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Document:	MicroPDP-11 Systems Maintenance Guide
Order Number:	EK-MIC11-SG
Revision:	001
Pages:	430
Original Filename:

OCR Text

EK-MIC11-SG-001

&
5 eEa@

Prepared by Educational Services
of Digital Equipment Corporation

[
i

1st Edition, September 1985

The material in this document is for informational purposes and is subject to
change without notice; it should not be construed as a commitment by Digital

Equipment Corporation. Digital Equipment Corporation assumes no responsibility

for any errors that may appear in this document.

Digital Equipment Corporation assumes no responsibility for the use or reliability of

its software on equipment that is not supplied by Digital Equipment Corporation.

NOTICE: This equipment generates, uses, and may emit radio frequency energy.
The equipment has been tested and found to comply with the limits for a Class A
computing device pursuant to Subpart J of Part 15 of FCC Rules, which are
designed to provide reasonable protection against such radio frequency interference
when operated in a commercial environment. Operation of this equipment in a
residential area may cause interference in which case the user at his own expense
may be required to take measures to correct the interference.

The following are trademarks of Digital Equipment Corporation.

dlilali]t|a[1 8
COMPACTape
DEC
DECmate
DECnet
DECsystem-10
DECSYSTEM-20
DECUS
DECwriter
DIBOL

EduSystem
[AS
MASSBUS
MicroPDP-11
MicroVAX
OMNIBUS
0S/8
PDP
PDT
P/OS

Professional
Q-Bus
RAINBOW
RSTS
RSX
UNIBUS
VAX
VMS
VT
Work Processor

Contents

Introduction

s X1X
Notes, Cautions, and Warnings .....c..coeeeeermimiiiiiiiiii
RElated D OCUIMIEIIES ... neee e e

ettt et e

et e et et e s e et s et e e e e e saanaeeeneee XX

Glossary LoCation .....ooiiiiiiiiiie e XX

Acronyms Used in this Document .........cccooiiiiiiiii, XX1
Chapter 1

System Identification

1.1
1.2
1.2.1
1.2.2

IDENTIFYING THE SYSTEM (ENCLOSURE) ... 1-1
IDENTIFYING THE SYSTEM (CPU) .covoiiiiiiiiiiiiiieees 1-3
I[dentifying the CPU (System Off) ... 1-4
Identifying the CPU (System On).......cccccceiiiiiniinnnnn, 1-5

Chapter 2

KDJ11-B Systems

2.1
2.2
2.2.1
2.2.2

INTRODUCTION L.t 2-1
KDJ11-B CPU MODULE ...t 2-3
KDJ11-B LEDS ittt 2-6
KDJ11-B Baud Rate Select Switch.......ccoooiiiiiiins 2-7

2.2.3

v 2.2.4

2.3
2.4
2.4.1
2.4.2
2.5
2.5.1
2.5.2

KDJ11-B DIP SWItch cooiiiiiiiiiiiiiiiiiineeeeee 2-7

KDJ11-B Location in MicroPDP-11/73 and

MicroPDP-11/83 oo, 2-9

KDJ11-B AUTOMATIC BOOT MODE.........oooin 2-10
KDJ11-B DIALOG MODE.....cccccccoiii, 2-11
Entering Dialog Mode ......oooooiiiiiiiiiiiiiin, 2-11
Dialog CommAandS .....c..eveeeeeeiiiiiiiiriieeeeiiiee e 2-12
KDJ11-B SETUP MODE ..o 2-13
Setup Command 1: EXit. ..o 2-13
Setup Command 2: List/Change Parameters in the Setup

Contents

2.5.3
2.0.4
2.9.5
2.95.6
2.5.7
2.9.8

2.9.9
2.5.10

2.5.11

2.5.12

Setup Command 3: List/Change Boot Translation in the
Setup Table ..o 2-18
Setup Command 4: List/Change the Automatic Boot ........ 2-19
Setup Command 5: Reserved ..........ccccooininiiis, 2-20
Setup Command 6: List/Change the Switch Boot
PP 2-20
1) (01 A 011 HEUUUUUR SR
oooinniniiie. 2-20
Programs.......ccc...oo
Boot
List
7:
Command
Setup
2-20
..................
Table
Setup
the
Initialize
8:
Command
Setup
Setup Command 9: Save the Setup Table into the
EEPROM Lo 2-20
Setup Command 10: Load EEPROM Data into the Setup
R UPRPPPRR 2-20
o) LT PSP
11
Setup Command 11: Delete EEPROM Boot...........c.......... 2-21
Setup Command 12: Load an EEPROM Boot into
PP PP PPPR 2-21
10) o\ AT
|\(S350

2.5.13

Setup Command 13: Edit/Create and EEPROM Boot....... 2-21

2.9.14

Setup Command 14: Save Boot into EEPROM ................. 2-22

2.5.15

2.6
2.6.1

2.7

Setup Command 15: Enter ROM ODT...............oooiiis 2-22
MSV11-P MEMORY MODULE (-PK, -PL) ..., 2-23
Expansion (CSR and Starting Addresses).......cccccoeeevvvnnnnnns 2-26

MSV11-JD AND MSV11-JE MEMORY MODULES
(IVLBO37 ).ttt 2-27

2.7.1

Error Correction...o.c..oviieiiiiiiiie

2.7.2

Battery-Backup c.oooovviiiiiii

e 2-29

2.7.3

Private Memory Interconnect (PMI)..........coooiiiiiiini. 2-30

e 2-29

2.7.4

Location of the MSV11-JD, -JE Memory ........cocveeviennnn.n. 2-30

2.7.5

Jumper Setting.....ccoooviiiiiiiii

2.7.6

MSV11-JD, -JE Switch Settings ......ocvvviivviiiiiiiiiieiicns 2-32

2.7.7

Memory Address Switch Settings......ccocoeeiiiiiiiiiiiiniiinc
i, 2-32

e 2-31

2.7.8

CSR Address Switch Settings.......ooovveiiiiiiiiiiiniiiieiieeeeenn, 2-34

2.7.9

MSV11-]D, -JE LEDS oo 2-35

2.8

MSV11-Q MEMORY ... 2-36

2.8.1

MSV11-Q Address Switches......ccooviiiiiiiiiiiiiiiiiiieiee, 2-37

2.8.2

MSV11-Q CSR Address.....cooovveviiiiiiniiiieiieeiieeeeeieeean 2-38

Chapter 3

KDF11-B Systems

3.1

INTRODUCTION .o 3-1

3.2

KDF11-B CPU ASSEMBLY ....oooiiiiiiieeeeeeeeee 3-2

3.3

KDF11-B CPU oo 3-3

3.4

KDF11-B BAUD RATE SELECT SWITCHES...................... 3-8

Contents

3.5
3.6

KDF11-B AUTOMATIC BOOT MODE...........oooiiii 3-10
KDF11-B CONSOLE DIALOG MODE ... 3-11

Chapter 4

Diagnostics

4.1
4.2
4.3
4.3.1
4.3.2
4.4
4.4.1

INTRODUCTION .ottt 4-1
START-UP SELF-TEST ..., 4-1
KDJ11-B TESTING PROCEDURE......cccccccooiiiiii 4-2
KDJ11-B MESSAZES ..uunieeeiriieeeeeiiieeiiiiiiinieeereniieseeeceinaee 4-3
KDJ11-B Console Terminal Messages..............c.oeeeeeiieinnn, 4-5
KDF11-B TESTING PROCEDURES ..., 4-8
ettt e eeiiie 4-8
KDF11-B MeESSAZES . .cevveeeeeiiee

