indicates a failing controller.
E.S.S

Test S: BR Level Test

Test 5 ensures that the TQK50 controller cannot interrupt when the CPU priority
is set to 7.
A failure in this test indicates a failing controller.
E.S.6

Test 6: Purge and Poll Test

The host sets the "PP" (purge and poll) bit and simulates a UQSSP (U/Q-Bus
storage systems protocol) handshake for a bus adapter purge. The host then
requests the controller to begin poll testing. The controller initiates DMA (direct
memory access) activity, in both directions, to the communications area identified
by the host. The controller ends this test, leaving the communications area cleared.
Ring depth in this test is set to 1, the minimum value, to reduce potential impact
on host memory if a failure occurs.
A failure in this test indicates a failing controller.
E.S.7

Test 7: Maximum Ring Buffer Test

Test 7 is similar to test 5 except the program uses the maximum allowed ring
depth. The ring depth value is equal to 128 command and 128 response slots of 32
bits per slot.
A failure in this test indicates a failing controller.
E.S.8

Test 8: Extended Address Test

Test 8 establishes the communications area in the highest available memory locations and tests the upper 6 bits of address logic on the controller module.
The program bypasses this test if the system contains only 28 K words of memory.
A failure in this test indicates a failing controller.

E-6

TK50 Extended Diagnostics

E.S.9

Test 9: Get DUST Status Test

Test 9 requests and tests the DUST status of each unit for:
• No command modifiers set.
• Illegal command modifiers set.
The program issues the get DUST status command to the unit under test. This
command is available in the DUP (diagnostics utilities protocol). The system tests
the DUST status packet received from the unit against a known good mask. If the
bits received do not match the mask, the program reports an error.
A failure in this test indicates a faulty controller.
E.S.10

Test 10: Execute Level 2 Microdiagnostics

Test 10 calls up the level 2 microdiagnostics resident on the controller and reports
the finding of these tests. Test 10 checks for:
• Full communication between the controller and the drive.
• Functional tests on the drive.
Most errors reported by this test occur in the drive.
E.6 CZTKA FUNCTIONAL DIAGNOSTICS/EXECUTE MODE
(LEVEL 2 MICRODIAGNOSTICS) TEST DESCRIPTIONS

The level 2 microdiagnostics test the read and write operations of the TK50 tape
drive. The program prompts the user to insert a scratch tape cartridge into the
tape drive. The host bypasses these tests if no tape is present. These diagnostic
report recoverable errors. It reports nonrecoverable errors as fatal device errors.
Test 10 (Section E.5.10) initiates the following sequence of tests twice to make
sure that both channels of the head receive equal testing. The program runs the
entire sequence first at the physical BOT (beginning of tape) using head channel 1.
The program positions the tape at the EaT (end of tape) and repeats the sequence
using head channel 2. At the completion of the test, the tape rewinds and is left at
the physical BOT.
The following test descriptions provide a summary of each of the level 2
microdiagnostic tests.

E-7

TK50 Extended Diagnostics

E.6.1

Test 1: Simple Read/Write Test

Test 1 verifies basic write/read capability.
Test 1 writes several blocks of IF and 2F data to the tape. The tape rewinds, and
the information is read back. The program performs a compare operation of the
read back function.
E.6.2

Test 2: Streaming Read/Write Test

Test 2 verifies that the drive can write and read over a fairly long distance while
in a normal operational mode.
Test 2 writes various data patterns on a single track and on a set length of tape
while the tape is streaming. The tape rewinds and reads while the tape is
streaming.
E.6.3

Test 3: Thrashing Read/Write Test

Test 3 verifies that the tape tracking and tension are not affected by frequent
direction changes.
Test 3 writes data patterns on a single track and inserts delays between the write
blocks to force thrashing. After rewinding, the program reads the blocks with
forced delays between reads.
E.6.4

Test 4: Peak Shift Test

Test 4 verifies that the write pre compensation logic is functioning properly.
Test 4 repeats test 2 using the worst case MFM (modified frequency modulation)
peak shift patterns.
E.6.5

Test 5: Signal Sag Test

Test 5 detects self-erasure of recorded data.
Test 5 writes a set length of tape with blocks of 2F data. The tape rewinds and
moves back and forth while stepping the head up and down. The program positions
the tape at the logical BOT for the recorded track and reads back.
E.6.6

Test 6: Overwrite Test

Test 6 guarantees that the drive is capable of overwriting previously recorded
data.

E·8

TK50 Extended Diagnostics

Test 6 writes a MW data pattern over a set length of tape on a signal track. The
tape rewinds, and the program rewrites a data pattern.
E.6.7

Test 7: Track Access Test

Test 7 verifies tape tracking and the drives ability to successfully record and
retrieve data on adjacent tracks.
Test 7 writes a set number of blocks of data on a signal track. The tape rewinds
and steps to the next track. This sequence repeats until all the tracks are written.
The program then rewinds the tape and reads back all the blocks from all the
tracks.
E.6.8

Test 8: Positioning Test

The first time through Test 8, the program positions the tape at the physical EOT.
This lets the entire testing sequence to repeat using channel 2 of the head. The
second entry into this test causes the tape to be positioned back at the physical
BOT.
This test includes a watch-dog timer to guard against a hung drive condition.
E.7

CZTKB DATA RELIABILITY TEST

The Data Reliability Test runs under the XXDP+ Supervisor and establishes the
performance quality of each unit being tested. The data reliability program detects
functional faults, but it does not isolate faults to the FRU level. The Data Reliability Test requires 28 K of memory.
This program supports all the PDP-II Diagnostic Supervisor flags with the following exceptions:
• LOE - Loop-on-error
• IDR - Inhibit drop units
E.8

CZTKB PROGRAM OPERATION

The program positions the tape at the BOT marker and then passes all the available tape over the tape head to the EOT marker on the tape. When this has been
done twice, one pass of the program is complete. The data reliability test takes 1
hour and 10 minutes when it is run in default mode. If the field engineer tells it to
run other tests or to run multiple passes, the time is considerably longer.
The program prompts you for answers to the following hardware questions which
must be answered when the program is started.

E-9

TK50 Extended Diagnostics

CHANGE HARDWARE - Type yes if this is the first time the program is run on
the unit under test.
NUMBER OF UNITS - Type in the number of units to be tested.
TKIP ADDRESS - Type in the base address of the unit, for example, 774500.
TK VECTOR ADDRESS - Type the vector for the module being tested. The first
module has a vector of 260.
T jMSCP UNIT NUMBER - Type in the unit name, for example, MUO.
Answering the software questions is optional. Use a <CR> or <CTRLjZ> to obtain
the default values. The following list provides the default values for each question.
CHANGE SW

No default

ENABLE TIME OF DAY CLOCK (L)
INPUT HOUR IN 24 HOUR FORMAT
(OMIT LEADING zeros) (D)
INPUT MINUTES (OMIT LEADING zeros

(N)

(0)
(D)

(0)

CHANGE CONTROLLER PARAMETERS (L)
ENABLE CONTROLLER ERROR CORRECTION (L)
ENABLE CONTROLLER ERROR RECOVERY (L)
ENABLE BAD BLOCKING (L)

(N)
(Y)
(Y)
(Y)

CHANGE PRINTER PARAMETERS (L)
ENABLE SOFT ERROR REPORT PRINTING (L)
ENABLE READ SOFT ERRORS ONLY (L)
CLEAR MEDIA TABLE ON EVERY PASS (L)
ENABLE MEDIA DEFECTS TABLE PRINTOUTS (L)
ENABLE PROGRAM VARIABLES DUMP ON ERROR
ENABLE CLEAR STATUS ON FATAL ERROR (L)

(N)

CHANGE TEST PARAMETERS (L)
DATA PATTERN (D)
RUN TEST 3 ONLY (L)
ENABLE DATA COMPARES IN TEST 5 (L)
ENABLE PRINT READ BUFFER IN TEST 5 (L)
CHANGE COMMAND SEQUENCE (L)

E.g

(N)

(N)
(N)
(N)

(L)

(N)
(N)
(N)

(0)
(Y)
(Y)
(N)
(N)

CZTKB ERROR REPORTING

The data reliability test provides a variety of information in its error printouts. The
following sections briefly discuss error reporting.

