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Document:	VAX 6000 Models 300 and 400 Service Manual
Order Number:	EK-624EA-MG
Revision:	001
Pages:	299
Original Filename:

OCR Text

VAX 6000 Models 300 and 400
Service Manual

Order Number EK–624EA–MG–001

This manual is intended for Digital customer service
engineers. It covers the <REFERENCE>(xyp) and
<REFERENCE>(xrp) CPU options, the <REFERENCE>(xma2)
memory, the <REFERENCE>(xrv) vector option, and
the <REFERENCE>(xbi_plus) I/O adapter. This manual is to be used with the VAX 6000 Platform Service
Manual.

digital equipment corporation
maynard, massachusetts

First Printing, December 1990
The information in this document is subject to change without notice and should not be
construed as a commitment by Digital Equipment Corporation.
Digital Equipment Corporation assumes no responsibility for any errors that may appear in
this document.
The software, if any, described in this document is furnished under a license and may be used
or copied only in accordance with the terms of such license. No responsibility is assumed
for the use or reliability of software or equipment that is not supplied by Digital Equipment
Corporation or its affiliated companies.
Copyright ©1990 by Digital Equipment Corporation.
All Rights Reserved.
Printed in U.S.A.

The following are trademarks of Digital Equipment Corporation:
DEMNA
DEC
DEC LANcontroller
DECnet
DECUS

PDP
ULTRIX
UNIBUS
VAX
VAXBI

VAXcluster
VAXELN
VMS
XMI

FCC NOTICE: The equipment described in this manual generates, uses, and may emit
radio frequency energy. The equipment has been type tested and found to comply with the
limits for a Class A computing device pursuant to Subpart J of Part 15 of FCC Rules, which
are designed to provide reasonable protection against such radio frequency interference when
operated in a commercial environment. Operation of this equipment in a residential area
may cause interference, in which case the user at his own expense may be required to take
measures to correct the interference.

Contents
Preface

xiii

Chapter 1 Introduction
1.1
1.2
1.3
1.4

Why Read This Document . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Functional Description . . . . . . . . . . . . . . . . . . . . . . .
Identifying the Platform Remotely . . . . . . . . . . . . . . . . . . . . .
Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . .

1–2
1–4
1–6
1–8

Chapter 2 Diagnostics
2.1
2.2
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.3.5
2.3.6
2.3.7
2.3.8
2.4
2.4.1
2.4.2
2.4.3
2.4.4

Diagnostic Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Self-Test and Additional Power-Up Tests . . . . . . . . . . . . . . . .
ROM-Based Diagnostic Monitor and Its Control . . . . . . . . . .
ROM-Based Diagnostic Programs . . . . . . . . . . . . . . . . . . .
START Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
START Command Qualifiers . . . . . . . . . . . . . . . . . . . . . . .
RBD Test Printout, Passing . . . . . . . . . . . . . . . . . . . . . . . .
RBD Test Printout, Failing . . . . . . . . . . . . . . . . . . . . . . . .
SUMMARY Command . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sample RBD Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Running ROM-Based Diagnostics on VAXBI Devices . . . . .
VAX Diagnostic Supervisor Programs . . . . . . . . . . . . . . . . . .
Booting the Diagnostic Supervisor from a CD Server . . . .
Running VAX/DS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sample VAX/DS Session . . . . . . . . . . . . . . . . . . . . . . . . . . .
VAX/DS Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–2
2–4
2–8
2–10
2–14
2–15
2–18
2–20
2–22
2–24
2–28
2–30
2–32
2–34
2–36
2–42

iii

Chapter 3 <REFERENCE>(xyp) Scalar Processor
3.1
KA62B Physical Description and Specifications . . . . . . . . . . .
3.2
<REFERENCE>(xyp) Configuration Rules . . . . . . . . . . . . . . .
3.3
KA62B Functional Description . . . . . . . . . . . . . . . . . . . . . . . .
3.4
Boot Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5
Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6
<REFERENCE>(xyp) Self-Test Results: Console Display . . .
3.7
<REFERENCE>(xyp) Self-Test Results: Module LEDs . . . . .
3.8
ROM-Based Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.1
<REFERENCE>(xyp) Self-Test — RBD 0 . . . . . . . . . . . . .
3.8.2
CPU/Memory Test — RBD 1 . . . . . . . . . . . . . . . . . . . . . . .
3.8.3
Second-Level Cache Test — RBD 4 . . . . . . . . . . . . . . . . . .
3.9
VAX/DS Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10 Machine Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.11 Console Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.12 CPU Replacement in Single CPU Systems . . . . . . . . . . . . . . .
3.12.1 Using the RESTORE Command . . . . . . . . . . . . . . . . . . . . .
3.12.2 Using SET Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13 CPU Replacement in Multiple CPU Systems . . . . . . . . . . . . .
3.14 How to Add a New Processor . . . . . . . . . . . . . . . . . . . . . . . . .
3.15 Patching the EEPROM with EVUCA . . . . . . . . . . . . . . . . . . .
3.16 <REFERENCE>(XYP) Registers . . . . . . . . . . . . . . . . . . . . . .

3–2
3–4
3–6
3–10
3–12
3–16
3–18
3–24
3–26
3–30
3–32
3–34
3–36
3–38
3–40
3–40
3–42
3–44
3–48
3–50
3–54

Chapter 4 <REFERENCE>(XRP) Scalar Processor
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10

<REFERENCE>(XRP) Physical Description and
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(XRP) Configuration Rules . . . . . . . . . . . . . .
KA64A Functional Description . . . . . . . . . . . . . . . . . . . . . . . .
Boot Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(XRP) Self-Test Results: Console Display . . .
<REFERENCE>(XRP) Self-Test Results: Module LEDs . . . .
<REFERENCE>(XRP) Self-Test Results: XGPR Register . . .
ROM-Based Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(XRP) ROM-Based Diagnostics . . . . . . . . . . .

4–2
4–4
4–6
4–10
4–12
4–18
4–20
4–24
4–28
4–30

4.10.1 Self-Test — RBD 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.10.2 CPU/Memory Interaction Tests — RBD 1 . . . . . . . . . . . . .
4.11 VAX/DS Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.12 Machine Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.13 Console Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.14 <REFERENCE>(XRP) Handling Procedures . . . . . . . . . . . . .
4.15 CPU Replacement in Single CPU Systems . . . . . . . . . . . . . . .
4.15.1 Using the RESTORE Command . . . . . . . . . . . . . . . . . . . . .
4.15.2 Using SET Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.16 CPU Replacement in Multiple CPU Systems . . . . . . . . . . . . .
4.17 How to Add a New Processor . . . . . . . . . . . . . . . . . . . . . . . . .
4.18 Patching the EEPROM with EVUCA . . . . . . . . . . . . . . . . . . .
4.19 <REFERENCE>(XRP) Registers . . . . . . . . . . . . . . . . . . . . . .

4–30
4–34
4–36
4–38
4–40
4–42
4–46
4–46
4–48
4–50
4–54
4–56
4–60

Chapter 5 <REFERENCE>(XRV) Vector Processor
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13

<REFERENCE>(xrv) Physical Description and Specifications
KA64A/FV64A Coprocessors . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(xrv) Configuration Rules . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Self-Test Results: Console Display and Self-Test LED . . . . . .
Self-Test Results: Scalar XGPR Register . . . . . . . . . . . . . . . .
Vector Processor Tests — RBD 0 and RBD 1 . . . . . . . . . . . . .
VAX/DS Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Machine Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Vector Console Commands . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(xrv) Handling Procedures . . . . . . . . . . . . . .
How to Replace a Vector Module . . . . . . . . . . . . . . . . . . . . . .
Vector Processor Registers . . . . . . . . . . . . . . . . . . . . . . . . . . .

5–2
5–4
5–6
5–8
5–10
5–12
5–14
5–16
5–17
5–18
5–22
5–26
5–28

Chapter 6 MS65A Memory
6.1
6.2
6.3
6.4

MS65A Physical Description . . . . . . . . . . . . . . . . . . . . . . . . .
MS65A Configuration Rules . . . . . . . . . . . . . . . . . . . . . . . . . .
MS65A Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MS65A Functional Description . . . . . . . . . . . . . . . . . . . . . . .

6–2
6–4
6–5
6–6

6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14

System Interleaving Requirements . . . . . . . . . . . . . . . . . . . .
MS65A Interleaving . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Console Commands for Interleaving . . . . . . . . . . . . . . . . . . .
MS65A Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Self-Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Self-Test Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory RBD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory RBD Test Examples . . . . . . . . . . . . . . . . . . . . . . . . .
MS65A Control and Status Registers . . . . . . . . . . . . . . . . . . .
Mixing MS65A and MS62A Memory Modules . . . . . . . . . . . .

6–8
6–10
6–12
6–14
6–16
6–18
6–20
6–22
6–24
6–26

Chapter 7 DWMBB I/O Adapter
7.1
7.1.1
7.1.2
7.2
7.3
7.4
7.5
7.6

DWMBB Physical Description . . . . . . . . . . . . . . . . . . . . . . . . 7–2
Physical Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4
<REFERENCE>(xbi_plus) Configuration Rules . . . . . . . . . . . 7–6
DWMBB Functional Description . . . . . . . . . . . . . . . . . . . . . . 7–8
<REFERENCE>(xbi_plus) Tests — RBD 2 . . . . . . . . . . . . . . . 7–10
DWMBB Tests — RBD 2 Subtests . . . . . . . . . . . . . . . . . . . . . 7–12
<REFERENCE>(xbi_plus) Registers . . . . . . . . . . . . . . . . . . . 7–14

Appendix A Console Error Messages for Model 300
Appendix B Console Error Messages for Model 400
Appendix C EEPROM Mismatches and the UPDATE Command

Appendix D Control Flags for Booting

Glossary

Index
Examples
2–1
2–2
2–3
2–4
2–5
2–6
2–7
2–8
2–9
2–10
2–11
2–12
2–13
2–14
3–1
3–2
3–3
3–4
3–5
3–6
3–7
3–8
3–9
3–10
3–11
3–12

Sample Self-Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . .
START Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RBD Test Printout, Passing . . . . . . . . . . . . . . . . . . . . . . . . . .
RBD Test Printout, Failing . . . . . . . . . . . . . . . . . . . . . . . . . .
SUMMARY Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sample RBD Session, Part 1 of 2 . . . . . . . . . . . . . . . . . . . . . .
Sample RBD Session, Part 2 of 2 . . . . . . . . . . . . . . . . . . . . . .
VAXBI RBD Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Booting the Diagnostic Supervisor over the Ethernet . . . . . .
Running Standalone VAX/DS from a TK70 . . . . . . . . . . . . . .
Running VAX/DS in User Mode . . . . . . . . . . . . . . . . . . . . . . .
Sample VAX/DS Session, Part 1 of 3 . . . . . . . . . . . . . . . . . . .
Sample VAX/DS Session, Part 2 of 3 . . . . . . . . . . . . . . . . . . .
Sample VAX/DS Session (Model 400 Only), Part 3 of 3 . . . . .
ROM and EEPROM Version Numbers . . . . . . . . . . . . . . . . . .
Self-Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(xyp) Self-Test RBD 0 . . . . . . . . . . . . . . . . . .
CPU/memory Test RBD 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Second-Level Cache Test RBD 4 . . . . . . . . . . . . . . . . . . . . . . .
Running Standalone Processor Diagnostics . . . . . . . . . . . . . .
Replacing a Single Processor . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing a Single Processor . . . . . . . . . . . . . . . . . . . . . . . . .
Retrieving EEPROM Information . . . . . . . . . . . . . . . . . . . . .
Customizing an EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . .
Adding a Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Patching the EEPROM with EVUCA — Part 1 . . . . . . . . . . .

2–4
2–14
2–18
2–20
2–22
2–24
2–26
2–28
2–32
2–34
2–35
2–36
2–38
2–40
3–8
3–16
3–26
3–30
3–32
3–34
3–40
3–42
3–44
3–46
3–48
3–50

vii

3–13
4–1
4–2
4–3
4–4
4–5
4–6
4–7
4–8
4–9
4–10
4–11
4–12
4–13
4–14
5–1
5–2
5–3
5–4
6–1
6–2
6–3
6–4
6–5
6–6
7–1

viii

Patching the EEPROM with EVUCA — Part 2 . . . . . . . . . . .
ROM and EEPROM Version Numbers . . . . . . . . . . . . . . . . . .
Self-Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
XGPR Register After Power-Up Test Failure . . . . . . . . . . . . .
Self-Test — RBD 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Running <REFERENCE>(XRP) Self-Test (RBD 0) on a
Secondary Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CPU/Memory Interaction Tests — RBD 1 . . . . . . . . . . . . . . .
VAX/DS Commands for Running Standalone Processor
Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing a Single Processor . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing a Single Processor . . . . . . . . . . . . . . . . . . . . . . . . .
Retrieving EEPROM Information . . . . . . . . . . . . . . . . . . . . .
Customizing an EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . .
Adding a Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Patching the EEPROM with EVUCA — Part 1 . . . . . . . . . . .
Patching the EEPROM with EVUCA — Part 2 . . . . . . . . . . .
Self-Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
XGPR Register After Power-Up Test Failure . . . . . . . . . . . . .
Running RBD 0 on a Secondary Processor with an Attached
Vector Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VAX/DS Commands for Testing Vector Processors . . . . . . . . .
SET MEMORY and INITIALIZE Commands . . . . . . . . . . . . .
MS65A Memory Module Results in Self-Test . . . . . . . . . . . . .
MS65A Memory Module Node Exclusion . . . . . . . . . . . . . . . .
RBD 3 — Test on All Modules with Halt on Error . . . . . . . . .
RBD 3 — Test with Confirm Switch . . . . . . . . . . . . . . . . . . . .
RBD 3 — Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(xbi_plus) Tests — RBD 2 . . . . . . . . . . . . . . .

3–52
4–8
4–18
4–24
4–30
4–31
4–34
4–36
4–46
4–48
4–50
4–52
4–54
4–56
4–58
5–10
5–12
5–14
5–16
6–12
6–16
6–18
6–22
6–22
6–23
7–10

Figures
1–1
1–2
1–3
2–1
3–1
3–2
3–3
3–4
3–5
3–6
3–7
3–8
4–1
4–2
4–3
4–4
4–5
4–6
4–7
4–8
4–9
4–10

<REFERENCE>(2X) System Architecture . . . . . . . . . . . . . . .
Power-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Booting the Operating System . . . . . . . . . . . . . . . . . . . . . . . .
Diagnostics Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(XYP) Module . . . . . . . . . . . . . . . . . . . . . . . .
Typical <REFERENCE>(xyp) Configuration . . . . . . . . . . . . .
<REFERENCE>(xyp) Block Diagram . . . . . . . . . . . . . . . . . . .
Selection of Boot Processor . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(xyp) Power-Up Sequence, Part 1 of 2 . . . . .
<REFERENCE>(XYP) Power-Up Sequence, Part 2 of 2 . . . . .
<REFERENCE>(xyp) LEDs After Power-Up Self-Test . . . . . .
The Stack in Response to a Machine Check . . . . . . . . . . . . . .
<REFERENCE>(XRP) Module . . . . . . . . . . . . . . . . . . . . . . . .
Typical <REFERENCE>(XRP) Configuration . . . . . . . . . . . . .
<REFERENCE>(XRP) Block Diagram . . . . . . . . . . . . . . . . . .
Selection of Boot Processor . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(XRP) Power-Up Sequence, Part 1 of 2 . . . . .
<REFERENCE>(XRP) Power-Up Sequence, Part 2 of 2 . . . . .
<REFERENCE>(XRP) LEDs After Power-Up Self-Test . . . . .
The Stack in Response to a Machine Check . . . . . . . . . . . . . .
Holding the <REFERENCE>(XRP) Module . . . . . . . . . . . . . .
Inserting the <REFERENCE>(XRP) Module in an XMI Card
Cage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5–1 <REFERENCE>(XRV) Module (Side 1) . . . . . . . . . . . . . . . . .
5–2 <REFERENCE>(XRV) Module (Side 2) . . . . . . . . . . . . . . . . .
5–3 VAX 6000 Model 400 Vector Processing System . . . . . . . . . . .
5–4 Scalar/Vector Configurations . . . . . . . . . . . . . . . . . . . . . . . . .
5–5 <REFERENCE>(XRV) Block Diagram . . . . . . . . . . . . . . . . . .
5–6 XGPR Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5–7 The Stack in Response to a Machine Check . . . . . . . . . . . . . .
5–8 Holding the <REFERENCE>(xrv) Module . . . . . . . . . . . . . . .
5–9 Inserting the <REFERENCE>(xrv) Module in an XMI Card
Cage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5–10 Replacing a Vector Module in an XMI Card Cage . . . . . . . . .
6–1 MS65A Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–4
1–8
1–10
2–2
3–2
3–4
3–6
3–10
3–12
3–14
3–19
3–36
4–2
4–4
4–6
4–10
4–13
4–16
4–20
4–38
4–42
4–44
5–2
5–3
5–4
5–6
5–8
5–12
5–17
5–22
5–24
5–26
6–2

6–2
6–3
6–4
6–5
7–1
7–2
7–3
7–4

MS65A Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–4
MS65A Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6
Examples of Interleaving . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–10
Memory Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–14
<REFERENCE>(XBIA_TITLE) . . . . . . . . . . . . . . . . . . . . . . . 7–2
<REFERENCE>(XBIB_TITLE) . . . . . . . . . . . . . . . . . . . . . . . 7–3
VAX 6000 Slot Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6
<REFERENCE>(XBI_TITLE) Block Diagram . . . . . . . . . . . . 7–8

Tables
1
1–1
2–1
2–2
2–3
2–4
2–5
2–6
2–7
2–8
2–9
3–1
3–2
3–3
3–4
3–5
3–6
3–7
3–8
3–9
3–10
3–11

Associated Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VAX 6000 Platform Differences . . . . . . . . . . . . . . . . . . . . . . .
Self-Test Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RBD Monitor Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RBD Monitor Control Characters . . . . . . . . . . . . . . . . . . . . . .
ROM-Based Diagnostic Programs for KA62B . . . . . . . . . . . . .
ROM-Based Diagnostic Programs for KA64A . . . . . . . . . . . . .
START Command Qualifiers . . . . . . . . . . . . . . . . . . . . . . . . .
VAX Diagnostic Program Levels . . . . . . . . . . . . . . . . . . . . . . .
VAX/DS Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VAX Diagnostic Supervisor Programs . . . . . . . . . . . . . . . . . .
KA62B Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
KA62B Error LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
KA62B ROM-Based Diagnostics . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(xyp) Power-Up Test — RBD 0 . . . . . . . . . .
Extended CPU/Memory Test — RBD 1 . . . . . . . . . . . . . . . . .
Second-Level Cache Test — RBD4 . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(xyp) VAX/DS Diagnostics . . . . . . . . . . . . . .
Machine Check Parameters . . . . . . . . . . . . . . . . . . . . . . . . . .
Console Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(xyp) Internal Processor Registers . . . . . . . .
<REFERENCE>(XMI) Registers for the the
<REFERENCE>(xyp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3–12 <REFERENCE>(xyp) Registers in <REFERENCE>(XMI)
Private Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4–1 <REFERENCE>(XRP) Specifications . . . . . . . . . . . . . . . . . . .

xvi
1–2
2–5
2–8
2–8
2–10
2–10
2–15
2–30
2–30
2–42
3–3
3–22
3–24
3–26
3–31
3–33
3–34
3–36
3–38
3–54
3–57
3–58
4–3

4–2
4–3
4–4
4–5
4–6
4–7
4–8
4–9
4–10
4–11
4–12

<REFERENCE>(XRP) Error LEDs . . . . . . . . . . . . . . . . . . . .
XMI Base Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interpreting XGPR Failing Test Numbers . . . . . . . . . . . . . . .
ROM-Based Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(XRP) Self-Test — RBD 0 . . . . . . . . . . . . . . .
CPU/Memory Interaction Tests — RBD 1 . . . . . . . . . . . . . . .
<REFERENCE>(XRP) VAX/DS Diagnostics . . . . . . . . . . . . . .
Machine Check Parameters . . . . . . . . . . . . . . . . . . . . . . . . . .
Console Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
<REFERENCE>(XRP) Internal Processor Registers . . . . . . .
<REFERENCE>(XMI) Registers for the
<REFERENCE>(XRP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4–13 <REFERENCE>(XRP) Registers in <REFERENCE>(XMI)
Private Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5–1 <REFERENCE>(XRV) Specifications . . . . . . . . . . . . . . . . . . .
5–2 Processor Module Combinations . . . . . . . . . . . . . . . . . . . . . . .
5–3 Interpreting XGPR Failing Test Numbers . . . . . . . . . . . . . . .
5–4 Vector Processor Tests in Self-Test — RBD 0 . . . . . . . . . . . . .
5–5 Vector Tests in CPU/Memory Interaction Tests — RBD 1 . . .
5–6 <REFERENCE>(XRV) VAX/DS Diagnostics . . . . . . . . . . . . . .
5–7 <REFERENCE>(xrv) Machine Check Parameters . . . . . . . . .
5–8 Vector Console Commands . . . . . . . . . . . . . . . . . . . . . . . . . . .
5–9 <REFERENCE>(XRV) Internal Processor Registers . . . . . . .
6–1 <REFERENCE>(xma2_title) Specifications . . . . . . . . . . . . . .
6–2 VAX 6000 Interleaving Requirements . . . . . . . . . . . . . . . . . .
6–3 Memory Tests — RBD 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6–4 RBD 3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6–5 <REFERENCE>(xma2) Control and Status Registers . . . . . .
6–6 Memory Module Configurations . . . . . . . . . . . . . . . . . . . . . . .
7–1 DWMBB/A Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7–2 DWMBB/B Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7–3 <REFERENCE>(xbi_plus) Cables . . . . . . . . . . . . . . . . . . . . .
7–4 <REFERENCE>(xbi_plus) Configuration . . . . . . . . . . . . . . . .
7–5 <REFERENCE>(xbi_plus_title) RBD Tests . . . . . . . . . . . . . .
7–6 VAXBI Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7–7 <REFERENCE>(xbi_plus) XMI Registers . . . . . . . . . . . . . . .

4–22
4–25
4–26
4–28
4–32
4–35
4–36
4–38
4–40
4–60
4–64
4–65
5–5
5–7
5–13
5–15
5–15
5–16
5–17
5–18
5–28
6–5
6–8
6–20
6–21
6–24
6–26
7–4
7–5
7–5
7–7
7–12
7–14
7–15

A–1
A–2
B–1
B–2
C–1
D–1
D–2

xii

Model 300 Console Error Messages Indicating Halt . . . . . . . .
Model 300 Standard Console Error Messages . . . . . . . . . . . .
Model 400 Console Error Messages Indicating Halt . . . . . . . .
Model 400 Standard Console Error Messages . . . . . . . . . . . .
UPDATE Results on EEPROM Mismatches . . . . . . . . . . . . . .
R5 Bit Functions for VMS . . . . . . . . . . . . . . . . . . . . . . . . . . .
R5 Bit Functions for ULTRIX . . . . . . . . . . . . . . . . . . . . . . . .

A–1
A–3
B–1
B–3
C–1
D–1
D–2

Preface

The VAX 6000 Family
The first product in this midrange multiprocessing VAX family is the
<REFERENCE>(calypso). Second, the <REFERENCE>(hyperion) offered
higher performance, with a faster processor and a more efficient console
tape drive (TK70). The third CPU in the series is <REFERENCE>(rigel),
which uses advanced technology for more enhanced performance. All
models have two versions — a traditional multiuser timesharing system
and a VAXserver for diskless computers and workstations.
The VAX 6000 Model 500 introduces a new XMI backplane and power
subsystem. While the older versions of the VAX 6000 series relied on
a VAXBI and its options for I/O, the newer versions have several I/O
adapters that provide I/O directly from the XMI. This manual covers
the <REFERENCE>(xyp) and <REFERENCE>(xrp) CPUs in the newer
cabinet. Please make sure you have the correct manuals for the systems
you are servicing.

Intended Audience
This manual is written for Digital customer service engineers servicing the
<REFERENCE>(2x) systems in the VAX 6000 series platform. The manual
covers the second and third of the three CPUs in this series. The KA62A
will not be shipped in the new <REFERENCE>(XMI2) being introduced
with the VAX 6000 Model 500.

Document Structure
This manual uses a structured documentation design. There are many
topics, organized into small sections for efficient reference. Each topic
begins with an abstract. You can quickly gain a comprehensive overview
by reading only the abstracts. Next is an illustration or example, which
also provides quick reference. Last in the structure is descriptive text.

xiii

This manual has seven chapters and five appendixes:
•

Chapter 1, Introduction, states why this manual is being written. It
also describes how to tell what power and packaging variant you have
from the console.

•

Chapter 2, Diagnostics, describes self-test, general methods for
running ROM-based diagnostics, and diagnostics run under the VAX
Diagnostic Supervisor. Refer to specific chapters for information on
running diagnostics on CPUs, memory, and options.

•

Chapter 3, <REFERENCE>(xyp) Scalar Processor, describes
the <REFERENCE>(hyperion) processor giving module specifications,
configuration rules, functional descriptions, and register descriptions.
Diagnostics and module replacement are also discussed.

•

Chapter 4, <REFERENCE>(xrp) Scalar Processor, describes
the <REFERENCE>(rigel) processor giving module specifications,
configuration rules, functional descriptions, and register descriptions.
Diagnostics and module replacement are also discussed.

•

Chapter 5, <REFERENCE>(xrv) Vector Processor, describes the
vector processor option available with the <REFERENCE>(rigel)
system. Diagnostics and module replacement are also discussed.

•

Chapter 6, <REFERENCE>(XMA2) Memory, gives module
specifications, configuration rules, register descriptions, and functional
descriptions of this memory module. Diagnostics, module replacement,
interleaving, and memory addressing are also discussed.

•

Chapter 7, <REFERENCE>(xbi_plus) I/O Adapter, describes
the I/O adapter to the VAXBI option available on either the
<REFERENCE>(hyperion) or the <REFERENCE>(rigel) systems.

•

Appendix A lists the <REFERENCE>(hyperion) console error
messages.

•

Appendix B lists the <REFERENCE>(rigel) console error messages.

•

Appendix C describes the results of executing the UPDATE command
when different ROM revisions are in a system.

•

Appendix D describes the boot flags used when booting either the VMS
or ULTRIX operating systems.

xiv

VAX 6000 Series Documents
These documents apply to all VAX 6000 systems.
Title

Order Number

VAX 6000 Series Installation Guide

EK–600EA–IN

VAX 6000 Series Owner’s Manual

EK–600EA–OM

VAX 6000 Platform Service Manual

EK–600EA–MG

VAX 6000 Series Platform Technical User’s Guide

EK–600EA–TM

VAX 6000 Models 200 and 300 Documents
These documents should be used for systems shipped before the VAX 6000
Model 500. The VAX 6200/6300 documentation set includes the following:
Title: VAX 6200

Order Number

Options and Maintenance

EK–620AB–MG

System Technical User’s Guide

EK–620AA–TM

<REFERENCE>(RIGEL) Documents
These documents should be used for systems shipped before the VAX 6000
Model 500. Documents in the VAX 6000–400 documentation set include:
Title

Order Number

VAX 6000–400 System Technical User’s Guide

EK–640EB–TM

VAX 6000–400 Options and Maintenance

EK–640EB–MG

VAX 6000–400 Maintenance Advisory

EK–640EA–MA

VAX 6000 Series Upgrade Manual

EK–600EB–UP

VAX 6000 Series Vector Processor Owner’s Manual

EK–60VAA–OM

VAX 6000 Series Vector Processor Programmer’s Guide

EK–60VAA–PG

Associated Documents
Other documents that you may find useful include:

Table 1: Associated Documents
Title

Order Number

System Hardware Options
VAXBI Expander Cabinet Installation Guide

EK–VBIEA–IN

VAXBI Options Handbook

EB–32255–46

System I/O Options
CIBCA User Guide

EK–CIBCA–UG

CIXCD Interface User Guide

EK–CIXCD–UG

DEBNI Installation Guide

EK–DEBNI–IN

DEClancontroller 400 Installation Guide

EK–DEMNA–IN

InfoServer 100 Installation and Owner’s Guide

EK–DIS1K–IN

KDB50 Disk Controller User’s Guide

EK–KDB50–UG

KDM70 Disk Controller User’s Guide

EK–KDM70–UG

KFMSA Module Installation and User Manual

EK–KFMSA–IM

RRD40 Disc Drive Owner’s Manual

EK–RRD40–OM

RA90/RA92 Disk Drive User Guide

EK–ORA90–UG

SA70 Enclosure User Guide

EK–SA70E–UG

Operating System Manuals
Guide to Maintaining a VMS System

AA–LA34A–TE

Guide to Setting Up a VMS System

AA–LA25A–TE

Introduction to VMS System Management

AA–LA24A–TE

ULTRIX–32 Guide to System Exercisers

AA–KS95B–TE

xvi

Table 1 (Cont.): Associated Documents
Title

Order Number

Operating System Manuals
VMS Installation and Operations: VAX 6000 Series

AA–LB36B–TE

VMS Networking Manual

AA–LA48A–TE

VMS System Manager’s Manual

AA–LA00A–TE

VMS VAXcluster Manual

AA–LA27A–TE

Peripherals
HSC Installation Manual

EK–HSCMN–IN

H4000 DIGITAL Ethernet
Transceiver Installation Manual

EK–H4000–IN

Installing and Using the VT320 Video Terminal

EK–VT320–UG

RV20 Optical Disk Owner’s Manual

EK–ORV20–OM

SC008 Star Coupler User’s Guide

EK–SC008–UG

TA78 Magnetic Tape Drive User’s Guide

EK–OTA78–UG

TA90 Magnetic Tape Subsystem Owner’s Manual

EK–OTA90–OM

TK70 Streaming Tape Drive Owner’s Manual

EK–OTK70–OM

TU81/TA81 and TU/81 PLUS Subsystem User’s Guide

EK-TUA81-UG

VAX Manuals
VAX Architecture Reference Manual

EY–3459E–DP

VAX Systems Hardware Handbook — VAXBI Systems

EB–31692–46

VAX Vector Processing Handbook

EC–H0739–46

xvii

Chapter 1

Introduction
With the introduction of the VAX 6000 Model 500 several changes were
made to improve the platform in which the various VAX 6000 models
reside. This chapter discusses the changes between the XMI-1 and XMI-2
platforms. Sections include:
•

Why Read This Document

•

System Functional Description

•

Identifying the Platform Remotely

•

Troubleshooting Flowcharts

Introduction 1–1

1.1 Why Read This Document
The VAX 6000 series platform has changed to accommodate
features of the VAX 6000 Model 500. Several XMI I/O adapters
are also now available and can be installed in any XMI card
cage. A new power regulator, capable of providing enough
current at +3.3 volts for the VAX Model 500, is inhibited in
the H9657 cabinet for Models 300 and 400. A more powerful
battery backup unit (BBU) option, capable of providing
power to the entire backplane, is available.

Table 1–1: VAX 6000 Platform Differences
Item

XMI-1 Platform

XMI-2 Platform

XMI backplane

XMI-1

XMI-2

Cabinet number

70-24900-XX

H9657-XX

XMI I/O adapters

DWMBA

CIXCD,
KDM70,

VAXBI

Required
DWMBA adapter
Two 6-slot channels

Optional1
DWMBB adapter
One 12-slot channel

Load device

TK50 or TK70

Optional1

XTC

20–29176-01

20–29176-02

Power regulators

+5V
– H7214
+5VBB
– H7214
-5, -2, 12 – H7215

+5V
– H7214
+5VBB
– None2
-5, -2, 12 – H7215
+3.3V
– H7242

Power logic

H7206-A

H7206-B

Battery backup

H7231-N

H7236-A2

Inhibit cable

None

17-02522-01

DEMNA,
DWMBB

1 Either a VAXBI with a TK70 or a CD server is required as a system load device.
2 In the XMI-2 backplane +5V and what was +5VBB are tied together.
Since the
VAX 6000 Model 500 uses a writeback cache design, the CPU’s cache also needed battery backup and the need for a separate +5VBB to back up only memory disappeared. The H7236-A BBU delivers more power than the H7231-N BBU.

1–2

VAX 6000 Models 300 and 400 Service Manual

Table 1–1 shows the major differences between the two platforms. Although
this manual does not cover the differences in detail, it does cover
the <REFERENCE>(2x) systems, the <REFERENCE>(xma2), and the
DWMBB in the XMI-2 cabinet. Other documentation covers upgrades (see
preface).
Power is distributed differently in the XMI-1 and XMI-2 backplanes.
Therefore, power considerations are important when servicing these
systems. Care must be exercised when replacing broken modules because
of incompatibilities.
The H7242 power regulator provides +3.3 volts to the XMI-2 backplane to
operate the VAX 6000 Model 500. The +3.3 volts is inhibited by a cable if
either a <REFERENCE>(xyp) or a <REFERENCE>(XRP) is in the system.
All XMI adapters have been designed to work on both backplanes with the
exception of the DWMBA. A new XMI-to-VAXBI adapter, the DWMBB, is
used to communicate between the two buses.
There are several ways to tell which cabinet houses your <REFERENCE>(rigel)
or <REFERENCE>(hyperion). Four are described here.
•

Look at the cabinet number on the label on the bottom of the vertical
frame member at the left rear of the cabinet. If this label is hidden
from view by an SA70, you will have to use another method. If the
label indicates a 70 class part number, you have the XMI-1 platform.
If the label indicates an H9657, you have the XMI-2 platform.

•

Open the rear cabinet door and look at the middle power regulator. If
the regulator is an H7242, it is an XMI-2 platform. Otherwise, it is an
XMI-1 platform.

•

Open the rear cabinet door and look to see if the H7242 inhibit cable is
installed. This cable has a large yellow tag on it and is easy to see at a
glance.

•

Open the rear cabinet door and look at the H7206 power logic unit just
above the H405 AC controller. If there are two connectors on the H7206,
the platform is an XMI-2. Otherwise, it is an XMI-1 platform.

For information on the XMI-1 power and packaging, see the VAX 6000–400
Options and Maintenance manual or the VAX 6200/6300 VAXserver 6200/
6300 Options and Maintenance manual. For information on the XMI-2
power and packaging, see the VAX 6000 Platform Service Manual.

Introduction 1–3

1.2 System Functional Description
The <REFERENCE>(2X) systems support multiprocessing with
up to six <REFERENCE>(xyp) or <REFERENCE>(XRP) processors. The system uses a high-speed <REFERENCE>(XMI)
system bus to connect its processors, its memory modules,
and its I/O adapters.

Figure 1–1: <REFERENCE>(2X) System Architecture

MEMORY
PROCESSORS

XMI

DWMBB/A
DEMNA

KDM70

CIXCD

DISKS
AND TAPES

STAR
COUPLER

DWMBB/B
VAXBI

OPTION
ETHERNET
AND CD SERVER

msb-0310-90

The <REFERENCE>(XMI) is the 64-bit system bus connecting all major
subsystems. It has a maximum throughput of 100 Mbytes per second.
Early versions of the VAX 6000 series had no direct XMI I/O. I/O was
achieved through an interface between the XMI bus and the VAXBI bus
which had direct I/O to the CI, disks, tapes, and other I/O devices. Since
direct XMI I/O now exists, the VAXBI is now optional.
The VAXBI and <REFERENCE>(XMI) share the concept of a node. A
node is a single functional unit that consists of one or more modules. The

1–4

VAX 6000 Models 300 and 400 Service Manual

<REFERENCE>(XMI) has three types of nodes: processor nodes, memory
nodes, and I/O adapter nodes.
A processor node, consists of a single-board VAX processor. It contains
a central processor unit (CPU) chip, a floating-point processor, a primary
and secondary cache, a writable EEPROM for system parameters, and a
communication path to the XMI bus. The <REFERENCE>(XRP) has a
chip that communicates with an optional vector processor.
Processors communicate with main memory over the <REFERENCE>(XMI).
The system supports multiprocessing with up to six processors. One processor becomes the boot processor during power-up and handles all system
communication. The other processors become secondary processors and receive system information from the primary processor (see Section 3.4 and
Section 4.4).
The <REFERENCE>(rigel) has an optional vector processor, the
<REFERENCE>(xrv), which executes VAX vector instructions.
This
processor is tightly coupled to the <REFERENCE>(XRP) through a Vector
Interface Bus (VIB) cable connecting the two modules. They occupy
adjacent <REFERENCE>(XMI) slots.
A memory node is an <REFERENCE>(XMA2). In <REFERENCE>(2x)
MS62A may also be installed. See Section 6.14, Mixing MS65A and MS62A
Memory Modules for details. Memory is a global resource and may be
reached by all processors on the <REFERENCE>(XMI). There are three
variants of the <REFERENCE>(xma2); 32-Mbyte, 64-Mbyte, and 128Mbyte. Each memory module has ECC and control logic. The console
program automatically interleaves the memory for maximum performance.
An optional battery backup unit protects all data in case of power failure.
The XMI I/O adapters include the DEMNA, the CIXCD, and the KDM70.
The DEMNA is an Ethernet adapter, the CIXCD is a CI adapter, and the
KDM70 is a disk adapter.
An optional <REFERENCE>(XMI)-to-VAXBI adapter, called a <REFERENCE>(XBI_plus), is a 2-module adapter that maps data between these
two buses. I/O adapters on the VAXBI pass data between the system
and peripheral devices. The <REFERENCE>(XBIA_plus) module is installed on the <REFERENCE>(XMI) bus; it communicates with the <REFERENCE>(XBIB_plus) module on the VAXBI using a 120-pin cable. The
in-cabinet version of the VAXBI in the XMI-2 platform has 12 slots. Each
VAXBI channel must have one <REFERENCE>(xbi_plus) connecting it to
the <REFERENCE>(XMI).
System error messages and self-test results refer to the pair of DWMBB
modules as XBI.

Introduction 1–5

1.3 Identifying the Platform Remotely
Section 1.1 explained how to identify the platform by
inspection. However, persons diagnosing systems remotely
will want to be able to identify system power. While there is
no foolproof method to do this on these systems, the method
given below should work in almost all cases.

Examples of Power Identification Using Show Configuration
1.

>>> SHOW CONFIGURATION
Type
Rev
1+ KA64A
(8082) 0007
3+ KA64A
(8082) 0007
A+ MS62A
(4001) 0002
B+ MS62A
(4001) 0002
D+ DWMBA/A (2001) 0002 1
E+ DWMBA/A (2001) 0002 1

!Likely an XMI-1 system

XBI D
1+ DWMBA/B (2107) 0007
2+ CIBCA
(0108) 41C1
5+ DMB32
(0109) 210B
6+ DEBNI
(0118) 0100
XBI E
1+ DWMBA/B (2107) 0007
4+ KDB50
(010E) 0F1C
6+ TBK70
(410B) 0307

>>> SHOW CONFIGURATION
Type
Rev
4+ KA64A
(8082) 0000
8+ MS65A
(4001) 0084
9+ MS65A
(4001) 0084
A+ CIXCD
(0C05) 1611
B+ DEMNA
(0C03) 0600
E+ DWMBB/A (2002) 0001 2

!Likely an XMI-2 system

XBI E
1+ DWMBB/B (210F) 000A
4+ KDB50
(010E) 131C
6+ KLESI-B (0103) 0006
8+ TBK70
(410B) 0307 3

1–6

VAX 6000 Models 300 and 400 Service Manual

>>> SHOW CONFIGURATION
Type
Rev
1+ <REFERENCE>(XRP)
(8082) 0007
2+ <REFERENCE>(XRP)
(8082) 0007
8+ MS65A
(4001) 0084
9+ MS65A
(4001) 0084
B+ KDM70
(0C22) 1811
D+ CIXCD
(0C05) 1611
E+ DEMNA
(0C03) 0600

!Likely an XMI-2 system

System configuration provides clues to help identify the power
and packaging of <REFERENCE>(hyperion) and <REFERENCE>(rigel)
systems. The examples show output from a SHOW CONFIGURATION
command on three systems.
System 1. The first system is an XMI-1 based system because there are
two DWMBAs at nodes D and E (see 1 in the example). A DWMBA is
not allowed on an XMI-2 based system. Therefore, the proper power and
related FRUs are found in the second column of Table 1–1. There are
also no XMI I/O devices, which is an indication of the XMI-1. The system
also has MS62A memory modules. XMI-2 based systems ship with MS65A
memories.
System 2. The second system is an XMI-2 based system because the XMIto-VAXBI adapter is a DWMBB at node E. A DWMBB is not likely to be
found in an XMI-1 based system. Note also that the VAXBI has node
numbers above six, indicating a 12-slot VAXBI channel. Therefore, the
proper power and related FRUs are found in the third column of Table 1–1.
System 3. The third system is an XMI-2 based system. There is no VAXBI,
the memories are all MS65As, and there is no system load device shown.
Therefore, the proper power and related FRUs are found in the third column
of Table 1–1.

Introduction 1–7

1.4 Troubleshooting Flowcharts
These flowcharts reference sections in this manual.

Figure 1–2: Power-Up

POWER ON

NO
SEE CHAPTER 5 IN

CONSOLE
PROMPT
>>>

VAX 600 PLATFORM
SERVICE MANUAL.

YES

CHECK SELF-TEST RESULTS
FOR ALL MODULES
SEE SECTION 2.2

SCALAR
PROCESSORS
PASS

SEE CHAPTER 3 FOR
KA62B, CHAPTER 4
FOR KA64B

YES

A
msb-0723C-90

1–8

VAX 6000 Models 300 and 400 Service Manual

VECTOR
PROCESSORS
PASS

NO
SEE CHAPTER 5

YES

MEMORY
MODULES
PASS

NO
SEE CHAPTER 6

YES

I/O
ADAPTERS
PASS

SEE CHAPTER 7
OR SPECIFIC I/O
SERVICE MANUAL

YES

BOOT
THE SYSTEM

BOOT
YES
ERROR STATUS
CODES

SEE APPENDIXES
A AND B

NO
SYSTEM
BOOTS

msb-0723D-90

Introduction 1–9

Figure 1–3: Booting the Operating System

BOOT
OPERATING
SYSTEM

MACHINE CHECK
OCCURS

LOCATE LENGTH OF
FRAME (00000018)
ON INTERRUPT STACK

LOCATE LENGTH FRAME +4
LOW WORD CONTAINS
MACHINE CHECK CODE

CODE
NOT EQUAL TO
14

YES

SEE SECTION 3.8 FOR
KA62B AND SECTION
4.10 FOR KA64B

YES
CODE = 14

SEE THESE SECTIONS
3.10 - KA62B
4.12 - KA64A
5.9 - FV64A

NO
REBOOT
OPERATING SYSTEM

ANALYZE CRASH DUMP;
SEE ERROR LOG
msb-0723E-90

1–10

VAX 6000 Models 300 and 400 Service Manual

Chapter 2

Diagnostics
This chapter describes diagnostics for the VAX 6000 Model 300 and 400
systems. Sections include:
•

Diagnostic Overview

•

Self-Test and Additional Power-Up Tests

•

ROM-Based Diagnostic Monitor and Its Control
ROM-Based Diagnostic Programs
START Command
START Command Qualifiers
RBD Test Printout, Passing
RBD Test Printout, Failing
SUMMARY Command
Sample RBD Session
Running ROM-Based Diagnostics on VAXBI Devices

•

VAX Diagnostic Supervisor Programs
Booting the Diagnostic Supervisor from a CD Server
Running VAX/DS
Sample VAX/DS Session
VAX/DS Diagnostics

Diagnostics 2–1

2.1 Diagnostic Overview
The <REFERENCE>(6000) systems are tested with two types
of diagnostics: ROM-based and loadable. The ROM-based
diagnostics (RBD) include self-tests, additional power-up
tests, and callable diagnostics (from the RBD monitor).
The loadable diagnostics run under the VAX Diagnostic
Supervisor (VAX/DS) in standalone mode or in user mode
(see Figure 2–1).