4.4.2
4.4.3
4.5
4.6

KDF11-B Diagnostic LEDS....c..ccooiii, 4-10
KDF11-B System Halt......oueioiininiins 4-10
CONSOLE EMULATOR MODE.....ccooiiiies 4-11
KDJ11-B AND KDF11-B OCTAL DEBUGGING
TECHNIQUE (ODT) e 4-11

4.7
4.7.1
4.7.2
4.7.3
4.8

USER TEST DISKETTES. ..o 4-13
User-Friendly Diagnostics (UFD) ..o 4-13
Field Service DiagnostiCS......cveeerrueriiiiiiriimiiinneeiiiineneii 4-15
Field Service Test Diskettes ...coovvveveiiiiiiiiiiiiiiieneee 4-16
OTHER DIAGNOSTIC MEDIA ... 4-17

4.9.1
4.9.2
4.9.3
4.10
4.10.1
4.10.2
4.10.3
4.10.4
4.11

Run-Time Exerciser MesSages ......ceeeuueiiiiiriiiieniniineeeenenee. 4-18
Selecting and Deselecting Program Modules .................... 4-20
Expanding the Run-Time Exerciser..........ccooccoviniinnn 4-21
TESTING WITH THE XXDP+ PROGRAMS........................ 4-21
seinies 4-22
XXDPA4 MESSAGES.cuunneeerriieeeereeeniieeeeiiniaeeeeareriiee
Starting a Program.......cccccooiiiiiiiiiiinini i 4-22
Restarting Programs ........ccccovvviiiiiiiiininnnnii 4-22
Modifying a Diagnostic Program ..........cccccccoeiniiiiinne. 4-23
TROUBLESHOOTING THE BA23 AND BA123

4.9

TESTING WITH THE DEC/X11 RUN-TIME
EXERCISER ..ottt ettt 4-17

e e 4-24
ENCLOSURES..............et

Chapter 5

Mass Storage and Backup Options

5.1
5.2
5.3

e e naae e 5-1
een st s e e e et
INTRODUCGTION oott
RC25 DISK SUBSYSTEM ..., 5-2
RD51, RD52, AND RD53 DISK DRIVES ..o 5-6

5.3.1

Factory Configuration .....ococioioiiiiiiiiiiiii

e 5-7

Contents

5.3.2

5.4
5.9

5.0.1
5.0.2
5.6
5.7

5.8
0.9
0.9.1

5.9.2

5.9.3

Disk FOrmatting.....ocveeenieiiiiiiiiiireri

RQDX1, RQDX2, AND RQDX3 DISK CONTROLLERS.......
RQDX1-E (M7512) AND RQDXE (M7513) EXTENDER
e e e
D UL S oottt
MO

RQDX1-E (M7512 Extender Module ......c.....cooooooininnn.
RQDXE (M7513) Extender Module ........cco.oooeeiiiiiinin
RX50 DISKETTE DRIVE. ...

RLO2 DISK SUBSYSTEM ..ottt

TQK25-EP TAPE DRIVE SUBSYSTEM......cccooviiinnin,
TQK50-KA TAPE DRIVE SUBSYSTEM ..o,

TQK50 (M7546) Tape Controller .........coovveeviiieiiiniinnnannnn.
Unit Number DIP SWitch ..o
Revision Level DIP Switch...coooviiiiiiiii

5.9.4

TQKSE0 LEDS i

5.9.5

TEKSBO LEDS oottt

5.9.6

Additional TQK50 Cabinet KitS..cooovvviiiiiiiiiiiiiiiiieenn,

Chapter 6

Q-Bus Communications and I/O Options

6.1

INTRODUCTION ..o

6.1.1

Ordering OPtIONS ..uuiivuiiiiieeeiiieeeiireerre
et eerneeeneeeenas

6.1.2

Module Configuration ......c..coviveviiiiiiiiiiieieeeceeeeeeeeee
e

6.2

DEQNA ETHERNET INTERFACE ...,

6.3

DHV11 ASYNCHRONOUS MULTIPLEXER ........c.c...oc..

6.4

DLVE1 ASYNCHRONOUS LINE INTERFACE....................

6.5

DLV]J1 ASYNCHRONOUS INTERFACE........ccccoeiiiiiii,

6.6

DMV11 SYNCHRONOUS CONTROLLER......cccccooviiiinn,

6.7

DPV11 SYNCHRONOUS INTERFACE........ooeiiiie

6.8

DRV11 PARALLEL-LINE INTERFACE .....ccccoviviiieine,

6.9

DRV11-B DMA INTERFACE. ...

6.10

DRV11-] HIGH-DENSITY, PARALLEL INTERFACE..........

6.11

DUV11 SYNCHRONOUS SERIAL-LINE INTERFACE ........

6.12

DZQ11 ASYNCHRONOUS MULTIPLEXER - (FOUR

6.13

DZV11 ASYNCHRONOUS MULTIPLEXER..........ccccen.

6.14

LPV11 INTERFACE MODULE .....cccoooviiiiiieiiiece,

Chapter 7

BA23-A Enclosure

7.1

INTRODUCTION ..ooiiiiiiiiiii

7.2

BA23-A FRAME ...

LINES) oo,

Contents

7.2.1
7.2.2
7.3
7.3.1
7.3.2
7.4
7.5
7.5.1
7.5.2

t 7-3
t
eeee e
BAZ23-A BeZEIS .. oo
e s s ennenes 7-4
sanserern
e
e
eene
e
AT CATCULATION o e e eeee e et e e e
7-5
o
.
FRONT CONTROL PANEL .
7-7
iiiiinicnns
.c.cooooooi
Control Panel Printed Circuit Board......
7-7
o
LTC DIP SWItch Uit o
7-8
t
o
MASS STORAGE .
7-8
o
.
.
BACKPLANE ASSEMBLY
7-9
o
..
Panel
ion
Distribut
Mass Storage Signal
7-11
iiiii
iineeeee
iiiimiii
oooveoim
Q22-Bus Backplane ........