E-10

TK50 Extended Diagnostics

E.9.1

Commands

All error printouts contain a field indicating the command on which the error was
detected. Table E-l lists these abbreviated commands.

Table E-l
Error Printout Commands
Abbreviation
Definition
RD
CMP
SPC
SKP
SPO

AVL
SUC
ABO
GUS
WRT
ACC
WTM
ERS
ERG

ONL
REW
GCS
SCC
E.9.2

Read
Compare host data
Space records (position)
Skip tape marks (position)
Space objects (position)
Available
Set unit characteristics
Abort
Get unit status
Write
Access
Write tape mark
Erase
Erase gap
Online
Rewind
Get command status
Get controller characteristics
Status/Log Packet and Program Errors

Each message also includes one line of text describing the type of fault that can
originate in anyone of three sources. Table E-2 shows three possible messages and
their sources.

Table E-2
Sample Messages and Their Source
Sample Message
Source
Invalid command issued
Data overrun
Program command timeout

Status error code
Error log packet
Program detected error condition

E-11

TK50 Extended Diagnostics

E.9.3

Drive Errors

When a drive error occurs, the response packet contains a substatus code. This
code is the drive error byte as returned by the drive. The program places this
value in the upper bits of the status field. Table E-3 lists these status values, the
corresponding error numbers, and the cause of the failure.
Table E-3
Status

Data Reliability Test Status Drive Errors
Description
Error

000013
002013
003013
010013
100413
101013
101413
102013
102413
103013
103413
104013
104413
105013
105413
106013
106413
110013
110413
111013
111413
112413
113013
113413
114013
114413
115013
115413
116013
116413
117013

00
04
06
10
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
90
91
92
93
95
96
97
98
99
9A
9B
9C
9D
9E

E-12

Write lock violation
Communication exception (timeout, etc.)
Wrong track error (following a turnaround)
Synchronization failure - read/write
Failure to load to BOT
Failure to unload tape into cartridge
General motor or tach failure
Motor A failure
Motor B failure
Drive lost control of tape or bad tach
Excessive drag in tape transport
Failure to stop tape or remain stopped
Cartridge insert error
Cartridge extract error
CU attempted to move tape with drive in error
Deceleration timeout error
Second attempt to balance reels in unit failed
8155 RAM memory failure in self-test
8155 timer failed
Read amplit (Hd 1) to low in calibrate
Read amplit (Hd 2) to low in calibrate
EOT sensed in R/W/S
BOT sensed in R/W/S
Drive block address overflow
Drive block address underflow
Servo-error excessive speed variations
Failure in tracking - presently not used
Command error - not recognized
Illegal command - incompatible with drive state
Write lock error
Write gate at wrong time

TK50 Extended Diagnostics

Table E-3
Status

Data Reliability Test Status Drive Errors (Cont.)
Description
Error

117413
120013
120413
121013
121413
122013
122413
123013
123413
124013
124413
125013

E.9.4

AO
Al
A2
A3
A4

A5
A6

A7
A8
A9

No write gate for calibration track write
Error sensing cal track 1 - bad head
Error sensing cal track 2 - bad head
Detection of edges of cal trk 1 out of spec
Detection of edges of cal trk 2 out of spec
Offset of cal trk 2 from 1 is too great
Search for bottom edge of tape failed
Bottom tape edge tolerance error
Drive is overheating
No current in LED of BOT sensor (cable)
Halt switch sense lines motor A questionable
Tachometer failure

Hard Error Reports

Hard error reports occur when a recovery process is not successful. The user can
disable these reports. Hard error reports typically have the following format:
CZTKB HRD ERR 0014 ON UNIT 00 TST 003 SUB 000 PC: 020460
HARD DATA ERROR
COMMAND: RD T/MSCP UNIT: 000 (0)
PASS:
1 (D) DATA PAT: 01 (0)
RECORD BYTE COUNT: 457 (D)
OBJECT CNT: 000000026352 (0)
RESPONSE PACKET
HIGH WORD
000000 (0)
000000 (0)
000050 (0)
000000 (0)
000000 (0)
000000 (0)
000000 (0)
000000 (0)
000000 (0)

LOW WORD
026532 (0)
000000 (0)
010240 (0)
000733 (0)
000000 (0)
000000 (0)
000000 (0)
001413 (0)
000733 (0)

E-13

TK50 Extended Diagnostics

E.9.S

Soft Error Reports

Soft error reports occur when a recovery process is successful. The user can
disable these reports. Soft error reports include the number of retries necessary to
successfully complete the current operation. These reports typically have the following format:
CZTKB SFT RD ERR 00014 ON UNIT 00 TST 003 SUB 000 PC: 020460
ECC RECOVERED DATA ERROR
COMMAND: RD T/MSCP UNIT: 000 (0)
PASS:
1(0) DATA PAT: 01 (0)
OBJECT CNT: 000000026352 (0)
TAP OBJ CNT: 000000026352 (0)
TRK NUM:
6 (D)
LEVEL:
0 (0)
RETRIES:
1 (D)
LOG BLK NUM:
0 (D)
PHYS BLK NUM:
9932 (D)
DRV CODE:
000 (0)
DRV FLGS:
041 (0)
DRV STATE:
000000 (0)
INTERN STATUS:
002 (0)
TAP CNT 0:
227 (0)
TAP CNT 1:
015 (0)
TAP CNT 2:
035 (0)
RD/WR STATE:
000000 (0)
OPER FLGS:
000000 (0)

E.10

CZTKB TEST DESCRIPTION

The following test descriptions summarize each of the data reliability tests.
E.10.1

Test 1: Basic Function Test

Test 1 executes a subset of the available commands on the unit under test. It
serves as a quick verify test and makes sure the unit can move tape and read/write
without error.
E.10.2

Test 2: Quick Verify Read/Write Test

Test 2 rewinds the tape, writes a record set, writes to the LEOT (logical end of
tape), and rewinds. The program repositions the tape to the just-written record set
and reads the current record set before skipping to the LEOT.
This test repeats 5 times or until it encounters a fatal error. Test 2 permits
retries, fixed record length, fixed number of records/sets, and predetermined data
patterns.

E-14

TK50 Extended Diagnostics

E.10.3 Test 3: Complex Read/Write Test

Test 3 rewinds the tape, writes N records, writes a tape mark, and then repeats
this sequence until the EOT is reached where it writes 2 tape marks. The tape
rewinds, reads N records, and spaces 1 record (should see unexpected tape mark).
This sequence repeats until the program reaches the LEOT.
Test 3 uses all data patterns, including random data, and randomly selects the
number of records (N) and the record size. This sequence permits hardware retries
and runs until EOT, LEOT, or a fatal error is encountered.
E.10.4 Test 4: Write Interchange Tape

Test 4 rewinds the tape and then writes until EOT or it encounters a fatal error.
Test 4 keeps track of the number of records and files that are written. If a fatal
error occurs, the tape rewinds and the program prevents the unit from executing
any further write operations.
E.10.5 Test 5: Read Unknown Tape

Test 5 rewinds the tape and then reads until EOT or it encounters a fatal error.
Test 5 keeps track of the number of records and files that are read. If a fatal error
occurs, the tape rewinds and the program prevents the unit from executing any
further read operations.
NOTE
Tests 4 and 5 can be used to perform a media interchange test
for multiple drives. The program does not attempt to determine
if the unit writing the tape or the unit reading the tape is at fault
when an error occurs.