Figure 2–1: Diagnostics Design

Self-test
ROM-Based
Diagnostics
(RBDs)

Additional Power-up Test
Operator-Invoked Diagnostics

VAX Diagnostic Supervisor, standalone (VAX/DS)
Loadable
VAX Diagnostic Supervisor, user mode (VAX/DS)

msb-0182-90

2–2

VAX 6000 Models 300 and 400 Service Manual

Self-Tests
Each module on the <REFERENCE>(XMI) and VAXBI buses has its own
self-test resident in ROM, except for the now optional <REFERENCE>(xbi_
plus) modules. At power-up, initialization, booting, or system reset, each
module runs its own self-test. The processor self-test completes within 10
seconds. The memory test completes in less than 60 seconds. Results of
self-test are printed on the STF line of the console self-test display.
Other Power-Up Tests
Following the modules’ self-tests, two additional tests are run and
reported in the self-test display: CPU/memory interaction tests and
<REFERENCE>(xbi_plus) tests.
All CPUs that have passed self-test run the CPU/memory interaction test.
The CPU/memory interaction test checks that the processors can access
memory. Memory also has a self-test that tests actual memory locations.
The CPU/memory interaction test is the second test for memory and serves
as a check on the memory’s <REFERENCE>(XMI) interface and on some
CPU logic that can be tested only by accessing memory. Results are printed
on the ETF line of the self-test display.
The optional DWMBB modules are tested by the boot processor before it
queries the VAXBI options for the results of their self-tests. Results from
both are printed on the XBI lines on the self-test printout (see Example 2–1).
Operator-Invoked ROM-Based Diagnostics
From the console prompt, you can enter RBD mode and run ROMbased diagnostics. There are five diagnostics for the <REFERENCE>(xyp)
and four for the <REFERENCE>(XRP). Common tests include self-tests,
CPU/memory interaction tests, DWMBB tests, and memory tests; the
<REFERENCE>(xyp) has an additional secondary cache test, and the
<REFERENCE>(XRP) has an additional vector interaction test. In RBD
mode, you have the capability of running tests other than those in the
default suite, running multiple passes of tests, and receiving an error report
with information about any failing tests.
VAX Diagnostic Supervisor (VAX/DS)
From the console prompt, you can boot VAX/DS in standalone mode from
the TK tape, a CD server, or other media and run level 3 diagnostics. From
the operating system, you can run VAX/DS in user mode and run level 2R
diagnostics. Level 2 VAX/DS diagnostics may be run either in standalone
or user mode. See Table 2–9 for a listing of VAX/DS diagnostics.

Diagnostics 2–3

2.2 Self-Test and Additional Power-Up Tests
The self-test diagnostics reside in ROM on the processors
and on most modules. These diagnostics check each module
at power-up, when the system is reset, and during a boot.
Self-test results are written to the console terminal, as
shown in Example 2–1.

Example 2–1: Sample Self-Test Results
#123456789 0123456789 0123456789 01234567#

! Trace for KA64A in slot 1

A
o
.
.
.

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

P
+
E
+
E

P
+
B
+
B

.
.

A4
64

A3
64

A2
64

A1
64

.
.

ROM0 = V3.00

ROM1 = V3.00

EEPROM = 2.03/3.00

NODE #
TYP
STF
BPD
ETF
BPD

The callouts in Example 2–1 refer to Table 2–1.

VAX 6000 Models 300 and 400 Service Manual

1
2

XBI E + 3
ILV
256Mb

SN = SG01234567

>>>

2–4

Self-test is invoked and results are written to the console under several
circumstances:
•

At power-up

•

When the control panel Restart button is pressed

•

During a boot

•

When the console command INITIALIZE is issued

On a <REFERENCE>(rigel) the first line of the self-test printout is the
progress trace. This line indicates how the <REFERENCE>(XRP) at node
1 is functioning during self-test. If there is no processor in node 1, no trace
appears.
The remainder of the printout is the self-test display. Table 2–1 describes
the tests run during self-test.
The callouts in Table 2–1 refer to
Example 2–1.

Table 2–1: Self-Test Components
Test

Description

Processors

Each processor runs its own self-test resident in its own ROM. A plus sign (+)
on the STF line 1 means the processor passed. Each processor also tests interaction with memory. A plus sign on the ETF line 2 means the test
passed.

Memory

Each memory runs its own on-board self-test. A plus sign on the STF line
1 means the memory passed.

<REFERENCE>(XBI_
The <REFERENCE>(XMI)-to-VAXBI adapter is tested by the boot procesPLUS)
sor. A plus sign at the right of the XBI line 3 means both the DWMBB/
A and DWMBB/B modules passed.
VAXBI

Each VAXBI bus on the system is checked, and each VAXBI node runs
its own self-test. A plus sign in column 0 through F of the XBI line 3 means
the VAXBI node passed.

The self-test printout in Example 2–1 reflects a specific configuration. A
detailed explanation of self-test results is available by typing HELP SELF
at the console prompt, or see the VAX 6000 Series Owner’s Manual.
The tests run during self-test can be individually invoked in RBD mode
using the ROM-based diagnostics monitor program. Here you can examine
each test more closely and determine which test is failing.
Two different ROM revision lines are possible. Example 2–1 shows the
KA64A revision line (see 4 ). The KA62B revision line follows:

Diagnostics 2–5

ROM = 6.0

2–6

EEPROM = 2.0/6.0

SN = SG01234567

VAX 6000 Models 300 and 400 Service Manual

2.3 ROM-Based Diagnostic Monitor and Its Control
The ROM-Based Diagnostic Monitor program is accessed
through the console program. Type T/R at the console
prompt to enter RBD mode. RBD mode has three commands
with qualifiers and a set of control characters that assist the
user when entering commands or running tests.

Table 2–2: RBD Monitor Commands
Command

Function

ST[ART]n

Starts RBD n, where n is the number
gram listed in Table 2–4 and Table 2–5

SU[MMARY]

Prints a summary report of the last RBD program run

QU[IT]

Exits the RBD monitor and returns control to the console program

the

RBD

pro-

Table 2–3: RBD Monitor Control Characters
Character

Environment

Function

CTRL/C

Test running

Stops the execution of an RBD test, executes cleanup
code, and returns to the RBDn> prompt.

DELETE

RBD command line

Use for deleting erroneous characters entered on the
command line.

CTRL/Q

Test running

Resumes output to terminal that was suspended with
CTRL/S .

CTRL/R

At RBD prompt

Refreshes the command line; useful when characters are deleted.

CTRL/S

Test running

Suspends output to the terminal until
typed.

CTRL/U

At RBD prompt

Disregards previous input.

CTRL/Y

Test running

Stops the execution of an RBD test and does not execute any cleanup code.

CTRL/Z

At RBD prompt

Exits RBD monitor program and enters console program; same effect as the QUIT command.

2–8

VAX 6000 Models 300 and 400 Service Manual

CTRL/Q

To enter the RBD monitor, at the console prompt type:
>>>

T/R

RBDn>

!
!
!
!
!

This is the abbreviation for TEST/RBD.
Early versions of the console only accept T/R.
RBD prompt appears signifying entrance into
RBD mode, where n is the XMI node number of
the processor running the RBD monitor program.

The RBD commands are explained here and in Sections 2.3.2 and 2.3.6.
Table 2–2 gives the commands, their abbreviations, and functions.
Four programs run from the ROM-based diagnostics (RBD) monitor
program. The programs are CPU self-test, CPU/memory interaction tests,
the DWMBB tests, and memory RBD tests. Each of these programs has
several tests, as shown in Table 2–4 and Table 2–5. A fifth program is
available for the <REFERENCE>(hyperion) and tests it’s secondary cache.
The RBDs are designed for use by Digital customer service personnel.
The RBD monitor responds to several control characters. These characters
manage both the diagnostic and the monitor as shown in Table 2–3.
When CTRL/C is entered from the console terminal, the diagnostic stops
execution, runs cleanup code, and returns control to the RBD monitor
program. This happens immediately when running RBD 0, RBD 1, or RBD
2; there may be a wait of up to one minute for a response when RBD 3 is
running. If CTRL/C is typed at the RBD monitor prompt, it has the same
effect as CTRL/U.
When you use the DELETE key (or rubout key), characters being deleted
are preceded by a backslash ( \ ) and print as they are rubbed out. When
the next valid character is typed, it is preceded by a backslash ( \ ) to
delineate the deleted characters. You can use CTRL/R to refresh the line.
When the RBD monitor program receives a CTRL/U, the program
disregards all previous input typed and returns the RBD prompt. If a
test is running when CTRL/U is entered, CTRL/U is ignored.
When a CTRL/Y is received by the RBD monitor program from the console,
the diagnostic stops execution and returns control to the RBD monitor
program. No cleanup code is run, and the unit under test is left in an
indeterminate state. A CTRL/Y entered at the RBD monitor prompt has
the same effect as CTRL/U.
When the RBD monitor program receives a CTRL/Z, the program exits and
control is returned to the console program (>>>). CTRL/Z has the same
effect as the QUIT command. If CTRL/Z is entered while an RBD test
is running, CTRL/Z has the same effect as CTRL/C: it halts the test and
executes cleanup code.

Diagnostics 2–9

2.3.1 ROM-Based Diagnostic Programs
Table 2–4 and Table 2–5 lists the diagnostic programs
available for both VAX 6000 Model 300 and Model 400
systems.

Table 2–4: ROM-Based Diagnostic Programs for KA62B
RBD
Program

Test
Totals

Default
Default
(Power-Up) (Callable) Description

Runs CPU tests

Runs CPU/memory interaction tests

Runs DWMBB tests

Sizes and runs additional tests on
main memory

Miscellaneous tests of second-level
cache

Table 2–5: ROM-Based Diagnostic Programs for KA64A
RBD
Program

Test
Totals

Default
Default
(Power-Up) (Callable) Description

37
49

Runs CPU tests
Runs scalar and vector tests

13
17

12
16

13
17

Runs CPU/memory interaction tests
Runs scalar/vector CPU/memory interaction tests

Runs DWMBB tests

Sizes and runs additional tests on
main memory

2–10

VAX 6000 Models 300 and 400 Service Manual

Table 2–4 and Table 2–5 show the number of tests available. Column 1
contains the numbers used to invoke the test in RBD mode.
RBD2> ST1

!Starts the CPU memory interaction test

The second column gives the total number of tests in the RBD. The third
column indicates that there may be some tests not run during power up,
and the fourth column indicates the number of test run when the RBD is
invoked by the START command with no qualifiers. All tests may be run.
Some, like a number of the memory diagnostics, modify data or take a long
time and are not run by default. These tests require the operator to invoke
them specifically.
For the <REFERENCE>(xyp) each RBD has a default number of tests
that run when the test is invoked. The CPU and CPU/memory tests (RBD
0 and 1) run all their tests when invoked. RBD 4, the secondary cache
tests, are not run by default and must be specifically requested to run.
The <REFERENCE>(XRP) does not have a separate RBD for its secondary
cache.
For the <REFERENCE>(XRP) each RBD has a default number of tests
that run at power-up, and another default number of tests that run when
the program is called from the RBD monitor (see Table 2–4 and Table 2–5).
The CPU diagnostic (RBD 0) runs all its tests in both modes. The powerup default for the CPU/memory interaction diagnostic (RBD 1) is 12 (scalar
only—16 with the vector tests), and the callable default is all tests.
The DWMBB diagnostic (RBD 2) runs 20 or 21 of the 26 tests as the default
in both modes; tests 2, 3, 4, 10, 11, and 26 must be invoked by qualifier in
callable mode.
To run tests other than the default suite from the RBD monitor, issue a
command such as the following, which invokes all DWMBB tests:
RBDn> ST2/T=1:26 D

See Section 7.4 for more details.
RBD 3, the Memory diagnostic, does not run on power-up. In callable
mode, 7 of 12 tests run when invoked; tests 2 through 8 are defaults. See
Section 6.11 for information on calling additional tests.
It is helpful to use the trace qualifier, /TR, with the RBD START command.
(See Section 2.3.3.) This qualifier shows each individual test as it is
run. If a test fails, the program displays error messages. By default, the
RBDs continue testing after an error is encountered. Adding the halt-onerror qualifier, /HE, causes the program to halt when the first error is
encountered. Testing can be aborted at any time by typing CTRL/C.

Diagnostics 2–11

To exit RBD mode, type QUIT at the RBD prompt.

2–12

VAX 6000 Models 300 and 400 Service Manual

2.3.2 START Command
The RBD monitor START command invokes a specific RBD
program. It takes an argument indicating the RBD program
to be run, and can take any of 13 qualifiers.
Example 2–2: START Command
>>> T/R

! Command to enter RBD monitor program.

RBD3>

! RBD monitor prompt, where 3 is the hexa! decimal node number of the processor
! that is currently receiving your input.

RBD3> ST2/TR E

! Runs the default XBI tests, testing the
! <REFERENCE>(xbi_plus) at <REFERENCE>(XMI) node number E. Test results
! are written to the console terminal.

RBD3> ST1/HE/IE/BE

! Runs the CPU/memory interaction RBD, halting
! on the first error encountered, inhibiting
! error output, ringing the bell when the
! first error is encountered.

The START command syntax is:
STn[/qualifier] [parameter]

where:
•

n is the RBD to be run (see Table 2–4 and Table 2–5).

•

[/qualifier] is one of those listed in Section 2.3.3.

•

[parameter] is a program-specific value used in RBD 2 or RBD 3. (For
the meaning of this parameter in RBD 2, see Section 7.4, and in RBD
3, see Section 6.11.)

2–14

VAX 6000 Models 300 and 400 Service Manual

2.3.3 START Command Qualifiers
The START command is the primary RBD program
command. Its qualifiers act as switches, allowing you to
control the output of the tests—to run portions of a test, to
run nondefault tests, and to loop on tests.

Table 2–6: START Command Qualifiers
Qualifier

Default

Function

/BE

Disabled

Bell sounds when an error is encountered

Disabled

Destructive test confirmation

/DS

Disabled

Disable status reports

/HE

Disabled

Halt on the test that incurs a hard error

/HS

Disabled

Halt on the test that incurs a soft error (<REFERENCE>(XRP) only)

/IE

Disabled

Inhibit all error output

/IS

Disabled

Inhibit summary reports

/LE

Disabled

Loop on the test that incurs a hard error

/LS

Disabled

Loop on the test that incurs a soft error (<REFERENCE>(XRP) only)

/P=n

Enabled

Make n passes of the test or tests indicated

/QV

Disabled

Quick verify mode

/T=n[:m]

Enabled

/T=n runs test n; /T=n:m runs a range of tests from n
through m

/TR

Disabled

Print a trace of test numbers, as they run

NOTE: A qualifier is valid only for the command with which it is issued.
Qualifiers do not remain in effect for the session.
See Example 2–2 for examples and a description of the START command
syntax.
/BE causes a bell on the console terminal to ring when an error is
encountered. This is useful when error printout is inhibited and a loop
on intermittent error is set (/LE).

Diagnostics 2–15

/C enables execution of destructive tests. See Example 2–7 and Section 6.11
for information on the destructive tests.
/DS disables printout of the diagnostics test results. The summary report
is run, unless it is specifically disabled.
/HE halts on hard error and stops execution of tests as soon as the first
hard error is encountered. (In this context, a hard error is defined as a
recoverable, repeatable error, for example, a ROM checksum error. This
differs from a fatal error, which is an unrecoverable fault, for example,
an unexpected interrupt or exception. A fatal error is always cause for
program abortion, regardless of the state of the /HE or /LE qualifier.) The
test number is printed, and a summary indicating failure of the RBD is
printed to the console terminal. Also the RBD monitor prompt is returned.
Continue on error is the default condition, so if you want a halt on error,
you must specifically invoke it in your command line.
/HS halts on soft error and stops execution of tests as soon as the
first soft error is encountered.
This qualifier works only on the
<REFERENCE>(XRP) module. (In this context, a soft error is defined as a
recoverable error that goes away after retry, for example, a corrected read
data memory error.) The test number is printed, and a summary indicating
failure of the RBD is printed to the console terminal. Also the RBD monitor
prompt is returned. Continue on soft error is the default condition, so if you
want to halt on soft error, you must specifically invoke it in your command
line.
/IE inhibits all error output, suppressing printing of RBD results. This
qualifier is used primarily for module repair, in conjunction with the /LE
or /LS qualifier. Errors are counted even when the printing is disabled.
/IS suppresses printout of RBD summary after the end of the last pass
performed by the RBD.
/LE loops on the test where the first hard error is detected. Even if the
error is intermittent, looping continues on the test indicated. To terminate
/LE, enter CTRL/C, CTRL/Z, or CTRL/Y. After entering one of these control
characters, a summary report is printed. A fatal error causes the program
to abort, regardless of the state of this qualifier.
/LS loops on the test where the first soft error is detected. This qualifier
works only on the <REFERENCE>(XRP) module. Even if the error is
intermittent, looping continues on the test indicated. To terminate /LS,
enter CTRL/C, CTRL/Z, or CTRL/Y. After entering one of these control
characters, a summary report is printed.
/P=n runs n passes of the RBD test invoked; n is a decimal number. If n is 0,
all selected tests run for an infinite number of passes. If the /P qualifier is
not used, the program defaults to one pass of the test invoked. When used

2–16

VAX 6000 Models 300 and 400 Service Manual

with the /T=n:m qualifier, you run a range of tests. To terminate /P=n, enter
CTRL/C, CTRL/Z, or CTRL/Y. After entering one of these control characters,
a summary reports prints out and the RBD monitor prompt returns.
/QV selects the quick verify version of any selected test that supports this
mode.
/T=n[:m] selects individual tests (/T=n) or a range of tests (/T=n:m) where
n and m are decimal numbers. For example, to run tests T0005 through
T0008, use /T=5:8. If no /T qualifier is used, the diagnostic runs its default
suite of tests.
/TR prints each test number as it is completed. This qualifier allows you to
trace the progress of the diagnostic as it runs. Without the /TR qualifier,
just the summary line is printed.
For both the <REFERENCE>(xyp) and the <REFERENCE>(XRP) a single
parameter field can be appended to the START command string to control
aspects of the diagnostic that are not covered by the qualifiers. The
parameter must be appended after any qualifiers and separated from them
by a space. The format of the parameter field is 4 hex characters. The use
of a parameter field is implementation specific.

Diagnostics 2–17

2.3.4 RBD Test Printout, Passing
The RBD printout results are different when the RBD tests
pass and when they fail. Example 2–3 shows a passing
printout, and Example 2–4 is a sample failure printout.
Example 2–3: RBD Test Printout, Passing
>>> T/R

! Command to enter RBD monitor program at
! console prompt.
! RBD monitor prompt, where 3 is the hexa! decimal node number of the processor
! that is currently receiving your input.

RBD3>

RBD3> ST2/TR E

! Runs the XBI self-test, testing the <REFERENCE>(xbi_plus)
! at <REFERENCE>(XMI) node number E. Test results
! written to the console terminal:

; XBI_TEST 1
; T0001
; T0016

T0005
T0017

3.00 2
T0006
T0018

T0007
T0019

T0008
T0020

T0009
T0021

T0012
T0022

T0013
T0023

T0014
T0024

T0015
T0025 3

;
P4
35
8082 6
17
; 00000000 00000000 00000000 00000000 00000000 00000000 00000000 8

RBD3> QU 9

! RBD prompt returns; test ran successfully.
! Exit RBD program.

>>>

The callouts in Example 2–3 are explained below.
1

This entry designates which test is being run. Here it is the XBI_TEST,
the self-test for the DWMBB. Below is a list of some XMI RBDs.
XRP/V_ST

RBD 0, the CPU tests for <REFERENCE>(XRP)

XCPST

RBD 0, the CPU tests for <REFERENCE>(xyp)

CPUMEM

RBD 1, the CPU/memory interaction tests

XBI_TEST

RBD 2, the DWMBB tests

XMA_RBD

RBD 3, the memory tests

SLCRBD

RBD4, the second-level cache tests for <REFERENCE>(xyp)

This field lists the revision number of the RBD program.

2–18

VAX 6000 Models 300 and 400 Service Manual

These T00nn fields appear only with the /TR qualifier; each entry
corresponds to a test being run and prints out as the test starts running.
In a passing RBD, the final T00nn number corresponds to the last test
run.
Note that T0002 through T0004 and T0010, T0011, and T0026 are not
executed. These tests are not part of the default selection and must be
individually invoked by qualifier. For a list of the tests for each RBD
and the definition of the tests, see the chapter for each module in this
manual.

This field indicates whether the RBD passed or failed; P for passed, F
for failed.

This field is the XMI node number of the boot processor executing the
RBD. It matches the number in your RBD prompt.

This field is 8082 for the <REFERENCE>(XRP) and 8001 for the
<REFERENCE>(xyp)—the device type of the boot processor.

This field displays the total number of passes (in decimal) executed by
the RBD. The default number of passes is 1. If you use the START
command with the qualifier /P=5, for example, then this field will show
5, indicating 5 passes were completed.

This line contains the summary of the RBD failures. In a successful
RBD run, the line will contain all zeros as shown here. Currently
only the second and third fields are used. The second field contains the
number of hard errors detected during the run. The third field contains
the number of soft errors detected during the run.

The console prompt is usually returned in response to the RBD QUIT
command, as shown in this example. However, when some tests are
run, the response to QUIT is a system reset. Self-test is then run, and
the self-test results are printed. The tests that cause a system reset
are: Test 1 and 22 of RBD 1; Tests 2, 3, 4, 10, and 11 of RBD 2; and
Tests 4 and 8 of RBD 3.

Diagnostics 2–19

2.3.5 RBD Test Printout, Failing
The RBD printout results are different when the RBD passes
and when it fails. Example 2–4 is a sample failure printout,
and Example 2–3 shows a passing printout.
Example 2–4: RBD Test Printout, Failing
>>> T/R

! Command to enter RBD monitor program at
! console prompt.
! RBD monitor prompt, where 2 is the hexa! decimal node number of the processor
! that is currently receiving your input.
! Execute RBD 0 (CPU test) and trace results.

RBD2>

RBD2> ST0/TR
; XRP/V_ST

3.00

; T0001
; T0011

T0003
T0013

T0002
T0012

T0004
T0014

T0005
T0015

T0006
T0016

T0007
T0017

T0008 T0009
T0018 1

T0010

;
F2
23
8082 4
15
;
HE 6
REX520 7
XX 8
T0018 9
;
10 10 AAAAAAAA 11 A8AAAAAA 12 00000000 13 000004AC 14 2006451F 15 01 16
; T0019 T0020 T0021 T0022 T0023 T0024 T0025 T0026 T0027 T0028
; T0029 T0030 T0031 T0032 T0033 T0034 T0035 T0036 T0037 17
;
F
2
8082
1 18
; 00000000 00000001 19 00000000 00000000 00000000 00000000 00000000
RBD2>
RBD2> QUIT
>>>

! RBD prompt returns; test completed.
! Exit RBD program.
! Console prompt reappears.

The callouts in Example 2–4 are explained below. (See also Example 2–3
for explanation of other fields of the printout.)
1

These T00nn fields appear only with the /TR qualifier; each entry
corresponds to a test being run. The entry prints out as the test starts
running. This T00nn number is the number of the failing test and is
followed by a failure report. In this example, test 18 failed. The /HE
qualifier was not used, so testing continues.

F indicates failure of the previous test listed, test 18.

This field is the XMI node number of the boot processor executing the
RBD. It matches the number in your RBD prompt.

2–20

VAX 6000 Models 300 and 400 Service Manual

This field is the device type of the boot processor.

This field displays the total number of passes (in decimal) executed by
the RBD. The default number of passes is 1.

The class of error is displayed here. HE indicates that the error was
a hard error. SE means the error was a soft error, and FE indicates a
fatal error. (See Section 2.3.3 for a definition of these errors.)

This field describes the failing logic for the <REFERENCE>(XRP) and
gives an abbreviated test name for the <REFERENCE>(xyp). Here,
the processor chip of a <REFERENCE>(XRP), device type 8082, is the
failing logic.

This field is the unit number used in memory and DWMBB tests.

This field lists the number of the test that failed; test 18 failed here.

This is a two-digit (decimal) generic error code.

The expected data is listed here.
expected.

AAAAAAAA is the data test 18

The received data is listed here.
received.

A8AAAAAA is the data test 18

This field shows any unexpected interrupt vectors.

This is the address in memory where the referenced error is found.

This is the address of the failing PC at the time of error.

This is the error number within the failing test. In this example, the
failure was detected at the first possible failure point in T0018. This is
a decimal field.

This final T00nn number corresponds to the last test run.

This entire line is the summary line, and a repeat of the failure
summary. It lists the pass/fail code (P or F), the node number and
device type number of the boot processor executing the RBD, and the
number of passes of the RBD.

This is the number of hard errors detected.

Diagnostics 2–21

2.3.6 SUMMARY Command
The RBD monitor SUMMARY command displays a summary
of the last diagnostic run.
Example 2–5: SUMMARY Command
>>> T/R
RBD1> ST0/IE/IS/P=100
; XRP/V_ST

3.00

RBD1> SU
; XRP/V_ST

! Command to enter RBD monitor program at
! console prompt.
! Execute RBD 0 (CPU test), inhibiting
! error outputs and summary report.

! Request a summary.
3.00

;
P1
12
8082 3
100 4
; 00000000 00000000 00000000 00000000 00000000 00000000 00000000 5
RBD1>

2–22

VAX 6000 Models 300 and 400 Service Manual

The callouts in Example 2–5 are explained below.
1

This field indicates whether the RBD passed or failed; P for passed, F
for failed.

This field is the XMI node number of the boot processor executing
the RBD. It will match the number in your RBD prompt, which also
indicates the node number of your boot processor.

This field is the device type number of the boot processor executing the
RBD.

This field displays the total number of passes executed by the RBD.

This line contains the summary of the RBD failures. Presently only the
second and third fields are used. The second field contains the number
of hard errors detected during the run. The third field contains the
number of soft errors detected during the run.

Diagnostics 2–23

2.3.7 Sample RBD Session
Examples 2–6 and 2–7 show a sample RBD session.
Example 2–6: Sample RBD Session, Part 1 of 2
>>> T/R 1
RBD1> ST0/TR 2
;XRP/V_ST

3.00

; T0001
; T0011
; T0021
; T0031

T0003
T0013
T0023
T0033

T0002
T0012
T0022
T0032

T0004
T0014
T0024
T0034

T0005
T0015
T0025
T0035

T0006
T0016
T0026
T0036

T0007
T0017
T0027
T0037

T0008
T0018
T0028

T0009
T0019
T0029

T0010
T0020
T0030

;
P
1
8082
1
;00000000 00000000 00000000 00000000 000000000 00000000 00000000
RBD1> ST1/TR/HE 3
;CPUMEM
; T0001
; T0011

3.00
T0002
T0012

T0003
T0013

T0004

T0005

T0006

T0007

T0008

T0009

;
P
1
8082
1
;00000000 00000000 00000000 00000000 000000000 00000000 00000000
RBD1> ST2 5 4
;XBI_TEST
;
;
;

3.00

F
1
8082
1
FE No_Unit
05
T0000
00 00000000 00000000 00000000 00000000 200705E7 01

;
F
1
8082
1
;00000000 00000001 00000000 00000000 00000000 00000000 00000000
RBD1>

ST2/TR/T=2:4/P=3 E 5

;XBI_TEST
; T0002

3.00

T0003

T0004

T0002

T0003

T0004

T0002

T0003

T0004

;
P
1
8082
3
;00000000 00000000 00000000 00000000 000000000 00000000 00000000

2–24

VAX 6000 Models 300 and 400 Service Manual

T0010

Enter RBD mode from console mode. The RBD prompt appears and
indicates you are operating from the boot processor at node 1.

Run RBD 0 and trace the tests.
successfully.

Run RBD 1, trace it and halt on the first error found. All CPU/memory
interaction RBD tests run and pass.

Run RBD 2, testing the DWMBB at XMI node 5. The value NO_UNIT
on the third line of output indicates that the node value of node 5 is not
correct; no DWMBB was found at this node.

Run 3 passes of tests 2 through 4 of RBD 2 on node E with Trace Set.

The CPU test runs all 37 tests

Note that the T00nn line lists each of the three tests three times, since
the /P=3 called for 3 passes of the tests. And the final parameter in the
summary line is a 3, indicating that 3 passes completed.

Diagnostics 2–25

Example 2–7: Sample RBD Session, Part 2 of 2

RBD1> ST3/TR/T=1 6
RBD1> ST3/TR/T=1
RBD1> ST3/TR/T=1 /C 7
;XMA_RBD

3.00

; T0001
;
P
1
8082
1
;00000000 00000000 00000000 00000000 000000000 00000000 00000000
RBD1> QU 8
[self-test results may be displayed here]
>>> SET CPU 2 9
>>> T/R
RBD2> ST0/TR 10
;XRP/V_ST

3.00

; T0001
; T0011
; T0021
; T0031

T0003
T0013
T0023
T0033

T0002
T0012
T0022
T0032

T0004
T0014
T0024
T0034

T0005
T0015
T0025
T0035

T0006
T0016
T0026
T0036

T0007
T0017
T0027
T0037

T0008
T0018
T0028

T0009
T0019
T0029

;
P
2
8082
1
;00000000 00000000 00000000 00000000 000000000 00000000 00000000

2–26

VAX 6000 Models 300 and 400 Service Manual

T0010
T0020
T0030

Run RBD 3, trace it, and run only test 1 of this RBD. This test is one
of the memory tests that is not part of the default suite of tests. Test 1
corrupts memory. You must add a /C qualifier (Confirm) to the START
command, to indicate that you do indeed intend to run this destructive
test.
The /C qualifier was not given in this example. The command line is
echoed, waiting for /C to be typed.
On a <REFERENCE>(rigel) you can either press Return and reenter
the command with the /C qualifier, or you can type the /C qualifier
followed by Return.
On a <REFERENCE>(hyperion) you must enter the command line
again adding the /C qualifier.

Run RBD 3, trace the tests as they run, run only test 1, and /C allows
the test to run. In this example, the test completed with no errors.

Exit from RBD mode. Enter console mode.

Make the next processor the primary processor so that RBD 0 can be
run on it.

Run RBD 0 and trace the tests.
Here the CPU runs all 37
<REFERENCE>(XRP) tests successfully.

Diagnostics 2–27

2.3.8 Running ROM-Based Diagnostics on VAXBI Devices
Some VAXBI devices can be tested from the console terminal
with their on-board ROM-based diagnostics. The Z console
command is used to send commands to these VAXBI nodes.

Example 2–8: VAXBI RBD Session
>>> SHOW CONFIGURATION 1
Type
Rev
1+ <REFERENCE>(XRP)
(8082) 0007
A+ MS65A
(4001) 0002
E+ DWMBB/A (2002) 0001
XBI E
1+ DWMBB/B (210F) 000A
5+ DMB32
(0109) 210B
6+ DEBNI
(0118) 0100
7+ KDB50
(010E) 0F1C
8+ TBK70
(410B) 0307
>>> Z/BI:6 E 2
?33 Z connection successfully started
T/R 3
RBD6> ST 0/TR 4
;DEBNI_ST
; T01

T02

1.02
T03

T04

T05

T06

T07

T08

;
P
6
0118 00000020
;00000000 00000000 00000000 00000000 00000000 00000000 00000000
;

PUDR: FFFFxxxx

RBD6> QUIT 5
^P
?31 Z connection terminated by ^P
>>> Z/BI:8 E 6
?33 Z connection successfully started
T/R
RBD8> ST 0/TR
;T1035_St

1.00

Example 2–8 Cont’d on next page

2–28

VAX 6000 Models 300 and 400 Service Manual

Example 2–8 (Cont.): VAXBI RBD Session
; T01
; T15

T02
T16

T03
T17

T04

T05

T06

T07

T08

T09

T10

T11

T12

T13

T14

;
P
8
410B 00000001
;00000000 00000000 00000000 00000000 00000000 00000000 00000000
;

PUDR: 5FF43FDF

RBD5> QUIT
^P
?31 Z connection terminated by ^P
>>>

The callouts in Example 2–8 are explained below.
1

The SHOW CONFIGURATION console command shows that this
system includes a DEBNI at node 6 of the VAXBI attached at XMI
node E, and a TBK70 at node 8 of the VAXBI attached at XMI node E.

The Z command is typed at the console prompt. A connection is
established to node 6 (/BI:6) of the VAXBI connected at XMI node E
(E). The console returns a message confirming that the connection has
been made.

After the console message is returned in 2 , no prompt is printed.
Typing T/R invokes the RBD monitor on the VAXBI adapter being tested
and returns the RBD monitor prompt. Note that the "6" in the RBD
prompt refers to the VAXBI node.

The START command for VAXBI RBDs requires a space before the 0.
When run with the /TR qualifier, test traces are printed. The last line of
the summary report indicates the contents of the Power-Up Diagnostic
Register. Refer to the technical manual for the device being tested to
interpret the contents reported.

The QUIT command exits the RBD monitor. The Z connection remains
until CTRL/P is entered.

Steps 2 through 5 are repeated to run the RBD of the TBK70 at node
8 of the VAXBI attached at XMI node E.

Diagnostics 2–29

2.4 VAX Diagnostic Supervisor Programs
The VAX Diagnostic Supervisor (VAX/DS) is a monitor that
controls operation of a diagnostic program. You can use
VAX/DS in one of two modes: standalone mode (exclusive
use of the system) or user mode (under the VMS operating
system).

Table 2–7: VAX Diagnostic Program Levels
Level

Type of Test

Run-Time Environment

System exercisers

Runs under the VMS operating system without VAX/DS

Function tests of peripheral devices

Runs under the VMS operating system with VAX/DS

Exercisers and function tests of
peripheral devices and processors

Runs under VAX/DS in user mode and
standalone mode

Function tests and logic tests of
peripheral devices and processors

Runs under VAX/DS in standalone
mode

Table 2–8: VAX/DS Documentation
Document

Order Number

VAX Diagnostic Supervisor User’s Guide

AA–FK66A–TE

VAX Diagnostic Software Handbook

AA–F152A–TE

VAX Diagnostic Design Guide

AA–FK67A–TE

VAX Systems Hardware Handbook

EB–31692–46

2–30

VAX 6000 Models 300 and 400 Service Manual

The VAX Diagnostic Supervisor (VAX/DS) can be run in interactive mode.
You type commands in response to the VAX/DS program prompt:
DS>

VAX/DS lets you load diagnostic programs into system memory, select
devices to be tested, and run the programs. The VAX/DS command
language also lets you control the execution of diagnostic programs; you
can specify which tests or sections of a program should run, and how many
passes it should run. You can also show the current state of parameters
that affect the operation of diagnostic programs. The programs report their
results through VAX/DS to the terminal.
VAX/DS supports three types of diagnostic programs:
•

Logic tests
Test a specific section of a device’s logic circuitry. Logic tests provide the
greatest degree of detail in determining the location of faulty hardware.

•

Function tests
Test the functions of the device. For example, a function test for a disk
drive would test the drive’s reading and writing capabilities. Function
tests can detect the location of faulty hardware, although the results
may be less exact than those of a logic test.

•

Exercisers
Test entire systems or subsystems and verify that a system can function
properly over a period of time. Exercisers can detect both hardware
faults resulting from the simultaneous use of a system’s numerous
devices and intermittent faults occurring only once or twice over a long
period of time.

Table 2–9 lists the VAX/DS programs available for the <REFERENCE>(rigel)
and <REFERENCE>(hyperion) systems. Each program has a HELP file
available. To access the help files for any diagnostic, at the VAX/DS prompt,
type:
DS>

HELP [VAX/DS diagnostic program name]

Diagnostics 2–31

2.4.1 Booting the Diagnostic Supervisor from a CD Server
To boot the Diagnostic Supervisor from a CD server, set
an additional control flag in R5 and enter ISL_LVAX at the
filename prompt.

Example 2–9: Booting the Diagnostic Supervisor over the Ethernet
>>> BOOT /XMI:E /BI:C /R5:110 ET0 1
Initializing system
[Self-test display prints]
Loading system software
Filename: ISL_LVAX

[Several establishing link messages]
Ethernet Initial System Load Function
FUNCTION
ID
1
2
3
4
-

FUNCTION
Display Menu
Help
Choose Service 3
Stop

Enter a function Id value: 3 3
Service options:
1 = Find Services
2 = Enter Known Service Name
=>1 4
Working
Servers found: 1
Service Name Format:
Service Name
Server Name
Ethernet ID
#1
VMS054
ESS_08002B15FCE1
08-00-2B-15-FC-E1

Example 2–9 Cont’d on next page

2–32

VAX 6000 Models 300 and 400 Service Manual

Example 2–9 (Cont.): Booting the Diagnostic Supervisor over the
Ethernet
#2
NSS_SYSDISK
ESS_08002B15FCE1
08-00-2B-15-FC-E1
#3
6000_DIAG_A
ESS_08002B15FCE1
08-00-2B-15-FC-E1
Enter a number =>3 5
[Diagnostic Supervisor Banner prints]
DS>

After placing a CDROM cartridge labeled 6000_DIAG_* in a CD server on
the network, your system can access and boot the Diagnostic Supervisor
from the Ethernet.
1

At the console prompt enter a boot command identifying a path to the
CD server.
Should the Ethernet be attached directly to the XMI through a DEMNA,
you will not need the /BI qualifier and you will need to change the device
name to EXnn.
R5 = 110 sets two flags for VMB. Bit 4 specifies the Diagnostic
Supervisor. Bit 8 prompts for a secondary loader.

At the prompt, "Filename" type ISL_LVAX — the secondary loader. The
system loads software and identifies various functions available.

At the prompt, "Enter a function Id value:" enter a 3 to Choose Service.

Assuming you do not know the Service Name or number, at the "=>"
prompt enter a 1 to Find Services, otherwise enter a 2.
The available services are then located and shown. You should see the
name of the CD you just put into the CD server.

At the "Enter a number =>" prompt, enter the number of the server
that has the CD with the Diagnostic Supervisor on it. The Diagnostic
Supervisor then boots.

Diagnostics 2–33

2.4.2 Running VAX/DS
You can use VAX/DS in one of two modes: standalone
mode (exclusive use of the system) or user mode (under
VMS). There are several methods of booting the VAX/DS in
standalone mode any one of which can be used. Section 2.4.1
shows one, Example 2–10 shows another, and Example 2–12
shows a third.

Example 2–10: Running Standalone VAX/DS from a TK70
>>> BOOT/R5:10 CSA1

! Enter BOOT command designating the
! TK tape drive as input device; /R5:10
! is the boot flag indicating the
! VAX/DS program.
[self-test results print]
Loading system software.
VAX DIAGNOSTIC SOFTWARE
PROPERTY OF
DIGITAL EQUIPMENT CORPORATION
***CONFIDENTIAL AND PROPRIETARY***
Use Authorized Only Pursuant to a Valid Right-to-Use License
Copyright, Digital Equipment Corporation, 1990. All Rights Reserved.
DIAGNOSTIC SUPERVISOR. ZZ-ERSAA-14.X-NNNN 1-JAN-1990 12:01:45
DS>
! System boots VAX/DS and displays banner.
! Run VAX/DS level 3 or 2 programs.
DS> ^P
! Enter CTRL/P to exit VAX/DS
?02 External halt (CTRL/P, break, or external halt)
PC = 00027056
PSL = 00000200
KSP = 0004D210
>>>

2–34

! Console prompt returns.

VAX 6000 Models 300 and 400 Service Manual

Example 2–11: Running VAX/DS in User Mode
$
! At the operating system prompt, run
$ RUN ERSAA
! the VAX/DS program.
[VAX/DS banner prints, as in example above]
DS>
! VAX/DS prompt appears.
! Run VAX/DS level 2R or 2 programs.
DS> EXIT
! Type EXIT to exit VAX/DS
$
! Operating system prompt returns.

Table 2–7 describes the levels of VAX/DS programs. Check Table 2–9 for
the programs you wish to run, and determine if you will run VAX/DS in
standalone or user mode.
To run VAX/DS in standalone mode on systems with a TK70 insert a TK
tape containing the VAX/DS program into the TK tape drive on the system.
At the console prompt, boot VAX/DS from the TK tape using the /R5:10
qualifier:
>>> BOOT /R5:10 CSA1

where CSA1 is the device name for the TK tape drive, and /R5:10 sets the
boot flag designating the VAX/DS program (see Example 2–10). To run
VAX/DS in standalone mode from a CD server, see Section 2.4.1.
To run VAX/DS in user mode under VMS, you use the RUN command under
your operating system (see Example 2–11).
In either standalone or user mode, VAX/DS functions the same way.
Typically a diagnostic running in user mode provides less detailed results
than one running in standalone mode. For more information on VAX/DS,
see the documents listed in Table 2–8.

Diagnostics 2–35

2.4.3 Sample VAX/DS Session
When you run the VAX/DS programs, run the system
autosizer program EVSBA first. This program, which takes
several minutes to execute, will save you time as you proceed
with other tests. Certain conditions cause the generation of
an unexpected trap or interrupt. Use the method shown to
avoid these conditions.

Example 2–12: Sample VAX/DS Session, Part 1 of 3
>>> SET BOOT DIAG /XMI:B /R5:10

DUA0

!booting through a KDM70

>>> BOOT DIAG 1
[self-test results print]
Loading system software.
VAX DIAGNOSTIC SOFTWARE
PROPERTY OF
DIGITAL EQUIPMENT CORPORATION
***CONFIDENTIAL AND PROPRIETARY***
Use Authorized Only Pursuant to a Valid Right-to-Use License
Copyright, Digital Equipment Corporation, 1990. All Rights Reserved.
DIAGNOSTIC SUPERVISOR. ZZ-ERSAA-14.X-NNNN
DS> RUN EVSBA 2

1-JAN-1990 12:01:45

.. Program: EVSBA - AUTOSIZER
at 17:52:20.21.

X6.6, revision 6.6, 3 tests,

level 3

.. End of run, 0 errors detected, pass count is 1,
time is 31-DEC-1989 17:55:07.02

2–36

VAX 6000 Models 300 and 400 Service Manual

The SET BOOT command stores a nickname for a set of parameters to
the BOOT command. (The lower key switch on the control panel must
be set to Update when this command is issued.) This BOOT command
loads VAX/DS from disk. Alternatively, you can use the command
BOOT/R5:10 CSA1 if you have a TK70 as a load device, or you can
boot over the Ethernet from a CD server. For more information on the
BOOT and SET BOOT commands, see any of the VAX 6000 Owner’s
Manuals.

The off-line autosizer program EVSBA identifies hardware on your
system and builds a database for the VAX Diagnostic Supervisor.
The autosizer eliminates the need for you to type in the name and
characteristics of the hardware you intend to test under VAX/DS with
level 3 diagnostic programs.

Diagnostics 2–37

Example 2–13: Sample VAX/DS Session, Part 2 of 3
DS> SHOW DEV 3
_DWMBB1 DWMBB
HUB
61F00000
BI Node Number (HEX)=00000001(X)
_DUA
KDB50
_DWMBB1 7C008000
_DJA23 RA60
_DUA
7C500000
_KA0
<REFERENCE>(XRP)
HUB
_KA1
<REFERENCE>(XRP)
HUB
_DWMBB0 DWMBB
HUB
61E80000
BI Node Number (HEX)=00000001(X)
_TXA
DMB32
_DWMBB0 7A00A000
_ETA0
DEBNI
_DWMBB0 7A00A000
_DUA2
RA82
_DUA
7C500000
_DUA61 RA82
_DUA
7C500000
_DUA
TBK70
_DWMBB1 7C00C000
_MUA0
TK70
_DUA
7C580000

XMI node # (1,2,3,4,B,C,D,E) =0000000E(X)
BI Node Number (HEX)=00000004(X)
61880000 XMI Node ID=00000001(X)
61900000 XMI Node ID=00000002(X)
XMI node # (1,2,3,4,B,C,D,E) =0000000D(X)
BI Node Number (HEX)=00000005(X)
BI Node Number (HEX)=00000006(X)

BI Node Number (HEX)=00000006(X)

DS> SELECT ALL 4
DS> SET TRACE
DS> SET EVENT 2
DS> RUN ERKMP
.. Program: ERKMP - <REFERENCE>(XRP) MP Exerciser, revision 1.0, 10 tests,
at 18:11:41.25.
Testing: _KA0 _KA1
Booting Secondary Processor #02
Test 1: Memory Interlock Test
Test 2: Interprocessor Interrupt Test
Test 3: Write Error Interrupt Test
Test 4: Cache Invalidate Test
Test 5: XMI Bus Arbitration Test
Test 6: XMI Bus Arbitration Collision Test
Test 7: XMI Lockout Test
Test 8: Cache Coherency Test
Test 9: XMI Suppress Assertion Test
Test 10: Multiprocessor Exerciser
.. End of run, 0 errors detected, pass count is 1,
time is 31-DEC-1989 18:16:24.49
DS> ^P 5
?02 External halt (CTRL/P, break, or external halt)
PC = 00027056
PSL = 00000200
KSP = 0004D210

2–38

VAX 6000 Models 300 and 400 Service Manual

The autosizer builds a table of devices for VAX/DS that can be
printed by using the SHOW DEVICE/BRIEF command at the DS>
prompt. The command lists system devices, similar to the SHOW
CONFIGURATION command in console mode.