Chapter 8

BA23-A FRU Removal and Replacement Procedures

8.1
8.2
8.3

seenia e nnanans 8-1
INTRODUGCTION ..o eeeteee e ettt
ii 8-6
oii
.co
...
L.
REMOVA
CONTROL PANEL
DRIVE
TAPE
TK50
AND
DRIVE
RX50 DISKETTE

8.3.1
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.5
8.6
8.7
8.8
8.9
8.10

TK50/TQK50 INTERCONNECT CABLE REMOVAL...... 8-10
RD5n FIXED-DISK DRIVE REMOVAL ... 8-12
RD51 Disk Drive Read/Write Board Removal .................. 8-15
RD52 Main Printed Circuit Board Removal..................... . 8-20
RD53 Disk Drive Read/Write Board Removal .................. 8-23
RQDX Interconnect Cable Removal ..o, 8-25
BACKPLANE ASSEMBLY REMOVAL ... 8-27
POWER SUPPLY (H7864-A/H7864) REMOVAL.................. 8-32
REAR COOLING FAN REMOVAL ..o 8-36
FRONT FAN REMOVAL ..ot 8-38
MODULE REMOVAL. ..ottt 8-42
REAR I/O INSERT PANEL REMOVAL ..o 8-45

Chapter 9

BA123-A Enclosure

9.1
9.2
9.2.1
9.2.2
9.3
9.3.1
9.3.2
9.4

nnes 9-1
s cnnnsasaseiii
INTRODUGCTION oot eeeeieeeeeeeiiineeeaerrs
9-2
.
ENCLOSURE FRAME ..
9-4
e
ras
e
e
et
e
e
aern
s
e
e
AGE CIrCULATION 1t veeeeeeeeiee e e e e e e et e e et
9-5
e
essnne
iiesness
neesiinm
Temperature SENSOTS ..covirereerreer
9-7
t
o
CONTROL PANEL ..
9-8
ienes
ceniiiiii
iniinieee
CPU Console Board ......ueeieeierereeeeeiiiii
9-10
ee
ienasene
rreeiein
niieeeee
LTC DIP SWitch Uni.omueiereeeiieeeiiiii
9-11
o
.
MASS STORAGE SHELVES .

7.6
7.7

POWER SUPPLY AND FANS ..o, 7-14
REAR 1/O DISTRIBUTION PANEL......ccooiiiiin, 7-19

s e e et e siaa e 8-8
e et e e et e e t
V oo
REMOAL

Contents

9.4.1

Signal Distribution Board........coooooiiiiii 0-12

9.4.2

RD Console Board ......cooveiiiiiiiiie

e 9-13

9.5

BACK
P L ANE e 9-15

9.6

9.7

POWER SUPPLY ..o 9-18
ELECTRICAL DISTRIBUTION ...oiiiiiiiiiiie
e, 9-21

9.8

I/O DISTRIBUTION PANEL ... 9-22

Chapter 10

BA123-A FRU Removal and Replacement Procedures

10.1

INTRODUCTION ..ot 10-1

10.2

REMOVAL OF THE EXTERIOR PANELS ..........ccoocoooii. 10-4

10.2.1

Removal of the Right-Side Panel..............cco.ocoeviiinininnn. 10-4

10.2.2

Removal of the Left-Side Panel.............coooviiivininn, 10-6

10.3

ON/OFF SWITCH REMOVAL......coovviiiiiiiieeis 10-8

10.4

CPU CONSOLE BOARD REMOVAL ..., 10-9

10.5

MASS STORAGE DEVICE REMOVAL ......oooveiiiiiiiie
. 10-10

10.5.1

RD52 Main Printed Circuit Board (MPCB) Removal ........ 10-12

10.5.2

RD53 Disk Drive Read/Write Board Removal .................. 10-16

10.6

FAN REMOVAL ... 10-18

10.6.1

Mass Storage Fan Removal........c.ooooviiiiiieiiiieiiii 10-18

10.6.2

Card-Cage Fan Removal ..........cocooooiiiiiiiieiiiiee 10-20

10.7

MODULE REMOVAL.....coooiiiiiiee

10.8

DOOR SWITCH REMOVAL ...t 10-24

e 10-22

10.9

TEMPERATURE SENSOR REMOVAL ... 10-24

10.10

POWER SUPPLY REMOVAL ... 10-26

10.11

BACKPLANE REMOVAL ...t 10-28

10.12

FILTER CONNECTOR AND INSERT PANEL
REMOVAL ..o, 10-30

Appendixes
Appendix A

Configuration

Appendix B

The PDP-11/23 PLUS System

Appendix C

Formatting a MicroPDP-11 System

Appendix D

Logical Unit Number Designation

Vili

Contents

Appendix E
Appendix F
Appendix G

RQDXE (M7513) Jumper Configurations
Setup Parameters Worksheet
Version 7 and Version 6 ROM Differences

Glossary
Index

FIGURES

1-1
1-2
1-3
1-4
1-5
1-6
2-1
2-2
2-3

2-4
2-5
2-6
2-7
2-8
2-9
2-10
3-1
3-2
4-1
4-1
4-2
4-3
4-4
4-5
4-6
5-1
5-2

BA11-S Enclosure (PDP-11/23 PLUS system only)....cccccccvvviriiinnnnene. 1-2
e e e ea e 1-2
BA23-A ENCIOSUTE ..ottt
s s eeresensin e eans 1-3
et
s
et
et
ea
e
eeeeeetne
et
BAT23-A ENCIOSUT coueeeieeeeeiee
iiniiiaenans 1-5
eeeeeeeeeeeeiiii
iiiiiiiiaieeeiee
...cevvvierimmir
KDF11-BA Startup MeSSAZe
1-6
iiieiini,
iiiiiiiinnii
cccoeeviiiii
MeSSage.....
KDF11-BE or BF Startup
1-6
i
eeeeee
imiiiieeiiiiiii
..ccceeiiiiiiim
KDJ11-BC Startup MeSSAZEe
2-3
o
.
.
KDJ11-B SLU Display Panel
e, 2-4
KDJ11-B Internal Cabling.......cccveeeeiiiiiiiiiiiiiiiee
iieeiaes 2-6
iiiiiiii
ooveimii
.......c
KDJ11-B Module Layout

MSV11-P Module Layout .......oecoeviiiiiiiiiiiiiieri e 2-24
MSV11-]D, -JE Memory Module........cccooiiiiiiiiiinnines 2-28
+5 V Jumper CONNECHIONS ...c.ceveuiiiiiiiiiiiiieaeiitee e 2-29
+5 VBB Battery-Backup Jumper Connections..........cccoveiieiiiiiiiiiiiannns. 2-30
PMI/Q22-Bus INterface .......coocuvriiimiiiiiiiniiiciii i 2-31
MSV11-QA Memory, Revision A ......cccooiiiiiiimiii 2-36
MSV11-QA, -QB, -QC Memory, Revision C......ccooiriviniiiin 2-37
KDF11-B SLU Panel....ooueeeeniiiiiiiieee ettt e e ecna e 3-3
KDF11-B CPU MOAUIE...ceneieniiiiiiieeiie ettt et et ena 3-4
Error Message Screen, Part 1 ... 4-6
Error Message Screen, Part 2 ... 4-6
User Diagnostics Menu, Part 1., 4-14
User Test Diagnostics Menu, Part 2 ..., 4-15
iiii 4-16
i
Service Diagnostics MEeNU .......ccovviiiiiiiiiiiieniiiiii
4-25
iiiin.
Troubleshooting Flow Diagram (Sheet 1 of 2)......cccooiii
Flow Diagram (Sheet 2 of 2) .o, 4-26
RC25 DisK SUDSYSTEIM ..vvvviviivieeiiiiireiiiinirecrririesereetenneteaneannaanassaesaeeseenss 5-4
reneiiii 5-5
e
M7740 Module Layoul ......ueeeveeeeeeemiimiiiiinieie