E-15

Appendix F
RQDXE (M7513) Jumper Configurations
F.1

INTRODUCTION

Use the RQDXE extender module when you have an RQDX2 or RQDX3 controller
module and you want to add an RX50 or fixed disk drive subsystem, or an additional disk drive in a BA23-A expansion box.
NOTE
The BA23-A supports only one fixed disk drive installed in the
enclosure. Never install two fixed disk drives in a BA23-A enclosure used as a host or as an expansion box.

The RQDX2 and RQDX3 controller modules support four fixed disk drives or two
fixed disk drives and an RX50 diskette drive.
The RQDXE supports a variety of arrangements of additional disk drives. This
appendix provides the jumper configurations for these arrangements.
Refer to Chapter 2, Section 2.12, for guidelines when you install an RQDXE
extender module and additional fixed disk drives.
F.2

RQDXE (M7513) JUMPER CONFIGURATIONS
(COMMON ARRANGEMENTS)

In the following examples, the term host is used for simplicity to imply the enclosure in which the RQDX2 or RQDX3 controller module resides.
In the following illustrations, Port 0 is on the left and Port 1 is on the right. Make
sure the jumpers on the fixed disk drives are set correctly. Refer to Chapter 5,
Section 5.3, for information.
The letter X implies that the port is empty or contains a device not supported by
the RQDX2 or RQDX3 controller module.
Subsystems, available from Digital, are tabletop or rackmounted RX50 diskette
drive or RD fixed disk drive units. Each subsystem contains its own power supply
and is designed to communicate with the host computer through an extender module installed in the host's backplane.

F·1

RQDXE (M7513) Jumper Configurations

F.2.1

Factory Configuration

Figure F -1 shows three fixed disk drive and RX50 diskette drive arrangements
using the RQDX2 or RQDX3 controller and the RQDXE extender modules. The
factory configuration supports all three arrangements.
Table F-I shows the RQDXE factory configuration. This configuration supports one
RX50 and two fixed disk drives. You can use this configuration with dual BA23-A
systems or with a subsystem.

BA23-A
HOST

RDO

RX50

~~J4

FRONT PANEL

BA23-C
EXPANSION BOX

RDl

I~~ ~

FRONT PANEL

BA23-A
HOST

RDO

BA23-C
EXPANSION BOX

RDl

BA23-A
HOST

RDO

RX50

RD-D, -R
SUBSYSTEM

Figure F-I

RDl

~
I~ ~ ~
LL
LL

FRONT PANEL

Three Possible Disk Drive Arrangements (Factory Setting)

Table F-l
RDYand
WRT PROT

RQDXE Jumper Setting (Factory Configuration)
Internal
Drive
Drive
External
Port SEL
Port SEL
SEL
ACK

Al to A3
BI to B3

EI to E2
FI to F3
F2 to F4
H3 to H4

F-2

K2 to K4

11 to L3
L4 to M2

NI to N2
N4 to P2

RQDXE (M7513) Jumper Configurations

F.2.2

Jumper Setting for Three Fixed Disk Drives

Figure F-2 shows a configuration using the RQDXE extender module with three
fixed disk drives, one in the BA23-A enclosure and two subsystems.
Table F-2 shows the RQDXE jumper setting to support three RD5n(s).
BA23·A
HOST

RDO

RD·D, ·R
SUBSYSTEMS
(ONLY)

RDl

RD2

Figure F-2
Table F-2

I~ ~ ~
I ~~ ~

FRONT PANEL

FRDNT PANEL

Three Fixed Disk Drives with an RQDXE (Arrangement 1)

RDYand
WRT PROT

RQDXE Jumper Setting for Three RD5n Disk Drives
(Arrangement 1)
Drive
Drive
External
Internal
SEL
ACK
Port SEL
Port SEL

Al to A3
Bl to B3
C2 to C4
D2 to D4

El to E2
Fl to F3
HI to H2
H3 to H4

Kl to K3
K2 to K4

L3 to Ml
L4 to M2

Nl to N2
N4 to P2

F-3

RQDXE (M7513) Jumper Configurations

F.3

ADDITIONAL RQDXE JUMPER SETTINGS

The following examples show a variety of arrangements of fixed disk drives and
RXSO diskette drives using the RQDX2 or RQDX3 controller and RQDXE extender
modules. The jumper configurations provided in the following tables support the
disk drive arrangements shown in the accompanying illustrations.
F.3.1

Additional Arrangements, Example 1

Figure F-3 shows a configuration using an RQDXE with an RXSO and a fixed disk
drive.
Table F-3 shows the jumper configuration to support this arrangement.
BA23-A
HOST

RX50

BA23-C
EXPANSION BOX

RDO

Figure F-3

rI ~~ rI~ ~

FRONT PANEL

An RX50 and a Fixed Disk Drive with an RQDXE

Table F-3
RDYand
WRT PROT

RQDXE Jumper Setting for an RX50 and Fixed Disk Drive
Drive
Drive
External
Internal
SEL
ACK
Port SEL
Port SEL

Al to A2
Bl to B2

El to E2
F3 to F4
H3 to H4

F-4

Kl to K2

L3 to L4
M2 to M4

Nl to N3
N4 to P2

RQDXE (M7513) Jumper Configurations

F.3.2

Additional Arrangements, Example 2

Figure F-4 shows a configuration using an RQDXE with an RX50 and two fixed
disk drive subsystems.
Table F-4 shows the jumper configuration to support this arrangement.
BA23-A
HOST
RD-D, -R
SUBSYSTEMS
(ONLY)

RX50

I~~ ~

FRONT PANEL

RDO

RD1

I~ ~ ~

FRONT PANEL

Figure F-4 An RX50 and Two RD5n Disk Drives with an RQDXE
(Arrangement 1)
Table F-4
RDYand
WRTPROT

RQDXE Jumper Setting for an RX50 and Two Fixed Disk
Drives (Arrangement 1)
Drive
Drive
External
Internal
SEL
ACK
Port SEL
Port SEL

Al to A2
A3 to A4
Bl to B2
B3 to B4

El to E2
Fl to F2
F3 to F4
H3 to H4

Kl to K2
K3 to K4

L3 to L4
Ml to M2

Nl to N3
N4 to P2

F-5

RQDXE (M7513) Jumper Configurations

F.3.3

Additional Arrangements, Example 3

Figure F -5 shows a configuration using an RQDXE with a fixed disk drive and an
RX50 in a BA23-A expansion box or subsystems.
Table F-5 shows the jumper configuration to support this arrangement.
BA23-A
HOST

BA23 -c
EXPANSION BOX
(RD/RX-D, -R
SUBSYSTEM)

RDO

RX50

Figure F-5
Table F-5
RDYand
WRT PROT
Al to A2
BI to B2
C3 to C4
D3 to D4

F-6

I~ ~
I~ ~

rr-

FRONT PANEL

A Fixed Disk Drive and an RX50 in a BA23-A Expansion Box
RQDXE Jumper Setting for a Fixed Disk Drive and an
RX50 in a BA23-A Expansion Box
Drive
Drive
External
Internal
Port SEL
SEL
ACK
Port SEL
E2 to E4
F3 to F4
HI to H3