When preparing to run a diagnostic, the SELECT ALL command
selects all devices listed in 3 and the SET TRACE command enables
printing of test numbers and names when the diagnostic runs. If you
run another diagnostic after this one and you want the tests traced,
you will need to issue the SET TRACE command again. The SET
EVENT 2 command disables some informational messages printed by
this particular diagnostic.

An external halt causes VAX/DS to print the contents of the program
counter, the processor status longword, and the stack pointer. Since
VAX/DS was called from console mode, the console prompt is returned.
In a <REFERENCE>(rigel) system an external halt can, in some cases,
cause an unexpected trap or interrupt through SCB vector 60. The
remainder of this example shows how to avoid this condition by using
the CLEAR EXCEPTION command and what happens if the condition
is not cleared by the console. The condition does NOT apply to the
<REFERENCE>(hyperion).

Diagnostics 2–39

Example 2–14: Sample VAX/DS Session (Model 400 Only), Part 3 of 3
>>> CLEAR EXCEPTION 6
XBER = 00000041
! no error bits set
XFADR = 61880008
! no error bits set
RCSR = 01240001
! no error bits set
>>> SHOW CONFIGURATION 7
Type
Rev
1+ KA64A
(8082) 0007
3+ KA64A
(8082) 0007
A+ MS65A
(4001) 0002
B+ MS65A
(4001) 0002
E+ DWMBB/A (2002) 0001
XBI E
1+ DWMBB/B (210F) 000A
2+ CIBCA
(0108) 41C1
4+ KDB50
(010E) 0F1C
5+ DMB32
(0109) 210B
6+ TBK70
(410B) 0307
8+ DEBNI
(0118) 0100
>>> CLEAR EXCEPTION 8
XBER = 8001B041
! error bits set
XFADR = 61900000
! error bits set
RCSR = 012C0011
! error bits set
>>> CONTINUE 9
! No errors seen DS> appears
DS>
DS> ^P
?02 External halt (CTRL/P, break, or external halt)
PC = 0002704A
PSL = 00000204
KSP = 0004D210
>>> SHOW CONFIGURATION
.
.
.
>>> CONTINUE 10

! Errors seen before DS> appears

?? Unexpected trap or interrupt thru SCB vector 0060
PC at error:
0002704A(X)
PSL at error:
00000004(X) ; CUR=KERNEL,PRV=KERNEL,IPL=00(X),Z
User return PC:
none found!
DS> CONTINUE
.. Continuing from 0002704A
DS>

2–40

VAX 6000 Models 300 and 400 Service Manual

The CLEAR EXCEPTION command prints the contents of three
registers (XBER, XFADR, and RCSR) and then clears their error bits,
if set. No error bits have been set at this point.

The SHOW CONFIGURATION command attempts to examine unused
address space, creating errors.

Issuing the CLEAR EXCEPTION command again shows the contents
of the three registers with error bits set. These error bits are then
cleared by the command. When VAX/DS is halted as it was in 5 of part
2 of this example and a command is issued that causes errors, as in 7 ,
the CLEAR EXCEPTION command must be issued before issuing the
CONTINUE command to resume the VAX/DS session.

VAX/DS is halted and SHOW CONFIGURATION is issued, again
creating errors. (The response to SHOW CONFIGURATION is the
same as shown in 7 .)

This time the CONTINUE command is issued 10 without first issuing
the CLEAR EXCEPTION command. Since error bits were not cleared,
VAX/DS attempts to perform its error recovery procedures, and an
interrupt occurs. This is normal behavior for a <REFERENCE>(rigel)
system in these circumstances.

Diagnostics 2–41

2.4.4 VAX/DS Diagnostics
Table 2–9 lists the VAX Diagnostic Supervisor tests available
for both Model 400 and Model 300 systems.

Table 2–9: VAX Diagnostic Supervisor Programs
Diagnostic

Level

Diagnostic Title

ERSAA1

<REFERENCE>(rigel) Diagnostic Supervisor

ELSAA2

<REFERENCE>(hyperion) Diagnostic Supervisor

EVSBA

VAX Standalone Autosizer

EVSBB

VAX Diagnostic Online Autosizer

VAX 6000 EEPROM Update Utility
EVUCA

VAX 6000 EEPROM Update Utility

<REFERENCE>(xyp)-Specific Diagnostics
ELKAX2

Manual Tests (5–6 min)

ELKMP2

Multiprocessor Exerciser
(2 min—quick )
(4 min—default)

<REFERENCE>(XRP)-Specific Diagnostics
ERKAX1

Manual Tests (5–6 min2 )

ERKMP1

Multiprocessor Exerciser
(2 min—quick)
(4 min—default)

<REFERENCE>(xrv)-Specific Diagnostics
1 Diagnostic software with file names beginning with ER are tests created specifically for the <REFERENCE>(rigel) system. This software is not transportable.
2 Diagnostic software with file names beginning with EL are tests created specifically for the <REFERENCE>(Hyperion) system.

2–42

VAX 6000 Models 300 and 400 Service Manual

Table 2–9 (Cont.): VAX Diagnostic Supervisor Programs
Diagnostic

Level

Diagnostic Title
<REFERENCE>(xrv)-Specific Diagnostics

EVKAG

VAX Vector Instruction Exerciser, Part 1
(1 1/2 min—quick)
(16 min—default)

EVKAH

VAX Vector Instruction Exerciser, Part 2
(1 min—quick)
(18 min—default)

VAX CPU Cluster Exerciser
EVKAQ

VAX Basic Instructions Exerciser, Part 1

EVKAR

VAX Basic Instructions Exerciser, Part 2

EVKAS

VAX Floating-Point Instruction Exerciser, Part 1

EVKAT

VAX Floating-Point Instruction Exerciser, Part 2

EVKAU

VAX Privileged Architecture Instruction Test, Part 1

EVKAV

VAX Privileged Architecture Instruction Test, Part 2

XMA Online Memory Diagnostic
EVKAM

VAX Memory User Mode Test

DEMNA Diagnostics
EVDYE

DEMNA NI Functional Diagnostic

EVGDB

DEMNA EEPROM Update Utility

EVDWC

VAX NI Exerciser

KDM70 Diagnostics
EVRAE

Generic MSCP Disk Exerciser

EVRLJ

VAX UDA50/KDB50/KDM70 Exerciser

EVRLM

KDM70 EEPROM Update Utility

EVRLN

DUP Control Program

Diagnostics 2–43

Table 2–9 (Cont.): VAX Diagnostic Supervisor Programs
Diagnostic

Level

Diagnostic Title
CIXCD Diagnostics

EVGAA

CI Functional Test Part I

EVGAB

CI Functional Test Part II

EVGAC

Standalone CI Exerciser

EVXCI

VAX CI Exerciser

EVGEA

CIXCD Functional Test

EVGEB

CIXCD EEPROM Update Utility

KDB50 Diagnostics
EVRLF

UDA50/KDB50 Basic Subsystem Diagnostic

EVRLG

UDA50/KDB50 Disk Drive Exerciser

EVRLB

VAX RAxx Formatter

EVRLJ

VAX UDA50-A/KDB50 Subsystem Exerciser

EVRLK

VAX Bad Block Replace Utility

EVRLL

Disk Drive Internal Error Log Utility

EVRAE

VAX Generic MSCP Disk Exerciser

DEBNA Diagnostics
EVDYD

DEBNA Online Functional Diagnostic

EVDWC

VAX NI Exerciser

DEBNI Diagnostics
EVDYE

DEBNI Online Functional Diagnostic

EVDWC

VAX NI Exerciser

TBK Diagnostic
EVMDA

2–44

TK Data Reliability Exerciser

VAX 6000 Models 300 and 400 Service Manual

Table 2–9 (Cont.): VAX Diagnostic Supervisor Programs
Diagnostic

Level

Diagnostic Title
CIBCA-AA Diagnostics

EVGCA

T1015 Repair Level Diagnostic, Part 1

EVGCB

T1015 Repair Level Diagnostic, Part 2

EVGCC

T1015 Repair Level Diagnostic, Part 3

EVGCD

T1015 Repair Level Diagnostic, Part 4

EVGCE

T1025 Repair Level Diagnostic

EVGAA

CI Functional Diagnostic, Part 1

EVGAB

CI Functional Diagnostic, Part 2

EVGDA

CIBCA EEPROM Program and Update Utility

EVXCI

VAX CI Exerciser

CIBCA-BA Diagnostics
EVGEE

CIBCA-BA Repair Level Diagnostic, Part 1

EVGEF

CIBCA-BA Repair Level Diagnostic, Part 2

EVGEG

CIBCA-BA Repair Level Diagnostic, Part 3

EVGAA

CI Functional Diagnostic, Part 1

EVGAB

CI Functional Diagnostic, Part 2

EVGDA

CIBCA EEPROM Program and Update Utility

EVXCI

VAX CI Exerciser

KLESI-B/TU81 Diagnostics
EVMBA

VAX TU81 Data Reliability Diagnostic

EVMBB

VAX Front-End/Host Functional Diagnostic

DHB32 Diagnostics
EVDAR

DHB32 Diagnostics

EVDAS

DHB32 Macrodiagnostics

Diagnostics 2–45

Table 2–9 (Cont.): VAX Diagnostic Supervisor Programs
Diagnostic

Level

Diagnostic Title
DMB32 Diagnostics

EVAAA

VAX Line Printer Diagnostic

EVDAJ

DMB32 Online Asynchronous Port Test

EVDAK

DMB32 standalone Functional Verification

EVDAL

DMB32 Online Synchronous Port Test

EVDAN

DMB32 Online Data Communications Link

DRB32 Diagnostics
EVDRH

DRB32-M, -E Functional Diagnostic

EVDRI

DRB32-W Functional Diagnostic

TM32 Diagnostics
EVMEA

TM32 L2R Reliability Diagnostic

EVMEB

TM32 L3 Functional Diagnostic, Part 1

EVMEC

TM32 L3 Functional Diagnostic, Part 2

UNIBUS Diagnostics
EVCBB

VAX DWBUA VAXBI to UNIBUS

EVDRB

VAX DR11W Online Diagnostic

EVDRE

VAX DR11W Repair Level Diagnostic

EVDUP

DUP11 Repair Level, Part 1

EVDUQ

DUP11 Repair Level, Part 2

EVAAA

VAX Line Printer Diagnostic (LP11)

DSB32 Diagnostics
EVDAP

DSB32 Level 3 Diagnostic

EVDAQ

DSB32 Level 2R Diagnostic

2–46

VAX 6000 Models 300 and 400 Service Manual

Table 2–9 (Cont.): VAX Diagnostic Supervisor Programs
Diagnostic

Level

Diagnostic Title
RV20 Diagnostics

EVRVA

RV20 Level 3 Functional Diagnostic

EVRVB

RV20 Level 2R Diagnostic

Diagnostics 2–47

Chapter 3

<REFERENCE>(xyp) Scalar Processor
This chapter contains the following sections:
•

KA62B Physical Description and Specifications

•

Configuration Rules

•

Functional Description

•

Boot Processor

•

Power-Up Sequence

•

<REFERENCE>(xyp) Self-Test Results: Console Display

•

<REFERENCE>(xyp) Self-Test Results: Module LEDs

•

ROM-Based Diagnostics
<REFERENCE>(xyp) Self-Test RBD
CPU/Memory Test RBD
Second-Level Cache RBD

•

VAX/DS Diagnostics

•

Machine Checks

•

Console Commands

•

CPU Replacement in Single CPU System
Using the RESTORE Command
Using SET Commands

•

CPU Replacement in Multiple CPU Systems

•

How to Add a New Processor

•

Patching the EEPROM with EVUCA

•

<REFERENCE>(XYP) Registers

<REFERENCE>(xyp) Scalar Processor 3–1

3.1 KA62B Physical Description and Specifications
The <REFERENCE>(xyp) is a single-module VAX processor
based on a single CPU chip and a floating-point accelerator
chip. The module designation is T2011-YA. Features of the
module are shown in Figure 3–1.

Figure 3–1: <REFERENCE>(XYP) Module

SECOND-LEVEL
CACHE "A"

DIAGNOSTIC CONSOLE
ROM
ROM

CMOS
GATE ARRAY

XMI
CORNER

EEPROM

RED
ERROR
LED

ZIF
CONNECTOR
SEGMENTS

RED BOOT
PROCESSOR
LED
YELLOW
SELF-TEST
LED

TOY
CLOCK
TAG STORE
AND CHIPS
SECOND-LEVEL
CACHE "B"

3–2

SYSTEM
SUPPORT
CHIP

FLOATING-POINT
ACCELERATOR
CVAX
CHIP

CLOCK
CHIP

VAX 6000 Models 300 and 400 Service Manual

msb-0049-90

Table 3–1: KA62B Specifications
Parameter

Description

Module Number:

T2011-YA

Dimensions:

23.3 cm (9.2") H x 0.6 cm (0.25") W x 28.0 cm (11.0") D

Temperature:
Storage Range

-40o C to 66o C (-40o F to 151o F)

Operating Range

5o C to 50o C (41o F to 122o F)

Relative Humidity:
Storage

10 to 95% noncondensing

Operating

10 to 95% noncondensing

Altitude:
Storage

Up to 4.8 km (16,000 ft)

Operating

Up to 2.4 km (8000 ft)

Current:

8.2A at +5V

Power:

41W

Cables:

None

Diagnostics:

ROM-based diagnostics (0, 1, and 4)
VDS diagnostics, see Section 3.9.

<REFERENCE>(xyp) Scalar Processor 3–3

3.2 <REFERENCE>(xyp) Configuration Rules
The <REFERENCE>(xyp) module will operate in any slot.
Processors usually go on the right, beginning with slot
1. The maximum number of <REFERENCE>(xyp)s in a
<REFERENCE>(hyperion) is six.

Figure 3–2: Typical <REFERENCE>(xyp) Configuration
XMI CARD CAGE

D C B A 9

7 6 5 4 3

PROCESSOR
SLOTS
msb-0054-88

3–4

VAX 6000 Models 300 and 400 Service Manual

By convention, processors are placed in the right <REFERENCE>(XMI)
slots, beginning with slot 1. Memories are placed in the middle slots, from
slot A to slot 5 and then slots B and C. A VAXBI adapter, if installed,
occupies slot E. If a processor is failing intermittently and you are working
on a system remotely, you may want to leave the module in the system
temporarily and prevent the operating system from using that processor.
To disable a CPU:
1. Enter console mode.
2. Use the command SET CPU/NOENABLE to remove the processor from
the software configuration.
3. Reboot the operating system.
The console self-test display does not indicate that a CPU has been
disabled. However, the SHOW CPU command reports which CPUs have
been disabled on the /NOENABLED line of its display.

<REFERENCE>(xyp) Scalar Processor 3–5

3.3 KA62B Functional Description
The <REFERENCE>(xyp) processor has four functional
sections (see Figure 3–3): the CPU section, the second-level
cache, the XMI interface, and the console and diagnostics
sections.

Figure 3–3: <REFERENCE>(xyp) Block Diagram

CVAX
WITH
1 KB
CACHE

2ND
LEVEL
CACHE
256 KB

CFPA

CLOCK

LAT/BUF
CVAX CDAL

DUP
TAG
STORE

XMI
INTERFACE
GATE ARRAY

SSC

XCI

A<31:0>
EEPROM

MUX

XLATCH x 7

To/from
System Console

XMI CORNER

XCLOCK

ADRS

XMI
msb-0050-88

3–6

VAX 6000 Models 300 and 400 Service Manual

The CPU section includes:
•

The CVAX processor chip, which supports the VAX Base Instruction
Group and data types. It has full VAX memory management including
demand paging and 4 Gbytes of virtual memory. The CPU chip includes
the first-level cache, for I-stream (instruction) storage only. First-level
cache is 1 Kbyte, organized with 128 tags. Cache is write-through,
two-way associative, and is filled eight bytes at a time.

•

A floating-point accelerator chip, which supports the VAX Base
Instruction Group floating-point instruction set. Data types supported
by the hardware are D_floating, F_floating, and G_floating.

•

The clock chip includes a VAX standard time-of-year (TOY) clock with
access to battery backup, an interval timer with 10 ms interrupts, and
two programmable timers.

The second-level cache is for both I-stream and D-stream (data) storage.
Second-level cache is 256 Kbytes, organized with 4096 tags. Cache is writethrough and direct-mapped. If a processor read misses an entry in the
cache, or if the entry is invalid, the XMI gate array reads the data from
main memory. Cache is filled 32 bytes at a time; the first longword read
satisfies the processor’s read request.
The <REFERENCE>(XMI) interface includes:
•

An octaword write buffer that decreases bus and memory controller
bandwidth needs by packing writes into larger, more efficient blocks
prior to sending them to main memory.

•

Hexword cache fill logic that loads the second-level cache with eight
longwords of data on each cache miss.

•

<REFERENCE>(XMI) write monitoring logic that uses a duplicate
tag store to detect when another <REFERENCE>(XMI) node writes a
memory location that is cached on this processor. Then the gate array
invalidates the corresponding entry in the second-level cache.

•

Full set of error recovery and logging capabilities.

<REFERENCE>(xyp) Scalar Processor 3–7

Example 3–1: ROM and EEPROM Version Numbers

A
o
.
.
.

.
.
.
.
.

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
E
+
E

P
+
B
+
B

.
.

A4
64

A3
64

A2
64

A1
64

.
.

ROM = 6.0
1

3–8

EEPROM = 2.0/6.1
2
3

SN = SGO1234567

VAX 6000 Models 300 and 400 Service Manual

NODE #
TYP
STF
BPD
ETF
BPD

XBI E +
ILV
256Mb

The console and diagnostics sections include:
•

A console read-only memory (ROM). This ROM contains code to
initialize and boot the system and execute console commands. The last
line of the self-test display shows the ROM version. In this example,
the callout 1 indicates that the console ROM is version 6.0.

•

A diagnostic ROM, which contains the power-up self-test and extended
diagnostics. The diagnostic ROM has the same version number as the
console ROM 1 .

•

An electrically-erasable, programmable ROM (EEPROM), which
contains system parameters and boot code. You can modify the
parameters with the console SET commands. Patches read into a
special area of the EEPROM patch the console and diagnostic code in
ROM. A program run under the VAX Diagnostic Supervisor is used
to patch the EEPROM. See Section 3.15, Patching the EEPROM with
EVUCA.
The last line of the self-test display shows two EEPROM version
numbers. The first number 2 indicates the format version of the
EEPROM. This version is changed only when the internal structure
of the EEPROM is modified.
The second number 3 is the revision of ROM patches that have been
applied to the EEPROM. The major number in this revision (before the
decimal point) corresponds to the major number of the ROM revision 1 .
The minor number indicates the actual patch revision. In this example,
the EEPROM has been patched once for console ROM 6 and the patch
revision is .1 .
The location of the two ROMs and the EEPROM can be seen in
Figure 3–1, Section 3.1.

•

A system support chip (SSC) contains circuits for writing the EEPROM,
controlling the console, and timer support. On the module, the red LED
next to the yellow LED is controlled by the SSC. When the power-up
tests have completed successfully, the SSC on the boot processor turns
off this LED.

<REFERENCE>(xyp) Scalar Processor 3–9

3.4 Boot Processor
The <REFERENCE>(hyperion) system is designed so that all
processors share system resources equally. Because only
one processor can boot the system or use the console at any
given time, this processor is designated the primary or boot
processor. The others are called secondary processors. The
boot processor is selected during the power-up sequence.

Figure 3–4: Selection of Boot Processor

CPU WITH
LOWEST
XMI NODE ID

N
ELIGIBLE

CPU WITH NEXT
LOWEST
XMI NODE ID

PASSED
BOTH POWER-UP
TESTS

BOOT PROCESSOR
msb-0051-90

3–10

VAX 6000 Models 300 and 400 Service Manual

Using boot code stored in its EEPROM, the boot processor reads the boot
block from a specified device. Booting may be triggered by a command
issued to the boot processor from the console, or by a system reset with the
bottom key switch in the Auto Start position.
The boot processor also communicates with the system console, using
the common console lines on the backplane. When you change system
parameters in the EEPROM using SET commands, the boot processor
automatically copies the new values to the EEPROMs on the secondary
processors. If you swap in a new <REFERENCE>(xyp) module, it should be
configured as a secondary processor. Then you can either use the UPDATE
command to copy the boot processor’s entire EEPROM to the new secondary
or use EVUCA and a series of SET commands to customize the EEPROM.
Since UPDATE is slow, and can, in certain instances, render a processor
unusable, the preferred method of updating a new processor placed in a
system is to do it using SET commands. See Section 3.15 for information
on running EVUCA and Section 3.12.2 on setting parameters.
CAUTION: Using UPDATE can be dangerous because of revision
mismatches.
See Appendix C for information on what happens in
mismatched cases.
Usually the processor with the lowest <REFERENCE>(XMI) node number
(which is also the lowest slot number) is selected as the boot processor.
However, if this processor does not pass all its power-up tests, the next
higher-numbered processor is selected. This is one way the boot processor
can change.
The user also has control over boot processor selection with the SET CPU
command. This command may declare a processor ineligible for selection.
SET CPU can also select a boot processor explicitly.
You can see the boot processor selection three ways:
•

In the self-test display, the boot processor is indicated by a B on lines
labeled BPD.

•

In console mode, the command SHOW CPU displays the boot processor
as "Current primary."

•

In program mode, the bottom red LED (next to the larger yellow LED)
is off on the boot processor module. It is lit on secondary processors.

<REFERENCE>(xyp) Scalar Processor 3–11

3.5 Power-Up Sequence
Figure 3–5 shows the power-up sequence for <REFERENCE>(xyp)
processors. All processors execute two phases of self-test,
and a boot processor is selected. The boot processor tests
VAXBI adapters, if present, and prints the self-test display.
Figure 3–5: <REFERENCE>(xyp) Power-Up Sequence, Part 1 of 2
Power-up or system reset (cold)

CPU 1
Self-Test

CPU 2
Self-Test

...

CPU n
Self-Test

Determine
Boot Processor

...

Determine
Boot Processor

Boot Processor tests
all memory modules

Boot Processor prints
self-test results
Boot Processor signals
all CPUs to start CPU/MEM tests

CPU 1
CPU/MEM tests

CPU 2
CPU/MEM tests

...

CPU n
CPU/MEM tests

Determine
Boot Processor

...

Determine
Boot Processor

A
NOTE: The second determination of the boot processor occurs
even if the original boot processor passes all memory tests.
msb-0047-89

3–12

VAX 6000 Models 300 and 400 Service Manual

All CPUs execute their on-board self-tests at the beginning of the powerup tests. On the STF line of the self-test display, a plus sign (+) is shown
for every module whose self-test passes (see Section 3.6).

The boot processor is determined as described in Section 3.4. On the
first BPD line, the letter B corresponds to the processor selected as
boot processor. Because the processors have not yet completed their
power-up tests, the designated processor may later be disqualified from
being boot processor. For this reason, the BPD line appears twice in
the self-test display.

The boot processor tests all memory modules and then prints the results
of self-test, lines NODE, TYP, STF, and BPD on the self-test display.
The boot processor then signals all CPUs to start running the extended
test.

All CPUs execute an extended test using the memories. On the ETF
line of the self-test display, a plus sign (+) is shown for every module
that passes extended test.

If all CPUs pass the extended test, the original boot processor selection
is still valid. Lines STF and ETF would be identical for all the
processors.
The yellow LED is lit on all processor modules that pass both power-up
tests. On the secondary processors, the red LED next to the yellow one
is also lit. On the boot processor, this red LED is off (see Figure 3–7).
If the original boot processor fails the extended test (indicated by a
minus sign (–) on line ETF), a new boot processor is selected. On the
second BPD line, the letter B corresponds to the processor finally
selected as boot processor.

<REFERENCE>(xyp) Scalar Processor 3–13

Figure 3–6: <REFERENCE>(XYP) Power-Up Sequence, Part 2 of 2

Boot Processor prints
CPU/MEM test results

Boot Processor
executes DWMBB tests

Boot Processor prints
DWMBB test results

Boot Processor halts in console
mode or boots operating system

If Boot Processor is booting
operating system, starts all attached
CPUs after boot processor has booted

CPU 1
running

CPU 2
running

...

CPU n
running
msb-0048A-90

3–14

VAX 6000 Models 300 and 400 Service Manual

The boot processor prints the ETF line and the second BPD line of
the self-test display. If none of the processors is successfully selected
as the boot processor, no self-test results are displayed and the console
hangs. You can identify this hung state by examining the LEDs on the
processor modules (see Section 3.7). All yellow LEDs will be OFF. The
group of six red LEDS will flash two alternate patterns, and in one
pattern only the bottom light will be ON.
You can force a processor to become the boot processor so that it will
display self-test results by typing the following:
>>n

where n is the CPU to become the boot processor.
7

The boot processor tests the DWMBB if one is present. Test results are
indicated on the lines labeled XBI on the self-test display. A plus sign
(+) at the right means that the adapter test passed; a minus sign (–)
means that the test failed.

<REFERENCE>(xyp) Scalar Processor 3–15

3.6 <REFERENCE>(xyp) Self-Test Results: Console
Display
You can check the <REFERENCE>(xyp) self-test results both
in the self-test display and in the lights on the module.
Pertinent information in the self-test display is shown in
Example 3–2.

Example 3–2: Self-Test Results
F

A
o
.
.
.

.
.
.
.
.

A
+
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
E
+
E

P
+
E
+
B

P
+
D
+
D

P
+
B
E

.
.

A4
64

A3
64

A2
64

A1
64

.
.

ROM = 6.0
>>>

3–16

EEPROM = 2.0/6.0

SN = SGO1234567

VAX 6000 Models 300 and 400 Service Manual

NODE #
TYP
STF
BPD
ETF
BPD

XBI E +
ILV
256Mb

1
2
3
4
5

The second line in the self-test display indicates the type (TYP) of
module at each <REFERENCE>(XMI) node. Processors are type P. In
this example, processors are at nodes 1, 2, 3, and 4.

The third line shows self-test fail status (STF), which are the results of
on-board self-test. Possible values for processors are:
+ (pass)
– (fail)
All processors passed self-test in this example.

The BPD line indicates boot processor determination. When the system
completes on-board self-test, the processor with the lowest ID number
that passes self-test and is eligible (designated by an E on the BPD
line) is selected as boot processor — in this example, the processor at
node 1.
The results on the BPD line indicate:
•

B — The boot processor

•

E — Processors eligible to become the boot processor

•

D — Processors ineligible to become the boot processor

During extended testing (ETF) all processors run a test, which includes
reading and writing memory and using the cache. On line ETF, results
are reported for each processor in the same way as on line STF—a
plus sign indicates that extended self-test passed and a minus sign that
extended test failed. In this example, the processor at node 1 (originally
selected boot processor) failed the CPU/memory extended test.

Another BPD line is displayed, because it is possible for a different
CPU to be designated boot processor before the system actually boots.
This occurs in this example, because the processor at node 1 failed
the extended test. The lowest-numbered processor that passed both
tests is the processor at node 2. However, a previous SET CPU/
NOPRIMARY command has made this processor ineligible to be boot
processor (indicated by the designation D on the BPD line). Therefore,
the processor at node 3 is designated boot processor.

The bottom line of the self-test display shows the ROM and EEPROM
version numbers and the system serial number.

<REFERENCE>(xyp) Scalar Processor 3–17

3.7 <REFERENCE>(xyp) Self-Test Results: Module
LEDs
You can check <REFERENCE>(XYP) self-test results both in
the self-test display and in the lights on the module. As
shown in Figure 3–7, if self-test passes, the large yellow LED
is on.

3–18

VAX 6000 Models 300 and 400 Service Manual

Figure 3–7: <REFERENCE>(xyp) LEDs After Power-Up Self-Test

SELF-TEST PASSED

SELF-TEST FAILED
MOST
SIGNIFICANT
BIT

RED

ALL OFF

TEST NUMBER
(BINARY)

RED

OFF

ON OR OFF

YELLOW

BOOT CPU

SECONDARY CPU

OFF

msb-0052-88

<REFERENCE>(xyp) Scalar Processor 3–19

NOTE: The two processors in this book have different LED patterns. Refer
to Section 4.7 for interpreting <REFERENCE>(XRP) LEDs.
The large yellow LED at the bottom of the LED array is ON if self-test
passes and OFF if self-test fails. (Here self-test means both the on-board
power-up test and the extended CPU/memory test.)
On the boot processor module, the red LED next to the yellow is OFF.
This LED, which is controlled by the SSC chip, is ON on all the secondary
processors.
The six red LEDs on top are all OFF if self-test passes. If any of the LEDs
is ON, self-test failed and the LEDs contain a binary error code. The error
code corresponds to the number of the test that failed in hexadecimal. In
the six error LEDs, the most significant bit is at the top, but the lights have
a reverse interpretation — a bit is ONE if the light is OFF.
For example, assume a processor fails self-test (yellow LED is OFF), has a
minus sign (–) on its STF line, and shows the following pattern in its top
six LEDs:
(MSB)

on
on
off
off
off
on

TOP
0
0 =

1
1 = E
1
0
BOTTOM

The failing test number decodes to 001110 (hex 0E, decimal 14). If you then
ran the ROM-based diagnostic 0 with TRACE ON, the last test number you
would see displayed is T0014.
When any of the six red error LEDs is lit, a failure has occurred during
testing. There are three sets of power-up self-test: KA62B power-up tests,
CPU/memory tests, and optionally the VAXBI adapter (DWMBB) tests.
Interpretation of the processor board error LEDs depends on which set
of tests was running at the time of failure. Table 3–2 decodes the LED
conditions.

3–20

VAX 6000 Models 300 and 400 Service Manual

Processor error LEDs can also indicate failures of memories
or VAXBI adapters.

Table 3–2: KA62B Error LEDs
Yellow
LED

Error
LEDs
(hex)

OFF

1–22

Power-up self-test (equivalent
to RBD 0)
T0001–T0034

KA62B

STF

OFF

25–38

CPU/memory test - Memory 1
(equivalent to RBD 1)
T0001–T0020

MS65A 1 (module
with lowest XMI
node number)

ETF

OFF

CPU/memory test - Memory 2
T0002
(equivalent to ST 1/T=2)

MS65A 2

ETF

OFF

CPU/memory test - Memory 3
T0002
(equivalent to ST 1/T=2)

MS65A 3

ETF

OFF

CPU/memory test - Memory 4
T0002
(equivalent to ST 1/T=2)

MS65A 4

ETF

OFF

CPU/memory test - Memory 5
T0002
(equivalent to ST 1/T=2)

MS65A 5

ETF

OFF

CPU/memory test - Memory 6
T0002
(equivalent to ST 1/T=2)

MS65A 6

ETF

OFF

CPU/memory test - Memory 7
T0002
(equivalent to ST 1/T=2)

MS65A 7

ETF

OFF

CPU/memory test - Memory 8
T0002
(equivalent to ST 1/T=2)

MS65A 8

ETF

DWMBB test (equivalent to
RBD 2)
T0001–T0026
See Table 7–5.

DWMBB

XBI

1–1A
ON
(boot
processor)

3–22

Diagnostic
and Test No.
(decimal)

Device
Failing

SelfTest
Line

VAX 6000 Models 300 and 400 Service Manual

If a processor’s yellow LED is OFF and the six red LEDs show an error
code in the range 1–22 (hex), the power-up self-test failed and the processor
board is bad. On the self-test console display, the processor shows a minus
sign (–) on the STF line.
After the power-up tests, each processor runs the CPU/memory tests. If a
test fails, the processor shows a minus sign (–) on the ETF line of the selftest console display. With the first memory, LED error codes are numbered
from 25 to 38 (hex), to distinguish them from the power-up tests. For
example, assume that a processor fails self-test (yellow LED is OFF) and
shows the following pattern in the error LEDs:
TOP
(MSB)

off
on

1
0

on
off
off
off

0
1
1
1

BOTTOM

The failing test number decodes to 100111 (hex 27), which corresponds to
the third CPU/memory test. If you then ran the ROM-based diagnostic 1
with TRACE ON, the last test number you would see displayed is T0003.
Each processor, after testing with the first memory, runs the CPU/memory
test on every other good memory module. (However, only CPU/memory
test T0002 is run.) If a failure occurs, the memory module is probably
bad, although the processor’s yellow light is OFF and the memory module’s
yellow light is ON. If several processors fail on the same memory, the
memory is certainly bad. Try using SET MEMORY to configure the bad
module out of the interleave set. For error codes higher than 38, consult
Table 3–2 to determine the failing memory.
The last series is the DWMBB tests. If one fails, the top six LEDs contain
an error code, although the processor’s yellow self-test LED is ON (because
the CPU itself has passed). The failing error code (converted to decimal)
corresponds to a test number in Table 7–5. Note that only the boot processor
performs the DWMBB tests, so the red LED next to the yellow LED is OFF.

<REFERENCE>(xyp) Scalar Processor 3–23

3.8 ROM-Based Diagnostics
The <REFERENCE>(xyp) ROM contains five diagnostics,
which you run using the boot processor’s RBD monitor
program described in Chapter 2. RBD 0, 1, and 4 test the
boot processor. RBD 2 tests VAXBI adapters, and RBD 3 tests
memories.

Table 3–3: KA62B ROM-Based Diagnostics
Diagnostic

Test

<REFERENCE>(xyp) power-up test

<REFERENCE>(xyp) extended CPU/memory test

<REFERENCE>(XBI_PLUS) tests

Memory test

Second-level cache test

3–24

VAX 6000 Models 300 and 400 Service Manual

RBD 0 is the same as the power-up self-test. It is useful for running several
passes when a processor fails self-test intermittently. Section 3.8.1 shows
an example and lists the tests.
RBD 1 is the same as the extended CPU/memory test. It is useful
for running several passes when a processor fails self-test intermittently.
Section 3.8.2 shows an example and lists the tests.
RBD 2 is the set of tests that the boot processor runs for each DWMBB
VAXBI-to-XMI adapter when the system is powered on. (The DWMBB
has no on-board self-test of its own.) The diagnostic reports whether the
<REFERENCE>(XBI_PLUS) passed and whether each I/O device on that
adapter’s VAXBI bus passed its own self-test.
RBD 3 is a set of memory tests that sizes and runs extended tests on all of
memory. Section 6.11 and Section 6.12 show an example of memory RBDs
and list the tests.
RBD 4 is a set of exhaustive cache tests. It is not meant to be used
frequently—you must explicitly request each test to run. The complete
set of seven tests takes over one hour.
For a detailed explanation of the diagnostic printout, see Chapter 2.

<REFERENCE>(xyp) Scalar Processor 3–25

3.8.1 <REFERENCE>(xyp) Self-Test — RBD 0
RBD 0 is equivalent to the <REFERENCE>(xyp) power-up
self-tests.
Example 3–3: <REFERENCE>(xyp) Self-Test RBD 0
>>>
>>> T/R
RBD3>
RBD3> START 0 /TRACE/HE

;XCPST

6.0

; T0001 T0002
; T0011 T0012
; T0021 1
;
;
;

! Console program prompt.
! Command to enter RBD monitor program.
! RBD monitor prompt, where 3 is the hexa! decimal node number of the boot processor.
! Runs the KA62B self-test on boot processor
! Trace prints each test number; halt on error
! Test results written to the console terminal:

F 2
HE
21

T0003
T0013

T0004
T0014

T0005
T0015

T0006
T0016

T0007
T0017

T0008
T0018

T0009
T0019

T0010
T0020

3
8001
1 3
XDEV_ERR
1 T0021 1
00000000 00000001 00000000 00001420 1FFD074C 00040CD0 02

In the example above: 1 test 21 failed, 2 F indicates failure, and 3 the
diagnostic ran for one pass.

Table 3–4:

<REFERENCE>(xyp) Power-Up Test — RBD 0

Test

Function

T0001

<REFERENCE>(xyp) ROM test

T0002

SSC Base Address Register test

T0003

SSC RAM test

T0004

SSC Configuration Register test

T0005

SSC Bus Timeout test

T0006

SSC Programmable Address Decode test

T0007

KA62B CSR1 test

T0008

SSC Output Port test

3–26

VAX 6000 Models 300 and 400 Service Manual

Table 3–4 (Cont.):

<REFERENCE>(xyp) Power-Up Test — RBD 0

Test

Function

T0009

KA62B EEPROM test

T0010

SSC Interval Timer test

T0011

SSC Programmable Timers tests

T0012

SSC Console test

T0013

SSC TOY Clock test

T0014

CVAX Critical Path test

T0015

Cache Data RAM March test

T0016

Cache Mask Write test

T0017

Cache Data Parity RAM March test

T0018

CSR1:CPUD test

T0019

CFPA test

T0020

CFPA Critical Path test

T0021

XDEV Register test

T0022

XBER Register test

T0023

XFADR Register test

T0024

XGPR Register test

T0025

KA62B CSR2 Register test

T0026

XMI High Longword Data test

T0027

Interprocessor IVINTR test

T0028

Write Error IVINTR test

T0029

CNAK Read test

T0030

CNAK Write test

T0031

CNAK IP/WE IVINTR test

T0032

Multiple Interrupt test

T0033

Parity Error CNAK Read test

<REFERENCE>(xyp) Scalar Processor 3–27

Table 3–4 (Cont.):

<REFERENCE>(xyp) Power-Up Test — RBD 0

Test

Function

T0034

Parity Error CNAK Write test

3–28

VAX 6000 Models 300 and 400 Service Manual

3.8.2 CPU/Memory Test — RBD 1
RBD 1 is equivalent to the extended CPU/memory test.

Example 3–4: CPU/memory Test RBD 1
>>>Z 3

! This example uses the Z command
! to connect processor 3 to the console
! Note new console program prompt

3>> T/R

! Command to enter RBD monitor program

RBD3>

! RBD monitor prompt, where 3 is the hexa! decimal node number of the processor
! that is currently receiving your input.

RBD3> START 1 /TRACE/HE

! Runs the CPU/memory RBD with trace; halt
! on error. Test results written to the
! console terminal:

;CPUMEM
; T0001
; T0011

6.0
T0002
T0012

T0003
T0013

T0004
T0014

T0005
T0015

T0006
T0016

T0007
T0017

T0008
T0018

T0009
T0019

1
2
;
P
3
8001
1
;000000000 00000000 00000000 00000000 00000000 00000000 00000000
RBD3>

In the example above:
1

P means that the diagnostic ran successfully.

One pass was completed.

3–30

VAX 6000 Models 300 and 400 Service Manual

T0010
T0020

Table 3–5: Extended CPU/Memory Test — RBD 1
Test

Function

T0001

Cache Disable test

T0002

Cache Invalidate test

T0003

Cache Read Fill test

T0004

Interlock Instruction Cache test

T0005

Longword Write WB0 test

T0006

Octaword Write WB0 test

T0007

WB Switch and Purge test

T0008

Octaword Write WB1 test

T0009

Write Buffer Read Tests

T0010

Hit WB0 test

T0011

Hit WB1 test

T0012

WB Mask Bit Byte Tests

T0013

WB Mask Bit Word Tests

T0014

Intlk Read/Unlck Write WB test

T0015

I/O Space Write WB test

T0016

Node Private Space WB test

T0017

WB Address test

T0018

WB Pending Purge test

T0019

Duplicate Tag Invalidate test

T0020

Duplicate Tag Address test

<REFERENCE>(xyp) Scalar Processor 3–31

3.8.3 Second-Level Cache Test — RBD 4
RBD 4 tests the second-level cache. Note that no tests are
run by default.

Example 3–5: Second-Level Cache Test RBD 4

>>> T/R

! Command to enter RBD monitor program

RBD1>

! RBD monitor prompt, where 1 is the
! hexadecimal node number of the processor
! that is currently receiving your input

RBD1> ST4/T=1:2/TR

! Specifically asks for tests 1 and 2 to
! be run with trace enabled

;SLCRBD

6.0

; T0001

! Test 1 started

1
;
;

S
1
XX SL_CACHE

8001
XX

3
1
T0001

! Status message for test 1

;00000000 00040000 00000000 00000000 00000000 00000000 00000000 00000000
! Print message showing current
! address and ending address
; T0002
! Test 2 started
1
3
;
S
1
8001
1
! Status message for test 2
;
XX SL_CACHE
XX
T0002
;00000000 01000000 00000000 00000000 00000000 00000000 00000000 00000000
! Print message showing current
! address and ending address.
;00000042 00000000 00000000 00000000 00000000 00000000 00000000 00000000
! Print message showing the
! number of cache hits
2
3
;
P
1
8001
1
;00000000 00000000 00000000 00000000 00000000 00000000 00000000
RBD1> QUIT

3–32

! Exit the RBD monitor

VAX 6000 Models 300 and 400 Service Manual

S denotes status message for individual test.

P means that the entire diagnostic ran successfully.

One pass was completed.

Table 3–6: Second-Level Cache Test — RBD4
Test

Function

T0001

Parity Error Test

T0002

Cache Coherency Test

T0003

Cache Invalidate Test

T0004

Self-Invalidate Test

T0005

Invalidate/Self-Invalidate Test

T0006

Self-Invalidate Scope Test

T0007

Cache Ram Parity Error Test

T0008

Passive Release Test

<REFERENCE>(xyp) Scalar Processor 3–33

3.9 VAX/DS Diagnostics
The <REFERENCE>(xyp) software diagnostics that run
under the VAX Diagnostic Supervisor (VAX/DS) are listed
in Table 3–7. An example follows. See Section 2.4 for
instructions on running the supervisor.

Table 3–7: <REFERENCE>(xyp) VAX/DS Diagnostics
Program

Description

EVSBA

VAX Standalone Autosizer

EVKAQ

VAX Basic Instructions Exerciser - Part 1

EVKAR

VAX Basic Instructions Exerciser - Part 2

EVKAS

VAX Floating Point Instruction Exerciser - Part 1

EVKAT

VAX Floating Point Instruction Exerciser - Part 2

EVKAU

VAX Privileged Architecture Instruction Test - Part 1

EVKAV

VAX Privileged Architecture Instruction Test - Part 2

ELKAX

Manual Tests

ELKMP

Multiprocessor Exerciser

EVUCA

VAX 6000 EEPROM Update Utility

Example 3–6: Running Standalone Processor Diagnostics

DS> RUN EVSBA

DS> SEL KA0

DS> RUN ELKAX 3
[diagnostic messages]
DS> EXIT

3–34

VAX 6000 Models 300 and 400 Service Manual

Run the standalone autosizer; then you do not need to attach devices
to the supervisor explicitly. However, if you want to know the Attach
command, enter HELP diagnostic_name ATTACH.

The instruction and manual tests run on the boot processor. If the
boot processor is the CPU with the lowest <REFERENCE>(XMI) node
number (which is usually the case), issue the command to select KA0.
The Diagnostic Supervisor numbers the processors consecutively. For
example, if the <REFERENCE>(xyp) module with the second-lowest
<REFERENCE>(XMI) node number were boot processor, you would
select KA1.

This example runs the manual tests (ELKAX), which include powerfail,
machine check, restart, and EEPROM functions. The diagnostic prints
messages, and you must manually intervene using console switches.

Exit from VAX/DS.