Contents

5-3

5-4
5-5

5-6

o-7
o-8

5-9

5-10
5-11

5-12
5-13

5-14
6-1

6-2

RD51 Disk Drive and Shunt Jumper ..o 5-8
e 5-9
Disk Drive and JUIMPETS ....oveuiiiiieeiieeeceeer
iiiiiiininniiiiinenn, 5-14
.........ccccooviii
Modules
Controller
RQDX1 and RQDX2
5-18
tt
et
iieeeiie
RQDXI-E MOQUIE...coeneiii
5-21
iie
eieiiiiiiiii
.......cccov
Module
Extender
RQDXE (M7513)
5-25
ees
e
e
e
ev
iiiie
ettt
eie
e
niiii
.cuie
DIIVE
DiIiSKEItE
RX50
5-27
e
eiciii
..ccivuiiiiiiiiiieiii
..
SubSyStem
Drive
Disk
RL0O2
e 5-28
RLV12 Module Layout ......oeviiveiiiiiiieiieiiieeeecie
s 5-30
TK25 Tape Drive SubSystem .......ouueeieeiriiiiiiiiiiiiiiiiiiiiie
e 5-31
M7605 Module Layout .....ooounviiiiiiiiiiieiie
e 5-34
TQK50 Tape Drive SubSysStem ........coeeeiiiiriieriiiiiiiiiiiiiiiieneei

TQK50 (M7546 Jumpers And Switches ......o.cooiiiviiiiiiiiiiiiin, 5-36
DEQNA Ethernet Module (IM7504) Layout ......coooveiiiiiiiiiiiiiiiciienn, 6-4
DEQNA Ethernet Internal Cabling.......oooiviiiiiiiiiiii 6-6

6-7

DHV11 Module (M3104) Layout ....ccoovvuviniiiiiieieereeeeeeeeeeeeeeea 6-8
DHV11 Internal Cabling ... ccouiiviiiiiiiii
et cea e 6-10
DLVE1 (M8017) Module Layout......ccooviuiiiiiiiiiieiecveeeeeeeeee 6-12
DLVET Internal Cabling .....ccooviniiiiiii
e 6-15
DLVJ1 Module (M8043) Layout......cccoovviuiiiiiiiiiieeieiieeeeeeee 6-18

6-8

DLV]J1 Internal Cabling .....cooviviiniiiiiiiiiie

6-4
6-5

6-6

et 5-19

DMV11 Module (M8064 and M8053) Layouts......coccovvvviviineieiiinnnnnnn. 6-23
6-10

DMV11 Internal Cabling .......ooooiiiiii

6-11

DPV11 Module (M8020) Layout....ccccuviveeiiiiiiiiiiiiieieiie e 6-27
DPV11 Internal Cabling .....couoiiuniiiiiiiiiie
e 6-29

6-12

e 6-25

6-13

DRV11 Module (IM7941) Layout....ccccoiiviiniiniiiiiiieieeeeeece
e 6-30

6-14

DRV11 Internal Cabling .....coouviiniiiniiiiii

6-15

DRV11-B Module (M7950) Layout .....ccvovevieiiiiiiiiieeeeeeeceeeeeee
e, 6-34

6-16

DRV11-B Internal Cabling........covivviiiniiiiiiiieieeieeee
e 6-36

e, 6-32

6-17

DRV11-] Module (IM8049) Layout .......ccovvvniiiiiiiiiieiiiiceeeeeceeeeee 6-37

6-18

DRV11-J Internal Cabling.....cccoooviiuiiiiiiiiiiiieiiee

6-19

DUV11 Module (M7951) Layout ....c.coouiiniiiiiiiieeeee 6-40

e 6-39

6-20

DUV11 Internal Cabling......coviuniiiiiiiiiiiiie

6-21

DZQ11 (M3106) Module Layout .....ccoovvviiiiiiiiiii

e 6-42

6-22

DZQ11 (M3106) Internal Cabling........cooovvuviiiiiiiiiiiiiiiiiee
e 6-45

e, 6-43

6-23

DZV11 Module (M7957) Layout .......ccoveiiiiiiiiiiiiiiiieeececeeeeeea 6-46

6-24

DZV11 Internal Cabling ......ccovvuviiiiiiiiiie

6-25

LPV11 Module (M8027) Layout ...cocuvvuiiniiiiiiiieeeeeeeeeeeeeeieeieveeeaee 6-49

e 6-48

6-26

LPV11 Internal Cabling......ccooovviiiiiiiiiiiie

7-1

A Floor-standing BA23-A Enclosure...........ccoooovveiiiiiieiiiiiieeiiieeeeenn, 7-1

e 6-51

7-2

BAZ23-A Frame .....coooiiiiiii

7-3

BAZ23-A Removable BezelS .......oiiiiiiiiiiiiiiiee

e 7-2

e 7-3

Contents

7-4
7-5

eaaes 7-4
t
tt
t
e et
AT L OW oo oot
7-5
e
iciei
iiiiiiii
BA23-A Front Control Panel......covoi

7-7
7-8
7-9
7-10
7-11

Signal Distribution Panel ..o 7-8
Internal Cabling in a BA23-A Enclosure...........coocconi 7-10
BaCKPIANC ... vttt 7-12
e 7-13
Backplane Grant ContinUILY ......ccoeeriiiiireniieeiniiii
t 7-14
e
iii
iiirieiiieii
Location of POWET SUPPIY...uii

7-6

7-12
7-13
7-14
8-1
8-2
8-3
8-4
8-5
8-6
8-7
8-8
8-9
8-10
8-11
8-12
8-13

ee 7-7
e
Control Panel with PC Board ......o.oviviiiiiiiiiiecine

Power Supply Rear VIeW......ooooiiiiiii 7-18
Rear 1/O Distribution Panel (KDJ11-B SLU Display Panel Shown)...... 7-19
1/O Insert Panels and Adapter Plate ..., 7-21
BA23-A Enclosure FRUS ..ouiii e 8-5
e 8-7
Control Panel Removal....o.oeeniiiiiiieieieeeieeee
iriiiiiiins 8-9
ccooiiv
.......
Removal
RX50 Diskette Drive
e e i 8-10
tt
ot
..
Access Cover RemMOVAL
evvenennn 8-13
Shown)...ccc
Drive
Disk
(RD51
Removal
Drive
k
RD5n Fixed-Dis
8-14
i
iiiice
iiiieeiiiecc
eeiiiiiiiiei
SEtHNZ..coue
RD52 Jumper CHP
8-15
iiiii.
oooooii
......c
Removal
Plate
Skid
RD51 Disk Drive
8-16
.
..............
Removal
P5
r
Connecto
and
Screws
Allen
RD51 Disk Drive
8-17
iiinnn,
.....ooeeeei
P4..........
and
P8,
P7,
P6,
rs
Connecto
RD51 Disk Drive
8-19
iie
s
iiineneneni
iiiiianreer
eimmoriiiii
...ueereeei
Setting....
Pack
DIP Shunt
8-20
t
e
iiine
eiiiiieeeeii
.ooouuiiiiie
Removal.....
Slide Plate
8-21
o
.
.
Removal
Screw
and
r
Connecto
Two-Pin
8-21
t
e
i
ieiineeiiiii
ccoouiiiiioi
Removal.....
Bezel
Front