KI to K2

L3 to L4
M2 to M4

NI to N3
N4 to P2

RQDXE (M7513) Jumper Configurations

F.3.4

Additional Arrangements, Example 4

Figure F-6 shows an alternate configuration using an RQDXE with an RX50 and
two fixed disk drive subsystems.
Table F-6 shows the jumper configuration to support this arrangement.
BA23-A
HOST

RX50

I~ ~ ~

FRONT PANEL

RO-O, -R
SUBSYSTEM
(ONLY)

ROl

ROO

I ~~ ~

FRONT PANEL

Figure F -6
Table F-6

An RX50 and Two Fixed Disk Drives (Arrangement 2)

RDYand
WRT PROT

RQDXE Jumper Setting for an RX50 and Two Fixed Disk
Drives (Arrangement 2)
Drive
Drive
External
Internal
SEL
ACK
Port SEL
Port SEL

Al to A3
A2 to A4
Bl to B3
B2 to B4

El to E2
Fl to F3
F2 to F4
H3 to H4

Kl to K3
K2 to K4

L3 to Ml
L4 to M2

Nl to N3
N4 to P2

F-7

ROOXE (M7513) Jumper Configurations

F.3.S

Additional Arrangements, Example 5

Figure F-7 shows another alternate configuration using an RQDXE with two fixed
disk drives and an RX50 diskette drive in a BA23-A expansion box or sUbsystems.
Table F-7 shows the jumper configuration to support this arrangement.
BA23-A
HOST

RDO

I~ ~ ~

FRONT PANEL

BA23-C
EXPANSION BOX
(RD/RX-D, -R
SUBSYSTEMS)

RDl

RX50

I~~ ~

FRONT PANEL

Figure F-7
Table F-7
RDYand
WRT PROT
Al to A3
BI to B2
C3 to C4
D3 to D4

F-8

Two Fixed Disk Drives and an RX50 (Arrangement 3)

RQDXE Jumper Setting for Two Fixed Disk Drives and an
RX50 (Arrangement 3)
Drive
Drive
External
Internal
SEL
ACK
Port SEL
Port SEL
E2 to E4
FI to F3
HI to H3

KI to K2

L1 to L3
L4 to M2

NI to N2
N4 to P2

RQDXE (M7513) Jumper Configurations

F.3.6

Additional Arrangements, Example 6

Figure F-8 shows an alternate configuration using an RQDXE with three fixed disk
drives, one in a BA23-A enclosure and two as subsystems.
Table F -8 shows the jumper configuration to support this arrangement.

HOST

ROO

I~ ~ ~

FRONT PANEL

EXPANSION BOX

R02

ROl

I~ ~

FRONT PANEL

Figure F-8

Table F-8

Three Fixed Disk Drives (Arrangement 2)

RDYand
WRT PROT

RQDXE Jumper Setting for Three Fixed Disk Drives
(Arrangement 2)
Drive
Drive
External
Internal
Port SEL
SEL
ACK
Port SEL

A3 to A4
B3 to B4
C3 to C4

El to E2
Fl to F2
F3 to HI

Kl to K2
K3 to K4

L3 to L4
Ml to M2

Nl to N2
N4 to P2

F-9

Index
AC load
backplane, 1-10
bus, 4-1, 4-5
configuration rules, 4-1, 4-3
definition, 1-10
Access
removal, 6-26
TK50 cable, 1-10
Acronyms, list of, xv
Address. See also CSR address
configuration example, 3-2
fixed, definition, 3-2
floating, definition, 3-2
typical switch settings, 3-3
Advance to next test
definition, 5-6
when to use, 5-6
Air circulation, 1-3
Allow alternate boot block
command, 2-16
use, 2-16
ANSI video terminal
command, 2-14
use, 2-14
Automatic boot mode
discussion, 2-9-2-10
enter, 2-14
KDFII-B, 2-30
KDJll-B, 2-9
messages, 2-9, 2-30
sequence, 2-9
to enter dialog mode, 2-9, 2-30

BA23 enclosure. See also FRU
air circulation, 1-3
backplane assembly, 1-8-1-12
bezels, 1-3
control panel, 1-4
controls and indicators, 1-5
dimensions,l-2
discussion, 1-1-1-19
fans, 1-13
frame, 1-2
I/O distribution panel, 1-18
LTC DIP switch, 1-6-1-7
mass storage, 1-8
power supply, 1-13
printed circuit board, 1-6-1-7
troubleshooting flowchart, 5-21
Backplane. See also Configuration;
Pin assignment; Signal name
ac load, 1-10
access cover removal, 6-26
advanced configuration, 4-10
basic configuration, 4-9
CD bus, 1-12
configuration, 4-1-4-12
dc load, 1-10
expansion space, 4-1-4-2
FRU procedure, 6-22-6-26
grant continuity, 1-12, 6-36
install modules, 1-12
order of modules, 4-2
pin assignment, A-I-A-5
Q22-Bus connectors, 1-12

Index-1

Index

signal distribution panel, 1-8, 1-10
signal names, A-I-A-5
Backup devices
TQK25-EP tape drive, 3-59-3-61
TQK50 tape drive, 2-51-2-53,
3-61-3-63
Battery backup
memory, jumper setting, 2-37
MSV11-JD, -JE memory, 2-37
Baud rate switch
KDFII-B, 2-29
KDJ11-B, 2-6-2-8
setup command 6, 2-19
BDCOK H signal, 1-13
BEVENT L signal, 1-13
BEVENT timing switch, 1-7
Bezels
BA23 enclosure, 1-3
remove, 1-3
Boot. See also Automatic boot mode
delete EEPROM, 2-20
from nonstandard address, 2-17
from off-board ROM, 2-11, 2-18
KDF11-B dialog command, 2-31
KDFII-B error table, 5-9
KDJ11-B dialog command, 2-11
KDJ11-B error table, 5-4
non-Digital devices, 2-18
non-Digital operating system, 2-16
save into EEPROM, 2-21
self-test error table, 5-4, 5-9
BPOK signal, 1-13
Bus loads, 4-1. See also Ac load;
DC load
Cable, TK50 tape drive,
Caution
fan power cable
front, 6-34
rear, 6-31

Index·2

1-10

fixed disk drive, 1-8, 1-10
module removal, 6-36
RD51 fixed disk drive, 6-10
static electricity, 6-1, 6-36
CD bus
use, 2-8
using PMI, 2-8
Change automatic boot
command, 2-18
exit, 2-18
use, 2-18
Change boot selection
command, 2-19
use, 2-19
Change boot translation
command, 2-17-2-18
use, 2-17-2-18
Change parameters
command, 2-12
use, 2-12
Circuit breaker, 1-14, 1-17
Clock select
command, 2-25
LTC switch, 1-6, 1-7
use, 2-15
Command line explanation, 5-6
Communications options, 3-4-3-43.
See also the specific module
Configuration. See also the specific
module; Worksheet
cabling, 4-9-4-10
common arrangements, table, 4-7
CSR addresses, 4-3
discussion, 3-2
expansion space, 4-3
floating CSR
addresses, 3-2, 4-6
common arrangements, 4-7
guidelines, 4-8
interrupt vectors, 3-2, 4-3
operating system, 4-12
order of modules, table, 4-2

