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Document:	BA215 Enclosure Maintenance
Order Number:	EK-191AA-MG
Revision:	001
Pages:	90
Original Filename:

OCR Text

BA215 Enclosure Maintenance
Order Number EK-191AA-MG-001

digital equipment corporation
maynard, massachusetts

October 1988

The information in this document is subject to change without notice and should not be
construed as a commitment by Digital Equipment Corporation.
Digital Equipment Corporation assumes no responsibility for any errors that may appear in

this document.

The software, if any, described in this document is furnished under a license and may be used

or copied only in accordance with the terms of such license. No responsibility is assumed
for the use or reliability of software or equipment that is not supplied by Digital Equipment

Corporation or its affiliated companies.

© Digital Equipment Corporation. 1988. All rights reserved.
Printed in U.S.A.
The READER'S COMMENTS form on the last page of this document requests the user’s
critical evaluation to assist in preparing future documentation.
The following are trademarks of Digital Equipment Corporation:

DEC

MicroVAX

ULTRIX

DECmate

MicroVMS

DECnet

UNIBUS

PDP

VAX

DECUS

P/OS

VAXBI

DECwriter

Professional

VAXELN

DELNI

Q-bus

VAXcluster

DEQNA

Rainbow

VAXstation

DESTA

RSTS

VMS

DIBOL

RSX

MASSBUS

Work Processor

MicroPDP-11

ThinWire

dlilgli[t]a]
|

ML-5979

FCC NOTICE: The equipment described in this manual generates, uses, and may emit
radio frequency energy. The equipment has been type tested and found to comply with the
limits for a Class A computing device pursuant to Subpart J of Part 15 of FCC Rules, which
are designed to provide reasonable protection against such radio frequency interference when
operated in a commercial environment. Operation of this equipment in a residential area
may cause interference, in which case the user at his own expense may be required to take
measures to correct the interference.

Contents
Preface

vii

Chapter 1

BA215 Enclosure Description

1.1

Introduction ......... .. ... . ...

1-1

1.2

Modules ... ...

1-3

1.2.1

Filler Panel for Covers and Flush Handles ............

1-6

1.2.2

Support Panel for Dual-Height Modules ... ...........

1-6

1.3

Mass StOrage . ...t

1-6

Backplane ....... ... ... ... ...

1-11

1.5

System Controls and Indicators . . .. ...................

1-12

1.6

Operator Control Panel (OCP) ... .....................

1-13

1.7

Power Supply . .. ... o

1-17

1.8

ACLineFilterandFans ........
... .. ... .. .. ... .....

1-21

1.9

Configuration Guidelines . .. .........
... ... .....
..

1-22

1.9.1

Module Order and Configuration . ...................

1-23

1.9.2

Configuration Worksheet ... ..............
... ... ...

1-23

Chapter 2

Installation

2.1

Introduction ...........
... oot

2-1

2.2

SitePreparation..........
... . ... .. . ..
.,

2-1

221

Clearance Requirements ............
.. ... ... ......

2-1

2.2.2

AcOUSEICS . . oo

2-2

2.2.3

Heat Dissipation ... ....... .. ... ..

2-3

2.2.4

Electrical Requirements . . .. .........
... ... ........

2-3

2.3

Unpacking the Shipment . . ..........
... ... ... .....

2-4

2.4

Connecting Devices . ......... ...

2-6

2.5

Setting System Controls. . . .........
... ... ... ......

2-9

2.6

Connecting the Power Cord . ... ...... ...

... ... ... ...

2-9

2.7

Attaching the Front Panel ... ..... ... ... ..............

2-9

Chapter 3

FRU Removal and Replacement

3.1

Introduction .......... ... ... . . ... .. ... ...

3-1

3.2

List of BA215 Enclosure FRUs.

3-1

3.3

Accessing FRUs . ...... ...

. . ...............
... ...
... .. ...

3-3

... ...

...... ...

3-3

3.3.1

Removing the Front Panel . .. ...

3.3.2

Removing the Media Faceplate

.....................

3.3.3

Removing the Side and Top Panel Unit ... ..........
..

3-7

3.3.4

Removing the Safety Plate . . ... ..... ...

... .......

3-8

Removal Procedures for BA215 Enclosure FRUs . ... ... ...

3-10

3.4.1

Modules with Bulkhead Handles . ... ................

3-10

3.4.2

Modules with Covers ........
... ... ... ... ........

3-13

3.4.3

CPUI/OPanel ..... .. ...

...

3-13

3.4.4

Operator Control Panel (OCP) . .. ...................

3-15

3.4.5

RF-Series Disk Drive . . ............
.. .............

3-17

3.4.6

TK-Series Tape Drive . . .. ........
. ... ... ........

3-22

3.4.7

Power Supply . . ... ...

3-24

3.4.8

Fan Tray Assembly

3-27

3.4.9

On/Off Switch Assembly.

3.4.10

Backplane

3.4

Appendix A

.. .. ... ... .. ...

. ... . . . . . . . ..

.........
... ... ... ... .......

... ... ...

... ...... ... ...

3-28

............
. ... ...

3-30

Related Documentation

Index

Figures
1-1

BAZ215 Enclosure, Pedestal

... .......
... .. ... ......

1-1

1-2

BA215 Enclosure Components .. ......................

1-2

1-3

BAZ200-Series Handles and Covers . .. ..................

1-4

BA215 Mass Storage Area .. ...........
... . ... .......

1-7

1-5

BA215 External Device Connector with DSSI Terminator . ..

1-8

1-6

Sliding Tracks, RF and TK Drives (Example)

1-9

............

1-8

BA215 Mass Storage Configuration (Example). .. .........

1-10

BA215Backplane . . ....... ... ...

1-11

BA215 Front Panel Key Positions .. ...................
1-10 BA215 Operator Control Panel (OCP) ..................
1-11 BA215 RF-Series OCP, Frontand Rear .. ...............

1-13

BA215 Power Supply . ... ... o
BA215 Power Supply Timing Diagram. .. ...............

1-18

1-9

1-12
1-13

1-14
1-15
1-19

Power Supply Cable to DSSI Mass Storage Devices. . ... ...
1-15 BA215 Fan Tray Assembly . . ... ... ... ... ..........
1-16 BA215 Configuration Worksheet .. ....................

1-20

..
... .........
BA215 Pedestal Dimensions. . . . ......
Sliding the BA215 Enclosure into Place . . . . .............
H3602-SA I/O Panel (Example) ... ....................

2-2

Cable Connections, CXA16 Module (Example) . ... ........
BA215 Front Panel Release Latch . . ...................

2-8

1-14

Removing the BA215 Front Panel (Pedestal) . ............
Removing the Media Faceplate .......................

1-22
1-25

2-5
2-7

2-10
3—4
3-5

BA215 Shipping Bracket Screws ......................
Removing the BA215 Side and Top Panel Unit ... ........

3-6

Removing the Safety Plate . . . ... .....................
Unlocking the Release Levers ........................

3-9

3-8
3-11

Attaching the Filler Panel (Example). ..................
H3602-SA I/O Panel (Example) .. .....................

3-12

....

3-16

Removing the OCP, RF Drives . .. .....................
3-11 Removing the OCP Cabling . . ........................
3-12 Removing the RF-Series Drive Cabling . ................
...
3-13 Removing an RF-Series Disk Drive . ................

3-17

RF30ID Switches . ...... ... i
3-15 Removing the TK-Series Drive . .. . ....................
3-16 Removing the TK-Series Drive Cabling .. ...............

3-21

Removing the Power Supply Cabling and Screws .........
... .......
........
3-18 Removing the Power Supply ........
3-19 Removing the Fan Tray Assembly .. ...................

3-25

Loweringthe OCP .. ...

... ... . ...

. .. .. ... ...

3-10

3-14

3-17

Removing the Fan Cable from the Fan Tray Assembly ... ..
.....
... .....
3-21 On/Off Switch Assembly Serews. .. ......
3-20

3-14

3-18
3-19
3-20

3-22
3-23
3-26

3-27
3-28
3-29

3-22

Disconnecting the Backplane Cables . .................
.

3-30

3-23

Removing the Backplane . ............
... .. ...
...
... .

3-31

Tables
1-1

BAZ200-Series Module Handles and Covers

..............

1-5

1-2

BAZ215 Enclosure Mass Storage Devices. ................

1-8

1-3

BAZ215 Backplane Connectors

1-4

BAZ215 Front Panel Key Positions

. ............
. ...
... .

1-13

1-5

RF-Series Drives, Controls and Indicators . .............
.

1-16

1-6

BA215 OCP Connectors . ...............
......
.....

1-17

1-7

BA215 Power Supply Controls and Indicators ............

1-20

1-8

Powerand BusLoad Data ...............
...
....
... ..

1-24

2-1

BAZ215 Electrical Requirements ... .............
....
. ..