8-14 Removal of Phillips Screws from Heatsink.........ccooooiiiin 8-22
a s 8-22
et t
8-15 MPCB ReMOVAL .eiieiiiiie e ett
iiiii 8-24
ooeiii
..cccc
l.....
Remova
Board
te
Read/Wri
RD53
8-16
8-26
iinii
8-17 Access Cover Removal.......ocoevviiiiiiiiii
PP PP PP E LD PPPPPPRTTEED 8-27
y
P PSSP
oIT Voo <11 YU U T TP
8-19 Cables and Module Removal........ccooiiiiiiii 8-29
8-20 Access Cover and Screw Removal .......cooooiiiiiii 8-30
8-21 Backplane Removal.........ccoooiiiiiiiiii 8-31
8-22 Power Supply Removal.......ccooiiiii 8-33
8-23 Power Supply and Fan Connector Removal.........ccccoviiinniiicnnnn. 8-34
894 Rear Fan Power Cable Installation and Routing.........cccooviiiiiicenanees 8-35
8-25 Removal of Fan from ChassiS ... 8-36
8-26 Rear Fan Installation........c.......... e 8-37

8-27
8-28
829
8-30

Front Cooling Fan DisCONNECTION .....eeevveeeiiiiiiiiiriiiniiieiiennneneees 8-39
Front Cooling Fan Removal.......coccoiiiiiiiiiees 8-40
Front Fan Power Cable and Fan Guard Connection............occocoeeeeennn. 8-40
Replacement Fan Installation ..o 3-41
XI

Contents

8-31
8-32
8-33
9-1

9-2
9-3

9-4
9-5
9-6
9-7
9-8

9-9

Module Removal....oooe e 8-43
Quad-Height Module Ejector Levers......cooccoo 8-44
Rear I/O Insert Panel Removal ..., 8-45
ettt e et et e ensaaas 9-1
BAT23-A ENCIOSUTE ..ottt

BA123-A Removable Panels and Doors......cccoviiiiiiiiiiiiiiiiinn, 9-3
e 9-4
AT W ettt
PC Board .........ccccooiiiii 9-6
Temperature Sensor
Mass Storage ShEIVES....oii i 9-7

CPU Console Board ......o.vieiiiiie et 9-8
Typical Arrangement
of
DeviCes.....coviiiiviiiiiiiiiiiiiiiic
e, 9-12
Signal Distribution Board.........cocooviiiiiiiiiiiiii 9-14
Signal Distribution Board Cabling...........oooviiiiiiiiiiiiii, 9-14

9-10

Backplane Grant ContinUILY .......ceoiuueeeiireiiiie

9-11

Backplane ConnectorsS.....cooieiiieiiiiiee

een e e e 9-15

9-12

POW
T SUDDIY .o 9-18

et 9-17

9-13

Circuit Breaker, Voltage Select Switch, Connectors (Rear View)........ 9-20

9-14

Electrical Distribution......coooiiiiiii e 9-21

9-15

Rear I/O Panel.......coooiiiiii

9-16

Filter Connectors and Adapter Plate........coooviiiiiiiii, 9-24

e 9-23

10-1

BATIZ3-A FRUS oot 10-3

10-2

Right-Side Panel Unhooking
..........coviiiiiiiiiiiiiii

10-3

Right-Side Panel Removal ... 10-5

10-4

Left-Side Panel UnhooKINg ......ccoviveiiieiiiiii

10-5

Left-Side
Panel Removal ........c.oooiviiiiii

e 10-7
e, 10-8

e 10-4
e 10-6

10-6

On/Off Switch Removal ..........ooooiiiiiiii

10-7

CPU Console Board Removal ......cooueiiviiiiiiieiiee

10-8

RD52 Jumper CHP SettIng...ouvieniiiiiieeieee

10-9

Slide Plate Removal... ..o 10-12

e, 10-9
eeeeens 10-11

10-10

Two-Pin Connector and Screw Removal .....ccoovvviiiiiiiiiiiiiiiieee 10-13

10-11

Front Bezel

10-12

Removal of Phillips Screws from HeatsinKk.......ccooovviveiieeiiiiiieiiiei 10-14

Removal.......oooiiiiniiiii

e 10-14

10-13

Main Printed Circuit Board Removal .......oooviiiiiiiiiiieeieeieeeeeeeeee 10-15

10-14

RD53 Read/Write Board Removal............oooooiiiiiiiiii 10-17

10-15

Mass Storage Fan Removal...........ooooovviiiiiiiiiiiiiiiiieeeee
e, 10-19

10-16

Card-Cage Fan Removal........ooooiiiiiiiiiiieee

10-17

Module Removal........ccoooiiiiiiii

e 10-21

e 10-23

10-18

Temperature Sensor/Door SWItCh.......oooveiiiiiii i 10-25

10-19

Power Supply Removal........oooiiiiiiiee

10-20

Backplane Removal........cooooiiiiiiiiiin

10-21

Filter Connector Removal .......ccooommiiiiiie
e e 10-31

A-1

BA23-A Configuration Worksheet .......cocoooeeeeeeeeeeeee

e 10-27
e 10-29

e A-7

Contents

A-2
A-3
A-4
A-5

BA123-A Configuration Worksheet .........cccocccciiiiiii A-8
Cable Connections for a BAZ23-A SyStem ....cooviiiiiiieiiieeiiieeiieeieeeeeees A-13
BA23-A Backplane Setup for an Expandable System .............cc.ocoeeenn A-14
Cable Connections for an Advanced Configuration...........ccooeoiviniinnnn.e. A-15