<REFERENCE>(xyp) Scalar Processor 3–35

3.10 Machine Checks
A machine check is an exception that indicates a processordetected internal error. Figure 3–8 shows the parameters
that are pushed on the stack in response to a machine check.
Table 3–8 lists these parameters.
Figure 3–8: The Stack in Response to a Machine Check
BYTE COUNT (0010 hex)

SP:

MACHINE CHECK CODE

SP+4:

MOST RECENT VIRTUAL ADDRESS

SP+8:

INTERNAL STATE INFORMATION #1

SP+C:

INTERNAL STATE INFORMATION #2

SP+10:

SP+14:

PSL

SP+18:
msb-0053-89

Table 3–8: Machine Check Parameters
Parameter

Value

Description

Machine check code (hex)
(SP+4)

Floating-point protocol error

Floating-point reserved instruction

Floating-point unknown error

Process PTE in P0 space during TB miss
flows

Process PTE in P1 space during TB miss
flows

Process PTE in P0 space during
M = 0 flows

3–36

VAX 6000 Models 300 and 400 Service Manual

Table 3–8 (Cont.): Machine Check Parameters
Parameter

Value

Description

Process PTE in P1 space during
M = 0 flows

Undefined INT.ID value

Undefined MOVCx state

Memory read error

SCB, PCB, or SPTE read error

Memory write error

SCB, PCB, or SPTE write error

Most recent virtual address
(SP+8)

<31:0>

Current contents of VAP register

Internal state information #1
(SP+C)

<31:24>

Opcode

<23:16>

1110, highest priority software interrupt <3:0>

<15:8>

CADR<7:0>

<7:0>

MSER<7:0>

<31:24>

Most recent contents of SC register <7:0>

<23:16>

11, state flags <5:0>

<15:8>

Restart flag, 111, ALU CC flags <3:0>

<7:0>

Offset from saved PC to PC at time of machine check

PC
(SP+14)

<31:0>

PC at the start of the current instruction

PSL
(SP+18)

<31:0>

Current contents of PSL

Internal state information #2
(SP+10)

Machine checks are taken regardless of the current IPL. During a machine
check the IPL is raised to 1F and the machine check frame is pushed onto
the interrupt stack. If the machine check exception vector bits (<1:0>) are
not both one, the operation of the processor is undefined.

<REFERENCE>(xyp) Scalar Processor 3–37

3.11 Console Commands
Table 3–9 summarizes the console commands. The VAX
6000 Series Owner’s Manual gives a full description of each
command, its qualifiers, and examples.

Table 3–9: Console Commands
Command

Function

BOOT

Initializes the system, causing a self-test, and begins the boot
program.

CONTINUE

Begins processing at the address where processing was interrupted by a CTRL/P console command.

DEPOSIT

Stores data in a specified address.

EXAMINE

Displays the contents of a specified address.

FIND

Searches main memory for a page-aligned 256-Kbyte block of
good memory or for a restart parameter block.

HALT

Null command; no action is taken since the processor has already halted in order to enter console mode.

HELP

Prints explanation of console commands.

INITIALIZE

Performs a system reset, including self-test.

PATCH EEPROM

Patches console, diagnostic, and boot primitive code from a
TK70.

REPEAT

Executes the command passed as its argument.

RESTORE EEPROM

Copies, if present, the TK tape’s EEPROM contents to the EEPROM of the processor executing the command.

SAVE EEPROM

Copies to the TK tape, if present, the contents of the EEPROM of the processor executing the command.

SET BOOT

Stores a boot command by a nickname.

SET CPU

Specifies eligibility of processors to become the boot processor.

SET LANGUAGE

Changes the output of the console error messages between numeric code only (international mode) and code plus explanation (English mode).

3–38

VAX 6000 Models 300 and 400 Service Manual

Table 3–9 (Cont.): Console Commands
Command

Function

SET MEMORY

Designates the method of interleaving the memory modules; supersedes the console program’s default interleaving.

SET TERMINAL

Sets console terminal characteristics in the EEPROM.

SHOW ALL

Displays the current value of parameters set.

SHOW BOOT

Displays all boot commands and nicknames that have been
saved using SET CPU.

SHOW CONFIGURATION

Displays the hardware device type and revision level for
each XMI and VAXBI node and indicates self-test status.

SHOW CPU

Displays the /ENABLED and /PRIMARY values for each node.

SHOW ETHERNET

Locates all Ethernet adapters on the system and displays their addresses.

SHOW MEMORY

Displays the memory lines from the system self-test, showing interleave and memory size.

SHOW TERMINAL

Displays the baud rate and terminal characteristics functioning on the console terminal.

START

Begins execution of an instruction at the address specified in the command string.

STOP

Halts the specified node.

TEST

Passes control to the self-test diagnostics; /RBD qualifier invokes ROM-based diagnostics.

UPDATE

Copies contents of the EEPROM on the processor executing the command to the EEPROM of the processor specified in the command string.

Logically connects the console terminal to another processor on the <REFERENCE>(XMI) bus or to a VAXBI node.

Introduces a comment.

<REFERENCE>(xyp) Scalar Processor 3–39

3.12 CPU Replacement in Single CPU Systems
There are two methods available to customize a processor
in a single-processor system. The first uses the RESTORE
command; the second sets the EEPROM by console
commands.

3.12.1 Using the RESTORE Command
Use the RESTORE command to customize a replaced CPU in
a single-processor system. Use this method only if the ROM
revision of the spare is the same as the ROM revision of the
CPU being replaced. Before you begin set the terminal baud
rate to 1200.

Example 3–7: Replacing a Single Processor
F

A
o
.
.
.

.
.
.
.
.

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
B
+
B

.
.

A2
64

A1
64

.
.

ROM = 6.0 8

EEPROM = 2.0/6.0

SN = 0000000000 9

?4E System serial number has not been initialized 9
>>> RESTORE EEPROM 12
?6D EEPROM Revision = 2.0/6.0
?6F Tape image Revision = 2.0/6.1
Proceed with update of EEPROM? (Y or N)
!optional - may need latest console/diag patches again
>>> BOOT

3–40

VAX 6000 Models 300 and 400 Service Manual

NODE #
TYP
STF
BPD
ETF
BPD

XBI E +
ILV
128Mb

6
7
7

1. Turn the upper key switch straight up to the Off position (0).
2. Remove the defective CPU module.
3. Insert the new processor module.
4. Turn the lower key switch to Halt.
5. Turn the upper key switch to Enable.
6. Check the self-test display for the processor, indicated by a P on the
TYP line (usually in slot 1). See Example 3–7 6 .
7. If the processor shows a plus sign (+) on both the STF and ETF lines,
it passed self-test. See Example 3–7 7 .
8. Compare the ROM revision 8 of the new processor with the ROM
revision of the one you just replaced. If they are the same, continue
with this procedure; otherwise use the second method described in
Section 3.12.2.
9. You will see the following message: 9
?4E System serial number has not been initialized

10. Turn the lower key switch to Update.
11. Mount the TK cartridge containing the most recent saved image of the
old processor’s EEPROM.1
12. Issue the console command RESTORE EEPROM 12 to copy all areas
of the EEPROM except the module-specific area to the boot processor’s
EEPROM.
13. If any patches have been issued since the last save, use EVUCA to
patch the EEPROM. See Section 3.15 for details.
14. Turn the lower key switch to the Auto Start position.
15. Boot the operating system 15 . Booting will initialize the system and
the EEPROM will be read. If the system console baud rate was not
normally set at 1200, you will have to change the terminal baud rate
back to its original value.

When the system is installed or after maintenance, customer service engineers should
save the EEPROM on a TK cartridge if available. The cartridge is left in the care of the
customer. Subsequently, the EEPROM might have been changed and saved several times.
This would normally happen following a PATCH operation.

<REFERENCE>(xyp) Scalar Processor 3–41

3.12.2 Using SET Commands
When replacing the only processor module in a system that
does not have a TK, you must enter console commands that
customize the EEPROM. The Site Management Guide should
contain this information. Before you begin set the terminal
baud rate to 1200.

Example 3–8: Replacing a Single Processor
F

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
B
+
B

TYP
STF
BPD
ETF
BPD

.
.

A2
64

A1
64

.
.

ILV
128Mb

ROM = 6.0

EEPROM = 2.0/6.0

SN = 0000000000

?4E System serial number has not been initialized
>>>

(or

ESC

CTRL/3 )

DEL

SET SYSTEM SERIAL

RET

! Follow the prompts to set the serial number.
>>> SET BOOT DEFAULT /XMI:E DU0 11
>>> SET LANGUAGE INTERNATIONAL 12
OR
>>> SET LANGUAGE ENGLISH
>>> SET TERMINAL /[NO]SCOPE /SPEED:9600 /[NO]BREAK

!optional - may need latest console/diag patches 14
>>> BOOT

3–42

VAX 6000 Models 300 and 400 Service Manual

NODE #

7
8
8

1. Turn the upper key switch straight up to the Off position (0).
2. Remove the defective CPU module.
3. Insert the new processor module.
4. The EEPROM on the new module has a default baud rate of 1200.
Make sure your terminal is set to 1200.
5. Turn the lower key switch to Halt.
6. Turn the upper key switch to Enable.
7. Check the self-test display for the processor, indicated by a P on the
TYP line. See 7 in Example 3–8.
8. If the processor shows a plus sign (+) on both the STF and ETF lines,
it passed self-test. See 8 .
9. Turn the lower key switch to Update.
10. To correct the error message, enter the SET SYSTEM SERIAL
command (see 10 ) and follow the command prompts. The serial number
should be in the Site Management Guide. If you do not find it there,
look on an old self-test display or on the tape located near the bottom
of the left rear cabinet upright.
11. To set up the boot alternatives, enter the SET BOOT command
supplying the parameters recorded in the Site Management Guide. You
might want to check these with the system manager. 11
12. Use the SET LANGUAGE command to set up the language desired. 12
13. Use the SET TERMINAL command to set the EEPROM terminal
characteristics. 13 Results of the SET TERMINAL command will take
effect when the system is reset. Make sure the terminal itself is set to
the same characteristics.
14. Use whatever console commands are necessary to completely customize
the EEPROM to the customer’s satisfaction.
If any patches or boot primitives need to be selected, follow the
procedure in Section 3.15. 14
15. Turn the lower key switch to the Auto Start position and boot the
operating system. 15

<REFERENCE>(xyp) Scalar Processor 3–43

3.13 CPU Replacement in Multiple CPU Systems
In a multiprocessing system replacing a processor requires
customizing the new processor into the system. If the
processor being replaced is the boot processor, then a few
extra steps are required. Since different CPUs can have
different ROM and EEPROM revisions in the same system,
updating the EEPROM of any processor should be done
using SET commands and EVUCA.

Example 3–9: Retrieving EEPROM Information
F

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
E
+
E

P
+
B
+
B

TYP
STF
BPD
ETF
BPD

.
.

. A4
. 128

A3 A2 A1
128 128 128

.
.

ILV
512Mb

ROM = 6.0

EEPROM = 2.0/6.0

NODE #

SN = 0000000000 or SGO1234567

?4F System serial number not initialized on primary processor. 10
or
?2D For Secondary Processor 3
?59 System serial number mismatch. Secondary processor has xxxxxxx
>>> SET CPU 3 11
>>>

ESC

(or

CTRL/3 )

DEL

SHOW SYSTEM SERIAL 12

>>> SHOW ALL 13
[System configuration and customization information prints]

3–44

VAX 6000 Models 300 and 400 Service Manual

7
8
8

1. Turn the upper key switch straight up to the Off position (0).
2. Remove the defective CPU module.
3. Insert the new processor module.
4. If the processor you are replacing is the first processor on the right
(usually in slot one), the console will make it the boot processor. If this
is the case, make sure that the console terminal baud rate is 1200, the
default baud rate of the spare.
5. Turn the lower key switch to Halt.
6. Turn the upper key switch to Enable.
7. Check the self-test display for the processor, indicated by a P on the
TYP line. See 7 in Example 3–9.
8. If the processor shows a plus sign (+) on both the STF and ETF lines,
it passed self-test. 8
9. Turn the lower key switch to Update.
10. You will see either the ?4F message or the ?2D and ?59 messages. 10
If you see mismatch messages, you may have to patch the EEPROM
using EVUCA. See Section 3.15. If you see the ?4F message, the
boot processor has been replaced and you must execute the next step;
otherwise, go to Step 12.
11. Issue the SET CPU n command so that the console is connected to a
processor that has been in the system for some time. 11
12. Get the system serial number by entering the SHOW SYSTEM SERIAL
command. 12
13. Issue the SHOW ALL command to get the customized boot parameters,
interleave characteristics, terminal setup, and any other parameters.
13

<REFERENCE>(xyp) Scalar Processor 3–45

If you collected the necessary information, you are now
ready to customize the EEPROM.

Example 3–10: Customizing an EEPROM

>>> SET CPU 3
>>>

ESC

(or

14
CTRL/3 )

DEL

SET SYSTEM SERIAL 15

! Follow the prompts to set the serial number.
>>> SET BOOT DEFAULT /XMI:E DU0 16
>>> SET LANGUAGE INTERNATIONAL or ENGLISH 17
>>> SET TERMINAL /[NO]SCOPE /SPEED:9600 /[NO]BREAK

>>> SET CPU/NOPRIMARY 3 19
!optional - may need latest console/diag patches again
>>> BOOT 21

3–46

VAX 6000 Models 300 and 400 Service Manual

14. Issue the SET CPU n command to connect the console to the primary
or secondary processor you just replaced. 14
15. Issue the SET SYSTEM SERIAL 15 and follow the prompts to correct
the error message 10 .
16. Use the SET BOOT command supplying the parameters displayed by
the SHOW ALL command to set up the boot alternatives. 16
17. Use the SET LANGUAGE command to set the language desired. 17
18. Use the SET TERMINAL command to set the EEPROM terminal
characteristics. These characteristics take effect when the system is
initialized and the EEPROM is read again. Make sure the terminal is
set to the same characteristics. 18
19. If the CPU you are working on has been designated as ineligible to be
the boot processor, use the SET CPU/NOPRIMARY command to set its
EEPROM correctly. 19
20. If any patches or boot primitives need to be selected, follow the
procedure in Section 3.15. 20
21. Turn the lower key switch to the Auto Start position and boot the
operating system. 21

<REFERENCE>(xyp) Scalar Processor 3–47

3.14 How to Add a New Processor
Add a new processor in a slot to the left of the boot processor
so it will be a secondary processor at power-up. This
procedure is similar to that described in Section 3.13.

Example 3–11: Adding a Processor
F

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
E
+
E

P
+
B
+
B

TYP
STF
BPD
ETF
BPD

.
.

. A4
. 128

A3 A2 A1
128 128 128

.
.

ILV
512Mb

ROM = 6.0

EEPROM = 2.0/6.0

?2D For Secondary Processor 3 8
?59 System serial number mismatch.

NODE #

SN = SGO1234567
Secondary processor has xxxxxxx

>>> SHOW ALL 9
[System configuration and customization information prints]
>>> SET CPU 4
>>>

ESC

(or

10
CTRL/3 )

! the node number of the CPU you added
DEL

SET SYSTEM SERIAL 11

>>> SET BOOT DEFAULT /XMI:E/ DU0 12
>>> SET LANGUAGE INTERNATIONAL or ENGLISH 13
>>> SET TERMINAL /[NO]SCOPE /SPEED:9600 /[NO]BREAK

>>> SET CPU/NOPRIMARY 15
!optional - may need latest console/diag patches again
>>> BOOT 17

3–48

VAX 6000 Models 300 and 400 Service Manual

5
6
6

1. Turn the upper key switch straight up to the Off position (0).
2. Insert the new processor module to the left of the boot processor.
3. Turn the lower key switch to Halt.
4. Turn the upper key switch to Enable.
5. Check the self-test display for the processor, indicated by a P on the
TYP line. See 5 in Example 3–11.
6. If the processor shows a plus sign (+) on both the STF and ETF lines,
it passed self-test. 6
7. Turn the lower key switch to Update.
8. You will see the ?2D and ?59 messages. 8 In addition, you may see
messages indicating that you need to patch the EEPROM. Should you
need to do so, see Section 3.15.
9. Type SHOW ALL to get the customized boot parameters, interleave
characteristics, terminal setup, and any other parameters. 9
10. Connect the console to the CPU you just added with the SET CPU n
command. 10
11. Issue the SET SYSTEM SERIAL command 11 and follow the prompts
to correct the error message.
12. Issue the SET BOOT command supplying the parameters displayed by
the SHOW ALL command to set up the boot alternatives. 12
13. Issue the SET LANGUAGE command to set the language desired. 13
14. Issue the SET TERMINAL command to set the EEPROM terminal
characteristics. 14
15. Use the SET CPU/NOPRIMARY command if the customer does not
want this particular CPU to become the primary for some reason. 15
16. If any patches or boot primitives need to be selected, follow the
procedure in Section 3.15. 16
17. Turn the lower key switch to the Auto Start position and boot the
operating system. 17

<REFERENCE>(xyp) Scalar Processor 3–49

3.15 Patching the EEPROM with EVUCA
To update the console and diagnostic ROMs on all VAX 6000
systems, use EVUCA under the Diagnostic Supervisor in
standalone mode.

Example 3–12: Patching the EEPROM with EVUCA — Part 1
>>> BOOT /XMI:A /R5:110 EX0 3
[self-test display prints]
Filename: ISL_LVAX
Follow Prompts
[Diagnostic Supervisor banner]
DS> LOAD EVUCA 4
DS> ATTACH KA62B HUB KA0 1 5
DS> ATTACH KA62B HUB KA1 2
DS> ATTACH KA62B HUB KA2 5
DS> ATTACH KA62B HUB KA3 6
DS> SELECT ALL 6
DS> SET TRACE
DS> START
.. Program: EVUCA - VAX 6000 EEPROM Update Utility, revision 1.0, 5 tests,
Testing: _KA0 _KA1 _KA2 _KA3
Booting secondary CPU 02.
Booting secondary CPU 05.
Booting secondary CPU 06.
Test 2: Load data from media
7
Data file? <ELUCB.BIN>
Searching for data file...
Data file loaded.
Looking for patch for CPU 01 - ROM 06.00 EEPROM 06.00
No patch image was found for CPU 01 - ROM 06.00 EEPROM 06.00 8
Looking for patch for CPU 02 - ROM 06.00 EEPROM 06.00
No patch image was found for CPU 02 - ROM 06.00 EEPROM 06.00
Looking for patch for CPU 05 - ROM 04.10 EEPROM 04.10
Patch image is revision 04.60
Do you really want to apply this patch [(No), Yes] YES 9
Looking for patch for CPU 06 - ROM 04.10 EEPROM 04.60
Patch image is revision 04.60
Do you really want to apply this patch [(No), Yes]
Test 3: Determine Typecode Updated

3–50

VAX 6000 Models 300 and 400 Service Manual

1. Turn the lower key switch to Update.
2. Load the latest diagnostic CD in the CD drive. The CD is labeled 6000_
DIAG_x where x is a letter revision.
3. Boot the VAX Diagnostic Supervisor from the CD server using a
command similar to that shown in Example 3–12 (see 3 ).
Alternatively, you could boot the supervisor from some other disk,
perform the appropriate ATTACH commands, and then use the VAX/DS
command SET LOAD to load EVUCA from the CD server. If you have
already copied the latest diagnostics to a local disk, run EVUCA from
there.
4. At the DS> prompt, type LOAD EVUCA (see 4 in Example 3–12).
5. Issue the ATTACH command similar to that shown by 5 to enable
VAX/DS access to the CPUs on the system.
6. The CPUs are selected, TRACE is set, and EVUCA is started (see 6 ).
7. Test 2 of EVUCA selects the correct patch file for the system being
patched 7 . A carriage return is the appropriate response. (Test 1 is for
Manufacturing Automated Verification System use.)
8. After loading the file, EVUCA identifies the ROM and EEPROM
revisions of each CPU in the system and reports whether there is a
patch for that revision. CPUs at nodes 1 and 2 8 have no patches.
9. When a patch is found, EVUCA asks the operator whether the patch
should be applied. For CPU 05 the patch image found is 4.60 and the
EEPROM rev. is 4.10 (see 9 ). A "yes" response is given. For CPU 06
the patch revision is 4.60 and the EEPROM revision is 4.60. Therefore,
the choice is made not to patch this EEPROM.
10. Test 3 determines what sections of the EEPROM need updating (see
10 ).

<REFERENCE>(xyp) Scalar Processor 3–51

Example 3–13: Patching the EEPROM with EVUCA — Part 2
13
Test 4: Update EEPROM data
Getting selectable boot primitives for CPU 05, ROM 04.10

[I/O device types in system identified]
[Boot primitives available identified]
Available boot primitive space is 27F4
Please enter what boot primitive to delete by number. [1-3(D)] 2
Boot primitives fit into allotted EEPROM area.
Secondary CPUs are being updated, please wait a maximum of 20 seconds. 14
Updating CPU 05
Test 5: Show Boot primitives
ROM boot primitives for CPU 01, revision 06.00 are:
1
This boot primitive supports the following:
- boot primitive designation DI
- boot primitive designation MI
- boot primitive designation CI
15
Device CIBCA, device type 0108
Device KFMSA, device type 0810
Device CIXCD, device type 0C05
.
.
.
[Messages about retrieving secondary CPU boot primitives]
CPU 02 has the same console revision as node 01.
Boot primitives are the same for these CPUs.

ROM boot primitives for CPU 05 are:
1
This boot primitive supports the following:
- boot primitive designation CI
2
This boot primitive supports the following:
- boot primitive designation DU
.
.
.
EEPROM boot primitives for CPU 05 are:
1

This boot primitive supports the following:
- boot primitive designation ET
.
.
.

CPU 06 has the same console revision as node 05.
Boot primitives are the same for these CPUs.

Example 3–13 Cont’d on next page

3–52

VAX 6000 Models 300 and 400 Service Manual

Example 3–13 (Cont.): Patching the EEPROM with EVUCA — Part 2
The primary CPU was not updated.
Secondary CPU 05, was successfully updated.
Current ROM

and EEPROM revisions for each CPU are:

[ROM revisions and EEPROM revisions summarized for each CPU] 18
.. End of run, 0 errors detected, pass count is 1,
time is 1-JAN-1991 17:06:57.88
DS>

13. Test 4 creates a new updated EEPROM image in memory (see 13 ).
Several boot primitives are available. Those that are permanent
reside in ROM; those that are selectable or are patched reside in
the EEPROM. If all boot primitives fit, EVUCA will not go through
a selection process. However, if all primitives do not fit, the user is
shown all the boot primitives available and prompted to choose which
primitive is not wanted. If enough space is available, EVUCA will
continue. If enough space is not available, the user must choose another
unwanted primitive. This process continues until space is available
for the remaining primitives.
14. Once the primitives fit, the EEPROMs are updated and the message
noted by 14 is printed.
15. Later ROM revisions identify both what boot primitives are available
and what devices they support (see 15 ).
16. CPU 2 and CPU 1 have the same ROM revision and have the same
boot primitives 16 .
17. CPU 5 has been patched, and test 5 shows the primitives in ROM
followed by those in EEPROM (See 17 in Example 3–13). Since the
ROM is an older revision, the devices the primitives support are not
printed.
18. A final list of current ROM and EEPROM revisions is printed 18 .

<REFERENCE>(xyp) Scalar Processor 3–53

3.16 <REFERENCE>(XYP) Registers
The <REFERENCE>(xyp) registers consist of the processor
status longword, internal processor registers, <REFERENCE>(xyp)
registers in <REFERENCE>(XMI) private space, <REFERENCE>(XMI) required registers, and 16 general purpose registers.

Table 3–10: <REFERENCE>(xyp) Internal Processor Registers
Register

Mnemonic

Address

Type

Class

Kernel Stack Pointer

KSP

IPR0

R/W

Executive Stack Pointer

ESP

IPR1

R/W

Supervisor Stack Pointer

SSP

IPR2

R/W

User Stack Pointer

USP

IPR3

R/W

Interrupt Stack Pointer

ISP

IPR4

R/W

Reserved

IPR5–IPR7

P0 Base Register

P0BR

IPR8

R/W

P0 Length Register

P0LR

IPR9

R/W

P1 Base Register

P1BR

IPR10

R/W

P1 Length Register

P1LR

IPR11

R/W

Key to Types:
R–Read
W–Write
R/W–Read/write
Key to Classes:
1–Implemented by the <REFERENCE>(xyp), specified in the VAX Architecture Reference Manual.
2–Implemented uniquely by the <REFERENCE>(xyp).
3–Not implemented. Read as zero; NOP on write.
4–Access not allowed; accesses result in a reserved operand fault.
5–Accessible, but not fully implemented; accesses yield UNPREDICTABLE results.
n I–The register is initialized on <REFERENCE>(xyp) reset (power-up, system reset, and node reset).

3–54

VAX 6000 Models 300 and 400 Service Manual

Table 3–10 (Cont.): <REFERENCE>(xyp) Internal Processor Registers
Register

Mnemonic

Address

Type

Class

System Base Register

SBR

IPR12

R/W

System Length Register

SLR

IPR13

R/W

Reserved

IPR14–IPR15

Process Control Block Base

PCBB

IPR16

R/W

System Control Block Base

SCBB

IPR17

R/W

Interrupt Priority Level

IPL

IPR18

R/W

AST Level

ASTLVL

IPR19

R/W

Software Interrupt Request

SIRR

IPR20

Software Interrupt Summary

SISR

IPR21

R/W

Reserved

IPR22–IPR23

Interval Clock Control/Status

ICCS

IPR24

R/W

Next Interval Count

NICR

IPR25

Interval Count

ICR

IPR26

Time-of-Year Clock

TODR

IPR27

R/W

Console Storage Receiver Status

CSRS

IPR28

R/W

Console Storage Receiver Data

CSRD

IPR29

Console Storage Transmitter Status

CSTS

IPR30

R/W

Console Storage Transmitter Data

CSTD

IPR31

Console Receiver Control/Status

RXCS

IPR32

R/W

Console Receiver Data Buffer

RXDB

IPR33

Console Transmit Control/Status

TXCS

IPR34

Console Transmit Data Buffer

TXDB

IPR35

Translation Buffer Disable

TBDR

IPR36

R/W

Cache Disable

CADR

IPR37

R/W

Machine Check Error Summary

MCESR

IPR38

R/W

Memory System Error

MSER

IPR39

R/W

Reserved

IPR40–IPR41

<REFERENCE>(xyp) Scalar Processor 3–55

Table 3–10 (Cont.): <REFERENCE>(xyp) Internal Processor Registers
Register

Mnemonic

Address

Type

Class

Console Saved PC

SAVPC

IPR42

Console Saved PSL

SAVPSL

IPR43

Reserved

IPR44–IPR47

SBI Fault/Status

SBIFS

IPR48

R/W

SBI Silo

SBIS

IPR49

SBI Silo Comparator

SBISC

IPR50

R/W

SBI Maintenance

SBIMT

IPR51

R/W

SBI Error

SBIER

IPR52

R/W

SBI Timeout Address

SBITA

IPR53

SBI Quadword Clear

SBIQC

IPR54

I/O Bus Reset

IORESET

IPR55

Memory Management Enable

MAPEN

IPR56

R/W

Translation Buffer Invalidate
All

TBIA

IPR57

Translation Buffer Invalidate
Single

TBIS

IPR58

Translation Buffer Data

TBDATA

IPR59

R/W

Microprogam Break

MBRK

IPR60

R/W

Performance Monitor Enable

PMR

IPR61

R/W

System Identification

SID

IPR62

Translation Buffer Check

TBCHK

IPR63

Reserved

IPR64–IPR127

The IPRs are explicitly accessible to software only by the Move To Processor
Register (MTPR) and Move From Processor Register (MFPR) instructions,
which require kernel mode privileges. From the console, EXAMINE/I and
DEPOSIT/I commands read and write the IPRs.

3–56

VAX 6000 Models 300 and 400 Service Manual

Table 3–11: <REFERENCE>(XMI) Registers for the the <REFERENCE>(xyp)
Register

Mnemonic

Address

XMI Device

XDEV

BB + 00

XMI Bus Error

XBER

BB + 04

XMI Failing Address

XFADR

BB + 08

XMI XGPR

XGPR

BB + 0C

KA62B Control/Status #2

CSR2

BB + 10

Note: "BB" = base address of a node, which is the address of the first
location in nodespace.

<REFERENCE>(xyp) Scalar Processor 3–57

Table 3–12: <REFERENCE>(xyp) Registers in <REFERENCE>(XMI)
Private Space
Register

Mnemonic

Address

KA62B Control/Status #1

CSR1

2000 0000

KA62B ROM

ROM

2004 0000 to 2007 FFFF

KA62B EEPROM

EEPROM

2008 0000 to 2008 7FFF

SSC Base Address

SSCBR

2014 0000

SSC Configuration

SSCCR

2014 0010

CDAL Bus Timeout

CBTCR

2014 0020

Console Select

CONSEL

2014 0030

Timer Control Register 0

TCR0

2014 0100

Timer Interval Register 0

TIR0

2014 0104

Timer Next Interval Register 0

TNIR0

2014 0108

Timer Interrupt Vector Register 0

TIVR0

2014 010C

Timer Control Register 1

TCR1

2014 0110

Timer Interval Register 1

TIR1

2014 0114

Timer Next Interval Register 1

TNIR1

2014 0118

Timer Interrupt Vector Register 1

TIVR1

2014 011C

CSR1 Base Address

CSR1BADR

2014 0130

CSR1 Address Decode Mask

CSR1ADMR

2014 0134

EEPROM Base Address

EEBADR

2014 0140

EEPROM Address Decode Mask

EEADMR

2014 0144

SSC BBU RAM

BBURAM

2014 0400 to 2014 07FF

IP IVINTR Generation

IPIVINTRGEN

2101 0000 to 2101 FFFF

WE IVINTR Generation

WEIVINTRGEN

2102 0000 to 2102 FFFF

3–58

VAX 6000 Models 300 and 400 Service Manual

Chapter 4

<REFERENCE>(XRP) Scalar Processor
This chapter contains the following sections:
•

<REFERENCE>(XRP) Physical Description and Specifications

•

<REFERENCE>(XRP) Configuration Rules

•

<REFERENCE>(XRP) Functional Description

•

Boot Processor

•

Power-Up Sequence

•

<REFERENCE>(XRP) Self-Test Results: Console Display

•

<REFERENCE>(XRP) Self-Test Results: Module LEDs

•

<REFERENCE>(XRP) Self-Test Results: XGPR Register

•

ROM-Based Diagnostics
<REFERENCE>(XRP) Self-Test — RBD 0
CPU/Memory Interaction Tests — RBD 1

•

VAX/DS Diagnostics

•

Machine Checks

•

Console Commands

•

<REFERENCE>(XRP) Handling Procedures

•

CPU Replacement in Single CPU System
Using the RESTORE Command
Using SET commands

•

CPU Replacement in Multiple CPU Systems

•

How to Add a New Processor

•

Patching the EEPROM with EVUCA

•

<REFERENCE>(XRP) Registers

<REFERENCE>(XRP) Scalar Processor 4–1

4.1 <REFERENCE>(XRP) Physical Description and
Specifications
The <REFERENCE>(XRP) is a single-module VAX processor.
The module designation is T2015. <REFERENCE>(rigel) systems can include up to six <REFERENCE>(XRP) processors,
which use the 100 Mbyte/second <REFERENCE>(XMI) system bus to communicate with memory. Features of the module are shown in Figure 4–1.

Figure 4–1: <REFERENCE>(XRP) Module

FLOATING-POINT
PROCESSOR

SYSTEM
SUPPORT
CHIP

XMI
INTERFACE

XMI
CORNER

CLOCK
CHIP

PROCESSOR
CHIP

ZIF
CONNECTOR
SEGMENTS

CACHE
CONTROL

YELLOW
SELF-TEST
LED
RED
LEDs

SECONDARY
CACHE

4–2

EEPROM

CONSOLE
ROM

VAX 6000 Models 300 and 400 Service Manual

DIAGNOSTIC
ROM

msb-0193B-90

Table 4–1: <REFERENCE>(XRP) Specifications
Parameter

Description

Module Number:

T2015

Dimensions:

23.3 cm (9.2") H x 0.6 cm (0.25") W x 28.0 cm (11.0") D

Temperature:
Storage Range

-40o C to 66o C (-40o F to 151o F)

Operating Range

5o C to 50o C (41o F to 122o F)

Relative Humidity:
Storage

10% to 95% noncondensing

Operating

10% to 95% noncondensing

Altitude:
Storage

Up to 4.8 km (16,000 ft)

Operating

Up to 2.4 km (8000 ft)

Current:

8.2A at +5V

Power:

41W

Cables:

Optional VIB for vector, 17-02240-03

Diagnostics:

ROM-based diagnostics (0 and 1)
VAX/DS diagnostics, see Section 4.11.

<REFERENCE>(XRP) Scalar Processor 4–3

4.2 <REFERENCE>(XRP) Configuration Rules
<REFERENCE>(XRP) modules will operate in any slot of the
XMI card cage; however, processors usually go on the right,
beginning with slot 1. Special rules apply if the KA64A has
an attached vector processor; see Section 5.3.

Figure 4–2: Typical <REFERENCE>(XRP) Configuration
XMI CARD CAGE

D C B A 9

7 6 5 4 3

PROCESSOR
SLOTS
msb-0054-88

4–4

VAX 6000 Models 300 and 400 Service Manual

By convention, processors are placed in the right <REFERENCE>(XMI)
slots, beginning with slot 1 and extending to slot 6. Memories are placed in
the middle slots, from slot A to slot 5 and then slots B and C, and VAXBI
adapters are installed in the left side of the card cage, beginning with slot
E.
An attached vector processor must be in the slot to the left of the
<REFERENCE>(XRP) module. The slot to the left of the vector processor
can be used only for a memory module. Installing another kind of module
can damage the vector module. A second scalar, vector, memory trio may
be placed next to the first. See Section 5.3 for a discussion of configuration
rules related to scalar/vector pairs.
For performance reasons, the scalar processor of a scalar/vector pair should
not be made the primary processor when other scalar processors are in the
system.

<REFERENCE>(XRP) Scalar Processor 4–5

4.3 KA64A Functional Description
The <REFERENCE>(XRP) processor has four functional
sections (see Figure 4–3): the CPU section, the backup cache,
the XMI interface, and the console and diagnostics sections.
Figure 4–3: <REFERENCE>(XRP) Block Diagram
System and
Aux Console
CPU
with
Cache

Control

Floating
Point

System
Support

Data

ROM
and
EEPROM

Addr

Data and Address Lines

Clock

Data

Addr
Control
Cache

To Vector
Module

Cache
Control

Inval-Bus

XMI
Interface

XCI

VIB

XClock

XLatch x 7

XMI
Corner

XMI Bus

msb-0181-89

4–6

VAX 6000 Models 300 and 400 Service Manual

The CPU section includes:
•

The processor chip, which supports the VAX Base Instruction Group
and data types. It contains a 64-entry, fully associative translation
buffer for both process and system-space mappings. The processor chip
includes a 2-Kbyte, direct-mapped, write-through instruction and data
cache with a quadword block and fill size.

•

A floating-point accelerator chip that enhances the computation phase
of floating-point and some integer instructions. This chip receives
operands from the processor chip, computes the result, and passes the
result and status back to the processor chip to complete the instruction.

The backup cache is a 128-Kbyte, direct-mapped, write-through instruction
and data cache. It is implemented in 24 16-Kbyte x 4 data RAMs. The
backup cache contains 2-Kbyte tags, organized to provide an octaword fill
size and a 4-octaword block size.
The <REFERENCE>(XMI) interface includes:
•

An octaword write buffer that decreases bus and memory controller
bandwidth needs by packing writes into larger, more efficient blocks
prior to sending them to main memory.

•

Cache fill logic that loads the backup cache with four octawords of data
on each cache miss.

•

<REFERENCE>(XMI) write monitoring logic that uses a duplicate
tag store to detect when another <REFERENCE>(XMI) node writes
a memory location that is cached on this processor. Then the XMI
interface chips invalidate the corresponding entry in the backup cache.

•

Full set of error recovery and logging capabilities.

<REFERENCE>(XRP) Scalar Processor 4–7

Example 4–1: ROM and EEPROM Version Numbers
#123456789 0123456789 0123456789 01234567#
F

A
o
.
.
.

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
E
+
E

P
+
B
+
B

.
.

A4
64

A3
64

A2
64

A1
64

.
.

ROM0 = V3.00 1

4–8

ROM1 = V3.00 2

EEPROM = 2.03/3.00 3

VAX 6000 Models 300 and 400 Service Manual

NODE #
TYP
STF
BPD
ETF
BPD

XBI E +
ILV
256Mb

SN = SG01234567 4

The console and diagnostics sections include:
•

A console read-only memory (ROM), which contains the code for
initialization, executing console commands, and bootstrapping the
system. The last line of the self-test display shows the ROM version.
In this example callout 1 indicates that the console ROM, ROM0, is
version V3.00.

•

A diagnostic ROM, ROM1, which contains the power-up self-test and
extended diagnostics. The diagnostic ROM has the same version
number as the console ROM. In this example callout 2 indicates that
the diagnostic ROM is version V3.00.

•

An electrically-erasable, programmable ROM (EEPROM), which
contains system parameters and boot code. You can modify the
parameters with the console SET commands. Patching console and
diagnostic code in the ROMs is done by reading the patches into a
special area of the EEPROM. The recommended procedure is described
in Section 4.18.
The last line of the self-test display shows two EEPROM version
numbers. The first number 3 indicates the format version of the
EEPROM. This version is changed only when the internal structure
of the EEPROM is modified.
The second number 4 is the revision of ROM patches that have been
applied to the EEPROM. The major number in this revision (before the
decimal point) corresponds to the major number of the ROM revision 1 .
The minor number indicates the actual patch revision. In this example,
the EEPROM has not been patched for console ROM V3.00.

•

A system support chip (RSSC) that includes support for external ROM/
EEPROM, 1 Kbyte of battery-backed-up RAM, console terminal UARTs,
bus reset logic, interval timer, programmable timers, time-of-year
(TOY) clock, bus timeout, and halt arbitration logic.

<REFERENCE>(XRP) Scalar Processor 4–9

4.4 Boot Processor
All <REFERENCE>(XRP) processors share system resources
equally. The processor controlling the console at any given
time is designated as the primary or boot processor. The
others are called secondary processors. The boot processor
is selected during the power-up sequence.
Figure 4–4: Selection of Boot Processor

CPU WITH
LOWEST
XMI NODE ID

N
ELIGIBLE

CPU WITH NEXT
LOWEST
XMI NODE ID

PASSED
BOTH POWER-UP
TESTS

BOOT PROCESSOR
msb-0051-90

4–10

VAX 6000 Models 300 and 400 Service Manual

Using boot code stored in its EEPROM, the boot processor reads the boot
block from a specified device. Booting may be triggered by a command
issued to the boot processor from the console, or by a system reset with the
bottom key switch in the Auto Start position.
The boot processor also communicates with the system console, using
the common console lines on the backplane. When you change system
parameters in the EEPROM using SET commands, the boot processor
automatically copies the new values to the EEPROMs on the secondary
processors. If you swap in a new <REFERENCE>(XRP) module, it should
be configured as a secondary processor. Then you can either use the
UPDATE command to copy the boot processor’s entire EEPROM to the
new secondary or use EVUCA and a series of set commands to customize
the EEPROM. Since UPDATE is slow, and can, in certain instances, render
a processor unusable, the preferred method of updating a new processor
placed in a system is to do it using SET commands. See Section 4.18 for
information on running EVUCA and Section 4.15.2 on setting parameters.
CAUTION: Using UPDATE can be dangerous because of revision
mismatches. See Appendix C for information on what happens in mismatch
cases.
Usually the processor with the lowest <REFERENCE>(XMI) node number
(which is also the lowest slot number) is selected as the boot processor.
However, if this processor does not pass all its power-up tests, the next
higher-numbered processor is selected. This is one way the boot processor
can change.
The user also has control over boot processor selection with the SET CPU
command. This command may declare a processor ineligible for selection.
SET CPU can also select a boot processor explicitly.
You can see the boot processor selection three ways:
•

In the self-test display, the boot processor is indicated by a B on the
second line labeled BPD.

•

In console mode, the command SHOW CPU displays the boot processor
as "Current primary." See Section 4.7.

•

The bottom red LED is off on the boot processor module. It is lit on
secondary processors.

<REFERENCE>(XRP) Scalar Processor 4–11

4.5 Power-Up Sequence
Figure 4–5 shows the power-up sequence for <REFERENCE>(XRP)
processors. All processors execute two phases of self-test,
and a boot processor is selected. The boot processor tests
the VAXBI adapters, if present, and prints the self-test display.

4–12

VAX 6000 Models 300 and 400 Service Manual

Figure 4–5: <REFERENCE>(XRP) Power-Up Sequence, Part 1 of 2
Power-up or system reset (cold)

CPU 1
Self-Test

CPU 2
Self-Test

...

CPU n
Self-Test

Determine
Boot Processor

...

Determine
Boot Processor

Boot Processor tests
all memory modules

Boot Processor prints
self-test results
Boot Processor signals
all CPUs to start CPU/MEM tests

CPU 1
CPU/MEM tests

CPU 2
CPU/MEM tests

...

CPU n
CPU/MEM tests

Determine
Boot Processor

...

Determine
Boot Processor

A
NOTE: The second determination of the boot processor occurs
even if the original boot processor passes all memory tests.
msb-0047-89

<REFERENCE>(XRP) Scalar Processor 4–13

The boot processor is determined as described in Section 4.4. On the
first BPD line, the letter B corresponds to the processor selected as
boot processor. Because the processors have not yet completed their
power-up tests, the designated processor may later be disqualified from
being boot processor. For this reason, the BPD line appears twice in
the self-test display.

The boot processor tests all memory modules, and then prints the
results of self-test, lines NODE, TYP, STF, and BPD on the self-test
display. The boot processor then signals all CPUs to start running the
extended test.

All CPUs execute an extended test using the memories. On the ETF
line of the self-test display, a plus sign (+) is shown for every module
that passes extended test.

If all CPUs pass the extended test, the original boot processor selection
is still valid. Lines STF and ETF would be identical for all the
processors.
The yellow LED and the top red LED are lit on all processor modules
that pass both power-up tests. On the secondary processors, the bottom
red LED is also lit. On the boot processor, this red LED is off (see
Figure 4–7).
If the original boot processor fails the extended test (indicated by a
minus sign (–) on line ETF), a new boot processor is selected. On the
second BPD line, the letter B corresponds to the processor finally
selected as boot processor.

4–14

VAX 6000 Models 300 and 400 Service Manual

Figure 4–6: <REFERENCE>(XRP) Power-Up Sequence, Part 2 of 2

Boot Processor prints
CPU/MEM test results

Boot Processor
executes DWMBB tests

Boot Processor prints
DWMBB test results

Boot Processor halts in console
mode or boots operating system

If Boot Processor is booting
operating system, starts all attached
CPUs after boot processor has booted

CPU 1
running

CPU 2
running

...

CPU n
running
msb-0048A-90

4–16

VAX 6000 Models 300 and 400 Service Manual

The boot processor prints the ETF line and the second BPD line of
the self-test display. If none of the processors is successfully selected
as the boot processor, no self-test results are displayed and the console
hangs. You can identify this hung state by examining the LEDs on the
processor modules (see Section 4.7). All yellow LEDs will be OFF. The
group of seven red LEDS indicate the failing test number in binarycoded decimal.
You can force a processor to become the boot processor so that it will
display self-test results by typing the following:
>>n

where n is the CPU to become the boot processor.
7

The boot processor tests the DWMBB if one is present. Test results are
indicated on the line labeled XBI on the self-test display. A plus sign
(+) at the right means that the adapter test passed; a minus sign (–)
means that the test failed.

<REFERENCE>(XRP) Scalar Processor 4–17

4.6 <REFERENCE>(XRP) Self-Test Results:
Console Display
You can check <REFERENCE>(XRP) self-test results in three
ways: the self-test display, the lights on the module, and the
contents of the XGPR register. Pertinent information in the
self-test display is shown in Example 4–2. See Chapter 6 for
information on vector processors.

Example 4–2: Self-Test Results
#123456789 0123456789 0123456789 01234567# 1
F

A
o
.
.
.