2-3

2-2

240VacPower Cords ......
..
...
.. ... ..
...
.. ... ...
.

2-3

3-1

BA215Enclosure FRUs ... ......
... ... ...
...
.. ... . .

3-2

System-Specific BA215 FRUs . . ..........
.......
... ...

3-2

3-3

BAZ215 Shock-Mounting Hardware . . . ... ...... ....... ..

3-3

3-4

RF30 Switch Settings.

.....................
...

.. ......
... .. ...
...
. ... .. .
. ..

1-12

3-21

Preface
This guide provides reference, installation, and maintenance information
for the BA215 enclosure. This enclosure is intended for MicroPDP-11 and
MicroVAX systems.

Intended Audience
This document is intended only for DIGITAL Field Service personnel and
qualified self-maintenance customers.

Organization
This guide has three chapters and one appendix.

Chapter 1 provides an overview of the system enclosure, describing the
module handles and covers, mass storage capacity and cabling, controls and
indicators, backplane, power distribution, and configuration guidelines.
Chapter 2 lists site preparation considerations and shows how to install the
BA215 pedestal system.

Chapter 3 describes how to remove and replace BA215 field replaceable
units (FRUs). The beginning of the chapter contains a list of these FRUs.
Appendix A provides a list of related documentation.

Warnings, Cautions, and Notes
Warnings, cautions, and notes appear throughout this guide. They have
the following meanings:
WARNING

Provides information to prevent personal injury.

CAUTION

Provides information to prevent damage to equipment or software.

NOTE

Provides general information about the current topic.

vii

Chapter

BA215 Enclosure Description
1.1

Introduction

The BA215 enclosure is a member of the BA200-series of enclosures, and
is available in a pedestal for office use or in a wall mount configuration
that conforms to NEMA (National Electronics Manufacturing Association)
standards. The pedestal version is shown in Figure 1-1.
The BA215 enclosure has a six-slot backplane, an operator control panel

(OCP), a CPU I/O panel, a power supply, two fans, and a mass storage area
that supports DIGITAL Small Storage Interconnect (DSSI) mass storage
devices. These components are shown in Figure 1-2.

Figure 1—1:

BA215 Enclosure, Pedestal

FRONT
PANEL

MLO-000767

BA215 Enclosure Description

1-1

Figure 1-2:

BA215 Enclosure Components

OPERATOR CONTROL
PANEL (OCP)

MASS
STORAGE
AREA

CPU 1/0
i— PANEL

POWER

SUPPLY

BACKPLANE AREA

1-2

BA215 Enclosure Maintenance

MLO-000768

1.2 Modules
There are two main differences between modules used in a BA200-series
enclosure and those used in other Q22-bus system enclosures:
*

Option modules with external I/O connectors have bulkhead handles.
These handles replace the insert panels and internal cabling found in
the BA23 and BA123 enclosures. This design is easier to maintain
because it eliminates problems caused by faulty internal cabling.

Non-I’O modules (such as memory modules) have blank bulkhead
covers.

The module handles and covers form an electrical seal that complies with

regulations for electromagnetic interference (EMI) for: (1) keeping radio
frequency interference generated by the system in the enclosure, and (2)
keeping external radio frequencies from entering the enclosure. The module
handles and blank covers also help maintain proper airflow.
Four basic types of handles and covers are used for BA200-series compatible
modules (Figure 1-3):
Single-width blank covers
Dual-width blank covers

Single-width flush handle
Single-width recessed handle
Each handle or cover has two quarter-turn, Phillips-head captive screws
to secure the module to the card cage (Figure 1-3). Module handles have
release levers to help install or remove the module from the card cage.

Some modules have special configurations, for example the dual-width
CPU I/O panel. Table 1-1 describes common module handle and cover
variations.

BA215 Enclosure Description

1-3

BA200-Series Handles and Covers

)

CAPTIVE
SCREW

!
\

JuitPiiiyg

non

Figure 1-3:

CAPTIVE
SCREW

SINGLE-WIDTH
BLANK COVER

DUAL-WIDTH
BLANK COVER

SINGLE-WIDTH
FLUSH HANDLE

SINGLE-WIDTH

FILLER

RECESSED HANDLE

PANEL
MLO-000769

1-4

BA215 Enclosure Maintenance

Table 1-1:
Part
Single-width
blank cover

BA200-Series Module Handles and Covers
Part
Number

Description

70-23981-01

Covers one backplane slot in the following cases:
Covers a standard Q22-bus module that does not have
external I/O connectors (for example, a memory module).
Covers an unused slot (slots 3, 4, or 5).

If you install this type of cover next to a module with
a recessed handle, you must add a metal filler panel to
maintain compliance for EMI. See Section 1.2.1.
Single-width

70-23981-04

blank cover

Covers one backplane slot in the following cases:
Covers a standard Q22-bus module that does not have
external I/O connectors (for example, a memory module)
in slot 6. Contains an opening at the top to allow a cable
from the tape controller to be routed to the mass storage
area.

Covers slot 6 (unused).
If you install this type of cover next to a module with

a recessed handle, you must add a metal filler panel to
maintain compliance for EMI. See Section 1.2.1.
Single-width
recessed handle

Used on modules designed for BA200-series enclosures.
The handle is riveted to the module. This style is the
preferred handle for all BA215 modules with external
I/O connectors. The CXA16 and CXY08 communication
modules use this type of handle.

Single-width
flush handle

Used when a recessed handle would interfere with the
module circuitry or I/O connector. The flush handle is
also riveted to the module. The KDJ11-S (a MicroPDP11 processor) and DEQNA-S (Ethernet controller) have
flush handles.

Dual-width
CPU /O panel

H3600-SA

Connects to the KA630 and KA650 CPU modules via a
ribbon cable with two connectors.

Dual-width

H3601-SA

Connects to the KDJ11-BF CPU module via a ribbon

CPU T/O panel
Dual-width
CPU I/O panel

cable with two connectors.
H3602-5A

Connects to the KA640 CPU module 50-pin connector via
a keyed ribbon cable.

BA215 Enclosure Description

1-5

1.2.1 Filler Panel for Covers and Flush Handles
When you install a module with a blank cover or flush handle next to a
module with a recessed handle, you must install a filler panel (Figure 1-3)
between the modules to meet regulations for EMI. Without the filler panel,
circuitry on the recessed-handle module is exposed. The filler panel kit
(70-24505—01) consists of two filler panels that contain sets of finger stock
to provide an effective chassis ground between the handles. Flush handles,
recessed handles, and covers have screw holes at the top and bottom for
installing the filler panel.

1.2.2 Support Panel for Dual-Height Modules
A plastic panel (74-33507-01) provides extra support for dual-height
modules in the BA200-series card cage. Dual-height modules are always
installed in the AB rows of a slot. The panel plugs into the CD rows, below
the dual-height module in the AB rows, to provide additional support. The
panel has a groove along the top edge to support the dual-height module
above it.

1.3 Mass Storage
The BA215 enclosure has a mass storage area above the card cage
(Figure 1-4). The mass storage area contains two full-height mounting
slots.
The BA215 can contain a combination of 13.3-cm (5.25-in) DIGITAL Small
Storage Interconnect (DSSI) mass storage devices, both half-height (41.4
mm; 1.63 in) and full-height (8.25 mm; 3.25 in). For example, one TK50
tape drive (full-height) and two RF30 fixed-disk drives (half-height) can be
installed, for a total data capacity of 395 Mbytes.

1-6

BAZ215 Enclosure Maintenance

Figure 1-4:

BA215 Mass Storage Area

1 MASS

STORAGE

J AREA

MLO-000770

The DSSI supports up to seven storage devices, daisy chained to the host
system through either the KA640 CPU or an adapter module such as the
KFQSA.

A 50-pin connector for external devices is located on the left side of the mass
storage area (Figure 1-5). This connector is used to connect the DSSI bus
to external DSSI drives. When external devices are not present, a DSSI
Honda terminator (12-29258-01) must be connected (Figure 1-5).

BA215 Enclosure Description

1-7

Figure 1-5:

BAZ215 External Device Connector with DSSI Terminator

EXTERNAL

DEVICE
CONNECTOR

DSS1
TERMINATOR

MLO-000771

Table 1-2 lists and describes the BA215-supported mass storage devices.

Table 1-2:

BA215 Enclosure Mass Storage Devices

Device/Capacity

Supported
Drives (Max)

Description

TK50 (95 Mbytes)

Full-height cartridge tape drive.

Installed in

the right-hand slot.

RF30 (150 Mbytes)

1-8

BA215 Enclosure Maintenance

Half-height DSSI disk drive.
left-hand slot(s).

Installed in the

Mass storage devices are mounted sideways on shock-mounting hardware
(Figure 1-6). A sliding track is attached to each side of the mass storage
device. One shock-resistant support is attached to the upper and lower
part of the mass storage area by two captive screws enclosed in rubber
shock bushings. The shock-mounting hardware varies, depending on the
type of device. See Table 3-3 in Chapter 3 for a list of the shock-mounting
hardware.