B-4
B-5
B-6
B-7
B-8
B-9
B-10
B-11
B-12
E-1
E-2
E-3
E-4

Bezel Assembly Printed Circuit Board ..........cooooiiiii, B-14
Bezel ASSEIMDBIY ..ot B-15
BA11-S Voltage Selection SWitCh......ccooooiii B-16
H9276 Backplane JUMPETS ....coeeiiiiiiiiiiiiiiieieee et B-19
PDP-11/23 PLUS System (Rear VIeW) ......ccocveiiiiiiniiniie B-20
H349 I/O Distribution Panel........c..cccooviiii B-21
Filter Connectors and Filter Connector Assemblies..........c...ooooiiiiiininss B-22
PDP-11/23 PLUS Internal Cabling.......ccccoviiiiiiiiiiie B-23
PDP-11/23 PLUS External Cable Routing ..........cccoociiniiiiniiiiie B-24
Three Possible Disk Drive Arrangements (Factory \ Setting) ............ E-3
Three Fixed-Disk Drives with an RQDXE (Arrangement 1)................ E-4
An RX50 and a Fixed-Disk Drive with an RQDXE .........ccccooiiiiin, E-5
An RX50 and Two RD5n Disk Drives with an RQDXE
(ATTANGEIMENT 1) 1iiiiiiiieeiieiieiii e E-6

A-6
A-7
A-8
A-9
A-10
B-1
B-2
B-3

E-5

E-6
E-7
E-8
G-1

BA23-A Advanced SySteml.......ooiiiiiiriiiiiiieiii A-15
Cable Connections for a BA123-A System .....ccooveiiviiiiiiiiiniiiniieiiens A-16
BA123-A Backplane Setup for an Expandable System................cc.c..... A-17
BA123-A Cable Connections for an Advanced Configuration e, A-19
BA123-A Advanced SyStem......coceiiiiiereiiiiiiriiiiiiiiei e A-20
BA11-5 Major Assemblies ......ccceiviimiimiiiiiiiiiiieeeeie e B-9
BA11-S Enclosure with Cover Removed .........ccoooiiiiiiiiis B-11
Front Panel Switches and Indicators......cooovviiriiiiiiiiiiieeenn, B-12

A Fixed-Disk Drive and an RX50 in a BA23-C

EXpansion BOX.....ccoeiiriiiiiiiii

i E-7

An RX50 and Two Fixed-Disk Drives (Arrangement 2) ...........ccceeeee E-8
Two Fixed-Disk Drives and an RX50 (Arrangement 3)...........ccceeeennn. E-9
Three Fixed-Disk Drives (Arrangement 2) ......cccoiviininriiiiiininneeeninnnen. E-10
Sample Autoboot DISPlay.......cccoiiriiiii G-5
TABLES

1-1
1-2
1-3
1-4
1-5

Q22-BUS ENCIOSUIES...ttirreieeeeeeriiiiiiiiiirictere et 1-1
Central Processing Unit (CPU) Types.....ccooviiiiiiiiiii 1-3
Module Number Identification .....c..evvereverrniviiiiiiiiieiinereneieeeaans 1-4
reeie 1-4
et eiaenaes
MS8189 ROMsS IdentifiCation .....vuueieeererieeeiiiiiieiiineriae
CPU REf@IOIICES - n et

e et e et ettt e e e e e st e e e s e saanenanes 1-7

Contents

2-1

2-2
2-3

2-5

2-6
2-7

2-8
2-9

2-10
2-11

2-12

2-13
2-14

2-15
2-16

2-17
2-18

2-19

KDJ11-B Factory Setting ...oeeveuiiiiniiiiiiieiieiee e 2-6

Baud Rate/Mode Select SWItCh ..o 2-7
e 2-8
KDJ11 Switches 2, 3, and 4 .....ccooeeiiimiiiiiiiiii
iiiiiiiiiii, 2-9
.....cccooo
8
and
Switch Settings for Switches 6, 7,
2-13
e
iiiiiiiieiee
Setup Mode Commands .........coovveriimi
2-14
onn,
........cco
Values.....
Parameter
KDJ11-B Setup Default
2-15
eiinee
ereaaenanee
eeeieeiieeieeiin
..oveiunieererii
ROM Code Mode SeleCtiOnsS.....
essesbiaeeeees 2-16
e eeiiie e e e eeeeetiie
PMG Count SETHINES...ouuuiiieiiiiiiieeeeiiiiie

Clock SIgNal SOUICES .uuuiiiiiieeeeeeeeeiiiiiiiiiiiiirs e 2-16
ROM Addresses Disabled .......coviiiiiiiiii 2-17
enaeaeeeenes 2-22 .
ieeieeiaer
et eteeneeeeeeeestne
ROM ODT COmMMANdS....cuvieniiiiiiniiii
e 2-23
MSV11-P Memory Modules ....c.ooiiiiiiiiiiieeirii
MSV11-P Factory Jumper Configuration...........ccoceeeviiiiiiiininniiiiiinnnnn, 2-25
e 2-26
MSV11-P CSR Configuration .........c.evieeveeereeiiieiiiieeeiieeceiniee
MSV11-P Starting Address Configuration..........cccoeeevvevnviiiiniinniiinnen, 2-27

D, ......ccoiiiiiiiiiiiiiiiiiien, 2-28
-JE Memory Modules
MSV11-]
riieeeniireeniineeinneninnenn, 2-31
]D,
JE Jumper Configurations.......ccoeeeeeuve
MSV11MSV11-JD, -JE Starting Memory Address Selection ...........ccccc........... 2-33
Common Memory Starting Address, MSVI1-J......coooooiiiiiiniiin 2-34

3-1

MSV11-] CSR Address Selection ......ciuevieiiiiiiiiiiiiieiiriiereevee
e 2-35
MSVT11-Q VATIANES 1ottt
ettt e e 2-36
MSV11-Q Address SWItChes....oooviiiiiiiiie
e, 2-37
MSV11-Q CSR AdAress.....iiveniiiiiiiiie et 2-38
MSV11-Q Factory Jumper Settings......coveiuiiiiiiiiiviiiiiiieiee
e 2-39
SLU Connector Pin FUunction.........ccooiviiiiiiiiiiiiie
e 3-2

3-2

KDF11-B Module Factory Jumper Configuration..........coceeevnvivinnrnnnenns 3-5

3-3

KDF11-B Module Factory Switch Configuration...........ccooevveviiieiinneaens 3-6

2-20

2-21
2-22
2-23

2-24

3-4

KDF11-B Diagnostic/Bootstrap Switch Settings (E102).........ccceuueeeeeee. 3-7

3-5

KDF11-B Baud Rate Switch Settings......oovvveiiiiiiiiiiiieiiiieeeceeeeeeeees 3-9

3-6

S2 (E114) Switch Pack Settings.....oooviiiiiiiiiiieiieeeeeeeee 3-9

4-1

Self-Test LISEING ...oiiiiiiiiiiiioe
e
e e e e ea e e eae e 4-2

4-2

KDJ11-B Self-Test and Boot/Diagnostic ROM Messages..................... 4-4

4-3

KDF11-B Self-Test and Boot Diagnostic ROM Messages.................... 4-9

4-4

List of LED Self-Test Display Codes ......ccoovviiiiiiiiiiiiiiiiiiiiiiieeeeeies 4-10