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
E
+
E

P
+
E
+
B

P
+
D
+
D

P
+
B
E

.
.

. A4
. 128

A3 A2 A1
128 128 128

.
.

ROM0 = V3.00
>>>

ROM1 = V3.00

EEPROM = 2.03/3.00

NODE #
TYP 2
STF 3
BPD 4
ETF 5
BPD 6

XBI E +
ILV
512Mb

SN = SG01234567 7

The first line of the self-test printout is the progress trace. This line
prints if a <REFERENCE>(XRP) module is in slot 1. The progress
trace has two purposes: to give a visual indication that the system
is functioning during self-test, and, if self-test fails, to display the
failing test number. The numbers correspond to the 37 tests in the
<REFERENCE>(XRP) self-test. When self-test passes, the line prints
as in Example 4–2. If a test fails, the failing test number is the last
one printed. For example, if test 14 fails, the line is printed as follows:
#123456789 01234

4–18

VAX 6000 Models 300 and 400 Service Manual

This line indicates the type (TYP) of module at each <REFERENCE>(XMI)
node. Processors are type P found at nodes 1, 2, 3, and 4 in this example.

This line shows self-test fail status (STF), which are the results of onboard self-test. Possible values for processors are:
+ (pass)
– (fail)
All processors passed self-test in this example.

The BPD line indicates boot processor designation. When the system
completes on-board self-test, the processor with the lowest XMI ID
number that passes self-test and is eligible is selected as boot processor
— in this example, the processor at node 1.
The results on the BPD line indicate:
•

B — The boot processor

•

E — Processors eligible to become the boot processor

•

D — Processors ineligible to become the boot processor

During extended test (ETF) all processors run additional tests, which
include reading and writing memory and using the cache. On line ETF,
results are reported for each processor in the same way as on line STF
— a plus sign indicates that extended test passed and a minus sign that
extended test failed. In this example, the processor at node 1 (originally
selected boot processor) failed the CPU/memory interaction tests.

The bottom line of the self-test display shows the ROM and EEPROM
version numbers and the system serial number.

A <REFERENCE>(XRP) performs additional tests on an attached FV64A
vector module (see Section 5.5).

<REFERENCE>(XRP) Scalar Processor 4–19

4.7 <REFERENCE>(XRP) Self-Test Results: Module
LEDs
You can check <REFERENCE>(XRP) self-test results in the
self-test display, in the lights on the module, or in the XGPR
register. If self-test passes, the large yellow LED is on.

Figure 4–7: <REFERENCE>(XRP) LEDs After Power-Up Self-Test

SELF-TEST PASSED

OFF

MOST
SIGNIFICANT
BIT

OFF

YELLOW

RED

BOOT CPU

4–20

SELF-TEST FAILED

SECONDARY CPU

VAX 6000 Models 300 and 400 Service Manual

FAILING
TEST NUMBER
(BINARY-CODED
DECIMAL)

msb-0176R-89

If self-test passes, the large yellow LED at the top of the LEDs is ON. (Here
self-test means both the on-board power-up tests, RBD 0, and the CPU/
memory interaction tests, RBD 1.) The top red LED (next to the yellow
one) is also ON, and the next five red LEDs are OFF. The bottom LED
is OFF if the processor is the boot processor, and ON if it is a secondary
processor.
If self-test fails, the yellow LED is OFF, and the red LEDs contain an error
code that corresponds to the number of the failing test. The test number is
represented in binary-coded decimal. In the seven red error LEDs, the most
significant bit is at the top, but the lights have a reverse interpretation —
a bit is ONE if the light is OFF.
For example, assume a processor fails self-test (yellow LED is OFF) and
shows the following pattern in its seven red LEDs:
TOP
(MSB) on
off
off

0
1
1

on
on
off
on

0
0
1
0

BOTTOM

The failing test number decodes to 011 0010 (binary-coded decimal 32). If
you then ran RBD 0 with the /TR and /HE qualifiers, the last test number
you would see displayed is T0032.
When any of the red error LEDs is lit, a failure has occurred during the
self-test sequence. But system power-up self-test actually comprises three
sets of tests: <REFERENCE>(XRP) power-up tests (RBD 0), CPU/memory
interaction tests (RBD 1), and VAXBI adapter (DWMBB) tests (RBD 2).
Interpretation of the processor board error lights depends on which set of
tests was running, as explained below and in Table 4–2.

<REFERENCE>(XRP) Scalar Processor 4–21

Processor error LEDs can also indicate failures of memories
or VAXBI adapters.

Table 4–2: <REFERENCE>(XRP) Error LEDs
Yellow
LED

Red LEDs
(Binarycoded
Diagnostic and
decimal) Test Number

Device Failing

OFF

1–37

Power-up self-test (RBD 0)
T0001–T0037
See Table 4–6.

<REFERENCE>(XRP)STF

OFF

50–62

CPU/memory test - Memory 1
(RBD 1) T0001–T0013
See Table 4–7.

KA64A or MS65A 1
(module with lowest XMI node number)

ETF

OFF

CPU/memory test - Memory 2
T0003
(equivalent to ST1/T=3)

MS65A 2

ETF

OFF

CPU/memory test - Memory 3
T0003
(equivalent to ST1/T=3)

MS65A 3

ETF

OFF

CPU/memory test - Memory 4
T0003
(equivalent to ST1/T=3)

MS65A 4

ETF

OFF

CPU/memory test - Memory 5
T0003
(equivalent to ST1/T=3)

MS65A 5

ETF

OFF

CPU/memory test - Memory 6
T0003
(equivalent to ST1/T=3)

MS65A 6

ETF

OFF

CPU/memory test - Memory 7
T0003
(equivalent to ST1/T=3)

MS65A 7

ETF

OFF

CPU/memory test - Memory 8
T0003
(equivalent to ST1/T=3)

MS65A 8

ETF

1–26

DWMBB test (RBD 2)
T0001–T0026
See Table 7–5.

DWMBB

XBI

Self-Test
Line

Applies to scalar-only configuration. When a vector module is attached to a KA64A, the
power-up tests are 1–49, and the CPU/memory tests are 50–66. Table 4–6 lists these tests.

4–22

VAX 6000 Models 300 and 400 Service Manual

If a processor’s yellow LED is OFF and the red LEDs show an error code
in the range 1–37, the power-up self-test failed and the processor board is
bad. On the self-test console display, the processor shows a minus sign (–)
on the STF line.
After the power-up tests, each processor runs the CPU/memory interaction
tests. If a test fails, the processor shows a minus sign (–) on the ETF line of
the self-test console display. The LED error codes are numbered from 50 to
62, which is the failing test number (1 through 13) plus 49, the number of
tests in RBD 0. For example, assume that a processor fails self-test (yellow
LED is OFF) and shows the following pattern in the error LEDs:
TOP
(MSB) off
on
off

1
0
1

on
off
off
on

0
1
1
0

BOTTOM

The failing test number decodes to 101 0110 (binary-coded decimal 56),
which corresponds to the seventh CPU/memory interaction test ((56–49 =
7).) If you then run RBD 1 with the /TR and /HE qualifiers, the last test
number you see displayed is T0007.
Each processor, after testing with the first memory, runs the CPU/memory
interaction tests on every other good memory module. (However, only CPU/
memory interaction test T0003 is run.) If a failure occurs, the memory
module is probably bad, although the processor’s yellow light is OFF and
the memory module’s yellow light is ON. If several processors fail on the
same memory, the memory is certainly bad. Try using SET MEMORY to
configure the bad module out of the interleave set. For error codes higher
than 66, consult Table 4–2 to determine the failing memory.
The last series is the DWMBB tests. If one fails, the red LEDs contain an
error code, although the processor’s yellow self-test LED is ON (because the
CPU itself has passed). The failing test numbers are listed in Table 7–5.
Note that only the boot processor performs the DWMBB tests.

<REFERENCE>(XRP) Scalar Processor 4–23

4.8 <REFERENCE>(XRP) Self-Test Results: XGPR
Register
When a <REFERENCE>(XRP) failure occurs during powerup and the failing test number cannot be found in the
module LEDs and RBDs cannot be run, you can examine
the XGPR register.
The failing test number is left
in the upper byte of the XGPR register of the failing
<REFERENCE>(XRP) processor or of the boot processor if
a memory or DWMBB module fails.

Example 4–3: XGPR Register After Power-Up Test Failure
>>> E/P/L 2190000C
2190000C

30xxxxxx

>>> E/P/L 2188000C

2188000C

49xxxxxx

>>> E/P/L 2188000C
2188000C

A0xxxxxx

! Examine the longword at physical address
! 2190000C, the address of the XGPR
! register of the <REFERENCE>(XRP) processor in slot 2.
! The result indicates that test 30 of the
! <REFERENCE>(XRP) self-test failed. See Table 4-4
! to interpret the data returned.
! Examine the XGPR register of the <REFERENCE>(XRP)
! processor in slot 1. Derivation of the
! address is explained below.
! CPU/memory interaction test 12 failed.
! Examine the XGPR register of the boot
! processor, which is in slot 1.
! Disregard bit <31> (which indicates a
! DWMBB test failure); the failing test
! number is 20.

When a failure occurs in power-up test, you can examine the XGPR
register to determine the failing test number. The XGPR register of
the <REFERENCE>(XRP) processor that failed self-test or CPU/memory
interaction test, or of the boot processor if DWMBB test failed, contains the
failing test number. If all power-up tests pass, the XGPR register contains
other data and should be ignored.
To examine the XGPR register, first see Table 4–3 to determine the base
address (BB) of the <REFERENCE>(XRP) processor’s node. Then calculate
the address of the XGPR register by adding 0C (hex) to the base address.

4–24

VAX 6000 Models 300 and 400 Service Manual

The failing test number is derived from the upper byte (bits <31:24>) of the
longword returned. For self-test, the upper byte contains the failing test
number. If CPU/memory interaction test fails, this byte contains the failing
test number plus 49. If DWMBB test fails, bit <31> is set (making the first
digit 8 through A), and bits <30:24> contain the failing test number. All
numbers are expressed in binary-coded decimal (BCD). See Table 4–4.

Table 4–3: XMI Base Addresses
Slot

Node

Base Address (BB)

2188 0000

2190 0000

2198 0000

21A0 0000

21A8 0000

21B0 0000

21B8 0000

21C0 0000

21C8 0000

21D0 0000

21D8 0000

21E0 0000

21E8 0000

21F0 0000

<REFERENCE>(XRP) Scalar Processor 4–25

Table 4–4: Interpreting XGPR Failing Test Numbers
Failing Diagnostic

XGPR <31>

XGPR <30:24>
(BCD)

Test
Numbers

Self-test 1

Clear

1–49

CPU/memory interaction test 2

Clear

50–66

1–17

Additional memory 3

Clear

67–73

DWMBB test 4

Set

1–26

1 See Table 4–6, KA64A Self-Test — RBD 0.
2 See Table 4–7, CPU/Memory Interaction Tests — RBD 1.
3 See Table 4–2, <REFERENCE>(XRP) Error LEDs.
4 See Table 7–5, <REFERENCE>(xbi_plus_title) RBD Tests.

4–26

VAX 6000 Models 300 and 400 Service Manual

4.9 ROM-Based Diagnostics
The <REFERENCE>(XRP) ROMs contain diagnostics, which
you run using the boot processor’s RBD monitor program
described in Chapter 2. RBD 0 and RBD 1 test the CPU,
memory, and their interaction. RBD 2 tests the DWMBB/A
and DWMBB/B adapters, and RBD 3 tests XMI memories.

Table 4–5: ROM-Based Diagnostics
Diagnostic

Test

<REFERENCE>(XRP) self-test

<REFERENCE>(XRP) CPU/memory interaction tests

<REFERENCE>(XBI_plus) tests

XMI memory tests

4–28

VAX 6000 Models 300 and 400 Service Manual

RBD 0 is the same as the <REFERENCE>(XRP) self-test. It is useful
for running several passes when a processor fails self-test intermittently.
Section 4.10.1 shows examples of running RBD 0 on both the boot processor
and a secondary processor, and lists the tests in RBD 0.
RBD 1 is the same as the CPU/memory interaction tests. It is useful for
running several passes when a processor fails CPU/memory interaction
tests intermittently. Section 4.10.2 shows an example and lists the tests.
RBD 2 is the set of tests that the boot processor runs for each DWMBB
VAXBI-to-XMI adapter when the system is powered on. (The DWMBB has
no on-board self-test of its own.) Section 7.4 shows an example and lists
the tests.
RBD 3 is a set of XMI memory tests that sizes and runs extended tests on
all of memory. Sections 6.11 and 6.12 list the tests and show examples.
For a detailed explanation of the diagnostic printout, see Chapter 2.

<REFERENCE>(XRP) Scalar Processor 4–29

4.10 <REFERENCE>(XRP) ROM-Based Diagnostics
4.10.1 Self-Test — RBD 0
RBD 0 is equivalent to the <REFERENCE>(XRP) self-tests.
The first 37 tests test scalar CPU modules; tests 38–49 test
vector modules.

Example 4–4: Self-Test — RBD 0
>>> T/R

! Command to enter RBD monitor program. Short
! for TEST/RBD.
! RBD monitor prompt, where 1 is the hexa! decimal node number of the boot processor.
! Runs the <REFERENCE>(XRP) self-test on boot processor
! Trace prints each test number; halt on error
! Test results written to the console terminal:

RBD1>
RBD1> ST0/TR/HE

;XRP/V_ST
; T0001
; T0011

T0002
T0012

3.00
T0003
T0013

T0004
T0014

T0005
T0015

T0006
T0016

T0007
T0017

T0008 T0009
T0018 1

T0010

F2
1
8082
13
HE
REX520
XX
T0018 1
10 AAAAAAAA A8AAAAAA 00000000 000004AC 2006451F 01

;
;
;

;
F
1
8082
1
;00000000 00000001 00000000 00000000 00000000 00000000 00000000
RBD1>

In Example 4–4:
1

Test 18 failed. The /HE switch causes execution to stop when the error
is encountered.

F indicates failure.

The diagnostic ran for one pass.

4–30

VAX 6000 Models 300 and 400 Service Manual

Example 4–5: Running <REFERENCE>(XRP) Self-Test (RBD 0) on a
Secondary Processor
>>> SET CPU 2 1
>>> T/R
RBD2> ST0/TR 2

! Note that only 37 tests ran. If a vector
! processor was present 49 tests would run

;XRP/V_ST

1.00

; T0001
; T0011
; T0021
; T0031

T0003
T0013
T0023
T0033

T0002
T0012
T0022
T0032

T0004
T0014
T0024
T0034

T0005
T0015
T0025
T0035

T0006
T0016
T0026
T0036

T0007
T0017
T0027
T0037

T0008
T0018
T0028

T0009
T0019
T0029

T0010
T0020
T0030

;
P
2
8082
1
;00000000 00000000 00000000 00000000 000000000 00000000 00000000

In Example 4–5:
1

This command causes the <REFERENCE>(XRP) module at node 2 to
become the primary processor.

The prompt indicates that the CPU at node 2 is the primary processor.
RBD 0 is run on this processor.

<REFERENCE>(XRP) Scalar Processor 4–31

Table 4–6: <REFERENCE>(XRP) Self-Test — RBD 0
Test

Function
KA64A Tests

T0001

<REFERENCE>(XRP) ROM Checksum Test

T0002

IPL Step-Down Test

T0003

RSSC Configuration Register Test

T0004

RSSC RAM Test

T0005

RSSC Output Port Test

T0006

RSSC Address Decode Register Access Test

T0007

RSSC Console UART External Loopback and Baud Rate Test

T0008

RSSC Console UART Internal Loopback and Interrupt Test

T0009

<REFERENCE>(XRP) EEPROM Test

T0010

RSSC Input Port Test

T0011

RSSC Bus Timeout Test

T0012

RSSC Programmable Timers Test

T0013

RCSR Register Test

T0014

RSSC TOY Clock Test

T0015

RSSC Interval Timer Test

T0016

Interrupts at IPL 14 to 17 Test

T0017

Primary Cache Tag Store Test

T0018

Primary Cache Data RAM March Test

T0019

Backup Tag Store Test

T0020

Flush Cache Test

T0021

Backup Tag Store Parity Error Test

T0022

C-Chip Primary Tag Store Test

T0023

C-Chip Refresh Register Test

T0024

Backup Cache Data Line Test

T0025

Backup Cache Data RAM March Test

T0026

Backup Cache Data Parity RAM March Test

4–32

VAX 6000 Models 300 and 400 Service Manual

Table 4–6 (Cont.): <REFERENCE>(XRP) Self-Test — RBD 0
Test

Function
KA64A Tests

T0027

Cache Mask Write Test

T0028

Data Parity Logic Test

T0029

Cache Disable Test

T0030

XGPR Register Test

T0031

CNAK Test

T0032

IVINTR Test

T0033

Multiple Interrupt Test

T0034

DC520 Critical Path Test

T0035

F-Chip Test

T0036

Disable F-Chip Test

T0037

F-Chip Critical Path Test

FV64A Tests
T0038

VECTL Registers Test

T0039

Verse Registers Test

T0040

Load/Store Registers Test

T0041

VIB Error Logic Test

T0042

Other VECTL Chip Logic Test

T0043

Verse and Favor Test

T0044

Load/Store Translation Buffer and CAM Test

T0045

Load/Store Cache Test

T0046

Load/Store Instruction Test

T0047

Load/Store Tag and Duplicate Tag Test

T0048

Load/Store Error Cases Test

T0049

Module Critical Path Test

<REFERENCE>(XRP) Scalar Processor 4–33

4.10.2 CPU/Memory Interaction Tests — RBD 1
RBD 1 is equivalent to the CPU/memory interaction tests.
The first 13 tests test scalar CPU modules; tests 14–17 test
vector modules.

Example 4–6: CPU/Memory Interaction Tests — RBD 1
>>> T/R

! Command to enter RBD monitor program

RBD3>

! RBD monitor prompt, where 3 is the hexa! decimal node number of the processor
! that is currently receiving your input.

RBD3> ST1/TR/HE

! Runs the CPU/memory interaction RBD with
! trace; halt on error. Test results
! written to the console terminal:

;CPUMEM
; T0001
; T0011

3.00
T0002
T0012

T0003
T0013

T0004

T0005

T0006

T0007

T0008

T0009

3
8082
12
;
P1
;000000000 00000000 00000000 00000000 00000000 00000000 00000000
RBD3>

In the example above:
1

P means that the diagnostic ran successfully.

One pass was completed.

4–34

VAX 6000 Models 300 and 400 Service Manual

T0010

Table 4–7: CPU/Memory Interaction Tests — RBD 1
Test

Function

KA64A/Memory Interaction Tests
T0001

Parity Error CNAK Read/Write Test

T0002

Miss When Invalid Test

T0003

Cache Read Fill Test

T0004

Interlock Instruction Cache Test

T0005

Octaword Write Buffer Test

T0006

Quadword-Boundary Byte Write Buffer Test

T0007

Two-Byte Write in Different Quadword Write Buffer Test

T0008

Write Buffer Switch and Purge Test

T0009

Statistical Write Buffer Test

T0010

Hit Write Buffer Test

T0011

Write Buffer Address Test

T0012

Invalidate Test

T0013

Hit on Disabled Tag Store Test

FV64A/Memory Interaction
T0014

Cache Test

T0015

Write Buffer Test

T0016

Duplicate Tag Test

T0017

Miscellaneous Error Test

<REFERENCE>(XRP) Scalar Processor 4–35

4.11 VAX/DS Diagnostics
The <REFERENCE>(XRP) software diagnostics that run
under the VAX Diagnostic Supervisor (VAX/DS) are listed
in Table 4–8. An example follows. See Section 2.4 for
instructions on running the supervisor. See Section 5.8 for
vector-specific tests.

Table 4–8: <REFERENCE>(XRP) VAX/DS Diagnostics
Program

Description

EVSBA

VAX Standalone Autosizer

EVSBB

VAX Diagnostic Online Autosizer

EVKAQ

VAX Basic Instructions Exerciser, Part 1

EVKAR

VAX Basic Instructions Exerciser, Part 2

EVKAS

VAX Floating Point Instruction Exerciser, Part 1

EVKAT

VAX Floating Point Instruction Exerciser, Part 2

EVKAU

VAX Privileged Architecture Instruction Test, Part 1

EVKAV

VAX Privileged Architecture Instruction Test, Part 2

ERKAX

Manual Tests

ERKMP

Multiprocessor Exerciser

EVUCA

VAX 6000 EEPROM Update Utility

Example 4–7: VAX/DS Commands for Running Standalone Processor
Diagnostics
DS> RUN EVSBA 1
DS> SEL KA0 2
DS> RUN ERKAX 3
DS> EXIT 4

4–36

VAX 6000 Models 300 and 400 Service Manual

The callouts in Example 4–7 are explained below:
1

Run the standalone autosizer; then you do not need to attach devices
to the supervisor explicitly. However, if you want to know how to use
the Attach command for a specific diagnostic, enter:
DS> HELP diagnostic_name ATTACH

The instruction and manual tests run on the boot processor. If the
boot processor is the CPU with the lowest <REFERENCE>(XMI) node
number (which is usually the case), issue the command to select KA0.
The Diagnostic Supervisor numbers the processors consecutively. For
example, if the <REFERENCE>(XRP) module with the second-lowest
<REFERENCE>(XMI) node number were boot processor, you would
select KA1.

This example runs the manual tests (ERKAX), which include powerfail,
machine check, restart, and EEPROM functions. The diagnostic prints
messages, and you must manually intervene using console switches.

Exit from VAX/DS.

<REFERENCE>(XRP) Scalar Processor 4–37

4.12 Machine Checks
Figure 4–8 and Table 4–9 show parameters for machine
checks. The machine check frame is pushed onto the
interrupt stack.
Figure 4–8: The Stack in Response to a Machine Check

Table 4–9: Machine Check Parameters
Parameter

Value
(hex) or
Bit
Description

Byte Count (SP)

Size of stack frame in bytes, not including PSL, PC,
or byte count longword

Machine check code (SP+4)

Floating-point operand or result transfer error

Floating-point reserved instruction

Floating-point operand parity error

Floating-point unknown status error

Floating-point returned result parity error

4–38

VAX 6000 Models 300 and 400 Service Manual

Table 4–9 (Cont.): Machine Check Parameters
Parameter

Value
(hex) or
Bit
Description
08

Translation buffer miss in ACV/TNV microflow

Translation buffer hit in ACV/TNV microflow

Undefined INT.ID value

Undefined MOVCx state

Undefined instruction trap code

Undefined control store address

Cache read tag/data parity error

DAL bus or data parity read error

DAL bus error on write or clear write buffer

Undefined bus error microtrap

Vector module error

Virtual address (SP+8)

<31:0>

Current contents of VAP register

Virtual instruction buffer
address (SP+C)

<31:0>

Current virtual instruction buffer address

Interrupt state (SP+10)

<22>

ICCS bit <6>

<15:1>

SISR bits <15:1>

<31:24>

Difference between current PC and opcode PC

<20:18>

Address of last memory reference

<17:16>

Data length of last memory reference

<15:8>

Opcode

<3:0>

Last GPR referenced by E-box

Internal state (SP+14)

Internal register (SP+18)

<31:0>

Program counter (SP+1C)

<31:0>

PC at the start of the current instruction

Processor status longword
(SP+20)

<31:0>

Current contents of PSL

<REFERENCE>(XRP) Scalar Processor 4–39

4.13 Console Commands
Table 4–10 summarizes the console commands. The VAX
6000 Series Owner’s Manual gives a full description of each
command, its qualifiers, and examples.

Table 4–10: Console Commands
Command

Function

BOOT

Initializes the system, causing a self-test, and begins the boot
program.

CLEAR EXCEPTION

Cleans up error state in XBER and RCSR registers.

CONTINUE

Begins processing at the address where processing was interrupted by a CTRL/P console command.

DEPOSIT

Stores data in a specified address.

EXAMINE

Displays the contents of a specified address.

FIND

Searches main memory for a page-aligned 256-Kbyte block of
good memory or for a restart parameter block.

HALT

Null command; no action is taken since the processor has already halted in order to enter console mode.

HELP

Prints explanation of console commands.

INITIALIZE

Performs a system reset, including self-test.

PATCH EEPROM

Patches console, diagnostic, and boot primitive code from a
TK70

REPEAT

Executes the command passed as its argument.

RESTORE EEPROM

Copies the TK tape’s EEPROM contents to the EEPROM of the processor executing the command.

SAVE EEPROM

Copies to the TK tape the contents of the EEPROM of the processor executing the command.

SET BOOT

Stores a boot command by a nickname.

SET CPU

Specifies eligibility of processors to become the boot processor or whether the vector processor is to be included in the system configuration.

4–40

VAX 6000 Models 300 and 400 Service Manual

Table 4–10 (Cont.): Console Commands
Command

Function

SET LANGUAGE

Changes the output of the console error messages between numeric code only (international mode) and code plus explanation (English mode).

SET MEMORY

Designates the method of interleaving the memory modules; supersedes the console program’s default interleaving.

SET TERMINAL

Sets console terminal characteristics.

SHOW ALL

Displays the current value of parameters set.

SHOW BOOT

Displays all boot commands and nicknames that have been
saved using SET BOOT.

SHOW CONFIGURATION

Displays the hardware device type and revision level for
each XMI and VAXBI node and indicates self-test status.

SHOW CPU

Identifies the primary processor and the status of other processors.

SHOW ETHERNET

Locates all Ethernet adapters on the system and displays their addresses.

SHOW LANGUAGE

Displays the mode currently set for console error messages, international or English.

SHOW MEMORY

Displays the memory lines from the system self-test, showing interleave and memory size.

SHOW TERMINAL

Displays the baud rate and terminal characteristics functioning on the console terminal.

START

Begins execution of an instruction at the address specified in the command string.

STOP

Halts the specified node.

TEST

Passes control to the self-test diagnostics; /RBD qualifier invokes ROM-based diagnostics.

UPDATE

Copies contents of the EEPROM on the processor executing the command to the EEPROM of another processor.

Logically connects the console terminal to another processor on the <REFERENCE>(XMI) bus or to a VAXBI node.

Introduces a comment.

<REFERENCE>(XRP) Scalar Processor 4–41

4.14 <REFERENCE>(XRP) Handling Procedures
The <REFERENCE>(XRP) module is static sensitive and
fragile. The CMOS2 technology used on this module is more
vulnerable to static than past technology. The 25 mil leads
used to attach chips to the module are very small, close
together, and easily bent. Be careful with the module.

Figure 4–9: Holding the <REFERENCE>(XRP) Module

msb-0228-90

4–42

VAX 6000 Models 300 and 400 Service Manual

The <REFERENCE>(XRP) module must be handled carefully. Figure 4–9
shows the proper way to hold the module. Be sure your hands do not touch
any components, leads, or XMI fingers. When inserting it in or removing
it from the XMI card cage, grasp the module only at the spot shown in
Figure 4–10, avoiding any contact with the 25 mil leads. Do not use any
component as a handle.
To avoid damaging the <REFERENCE>(XRP) module, follow these
handling procedures:
1. Always wear an antistatic wrist strap.
2. Before removing the module from its ESD box, place the box on a clean,
stable surface.
Be sure the box will not slide or fall. Never place the box on the floor.
And be sure no tools, papers, manuals, or anything else that might
damage the module are near it. Some components on this module can
be damaged by a 600-volt static charge; paper, for example, can carry
a charge of 1000 volts.
3. Hold the module only by the edges, as shown in Figure 4–9.
Do not hold the module so that your fingers touch any components or
leads. Be sure you do not bend the module as you are holding it.
4. Be sure nothing touches the module surface or any of its components.
If anything touches the module, components or leads can be damaged.
This includes the antistatic wrist strap, clothing, jewelry, cables,
components on other modules, and anything in the work area (such
as tools, manuals, or loose papers).
Remove your jacket and roll up your sleeves before handling the module.
Also remove any jewelry.

<REFERENCE>(XRP) Scalar Processor 4–43

Figure 4–10: Inserting the <REFERENCE>(XRP) Module in an XMI Card
Cage

msb-0219-90

4–44

VAX 6000 Models 300 and 400 Service Manual

You must take special precautions when inserting the <REFERENCE>(XRP)
module in or removing it from the XMI card cage.
1. Be sure, when inserting the module in or removing it from the XMI
card cage, that no part of the module comes in contact with another
module or a cable.
2. When swapping out a module, place it in an unused XMI slot, if one is
available, or set the module on an ESD mat while you install the new
module.
An unused XMI slot is the best place to leave a module that is being
swapped out until it can be placed in the ESD box. If there are no
extra slots, place the module you removed on an ESD mat on a stable,
uncluttered surface, with side 1 (the side with the heat sinks) up. Do
not put it on the top of the system cabinet. And never slide the module
across any surface. The leads on the components are fragile and can be
damaged by contact with fingers or any surface.
3. Hold the XMI card cage handle while removing or inserting the module.
If it is not held in place, the handle can spring down and damage the
module.
4. When inserting the module in the card cage, grasp it as shown in
Figure 4–10, and slide it slowly and gently into the slot.
5. Do not attach the repair tag to the module.
Place the repair tag in the plastic bag attached to the bottom of the
ESD box. Allowing the repair tag to come in contact with the module
can cause damage to a component.

<REFERENCE>(XRP) Scalar Processor 4–45

4.15 CPU Replacement in Single CPU Systems
There are two methods available to customize a processor
in a single-processor system. The first uses the RESTORE
command; the second sets the EEPROM by console
command.

4.15.1 Using the RESTORE Command
Use the RESTORE command to customize a replaced CPU in
a single-processor system. Use this method only if the ROM
revision of the spare is the same as the ROM revision of the
CPU being replaced. Before you begin set the terminal baud
rate to 1200.
Example 4–8: Replacing a Single Processor
#123456789 0123456789 0123456789 01234567#
F

A
o
.
.
.

.
.
.
.
.

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
B
+
B

.
.

A2
64

A1
64

.
.

ROM0 = V3.00

ROM1 = V3.00 8

EEPROM = 2.03/3.00

>>> RESTORE EEPROM 12
?6E EEPROM Revision = 2.03/3.00
?70 Tape image Revision = 2.03/3.01
Proceed with update of EEPROM? (Y or N)
!optional - may need latest console/diag patches again

4–46

NODE #
TYP
STF
BPD
ETF
BPD

XBI E +
ILV
128Mb

SN = 0000000000 9

?4F System serial number has not been initialized 9

>>> BOOT

VAX 6000 Models 300 and 400 Service Manual

6
7
7

1. Turn the upper key switch straight up to the Off position (0).
2. Remove the defective CPU module.
3. Insert the new processor module.
4. Turn the lower key switch to Halt.
5. Turn the upper key switch to Enable.
6. Check the self-test display for the processor, indicated by a P on the
TYP line (usually in slot 1). See 6 .
7. If the processor shows a plus sign (+) on both the STF and ETF lines,
it passed self-test. See 7 .
8. Compare the ROM revision 8 of the new processor with the ROM
revision of the one you just replaced. If they are the same, continue
with this procedure; otherwise use the second method described in
Section 4.15.2.
9. You will see the following message: 9
?4F System serial number has not been initialized.

10. Turn the lower key switch to Update.
11. Mount the TK cartridge containing the most recent saved image of the
old processor’s EEPROM.1
12. Issue the console command RESTORE EEPROM 12 to copy all areas
of the EEPROM except the module-specific area to the boot processor’s
EEPROM.
13. If any patches have been issued since the last save, use EVUCA to
patch the EEPROM. See Section 4.18 for details.
14. Turn the lower key switch to the Auto Start position.
15. Boot the operating system 15 . Booting will initialize the system and
the EEPROM will be read. If the system console baud rate was not
normally set at 1200, you will have to change the terminal baud rate
back to its original value.

<REFERENCE>(XRP) Scalar Processor 4–47

4.15.2 Using SET Commands
When replacing the only processor module in a system that
does not have a TK, you must enter console commands that
customize the EEPROM. The Site Management Guide should
contain this information. Before you begin set the terminal
baud rate to 1200.

Example 4–9: Replacing a Single Processor
#123456789 0123456789 0123456789 01234567#
F

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
B
+
B

TYP
STF
BPD
ETF
BPD

.
.

A2
64

A1
64

.
.

ILV
128Mb

ROM0 = V3.00

ROM1 = V3.00

EEPROM = 2.03/3.00

(or

ESC

CTRL/3 )

DEL

SET SYSTEM SERIAL

RET

! Follow the prompts to set the Serial Number.
>>> SET BOOT DEFAULT /XMI:E DU0 11
>>> SET LANGUAGE INTERNATIONAL 12
OR
>>> SET LANGUAGE ENGLISH
>>> SET TERMINAL /[NO]SCOPE /SPEED:9600 /[NO]BREAK

!optional - may need latest console/diag patches 14
>>> BOOT

4–48

NODE #

SN = 0000000000

?4F System serial number has not been initialized
>>>

VAX 6000 Models 300 and 400 Service Manual

7
8
8

1. Turn the upper key switch straight up to the Off position (0).
2. Remove the defective CPU module.
3. Insert the new processor module.
4. The EEPROM on the new module has a default baud rate of 1200.
Make sure your terminal is set to 1200.
5. Turn the lower key switch to Halt.
6. Turn the upper key switch to Enable.
7. Check the self-test display for the processor, indicated by a P on the
TYP line. See 7 in Example 4–9.
8. If the processor shows a plus sign (+) on both the STF and ETF lines,
it passed self-test (see 8 ).
9. Turn the lower key switch to Update.
10. To correct the error message, enter the SET SYSTEM SERIAL
command (see 10 ) and follow the prompts. The serial number should be
in the Site Management Guide. If you do not find it there, look on an
old self-test display or on the tape located near the bottom of the left
rear cabinet upright.
11. To set up the boot alternatives, enter the SET BOOT command
supplying the parameters recorded in the Site Management Guide. You
might want to check these with the system manager. 11
12. Use the SET LANGUAGE command to set up the language desired. 12
13. Use the SET TERMINAL command to set the EEPROM terminal
characteristics. 13 Results of the SET TERMINAL command will take
effect when the system is reset. Make sure the terminal itself is set to
the same characteristics.
14. Use whatever console commands are necessary to completely customize
the EEPROM to the customer’s satisfaction.
If any patches or boot primitives need to be selected, follow the
procedure in Section 4.18. 14
15. Turn the lower key switch to the Auto Start position and Boot the
operating system. 15

<REFERENCE>(XRP) Scalar Processor 4–49

4.16 CPU Replacement in Multiple CPU Systems
In a multiprocessing system replacing a processor requires
customizing the new processor into the system. If the
processor being replaced is the boot processor, then a few
extra steps are required. Since different CPUs can have
different ROM and EEPROM revisions in the same system,
updating the EEPROM of any processor should be done
using SET commands and EVUCA.

Example 4–10: Retrieving EEPROM Information
#123456789 0123456789 0123456789 01234567#
F

NODE #

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
E
+
E

P
+
B
+
B

TYP
STF
BPD
ETF
BPD

.
.

. A4
. 128

A3 A2 A1
128 128 128

.
.

ILV
512Mb

ROM0 = V3.00 ROM1 = V3.00 EEPROM = 2.03/3.00 SN = 0000000000
?50 System serial number not initialized on primary processor.
10
or
?2D For Secondary Processor 3
?5A System serial number mismatch. Secondary processor has xxxxxxx
>>> SET CPU 3 11
>>>

ESC

(or

CTRL/3 )

DEL

SHOW SYSTEM SERIAL 12

>>> SHOW ALL 13
[System configuration and customization information prints]

4–50

VAX 6000 Models 300 and 400 Service Manual

7
8
8

1. Turn the upper key switch straight up to the Off position (0).
2. Remove the defective CPU module.
3. Insert the new processor module.
4. If the processor you are replacing is the first processor on the right
(usually in slot one), the console will make it the boot processor. If this
is the case, make sure that the console terminal baud rate is 1200, the
default baud rate of the spare.
5. Turn the lower key switch to Halt.
6. Turn the upper key switch to Enable.
7. Check the self-test display for the processor, indicated by a P on the
TYP line. See 7 in Example 4–10.
8. If the processor shows a plus sign (+) on both the STF and ETF lines,
it passed self-test. 8
9. Turn the lower key switch to Update.
10. You will see either the ?50 message or the ?2D and ?5A messages. 10 If
you see mismatch messages, you may have to patch the EEPROM using
EVUCA. See Section 4.18. If you see the ?50 message, the boot processor
has been replaced and you must execute the next step; otherwise, go to
Step 12.
11. Issue the SET CPU n command so that the console is connected to a
processor that has been in the system for some time. 11
12. Get the system serial number by entering the SHOW SYSTEM SERIAL
command. 12
13. Issue the SHOW ALL command to get the customized boot parameters,
interleave characteristics, terminal setup, and any other parameters.
13

<REFERENCE>(XRP) Scalar Processor 4–51

If you collected the necessary information, you are now
ready to customize the EEPROM.

Example 4–11: Customizing an EEPROM

>>> SET CPU 3
>>>

ESC

(or

14
CTRL/3 )

DEL

SET SYSTEM SERIAL 15

! Follow the prompts to set the serial number.
>>> SET BOOT DEFAULT /XMI:E DU0 16
>>> SET LANGUAGE INTERNATIONAL or ENGLISH 17
>>> SET TERMINAL /[NO]SCOPE /SPEED:9600 /[NO]BREAK

>>> SET CPU/NOPRIMARY 3 19
!optional - may need latest console/diag patches again
>>> BOOT 21

4–52

VAX 6000 Models 300 and 400 Service Manual

14. Issue the SET CPU n command to connect the console to the primary
or secondary processor you just replaced. 14
15. Issue the SET SYSTEM SERIAL command 15 and follow the command
prompts to correct the error message 10 .
16. Use the SET BOOT command supplying the parameters displayed by
the SHOW ALL command to set up the boot alternatives. 16
17. Use the SET LANGUAGE command to set the language desired. 17
18. Use the SET TERMINAL command to set the EEPROM terminal
characteristics. These characteristics take effect when the system is
initialized and the EEPROM is read again. Make sure the terminal is
set to the same characteristics. 18
19. If the CPU you are working on has been designated as ineligible to be
the boot processor, use the SET CPU/NOPRIMARY command to set its
EEPROM correctly. 19
20. If any patches or boot primitives need to be selected, follow the
procedure in Section 4.18. 20
21. Turn the lower key switch to the Auto Start position and boot the
operating system. 21

<REFERENCE>(XRP) Scalar Processor 4–53

4.17 How to Add a New Processor
Add a new processor in a slot to the left of the boot processor
so it will be a secondary processor at power-up. This
procedure is similar to that described in Section 4.16.

Example 4–12: Adding a Processor
#123456789 0123456789 0123456789 01234567#
F

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

P
+
E
+
E

P
+
B
+
B

TYP
STF
BPD
ETF
BPD

.
.

. A4
. 128

A3 A2 A1
128 128 128

.
.

ILV
512Mb

ROM0 = V3.00

ROM1 = V3.00

EEPROM = 2.03/3.00

?2D For Secondary Processor 3 8
?5A System serial number mismatch.

NODE #

SN = SGO1234567

Secondary processor has xxxxxxx

>>> SHOW ALL 9
[System configuration and customization information prints]
>>> SET CPU 3
>>>

ESC

(or

10
CTRL/3 )

! the node number of the CPU you added
DEL

SET SYSTEM SERIAL 11

>>> SET BOOT DEFAULT /XMI:E/ DU0 12
>>> SET LANGUAGE INTERNATIONAL or ENGLISH 13
>>> SET TERMINAL /[NO]SCOPE /SPEED:9600 /[NO]BREAK

>>> SET CPU/NOPRIMARY 15
!optional - may need latest console/diag patches again
>>> BOOT 17

4–54

VAX 6000 Models 300 and 400 Service Manual

5
6
6

1. Turn the upper key switch straight up to the Off position (0).
2. Insert the new processor module to the left of the boot processor.
3. Turn the lower key switch to Halt.
4. Turn the upper key switch to Enable.
5. Check the self-test display for the processor, indicated by a P on the
TYP line. See 5 in Example 4–12.
6. If the processor shows a plus sign (+) on both the STF and ETF lines,
it passed self-test. 6
7. Turn the lower key switch to Update.
8. You will see the ?2D and ?5A messages. 8 In addition, you may see
messages indicating that you need to patch the EEPROM. Should you
need to do so, see Section 4.18.
9. Type SHOW ALL to get the customized boot parameters, interleave
characteristics, terminal setup, and any other parameters. 9
10. Connect the console to the CPU you just added with the SET CPU n
command. 10
11. Issue the SET SYSTEM SERIAL command 11 and follow the command
prompts to correct the error message.
12. Issue the SET BOOT command supplying the parameters displayed by
the SHOW ALL command to set up the boot alternatives. 12
13. Issue the SET LANGUAGE command to set the language desired. 13
14. Issue the SET TERMINAL command to set the EEPROM terminal
characteristics. 14
15. Issue the SET CPU/NOPRIMARY command if the customer does not
want this particular CPU to become the primary for some reason. 15
16. If any patches or boot primitives need to be selected, follow the
procedure in Section 4.18. 16
17. Turn the lower key switch to the Auto Start position and boot the
operating system. 18

<REFERENCE>(XRP) Scalar Processor 4–55

4.18 Patching the EEPROM with EVUCA
To update the console and diagnostic ROMs on all VAX 6000
systems, use EVUCA under the Diagnostic Supervisor in
standalone mode.

Example 4–13: Patching the EEPROM with EVUCA — Part 1
>>> BOOT /XMI:A /R5:110 EX0 3
[Self-test display prints]
Filename: ISL_LVAX
Follow Prompts
[Diagnostic Supervisor Banner]
DS> LOAD EVUCA 4
DS> ATTACH KA64A HUB KA0 1 5
DS> ATTACH KA64A HUB KA1 2
DS> ATTACH KA64A HUB KA2 5
DS> ATTACH KA64A HUB KA3 6
DS> SELECT ALL 6
DS> SET TRACE
DS> START
.. Program: EVUCA - VAX 6000 EEPROM Update Utility, revision 0.5, 5 tests,
Testing: _KA0 _KA1 _KA2 _KA3
Booting secondary CPU 02.
Booting secondary CPU 05.
Booting secondary CPU 06.
Test 2: Load data from media
7
Data file? <ERUCA.BIN>
Searching for data file...
Data file loaded.
Looking for patch for CPU 01 - ROM 03.00 EEPROM 03.00
No patch image was found for CPU 01 - ROM 03.00 EEPROM 03.00 8
Looking for patch for CPU 02 - ROM 03.00 EEPROM 03.00
No patch image was found for CPU 02 - ROM 03.00 EEPROM 03.00
Looking for patch for CPU 05 - ROM 02.00 EEPROM 02.00
Patch image is revision 02.02
Do you really want to apply this patch [(No), Yes] YES 9
Looking for patch for CPU 06 - ROM 02.00 EEPROM 02.02
Patch image is revision 02.02
Do you really want to apply this patch [(No), Yes]
Test 3: Determine Typecodes Updated 10

4–56

VAX 6000 Models 300 and 400 Service Manual

1. Turn the lower key switch to Update.
2. Load the latest diagnostic CD in the CD drive. The CD is labeled 6000_
DIAG_x where x is a letter revision.
3. Boot the VAX Diagnostic Supervisor from a CD server using a command
similar to that shown in Example 4–13 (see 3 ).
Alternatively, you could boot the supervisor from some other disk,
perform the appropriate ATTACH commands, and then use the VAX/DS
command SET LOAD to load EVUCA from the CD server. If you have
already copied the latest diagnostics to a local disk, run EVUCA from
there.
4. At the DS> prompt, type LOAD EVUCA (see 4 in Example 4–13).
5. Issue the ATTACH command similar to that shown by 5 to enable the
VAX/DS access to the CPUs on the system.
6. The CPUs are selected, TRACE is set, and EVUCA is started (see 6 ).
7. Test 2 of EVUCA selects the correct patch file for the system being
patched. 7 . A carriage return is the appropriate response. (Test 1 is
for Manufacturing Automated Verification System use.)
8. After loading the file, EVUCA identifies the ROM and EEPROM
revisions of each CPU in the system and reports whether that revision
has a patch. CPUs at nodes 1 and 2 8 have no patches.
9. When a patch is found, EVUCA asks the operator whether the patch
should be applied. For CPU 05 the patch image found is 2.02 and
the EEPROM revision is 2.00. A "yes" response is given (see 9 ). For
CPU 06 the patch revision is 2.02 but the EEPROM revision is 2.02.
Therefore, the choice is made not to patch this EEPROM.
10. Test 3 determines what sections of the EEPROM need updating.