Figure 1-6:

Sliding Tracks, RF and TK Drives (Example)

SLIDING
TRACKS

SLIDING

TK-SERIES

RF-SERIES

MLO-000772

BA215 Enclosure Description

1-9

Fixed-disk drives face the rear of the enclosure, providing easy access to

drive signal and power cables. TK tape drives face the front of the enclosure,
providing access to the controls and tape cartridge opening.
Figure 1-7 shows a typical BA215 enclosure configuration: one TK50 tape
drive and two RF30 fixed-disk drives.
Figure 1-7 also shows the 50conductor, DSSI interconnect ribbon cable (17-01962—-01), which connects
the CPU DSSI connector (on the right side of the left storage area) to the
first RF30, the second RF30, and the external device connector.
Figure 1-7:

BA215 Mass Storage Configuration (Example)

RF30

DISK DRIVES

TK50
TAPE DRIVE

DSSi

INTERCONNECT
RIBBON CABLE
FOR RF DISKS

MLO-000773

1-10

BA215 Enclosure Maintenance

1.4 Backplane
The BA215 enclosure has a six-slot, quad-height backplane (Figure 1-8).
All six backplane slots are Q/CD slots. That is, the AB rows of all six
slots contain the Q22-bus, and the CD rows of all slots contain the CD
interconnect.

Figure 1-8:

BA215 Backplane

POWER
SUPPLY

CONNECTOR

TO OPERATOR
CONTROL

PANEL (OCP)

TO FANS—|

INTERCONNECT

MLO-000774

The backplane is bounded and cannot be expanded. It supports 33.5
equivalent ac loads and 20 dc loads. An ac load is the capacitance a module

presents to a bus signal line. One ac load equals 9.35 picofarads (pf). A
de load is the dc leakage a module presents to a bus signal line. One dc
load is approximately 105 microamperes (nA). The backplane presents 1.5
ac loads to the Q22-bus.

Table 1-3 describes the connectors on the backplane (Figure 1-8).

BA215 Enclosure Description

1-11

Table 1-3:

BA215 Backplane Connectors

Connector
56-pin edge board

Function
Ribbon cable connects to the power supply, which distributes +5
Vdc and +12 Vde to backplane slots.

10-pin connector

Ribbon cable connects to the operator control panel (OCP). Carries

the DCOK, POK, +5 Vdc, and signal ground lines for the DC OK
LED and disk activity lights.
5-pin power

Cable connects to the two dc fans housed in the ac line filter

assembly.

1.5 System Controls and Indicators
The BA215 enclosure has the following controls and indicators:
On/off power switch with ac power neon light
DC OK LED
System restart switch
CPU halt button
Mass storage device controls and indicators
These controls and indicators are located behind the smoke-grey plastic
window on the front panel. The front panel has a three-position lock. You
can lower the window by turning the lock’s universal key to the middle or
bottom position (Figure 1-9). The levels of access for the lock are listed in
Table 1-4.

1-12

BA?215 Enciosure Maintenance

Figure 1-9:

BA215 Front Panel Key Positions

]1 _ NO ACCESS TO

.—] CONTROLS

ACCESS TO TK

(}__ TAPE DRIVE AND
FIXED-DISK

CONTROLS

\ ACCESS TO ON/OFF SWITCH

(

AND FRONT PANEL

RELEASE LATCH

MLO-000775

Table 1—4:
Key Position

BAZ215 Front Panel Key Positions
Level of Access

Top

No access to controls. Disk, tape drive, and DC OK LEDs are visible.

Middle

Access to disk drive and tape drive controls (OCP).

Bottom

Access to on/off power switch and to release latch (to remove or replace
front panel).

Additional controls, such as the console baud rate select switch and powerup mode switch, are located on the CPU I/O panel. These controls are
accessible only by removing the front panel; they vary depending on
the CPU. Refer to the applicable CPU maintenance documentation for a
description of the controls on the CPU I/O panel.

1.6 Operator Control Panel (OCP)
The controls and indicators for the RF-series fixed-disk drives are located on
the BA215 enclosure operator control panel (OCP), shown in Figure 1-10.

BA215 Enclosure Description

1-13

Figure 1-10:

BA215 Operator Control Panel (OCP)

Figure 1-11 shows the OCP from the front and the rear. The settings
and functions are described in Table 1-5. The connectors are described in
Table 1-6.

Standard system configurations use the write-protect buttons and the driveready LEDs in the right column for RF drive 1, and the buttons in the center
column for RF drive 2. The left column of buttons and LEDs are reserved
for future use.

1-14

BA215 Enclosure Maintenance

Figure 1-11:

BAZ215 RF-Series OCP, Front and Rear
FRONT

TO POK LEAD

POWER
SUPPLY

10-PIN TO
BACKPLANE

RESERVED FOR
FUTURE USE

UNIT ID

SELECT PLUGS

[5]

DRIVE FAULTS
(RED)

c;,u/

WRITE-PROTECT

|_—" LEDS

B
DRIVE-READY
—
LEDS
B
/

DC OK (GREEN)

REAR

FiF—z————JQZ———E—j
0

RF1

| P3 P2 P1

MLO-000777

BA215 Enclosure Description

1-15

Table 1-5:

RF-Series Drives, Controls and Indicators

10103 4
Description

Control
Indicator

Setting

Function

Unit Number

Unit ID

Installed

Three sockets.

select sockets

There are eight unit
ID select plugs numbered O through
7;

normally,

the

DSSI

controller

node

Each

unit

select
plug sets the DSSI address to the
number specified on the plug (normal
operating position). The plug must be
installed if the drive is present.

Fault

Drive fault

Removed

DSSI address undefined. If drive is
present, drive-fault LED lights.

Indicates

Red LED

faulty

drive

undefined DSSI address.

Off

Drive functioning correctly and DSSI
address

defined

(normal

operating

position).

Write Protect

Ready

Write-protect

Out

LEDs

LED off

the disk (normal operating position).

LED on

System cannot write to the disk, but
can read from the disk.

Drive-ready

Out

LEDs

LED on

Disk is on line (normal operating

System can read from and write to

position). System can read from and
write to the disk.

LED off

System

Disk is off line. System cannot read
from or write to the disk.

Restart/Run

Reinitializes system state.
Reruns
self-tests. Work in progress is lost.

Halt

CPU in console I/O mode.
Console
emulation program running.

LED on

Out
LED off

CPU can run system software (normal operating position).

DC OK

Green LED

DC voltage within tolerance.

Off

DC voltage not present or not within
tolerance.

1-16

BA215 Enclosure Maintenance

Table 1—-6:

BA215 OCP Connectors

Connector

Location
on OCP

10-pin Berg

Left side

Function
Three connectors, one for each RF drive. The RF
connection paths are shown on the rear of the OCP,

in Figure 1-11. (The RF3 drive, shown with dotted
line, is for future use.)
3-pin right angle

Top

Color-coded (red, white, and blue) POK lines from
the power supply, to prevent excessive current
draw by the disk drives during power-up.

2-pin right angle

Top

Reserved for future POK use.

10-pin Berg

Top

Multicolored ribbon cable from the backplane.
This cable carries the DCOK, POK, +5 Vdc, and
signal ground lines for the DC OK LED and disk

activity lights.

1.7 Power Supply
The BA215 enclosure contains one power supply, either H7868-A (120 Vac)
or H7868-B (240 Vac), shown in Figure 1-12. The power supply plugs
directly into the backplane via a 56-pin connector, and can deliver the

following maximum currents:
7.6 amperes at +12 Vde
33.0 amperes at +5 Vdc

The combined maximum currents at +5 Vdc and +12 Vdc must not consume
more than 230 watts of power.
The power supply has an ac input power connector at its base, which
connects to the 12-pin connector on the ac line filter assembly; only 6 of

the 12 pins are used.

BA215 Enclosure Description

1-17

Figure 1—12:

BA215 Power Supply
DC OK

ON/OFF
SWITCH

o .