Index

power requirements, 4-3
prepare setup table, 4-12
RD5n fixed disk drive, 6-10
rules, 4-1
worksheet, 4-5-4-6, D-l-D-5
Console dialog mode. See Dialog mode;
KDF11-B CPU module;
KDJ11-B CPU
Console emulator mode
discussion, 5-10-5-12
entering, 5-10
KDF11-B, 5-8
KDJ11-B, 5-4
modify registers, 5-11
ODT commands, 5-12
system halt, 5-8
using, 5-8, 5-10, 5-11
using ODT, 5-11
Console messages, KDJ11-B, 5-6
Control panel
controls and indicators, 1-5-1-6
FRU procedure, 6-6
installation, 6-6
LEDs, 1-7
Controls and indicators
baud rate switch, 2-6-2-8
DC OK, 1-5
Halt, 1-6
Ready, 1-6
Restart, 1-6
Run, 1-5
table, use of, 1-5
Write-protect, 1-6
CSR address. See also the
specific module
configuring, 4-3
floating, 4-6
guidelines, 4-8
MSV11-P memory, 2-34
RQDXn disk controller, 2-44
TQK50 tape controller, 2-51
worksheet, 4-6

CZTKA. See also XXDP+
hardware questions, E-3
level 1 tests, E-2
message format 1, E-4
message format 2, E-4
software questions, E-3
user interface, E-2
verify mode, E-2
CZTKB. See also XXDP+
data reliability tests, E-9
drive errors, table, E-12
error reporting, E-I0
hard errors, E-13
hardware questions, E-I0
program operation, E-9
soft errors, E-14
software questions, E-I0
test descriptions, E-14
Data error message, 5-15
Data reliability tests. See also CZTKB
commands, E-ll
discussion, E-9
drive errors, table, E-12
error reporting, E-I0
hard errors, E-13
program errors, E-ll
program operation, E-9
test descriptions, E-14-E-15
DC load
backplane, 1-10
bus, 4-1, 4-5
configuration rules, 4-1, 4-3
definition, 1-10
DC OK indicator, 1-5
DEC/XII run-time exerciser
data error message, 5-15
deselect commands, 5-16
expansion, 5-17
message
format, 5-15
types, 5-14
Index-3

Index

select
commands, 5-16
modules, 5-16
status error message, 5-16
system error messages, 5-13
using, 5-14
Delete EEPROM boot
command, 2-20
use, 2-20
DEQNA Ethernet interface
CSR address, 3-5
description, 3-4
internal cabling, 3-5
interrupt vector, 3-5
part numbers, 3-4
Deselect program modules
DEC/X11, 5-16
DRV11 asynchronous multiplexer
CSR address, 3-7
description, 3-6
internal cabling, 3-8
interrupt vector, 3-8
part numbers, 3-6
Diagnose, dialog command, 2-31
Diagnostic/bootstrap switch
KDF11-B, 2-27-2-28
Diagnostics. See also XXDP+
boot ROM error, 5-4, 5-9
console emulator mode, 5-4
data error message, 5-15
DEC/X11 run-time exerciser, 5-14
definition of message format, 5-6
deselect
commands, 5-16
modules, 5-16
discussion, 5-1-5-20
error code table, 5-2
field service diskettes
discussion, 5-12
part number, 5-13
using, 5-13
XXDP+ software, 5-13
Index-4

message
format, 5-4, 5-6
location, 5-2, 5-4
response to, 5-4-5-5
types, 5-15
select
commands, 5-16
modules, 5-16
self-test, 2-9, 2-30
self-test description, 5-1
system error message, 5-15-5-16
troubleshooting flowchart, 5-21
user-friendly diskettes
part number, 5-12
user test, 5-12
using, 5-12
XXDP+
message format, 5-18
modifying a program, 5-195-20
programs, 5-18
restart a program, 5-19
start a program, 5-19
Dialog mode
entering, 2-10, 2-30
KDF11-B
commands, 2-31
menu, 2-31
KDJ11-B, 2-10-2-22
KDJ11-B
commands, 2-11
uses, 2-10
Disable (commands and use)
clock CSR, 2-15
long memory test, 2-16
ROM, 2-16
user-friendly format, 2-13
Disk controller module. See RQDXn
disk controller

Index

Disk drive. See RC25 disk subsystem;
RD5n fixed disk drives;
RL02 disk subsystem;
RX50 diskette drive
Diskette drive. See RX50
diskette drive
Diskettes
field service
diagnostic, 5-12
part number, 5-13
user-friendly
part number, 5-12
user test, 5-12
DLVE1 asynchronous interface
baud rate selection, 3-12
CSR address, 3-10
description, 3-9
internal cabling, 3-12
interrupt vector, 3-10
jumper settings, 3-11
part numbers, 3-9
DLV]1 asynchronous interface
CSR address, 3-13
description, 3-13
internal cabling, 3-15
interrupt vector, 3-14
part numbers, 3-13
DMV11 synchronous controller
CSR address, 3-17
description, 3-16
internal cabling, 3-19
interrupt vector, 3-17
part numbers, 3-16
DPVll synchronous interface
CSR address, 3-22
description, 3-20
internal cabling, 3-23
interrupt vector, 3-22
part numbers, 3-20

Drive errors, TK50 tests, E-12
DRVll parallel-line interface
CSR address, 3-25
description, 3-24
internal cabling, 3-26
interrupt vector, 3-25
part numbers, 3-24
DRV11-B DMA interface
CSR address, 3-28
description, 3-27
internal cabling, 3-29
interrupt vector, 3-28
part numbers, 3-27
DRV11-J high density interface
CSR address, 3-32
description, 3-30
internal cabling, 3-31
interrupt vector, 3-31
part numbers, 3-30
DUV11 synchronous serial interface
CSR address, 3-32
description, 3-32
internal cabling, 3-34
interrupt vector, 3-33
part numbers, 3-32
DZQll asynchronous multiplexer
CSR address, 3-36
description, 3-35
internal cabling, 3-36
interrupt vector, 3-36
part number, 3-35
DZV11 asynchronous multiplexer
backplane pin assignment, A-4
backplane signal name, A-4
CSR address, 3-39
description, 3-38
internal cabling, 3-40
interrupt vector, 3-39
part numbers, 3-38

Index-5

Index

Edit/create EEPROM boot
command, 2-20
enter ROM ODT, 2-20
use, 2-20
EEPROM, features and use, 2-4
Ejector levers, 6-38
Enable ECC test
command, 2-15
use, 2-15
Enable halt on break
command, 2-13
use, 2-13
Enable trap on halt
command, 2-16
use, 2-16
Enclosure. See BA23 enclosure
Enter ROM ODT
command, 2-21
use, 2-21
EPROM, features and use, 2-4
Error code
KDFlI-B LED display, 5-10
KDFII-B ROM messages, 5-9
KDJlI-B self-test table, 5-2
table, 5-2
Error message
DEC/XlI
data error, 5-15
description, 5-6
format, 5-15
status error, 5-16
system error, 5-15
KDFlI-B boot, 5-8
KDJlI-B format, 5-6
Error number, explanation, 5-6
Execute mode
discussion, E-2
test descriptions, E-7 -E-9
Exit, setup command 1, 2-12
Expansion space
backplane, 4-2
I/O distribution panel, 4-2
Index-6

Fan
caution, power cable, 6-31, 6-34
cowling removal, 6-24
FRU procedure, 6-30, 6-32
installation, 6-31, 6-34
location, 1-13
power connector, 1-17
voltage, 1-13
Fixed disk drives. See RD5n fixed
disk drive
Floating CSR addresses common
arrangements, 4-7
guidelines, 4-8
how to configure, 4-3
Floating point, 2-4, 2-24
Floppy disk drive. See RX50
diskette drive
Flowchart, troubleshooting, 5-21
Force clock interrupts
command, 2-15
use, 2-15
Format
help, C-2
messages, C-3
mode C-3
RD5n, 3-49-3-50
RD5n procedure, C-I-C-2
FRU
backplane access cover, 6-26
backplane assembly, 6-22-6-26
control panel, 6-6
diagram, 6-5
fan
cowling, 6-24
front, 6-32
rear, 6-30
flowchart, 5-21
I/O distribution panel, 6-40
I/O insert panel, 6-40
modules, 6-36
parts list, 6-2