4-5

Console
ODT Commands.......couuuiieiiiiniiiieeiieeieeeeeeeeeee e 4-12

4-6

Select/Deselect CommandsS.........eviuiiiiiiiiiiiiiie

4-7

XXDP+ Diagnostic Programs.......ccccoeviviiiiiiiiiiiiiicicieeee
e, 4-21

e 4-20

o-1

M7740 CSR Address...couiiiieiiiieeieeiee

5-2

RD51 DIP Shunt Pack Factory Setting........coooovviiiiiiiiiiiiiniiiieieen 5-7

5-3

RQDX1, RQDX2, and RQDX3 Factory Jumper Configuration............. 5-15

5-4

RQDX1-E Factory Configuration...........ccoeeviiiiiiiiiiiiniiiiieeeeieeeeeee 5-19

X1V

e 5-3

Contents

5-5
5-6
5-7
5-8
5-9
5-10
5-11

Three Possible Arrangements Using the RQDXE ... 5-22
RQDXE Jumper Setting (Factory Configuration) .........ccceceviiiriniinces, 5-23
Three Fixed-Disks With an RQDXE ..o, 5-23
RQDXE Configuration for Three Fixed-Disk Drives.......c..cccoooceee 5-23
et e et ettt e e et s e e s s e ens 5-29
RLV 12 CSR AdAreSS..neetieeeeeeiie
it 5-29
..ouueeeeiiiiie
VECtOr
RLV12 Interrupt
ettt s e e 5-32
ceneieiiiiiiieiee
..
M7605 CSR AdAreSS

6-27

iii 6-47
e
DZV11 Interrupt VECOT .iivieeieeiiiiiiiiiiiiiiiiii

5-12 M7605 INterrupt VECLOT ..ovuueeiieeiiiiiieeeeiiie e 5-32
e 5-35
5-13 M7546 Fixed CSR Address..ccciuniiiiiiiieiieieeiiiecee
, 5-36
iiiiiiiieenn
..cocciviiii
Settings....
Pack
Switch
5-14 Unit Number
5-37
o
.
.
Pack..
Switch
Level
5-15 Revision
5-39
iiin.
ooieiiiiiinn
........cooo
Description.
and
Number
Part
5-16 TQKS50
iinee 6-5
i,
DEQNA Ethernet CSR Addresses.....ccoeveeiiiiiiiiiiiieiiiiiiii
6-1
6-5
nniniii,
iiiiiiiiiiii
.....cooviii
VeCtors
Interrupt
Ethernet
DEQNA
6-2
6-9
eenaes
s
ieeinieesnans
eeaeeeeeeieeet
iieeeiiieeeeii
«eeenneeeeeeee
AQAIeSS
CSR
11
DHV
6-3
DHV 11 Interrupt VeCtOr . .oovvviiiiiiiiiiiiiiies et 6-9
6-4
i 6-12
st eneesienenes
DLVET Fixed CSR AddreSSeS ..couiiuniieiiiieiiieeeieeieeiiei
6-5
6-13
t
e
iiiiiiee
..ouuuiereeeeiieri
VECtOr
Interrupt
DLVET
6-6
6-13
iiiiiin,
ccviiriii
.........
Setting
Factory
Jumper
DLVE1
6-7
6-14
nrien
eeaeenaeen
e
iieiiciiiieri
iiiieiieiiiei
......ocivuvv
SeleCtion
Rate
Baud
DLVEL
6-8
6-17
seneeeeeeees
eiieiiere
s
e
e
aeaeea
e
re
e
eeeieeiiiii
vnreieiiiii
wuvvvvvivri
AQAIESS
CSR
DLV]T
6-9
6-10 DLVJ1 Interrupt VeCtor . uuueieee et 6-17
6-11 DMV LT VeI SIONS ceuurneeieineitereeenaeeeaeeteenneetueetaetiaetraseranaraeatueraetiasnas 6-21
e e s et e e 6-21
65-12 DMV 1T INteITaCeS ceenneieeiiieee ettt
e 6-22
s e ereieeei
eeiiaeen
ettt
6-13 DMV 11 CSR AdAresS..cuneieniiiiiiii
e 6-22
6-14 DMV11 Interrupt VEeCTOr ..viiiiiiiiiiiiiiiiiic
e, 6-24
6-14A DMV 11 Switch SelecSettingsS..cooueiiiiieiieeiiiieiii
ane 6-28
eeeeee
e eneeraraeseeenaa
etiieeiiei
6-15 DPV 11 CSR AddresS..eeuiiniieiiiiie
et 6-28
6-16 DPV11 Interrupt VECIOT couviiiieiiiiieeeiiiie
enaes 6-31
et een st ee
et r eieeei
iiiiie
ettt
6-17 DRVI1 CSR AdAIeSS ovuneieneiii
6-18 DRV11 Interrupt VeCTOr .ooveiiriiiiiiiiiiiiiiiii e 6-31
ane 6-35
e cenns i in
eciiieeii
et reri
65-19 DRV11-B CSR Address ..couuiiiiuniiiiiaeeeiieeei
6-35
icii
i
6-20 DRV11-B Interrupt VecCtor ..ooooieeiiiiiiiiiiiiiii
6-21 DRV11-] CSR AdAress . couuuuiieeeeeeiiiiiiiiiiiieieiieiiiiiisee et 6-38
e 6-41
et
eee e eeieeii
iiieii
et
6-22 DUVI1 CSR AdAreSS .ueeniieiiin
6-23 DUV Interrupt VeCtor ..o e iiiiieiiiiiiiiiii i 6-41
6-24 DZQ11 CSR AdAresS...couvuuiieeeeeeeeiiiiiiiie ettt 6-44
6-25 DZQ11 Interrupt VECTOT .ovveeeeeee ittt 6-44
6-26 DZVI1 CSR AdAreSS..uucieieiiiiiiiiieeeeeiiae ettt e i 6-47
6-28

LPV11 CSR AdAIeSS ..ot 6-50

Contents

6-29

6-30

7-1

7-2
7-3
7-4

8-1

8-2
9-1
9-2
9-3
10-1

A-1

LPVI11 Interrupt VeCtOr. o 6-50

6-50
et
LPV11 Jumper Configuration ..........oeveiiiereineiiiniiiiiiiiieiiinn
7-3
e
ieeiiineeiiniiii
.......coovivuevim
SpecifiCations
Enclosure
BA23
Front Control Panel Controls and Indicators......c.cooeiiiiniiiiiin.. 7-5
H7864-A Power Supply Specifications (Rev. 20) .....ccooiviiviiiiiinnn. 7-16
H7864 Power Supply Specifications (Rev. 12)....coooiiiiiiiiiiii. 7-17
Field Replaceable UnitS....ooviiiiiiiiiiiiieeeieece et 8-2
RD51 Jumper Configuration .......cceeeueeeiviieeeiiiereiieeeiee
e 8-18
CPU Console Board Controls and Indicators.........cooovviiiiiviiiiiiininn.e 9-9
RD Console Board Controls and Indicators.......ccccooeiiiiiiiiiiiiiiiinineenn. 9-13
Regulators A and B Current and Power..........ccoeviiiiiiiiiiiiiiiiiiiinnen. 9-19
BAT23-A FRUS oottt 10-1
Order of Modules in the BA23-A and BA123-A Backplane.................. A-3