CIRCUIT
BREAKER

POWER SUPPLY

MLO-000778

1-18

BA215 Enclosure Maintenance

The power supply enters and completes a shutdown sequence whenever
the BPOK H signal is negated (Figure 1-13). When BPOK H is asserted
high on the Q22-bus, the power system is in a state to allow normal system
operation. The following conditions negate BPOK H:
*

Temperature sensor triggered, possibly caused by fan failure

An overcurrent condition

Input voltage greater than 132 Vrms or less than 88 Vrms (at 120-Vac

range)

The power supply ac and dc power controls and indicators are listed in
Table 1-7. (See also Figure 1-12.)
Figure 1-13:

BA215 Power Supply Timing Diagram

VALID AC —J
DC POWER
ALL
VOLTAGES

=————m—

BDCOK H

BPOK H

D=2 -D

(&3
D [ ¢—m—gg —>

5> <—6->|<—7->I<—8»
TDC

TDCOK

3 seconds maximum

3 milliseconds {msec) minimum

70 msec minimum

3 msec minimum

TPOK

TACF

TPOKF

TAC

TDCOKF

TDCF

TDCOK

20 msec ride-through time

4 msec minimum hold up

5 msec minimum
3 msec minimum
Mi0-000129

BA215 Enclosure Description

1-19

Table 1-7:

BA215 Power Supply Controls and Indicators

Indicator

Location

Function

AC power

On/off (1/0)
power switch

Lights when the on/off switch is set to on (1), and the
ac voltage is present at the input of the power supply.

DC OK

Front panel

Lights when power supply output dc voltages are

(OCP)

normal.

Power supply

Lights when power supply output dc voltages

front panel

normal.

Reset
button

Power supply
front panel

Resequences
backplane.

Circuit

Power supply

Stops flow of current in an overload or stressed electric

breaker

front panel

circuit.

DC OK

the

power

cycle

for

modules

are

the

Mass storage devices receive power through a nine-pin connector on the top
front of the power supply. Figure 1-14 shows the DSSI power cable with
connectors to RF-series drives and the OCP.
Figure 1-14:

Power Supply Cable to DSSI Mass Storage Devices

(CONDUCTOR =1
TO TAPE
ADAPTER CABLE

TO RF-SERIES
DRIVES

WHITE}

TO POK CONNECTOR
ON OPERATOR CONTROL

{(CONDUCTOR =1
RED)

PANEL (OCP)
(CONDUCTOR =1
BLUE)

§ TO POWER SUPPLY
MLO-000779

1-20

BAZ215 Enciosure Maintenance

The RF-series OCP contains a three-pin connector for POK lines {(color
coded) from the power supply (Figure 1-14). The POK signal is on all
three lines, and is used to prevent excessive current draw by the disk drives
during power-up. The OCP also contains a two-pin POK connector, reserved
for future use.

1.8 AC Line Filter and Fans
The BA215 enclosure has one ac line filter, located on the fan tray assembly.
The fan tray assembly fits under the card cage, behind the safety plate, as
shown in Figure 1-15. The fan tray assembly contains a 12-pin connector
(only 6 of the 12 pins are used) to provide ac input power to the power
supply, and a six-pin connector, which connects the on/off switch assembly
to the power supply.
The fan tray assembly houses two 11.3-cm (4.5-in) dc¢ fans (Figure 1-15).
The fans draw air into the top of the enclosure. The air passes through the
enclosure and exhausts through the bottom.
A temperature sensor in the power supply adjusts the fan speed by varying
the input voltage based on the room temperature. The sensor adjusts input
voltage to provide sufficient cooling, at minimum speed, for all combinations
of load. The voltage to the fans varies from a maximum of —12.7 volts at
42°C (108°F) to a minimum of -7.8 volts at 30°C (86°F).

BA215 Enclosure Description

1-21

Figure 1-15:

BA215 Fan Tray Assembly

FAN POWER
HARNESS (ATTACHED)

MLO-000780C

1.9 Configuration Guidelines
Before you change a configuration in the BA215 enclosure, you must
consider the following factors:
Module order in the backplane
Module configuration
When you add a device to a system, you must know the capacity of the
system enclosure in these areas:
Number of backplane slots
Power limitation

1-22

BA215 Enclosure Maintenance

1.9.1 Module Order and Configuration
Module order in the backplane is system specific, depending on the CPU.
Refer to the applicable CPU maintenance documentation for the preferred
module order of the specific system.
For information on how to configure modules, refer to Microsystems Options,

which includes a complete listing of all supported options along with the
following information for each module and device:
Ordering information

Operating system support
Diagnostic support
Option description
CSR addresses and interrupt vectors
LEDs
Loopback connectors
Self-tests
FRUs (if applicable)
Related documentation

1.9.2 Configuration Worksheet
Use the configuration worksheet shown in Figure 1-16 to make sure a
configuration does not exceed system limits for expansion space, power,
and bus loads. If you use standard DIGITAL modules, you will not exceed
the limits for bus loads.
When you change a configuration, use the worksheet as follows:
1.

List all the devices already installed in the system.

List all the devices you plan to install in the system.

Fill in the
Table 1-8.

Add up the columns. Make sure the totals are within the limits for the
power supply.

NOTE: Check

information

the

for each

appropriate

CPU

device,

using the

maintenance

data listed in

documentation

determine which options are supported for the specific system.

BA215 Enclosure Description

1-23

Table 1-8:

Power and Bus Load Data
Current

(Amps)

Power

Bus Loads

Option

Module

+5V

+12V

Watts

AAV11-SA

A1009-PA

1.8

0.0

9.0

2.1

0.5

ADVI11-SA

A1008-PA

3.2

0.0

16.0

2.3

0.5

AXV11-SA

A026-PA

2.0

0.0

10.0

1.2

0.3

KWV11-SA

M4002-PA

2.2

0.130

11.16

1.0

0.3

CXA16-M

M3118-YA

1.6

0.20

10.4

3.0

0.5

CXB16-M

M3118-YB

2.0

0.0

10.0

3.0

0.5

CXY08-M

M3119-YA

1.8

0.30

12.6

3.2

0.5

DELQA-SA

M7516-PA

2.7

0.5

19.5

2.2

0.5

DEQNA-SA

M7504-PA

3.5

0.50

23.5

2.2

0.5

DFA01

M3121-PA

1.97

0.40

14.7

3.0

1.0

DPV11-SA

M8020-PA

1.2

0.30

9.6

1.0

DRQ3B-SA

M7658-PA

0.0

22.5

2.0

1.0

DRV1J-SA

M8049-PA

1.8

0.0

9.0

2.0

1.0

DRVIW-SA

M7651-PA

1.8

0.0

9.0

2.0

1.0

DZQ11-SA

M3106-PA

1.0

0.36

9.3

1.4

0.5

IBQO1-SA

M3125-PA

5.0

0.0

25.0

4.6

1.0

IEQ11-SA

M8634-PA

3.5

0.0

17.5

2.0

1.0

KA620-AA

M7478

6.2

0.14

32.7

2.7

1.0

KAG30-AA

M7606

6.2

0.14

32.7

2.7

1.0

KA640-AA

M7624

6.0

0.14

31.68

3.5

1.0

KAG650-AA

M7620-A

6.0

0.14

31.7

2.7

1.0

KDJ11-BC

M8190

5.5

0.1

28.7

2.3

1.1

KDJ11-BF

M8190

5.5

0.2

29.9

2.6

1.0

KMV1A-SA

M7500-PA

2.6

0.2

154

3.0

1.0

KWV11-SA

M4002-PA

2.2

0.13

11.16

1.0

0.3

LPV11-SA

M8086-PA

1.6

0.0

8.0

1.8

0.5

M9060

M9060-YA

5.3

0.0

26.5

0.0

MS630-AA

M7607

1.0

0.0

5.0

0.0

MS630-BA

M7608

1.8

0.0

9.0

0.0

MS630-BB

M7608

1.8

0.0

9.0

MS630-CA

M7609

3.1

0.0

15.5

0.0

MS650-AA

M7621-A

2.7

0.0

13.5

0.0

MSV11-JD

M8637-D

3.74

0.0

18.7

2.7

0.5

MSV11-JE

M8637-E

4.1

0.0

20.5

2.7

0.5

1-24

BAZ215 Enclosure Maintenance

Table 1-8 (Cont.):

Power and Bus Load Data
Current

(Amps)

Power

Bus Loads

Option

Module

+5V

+12V

Watts

MSV11-PK

M8B067-K

3.45

17.25

2.0

1.0

MSV11-PL

M8067-L

3.6

17.5

2.0

1.0

MSVI11-QA

M7551-AA

0.0

12.0

2.0

1.0

RF30-S

1.25

2.85

18.3

TK50

1.35

2.4

33.55

TQK50

M7546

0.0

14.5

2.0

1.0

VCBO02

M7169

5.8

0.75

38.0

3.5

1.0

VCBO0O2

M7168

0.0

17.0

0.0

Figure 1-16:

BA215 Configuration Worksheet

POWER SUPPLY
SLOT

MODULE

BACKPLANE

Current (Amps)

Power

+5 Vdc | +12 Vde | (Watts)|

Bus Loads

TAPE

—

DISK 1

—

3
4

6
MASS STORAGE:

DISK 2
DSSI Terminator

0.64

0.0

3.0

—

33.5°%

200

Total all columns:

Must NOT exceed:

*NOTE:

33.0A

76 A*

|2300W

Power supplies may differ. Check your power supply specifications
to confirm the maximum +12V current.