<REFERENCE>(XRP) Scalar Processor 4–57

Example 4–14: Patching the EEPROM with EVUCA — Part 2
13
Test 4: Update EEPROM data
Getting selectable boot primitives for CPU 05, ROM 02.00

[I/O device types in system identified]
[Boot primitives available identified]
Available boot primitive space is 27F4
Please enter what boot primitive to delete by number. [1-3(D)] 2
Boot primitives fit into allotted EEPROM area.
Secondary cpus are being updated, please wait a maximum of 20 seconds. 14
Updating CPU 05
Test 5: Show Boot primitives
ROM boot primitives for CPU 01, revision 3.00 are:
1
This boot primitive supports the following:
- boot primitive designation DI
- boot primitive designation MI
- boot primitive designation CI
15
Device CIBCA, device type 0108
Device CIXCD, device type 0C05
.
.
.
[Messages about retrieving secondary CPU boot primitives]
CPU 02 has the same console revision as node 01.
Boot primitives are the same for these cpus.

ROM boot primitives for CPU 05, are:
1
This boot primitive supports the following:
- boot primitive designation CI
2
This boot primitive supports the following:
- boot primitive designation DU
.
.
.
EEPROM boot primitives for CPU 05 are:
1

This boot primitive supports the following:
- boot primitive designation ET
.
.
.

CPU 06 has the same console revision as node 05.
Boot primitives are the same for these cpus.
The primary CPU was not updated.
Secondary CPU 05, was successfully updated.

Example 4–14 Cont’d on next page

4–58

VAX 6000 Models 300 and 400 Service Manual

Example 4–14 (Cont.): Patching the EEPROM with EVUCA — Part 2
Current ROM and EEPROM revisions for each CPU are:
[ROM revisions and EEPROM revisions summarized for each CPU] 18
.. End of run, 0 errors detected, pass count is 1,
time is 24-SEP-1990 17:06:57.88
DS>

13. Test 4 creates a new updated EEPROM image in memory (see 13 ).
Several boot primitives are available. Those that are permanent reside
in ROM; those that are selectable or are patched reside in the EEPROM.
If all boot primitives fit, EVUCA will not go through a selection
process. However, if all primitives do not fit, the user is shown all
the boot primitives available and prompted to choose which primitive
is not wanted. If enough space is available, EVUCA continues. If
enough space is not available, the user must choose another unwanted
primitive. This process continues until space is available for the
remaining primitives.
14. Once the primitives fit, the EEPROMs are updated and the message
noted by 14 is printed.
15. Later ROM revisions identify both what boot primitives are availiable
and what devices they support (see 15 ).
16. CPU 2 and CPU 1 have same revision and have the same boot primitives
16 .
17. CPU 5 has been patched, and test 5 shows the primitives in ROM
followed by those in EEPROM 17 . Since the ROM is an older revision,
the devices the primitives support are not printed.
18. CPU 5 and 6 are now the same 18 .

<REFERENCE>(XRP) Scalar Processor 4–59

4.19 <REFERENCE>(XRP) Registers
The <REFERENCE>(XRP) registers consist of the processor status longword, internal processor registers, <REFERENCE>(XRP) registers in <REFERENCE>(XMI) private space,
<REFERENCE>(XMI) required registers, and 16 general purpose registers.

Table 4–11: <REFERENCE>(XRP) Internal Processor Registers
Register

Mnemonic

Address

Type

Class

Kernel Stack Pointer

KSP

IPR0

R/W

Executive Stack Pointer

ESP

IPR1

R/W

Supervisor Stack Pointer

SSP

IPR2

R/W

User Stack Pointer

USP

IPR3

R/W

Interrupt Stack Pointer

ISP

IPR4

R/W

Reserved

IPR5–IPR7

P0 Base

P0BR

IPR8

R/W

P0 Length

P0LR

IPR9

R/W

P1 Base

P1BR

IPR10

R/W

P1 Length

P1LR

IPR11

R/W

Key to Types:
R–Read
W–Write
R/W–Read/write
Key to Classes:
1–Implemented by the <REFERENCE>(XRP) (as specified in the VAX Architecture Reference Manual).
2–Implemented uniquely by the <REFERENCE>(XRP).
3–Not implemented. Read as zero; NOP on write.
4–Access not allowed; accesses result in a reserved operand fault.
5–Accessible, but not fully implemented; accesses yield UNPREDICTABLE results.
6–Implemented by the FV64A vector module.
I–The register is initialized on <REFERENCE>(XRP) reset (power-up, system reset, and node reset).

4–60

VAX 6000 Models 300 and 400 Service Manual

Table 4–11 (Cont.): <REFERENCE>(XRP) Internal Processor Registers
Register

Mnemonic

Address

Type

Class

System Base

SBR

IPR12

R/W

System Length

SLR

IPR13

R/W

Reserved

IPR14–IPR15

Process Control Block Base

PCBB

IPR16

R/W

System Control Block Base

SCBB

IPR17

R/W

Interrupt Priority Level

IPL

IPR18

R/W

AST Level

ASTLVL

IPR19

R/W

Software Interrupt Request

SIRR

IPR20

Software Interrupt Summary

SISR

IPR21

R/W

Reserved
Interval Counter Control and
Status

IPR22–IPR23
ICCS

Reserved

IPR24

3
R/W

IPR25–IPR26

2I
3

Time-of-Year Clock

TODR

IPR27

R/W

Console Storage Receiver Status

CSRS

IPR28

R/W

Console Storage Receiver Data

CSRD

IPR29

Console Storage Transmitter Status

CSTS

IPR30

R/W

Console Storage Transmitter Data

CSTD

IPR31

Console Receiver Control/Status

RXCS

IPR32

R/W

Console Receiver Data Buffer

RXDB

IPR33

Console Transmitter Control/Status

TXCS

IPR34

R/W

Console Transmitter Data Buffer

TXDB

IPR35

Reserved
Machine Check Error Summary

IPR36–IPR37
MCESR

Reserved
Accelerator Control and Status
Reserved

IPR38

3
W

IPR39
ACCS

IPR40
IPR41

2
3

R/W

2I
3

<REFERENCE>(XRP) Scalar Processor 4–61

Table 4–11 (Cont.): <REFERENCE>(XRP) Internal Processor Registers
Register

Mnemonic

Address

Type

Class

Console Saved PC

SAVPC

IPR42

Console Saved PSL

SAVPSL

IPR43

Reserved

IPR44–IPR46

Translation Buffer Tag

TBTAG

Reserved

IPR47

3
W

IPR48–IPR54

2
3

I/O Reset

IORESET

IPR55

Memory Management Enable

MAPEN

IPR56

R/W

Translation Buffer Invalidate
All

TBIA

IPR57

Translation Buffer Invalidate
Single

TBIS

IPR58

Translation Buffer Data

TBDATA

IPR59

Reserved

IPR60–IPR61

System Identification

SID

IPR62

Translation Buffer Check

TBCHK

IPR63

Reserved

IPR64–IPR111

Backup Cache Reserved

BC112

IPR112

R/W

Backup Cache Tag Store

BCBTS

IPR113

R/W

Backup Cache P1 Tag Store

BCP1TS

IPR114

R/W

Backup Cache P2 Tag Store

BCP2TS

IPR115

R/W

Backup Cache Refresh

BCRFR

IPR116

R/W

Backup Cache Index

BCIDX

IPR117

R/W

Backup Cache Status

BCSTS

IPR118

R/W

Backup Cache Control

BCCTL

IPR119

R/W

Backup Cache Error

BCERR

IPR120

Backup Cache Flush Backup Tag Store

BCFBTS

IPR121

Backup Cache Flush Primary Tag
Store

BCFPTS

IPR122

4–62

VAX 6000 Models 300 and 400 Service Manual

Table 4–11 (Cont.): <REFERENCE>(XRP) Internal Processor Registers
Register

Mnemonic

Reserved

Address

Type

IPR123

Class
2

Vector Interface Error Status

VINTSR

IPR123

R/W

Primary Cache Tag Store

PCTAG

IPR124

R/W

Primary Cache Index

PCIDX

IPR125

R/W

Primary Cache Error Address

PCERR

IPR126

R/W

Primary Cache Status

PCSTS

IPR127

R/W

Reserved

IPR128–IPR143

Vector Processor Status

VPSR

IPR144

R/W

Vector Arithmetic Exception

VAER

IPR145

Vector Memory Activity Check

VMAC

IPR146

Vector Translation Buffer
Invalidate All

VTBIA

IPR147

Reserved

IPR148–IPR156

Vector Indirect Register Address

VIADR

IPR157

R/W

Vector Indirect Data Low

VIDLO

IPR158

R/W

Vector Indirect Data High

VIDHI

IPR159

R/W

<REFERENCE>(XRP) Scalar Processor 4–63

Table 4–12: <REFERENCE>(XMI) Registers for the <REFERENCE>(XRP)
Register

Mnemonic

Address

XMI Device

XDEV

BB + 00

XMI Bus Error

XBER

BB + 04

XMI Failing Address

XFADR

BB + 08

XMI GPR

XGPR

BB + 0C

RCSR

BB + 10

<REFERENCE>(XRP)
and Status

Control

Note: "BB" = base address of an XMI node, which is the address of the
first location in nodespace.

4–64

VAX 6000 Models 300 and 400 Service Manual

Table 4–13: <REFERENCE>(XRP) Registers in <REFERENCE>(XMI)
Private Space
Register

Mnemonic

Address

Control Register Write Enable

CREGWE

2000 0000

Console ROM (halt protected)

2004 0000 to 2007 FFFF

Console EEPROM (halt protected)

2008 0000 to 2008 7FFF

Console ROM (not halt protected)

200C 0000 to 200F FFFF

Console EEPROM (not halt
protected)

2010 0000 to 2010 7FFF

RSSC Base Address

SSCBAR

2014 0000

RSSC Configuration

SSCCNR

2014 0010

RSSC Bus Timeout Control

SSCBTR

2014 0020

RSSC Output Port

OPORT

2014 0030

RSSC Input Port

IPORT

2014 0040

Control Register Base Address

CRBADR

2014 0130

Control Register Address Decode Mask

CRADMR

2014 0134

EEPROM Base Address

EEBADR

2014 0140

EEPROM Address Decode Mask

EEADMR

2014 0144

Timer 0 Control

TCR0

2014 0160

Timer 0 Interval

TIR0

2014 0164

Timer 0 Next Interval

TNIR0

2014 0168

Timer 0 Interrupt Vector

TIVR0

2014 016C

Timer 1 Control

TCR1

2014 0170

Timer 1 Interval

TIR1

2014 0174

Timer 1 Next Interval

TNIR1

2014 0178

Timer 1 Interrupt Vector

TIVR1

2014 017C

RSSC Interval Counter

SSCICR

2014 01F8

RSSC Internal RAM

2014 0400 to 2014 07FF

IP IVINTR Generation

IPINTR

2101 0000 to 2101 FFFF

WE IVINTR Generation

WEINTR

2102 0000 to 2102 FFFF

<REFERENCE>(XRP) Scalar Processor 4–65

Chapter 5

<REFERENCE>(XRV) Vector Processor
Of the two CPUs discussed in this book only the <REFERENCE>(rigel)
system supports the vector processor.
This chapter contains the following sections:
•

<REFERENCE>(xrv) Physical Description and Specifications

•

KA64A/FV64A Coprocessors

•

<REFERENCE>(xrv) Configuration Rules

•

Functional Description

•

Self-Test Results: Console Display and Self-Test LED

•

Self-Test Results: Scalar XGPR Register

•

Vector Processor Tests — RBD 0 and RBD 1

•

VAX/DS Diagnostics

•

Machine Checks

•

Vector Console Commands

•

FV64A Handling Procedures

•

How to Replace a Vector Module

•

Vector Processor Registers

<REFERENCE>(XRV) Vector Processor 5–1

5.1 <REFERENCE>(xrv) Physical Description and
Specifications
The <REFERENCE>(XRV) is a vector processor used with
the <REFERENCE>(XRP) scalar processor. The module
designation is T2017.
The two processor modules are
connected with a VIB cable. Figure 5–1 shows side 1 of the
module, and Figure 5–2 shows side 2.

Figure 5–1: <REFERENCE>(XRV) Module (Side 1)
CACHE
TAG
STORE

CACHE CONTROL AND
CACHE ADDRESS BUFFERS

DUPLICATE
TAG
STORE

LOAD/STORE
CHIP
XMI
CORNER

OSCILLATOR

SELF-TEST
LED

ZIF
CONNECTOR
SEGMENTS

VIB
CONNECTOR

CD BUS
CACHE
INTERFACE

FAVOR 3

VERSE 2
CLOCK
CHIP

VERSE 1

VERSE 0
VECTL
CHIP

+3.3V REGULATOR
msb-0319-89

5–2

VAX 6000 Models 300 and 400 Service Manual

Because the vector module has components on side 2,
only memory modules can be installed next to side 2 (see
Figure 5–2).

Figure 5–2: <REFERENCE>(XRV) Module (Side 2)

XMI
CORNER

DUPLICATE
TAG
STORE

CACHE
TAG
STORE

CACHE CONTROL AND
CACHE ADDRESS BUFFERS

ZIF
CONNECTOR
SEGMENTS
VIB
CONNECTOR

MODULE
REVISION
EEPROM

CD BUS
CACHE
INTERFACE

FAVOR 0

FAVOR 1

FAVOR 2

VERSE 3

msb-0320-89

<REFERENCE>(XRV) Vector Processor 5–3

5.2 KA64A/FV64A Coprocessors
The <REFERENCE>(rigel) uses a high-speed system bus, called
the <REFERENCE>(XMI) bus, to interconnect its processors
and its memory modules. In Figure 5–3 all I/O devices connect to the VAXBI bus. The <REFERENCE>(rigel) supports
multiprocessing with up to six scalar processors or one or
two scalar/vector pairs.

Figure 5–3: VAX 6000 Model 400 Vector Processing System

MEMORY

MEMORY
VIB

MEMORY
VECTOR
CPU

VIB
SCALAR
CPU

VECTOR
CPU

SCALAR
CPU

XMI

DWMBB
I/O
INTERFACE

msb-0526A-90

NOTE: Installation of an <REFERENCE>(xrv) vector processor requires
that the attached <REFERENCE>(XRP) module (T2015) be at a
minimum revision of K. In addition, the ROMs on any additional
<REFERENCE>(XRP) modules must be at a minimum revision of V2.00
(ROM 0 and ROM 1).

5–4

VAX 6000 Models 300 and 400 Service Manual

Table 5–1: <REFERENCE>(XRV) Specifications
Parameter

Description

Module Number:

T2017

Dimensions:

23.3 cm (9.2") H x 2.4 cm (0.94") W x 28.0 cm (11.0") D

Temperature:
Storage Range

-40o C to 66o C (-40o F to 151o F)

Operating Range

5o C to 50o C (41o F to 122o F)

Relative Humidity:
Storage

10% to 95% noncondensing

Operating

10% to 95% noncondensing

Altitude:
Storage

Up to 4.8 km (16,000 ft)

Operating

Up to 2.4 km (8000 ft)

Current:

14.2A at +5V

Power:

70W

Cables:

VIB cable, 17-02240-03

Diagnostics:

ROM-based diagnostics 0 and 1.
VAX/DS diagnostics, see Section 5.8.

The FV64A vector processor is an integrated vector processor; that is, the
vector processor module performs as a coprocessor that is tightly coupled
with a host scalar processor. The two processors are physically connected
by an intermodule cable, the VIB. The scalar processor is specifically
designed to support its vector coprocessor, and the vector instruction set is
implemented as part of the host native instruction set. Both the scalar and
vector processors are on the XMI bus, and they share a common memory.
A VAX 6000 Model 400 system can have one or two scalar/vector pairs. If
the system has only one pair, it can also have additional scalar processors.
See Table 6–2 for memory configuration rules related to vector processing.

<REFERENCE>(XRV) Vector Processor 5–5

5.3 <REFERENCE>(xrv) Configuration Rules
A vector processor must be installed to the left of its
companion scalar processor. An intermodule cable connects
the two modules. A memory module or an empty slot must be
to the left of the vector processor. Any other configuration
may damage the vector module.

Figure 5–4: Scalar/Vector Configurations

M V P M V P

M V P P P P

TWO SCALAR/VECTOR PAIRS

ONE SCALAR/VECTOR PAIR

SLOT 1

KEY:
M = MEMORY
V = VECTOR PROCESSOR
P = SCALAR PROCESSOR
msb-0373-90

5–6

VAX 6000 Models 300 and 400 Service Manual

Table 5–2 shows the maximum number of scalar and vector processors
supported in a VAX 6000 Model 400 system.

Table 5–2: Processor Module Combinations
Maximum
CPUs

Maximum
Vectors

Configuration
(Slot 1 at Right)

P P P P P P

M V P P P P

M V P M V P

Figure 5–4 shows system configurations for a VAX 6000 Model 400 system
with one or two vector processors. The diagram on the left indicates the
configuration for two scalar/vector pairs (V- -P) with a memory module in
the slot to the left of the vector processor. The diagram on the right shows
a single scalar/vector pair with additional scalar processors.
Typically, processors are placed in the right <REFERENCE>(XMI) slots,
beginning with slot 1 and extending to slot 6. Memories are placed in the
middle slots, from slot A to slot 5 and then slots B and C, and VAXBI
adapters are installed in the left side of the card cage, beginning with slot
E. However, in a system with a vector processor, the modules should be
installed as shown in Figure 5–4. These configurations must be followed to
avoid damage to the modules and for performance reasons:
•

Because the <REFERENCE>(xrv) module has VLSI components with
heat sinks protruding from both sides, only a memory module,
with its low components, can be placed next to side 2 of the
<REFERENCE>(xrv).

•

In a system with one scalar/vector pair and one or more additional
scalar processors, the scalar processor of the pair should be prevented
from being the boot processor for performance reasons.
If the scalar/vector pair is to the left of other scalar processors, then the
processor of the scalar/vector pair will not become the boot processor
unless other processors fail self-test or have been disabled with the
SET CPU console command. Alternatively, you can issue the SET
CPU/NOPRIMARY command and give the node number of the attached
scalar processor that you do not want to be the boot processor.

<REFERENCE>(XRV) Vector Processor 5–7

5.4 Functional Description
Figure 5–5 shows the three main functional units of the
<REFERENCE>(XRV) processor: the vector control unit, the
arithmetic unit, and the load/store unit, which includes the
XMI interface and cache control.

Figure 5–5: <REFERENCE>(XRV) Block Diagram

To Scalar Processor

VIB
Cable

VECTOR CONTROL UNIT
VECTL Chip

Cache Data Bus
(CD Bus)

LOAD/STORE UNIT
Load/Store Chip
Cache and XMI Interface

ARITHMETIC UNIT

Vector
Register
File Chips
(Verse)

Vector
FPU Chips
(Favor)

XMI Bus

msb-0527-90

5–8

VAX 6000 Models 300 and 400 Service Manual

The <REFERENCE>(xrv) is an integrated vector processor, tightly coupled
to the <REFERENCE>(XRP) scalar processor. The vector instructions are
issued from the scalar processor, and the vector processor then dispatches
them internally. All communication between the scalar and vector modules
takes place across the intermodule VIB cable. All communication with
memory is over the XMI bus.
The vector processor has 16 vector data registers, each 64 quadwords long.
There is a 1-megabyte direct-mapped cache and a 136-entry translation
buffer.
The <REFERENCE>(xrv) is an XMI module with the standard XMI
Corner. The module has a cable connector at the rear edge of the module
that connects to the rear edge of a <REFERENCE>(XRP) module. The
instructions are issued over the VIB bus and pass to the VECTL chip,
which then controls the operations on the module. It passes instructions
to the load/store unit over the CD bus. The load/store unit then issues
XMI memory transactions. The VECTL chip also issues instructions to the
four pairs of Verse and Favor chips that make up the arithmetic unit. The
vector data registers are in the Verse chips. The Favor chips perform the
arithmetic operations on the data held in the Verse chips.
The vector processor module uses the standard XMI Corner interface, but it
functions only as an XMI commander. The vector processor does not issue
transactions to I/O space, nor does it respond to XMI transactions directed
to it. All error reporting is done by the scalar processor.

<REFERENCE>(XRV) Vector Processor 5–9

5.5 Self-Test Results: Console Display and
Self-Test LED
You can check the vector processor self-test results in three
ways: the self-test display if the vector is attached to
the processor in node 1, the yellow self-test LED on the
<REFERENCE>(xrv) module, and the contents of the XGPR
register of the attached <REFERENCE>(XRP) module. If
self-test passes, the large yellow LED on the vector module
lights. If the vector module fails self-test, the light remains
unlit.

Example 5–1: Self-Test Results
#123456789 0123456789 0123456789 0123456789 0123456789 # 1
F

A
o
.
.
.

A
+
.
.
.

.
.
.
.
.

M
+
.
.
.

.
.
.
.
.

M
+
.
.
.

V- -P
+
+
D
E
+
+
D
E

M
+
.
+
.

V- -P
+
+
E
B
+
+
E
B

.
.

A2
64

A1
64

.
.

B2
32

.
.

B1
32

.
.

ROM0 = V3.00
>>>

ROM1 = V3.00

EEPROM = 2.03/3.00

NODE #
TYP 2
STF 3
BPD 4
ETF 5
BPD 6

XBI E +
ILV
192Mb

SN = SG01234567 7

Example 5–1 shows the self-test results for a system with two scalar/vector
pairs. Each <REFERENCE>(XRP) runs its self-test and then tests any
attached vector processor.
1

The first line of the self-test printout is the progress trace. This line
shows the self-test progress of the <REFERENCE>(XRP) in node 1.
The numbers correspond to tests in the system self-test. If there is an
attached vector processor module and self-test passes, the line prints as
in Example 5–1 ending with #. If there is no attached vector processor,
testing stops after the first 37 tests. If a test fails, the failing test
number is the last one printed. For example, if test 14 fails, the line is
printed as follows:
#123456789 01234

5–10

VAX 6000 Models 300 and 400 Service Manual

This line indicates the type (TYP) of module at each <REFERENCE>(XMI)
node. Scalar processors are type P, and vector processors are type V. The
dashes indicate that the scalar processors are attached to the adjacent
vector processors.

This line shows self-test fail status (STF), which are the results of onboard self-test. Possible values for processors are:
+ (pass)
– (fail)
All processors passed self-test in this example.

The BPD line indicates boot processor designation and whether vector
processors are enabled or disabled.1 When the system completes onboard self-test, the scalar processor with the lowest XMI ID number
that passes self-test and is eligible is selected as boot processor — in
this example, the processor at node 1.
The results on the BPD line indicate:
•

The boot processor (B)

•

Scalar processors eligible (E) or ineligible (D) to become the boot
processor

•

Vector processors enabled (E) or disabled (D)

In this example the vector processor attached to the scalar processor
at node 4 has been disabled. A vector processor can be disabled by the
SET CPU/NOVECTOR_ENABLED command.
5

During extended test (ETF) all processors run additional tests, which
include reading and writing memory and using the cache. On line ETF,
results are reported for each processor in the same way as on line STF—
a plus sign indicates that extended test passed and a minus sign that
extended test failed.

Another BPD line is displayed, because it is possible for a different CPU
to be designated boot processor if the processor first designated as the
boot processor fails the extended testing.

The last line of the self-test display shows the ROM and EEPROM
version numbers and the system serial number. Version 2 or greater
ROMs and EEPROMs are required to support vector processors.

If a revision J scalar processor has an attached vector module, the vector will be
disabled, and this error message is displayed: ?7D Vector module is disabled–check
<REFERENCE>(XRP) revision at node n. The attached scalar module (T2015) must be
at a minimum revision of K. In addition, the ROMs on any other <REFERENCE>(XRP)
modules must be at a minimum revision of V2.0.

<REFERENCE>(XRV) Vector Processor 5–11

5.6 Self-Test Results: Scalar XGPR Register
You can check self-test results in the self-test display or
in the XGPR register.
The failing test number is left
in the upper byte of the XGPR register of the failing
<REFERENCE>(XRP) processor.

Figure 5–6: XGPR Register
3
1

2 2 2 2 2 1
4 3 2 1 0 9

1 1
6 5

0
Reserved

Vector Node ID
Vector Enabled
Vector Extended Test Failed
Vector Self−Test Failed
Vector Present
Failing Test Number
msb−p371−90

Example 5–2: XGPR Register After Power-Up Test Failure
>>> E/P/L 2188000C
2188000C

5–12

45F0xxxx

! Examine the longword at physical address
! 2188000C, the address of the XGPR
! register of the processor in slot 1.
! The result indicates that test 45 of
! self-test failed (Load/Store Cache test).

VAX 6000 Models 300 and 400 Service Manual

Figure 5–6 shows the XGPR register of the scalar processor. Bit <23>, when
set, indicates that there is a vector processor attached to this processor. Bits
<22:16> give status on an attached vector processor.
The failing test number is derived from the upper byte (bits <31:24>) of the
longword returned. For self-test, the upper byte contains the failing test
number. If CPU/memory interaction test fails, this byte contains the failing
test number plus 49. If DWMBB test fails, bit <31> is set (making the first
digit 8 through A), and bits <30:24> contain the failing test number. All
numbers are expressed in binary-coded decimal (BCD). See Table 5–3.
As shown in Example 5–2, you can examine the XGPR register of the failing
node to determine the failing test number. See Table 4–3 to determine the
base address (BB) of the <REFERENCE>(XRP) processor’s node. Then
calculate the address of the XGPR register by adding 0C (hex) to the base
address.

Table 5–3: Interpreting XGPR Failing Test Numbers
Failing Diagnostic

XGPR <31>

XGPR <30:24>
(BCD)

Test
Numbers

Self-test

Clear

1–49

CPU/memory interaction test

Clear

50–66

1–17

Additional memory

Clear

67–73

DWMBB test

Set

1–26

<REFERENCE>(XRV) Vector Processor 5–13

5.7 Vector Processor Tests — RBD 0 and RBD 1
T0038 through T0049 of RBD 0 test the vector processor
during self-test. Tests 14–17 of RBD 1 test the vector
processor during CPU/memory testing.

Example 5–3: Running RBD 0 on a Secondary Processor with an
Attached Vector Processor
>>> SET CPU 4 1
>>> T/R
RBD4> ST0/TR 2
;XRP/V_ST
; T0001
; T0011
; T0021
; T0031
; T0041

2.00

T0002
T0012
T0022
T0032
T0042

T0003
T0013
T0023
T0033
T0043

T0004
T0014
T0024
T0034
T0044

T0005
T0015
T0025
T0035
T0045

T0006
T0016
T0026
T0036
T0046

T0007
T0017
T0027
T0037
T0047

T0008
T0018
T0028
T0038
T0048

T0009
T0019
T0029
T0039
T0049

T0010
T0020
T0030
T0040

;
P
2
8082
1
;00000000 00000000 00000000 00000000 000000000 00000000 00000000

In Example 5–3:
1

This command causes the <REFERENCE>(XRP) module at node 4 to
become the primary processor.

The prompt indicates that the CPU at node 4 is the primary processor.
RBD 0 is run on the scalar/vector processor pair at node 4.

5–14

VAX 6000 Models 300 and 400 Service Manual

Table 5–4: Vector Processor Tests in Self-Test — RBD 0
Test

Function

T0038

VECTL Registers Test

T0039

Verse Registers Test

T0040

Load/Store Registers Test

T0041

VIB Error Logic Test

T0042

Other VECTL Chip Logic Test

T0043

Verse and Favor Test

T0044

Load/Store Translation Buffer and CAM Test

T0045

Load/Store Cache Test

T0046

Load/Store Instruction Test

T0047

Load/Store Tag and Duplicate Tag Test

T0048

Load/Store Error Cases Test

T0049

Module Critical Path Test

Table 5–5: Vector Tests in CPU/Memory Interaction Tests —
RBD 1
Test

Function

T0014

Cache Test

T0015

Write Buffer Test

T0016

Duplicate Tag Test

T0017

Miscellaneous Error Test

<REFERENCE>(XRV) Vector Processor 5–15

5.8 VAX/DS Diagnostics
The <REFERENCE>(xrv) software diagnostics that run
under the VAX Diagnostic Supervisor (VAX/DS) are listed
in Table 5–6. Example 5–4 lists VAX/DS commands used in
testing vector processors. See Section 2.4 for instructions
on running the supervisor.

Table 5–6: <REFERENCE>(XRV) VAX/DS Diagnostics
Program

Description

ERKMP

Multiprocessor Exerciser
(2 min—quick)
(4 min—default)

EVKAG

VAX Vector Instruction Exerciser, Part 1
(1 1/2 min—quick)
(16 min—default)

EVKAH

VAX Vector Instruction Exerciser, Part 2
(1 min—quick)
(18 min—default)

Example 5–4: VAX/DS Commands for Testing Vector Processors
DS> RUN ERKMP
DS> SET QUICK
DS> DESELECT KA1
DS> RUN EVKAG
DS> RUN EVKAH
DS> BOOT n
DS> DESELECT KA0
DS> SELECT KA1
DS> BOOT n
DS> EXIT

5–16

! Multiprocessor Exerciser also tests
! vector processors.
! Abbreviated version of the VAX Vector
! Instruction Exerciser will be run.
! Removes the second scalar/vector pair
! from testing.
! Part 1 of VAX Vector Instruction Exerciser.
! Part 2.
! If more than one vector, make the other
! scalar of the second scalar/vector pair
! the boot processor. Run EVKAG and EVKAH
! on the second vector.
! Restore original boot processor.

VAX 6000 Models 300 and 400 Service Manual

5.9 Machine Checks
A machine check is an exception that indicates a processordetected internal error. Figure 5–7 and Table 5–7 show these
parameters.

Figure 5–7: The Stack in Response to a Machine Check

Table 5–7: <REFERENCE>(xrv) Machine Check Parameters
Parameter
Machine check code
(SP+4)

Value
(hex)

Description

Vector module error

Machine checks are taken regardless of the current IPL. If the machine
check exception vector bits (<1:0>) are not both one, the operation of the
processor is undefined. The exception is taken on the interrupt stack and
the IPL is raised to 1F (hex). See Table 4–9 for the complete list of machine
check codes.

<REFERENCE>(XRV) Vector Processor 5–17

5.10 Vector Console Commands
Table 4–10 gives the console commands specific to the vector
processor.

Table 5–8: Vector Console Commands
Command

Function

DEPOSIT

Stores data in a specified address.
Additional addresses can be VMR, VCR, and VLR (for Vector Mask Register, Vector Count Register, and Vector Length Register).

Defines the address space as a vector indirect register; accesses addresses 400 and higher.

Quadword is the default data size for vector registers (except for VCR and VLR).

/VE

Defines the address space as the vector register set.

EXAMINE

Displays the contents of a specified address. Additional addresses can be VMR, VCR, and VLR (for Vector Mask Register, Vector Count Register, and Vector Length Register).

Defines the address space as a vector indirect register; accesses addresses 400 and higher.

Quadword is the default data size for vector registers (except for VCR and VLR).

/VE

Defines the address space as the vector register set.

SET CPU

Specifies attributes of processors, such as eligibility to become the boot processor or whether a vector processor is enabled.

/NOVECTOR_ENABLED

Prevents a vector module from being recognized in the system configuration.

/VECTOR_ENABLED

Specifies that a vector module will be recognized in the system configuration; the default.

5–18

VAX 6000 Models 300 and 400 Service Manual

DEPOSIT Examples
1.

>>> DEPOSIT/VE V12 0

>>> DEPOSIT V6:2C/n:2

>>> DEPOSIT VLR 1

>>> DEPOSIT/Q/P 200 FFFFFFFF45370201
! Deposits FFFFFFFF45370201, a quadword
! of data into physical memory at address
! 200.

>>> DEPOSIT/M

440 0

!
!

Deposits zero into all 64 elements
of vector register V12.

!
!
!

Deposits zero into V6 beginning at
element 2C (hex) and also in the next
two elements.

!
!

Deposits one in the Vector Length
Register.

!
!

Deposits zeros to vector indirect
register with address 440 (hex).

<REFERENCE>(XRV) Vector Processor 5–19

EXAMINE Examples
1.

>>> EXAMINE VLR

!
!

Examines the Vector Length
Register.

M 00000001 0E

>>> EXAMINE/Q/P 200

!
!

Examines the quadword in
physical memory at address 200.

>>> EXAMINE/VE V12:2E

!
!
!

Examines element 2E (hex)
(which is 41 decimal) of vector
data register V12.

>>> EXAMINE/M

!
!
!
!

Examines the vector indirect
register at hex address 440.
/M is used to access vector
indirect registers.

440

M 440 FFFFFFFF 00000000

5–20

VAX 6000 Models 300 and 400 Service Manual

>>> EXAMINE/VE V0
VE V00:00
VE V00:02
VE V00:04
VE V00:06
VE V00:08
VE V00:0A
VE V00:0C
VE V00:0E
VE V00:10
VE V00:12
VE V00:14
VE V00:16
VE V00:18
VE V00:1A
VE V00:1C
VE V00:1E
VE V00:20
VE V00:22
VE V00:24
VE V00:26
VE V00:28
VE V00:2A
VE V00:2C
VE V00:2E
VE V00:30
VE V00:32
VE V00:34
VE V00:36
VE V00:38
VE V00:3A
VE V00:3C
VE V00:3E

!
!

Examines vector register V0; system
displays all 64 elements of register V0.

00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002
00000000 00000002

VE V00:01
VE V00:03
VE V00:05
VE V00:07
VE V00:09
VE V00:0B
VE V00:0D
VE V00:0F
VE V00:11
VE V00:13
VE V00:15
VE V00:17
VE V00:19
VE V00:1B
VE V00:1D
VE V00:1F
VE V00:21
VE V00:23
VE V00:25
VE V00:27
VE V00:29
VE V00:2B
VE V00:2D
VE V00:2F
VE V00:31
VE V00:33
VE V00:35
VE V00:37
VE V00:39
VE V00:3B
VE V00:3D
VE V00:3F

<REFERENCE>(XRV) Vector Processor 5–21

5.11 <REFERENCE>(xrv) Handling Procedures
Handle the processor modules with care. The technology
used on the later 6000 series modules is more vulnerable to
static than earlier technology. Also, these modules have 25
mil leads to the chips; these leads are small, close together,
and easily bent.

Figure 5–8: Holding the <REFERENCE>(xrv) Module

msb-0228A-90

5–22

VAX 6000 Models 300 and 400 Service Manual

The later 6000 series modules require careful handling. Prepare yourself
and the work area before handling these modules. Roll up your sleeves
and remove any jewelry. Figure 5–8 shows the proper way to hold these
modules.
Follow these handling procedures to avoid damaging the processor modules:
1. Always wear an antistatic wrist strap.
2. Before removing the module from its ESD box, place the box on a clean,
stable surface.
Be sure the box will not slide or fall. Never place the box on the floor.
And be sure no tools, papers, manuals, or anything else that might
damage the module is near it. Some components on this module can
be damaged by a 600-volt static charge; paper, for example, can carry
a charge of 1000 volts.
3. Hold the module only by the edges, as shown in Figure 5–8.
Do not hold the module so that your fingers touch any 25 mil devices,
leads, or XMI fingers. Be sure you do not bend the module as you are
holding it.
4. Be sure nothing touches the module surface or any of its components.
If anything touches the module, components or leads can be damaged.
This includes the antistatic wrist strap, clothing, jewelry, cables,
components on other modules, and anything in the work area (such
as tools, manuals, or loose papers).

<REFERENCE>(XRV) Vector Processor 5–23

Figure 5–9: Inserting the <REFERENCE>(xrv) Module in an XMI Card
Cage

msb-0372-90

5–24

VAX 6000 Models 300 and 400 Service Manual

You must take special precautions when moving the processor modules in
or out of the XMI card cage.
1. Be sure, when inserting the module in or removing it from the XMI
card cage, that no part of the module comes in contact with another
module or a cable. The leads on the components are fragile and can be
damaged by contact with fingers or any surface.
2. When you swap out a module, place it in the correct ESD box before
you install the new module.
3. Hold the XMI card cage handle while removing or inserting the module.
If it is not held in place, the handle can spring down and damage the
module.
4. When inserting the module in the card cage, grasp it as shown in
Figure 5–9, being careful not to touch any 25 mil devices, and slide
it slowly and gently into the slot.
5. Do not attach the repair tag to the module.
Place the repair tag in the plastic bag attached to the bottom of the
ESD box. Allowing the repair tag to come in contact with the module
can cause damage to a component.

<REFERENCE>(XRV) Vector Processor 5–25

5.12 How to Replace a Vector Module
If a vector module is defective, you can replace it with a
new one. If you install an additional one, see the complete
installation instructions in the VAX 6000 Series Upgrade
Manual.

Figure 5–10: Replacing a Vector Module in an XMI Card Cage

msb-0407-90

5–26

VAX 6000 Models 300 and 400 Service Manual

CAUTION: Special care must be taken when handling processor modules.
See Section 5.11 before replacing this module. Also review the configuration
rules in Section 5.3.
While removing or inserting a module in the XMI card cage, you must hold
the XMI card cage lever. Failure to do so may result in damage to the
module.
1. Turn the upper key switch straight up to the Off position (0).
2. Open the cabinet door and remove the plastic door in front of the XMI
card cage.
CAUTION: You must wear an antistatic wrist strap attached to the
cabinet when you handle any modules.
3. Disconnect the VIB cable (17-02240-03) from the vector module.
4. Remove the defective vector processor module.
5. Take the new vector processor module from the ESD box and insert it
in the XMI card cage. Place the defective module in the ESD box.
6. Attach the connecting VIB (vector interface bus) cable. The keyed end
of the cable attaches to the vector module.
7. Press the lever down to close the connector.
8. Replace the plastic door and shut the cabinet door.
9. Turn the lower key switch to Halt and the upper key switch to Enable.
10. Check the self-test display for the new vector processor, indicated by a
V on the TYP line.
11. If the processor shows a plus sign (+) on both lines STF and ETF, it
passed self-test.
NOTE: Installation of an <REFERENCE>(xrv) vector processor requires
that the attached <REFERENCE>(XRP) module (T2015) be at a
minimum revision of K. In addition, the ROMs on any additional
<REFERENCE>(XRP) modules must be at a minimum revision of V2.0
(ROM 0 and ROM 1).

<REFERENCE>(XRV) Vector Processor 5–27

5.13 Vector Processor Registers
The <REFERENCE>(XRV) internal processor registers are
listed in Table 5–9. See Chapter 4 for the complete list of
IPR registers. The console program allows you to access the
vector registers. Software accesses the vector registers with
MTPR/MFPR and MTVP/MFVP instructions.

Table 5–9: <REFERENCE>(XRV) Internal Processor Registers
Register

Mnemonic Address

Type

Class

Vector Interface Error Status

VINTSR

IPR123

R/W

Vector Processor Status

VPSR

IPR144

R/W

Vector Arithmetic Exception

VAER

IPR145

Vector Memory Activity Check

VMAC

IPR146

Vector Translation Buffer Invalidate All

VTBIA

IPR147

Vector Indirect Register Address

VIADR

IPR157

R/W

Vector Indirect Data Low

VIDLO

IPR158

R/W

Vector Indirect Data High

VIDHI

IPR159

R/W

Key to Types:
R–Read
W–Write
R/W–Read/write
Key to Classes:
1–Implemented by the <REFERENCE>(XRP) CPU module.
2–Implemented by the <REFERENCE>(XRV) vector module.

5–28

VAX 6000 Models 300 and 400 Service Manual

The IPRs listed in Table 5–9 are explicitly accessible to software only by
the Move To Processor Register (MTPR) and Move From Processor Register
(MFPR) instructions, which require kernel mode privileges. (The vector
indirect registers are also accessed with MTPR and MFPR instructions.
These registers are described in the System Technical User’s Guide.)
From the console, EXAMINE/I and DEPOSIT/I commands read and write
the IPRs. EXAMINE/M and DEPOSIT/M commands provide access to
the vector indirect registers above hex address 400. EXAMINE/VE and
DEPOSIT/VE provide access to the vector data registers.
Other instructions, the Move To/From Vector Processor (MTVP/MFVP)
instructions, are used by software to access the Vector Length, Vector
Count, and Vector Mask control registers. From the console, these registers
are specified as VLR, VCR, and VMR after DEPOSIT and EXAMINE
commands, with no qualifiers.
For more information on accessing the vector module registers, see the VAX
6000 Series Vector Processor Owner’s Manual.

<REFERENCE>(XRV) Vector Processor 5–29

Chapter 6

MS65A Memory
This chapter discusses the <REFERENCE>(xma2) memory module.
Sections include:
•

Physical Description

•

Configuration Rules

•

Specifications

•

Functional Description

•

System Interleaving Requirements

•

MS65A Interleaving

•

Console Commands for Interleaving

•

Addressing

•

Memory Self-Test

•

Memory Self-Test Errors

•

Memory RBD

•

Memory RBD Test Examples

•

Control and Status Registers

•

Mixing MS65A and MS62A Memory Modules

MS65A Memory 6–1

6.1 MS65A Physical Description
The <REFERENCE>(xma2) memory module is a metal-oxide
semiconductor (MOS), dynamic random access memory
(DRAM), which provides up to 128 Mbytes of data
storage. The memory module is designed for use with the
<REFERENCE>(6000) system through the XMI bus.

Figure 6–1: MS65A Module
BLOCK STATE
BUFFER
DRAMS

DATA
MUXs

CMOS
GATE ARRAY

EEPROM
XMI
CORNER

GREEN
POWER
LED
ZIF
CONNECTOR
SEGMENTS

YELLOW
SELF-TEST
LED

SMALL
RED
LED
DRAM
CONTROL/ADDRESS
BUFFERS

6–2

DRAMS

DATA
MUXs

DRAMS

VAX 6000 Models 300 and 400 Service Manual

msb-0454-90

The <REFERENCE>(xma2) memory module has the following features:
•

The memory module contains MOS dynamic RAM (DRAM) arrays; a
CMOS memory control gate array that contains error correction code
(ECC) logic and control logic; an EEPROM storage element and an XMI
interface known as the XMI Corner.

•

Storage arrays are made up of two or four banks, either 155 or 299
DRAMs.

•

ECC logic detects single-bit and double-bit errors and corrects single-bit
errors on 64-bit words.

•

Memory self-test checks all RAMs, the data path, and control logic on
power-up.

•

Quadwords, octawords, and hexwords can be read from or written to
memory.

•

Memory is configured by the console program for 2-, 4-, 8-way or no
interleaving.

MS65A Memory 6–3

6.2 MS65A Configuration Rules
Figure 6–2 shows the order of placement of MS65A modules
in the XMI backplane.

Figure 6–2: MS65A Configuration

XMI CARD CAGE

D C B A 9

7 6 5 4 3

Memory Slots 1

1
msb-0133E-90

Memory modules are configured after I/O adapter and processor modules.
Install memory modules next to vector processors first, then install
additional memories as follows:
1

Install the first memory module in slot A. Fill all available slots left to
right from slot A to slot 1.

Install any additional memory modules right to left in available slots
from slot B to slot E.