Index

power supply, 6-27-6-30
Q22-Bus module cover, 6-22
RD51 read/write board, 6-12-6-15
RD52 read/write board, 6-16-6-19
RD53 read/write board, 6-20
RD5n fixed disk drive, 6-10
RX50 diskette drive, 6-8
subsystem storage cover, 6-6
Grant continuity
card installation, 6-36
discussion, 1-12
Grounded wrist strap
part number, 6-1
use, 6-1
Halt, switch, 1-6
Help
dialog command, 2-11, 2-31
XXDP+ on line, 5-13
Host, definition, F-l
Ignore battery
command, 2-14
use, 2-14
Indicator
DC OK, 1-5
Halt, 1-6
Run, 1-5
Write-protect, 1-6
Initialize the setup table
command, 2-19
use, 2-19
Installation. See also FRU
KDJ11-B guidelines, 2-8
MSVII-J guidelines, 2-38
MSV11-P guidelines, 2-8
Interrupt vector
discussion, 3-2
how to configure, 4-3
worksheet, 4-6

I/O distribution panel
adapter plate, 1-19
cabinet kit, 1-18
cutouts
dimensions, 1-19
number available, 1-19
type, 1-19
expansion space, 4-1-4-2
FRU procedure, 6-40
insert panel
dimensions, 1-19
discussion, 1-18
FRU, 6-40
type, 1-19
SLU display, 1-18

J11 micro ODT. See also ODT
addressing, 5-11
commands, table, 5-12
setup mode, 2-14
using, 5-11
Jumper setting. See also the
specific module
KDF11-B CPU factory, 2-26
KDJ11-B CPU, 2-5
MSV11-P memory factory, 2-33
RD5n fixed disk drive, 6-12
replacing modules, 6-39
RQDXI-E, 2-47
RQDXn, 2-46
TQK50 tape controller, 2-51
KDFII-B (systems). See also
KDF11-B CPU
backplane pin assignment, A-2
backplane signal name, A-2
boot diagnostics, 5-8
console emulator mode, 5-10-5-11
message
diagnostic ROM, 5-9
format, 5-8
location, 5-8
Index-?

Index

octal display, 5-10
ODT addressing, 5-11
self-test, 5-8
system halt, 5-10
testing procedures, 5-8
KDF11-B CPU
automatic boot mode, 2-30
baud rate switch, 2-29
description, 2-22
diagnostic/bootstrap switch, 2-27
dialog mode, 2-31
DIP switch, 2-24
discussion, 2-22-2-31
factory
jumper setting, 2-26
switch setting, 2-27
features, 2-24
jumper, 2-24
LEDs, 2-24, 5-10
location in backplane, 2-29
MMU chip, 2-24
switch E102, 2-27
where to install, 2-24
KDF11-BA CPU
factory jumper setting, 2-26
field upgrade, 2-24
KDJI1-B (systems). See also
KDJ11-B CPU
backplane pin assignment, A-2
backplane signal name, A-2
console emulator mode, 5-10
message
diagnostic ROM, 5-4
format, 5-4, 5-6
location, 5-2, 5-4
octal address, 5-3
octal display message, 5-4
ODT addressing, 5-11
options available, 2-4
parts of a message, 5-6

Index-8

response to message, 5-4-5-5
self-test, 5-1
self-test error code table, 5-2
testing procedure, 5-2
KDJI1-B CPU
automatic boot mode, 2-9
baud rate switch, 2-6-2-7
cables, 2-2
cache, 2-4
description, 2-2
dialog mode, 2-10-2-22
DIP switch, 2-5, 2-7
discussion, 2-2-2-22
EEPROM, 2-4
features, 2-4
hertz, 2-4
illustration, 2-5
LEDs, 2-6
SLU display, 2-2
where to install, 2-8
Kernel mode, 2-16
LEDs
control panel, 1-7
KDF11-B display, 2-24, 5-9
KDJ11-B CPU, 2-6
RQDXn disk controller, 2-44
TQK50 tape controller, 2-53
Level 1 testing
test descriptions, E-5-E-7
TK50 diagnostics, E-2
Level 2 testing
test descriptions, E-7
TK50 diagnostics, E-2
List boot programs
command, 2-19
use, 2-19
List, dialog command, 2-11, 2-31
List parameters
command, 2-12
use, 2-12

Index

Load EEPROM boot in memory
command, 2-20
use, 2-20
Load EEPROM data in setup table
command, 2-19
use, 2-19
Location 0, 2-16
Location 26, 2-14
Logical unit number. See LUN
LPV11 interface
additional jumpers, 3-42
CSR address, 3-42
description, 3-41
internal cabling, 3-43
interrupt vector, 3-42
part numbers, 3-41
LSI-11 bus. See Q22-Bus backplane
LTC switch, 1-6-1-7
LUN
configuration example, B-4
jumpers, B-1
standard configuration, B-3
Map
dialog command, 2-11, 2-31
module status, 5-17
Mass storage
area, 1-8
caution, disk drive, 1-8, 1-10
devices, 3-44-3-58
signal distribution panel, 1-8
Memory battery OK, 2-14
Memory management unit, 2-24
Memory module. See MSV11-P;
-JD; -JE
Message
formatting, C-3
XXDP+ message format, 5-18
Micro ODT
addressing, 5-11
commands, table, 5-12
using, 5-11

MicroPDP-11/23. See also KDF11-B;
KDF11-B CPU
automatic boot mode, 2-30
definition, 2-1
dialog mode, 2-31
identify, 2-1
KDF11-B CPU, 2-22-2-31
location of CPU, 2-29
message location, 5-8
testing procedures, 5-8
MicroPDP-11/73. See also KDJ11-B;
KDJ11-B CPU
automatic boot mode, 2-9
CPU installation, 2-8
definition, 2-1
hertz, 2-4
identify, 2-1
KDJ11-B CPU, 2-2-2-22
memory installation, 2-8
message location, 5-8
self-test code, 5-1-5-2
testing procedure, 5-2, 5-8
where to install CPU, 2-8
MicroPDP-ll/83. See also KDJ11-B;
KDJ11-B CPU
CPU installation, 2-8
definition, 2-1
hertz, 2-4
identify, 2-1
KDJ11-B CPU, 2-2-2-22
KDJ11-BF CPU, 2-1
memory installation, 2-8
message location, 5-8
power supply, 1-14
seft-test code, 5-2
testing procedure, 5-2, 5-8
where to install CPU, 2-8
Mode
24 mode, 2-14
automatic boot, 2-9, 2-30
console emulator, 5-4, 5-8,
5-10-5-12
Index-9