** Applicable to KABxx-series CPUs.

MLO-000781

BA215 Enclosure Description

1-25

Chapter

Installation
2.1

Introduction

This chapter provides site preparation guidelines and
procedures for the BA215 enclosure in an office pedestal.

installation

2.2 Site Preparation
Before you unpack the BA215
preparations in this section.

enclosure

shipment,

verify

the

site

2.2.1 Clearance Requirements
Figure 2—-1 shows the dimensions of a BA215 enclosure in an office pedestal.
You must leave at least 100 ¢m (40 in) of clearance in front of the enclosure,
to ensure access to system controls. You can place the rear of the enclosure
against a wall or table, and the system will have enough room for adequate
airflow because the base of the enclosure is 5 cm (2 in) wider than the
cabinet.
If you are placing the enclosure alongside other equipment, you must leave
at least 30 cm (12 in) of clearance at each side for proper airflow. If other
equipment will not be next to the enclosure, leave at least 5 ¢cm (2 in) of
clearance at each side for proper airflow.

WARNING: Use two people to handle the BA215 shipping carton and
enclosure.

The system weighs between 50 kg (110 Ib) and 64 kg (140 [b),

depending on the options installed.

Installation

2-1

Figure 2-1:

BA215 Pedestal Dimensions

67.5cm

(27.0in)

(17.8in)

34.0cm —

136

MLO-000782

2.2.2 Acoustics
The BA215 enclosure in a pedestal is designed for use in offices and other
general working areas.
The acoustic emission levels are as follows:
e

LNPE for the BA215 enclosure is 5.7. LNPE (B) is the noise power
emission level (A_weighted sound power level) measured in bels re 1
pw (reference 1 picowatt).

LPA for the BA215 enclosure is 38. LPA is the sound pressure measured
in decibels at 1.0 m (3.3 ft) from the front edge of the unit and 1.5 m

(5.0 ft) above the floor.
NOTE: Levels may be lower, depending on the kind and number of mass
storage devices in the system. Data is measured in accordance with ANSI
S12.10-1985 (American National Standards Institute) and 1SO/DIS 7779
(International Standards Organization).

2-2

BA215 Enclosure Maintenance

2.2.3 Heat Dissipation
Heat dissipates in the BA215 enclosure system at a maximum rate of 1178
Btu per hour.

2.2.4 Electrical Requirements
Table 2—1 lists the electrical requirements for systems in the BA215
pedestal. Table 2-2 lists international power cords.

Table 2-1:

BAZ215 Electrical Requirements

Nominal AC Voltage —

101 Vac

120 Vac

220-240 Vac

Voltage range

88 to 110 Vac

93 to 132 Vac

176 to 264 Vac

Power source phase

Single

Nominal frequency

50 to 60 Hz

Frequency range

47 to 63 Hz

Maximum steady state

52A

44 A

24 A

0.87 A

0.73 A

0.40 A

Start-up current (30 seconds)

71A

59A

31A

Maximum inrush current

50 A

Maximum power consumption

340 W

current at nominal voltage

Minimum steady state current at
nominal voltage

Table 2-2:

240 Vac Power Cords

Description

Option

Part number

United States, 120 Vac

BN20M-2E

17-00083-11

United States, Japan, 240 Vac

BN20N-2E

17-00083-12

Australia, New Zealand, 240 Vac

BN19J-2E

17-00198-08

Europe-Schuko, 240 Vac

BN03B-2E

17-00199-01

United Kingdom, Ireland, 240 Vac

BN19B-2E

17-00209-09

Switzerland, 240 Vac

BN19F-2E

17-00210-06

Denmark, 240 Vac

BN19L-2E

17-00310-06

Italy, 240 Vac

BN19N-2E

17-00364-09

South Africa, India, 240 Vac

BN19T-2E

17-00456-09

Israel, 240 Vac

BN19Y-2E

17-00457-09

Installation

2-3

2.3 Unpacking the Shipment
Unpack the BA215 enclosure shipment as follows:
1.

Check the invoice to make sure the shipment is complete. The shipment

contains several cartons:

One carton contains the BA215 enclosure.
attached to the bottom of this carton.

One carton contains cables for connecting additional devices to the

A wooden pallet is

system.

Several cartons contain console terminal components.

One carton, marked "software,” contains software documentation,
system software, diagnostic software, and a software license.

NOTE: Save all packing materials in case the system needs to be
reshipped in the future.
Depending on the customer’s order, the shipment may also include
additional terminals, printers, or modems.

Before unpacking the equipment, check the cartons for external
shipping damage. Report any damage to the Field Service or sales
office and to the local carrier.
Unpack the BA215 enclosure according to the instructions on the carton

with the wooden pallet attached.

WARNING: Use two people to lift the system. The system welighs between
50 kg (110 Ib) and 64 kg (140 1b), depending on the options installed.
Verify that the system power requirements match the power source.
The correct voltage for the system is listed on the serial number label

next to the power supply. If the voltage does not match the power
source, do not continue; contact the salesoffice.

Unpack the remaining cartons. Check the contents against the shipping
list to make sure the order is complete.

2-4

BA215 Enclosure Maintenance

Move the BA215 enclosure to the desired location. Casters attached to
the base of the BA215 enclosure allow you to easily push it into place
and position it (Figure 2-2). Leave a few inches behind the BA215
enclosure for routing cables underneath. When you have completed the
installation, you can place the enclosure base directly against a wall.

Figure 2-2:

Sliding the BA215 Enclosure into Place

HAND HOLDS

SLIDES FRONT
TO BACK

ROLLS LEFT
TO RIGHT

MLO-000783

Installation

2-5

You must release the four brackets that hold the mass storage devices

during shipping. There are four orange plain-slotted screws that hold
the shipping brackets, two on each side of the mass storage area. Using

the instructions on the BA215 enclosure carton, loosen these four screws
about five or six turns, or until you hear the shipping brackets release.
Then firmly tighten them again. Loosening the shipping bracket screws
automatically releases the shipping brackets on the inside of the mass
storage area.

CAUTION: Failure to release the shipping brackets may result in
damage to the disk drives.
After the shipping brackets are released, you must tighten the screws
firmly to allow for front panel clearance.

2.4 Connecting Devices
Connect the console terminal and additional devices as follows:
1.

Install the console terminal according to the instructions in the
installation guide for the terminal. The CPU connects to the console
terminal through a CPU I/O panel, such as the H3602-SA (KA640 CPU)

(Figure 2-3).

2-6

BA215 Enclosure Maintenance

Figure 2-3:

H3602-SA /O Panel (Example)

FRONT

REAR

{
L
2.

s
MLO-000784

Connect cables for external devices directly to connectors on the module
handles. Begin with the module on the right, then continue toward the
left. Each module handle or cover has a label at the top that contains
the option and module number. Figure 2-4 shows the CXA16 module
connections.

Refer to the customer documentation for instructions on connecting
peripheral devices to system-specific modules installed in the BA215
enclosure.

Installation

2-7

Figure 2-4:

Cable Connections, CXA16 Module (Example)

BAIL / :
LATCHES

BC16D

CABLE

FEED CABLE UNDER
BASE AND THROUGH

OPENING

MLO-000785

2-8

BA215 Enclosure Maintenance

2.5 Setting System Controls
The system controls are located on the dual-width CPU I/O panel. These
controls vary depending on the CPU.
For most systems, you must set the baud rate of the console serial line to

the same baud rate as the console terminal, and make sure the fixed-disk
drives are ready and not write-protected. Some systems also require you
to set the enable/disable and power-up mode switches.
Using the removal procedure in Section 3.4.3, remove the CPU I/O panel.
Check the appropriate CPU maintenance documentation for the correct
switch settings, then set the system controls.

2.6 Connecting the Power Cord
Connect the power cord to the BA215 enclosure as follows:
1.

Make sure the system on/off switch is off (0).

Thread the power cord under the rear of the enclosure.

The power

cord receptacle is located at the front of the system to the right, just
above the base of the enclosure. Plug the power cord into the power
receptacle.
3.

See the appropriate CPU maintenance documentation for information
on the power-up self-tests and how to select a console terminal

language.

2.7 Attaching the Front Panel
The front panel is packed separately in the BA215 enclosure shipping
carton. Attach the front panel to the BA215 enclosure as follows:
1.

Pull out on the release latch on the front panel (Figure 2-5), but do not
attempt to remove it.

Installation

2-9

Figure 2-5:

BA215 Front Panel Release Latch

—T—
—_T—]

!
’

—T—
T

—_T—

==
—-——

——

| —
_=

|mea
|G

——

|
&=
C—

RELEASE LATCH

ON/OFF

SWITCH
MLO-000786

Holding the front panel with both hands, place it against the front of
the enclosure, about an inch above the bottom of the enclosure.

Slide the front panel down until you feel it lock into place. Secure the
front panel by pushing in the release latch.