6–4

VAX 6000 Models 300 and 400 Service Manual

6.3 MS65A Specifications
Table 6–1 gives the <REFERENCE>(xma2) module specifications.

Table 6–1: <REFERENCE>(xma2_title) Specifications
Parameter

Description

Module Number:

T2053

Dimensions:

23.3 cm (9.2") H and 28.0 cm (11.0") D

Memory size:

MS65A-BA
MS65A-CA
MS65A-DA

Addresses:

16-Mbyte boundaries

32 Mbytes
64 Mbytes
128 Mbytes

Starting Address

0 Mbytes to 512 Mbytes

Ending Address

0 to 512 Mbytes

Technology:
DRAMS

1 or 4 Mbit dynamic RAMs

Gate Arrays

CMOS memory control gate array

Interleave:

2-, 4-, 8-way or none

Error Correction Code:

Detects single- and double-bit errors and corrects single-bit errors

Temperature:
Storage Range

–40o C to 66o C (–40o F to 151o F)

Operating Range

5o C to 50o C (41o F to 122o F)

Relative Humidity:
Storage and Operating

10 to 95% noncondensing

Altitude:
Storage

Up to 4.8 km (16,000 ft)

Operating

Up to 2.4 km (8000 ft)

Current:

10A active, 3.8A standby, max. at +5V

Power:

50W active, 19W standby, max. at +5V

MS65A Memory 6–5

6.4 MS65A Functional Description
The <REFERENCE>(xma2) consists of an XMI Corner, a
memory control gate array, address and control drivers,
block state DRAMs, DRAM arrays, and an EEPROM.

Figure 6–3: MS65A Block Diagram
Bank 2
Data
DRAMs

Bank 3
Data
DRAMs

Bank 0
Data
DRAMs

Bank 1
Data
DRAMs

MUX

MUX SEL

Block
State
DRAMs

To DRAM Array

Buffers
Address/Control

EEPROM

Memory
Control
Array

Diag Test Bus

PROM Bus
XCI
XMI
Corner

XMI Bus

msb-0730-90

6–6

VAX 6000 Models 300 and 400 Service Manual

The XMI Corner is located on the <REFERENCE>(xma2) module and
contains interface logic.
The memory control gate array transfers data between the XMI Corner
and the DRAMs. The memory control gate array also controls address
multiplexing, command decoding, arbitration, and CSR logic functions.
Address and control logic modifies address bits received from the XMI
Corner. These modified address bits are used to control the selection of
the DRAMs during reading and writing.
Memory is arranged in two or four banks of DRAMs. Each bank contains
either 155 or 299 DRAMs on each memory module.
The data in the EEPROM is used to initialize the memory control gate array.
After a power-up or system reset, the data in the EEPROM is loaded into
the memory control gate array.

MS65A Memory 6–7

6.5 System Interleaving Requirements
System performance is affected by the speed with which
memory responds to requests made of its resources. For this
reason, <REFERENCE>(HYPERION) and <REFERENCE>(rigel)
systems have memory interleaving requirements. Those requirements are given in Table 6–2.

Table 6–2: VAX 6000 Interleaving Requirements
Model
400 with
Vectors

Interleave
Factor

Model
300

Model
400

One way

310
320
330

410
420

Two way

340
350
360

430
440

410 or 420
with 1 vector

450
460

420 with
2 vectors

Four way

430 or 440
with 1 vector

6–8

VAX 6000 Models 300 and 400 Service Manual

The interleave configuration requirements shown in Table 6–2 are
necessary for system performance. Differences between the two systems
are primarily due to cache differences on the two CPUs.
Note that memory size is not the issue. However, to achieve 4-way
interleaving the minimum memory capacity is 128 Mbytes (4 x 32-Mbyte
arrays).

MS65A Memory 6–9

6.6 MS65A Interleaving
Interleaving optimizes memory access time and increases
the effective memory transfer rate by operating memory
modules in parallel.

Figure 6–4: Examples of Interleaving

32 Mb

2-WAY INTERLEAVE SET
(32, 32)

32 Mb

64 Mb

2-WAY INTERLEAVE SET
(32 + 32, 64)

64 Mb
32 Mb
128 Mb

128 Mb

32 Mb
32 Mb

4-WAY INTERLEAVE SET WITH ONE MEMORY NOT INTERLEAVED
(128, 128, 128, 64 + 32+32) interleaved and (32) not interleaved
msb-0717A-91

6–10

VAX 6000 Models 300 and 400 Service Manual

Memory supports 2-, 4-, 8-way or no interleaving. Up to eight memory
modules of the same size can be interleaved. Memory modules of different
sizes can also be interleaved. Figure 6–4 shows three examples of
interleaving.
•

A 2-way interleave set is made from two, same sized, arrays.

•

A 2-way interleave set is made from three memory arrays of different
sizes.

•

The final example shows how the console builds a 4-way interleave set
from several different array sizes.

Interleaving is done on hexword boundaries. Interleaving addresses are
set in the Starting and Ending Address Register by the console program
(see Section 6.8). The <REFERENCE>(xma2) does not check for valid or
invalid interleaving configurations.
NOTE: Memory modules that fail self-test due to multiple-bit errors are not
included in the interleave set.
When different sizes of memory modules are installed in a <REFERENCE>(6000)
system, the console interleaves the memory modules according to size and
sets as follows:
•

Sorts memory modules into groups by size.

•

Interleaves the largest size memory modules first.

•

Stacks remaining sets of modules into sets that equal the largest size
memory modules and interleaves them with the largest size memory
modules.

•

Stacks remaining modules into sets of the next largest size memory
modules and interleave them.

•

Continues stacking and interleaving memory modules until all memory
modules have been interleaved (including noninterleaved modules).

Unless the system requires a specific, dedicated memory use, let the console
set the default interleave set rather than setting interleaving manually.
In default, the console program chooses the optimal configuration for the
system.

MS65A Memory 6–11

6.7 Console Commands for Interleaving
The SET MEMORY command is used to set memory interleaving in a configuration other than the default. This is not
usually advisable, but occasional customer use will warrant
overriding the original console setting of the interleave. The
INITIALIZE command causes both <REFERENCE>(6000) systems to execute <REFERENCE>(xma2) self-tests and the SET
MEMORY commands to take effect.

Example 6–1: SET MEMORY and INITIALIZE Commands
>>> SET MEMORY

/INTERLEAVE:DEFAULT 1
! For a system with one 64-Mbyte and two
! 32-Mbyte memory modules, it creates a 2-way
! interleave of 64-Mbyte memory modules
! (1x64-Mbyte and 2x32-Mbyte memory modules)
! located at XMI nodes A, 9, and 8.

>>> SHOW MEMORY 2
F

E
.
.

D
.
.

C
.
.

B
.
.

! Displays the memory lines from self-test.
A
A2
32

9
A2
32

8
A1
64

7
.
.

6
.
.

5
.
.

4
.
.

3
.
.

2
.
.

1
.
.

NODE #
ILV
128Mb

/INTERLEAVE:DEFAULT
>>> SET MEMORY

/INTERLEAVE:(8, 9+A) 3
! Explicitly specifies what is created
! as requested by the user (two interleave
! sets with modules in nodes 8, 9, and A).

>>> INITIALIZE 4

! Enables the SET MEMORY command to take effect

[self-test display]
>>> SHOW MEMORY 5
F

E
.
.

D
.
.

C
.
.

B
.
.

! Displays the memory lines from self-test.
A
B2
32

9
B1
32

8
A1
64

7
.
.

6
.
.

5
.
.

4
.
.

3
.
.

2
.
.

/INTERLEAVE:(8, 9+A)
>>>

6–12

VAX 6000 Models 300 and 400 Service Manual

1
.
.

NODE #
ILV
128Mb

The callouts in Example 6–1 are explained below.
1

Shows the SET MEMORY command that configures interleaving with
the console program. This command invokes the default interleaving
configuration. It is recommended that this default be used, rather than
trying to interleave memory manually.

The SHOW MEMORY command displays the node number (node #),
interleave (ILV), and total usable memory (xxMb) lines from the selftest results.

Shows the SET MEMORY command that creates a 2-way interleave
as requested by the user. In this example the user explicitly specified
how to interleave the memory modules. Each interleaving set must
contain the node number of the memory module. If there is more than
one memory module in a set, they are joined by a + sign. Each set of
interleaved memory modules must be separated by a comma.

The system is initialized and the new memory interleave configuration
takes effect. You cannot initialize a memory node by itself after a SET
MEMORY command because memory addressing would be changed and
data structures lost.

The SHOW MEMORY command displays the configuration set in 3 .

NOTE: Refer to Chapter 5 of the VAX 6000 Series Owner’s Manual
for detailed information on the SET MEMORY and SHOW MEMORY
commands.
The SET MEMORY command does not change memory interleaving
immediately; it just modifies the memory configuration in the EEPROM.
The memory configuration specified by the SET MEMORY command
takes place when the system is initialized (by a power-up or INITIALIZE
command).

MS65A Memory 6–13

6.8 MS65A Addressing
Memory addressing is set on hexword boundaries and
depends on the interleaving sets organized by the console.
Starting and ending addresses are determined by the
console regardless of how interleaving is done (by the user
or by the console).

Figure 6–5: Memory Addressing

TOTAL MEMORY SIZE: 256 Mb
ENADR = 00000400

ENADR = 00000400

INTLV = 00000001

STADR = 00000200
ENADR = 00000200
INTLV = 00000001
STADR = 00000100

64 Mb
INTLV = 00000021

32 Mb

128 Mb

ENADR = 00000100
INTLV = 00000001
STADR = 00000000

32 Mb
STADR = 00000000
msb-0717-91

6–14

VAX 6000 Models 300 and 400 Service Manual

Figure 6–5 shows the starting address (STADR), ending address (ENADR),
and interleave (INTLV) registers of a sample interleave set. The contents
of these registers are set by the console.
The memory shown in Figure 6–5 is divided into two interleaving sets and
totals 256 Mbytes. Set 0 consists of two 32-Mbyte arrays and one 64-Mbyte
array. Set 1 consists of one 128-Mbyte array.
The starting address of the first array is 0. The ending address is
determined by multiplying the density of the array by the interleave factor
(number of sets). For example, the starting address of the first array in set
0 is 0, and the ending address is 100 hex (64 decimal, which is equal to 32
multiplied by 2). The starting address of the second array is the same as
the ending address of the first.
Each array’s interleave register indicates the set it belongs to (bits <7:5>)
and the total number of interleave sets (bits <1:0>). The interleave register
for the 128-Mbyte array indicates that the array is set 1 (bits <7:5>=001)
of two interleave sets (bits <1:0>=01).

MS65A Memory 6–15

6.9 Memory Self-Test
The <REFERENCE>(xma2) performs an initialization and
self-test sequence on power-up or when the sequence is
requested by a console command. During self-test the array
chip is initialized, all memory locations are tested, and the
control and status registers are initialized.

Example 6–2: MS65A Memory Module Results in Self-Test
#123456789 0123456789 0123456789 01234567#
F

E
A
+
.
.
.

D
A
+
.
.
.

C
.
.
.
.
.

B
.
.
.
.
.

A
M
.
.
.

9
M
+
.
.
.

8
M
+
.
.
.

7
M
+
.
.
.

6
.
.
.
.
.

5
.
.
.
.
.

4
.
.
.
.
.

3
P
+
E
+
E

2
P
+
E
+
E

1
P
+
B
+
B

.
.

C1
64

B1
64

A2
64

A1
64

.
.

ROM0 = V3.00

ROM1 = V3.00

EEPROM = 2.03/3.00

NODE #
1
TYP
2
STF
BPD
ETF
BPD

3
ILV
256Mb 4

SN = SGO1234567

>>>

6–16

VAX 6000 Models 300 and 400 Service Manual

The callouts in Example 6–2 are explained below.
1

The TYP line shows that memory modules are installed in XMI slots 7
through A as indicated by the M in this row.

The STF line shows if memory modules pass self-test, as indicated by
the + in this row. If a module fails self-test, a – is indicated, but the
console still tests all pages within the module. The failing module is
included in the configuration, and the addresses that fail self-test are
not used by the system.

The ILV line indicates that two memory array modules are 2-way
interleaved and the other two modules are interleaved by themselves.
That is, memory modules in slots 7 and 8 are two-way interleaved into
one interleave set (indicated by all modules beginning with the letter
A). The module at node A failed its self-test and although used by the
system it is not included in an interleave set.

This system contains a total usable memory of 256 Mbytes (four 64Mbyte memory modules).

If all <REFERENCE>(xma2) nodes pass self-test, the CPU/memory test is
performed on the <REFERENCE>(xma2) by the CPU. The console executes
a simple read/write test to a small portion of memory. Since there are no
errors from the self-test, the memory bitmap is set with all pages as good.

MS65A Memory 6–17

6.10 Memory Self-Test Errors
If an <REFERENCE>(xma2) node fails self-test, an explicit
memory test is run on the failing module and console error
messages are displayed. The failing module is still included
in the memory configuration.

Example 6–3: MS65A Memory Module Node Exclusion
>>>
>>>
>>>

SET MEMORY /INTERLEAVE:(8+9, A)
INITIALIZE
SHOW MEMORY

E
D
C
B
A
9
.
.
.
.
B1 A2
.
.
.
.
64 64
/INTERLEAVE:(8+9, A)

8
A1
64

7
.

6
.
.

5
.
.

4
.
.

3
.
.

2
.
.

1
.
.

NODE #
ILV
192Mb

If an <REFERENCE>(xma2) node fails self-test, then the console executes
an explicit memory test during the building of the bitmap. Failing memory
modules are included in the configuration, although they are interleaved by
themselves. The only way to exclude a memory module from interleaving
is to use the SET MEMORY command without designating the node you
want to exclude. Example 6–3 shows how to exclude the memory module
at node 7.
During the explicit memory test, any number of the following console
messages might be displayed to aid the customer service engineer in
diagnosing the problem.
?37

Explicit interleave list is bad. Configuring
all arrays uninterleaved.

This means that the explicit set of memory arrays for the explicit interleave
includes no nodes that contain memory arrays. All memory arrays found
in the system are unconfigured (the SET MEMORY command may have
specified nodes that did not contain memory modules).
?45
?46

Memory interleave set is inconsistent: n n ...(<REFERENCE>(xyp) msg.)
Memory interleave set is inconsistent: n n ...(<REFERENCE>(XRP) msg.)

This means that the listed nodes (n n) do not form a valid memory interleave
set. One or more of the nodes might not be a memory array or the set
contains an invalid number of memory arrays. Each listed memory array

6–18

VAX 6000 Models 300 and 400 Service Manual

that is valid will be configured uninterleaved; any memory array that is
not included in the set will not be interleaved.
?46
?47

Insufficient working memory for normal operation. (<REFERENCE>(xyp) msg.)
Insufficient working memory for normal operation. (<REFERENCE>(XRP) msg.)

This means that less than 256 Kbytes per processor of working memory
were found. There may be insufficient memory for the console to function
or for the operating system to boot.
?47
?48

Uncorrectable memory errors -- long memory test
must be performed. (<REFERENCE>(xyp) message)
Uncorrectable memory errors -- long memory test
must be performed. (<REFERENCE>(XRP) message)

This means that a memory array contains an unrecoverable error. The
console must perform a slow test to locate all the failing locations. (Slow =
approximately 3 minutes per 32 Mbytes.)
?48
?4A

Memory not interleaved due to Uncorrectable errors. (<REFERENCE>(xyp))
Memory not interleaved due to Uncorrectable errors. (<REFERENCE>(XRP))

This means that the listed arrays would normally have been interleaved
(by default or an explicit request). Because one or more arrays contained
unrecoverable errors, this interleave set will not be constructed.
NOTE: Refer to Appendix A for a list of <REFERENCE>(xyp) console error
messages and Appendix B for a list of <REFERENCE>(XRP) console error
messages.
When self-test has finished running on the module, the yellow LED on the
module lights, indicating that the module has completed self-test. After
self-test, starting and ending addresses are set by the boot processor.
Note that lighting the yellow LED does not mean that memory has passed
self-test but only that self-test completed.

MS65A Memory 6–19

6.11 Memory RBD
RBD 3 of the ROM-based diagnostics sizes memory, runs
extended memory tests, and indicates any failing tests.

Table 6–3: Memory Tests — RBD 3
Test

Function

T00011

Memory Self-Test (13 sec2 3 )

T00024

CSR Addressability Test

T00034

CSR Bit Toggling Test

T00044

Parity Error Detection Test

T00054

Error Detection and Correction Logic Test

T00064

Data Path Test

T00074

Quadword and Octaword Masked Write Logic Test

T00084

Interlock Lock Logic Test

T00091

Interleaving and Address Boundary Test (20 sec2 )

T00101

ECC RAM March Test (20 min2 )

T00111

RAM March Test (9 min–RAM; 17 min–ROM2 )

T00121

RAM Moving Inversions Test (2.5 hrs–RAM; 4.5 hrs–ROM2 )

1 The /C qualifier is required for these tests.
2 Run times are approximate for one 32-Mbyte module.
3 If self-test fails, there is a 60 second timeout.
4 Tests T0002 through T0008 are run by default.

6–20

VAX 6000 Models 300 and 400 Service Manual

Tests T0002 through T0008 are run by default.
Tests T0001 and
T0009 through T0012 must be selected by the user.
Tests are
performed on all <REFERENCE>(XMA2)s unless the user specifies a single
<REFERENCE>(XMA2). Parameters specified in the command line (refer
to Table 6–4) allow one or all memory modules to be tested. These
parameters also allow RBD tests to be run from main memory or ROM
for RBD tests T0011 and T0012. The /C (confirm destructive memory test)
switch is required with RBD tests T0001, T0009, T0010, T0011, and T0012.
Parameters are ignored by tests T0001 through T0010.

Table 6–4: RBD 3 Parameters
KA64A
KA62B
Parameter1 Parameter

Function

00
(or none)

Run tests T0011 and T0012 from main memory (RAM) and
test all memory modules

Run tests T0011 and T0012 from main memory (RAM) and
test memory module n only

Run tests T0011 and T0012 from ROM and test all memory modules

Run tests T0011 and T0012 from ROM and test memory module n only

1 The first character indicates if the tests are run from RAM (0) or ROM (1). The second charac-

ter indicates whether to test all modules (0) or a specific module (n), where n is the memory module backplane slot (must be one of the following: A, 9, 8, 7, 6, 5, B, or C).

NOTE: If you suspect that all of memory is bad, run tests T0011 and T0012
from ROM.
The CPU/memory interaction diagnostic also runs tests that exercise
memory. See Chapter 3 for information on this CPU/memory interaction
diagnostic. See Chapter 2 for more information on running the RBDs.

MS65A Memory 6–21

6.12 Memory RBD Test Examples
RBD 3 sizes memory, runs extended memory tests,
and indicates any failing tests.
Example 6–4 through
Example 6–6 show the use of various qualifiers.
Example 6–4: RBD 3 — Test on All Modules with Halt on Error
>>> T/R

! Command to enter RBD monitor program

RBD3>

! RBD monitor prompt, where 3 is the hexa! decimal node number of the processor
! that is currently receiving your input

RBD3> ST3/TR/HE

! Runs the default <REFERENCE>(XMA2) RBD
! test; test results written to the
! console terminal; tests will halt on
! any hard error found (/HE)

;XMA_RBD
; T0002
;
;

3.00
T0003

S
XX

T0004

3
NO_XMA2

T0005

T0006

T0007

8082
09

1
T0008

T0008

;
P
3
8082
1
;00000000 00000000 00000000 00000000 00000000 00000000 00000000
RBD3>

Example 6–5: RBD 3 — Test with Confirm Switch
RBD3> ST3/TR/T=9:10/C

;XMA_RBD
; T0009

! Runs the <REFERENCE>(XMA2) RBD tests
! T0009 and T0010 only. These are
! destructive tests, so the confirm
! switch is needed. Confirm destructive
! memory test switch (/C) is required
! on tests T0001 and T0009 through T0012.

3.00
T0010

;
P
3
8082
1
;00000000 00000000 00000000 00000000 00000000 00000000 00000000
RBD3>

6–22

VAX 6000 Models 300 and 400 Service Manual

Example 6–6: RBD 3 — Parameter
RBD3> ST3/TR/T=11:12/C 0A

;XMA_RBD
; T0011

! Runs <REFERENCE>(XMA2) RBD tests
! T0011 and T0012 from RAM on the
! the memory module in slot A. Confirm
! destructive memory test switch (/C)
! is required on these tests.

3.00
T0012

[RBD status messages are printed every two minutes;
use the /DS qualifier in the command string to inhibit
these messages.]
;
P
3
8082
1
;00000000 00000000 00000000 00000000 00000000 00000000 00000000
RBD3> QUIT
! Exit from RBD monitor program
?06 Halt instruction executed in kernel mode.
PC = 200601D8
PSL = 041F0604
ISP = 201405B4
>>>

! Console prompt returns

In Example 6–4 note the status message in the display ( 1 ). The message
fields are as follows:
•

S = Status message

•

3 = Node from which the RBD is running

•

8082 = Device type of node from which RBD is running

•

1 = Pass 1

•

XX = Undefined

•

NO_XMA2 = RBD does not perform parts of test 8 on MS65A memories

•

09 = Node where MS65A resides

•

T0008 = Test 8 produced the status message

The RBD completes with the normal pass/fail message. Only test 8, the
Interlock Lock Logic Test, behaves this way; all other tests are run on both
MS62As and MS65As.

MS65A Memory 6–23

6.13 MS65A Control and Status Registers
The memory contains 19 control and status registers (CSRs)
to control the memory and log errors. All CSRs are 32
bits long and respond only to longword read and write
transactions. Only full writes are performed to the CSRs. If
a parity error occurs during a write operation, the operation
is aborted and the contents of the CSRs are unchanged.
The CSRs start at an address dependent upon the node ID. All CSR
addresses are designated as BB + n, where n is the relative offset of the
register.

Table 6–5: <REFERENCE>(xma2) Control and Status Registers
.
CSR Name

Mnemonic

Address

Device Type Register

XDEV

BB1 + 00

Bus Error Register

XBER

BB + 04

Starting and Ending Address Register

SEADR

BB + 10

Memory Control Register 1

MCTL1

BB + 14

Memory ECC Error Register

MECER

BB + 18

Memory ECC Address Register

MECEA

BB + 1C

Memory Control Register 2

MCTL2

BB + 30

TCY Tester Register

TCY

BB + 34

Block State ECC Error Register

BECER

BB + 38

Block State ECC Address Register

BECEA

BB + 3C

Starting Address Register

STADR

BB + 50

Ending Address Register

ENADR

BB + 54

Segment/Interleave Control Register

INTLV

BB + 58

Memory Control Register 3

MCTL3

BB + 5C

Memory Control Register 4

MCTL4

BB + 60

1 "BB" refers to the base address of an <REFERENCE>(XMI) node (2180 0000 + (node ID x

8000))

6–24

VAX 6000 Models 300 and 400 Service Manual

Table 6–5 (Cont.): <REFERENCE>(xma2) Control and Status Registers
CSR Name

Mnemonic

Address

Block State Control Register

BSCTL

BB + 68

Block State Address Register

BSADR

BB + 6C

EEPROM Control Register

EECTL

BB + 70

Timeout Control/Status Register

TMOER

BB + 74

MS65A Memory 6–25

6.14 Mixing MS65A and MS62A Memory Modules
This section discusses the interleaving of MS62A and
<REFERENCE>(xma2) memory modules in Model 300 and
Model 400 systems. For completeness the VAX 6000 Model
200 and the VAX 6000 Model 500 are included.

Table 6–6: Memory Module Configurations
System Type

MS65A

MS62A

Mixed

Model 2001

Yes

Model 3002

Yes

Model 4003

Yes

Model 500

Yes

1 The minimum CPU ROM revision required is 5.00.
2 The minimum CPU ROM revision required is 6.00.
3 The minimum CPU ROM revision required is 3.00.

If <REFERENCE>(xma2)s or a mix of memory modules are used in a Model
200, 300, or 400 system, a ROM upgrade kit is required. The console
and diagnostic ROMs are replaced, so that <REFERENCE>(xma2)s will
be supported. See the footnotes in Table 6–6 for the minimum revisions of
the console and diagnostic ROMs for each type of system.

6–26

VAX 6000 Models 300 and 400 Service Manual

There is no difference between MS62A memory modules and <REFERENCE>(xma2)s as far as interleaving is concerned. The console software
that does the interleaving only recognizes the size difference (number of
Mbytes) of the memory module.
Memory ROM-based diagnostics function with both types of memory
modules. However, since the <REFERENCE>(xma2) has an EEPROM and
the MS62A memory module does not, the RBD does not test the EEPROM
on the <REFERENCE>(xma2). The following <REFERENCE>(xma2)
RBDs will not run on <REFERENCE>(xma2)s installed in Model 200, 300,
or 400 systems.
•

SEADR Register Test

•

Block State Test

•

EEPROM Update Test

Status messages will print on the console terminal stating that the
diagnostic test does not run.

MS65A Memory 6–27

Chapter 7

DWMBB I/O Adapter
This chapter discusses the DWMBB adapter, the interface to an optional
VAXBI I/O channel. Sections include:
•

Physical Description
Physical Layout
Specifications

•

Configuration Rules

•

Functional Description

•

Registers

DWMBB I/O Adapter

7–1

7.1 DWMBB Physical Description
7.1.1 Physical Layout
The <REFERENCE>(xbia) is an XMI module (T2018) with the
standard XMI Corner, an XMI self-test OK LED indicator,
IBUS drivers/receivers and transceivers, timeout logic, and
a gate array that controls the <REFERENCE>(xbia). Most
of the components on the <REFERENCE>(xbia) are surfacemounted.

Figure 7–1: <REFERENCE>(XBIA_TITLE)
GATE ARRAY

YELLOW
SELF-TEST
LED

XMI
CORNER

ZIF
CONNECTOR
SEGMENTS

msb-0060-88

7–2

VAX 6000 Models 300 and 400 Service Manual

The <REFERENCE>(XBIB) is a standard VAXBI (T1043)
module with a VAXBI Corner, including a BIIC interface
chip, the primary interface between the VAXBI bus and
the <REFERENCE>(XBIB) node logic, a clock driver, and a
clock receiver. The <REFERENCE>(XBIB) gate array is used
mostly for data path logic. The VAXBI self-test OK LED is on
the VAXBI Corner, and the module self-test OK LED is at the
module edge opposite the connector edge.

Figure 7–2: <REFERENCE>(XBIB_TITLE)
MASTER
SEQUENCER

VAXBI
CORNER

YELLOW
SELF-TEST
LED
BIIC

SLAVE
SEQUENCER
YELLOW
SELF-TEST
LED

GATE
ARRAY

CLOCK
RECEIVER
ZIF
CONNECTOR
SEGMENTS

CLOCK
DRIVER

msb-0061-89

DWMBB I/O Adapter

7–3

7.1.2 Specifications
The following specifications apply to the DWMBB modules.

Table 7–1: DWMBB/A Specifications
Parameter

Description

Module Number:

T2018

Dimensions:

23.3 cm (9.2") H x 0.23 cm (0.093") W x 28.0 cm (11.0") D

Temperature:
Storage Range

-40o C to 66o C (-40o F to 151o F)

Operating Range

5o C to 50o C (41o F to 122o F)

Relative Humidity:
Storage and operating

10% to 95% noncondensing

Altitude:
Storage

Up to 4.8 km (16,000 ft)

Operating

Up to 2.4 km (8000 ft)

Current:

6A at +5V

Power:

16W

7–4

VAX 6000 Models 300 and 400 Service Manual

Table 7–2: DWMBB/B Specifications
Parameter

Description

Module Number:

T1043

Dimensions:

20.3 cm (8") H x 0.23 cm (0.093") W x 23.3 cm (9.2") D

Temperature:
Storage Range

-40o C to 66o C (-40o F to 151o F)

Operating Range

5o C to 50o C (41o F to 122o F)

Relative Humidity:
Storage and operating

10% to 95% noncondensing

Altitude:
Storage

Up to 4.8 km (16,000 ft)

Operating

Up to 2.4 km (8000 ft)

Current:

6A at +5V
10mA at -12V

Power:

30W

Table 7–3: <REFERENCE>(xbi_plus) Cables
Part Number

Description

17-01569-01

DWMBB to H7206-B power OK cable

17-01897-01

15’ DWMBB cables for expander cabinet, from XMI slots 1, 2, 3, and
4 as needed (segments D and E) to VAXBI cages 2, 3, 4, and 5 (segments D and E). Two per DWMBB.

17-01897-02

7" DWMBB cables, from XMI slot E (segments D and E) to VAXBI cage 1
slot 1 (segments D and E). Two per DWMBB.

DWMBB I/O Adapter

7–5

7.2 <REFERENCE>(xbi_plus) Configuration Rules
This section describes the configuration rules for the
DWMBB/A module in the XMI card cage and for the
DWMBB/B module in the VAXBI card cage.

Figure 7–3: VAX 6000 Slot Numbers
XMI CARD CAGE

VAXBI CARD CAGE

12 11 10 9 8 7

5 4 3

D C B A 9

7 6 5 4 3

msb-0040B-90

7–6

VAX 6000 Models 300 and 400 Service Manual

<REFERENCE>(XBIA) modules are placed in the order shown in
Table 7–4.

Table 7–4: <REFERENCE>(xbi_plus) Configuration
<REFERENCE>(XMI) Node
No.
VAXBI Channel

Location

System cabinet

Expander cabinet

Configuration rules are as follows:
•

The first VAXBI channel is the 12-slot channel in the system cabinet.
The DWMBB/A module is placed in XMI slot E; the corresponding
DWMBB/B module is placed in the system VAXBI cage, slot 1 (the
rightmost slot). See Figure 7–3.

•

Any additional VAXBI channels are 6-slot channels in the expander
cabinet. The DWMBB/B module is placed in slot 1 of each. The
corresponding DWMBB/A module is placed in the XMI slot listed in
Table 7–4.

DWMBB I/O Adapter

7–7

7.3 DWMBB Functional Description
The <REFERENCE>(xbi_plus) adapter provides an information path between the <REFERENCE>(XMI) bus and I/O devices on the VAXBI bus. The <REFERENCE>(xbi_plus) consists of two modules: the <REFERENCE>(XBIA) and the
<REFERENCE>(XBIB). The <REFERENCE>(XBIA) resides on
the <REFERENCE>(XMI) bus, and the <REFERENCE>(XBIB)
resides on the VAXBI bus. Four 30-pin cables, which make
up the IBUS, connect the two modules.

Figure 7–4: <REFERENCE>(XBI_TITLE) Block Diagram

VAXBI
CORNER
(BIIC)
DWMBB/A
MODULE
LOGIC

XMI
CORNER

T2018 MODULE

IBUS

DWMBB/B
MODULE
LOGIC

T1043 MODULE

XMI

VAXBI
msb-0062A-90

7–8

VAX 6000 Models 300 and 400 Service Manual

The <REFERENCE>(XBIA) contains the <REFERENCE>(XMI) Corner,
the register files, <REFERENCE>(XMI) required registers, <REFERENCE>(XBIA)specific registers, page map registers, and the control sequencers for the
<REFERENCE>(XMI) interface.
The <REFERENCE>(XBIB) contains the BIIC interface chip, interconnect
drivers, control sequencers to handle the control of the data transfer, status
bits to and from the <REFERENCE>(XBIA) module’s register files and
the BIIC, <REFERENCE>(XBIB)-specific registers, decode logic for direct
memory access (DMA) operation, and VAXBI clock-generation circuitry.
The <REFERENCE>(XBIA) and <REFERENCE>(XBIB) modules are
connected by four cables of 30 wires each. These 120 wires make up
the IBUS, which transfers data and control information between the two
modules.
The <REFERENCE>(xbi_plus) uses I/O and DMA transactions to exchange
information. I/O transactions originate from the <REFERENCE>(XYP)
or <REFERENCE>(XRP) module(s) and are presented to the <REFERENCE>(xbi_plus) from the <REFERENCE>(XMI) bus with the processor as
the <REFERENCE>(XMI) commander and the <REFERENCE>(xbi_plus)
as the <REFERENCE>(XMI) responder.
DMA transactions originate from VAXBI nodes that select the <REFERENCE>(xbi_plus) as the VAXBI slave. These are read or write transactions
targeted to <REFERENCE>(XMI) memory space or are VAXBI-generated
interrupt transactions that target a <REFERENCE>(xyp) or <REFERENCE>(XRP) module. For DMA transactions, the <REFERENCE>(xbi_
plus) is the <REFERENCE>(XMI) commander, and the <REFERENCE>(XMA)
module is the <REFERENCE>(XMI) responder.
The <REFERENCE>(xbi_plus) can be both a master and a slave on
the VAXBI. As a master, it carries out transactions requested by
its <REFERENCE>(XMI) devices. As a slave, it responds to VAXBI
transactions that select its node.

DWMBB I/O Adapter

7–9

7.4 <REFERENCE>(xbi_plus) Tests — RBD 2
The <REFERENCE>(xbi_plus) ROM-based diagnostic, RBD
2, checks functions of both <REFERENCE>(xbi_plus)
modules. RBD 2 tests the <REFERENCE>(xbi_plus) modules
and can trace the subtests, pinpointing errors.

Example 7–1: <REFERENCE>(xbi_plus) Tests — RBD 2
>>> T/R

! Command to enter RBD monitor program

RBD1>

! RBD monitor prompt, where 1 is the
! hexadecimal node number of the
! processor that is currently receiving
! your input.

RBD1> ST2/TR E 1

! Runs the DWMBB RBD, testing
! the DWMBB at XMI node number E. Test
! results written to the console
! terminal:

;XBI_TEST

3.00

; T0001
; T0016

T0006
T0018

T0005
T0017

T0007
T0019

T0008
T0020

T0009
T0021

T0012
T0022

;
P 2
1
8082
1 3
;000000000 00000000 00000000 00000000 00000000
RBD1> ST2/TR/T=1:26 E 4

;XBI_TEST

3.00

; T0001
; T0011
; T0021

T0003
T0013
T0023

T0002
T0012
T0022

;
P
;000000000

7–10

1
00000000

T0013
T0023

T0014
T0024

00000000

T0015
T0025

00000000

! Runs the DWMBB RBD, testing
! the DWMBB at XMI node number E. Test
! results written to the console
! terminal:

T0004
T0014
T0024

T0005
T0015
T0025

8082
00000000

T0006
T0016
T0026

1
00000000

T0007
T0017

00000000

T0008
T0018

T0009
T0019

00000000

VAX 6000 Models 300 and 400 Service Manual

T0010
T0020

00000000

The <REFERENCE>(xbi_plus) has no on-board self-test.
The boot
processor ROM code tests <REFERENCE>(xbi_plus)s during additional
power-up tests.
At power-up, the boot processor first sizes all
<REFERENCE>(xbi_plus)s and then serially tests each one.
1

When invoking RBD 2 from the monitor, the START command requires
a parameter. This parameter is the XMI node number (hexadecimal)
of the <REFERENCE>(xbia_plus) module of the <REFERENCE>(xbi_
plus) to be tested.

This diagnostic ran successfully.

One pass was completed.

This command runs all the tests in RBD 2.

DWMBB I/O Adapter

7–11

7.5 DWMBB Tests — RBD 2 Subtests
RBD 2 consists of 26 tests, as shown in Table 7–5.

Table 7–5: <REFERENCE>(xbi_plus_title) RBD Tests
Test

Function

Default

T0001

DWMBB/A CSR Test

Yes

T0002

<REFERENCE>(XMI) Low Longword Parity Error Test

T0003

<REFERENCE>(XMI) High Longword Parity Error Test

T0004

<REFERENCE>(XMI) Function and ID Parity Error Test

T0005

<REFERENCE>(xbib_plus) CSR Test

Yes

T0006

BIIC VAXBI Loopback Transaction Test

Yes

T0007

BIIC VAXBI Transaction Test

Yes

T0008

DMA Test

Yes

T0009

DMA Buffer Test

Yes

T0010

XMI Parity Error Interrupt Test

T0011

Write Sequence Error Interrupt Test

T0012

CPU Buffer C/A Fetch Parity Error (Interrupt) Test

Yes

T0013

CPU Buffer Data Fetch Parity Error (Interrupt) Test

Yes

T0014

DMA Buffer Data Fetch Parity Error (Interrupt) Test

Yes

T0015

VAXBI Interlock Read Error (Interrupt) Test

Yes

T0016

DMA-A Buffer C/A Load Parity Error (Interrupt) Test

Yes

T0017

DMA-A Buffer Data Load Parity Error (IVINTR) Test

Yes

T0018

DMA-B Buffer C/A Load Parity Error (Interrupt) Test

Yes

T0019

DMA-B Buffer Data Load Parity Error (IVINTR) Test

Yes

T0020

CPU Buffer Data Load Parity Error (Interrupt) Test

Yes

T0021

BCI Parity Error Test

Yes

T0022

Nonexistent Memory (Interrupt) Test

Yes

T0023

CRD Error (Interrupt) Test

Yes

7–12

VAX 6000 Models 300 and 400 Service Manual

Table 7–5 (Cont.): <REFERENCE>(xbi_plus_title) RBD Tests
Test

Function

Default

T0024

VAXBI Interrupt Test

Yes

T0025

VAXBI IP Interrupt Test

Yes

T0026

No Stall Timeout Test

Yes

DWMBB I/O Adapter

7–13

7.6 <REFERENCE>(xbi_plus) Registers
Two sets of registers are used by the <REFERENCE>(xbi_
plus) adapter: VAXBI registers (residing in the BIIC) and
<REFERENCE>(xbi_plus) registers (residing on both modules of the <REFERENCE>(xbi_plus)). The <REFERENCE>(xbi_
plus) registers include the <REFERENCE>(XMI) required
registers and <REFERENCE>(xbi_plus)-specific registers addressed in <REFERENCE>(xbi_plus) private space.

Table 7–6: VAXBI Registers
Name

Mnemonic

Address1

Device Register

DTYPE

bb+00

VAXBI Control and Status Register

VAXBICSR

bb+04

Bus Error Register

BER

bb+08

Error Interrupt Control Register

EINTRSCR

bb+0C

Interrupt Destination Register

INTRDES

bb+10

IPINTR Mask Register

IPINTRMSK

bb+14

Force-Bit IPINTR/STOP Destination Register

FIPSDES

bb+18

IPINTR Source Register

IPINTRSRC

bb+1C

Starting Address Register

SADR

bb+20

Ending Address Register

EADR

bb+24

BCI Control and Status Register

BCICSR

bb+28

Write Status Register

WSTAT

bb+2C

Force-Bit IPINTR/STOP Command Register

FIPSCMD

bb+30

User Interface Interrupt Control Register

UINTRCSR

bb+40

General Purpose Register 0

GPR0

bb+F0

General Purpose Register 1

GPR1

bb+F4

General Purpose Register 2

GPR2

bb+F8

General Purpose Register 3

GPR3

bb+FC

1 The abbreviation "bb" refers to the base address of a VAXBI node (the address of the first lo-

cation of nodespace).

7–14

VAX 6000 Models 300 and 400 Service Manual

Table 7–6 lists the VAXBI registers. The VAXBI registers are described
in Chapter 5 of the VAXBI Options Handbook. Table 7–7 lists the
<REFERENCE>(xbi_plus) registers.

Table 7–7: <REFERENCE>(xbi_plus) XMI Registers
Name

Mnemonic1

Address2

Device Register

XDEV

BB+00

Bus Error Register

XBER

BB+04

Failing Address Register

XFADR

BB+08

Responder Error Address Register

AREAR

BB+0C

Error Summary Register

AESR

BB+10

Interrupt Mask Register

AIMR

BB+14

Implied Vector Interrupt Destination/Diagnostic
Register

AIVINTR

BB+18

Diagnostic 1 Register

ADG1

BB+1C

Utility Register

AUTLR

BB+20

Control and Status Register

ACSR

BB+24

Return Vector Register

ARVR

BB+28

XMI Failing Address Extension Register

XFAER

BB+2C

VAXBI Error Address Register

ABEAR

BB+30

Control and Status Register

BCSR

BB+40

Error Summary Register

BESR

BB+44

Interrupt Destination Register

BIDR

BB+48

Timeout Address Register

BTIM

BB+4C

Vector Offset Register

BVOR

BB+50

Vector Register

BVR

BB+54

Diagnostic Control Register 1

BDCR1

BB+58

Reserved Register

BRSVD

BB+5C

1 If the first letter of the mnemonic is "X" or "A," it indicates that the register resides on the <REFERENCE>(XBIA) module; a first letter of "B" indicates that the register resides on the <REFERENCE>(XBIB) module.
2 The abbreviation "BB" refers to the base address of an <REFERENCE>(XMI) node (the address of the first location of nodespace).

DWMBB I/O Adapter

7–15

Table 7–7 (Cont.): <REFERENCE>(xbi_plus) XMI Registers
Name

Mnemonic1

Address2

Page Map Register (first location)

PMR

BB+200

PMR

BB+401FC

.
.
.
Page Map Register (last location)

7–16

VAX 6000 Models 300 and 400 Service Manual

Appendix A

Console Error Messages for Model 300
Table A–1 lists messages ?02 through ?1F which appear when the processor
halts and the console gains control. Each message is followed by a "PC =
xxxxxxxx" message giving the address where the processor was executing
when it halted; these messages designate the reasons for the halt.
Table A–2 lists the standard console error messages ?20 through ?7C.

Table A–1: Model 300 Console Error Messages Indicating Halt
Error Message

Meaning

?02 External halt.

CTRL-P

or STOP command.

?04 Interrupt stack not valid.

Interrupt stack pointer contained an invalid address.

?05 Machine check during exception.

A machine check occurred while handling another error condition.

?06 Halt instruction executed.

The CPU
tion.

?07 SCB vector bits <1:0> = 11.

An interrupt or exception vector in the
System Control Block contained an invalid address.

?08 SCB vector bits <1:0> = 10.

An interrupt or exception vector in the
System Control Block contained an invalid address.

?0A CHMx executed while on interrupt stack.

A change-mode instruction was issued
while executing on the interrupt stack.

?0B CHMx to interrupt stack.

The System Control Block vector for a
change-mode instruction indicated service on the interrupt stack.

?0C SCB read error.

The System Control Block was not accessible in memory.

?10 ACV or TNV during machine check.

An access violation or translation-notvalid error occurred while handling another error condition.

executed

Halt

instruc-

Console Error Messages for Model 300 A–1

Table A–1 (Cont.): Model 300 Console Error Messages Indicating Halt
Error Message

Meaning

?11 ACV or TNV during KSP not valid.

An access violation or translation-notvalid error occurred while handling another error condition.

?12 Machine check during machine check.

A machine check occurred while handling another error condition.

?13 Machine check during KSP not valid.

A machine check occurred while handling another error condition.

?19 PSL <26:24>= 101 during interrupt
or exception.

An exception or interrupt occurred while
on the interrupt stack but not in kernel mode.

?1A PSL <26:24>= 110 during interrupt
or exception.

An exception or interrupt occurred while
on the interrupt stack but not in kernel mode.

?1B PSL <26:24>= 111 during interrupt
or exception.

An exception or interrupt occurred while
on the interrupt stack but not in kernel mode.

?1D PSL <26:24> = 101 during REI.

An REI instruction attempted to restore a PSL with an invalid combination of access mode and interrupt stack bits.

?1E PSL <26:24> = 110 during REI.

An REI instruction attempted to restore a PSL with an invalid combination of access mode and interrupt stack bits.

?1F PSL <26:24> = 111 during REI.

An REI instruction attempted to restore a PSL with an invalid combination of access mode and interrupt stack bits.

A–2

VAX 6000 Models 300 and 400 Service Manual

Table A–2: Model 300 Standard Console Error Messages
Error Message

Meaning

?20 Illegal memory reference.

An attempt was made to reference a virtual address (/V) that is either unmapped or is protected against access under the current PSL.

?21 Illegal command.

The command was not recognized, contained the wrong number of parameters, or contained unrecognized or inappropriate qualifiers.

?22 Illegal address.

The specified address was recognized as
being invalid, for example, a general purpose register number greater than 15.

?23 Value is too large.

A parameter or qualifier value contained too many digits.

?24 Conflicting qualifiers.

A command specified recognized qualifiers that are illegal in combination.

?25 Checksum did not match.

The checksum calculated for a block of X
command data did not match the checksum received.

?26 Halted.

The processor is currently halted.

?27 Item was not found.

The item requested in a FIND command could not be found.

?28 Timeout while waiting for characters.

The X command failed to receive a full
block of data within the timeout period.

?29 Machine check accessing memory.

Either the specified address is not implemented by any hardware in the system, or an attempt was made to write
a read-only address, for example, the address of the 33rd Mbyte of memory on a 32-Mbyte system.