Index

dialog, 2-10-2-22
execute, E-2
KDFll-B
automatic boot, 2-30
console emulator, 5-8, 5-10
dialog, 2-30
KDJll-B
automatic boot, 2-9-2-10
console emulator, 5-4, 5-10
dialog mode, 2-10-2-22
kernel, 2-16
power-up, 2-14
reconstruct, C-4
reformat, C-4
restart, 2-14
restore, C-4
setup, 2-12-2-22
verify, E-2
Modifying a program, 5-19-5-20
Module. See also the specific module;
floating CSR address
caution, removal, 6-36
communications, 3-4-3-43
configuration instructions, 3-2
contact finger identification, A-I
control register, 3-2
CSR address, to configure, 4-3
ejector levers, 6-38
FRU procedure, 6-36
grant continuity, 6-36
installation guidelines, 4-1, 6-36,
6-39
interupt vector
fixed vector, 3-2
floating vector, 3-2
to configure, 4-3
KDFll-B CPU, 2-22-2-31
KDJll-B CPU, 2-2-2-22
mass storage, 3-44-3-58

Index-10

MSVll-JD, -JE, 2-35-2-43
MSVll-P memory, 2-32-2-35
options, 3-1-3-63
physical priority, 4-1
RQDXI-E, 2-46
RQDXE, 2-46
RQDXn disk controller, 2-44-2-46
status, 5-17
status register, 3-2
TQK50 tape controller, 2-51-2-53
MSVll-JD, -JE memory
battery backup, 2-37
CSR address setting, 2-42-2-43
description, 2-35
discussion, 2-35-2-43
error correction, 2-36
jumper setting, 2-39
LEDs, 2-43
location in backplane, 2-8, 2-36,
2-38
memory address, table, 2-41
memory address setting, 2-402-42
storage capacity, 2-36
switch function, 2-39
MSVll-P memory
additional modules, 2-34
backplane pin assignment, A-3
backplane signal name, A-3
CSR address setting, 2-34
description, 2-32
factory jumper setting, 2-33
LEDs, 2-33
location in backplane, 2-8, 2-29,
2-32
starting address setting,
2-34-2-35
storage capacity, 2-32

Index

Octal display
console emulator mode, 5-4
what to do, 5-4, 5-10
Octal values
adding, D-2
configuration worksheet, D-2
ODT. See also J11 micro ODT;
ROM ODT
commands, table, 5-12
enter, 2-14
]11 micro, 2-14
ROM, 2-21-2-22
using, 5-11
Options
backup devices, 3-51-3-55
communications, 3-4-3-43
guidelines, 3-1
mass storage, 3-44-3-58
to order, 3-1

FRU procedure, 6-27-6-30
installation, 6-29
MicroPDP-11/83, 1-14
part number, 1-14, 6-2
regulators, 6-27
replacement guidelines, 1-14, 6-3
specification, table, 1-15-1-17
VOLT SEL, 1-14
voltage
distribution, 1-13
tolerance, 6-27
Power-up mode
command, 2-14
use, 2-14
Private memory interconnect. See PMI
Processor mastership grant. See PMG
Program modules
deselect, 5-16
select, 5-16

Part numbers, 6-2
Pin assignment
DZVII-A, A-4
KDF11-B, A-2
KDJ11-B, A-2
MSV11-P, A-3
RQDXn, A-5
PMG count
command, 2-14
use, 2-14
values, 2-15
PMI
CD bus, 2-8
data transfer, 2-8, 2-38
location of memory module, 2-38
use, 2-8, 2-38
Power requirements, 4-3-4-4
Power supply
cable removal, 6-24
connectors, 1-14,1-17
control signals, 1-13
description, 1-13-1-17

Q22-Bus backplane
connectors, 1-10-1-11
discussion, 1-10-1-12
grant contunity, 1-12,6-36
module installation, 1-12
Q22-Bus module cover removal,

6-22

RC25 disk subsystem
CSR address
guidelines, 3-44
setting, 3-44
description, 3-44
interrupt vector, 3-44
number of MSCP devices, 3-44
part numbers, 3-44
RD5n fixed disk drive
additional, 6-3
cables, 3-46
caution, head positioner, 6-10
connectors, 1-10
description, 3-46
formatting, 3-49-3-50, C-I-C-2
Index-11

Index

FRU procedure, 6-10
jumper clip, 2-46-2-47, 6-12
location, 1-8
ordering information, 6-3
part numbers, 3-46
RD51 configuration, 3-46, 3-48
RD52 configuration, 3-46, 3-48
RD53 configuration, 3-48
shipping carton part number, 6-10
signal distribution panel, 1-10
when to format, 6-10, 6-12
Read/write board
RD51 fixed disk drive, 6-12-6-15
RD52 fixed disk drive, 6-16-6-19
RD53 fixed disk drive, 6-20
Ready switch, 1-6
Reconstruct mode, C-4
Reformat mode, C-4
Regulators, power supply, 6-27
Related documents, xiv
Removal and replacement. See FRU
Restart mode
command, 2-14
use, 2-14
Restart switch, 1-6
Restart/enable switch, 1-7
Restarting a program, 5-19
Restore mode, C-4
RL02 disk subsystem
controller, 3-57
description, 3-57
part numbers, 3-57
RLV12 controller
CSR address, 3-58
description, 3-57
interrupt vector, 3-58
ROM
KDF11-B boot message, table, 5-9
KDJ11-B boot message, table, 5-4

Index-12

ROM ODT
allowable addresses, 2-21
enter, 2-20-2-21
table of commands, 2-21-2-22
RQDX1-E extender module
description, 2-46
discussion, 2-46-2-48
factory setting, 3-54
installation guidelines, 2-46
jumper location, 3-53
jumper setting, 2-47
when to use, 2-46, 3-53
RQDXE extender module
description, 2-46
discussion, 2-46-2-50
drive arrangements, factory
setting, F-2
factory configuration, F-2
factory jumper setting, 2-49
guidelines, 3-55
installation guidelines, 2-46
jumper configurations, F-1-F-9
jumper setting, 3-55
RX50 and two fixed disks, F-5,
F-7-F-8
RX50 and fixed disk, F-4, F-6
three disk drives, 3-55
typical arrangements, 2-49-2-50
when to use, 2-48, 3-55, F-1
RQDXn disk controller
backplane signal name, A-5
CSR address, 2-46, 3-53
description, 2-44, 3-51
discussion, 2-44-2-46
factory jumper setting, 2-46
interrupt vector, 2-46, 3-53
LEDs, 2-44
location in backplane, 2-44, 3-51
LUN
discussion, B-3
jumpers, B-3

Index

number of drives supported, 2-44,
3-51, 3-53
part numbers, 3-51
starting address, 2-44
Run indicator, 1-5
RX50 diskette drive
cable, 3-56
connectors, 1-10
description, 3-56
diskettes, 6-8
FRU procedure, 6-8
indicator lights, 3-56
permissible number of, 3-56
signal distribution panel, 1-10
Save boot into EEPROM
command, 2-21
use, 2-21
Save the setup table in EEPROM
command, 2-19
use, 2-19
Select program modules, 5-16
Self-test
conditions, 5-1
description, 5-1
using, 2-9, 2-30
Setup dialog command, 2-11
Setup mode, 2-12-2-22
change
automatic boot, 2-18
boot translation, 2-17-2-18
change parameters
command, 2-13
discussion, 2-12-2-16
table, 2-13
using, 2-13
change the switch boot
selection, 2-19
command 1, 2-12
command 2, 2-12-2-16
command 3, 2-17-2-18
command 4, 2-18

command 5, 2-19
command 6, 2-19
command 7, 2-19
command 8, 2-19
command 9, 2-19
command 10, 2-19
command 11, 2-20
command 12, 2-20
command 13, 2-20
command 14, 2-21
command 15, 2-21
command, table, 2-12
delete EEPROM boot, 2-20
edit/create EEPROM boot, 2-20
enter ROM ODT, 2-21
exit, 2-12
initialize the setup table, 2-19
list boot programs, 2-19
load EEPROM boot in
memory, 2-20
load EEPROM data, 2-19
return to, 2-17
save boot into EEPROM, 2-21
save setup table in
EEPROM, 2-19
Setup table
autoboot, 2-9
definition, 2-9
KDJ11-B default values, 2-13
save, 2-19
Signal distribution panel
connectors, 1-10
TK50 installation, 1-10
Signal name
DZV11-A, A-4
KDF11-B, A-2
KDJ11-B, A-2
MSV11-P, A-3
RQDXn, A-5
SLU panel, baud rate switch, 2-6
Starting a program, 5-19