2-10

BA215 Enclosure Maintenance

Chapter 3

FRU Removal and Replacement
3.1 Introduction
This chapter describes how to remove and replace the major field
replaceable units (FRUs) for the BA215 enclosure.

3.2 List of BA215 Enclosure FRUs
Table 3-1 lists the BA215 enclosure FRUs and their part numbers.
CAUTION:

Only qualified service personnel should remove or replace FRUs.

Before you remove or replace FRUs, always set the on/off power switch
to off (0) and remove the ac power cord from the wall outlet.

Always use the
Static electricity can damage integrated circuits.
grounded wrist strap and antistatic mat found in the Antistatic Kit (29~
26246) when you work with the internal parts ofa computer system.

FRU Removal and Replacement

3-1

Table 3—1:

BA215 Enclosure FRUs

FRU

Part Number

AC on/off switch and cable assembly

17-01938-01

Backplane

70-25447-01

Cable, backplane to OCP

17-01964-01

CD support panel (for dual-height modules)

74-33507-01

Cover, single-width

70-23981-01

Cover, dual-width

70-23982-02

Fans (de), tray, and fan tray assembly

70-25454-01

Fans (2)

12-23609-04

Power cord (120 Vac, USA)

17-00083-11

Power supply, 120 Vac

H7868-A

Power supply, 240 Vac

H7868-B

Sidewall filler panel (for blank cover)

70-24505-01

Terminator, external DSSI

12-29258-01

NOTE: The

DSSI system

expansion

cable

(BC2IM)

is packaged

and

supplied with the storage expander products.
Table 3-2 lists the system-specific FRUs in the BA215 enclosure; their
presence depends on which CPU and mass storage devices are installed.
Refer to the applicable CPU maintenance documentation for a complete

list of supported options; these options are also FRUs.

Table 3-2:

System-Specific BA215 FRUs

FRU

Part Number

CPU I/O panel for KA640 CPU (H3602-SA)

70-25775-01

Operator Control Panel (OCP), RF-series drives

70-25453-01

Cable, KA640 to DSSI (round)

17-01963-01

Cable, RF-series disk to DSSI (flat)

17-01962-01

Cable, power supply to mass storage

17-01965-01

Cable, KA640 memory interconnect

17-01534-02

Cable, KA640 memory interconnect (3-connector)

17-01534-01

Cable, KA640 memory interconnect (5-connector)

17-01534-03

Cable, RF-series drive to OCP (10-conductor)

17-01936-01

Cable, TK power adapter

17-01937-01

3-2

BA215 Enclosure Maintenance

Table 3-3 lists the shock-mounting hardware and part numbers required
to install RF30 disk drives and a TK50 tape drive in the BA215 enclosure.
Each drive listed in the left column requires all the mounting hardware
listed in the same row. One sliding track attaches to each side of the drive.
One shock-resistant support attaches to the top of the mass storage area of
the enclosure and one attaches to the bottom of the mass storage area.

Table 3-3:

BA215 Shock-Mounting Hardware

Device

Left of Drive!

Right of Drive

Enclosure

Top of

Bottom of

RF30

74-36498-01

70-25452-01

74-25452-01

TK50

74-33573-01

74-33573-02

70-23997-01

70-23997-02

Enclosure

'Drive right side up and facing forward.

3.3 Accessing FRUs
Before you can remove FRUs from the BA215 enclosure, you must perform
one or more of the procedures in this section:
*

Remove the front panel.

Remove the media faceplate covering the mass storage area.

Remove the safety plate covering the fan tray assembly.

Remove the side and top panels (one unit).

3.3.1 Removing the Front Panel
You must remove the front panel before removing any FRUs.
Remove the front panel as follows:

To reach the on/off power switch, turn the universal key in the front
panel lock to the bottom position and lower the grey window.

Set the on/off power switch to off (0), and unplug the ac power cord from
the wall outlet.

Pull the release latch toward you, but do not attempt to remove it
(Figure 3-1).

Using the release latch as a handle, lift the front panel off (Figure 3-1).

FRU Removal and Replacement

3-3

Figure 3-1:

Removing the BA215 Front Panel (Pedestal)

IMPORTANT:
PULL RELEASE LATCH FORWARD
BEFORE LIFTING DOOR

MLO-000787

3.3.2 Removing the Media Faceplate
You must remove the media faceplate before you can remove a disk drive,
tape drive, operator control panel (OCP), or the ac on/off switch assembly.
Remove the media faceplate as follows:
CAUTION: Static electricity can damage integrated circuits.

Use an

antistatic wrist strap and mat when you remove the media faceplate.

3-4

BAZ215 Enclosure Maintenance

Remove the front panel, using the procedure in Section 3.3.1.

Put on the grounded wrist strap included in the Antistatic Kit (2926246), and attach the alligator clip to the BA215 frame.

If installed, you must remove the DSSI expansion cable (BC21M) from
the external device connector. Halt any bus activity on a second host
system, then remove the DSSI expansion cable.
CAUTION: Make sure you stop any bus activity before you remove the
DSSI expansion cable, to prevent the possibility of high error rates.

Loosen the four quarter-turn captive screws that hold the media
faceplate to the BA215 frame (Figure 3—-2). Remove the faceplate.

Figure 3-2:

Removing the Media Faceplate

CAPTIVE
SCREWS

MLO-000788

FRU Removal and Replacement

3-5

The shipping brackets inside the mass storage area should already be
in their released positions. To prevent damage to the disk drives, make
sure the shipping brackets are released by loosening the four orange
plain-slotted screws, shown in Figure 3-3, about five or six turns.
Then firmly tighten them again. Loosening the shipping bracket screws

automatically releases the shipping brackets.
CAUTION: Failure

release the shipping brackets

may result in

damage to the disk drives.
After the shipping brackets are released, you must firmly tighten the

shipping bracket screws again to allow for front panel clearance.

Figure 3-3:

BAZ215 Shipping Bracket Screws

SHIPPING
BRACKET
SCREWS

SHIPPING

BRACKET

SCREWS

MLO-000789

3-6

BA215 Enclosure Maintenance

3.3.3 Removing the Side and Top Panel Unit
You must remove the side and top panel unit before you can remove the
backplane.

Remove the side and top panel unit as follows:
1.

Remove the media faceplate, using the procedure in Section 3.3.2.

Remove the six Phillips-head screws with metal washers, three on each
side of the BA215 frame, that hold the side and top panel unit to the
BA215 frame (Figure 3—4).

The side and top panel unit is seated to the top of the BA215 frame by

four shoulder bolts. Slide the side and top panel unit toward the rear
of the BA215 frame, to unseat the shoulder bolts from the keyhole slots
on the BA215 frame. Lift the side and top panel unit and remove.

FRU Removal and Replacement

3-7

Figure 34:

Removing the BA215 Side and Top Panel Unit

SCREWS
SCREWS

MLO--000790

3.3.4 Removing the Safety Plate
You must remove the safety plate covering the fan tray assembly before you
can remove the fan tray assembly, the power supply, and the on/off switch
assembly.
Remove the safety plate as follows:
1.

Remove the front panel, using the procedure in Section 3.3.1.

Put on the grounded wrist strap included in the Antistatic Kit (29—
26246), and attach the alligator clip to the BA215 frame.

3-8

BAZ215 Enclosure Maintenance

Loosen the two Phillips-head captive screws at the top of the safety
plate (Figure 3-5).

The bottom edge of the safety plate sits behind a rolled lip at the bottom
of the BA215 frame. Dislodge the safety plate from the rolled lip, and
remove.

Figure 3-5:

Removing the Safety Plate

CAPTIVE
SCREWS

SAFETY PLATE

MLD-000791

FRU Removal and Replacement

3-9

3.4 Removal Procedures for BA215 Enclosure

FRUs

Each of the following sections describes the removal procedure for the
specified FRU. Unless otherwise indicated, you can replace an FRU by
reversing the steps in the removal procedure.

3.4.1 Modules with Bulkhead Handles
The BA215 enclosure uses modules with attached bulkhead handles or with
covers. See Section 1.2 for a complete description of BA200-series handles
and covers.

Remove modules with bulkhead handles as follows:

CAUTION: Static electricity can damage integrated circuits.

Use an

antistatic wrist strap and mat when you remove or replace modules.

Remove the front panel, using the procedure in Section 3.3.1.

Put on the grounded wrist strap included in the Antistatic Kit (29—
26246), and attach the alligator clip to the BA215 frame.

Note the orientation of external cables connected to the module. Label
and disconnect the cables.

Release the two quarter-turn captive screws that hold the module
handle to the card cage.

Unlock the release levers by simultaneously pulling up on the top lever
and pulling down on the bottom lever (Figure 3-6).

Pull out on the module’s handle, and remove the module from the card
cage.