?2A Unexpected machine check or
interrupt.

A valid operation within the console
caused a machine check or interrupt.

?2B Command is not implemented.

The command is not implemented by this
console.

?2C Unexpected exception.

A valid operation within the console
caused an exception.

Console Error Messages for Model 300 A–3

Table A–2 (Cont.): Model 300 Standard Console Error Messages
Error Message

Meaning

?2D For Secondary Processor n

This message is a preface to second message describing some error related to a secondary processor. This message indicates which secondary processor is involved.

?2E Specified node is not an I/O adapter.

The referenced node is incapable of performing I/O or did not pass its selftest.

?30 Write to Z command target has timed out.

The target node of the Z command is not
responding.

?31 Z connection terminated by ^P.

A CTRL/P was typed on the
board to terminate a Z command.

?32 Your node is already part of a Z connection.

You cannot issue a Z command while executing a Z command.

?33 Z connection successfully started.

You have requested a Z connection to a
valid node.

?34 Specified target already has a Z connection.

The target node was the target of a previous Z connection that was improperly terminated. Reset the system to clear this
condition.

?36 Command too long.

The command length exceeds 80 characters.

?37 Explicit interleave list is bad.
Configuring all arrays uninterleaved.

The list of memory arrays for explicit interleave includes no nodes that
are actually memory arrays.
All arrays found in the system are configured.

?38 Waiting for a CR to terminate the command.

The command has not yet been issued by a carriage return.

?39 Console patches are not useable.

The console patch area in EEPROM
is corrupted or contains a patch revision that is incompatible with the console ROM.

?3B Error
tion.

A–4

encountered

during

I/O

opera-

key-

An I/O adapter returned an error status
while the console boot primitive was performing I/O.

VAX 6000 Models 300 and 400 Service Manual

Table A–2 (Cont.): Model 300 Standard Console Error Messages
Error Message

Meaning

?3C Secondary processor not in console mode.

The primary processor console needed to
communicate with a secondary processor, but the secondary processor was not
in console mode. STOP the node or reset the system to clear this condition.

?3D Error initializing I/O device.

A console boot primitive needed to perform I/O, but could not initialize the I/O
adapter.

?3E Timeout while sending message to
secondary.

A secondary processor failed to respond to a message sent from the primary.
The primary sends such messages to perform console functions on secondary processors.

?3F Key switch must be at "Update" to
update EEPROM.

A SET command needs to update the EEPROM, but the key switch is not set to allow updates.

?40 Specified node is not a bus adapter.

A command that accesses a VAXBI node
specified an XMI node that was not a bus
adapter.

?41 Invalid terminal speed.

The SET TERMINAL command specified an unsupported baud rate.

?42 Unable to initialize node.

The INITIALIZE command failed to reset the specified node.

?43 Processor is not enabled to BOOT or START.

As a result of a SET CPU/NOENABLE
command, the processor is disabled from
leaving console mode.

?44 Unable to stop node.

The STOP command failed to halt the
specified node.

?45 Memory interleave set is
inconsistent: n n ...

The listed nodes do not form a valid memory interleave set.
One or more of
the nodes might not be a memory array, or the set could contain an invalid number of members. Each listed array that is a valid memory will be configured uninterleaved.

Console Error Messages for Model 300 A–5

Table A–2 (Cont.): Model 300 Standard Console Error Messages
Error Message

Meaning

?46 Insufficient working memory for normal operation.

Less than 256 Kbytes per processor of
working memory were found. There is insufficient memory for the console to function normally or for the operating system to boot.

?47 Uncorrectable memory errors—long memory test must be performed.

A memory array contains an unrecoverable error.
The console must perform a slow test to locate all the failing locations.

?49 Memories not interleaved due to
uncorrectable errors:

The listed arrays would normally have
been interleaved (by default or explicit request). Because one or more of them contained unrecoverable errors, this interleave set will not be constructed.

?4A Internal logic error in console.

The console encountered
cally impossible condition.

?4B Invalid node for Z command.

The target of a Z command must be a CPU
or an I/O adapter and must not be the primary processor.

?4C Invalid node for new primary.

The SET CPU command failed when attempting to make the specified node the
primary processor.

?4D Specified node is not a processor.

The specified node is not a processor, as required by the command.

?4E System serial number has not been
initialized.

No CPU in the system contains a valid
system serial number.

?4F System serial number not initialized on
primary processor.

The primary processor has an uninitialized system serial number. All other processors in the system contain a valid serial number.

?50 Secondary processor returned bad
response message.

A secondary processor returned an unintelligible response to a request made
by the console on the primary processor.

?51 ROM revision mismatch. Secondary
processor has revision x.y.

The revision of console ROM of a secondary processor does not match the primary.

A–6

VAX 6000 Models 300 and 400 Service Manual

theoreti-

Table A–2 (Cont.): Model 300 Standard Console Error Messages
Error Message

Meaning

?52 EEPROM header is corrupted.

The EEPROM header has been corrupted.
The EEPROM must be restored from the TK tape drive.

?53 EEPROM revision mismatch.
Secondary processor has revision x.y/x.y.

A secondary processor has a different revision of EEPROM or has a different set of EEPROM patches installed.

?54 Failed to locate EEPROM area.

The EEPROM did not contain a set of
data required by the console. The EEPROM may be corrupted.

?55 Console parameters on secondary processor do not match primary.

Console parameters do not match on the
primary and secondary processors.

?56 EEPROM area checksum error.

A portion of the EEPROM is corrupted.
It may be necessary to reload the EEPROM from the TK tape drive.

?57 Saved boot specifications on secondary processor do not match primary.

Saved boot specifications do not match
on the primary and secondary processors.

?58 Invalid unit number.

A BOOT or SET BOOT command specifies a unit number that is not a valid hexadecimal number between 0 and FF.

?59 System serial number mismatch.
Secondary processor has xxxxxxxx.

The indicated serial number of a secondary processor does not match the primary.

?5A Unknown type of boot device.

The console program does not have a boot
primitive to support the specified type
of device or the device could not be accessed to determine its type.

?5B No HELP is available.

The HELP command is not supported
when the console language is set to International.

?5C No such boot spec found.

The specified saved boot specification was
not found in the EEPROM.

?5D Saved boot spec table full.

The maximum number of saved boot specifications has already been stored.

Console Error Messages for Model 300 A–7

Table A–2 (Cont.): Model 300 Standard Console Error Messages
Error Message

Meaning

?5E EEPROM header version mismatch.

The primary and a secondary processor have different versions of the EEPROM. The requested operation cannot be performed.

?5F Bad transfer length.

The primary processor attempted to send
EEPROM data to a secondary processor using an invalid length.

?60 EEPROM header or area has
bad format.

All or part of the EEPROM contains inconsistent data and is probably corrupted. Reload the EEPROM from the TK
tape.

?61 Illegal node number.

The specified node number is invalid.

?62 Unable to locate console tape device.

The console could not locate the I/O
adapter that controls the TK tape.

?63 Operation only applies to secondary
processors.

The command can only be directed at a
secondary processor.

?64 Insufficient memory to buffer EEPROM
image.

The SAVE, RESTORE, and PATCH EEPROM commands require working memory, but not enough was found.

?65 Validation of EEPROM tape image failed.

The image on tape is corrupted or
is not the result of a SAVE EEPROM command. The image cannot be restored.

?66 Read of EEPROM image from tape failed.

The EEPROM image was not successfully read from tape.

?67 Validation of local EEPROM failed.

For a PATCH EEPROM operation, the
EEPROM must first contain a valid image before it can be patched. For a RESTORE EEPROM operation, the image was written back to EEPROM
but could not be read back successfully.

?68 EEPROM not changed.

The EEPROM contents were not changed.

?69 EEPROM changed successfully.

The EEPROM contents were successfully patched or restored.

A–8

VAX 6000 Models 300 and 400 Service Manual

Table A–2 (Cont.): Model 300 Standard Console Error Messages
Error Message

Meaning

?6A Error changing EEPROM.

An error occurred in writing to the EEPROM. The EEPROM contents may be corrupted.

?6B EEPROM saved to tape successfully.

The EEPROM contents were successfully written to the TK tape.

?6C EEPROM not saved to tape.

The EEPROM contents were not completely written to the TK tape.

?6D EEPROM Revision = x.x/y.y.

The EEPROM contents are at revision x.x with revision y.y patches.

?6E Major revision mismatch between tape
image and EEPROM.

The TK tape contains an EEPROM image with a major revision different from
that found in the EEPROM. The image cannot be restored.

?6F Tape image Revision = x.x/y.y.

The EEPROM image on the TK tape is
at revision x.x with revision y.y patches.

?74

CONSOLE_LIMIT value too small for
proper operation. Value ignored.

?75

Error writing to tape. Tape may be writelocked.

?83

See Loading system software below.

?84

See Failure below.

?85

See Restarting system software below.

?B0

See Initializing system below.

Failure.

The console failed in a restart or boot operation. Shows as ?84 in SET LANGUAGE INTERNATIONAL mode.

Initializing system.

The console is resetting the system in response to a BOOT command.
Shows
as ?B0 in SET LANGUAGE INTERNATIONAL mode.

Console Error Messages for Model 300 A–9

Table A–2 (Cont.): Model 300 Standard Console Error Messages
Error Message

Meaning

Loading system software.

The console is attempting to load the operating system in response to a BOOT command, power-up, or restart failure. Shows
as ?83 in SET LANGUAGE INTERNATIONAL mode.

Node: n ?xx

Error message ?xx was generated on secondary processor n and was passed
to the primary processor to be displayed.

Restarting system software.

The console is attempting to restart the inmemory copy of the operating system following a power-up or serious error. Shows as ?85 in SET LANGUAGE INTERNATIONAL mode.

A–10

VAX 6000 Models 300 and 400 Service Manual

Appendix B

Console Error Messages for Model 400
Table B–1 lists Model 400 messages that appear when the processor halts
and the console gains control. Most messages are followed by:
•

PC = xxxxxxxx — program counter = address at which the processor
halted or the exception occurred

•

PSL = xxxxxxxx — processor status longword = contents of the register

•

–SP = xxxxxxxx — –SP is one of the following:
ESP executive stack pointer
ISP interrupt stack pointer
KSP kernel stack pointer
SSP supervisor stack pointer
USP user stack pointer

Table B–2 lists other console error messages.

Table B–1: Model 400 Console Error Messages Indicating Halt
Error Message

Meaning

?02 External halt (CTRL/P, break, or external halt).

CTRL/P

or STOP command.

?03 Power-up halt.

System has powered up, had a system reset, or an XMI node reset.

?04 Interrupt stack not valid during exception processing.

Interrupt stack pointer contained an invalid address.

?05 Machine check occurred during exception processing.

A machine check occurred while handling another error condition.

?06 Halt instruction executed in kernel mode.

The CPU
tion.

?07 SCB vector bits <1:0> = 11.

An interrupt or exception vector in the
System Control Block contained an invalid address.

executed

Halt

instruc-

Console Error Messages for Model 400 B–1

Table B–1 (Cont.): Model 400 Console Error Messages Indicating Halt
Error Message

Meaning

?08 SCB vector bits <1:0> = 10.

An interrupt or exception vector in the
System Control Block contained an invalid address.

?0A CHMx executed while on interrupt stack.

A change-mode instruction was issued
while executing on the interrupt stack.

?10 ACV/TNV occurred during machine check
processing.

An access violation or translation-notvalid error occurred while handling another error condition.

?11 ACV/TNV occurred during kernel-stack-notvalid processing.

An access violation or translation-notvalid error occurred while handling another error condition.

?12 Machine check occurred during machine
check processing.

A machine check occurred while processing a machine check.

?13 Machine check occurred during kernel-stacknot-valid processing.

A machine check occurred while handling another error condition.

?19 PSL <26:24>= 101 during interrupt
or exception.

An exception or interrupt occurred while
on the interrupt stack but not in kernel mode.

?1A PSL <26:24>= 110 during interrupt
or exception.

An exception or interrupt occurred while
on the interrupt stack but not in kernel mode.

?1B PSL <26:24>= 111 during interrupt
or exception.

An exception or interrupt occurred while
on the interrupt stack but not in kernel mode.

?1D PSL <26:24> = 101 during REI.

An REI instruction attempted to restore a PSL with an invalid combination of access mode and interrupt stack bits.

?1E PSL <26:24> = 110 during REI.

An REI instruction attempted to restore a PSL with an invalid combination of access mode and interrupt stack bits.

?1F PSL <26:24> = 111 during REI.

An REI instruction attempted to restore a PSL with an invalid combination of access mode and interrupt stack bits.

B–2

VAX 6000 Models 300 and 400 Service Manual

Table B–2: Model 400 Standard Console Error Messages
Error Message

Meaning

?20 Illegal memory reference.

An attempt was made to reference a virtual address (/V) that is either unmapped or is protected against access under the current PSL.

?21 Illegal command.

The command was not recognized, contained the wrong number of parameters, or contained unrecognized or inappropriate qualifiers.

?22 Illegal address.

The specified address was recognized as
being invalid, for example, a general purpose register number greater than 15.

?23 Value is too large.

A parameter or qualifier value contained too many digits.

?24 Conflicting qualifiers.

A command specified recognized qualifiers that are illegal in combination.

?25 Checksum did not match.

The checksum calculated for a block of X
command data did not match the checksum received.

?26 Halted.

The processor is currently halted.

?27 Item was not found.

The item requested in a FIND command could not be found.

?28 Timeout while waiting for characters.

The X command failed to receive a full
block of data within the timeout period.

?29 Machine check accessing memory.

?2A Unexpected machine check or
interrupt.

A valid operation within the console
caused a machine check or interrupt.

?2B Command is not implemented.

The command is not implemented by this
console.

?2C Unexpected exception.

An attempt was made to examine either a nonexistent IPR or an unimplemented register in RSSC address range
(20140000—20140800).

Console Error Messages for Model 400 B–3

Table B–2 (Cont.): Model 400 Standard Console Error Messages
Error Message

Meaning

?2D For Secondary Processor n.

This message is a preface to second message describing some error related to a secondary processor. This message indicates which secondary processor is involved.

?2E Specified node is not an I/O adapter.

The referenced node is incapable of performing I/O or did not pass its selftest.

?30 Write to Z command target has timed out.

The target node of the Z command is not
responding.

?31 Z connection terminated by ^P.

A CTRL/P was typed on the
board to terminate a Z command.

?32 Your node is already part of a Z
connection.

You cannot issue a Z command while executing a Z command.

?33 Z connection successfully started.

You have requested a Z connection to a
valid node.

?34 Specified target already has a Z
connection.

The target node was the target of a previous Z connection that was improperly terminated. Reset the system to clear this
condition.

?36 Command too long.

The command length exceeds 80 characters.

?37 Explicit interleave list is bad.
Configuring all arrays uninterleaved.

The list of memory arrays for explicit interleave includes no nodes that
are actually memory arrays.
All arrays found in the system are configured.

?39 Console patches are not usable.

The console patch area in EEPROM
is corrupted or contains a patch revision that is incompatible with the console ROM.

?3B Error encountered during I/O
operation.

An I/O adapter returned an error status
while the console boot primitive was performing I/O.

B–4

VAX 6000 Models 300 and 400 Service Manual

key-

Table B–2 (Cont.): Model 400 Standard Console Error Messages
Error Message

Meaning

?3C Secondary processor not in console mode.

The primary processor console needed to
communicate with a secondary processor, but the secondary processor was not
in console mode. STOP the node or reset the system to clear this condition.

?3D Error initializing I/O device.

A console boot primitive needed to perform I/O, but could not initialize the I/O
adapter.

?3E Timeout while sending message to
secondary processor.

A secondary processor failed to respond to a message sent from the primary.
The primary sends such messages to perform console functions on secondary processors.

?3F Microcode power-up self-test failed
in REX520.

Model 400 CPU chip failed its microcoded self-test.

?40 Key switch must be at "Update" to
update EEPROM.

A SET command was issued, but the
key switch was not set to allow updates to the EEPROM.

?41 Specified node is not a bus adapter.

A command to access a VAXBI node specified an XMI node that was not a bus
adapter.

?42 Invalid terminal speed.

The SET TERMINAL command specified an unsupported baud rate.

?43 Unable to initialize node.

The INITIALIZE command failed to reset the specified node.

?44 Processor is not enabled to BOOT or START.

As a result of a SET CPU/NOENABLE
command, the processor is disabled from
leaving console mode.

?45 Unable to stop node.

The STOP command failed to halt the
specified node.

?46 Memory interleave set is
inconsistent: n n ...

The listed nodes do not form a valid memory interleave set.
One or more
of the nodes might not be a memory array or might be of a different size, or the set could contain an invalid number of members. Each listed array that is a valid memory will be configured uninterleaved.

Console Error Messages for Model 400 B–5

Table B–2 (Cont.): Model 400 Standard Console Error Messages
Error Message

Meaning

?47 Insufficient working memory for normal operation.

Less than 256 Kbytes per processor of
working memory were found. There is insufficient memory for the console to function normally or for the operating system to boot.

?48 Uncorrectable memory errors—long memory test must be performed.

A Model 400 memory array contains
an unrecoverable error.
The console must perform a slow test to locate all the failing locations.

?49 Memory cannot be initialized.

The specified operation was attempted
and prevented.

?4A Memories not interleaved due to
uncorrectable errors:

The listed arrays would normally have
been interleaved (by default or explicit request). Because one or more of them contained unrecoverable errors, this interleave set will not be constructed.

?4B Internal logic error in console.

The console encountered
cally impossible condition.

?4C Invalid node for Z command.

The target of a Z command must be a CPU
or an I/O adapter and must not be the primary processor.

?4D Invalid node for new primary.

The SET CPU command failed when attempting to make the specified node the
primary processor.

?4E Specified node is not a processor.

The specified node is not a processor, as required by the command.

?4F System serial number has not been
initialized.

No CPU in the system contains a valid
system serial number.

?50 System serial number not initialized on
primary processor.

The primary processor has an uninitialized system serial number. All other processors in the system contain a valid serial number.

?51 Secondary processor returned bad
response message.

A secondary processor returned an unintelligible response to a request made
by the console on the primary processor.

B–6

VAX 6000 Models 300 and 400 Service Manual

theoreti-

Table B–2 (Cont.): Model 400 Standard Console Error Messages
Error Message

Meaning

?52 ROM revision mismatch. Secondary
processor has revision x.xx.

The revision of console ROM of a secondary processor does not match that of
the primary.

?53 EEPROM header is corrupted.

The EEPROM header has been corrupted.
The EEPROM must be restored from the TK tape drive.

?54 EEPROM revision mismatch.
Secondary processor has revision x.xx/y.yy.

A secondary processor has a different revision of EEPROM or has a different set of EEPROM patches installed.

?55 Failed to locate EEPROM area.

The EEPROM did not contain a set of
data required by the console. The EEPROM may be corrupted.

?56 Console parameters on secondary processor do not match primary.

The console parameters are not the same
for all processors .

?57 EEPROM area checksum error.

A portion of the EEPROM is corrupted.
It may be necessary to reload the EEPROM from the TK tape drive.

?58 Saved boot specifications on secondary processor do not match primary.

The saved boot specifications are not the
same for all processors.

?59 Invalid unit number.

A BOOT or SET BOOT command specified a unit number that is not a valid hexadecimal number between 0 and FF.

?5A System serial number mismatch.
Secondary processor has xxxxxxxx.

The indicated serial number of a secondary processor does not match that of
the primary.

?5B Unknown type of boot device.

The console program does not have a boot
primitive to support the specified type
of device or the device could not be accessed to determine its type.

?5C No HELP is available.

The HELP command is not supported
when the console language is set to International.

?5D No such boot spec found.

The specified boot specification was not
found in the EEPROM.

?5E Saved boot spec table full.

The maximum number of saved boot specifications has already been stored.

Console Error Messages for Model 400 B–7

Table B–2 (Cont.): Model 400 Standard Console Error Messages
Error Message

Meaning

?5F EEPROM header version mismatch.

Processors have different versions of EEPROMs.

?61 EEPROM header or area has bad
format.

All or part of the EEPROM contains inconsistent data and is probably corrupted. Reload the EEPROM from the TK
tape.

?62 Illegal node number.

The specified node number is invalid.

?63 Unable to locate console tape device.

The console could not locate the I/O
adapter that controls the TK tape.

?64 Operation only applies to secondary
processors.

The command can only be directed at a
secondary processor.

?65 Operation not allowed from secondary
processor.

A secondary processor cannot perform this
operation.

?66 Validation of EEPROM tape image failed.

The image on tape is corrupted or
is not the result of a SAVE EEPROM command. The image cannot be restored.

?67 Read of EEPROM image from tape failed.

The EEPROM image was not successfully read from tape.

?68 Validation of local EEPROM failed.

?69 EEPROM not changed.

The EEPROM contents were not changed.

?6A EEPROM changed successfully.

The EEPROM contents were successfully patched or restored.

?6B Error changing EEPROM.

An error occurred in writing to the EEPROM. The EEPROM contents may be corrupted.

?6C EEPROM saved to tape successfully.

The EEPROM contents were successfully written to the TK tape.

?6D EEPROM not saved to tape.

The EEPROM contents were not completely written to the TK tape.

B–8

VAX 6000 Models 300 and 400 Service Manual

Table B–2 (Cont.): Model 400 Standard Console Error Messages
Error Message

Meaning

?6E EEPROM Revision = x.xx/y.yy.

The EEPROM contents are at revision x.xx with revision y.yy patches.

?6F Major revision mismatch between tape
image and EEPROM.

The major revision of tape and EEPROM do not match. The requested operation cannot be performed.

?70 Tape image Revision = x.xx/y.yy.

The EEPROM image on the TK tape is
at revision x.xx with revision y.yy patches.

?73 System serial number updated.

The EEPROM has been updated with the
correct system serial number.

?74 System serial number not updated.

The EEPROM has not been changed.

?75 /CONSOLE_LIMIT value too small for
proper operation. Value ignored.

No change has been made.

?76 Error writing to tape. Tape may be
write-locked.

Tape has not been written. Check to see
if tape is write-locked.

?77 CCA not accessible or corrupted.

Attempt to find the console communications area (CCA) failed.
The console then builds a local CCA, which does
not allow for interprocessor communication.

?78 Vector module configuration error at node
n

The console detected a vector module configuration error. Problem can be that the
vector node number is not one greater
than the scalar CPU or that the module to the left of a vector processor is not a memory module.

?79 Vector synchronization error.

The console could not synchronize with
the vector processor on a console entry. The Busy bit in the Vector Processor Status Register remained set after a timeout, or a vector processor error occurred.

?7A No vector module associated with CPU at
specified node.

No vector module is in the slot to the left
of the specified CPU, or the VIB cable either is not attached or is bad.

?7B An error occurred while accessing the vector module.

Attempt to access VCR, VLR, or VMR registers failed.

Console Error Messages for Model 400 B–9

Table B–2 (Cont.): Model 400 Standard Console Error Messages
Error Message

Meaning

?7C I/O adapter configuration error at node n

The I/O adapter at node n is configured improperly.

?7D Vector module is disabled—check KA64A revision at XMI node n

The vector module is attached to a KA64A
module that is not at the revision level required.

?83 Loading system software.1

The console is attempting to load the operating system in response to a BOOT command, power-up, or restart failure.

?84 Failure.1

An operation did not complete successfully. Should be issued with another message to clarify failure.

?85 Restarting system software.1

The console is attempting to restart the inmemory copy of the operating system following a power-up or serious error.

?A0 Initializing system.1

The console is resetting the system in response to a BOOT command.

?A6 Console halting after unexpected machine check or exception.1

The console executed a Halt instruction to reset the console state after processing an unexpected machine check.

?A7 RCSR <WD> is set. Local CCA must be
built.

When the <WD> bit is set, writes to memory are disabled. The Model 400 processor must then build a CCA in local memory. Main memory cannot be written to or accessed with interlocked instructions.

?A8 Bootstrap failed due to previous error.1

The previous attempt to bootstrap the system failed.

?A9 Restart failed due to previous error.1

The previous attempt to restart the system failed.

Node n: ?xx

Error message ?xx was generated on secondary processor n and was passed
to the primary processor to be displayed.

1 No numbered prefix appears with these messages in English language mode. These numbers are used for these messages in International mode.

B–10

VAX 6000 Models 300 and 400 Service Manual

Table B–2 (Cont.): Model 400 Standard Console Error Messages
Error Message

Meaning

Console Error Messages for Model 400 B–11

Appendix C

EEPROM Mismatches and the UPDATE
Command
Table C–1 shows the results of trying to update processor modules from
primary processors that have different ROM revisions from the secondary
being updated.

Table C–1: UPDATE Results on EEPROM Mismatches
Primary
ROM
Revision

Secondary
ROM
Revision

Results after UPDATE issued

<REFERENCE>(xrp)
ROM Revisions
1.0

2.0

Processor EEPROM corrupted, but still powers up.

1.0

3.0

Processor EEPROM corrupted, but still powers up.

2.0

1.0

Use EVUCA for updates to secondary EEPROM.
Update not allowed.

2.0

3.0

Use EVUCA for updates to secondary EEPROM.
Update not allowed.

3.0

1.0

Use EVUCA for updates to secondary EEPROM.
Update not allowed.

3.0

2.0

Use EVUCA for updates to secondary EEPROM.
Update not allowed.

<REFERENCE>(xyp)
ROM Revisions
4.1

6.0

Processor updated.
Power-up tests broken.
Processor will not be recognized.

6.0

4.1

Use EVUCA for updates to secondary EEPROM.
Update not allowed.

EEPROM Mismatches and the UPDATE Command C–1

Table C–1 (Cont.): UPDATE Results on EEPROM Mismatches
Primary
ROM
Revision

Secondary
ROM
Revision

Results after UPDATE issued

KA62A ROM
Revisions
3.0

5.0

Processor updated.
Power-up tests broken.
Processor will not be recognized.

5.0

3.0

Use EVUCA for updates to secondary EEPROM.
Update not allowed.

C–2

VAX 6000 Models 300 and 400 Service Manual

Appendix D

Control Flags for Booting
With the console BOOT command, you can control various phases of booting
by setting bits in General Purpose Register R5:
BOOT /R5:n

where n is in hexadecimal notation. For example, to set bit 4 in R5 when
booting, you would enter:
BOOT /R5:10

The R5 bit functions are defined by VMB and by the operating system. The
value –1 in R5 is reserved for Digital.

Table D–1: R5 Bit Functions for VMS
Bit

Function

Conversational boot. The secondary bootstrap program, SYSBOOT, prompts you
for system parameters at the console terminal.

Debug. If this flag bit is set, the operating system maps the code for the
XDELTA debugger into the system page tables of the running operating system.

Initial breakpoint. If this flag bit is set, VMS executes a breakpoint (BPT) instruction early in the bootstrapping process.

Secondary boot from boot block.
The secondary boot is a single 512byte block whose logical block number is specified in General Purpose Register R4.

Boots the VAX Diagnostic Supervisor. The secondary loader is an image called DIAGBOOT.EXE.

Boot breakpoint. This stops the primary and secondary loaders with a breakpoint (BPT) instruction before testing memory.

Control Flags for Booting D–1

Table D–1 (Cont.): R5 Bit Functions for VMS
Bit

Function

Image header.
The transfer address of the secondary loader image comes from the image header for that file. If this flag is not set, control shifts to the first byte of the secondary loader.

File name. VMB prompts for the name of a secondary loader.

Halt before transfer. VMB executes a HALT instruction before transferring control to the secondary loader.

No effect, since console program tests memory.

Reserved for the VAX Diagnostic Supervisor.

Do not discard CRD pages.

31:28

Specifies the top-level directory number for system disks.

Table D–2: R5 Bit Functions for ULTRIX
Bit

Function

Forces ULTRIXBOOT to prompt the user for an image name (the default is VMUNIX).

Boots the ULTRIX kernel image in single-user mode.

Must be set, and R4 must be zero.

Must be set.

D–2

VAX 6000 Models 300 and 400 Service Manual

Glossary
Adapter

A node that interfaces other buses, communication lines, or peripheral
devices to the <REFERENCE>(XMI) bus or the VAXBI bus.
Address space

The 1 terabyte of physical address space that the XMI bus is capable of
supporting; currently the XMI bus supports 1 gigabyte of physical memory.
Asymmetric multiprocessing

A multiprocessing configuration in which the processors are not equal in
their ability to execute operating system code. In general, a single processor
is designated as the primary, or master, processor; other processors are
the slaves. The slave processors are limited to performing certain tasks,
whereas the master processor can perform all system tasks. Contrast with
Symmetric multiprocessing.
Bandwidth

The data transfer rate measured in information units transferred per unit
of time (for example, Mbytes per second).
Boot device

Contains the bootblock and typically also contains the virtual memory boot
program (VMB). A VAX 6000 series system can be booted from one of four
boot devices: the console load device, a local system disk, a disk connected
to the system through a CI adapter, or a disk connected to the system
through the Ethernet.
Boot primitives

Small programs stored in ROM on each processor with the console program.
Boot primitives read the bootblock from boot devices. There is a boot
primitive for each type of boot device.
Boot processor

The CPU module that boots the operating system and communicates with
the console.

Glossary–1

Bootblock

Block zero on the system disk; it contains the block number where the
virtual memory boot (VMB) program is located on the system disk and
contains a program that, with the boot primitive, reads VMB from the
system load device into memory.
CIBCA

VAXBI CI port interface; connects a system to a Star Coupler.
CIXCD

XMI CI port interface; connects a system to a Star Coupler.
Cold start

An attempt by the primary processor to boot a new copy of the operating
system.
Compact disk server

Ethernet-based CD server; provides access to CDROMs for software
installation, diagnostics, and on-line documentation.
Console communications area (CCA)

Segment of system main memory reserved by the console program.
Console mode

A mode of operation allowing a console terminal operator to communicate
with nodes on the XMI bus.
DEBNI

VAXBI adapter; Ethernet port interface.
DEMNA

XMI adapter; Ethernet port interface.
DHB32

VAXBI adapter communication device; supports up to 16 terminals.
DMB32

VAXBI adapter interface for 8-channel asynchronous communications for
terminals, one synchronous channel, and a parallel port for a line printer.
DRB32

VAXBI adapter; parallel port.

Glossary–2

DSB32

VAXBI adapter communication device; provides two synchronous lines.
DWMBB

The XMI-to-VAXBI adapter; a 2-module adapter that allows data transfer
from the XMI to the VAXBI; DWMBB/A is the module in the XMI card cage,
and DWMBB/B is the VAXBI module. Every VAXBI on a VAX 6000 series
system must have a <REFERENCE>(XBI) adapter.
Ethernet-based compact disk server

The RRD40 compact disk drive, a console load device, functions as a server
on the Ethernet.
FV64A

Vector processor; works in a scalar/vector processor pair.
Interleaving memory

See Memory interleaving.
KDB50

VAXBI adapter for RAxx disks; enables connection to disk drives.
KDM70

XMI adapter for RAxx disks; enables connection to disk drives.
Memory interleaving

Method to optimize memory access time; the VAX 6000 series console
program automatically interleaves the memories in the system unless the
SET MEMORY command is used to set a specific interleave or no interleave
(which would result in serial access to each memory module). Interleaving
causes a number of memories to operate in parallel.
Memory node

Also called the <REFERENCE>(XMA2). Memory is a global resource
equally accessible by all processors on the <REFERENCE>(XMI). See also
<REFERENCE>(XMA2).
Module

A single <REFERENCE>(XMI) or VAXBI card that is housed in a single
slot in its respective card cage. XMI modules (11.02" x 9.18") are larger
than VAXBI modules (8.0" x 9.18").

Glossary–3

<REFERENCE>(XMA2)

XMI memory array; a memory subsystem of the XMI. Memory is a global
resource equally accessible by all processors on the <REFERENCE>(XMI).
A memory module can have 32, 64, or 128 Mbytes of memory, consisting of
MOS 1–Mbit or MOS 4–Mbit dynamic RAMs, ECC logic, and control logic.
Node

An <REFERENCE>(XMI) node is a single module that occupies one of the
14 logical and physical slots on the <REFERENCE>(XMI) bus. A VAXBI
node consists of one or more VAXBI modules that form a single functional
unit.
Node ID

A hexadecimal number that identifies the node location.
On the
<REFERENCE>(XMI) bus, the node ID is the same as the physical location.
On the VAXBI, the source of the node ID is an ID plug attached to the
backplane.
Pended bus

A bus protocol in which the transfer of command/address and the transfer
of data are separate operations. The <REFERENCE>(XMI) bus is a pended
bus.
Primary processor

See Boot processor.
Processor node

A VAX processor that contains a central processor unit (CPU), executes
instructions, and manipulates data contained in memory.
RBD

ROM-based diagnostics.
RBV20/RBV64

VAXBI adapter for write-once-read-many (WORM) optical disk drive. The
RBV20 and RBV64 controllers use the KLESI–B adapter.
Scalar/vector processor pair

The FV64A vector processor functions as a coprocessor with a host scalar
processor. The scalar/vector processor pair appear as one processor to an
executing program.
Secured terminal

Console terminal in program mode while the machine is processing.

Glossary–4

Shadow set

Two disks functioning as one disk, each shadowing the information
contained on the other, controlled by an HSC controller under the VMS
operating system.
Symmetric multiprocessing

A multiprocessing system configuration in which all processors have equal
access to operating system code residing in shared memory and can perform
all, or almost all, system tasks.
System root

In a BOOT commmand, the argument to the /R5 qualifier.
TBK70

VAXBI adapter connecting the TK tape drive to the system.
TU81E

VAXBI adapter for a local (nonclustered) tape subsystem.
controller uses the KLESI–B adapter.

The TU81E

VAX Diagnostic Supervisor (VAX/DS)

Software that loads and runs diagnostic and utility programs.
VAXBI bus

The 32-bit bus used for I/O.
VAXBI Corner

The portion of a VAXBI module that connects to the backplane and provides
an electrically identical interface for every VAXBI node.
VMB

The virtual memory boot program (VMB.EXE) that boots the operating
system. VMB is the primary bootstrap program and is stored on the boot
device. The goal of booting is to read VMB from the boot device and load
the operating system.
XBI

Lines in the self-test display that show the status of <REFERENCE>(XBI_
plus) adapters and of VAXBI nodes. See also <REFERENCE>(xbi_plus).
XMI

The 64-bit, high-speed system bus.

Glossary–5

<REFERENCE>(XMI) Corner

The portion of an <REFERENCE>(XMI) module that connects to the
backplane and provides an electrically identical interface for every XMI
node.

Glossary–6

Index
A
Architecture, 1–4
with vector processors, 5–4

B
Backup cache
KA64A processor, 4–7
Booting
control flags for, D–1 to D–2
Boot processor
how to replace, 3–44
how to replace KA64A, 4–50
KA62B processor, 3–10
KA64A processor, 4–10
BPD
in self-test display, 3–17, 4–19,
5–11

C
Configuration rules
KA62B processor, 3–4
KA64A processor, 4–4
memory, 6–4
processor, 5–6
<REFERENCE>(xbi_plus)
adapter, 7–6 to 7–7
Console commands
KA62B processor, 3–38
KA64A processor, 4–40
SET MEMORY command, 6–13,
6–15
SHOW MEMORY command,
6–13, 6–15
vector processor, 5–18
CPU replacement
multiprocessor system

CPU replacement
multiprocessor system (Cont.)
KA62B, 3–44 to 3–47
KA64A, 4–50 to 4–53
single processor
KA62B, 3–40 to 3–43
KA64A, 4–46 to 4–49

D
DEBNI, running RBD, 2–28
Diagnostics
design, 2–2
KA62B ROM-based, 3–24
KA64A ROM-based, 4–28
overview, 2–2 to 2–3
ROM-based, 2–2
self-test, 2–2
VAX/DS, 2–2, 5–16
XGPR use, 4–24, 5–12
DWMBB adapter, 7–1 to 7–16
configuration rules, 7–6 to 7–7
functional description, 7–8 to
7–9
physical description, 7–2 to 7–3
RBD, 7–10
registers, 7–14 to 7–16
specifications, 7–4 to 7–5

E
EEPROM version number
KA62B processor, 3–9
KA64A processor, 4–9
Error messages
console
Model 300, A–1 to A–10
Model 400, B–1 to B–11

Index–1

ETF
in self-test display, 3–17, 4–19,
5–11
EVUCA session
on KA62B, 3–50 to 3–53
on KA64A, 4–56 to 4–59
Extended test
KA62B processor, 3–13
KA64A processor, 4–14

F
FV64A processor
inserting in XMI card cage, 5–25

I
I/O nodes, 1–5
Interleaving, 6–10
console commands, 6–12
default, 6–11

K
KA62B processor
configuration rules, 3–4
console commands, 3–38
CPU replacement
multiprocessor system, 3–44
to 3–47
single processor system, 3–40
to 3–43
functional description, 3–6
how to add new, 3–48
how to replace boot, 3–44
how to replace only using
RESTORE, 3–40
how to replace only using SET,
3–42
how to replace secondary, 3–48
LEDs, 3–18
machine checks, 3–36
patching EEPROM with EVUCA,
3–50
physical description, 3–2
power-up, 3–12

Index–2

KA62B processor (Cont.)
primary cache, 3–7
processor chip (CVAX), 3–7
RBD
CPU/memory test, 3–30
second-level cache test, 3–32
self-test, 3–26
registers, 3–54 to 3–58
second-level cache, 3–7
self-test, 3–13
self-test display, 3–16
VAX/DS diagnostics, 3–34
XMI interface, 3–7
KA64A processor
backup cache, 4–7
configuration rules, 4–4
console commands, 4–40
CPU replacement
multiprocessor system, 4–50
to 4–53
single processor system, 4–46
to 4–49
functional description, 4–6
how to add new, 4–54
how to replace boot, 4–50
how to replace only using
RESTORE, 4–46
how to replace only using SET,
4–48
how to replace secondary, 4–54
LEDs, 4–20
machine checks, 4–38
patching EEPROM with EVUCA,
4–56
physical description, 4–2
power-up, 4–12
primary cache, 4–7
processor chip, 4–7
RBD
CPU/memory test, 4–34
self-test, 4–30
registers, 4–60 to 4–65
self-test, 4–14
self-test display, 4–18
specifications, 4–3

KA64A processor (Cont.)
VAX/DS diagnostics, 4–36
XMI interface, 4–7

L
LEDs
KA62B processor error code in,
3–18
KA64A processor error code in,
4–20

M
Machine checks, 5–17
KA62B processor, 3–36
KA64A processor, 4–38
Memory
See MS65A memory
Module handling, 4–42 to 4–45,
5–22 to 5–25
MS62A memory
RBD test examples, 6–22
MS65A memory
addressing, 6–14
configuration rules, 6–4
control and status registers, 6–24
description, 6–2
features, 6–3
functional description, 6–6
good and bad memory pages,
6–19
interleaving, 6–10
mixed memory usage, 6–26
power-up, 6–16
RBD test 3, 6–20
parameters, 6–21
self-test, 6–16 to 6–19
self-test errors, 6–18 to 6–19
specifications, 6–5
yellow LED, 6–19
MTPR/MFPR instructions, 4–63,
5–29
MTVP/MFVP instructions, 5–29

P
Power identification
determined by inspection, 1–3
determined remotely, 1–6 to 1–7
Power-up
KA62B processor, 3–12
KA64A processor, 4–12
Primary processor
See Boot processor
Processor
configuration rules, 5–6
console commands, 5–18
machine checks, 5–17
Progress trace, 2–5, 4–18, 5–10

R
RBDs
See also ROM-based diagnostics
on VAXBI devices, 2–28
<REFERENCE>(XBI_plus) adapter,
1–5
<REFERENCE>(XMA2) memory,
1–5
<REFERENCE>(XMI)-to-VAXBI
adapter, 1–5
See also DWMBB adapter
<REFERENCE>(XRP) module
handling procedures, 4–42 to
4–45
inserting in XMI card cage, 4–44
to 4–45
<REFERENCE>(XRP) processor,
4–1 to 4–65
See also Scalar processor
<REFERENCE>(xrv) processor
how to replace, 5–26
<REFERENCE>(XRV) processor,
5–1 to 5–29
See also Vector processor
<REFERENCE>(XYP) processor,
3–1 to 3–58
See also Scalar processor
Registers

Index–3

Registers (Cont.)
DWMBB adapter, 7–14
KA62B processor, 3–54 to 3–58
KA64A processor, 4–60 to 4–65
MS65A memory, 6–24 to 6–25
<REFERENCE>(xbi_plus)
adapter, 7–14 to 7–16
vector processor, 5–28 to 5–29
Repair tag, 4–45
ROM-based diagnostics
commands, 2–8
QUIT, 2–19
START, 2–14 to 2–17
SUMMARY, 2–22 to 2–23
control characters, 2–8 to 2–9
entering RBD mode, 2–9
exiting RBD mode, 2–12
fatal error, defined, 2–16
hard error, defined, 2–16
KA62B CPU/memory test, 3–30
KA62B second-level cache test,
3–32
KA62B self-test, 3–26
KA64A CPU/memory interaction
tests, 4–34
KA64A self-test, 4–30
MS65A memory, 6–20
on KA62B, 3–24 to 3–32
on KA64A, 4–28 to 4–35
overview, 2–2
program, 2–8 to 2–12
qualifiers, 2–15 to 2–17
<REFERENCE>(xbi_plus)
adapter, 7–10 to 7–13
sample session, 2–24 to 2–27
self-test, 5–14
soft error, defined, 2–16
system reset in, 2–19
test printout
explanation, 2–18 to 2–21
failing, 2–20 to 2–21
passing, 2–18 to 2–19
sample, 2–24 to 2–27
tests, 2–10
VAXBI devices, 2–28 to 2–29

Index–4

ROM requirements for vector
processors, 5–4
ROM version number
KA62B processor, 3–9
KA64A processor, 4–9
RSSC, 4–9

S
Scalar processor, 1–5
KA62B specifications, 3–3
<REFERENCE>(XRP), 4–1 to
4–65
<REFERENCE>(xyp), 3–1 to
3–58
Self-test, 2–4 to 2–6
display, 5–10
KA62B display, 3–13, 3–16
KA62B processor, 3–13
KA64A display, 4–14, 4–18
KA64A processor, 4–14
progress trace, 2–5
sample printout, 2–4
when invoked, 2–5
Specifications
DWMBB adapter, 7–4 to 7–5
KA62B processor, 3–3
KA64A processor, 4–3
MS65A memory, 6–5
vector processor, 5–5
SSC, 3–9
STF
in self-test display, 3–17, 4–19,
5–11
System
architecture, 1–4, 5–4
functional description, 1–4 to
1–5
System support chip
See RSSC for KA64A
See SSC for KA62B

T
TBK70, running RBD, 2–28

Troubleshooting flowcharts, 1–8 to
1–10
TYP
in self-test display, 3–17, 4–19,
5–11

U
ULTRIX booting, D–2

V
VAX/DS, 2–30 to 2–47
booting from Ethernet, 2–32 to
2–33
description, 2–31
diagnostics, 5–16
documentation, 2–30
exerciser tests, 2–31
explanation of levels, 2–30
function tests, 2–31
HELP in, 2–31
interrupt, 2–39, 2–41
KA62B diagnostics, 3–34
KA64A diagnostics, 4–36
list of diagnostics, 2–42 to 2–47
logic tests, 2–31
running in user mode, 2–34 to
2–35
running standalone, 2–34 to
2–35
sample session, 2–36 to 2–41
trap, unexpected, 2–39
types of diagnostic programs,
2–31
unexpected trap, 2–39
VAX Diagnostic Supervisor
See VAX/DS
Vector console commands, 5–18
Vector processor
configuration rules, 5–6
console commands, 5–18
functional description, 5–8
handling procedures, 5–22 to
5–25
how to replace, 5–26

Vector processor (Cont.)
machine checks, 5–17
memory requirements, 5–5
physical description, 5–2 to 5–3
registers, 5–28 to 5–29
self-test, 5–10
specifications, 5–5
XMI transactions, 5–9
VMS booting, D–1

X
XGPR register, 4–24, 5–12
XMI interface
KA62B processor, 3–7
KA64A processor, 4–7

Index–5