Index-13

Index

Starting address. See also CSR
address; the specific module
MSV11-JD, -JE, 2-40
MSV11-P memory, 2-34
RQDXn disk controller, 2-44
Startup self-test
conditions, 5-1
description, 5-1
Static electricity
caution, 6-1
module, 6-36
Status
module, 5-17
Status error message, 5-16
Subsystem, definition, F-l
Subsystem storage cover, 6-6
Switch
BEVENT, 1-7
Halt, 1-6
LTC, 1-6-1-7
Ready, 1-6
Restart, 1-6
Write-protect, 1-6
Switch setting. See also the specific
module guidelines, 3-2, 3-3
KDFII-B CPU
baud rate, 2-6-2-8
EI02, 2-27
factory, 2-27
KD]11-B CPU, 2-5
module, 6-35
TQK50
revision level, 2-53
unit number, 2-52
typical address example, 3-3
typical vector example, 3-3
System error message, 5-14
Tape drives. See TQK25-EP tape
drive; TQK50 tape controller;
TQK50 tape drive

Index-14

Test, dialog command, 2-11
Testing procedure, 5-1-5-22
TK50 diagnostics. See also CZTKA;
CZTKB
CZTKA user interface, E-2
data reliability tests, E-2
discussion, E-l-E-15
drive errors, table, E-12
level 1 testing, E-2
level 2 testing, E-2
running the tests, E-l
TK50 tape drive. See TQK50
tape drive
TQK25-EP tape drive subsystem
adapter module, 3-60
CSR address, 3-61
description, 3-59
interrupt vector, 3-61
part numbers, 3-59
TQK50 tape controller
CSR address
additional modules, 2-51
first module, 2-51
description, 2-51-2-53
interrupt vector, 2-51
jumper setting, 2-51
LEDs, 2-53
number of drive supported, 2-51
revision level switch, 2-53
unit number
nomenclature, 2-52
switch setting, 2-52
TQK50 tape drive subsystem. See also
TQK50 tape controller
cable, 1-10
controller module, 3-62
CSR address, 3-63
description, 3-61
error table, E-12
installation, 1-10
interrupt vector, 3-63

Index

location, 1-8
part numbers, 3-61
revision level, 3-63
unit number, 3-62
Translation table, example, 2-17
Troubleshooting. See also Diagnostics
BA23 enclosure, 5-21
DEC/XlI run-time exerciser, 5-14
flowchart, 5-21
part numbers, 6-2
to FRU, 5-21, 6-1-6-41
XXDP+ programs, 5-17

Worksheet
adding octal values, D-2
blank, D-4
floating CSR addresses, D-1
instructions, D-1
sample, floating CSR address,
Wrist strap
part number, 6-1
use, 6-1
Write-protect
RD5n fixed disk drive, 6-12
switch, 1-6

Unit number nomenclature
table, B-1
TQK50 tape controller, 2-52
User-friendly diagnostics
diskette part number, 5-12
user test, 5-12
using, 5-12

XXDP+. See also CZTKA; CZTKB
messages format, 5-18
modify a program, 5-19, 5-20
on-line help, 5-13
programs, table, 5-18
RD52 format, 5-18
restart a program, 5-19
revision, 5-14
run-time exerciser, 5-13
software system, 5-13
start a program, 5-19
test reports, 5-18
TK50 diagnostics, E-1

Vector
fixed, definition, 3-2
floating, definition, 3-2
how to configure, 4-3
worksheet, 4-6
Verify mode, tests, E-2, E-5
VOLT SEL, 1-14, 1-17
Voltage
power supply, 6-27
tolerance, 6-27

D-3

Index-15

C, MR-14882; I-I, MR-ISI62; 1-2, MR-lS212; 1-3, MR-ISI83; 1-4, MR-134S4; I-S, MR-ISI68; 1-6, MR-lSI67; 1-7, MR-lSI6S;
1-8, MR-ISI64; 1-9, MR-11887; 1-10, MR-9416; 1-11, MR-15213; 1-12, MR-953S; 1-13, MR-13345; 1-14, MR-lSI63; 2-1, MR-14070;
2-2, MR-14922; 2-3, MR-14069; 2-4, MR-9407; 2-5, MR-13096; 2-6, MR-14071; 2-7, MR-15984; 2-8, MR-lS982; 2-9, MR-lS981;
2-10, MR-15983; 2-11, MR-14081, MR-14234; 2-12, MR-13058; 2-13, MR-lS295; 3-1, MR-14072; 3-2, MR-lS584; 3-3, MR-14074;
3-4, MR-15S88; 3-S, MR-14271; 3-6, MR-15196; 3-7, MR-14798; 3-8, MR-lSS89; 3-9, MR-14075; 3-10, MR-lS58S, MR-15580;
3-11, MR-14236; 3-12, MR-15S82; 3-13, MR-14077; 3-14, MR-lS199; 3-15, MR-14076; 3-16, MR-lS187; 3-17, MR-14797;
3-18, MR-15581; 3-19, MR-14078; 3-20, MR-15200; 3-21, MR-lS244; 3-22, MR-155S:J; ]-2:1, MR-14079; 3-24, MR-ISS86;
3-25, MR-14235; 3-26, MR-15587; 3-27, MR-15172; 3-28, MR-14080; 3-29, MR-14040; 3-30, MR-IJ047; 3-31, MR-14081, MR-14234;
3-32, MR-130S8; 3-33, MR-14041; 3-34, MR-14042; 3-3S, MR-14084; 3-36, MR-15173; 3-37, MR-14082; 3-38, MR-15160;
3-39, MR-140S3; 4-1, MR-1528S; 4-2, MR-lSI90; 4-3, MR-lS293; 4-4, MR-15338; 4-5, MR-15294; S-I, MR-1SIS9, MR-15161;
5-2, MR-15214, MR-IS2IS; 6-1, MR-15164; 6-2, MR-151S4; 6-3, MR-15174; 6-4, MR-lSI7S; 6-5, MR-12047, MR-15185; 6-6, MR-15176;
6-7, MR-15177; 6-S, MR-1517S; 6-9, MR-15179; 6-10, MR-15219; 6-11, MR-1521S; 6-12, MR-15217; 6-13, MR-lS220; 6-14, MR-15224;
6-15, MR-IS693; 6-16, MR-ISI93; 6-17, MR-15180; 6-18, MR-lSI81; 6-19, MR-15182; 6-20, MR-lS208; 6-21, MR-15207;
6-22, MR-15169; 6-23, MR-lS170; 6-24, MR-lSI94; 6-25, MR-1522S, MR-15226; 6-26, MR-15222; 6-27, MR-lS227; 6-2S, MR-15211;
6-29, MR-15228, MR-IS223; 6-30, MR-15188; 6-31, MR-15221; 6-32, MR-15195; A-I, MR-S4S6; F-I, MR-15973; F-2, MR-lS974;
F-3, MR-lS975; F-4, MR-15976; F-S, MR-lS977; F-6, MR-lS978; F-7, MR-15979; F-8, MR-15980