3-10

BA215 Enclosure Maintenance

Figure 3-6:

Unlocking the Release Levers

Installation Note
When you install a module that has either a blank cover or a flush handle
next to a module with a recessed handle, you must install a filler panel (70—
24505-01) between the modules to meet regulations for electromagnetic
interference (EMI). Without the filler panel, circuitry on the module with a
recessed handle is exposed.

Check the modules in the card cage to see if any module with a recessed
handle is next to a module with a blank cover or a flush handle. Install the
filler panel, if needed, as follows:
1.

Fit the filler panel onto the side of the blank cover or flush-handle
module that is next to the module with the recessed handle. Make sure

FRU Removal and Replacement

3-11

the tabs on the filler panel fit into the tab indentations on the blank
cover or flush handle (Figure 3-7).
2.

Using the two screws that come with the filler panel, attach the
filler panel to the top and bottom of the blank cover or flush handle
(Figure 3-7).

Attaching the Filler Panel (Example)

Y—
)

Figure 3-7:

ASSEMBLY

FILLER PANEL

\55 D

FILLER

PANEL ASSEMBLY

MOUNTED ON BLANK

BULKHEAD COVER
MLO-000793

3-12

BAZ215 Enclosure Maintenance

3.4.2 Modules with Covers
The BA215 enclosure uses modules with attached bulkhead handles or with
covers. See Section 1.2 for a complete description of BA200-series handles
and covers.
Remove modules with covers as follows:

CAUTION: Static electricity can damage integrated circuits.

Use an

antistatic wrist strap and mat when you remove or replace modules.

Remove the front panel, using the procedure in Section 3.3.1.

Put on the grounded wrist strap included in the Antistatic Kit (29—
26246), and attach the alligator clip to the BA215 frame.

Release the two quarter-turn captive screws that hold the cover to the
card cage.

Pull the cover away from the card cage.

Note the orientation of internal cables connected to the module. Some
connectors are not keyed. Label and disconnect the cables.

Unlock the module’s release levers by simultaneously pulling up on the
top lever and pulling down on the bottom lever. For a module with a
plastic handle, pull out on the plastic handle.

Carefully pull the module out of the card cage.

Installation Note

Check to see if you need a filler panel(s) according to the procedure in the
Installation Note, Section 3.4.1.

3.4.3 CPU I/O Panel
The CPU connects to the console terminal through a CPU /O panel,
described in Section 2.4.
Remove the CPU I/O panel covering the CPU module in slot 1 in the card

cage, as follows:

CAUTION: Static electricity can damage integrated circuits.

Use an

antistatic wrist strap and mat when you remove or replace modules.

Remove the front panel, using the procedure in Section 3.3.1.

Put on the grounded wrist strap included in the Antistatic Kit (29—
26246), and attach the alligator clip to the BA215 frame.

FRU Removal and Replacement

3-13

Release the two quarter-turn captive screws that hold the CPU I/O
panel to the card cage (Figure 3-8).

Pull the CPU I/O panel away from the card cage, and disconnect the

keyed ribbon cable from the rear of the panel (Figure 3-8).

Figure 3-8:

H3602-SA 1/O Panel (Example)

FRONT

REAR

CAPTIVE

./Qo/ SCREW

)

KAB40 CPU

DE* CONNECTOR

CAPTIVE\

SCREW

§
MLO-000734

3-14

BA215 Enclosure Maintenance

3.4.4 Operator Control Panel (OCP)
The BA215 enclosure mass storage area contains an operator control panel

(OCP) for DSSI mass storage devices.

Remove the OCP from the enclosure and from its supporting frame as
follows:

CAUTION: Static electricity can damage integrated circuits.

antistatic wrist strap and mat when you remove the OCP.

Use an

Remove the media faceplate, using the procedure in Section 3.3.2.

Loosen the plain-slotted captive screw that holds the top of the operator
control panel (OCP) to the BA215 frame (Figure 3-9).

The OCP is held onto the bottom of the BA215 frame by two tabs that
fit into slots on the frame. Lower the OCP, allowing the OCP to rest on
its tabs (Figure 3-9).

FRU Removal and Replacement

3-15

Figure 3-9:

Lowering the OCP

CAPTIVE

SCREW

MLO-000795

Label and disconnect all cables from the OCP.

Lift the OCP from the slots on the BA215 frame.

Remove the four Phillips-head screws that hold the OCP to its metal

frame (Figure 3-10). Remove the OCP from the metal frame.

Installation Note

Make sure not to pinch any mass storage cabling when you secure the OCP.

3-16

BA215 Enclosure Maintenance

Figure 3—10:

Removing the OCP, RF Drives

REAR

SCREWSTM

/{;m

[ tC :

SCREWS

5F—2————JZE~——§—

“Ej P3P2 P1
1)

RF1

'L_J‘
I/

MLO-000796

3.4.5 RF-Series Disk Drive
Remove an RF-series fixed-disk drive from the BA215 mass storage area as
follows:

CAUTION:
e

Static electricity can damage integrated circuits.

Use an antistatic

wrist strap and mat when you remove or replace mass storage
devices.

Handle any fixed-disk drive with care; dropping or bumping the
drive can damage the disk surface.

Remove the media faceplate, using the procedure in Section 3.3.2.

Lower the OCP,
Section 3.4.4.

Label and disconnect the following lines and cables from the OCP
(Figure 3-11):
*

using

steps

through

of the

procedure

Color-coded (red, white, and blue) POK lines; right-angle 3-pin
connector.

Multicolored ribbon cable from backplane; center-polarized (keyed)
10-pin Berg connector.

Signal cables from RF-series drives; center-polarized (keyed) 10-pin
Berg connector.

FRU Removal and Replacement

3-17

Figure 3-11:

Removing the OCP Cabling

POK LINES
TO RE-SERIES
DRIVES

RIBBON CABLE
TO BACKPLANE

SIGNAL CABLES TO
RF-SERIES DRIVES

MLO-000797

Lift the OCP from the slots on the BA215 frame, and remove.

Label and disconnect the following cables from the fixed-disk drives
(Figure 3-12):
*

Power supply cable; 5-pin connector. Refer to A in Figure 3—-12.

Signal cable; 10-pin connector. Refer to B in Figure 3-12.

DSSI-to-RF interconnect cable;
50-pin flat multi-connector.
Disconnect this cable from the center chassis support plug, then
from the fixed-disk drives. Refer to C in Figure 3-12.

3-18

BA215 Enclosure Maintenance

Figure 3—-12:

Removing the RF-Series Drive Cabling

POWER SUPPLY

CABLETO

-SERIES
RF-SER
IES DRIVE

(CONDUCTOR #1

SIGNAL CABLE

(CONDUCTOR #1
WHITE)

DSSI-TO-RF —
[|

INTERCONNECT

]
LV

CABLE

MLO-000798

FRU Removal and Replacement

3-19

Release the RF-series drive from the shock-resistant supports by
loosening the captive screws above and below the drive (Figure 3-13).

Slide the drive out of the BA215 mass storage area (Figure 3-13).

Remove the sliding tracks from the drive and install them on the new
drive.

NOTE: See Microsystems Options for procedures on how to remove and
replace fixed-disk drive FRUs.

Figure 3-13:

Removing an RF-Series Disk Drive

CAPTIVE

CAPTIVE
SCREW
MLO-000799

RF30 Installation Notes

DSSI node ID switches are located on the electronics controller module, at
the connector end of the RF30 (Figure 3—-14). Set these switches to assign
a unique node ID number to each drive on the DSSI bus. Table 3—4 shows
the switch settings for up to seven DSSI nodes.

3-20

BA215 Enclosure Maintenance

DSS! NODE

FAULT

READY

ID SWITCHES

LED

RF30 ID Switches

_ T

Figure 3—14:

MLO-000800

Table 3—4:

RF30 Switch Settings
Switch

DSSI
Node ID

1(MSB)

3 (LSB)

Down

RF30 drives are factory configured to the same unit ID. When installing an
additional or replacement RF30, make sure the unit ID select plug on the
operator control panel (OCP) and the unit ID DIP switch on the RF30 are
set to the same value. Although the unit ID select plug overrides the RF30
unit ID DIP switch, it is good practice to set them to the same value. This
eliminates the possibility of having a duplicate unit ID, which can occur if
you disconnect the OCP from the drives and fail to set the DIP switches to
the correct value.
There are eight unit ID select plugs, numbered 0 through 7; normally, the
DSSI controller is node 7.

FRU Removal and Replacement

3-21

3.4.6 TK-Series Tape Drive
Remove a TK-series drive from the BA215 mass storage area as follows:

CAUTION:
e

Static electricity can damage integrated circuits.

Use an antistatic

wrist strap and mat when you remove or replace mass storage
devices.
s

Always remove a TK-series tape cartridge before you turn off the
system.

Never put your hands or other objects into the cartridge

opening.

Remove the media faceplate, using the procedure in Section 3.3.2.

Release the TK-series drive from its shock-resistant supports by
loosening the captive screws above and below the drive (Figure 3-15).

Figure 3-15:

Removing the TK-Series Drive

CAPTIVE

CAPTIVE
SCREW
MLO-000801

3-22

BAZ215 Enclosure Maintenance

Slowly slide the TK-series drive part way out of the BA215 mass storage
area (Figure 3-15), until you can reach the signal and power cables at
the rear of the drive (Figure 3-16).

Label and disconnect the signal and power cables from the rear of the
drive (Figure 3-16).

Slide the drive out of the BA215 mass storage area.

Remove the sliding tracks from the drive and install them on the new
drive.

Figure 3—-16:

Removing the TK-Series Drive Cabling

Installation Notes

If the new TK-series drive is attached to a skid plate, you must: (1) remove
the skid plate from the new drive, and (2) install the skid plate on the
defective drive before returning the drive.

When you install a TK-series drive, make sure not to pinch any cabling at
the rear of the drive. If you feel resistance when sliding the drive into the
BA215, remove the drive and check to see if the cables are in the way.

FRU Removal and Replacement

3-23

3.4.7 Power Supply
The BA215 enclosure has one power supply, described in Section 1.7.

Remove the power supply as follows:
CAUTION: Static electricity can damage integrated circuits.

Use an

antistatic wrist strap and mat when you remove or replace the power
supply.
1.

Remove the BA215 front panel, using the procedure in Section 3.3.1.

Put on the grounded wrist strap included in the Antistatic Kit (29—
26246), and attach the alligator clip to the BA215 frame.

At the top of the power supply, remove the screw that holds the cover
for the mass storage power cable; remove the cover (Figure 3-17).

At the top of the power supply, disconnect the power supply DSSI
cable by grasping the white plastic handle on the cable connector
(Figure 3-17).

Loosen the two flat-head captive screws that hold the power supply in
place (Figure 3-17).

Remove the safety plate covering the fan tray assembly, using the
procedure in Section 3.3.4.

3-24

BA215 Enclosure Maintenance

Figure 3—-17:

Removing the Power Supply Cabling and Screws

CAPTIVE SCREW

HANDLE

CAPTIVE
SCREW

MLO-000803

The power supply connects directly to the backplane. Remove the power
supply by slowly pulling it out of the enclosure, to avoid damage to the
backplane connector (Figure 3-18).

FRU Removal and Replacement

3-25

Figure 3—18:

Removing the Power Supply

Installation Notes
Make sure you insert the top and bottom edges of the power supply into

the plastic guides in the card cage.

Make sure not to pinch any cabling between the rear of the supply and the

BA215 frame. If you feel resistance, remove the supply and make sure the
cabling is not in the way.

The power supply DSSI cable is keyed; be careful to connect it correctly.

3-26

BAZ215 Enclosure Maintenance

3.4.8 Fan Tray Assembly
The fan tray assembly, which houses the two dc fans and the ac line filter,
is located behind the safety plate at the bottom of the BA215 enclosure.
Remove the fan tray assembly as follows:

Remove the power supply, using the procedure in Section 3.4.7.

Loosen the two Phillips-head captive screws that hold the fan tray

Carefully pull the complete assembly forward; the attached cables will

Disconnect the ac cable to the power supply (Figure 3-19).

assembly to the bottom of the card cage (Figure 3-19).

prevent you from removing it completely.

Figure 3—19:

Removing the Fan Tray Assembly

CAPTIVE
SCREWS

MLO-000805

Remove the fan tray assembly from the enclosure.

FRU Removal and Replacement

3-27

The two dc fans are surrounded by sheet metal in the fan tray assembly
(Figure 3-19). Remove the fans from the fan tray assembly as follows:
1.

Note the orientation (+ or —) of the Y-cable connectors on the two fans.
Disconnect the Y-cables from the two fans (Figure 3-20).

Remove the eight screws (four on each fan). Remove the fans from the
sheet metal.

Figure 3-20:

Removing the Fan Cable from the Fan Tray Assembly

L [[FeC

MLO-000806

3.4.9 On/Off Switch Assembly
The BA215 enclosure on/off switch assembly is located just below the mass

storage area, on the right.

Remove the on/off switch assembly as follows:
1.

Remove the power supply, using the procedure in Section 3.4.7.

3-28

BAZ215 Enclosure Maintenance

2.
3.

Pull the fan tray assembly forward and disconnect the ac power supply

cable, using steps 1 through 4 of the procedure in Section 3.4.8.

Loosen the two captive screws on the sheet metal panel attached to the

on/off switch assembly (Figure 3-21).

Pull the sheet metal panel away from the BA215 frame.

From the back of the on/off switch assembly, push up on the bottom of
the plastic switch and remove the assembly from the sheet metal panel.

Figure 3-21:

On/Off Switch Assembly Screws

—

)

ON/OFF

SWITCH

> |l
,

4‘\
3

\ CAPTIVE
CREWS

S
/

MLO-000807

FRU Removal and Replacement

3-29

3.4.10 Backplane
The backplane is the only part of the BA215 enclosure that you remove
from the rear of the enclosure.
Remove the backplane as follows:
1.

From the front of the enclosure:
a.

Remove the

side

and

top panel

unit,

using the

procedure

Section 3.3.3.
b.

Remove all modules from the backplane, using the procedures in
Sections 3.4.1 through 3.4.3.

Reach through the card cage, and disconnect the fan cable and OCP
cable from the backplane (Figure 3-22).

Figure 3-22:

Disconnecting the Backplane Cables

POWER

SUPPLY

|
TO

ocP

CONNECTOR

TO FANS
|

MLO-000808

Read the Caution below. Then, from the rear of the enclosure, remove
the ten Phillips-head screws that hold the metal plate and backplane
to the rear of the enclosure (Figure 3-23). The backplane and metal
plate are one FRU; do not remove the plate from the backplane.

3-30

BAZ215 Enclosure Maintenance

CAUTION: The metal plate and backplane rest on two metal tabs on the
BAZ215 frame, to prevent the assembly from dropping when you remove
the last screw. Remove the lower screws first, then the middle screws;
remove the upper screws last. Make sure the metal plate and backplane
are supported by the tabs before you remove the last screw.

Figure 3-23:

Removing the Backplane

MLO-000809

FRU Removal and Replacement

3-31

Installation
1.

Align the new backplane assembly with the rear of the enclosure. Make
sure the bottom of the backplane assembly rests on the BA215 frame
tabs.
While you support the backplane assembly, insert and tighten the ten
screws part way.

Insert quad-height modules into slots 1 and 6.
Fully tighten all backplane screws.

Install the power
Section 3.4.7.

supply

reversing

the

removal

procedure

Properly configure and install all modules, module covers, and filler

panels.

3-32

BA215 Enclosure Maintenance

Appendix

Related Documentation
The following documents contain information relating to MicroVAX or
MicroPDP-11 systems.
Order Number

Document Title

Modules
CXA16 Technical Manual

EK-CAB16-TM

CXY08 Technical Manual

EK-CXY08-TM

DEQNA Ethernet User’s Guide

EK-DEQNA-UG

DHV11 Technical Manual

EK-DHV11-TM

DLV11-J User’s Guide

EK-DLV1J-UG

DMV11 Synchronous Controller Technical Manual

EK-DMV11-TM

DMV11 Synchronous Controller User’s Guide

EK-DMV11-UG

DPV11 Synchronous Controller Technical Manual

EK-DPV11-TM

DPV11 Synchronous Controller User’s Guide

EK-DPV11-UG

DRV11-J Interface User’s Manual

EK-DRV1J-UG

DRV11-WA General Purpose DMA User’s Guide

EK-DRVWA-UG

DZQ11 Asynchronous Multiplexer Technical Manual

EK-DZQ11-TM

DZQ11 Asynchronous Multiplexer User’s Guide

EK-DZQ11-UG

DZV11 Asynchronous Multiplexer Technical Manual

EK-DZV11-TM

DZV11 Asynchronous Multiplexer User’s Guide

EK-DZV11-UG

IEU11-A/TEQ11-A User’s Guide

EK-IEUQ1-UG

KA630-AA CPU Module User’s Guide

EK-KAB30-UG

KAB840-AA CPU Module User’s Guide

EK-KA640-UG

KA650-AA CPU Module User’s Guide

EK-KA850-UG

KDA50-Q CPU Module User’s Guide

EK-KDA5Q-UG

KDJ11-B CPU Module User’s Guide

EK-KDJ1B-UG

KDJ11-D/S CPU Module User’s Guide

EK-KDJ1D-UG

KDF11-BA CPU Module User’s Guide

EK-KDFEB-UG

KMV11 Programmable Communications Controller User’s Guide

EK-KMV11-UG

KMV11 Programmable Communications Controller Technical

EK-KMV11-TM

Manual