A-2

BA23-A Current and Power LimitS.....cooiiiiiiiiiiiiiiiiiiecieeeeee A-4

A-3

BA23-A Power Requirements, Bus Loads, I/O Panel.........c................. A-5

A-4

Address/Vector Worksheet......ooviviiiiiiiiiiiiii

e A-10

A-5

Floating CSR Address Chart .......oooiiiiiiiiiiiii

e, A-11

A-6

Sample Worksheet for Generating CSR Addresses.......cccoooovvvviennennnn... A-23

A-7

Blank Worksheet for Generating CSR Addresses .........ccovvevvviviiiinnninns A-24

B-2

KDF11-BA Factory Jumper Configuration .........cccoovvvivvviiiiiniiiinniiinnnnen, B-3

B-3

Break on Halt Jumper ConfigurationS........ccccoooeviiiiiniiiiniiiieiieeccenne, B-4

KDF11-BA Factory Switch ConfigurationsS........coccoevviiiiiiniiiinniinnecinn... B-2

B-4

On-Board Device Selection JUMPEeIS. ..ot B-4

B-5

Halt/Trap Jumper Configuration.......oovvuniiieiiieieeeee

B-6

Power-Up Mode Jumper ConfigurationsS......c.cooooevvvieviiiiiiniiiiieeiiinniennn.. B-6

e B-6

B-7

ROM or EPROM Jumper Configurations ........cccccoveiiiiiniiiiiiieiieneiennnn. B-7

B-8

SLU Character Format Jumper ConfigurationS.........ccoeeeveeveveinereennnn... B-7

B-9

Switch S2 (E114) SLU Baud Rate Speed Select......ooovvvveveoviieineeeenn.... B-8

B-10

BA11-S Front Panel Controls and Indicators ........ccooovvvivoeiiiiiiiniinnienn, B-13

B-11

Bezel Assembly JUMPETS ..o B-14

B-12

H7861 Power Supply SpecifiCations ......ccoeevvivviiiiiiieiiiiiiee

B-13

H9276 Backplane Jumper Settings.....cooviuviieiiiiiiiieiieeeeeeieeeeeeeenn B-19

D-2

RQDX Logical Unit Number Jumper Configuration ..........ccccoveeeeennnn.... D-2

D-3

RQDX Unit Number And Jumper Format.........ooooverviimieiiiiieesin., D-3

e B-17

RQDX Standard LUN Configuration .........oeceeeoiieioeeeieeieieeeeeaeeeen D-2

E-1

RQDXE Jumper Setting (Factory Configuration) .........cccvveveevevveeeennn, E-3

E-2

RQDXE Jumper Setting for Three RD5n Disk Drives

E-3

RQDXE Jumper Setting for an RX50 and Fixed-Disk Drive................ E-5

E-4

RQDXE Jumper Setting for an RX50 and Two

(Arrangement 1) .ooiiiiiiiii e, E-4

Fixed-Disk Drives (Arrangement 1) ......coovveieooeeeeieieeeeeeeeeee, E-6

XVI

Contents

E-5

E-6
E-7

E-8

F-2

F-3
F-4

G-1

RQDXE Jumper Setting for a Fixed-Disk Drive and an

RX50 in a BA23-C Expansion BoX ......cooviiiiiiiiiiiiiiiiiiirncn, E-7
RQDXE Jumper Setting for a RX50 and Two Fixed-Disk
Drives (Arrangement 2)......cccovveeeeeeiieeeiieeiiiiii e E-8
RQDXE Jumper Setting for Two Fixed-Disk Drives and an
e, E-9
RX50 (Arrangement Three) .....ccooeviiiiiiiiiiiiiiiiiiiiiie
RQDXE Jumper Setting for Three Fixed-Disk Drives

e et e e e e e s e e e re et E-10
(ATTANZEIMENT 2) 1oitiiiiiieeeeeeeee et
Setup ComMmMAN 2 ...vvviiiiiieeeee e F-2
Setup Command 3 .....iiiiireereee e F-3
Setup Command 4 .........oooiiiiiiiii F-4
Setup Command 6 — Switches 2, 3, and 4 .......cccoooii F-5
KDJ11-CPU ROM Part and Version Numbers.........cccccooviiiiiiiiiiiinnn, G-1

Introduction

This manual is one of a set that describes the MicroPDP-11 systems in a BA23-A
or BA123-A enclosure. The manual is intended for service personnel. The
MicroPDP-11 Systems Owner’s Manual (EK-MIC11-OM) describes the unpacking,
installation, checkout, and normal operation of the MicroPDP-11 systems in the
BA23-A enclosure. The MicroPDP-11 Systems Owner’s Manual, DIGITAL P.N.
AZ-GLIAA-MC, provides the identical information for the BA123-A enclosure.

The MicroPDP-11 Systems Technical Manual describes the enclosures as well as
providing option, configuration, and diagnostic information. Refer to EK-MIC11-TM
for BA23-A enclosure information, and AZ-GLHAA-MC for BA123-A enclosure
information.

The KDJ11-B CPU User’s Guide (EK-KDJ1B-UG) describes the use and operation

of the KDJ11-B CPU module. The KDF11-BA CPU User’s Guide (EK-KDFEB-UG)
describes the use and operation of the KDF11-B CPU module. The MicroPDP-11
Hustrated Parts Breakdown (EK-OLCP5-IP) shows the mechanical breakdown of
the MicroPDP-11 in the BA23-A mounting enclosure. The MicroPDP-11 Illustrated
Parts Breakdown (EK-BA123-IP) shows the mechanical breakdown of the
MicroPDP-11 in the BA123-A mounting enclosure.
Notes, Cautions, and Warnings

Any notes, cautions, and warnings that appear in this manual are defined as follows:
e

A NOTE contains general information.

e A CAUTION contains information to prevent damage to equipment.

e A WARNING contains information to prevent personal injury.

Y 1Y

Introduction

Related Documents”
MicroPDP-11 Systems Owner’s Manualt
MicroPDP-11 Systems Owner’s Manualt

EK-MIC11-OM
AZ-GLIAA-MC
EK-MIC11-SG
EK-OLCP5-1P

MicroPDP-11 System Illustrated Parts Breakdown?

EK-BA123-IP

MicroPDP-11 Systems Service Maintenance Guidet¥
MicroPDP-11 System Illustrated Parts Breakdownt
MicroPDP-11 Systems Technical Manualt
MicroPDP-11 Systems Technical Manualt
KDJ11-B CPU User’s Guide
KDF11-BA CPU User’s Guide
RQDX1 Controller Module User’s Guide
RQDX2 Controller Module User’s Guide
RQDX3 Controller Module User’s Guide

EK-MIC11-TM

AZ-GLHAA-MC
EK-KDJ1B-UG

EK-KDFEB-UG
EK-RQDX1-UG
EK-RQDX2-UG
EK-RQDX3-UG

Microcomputer Interfaces Handbook

EB-20174-20

Microcomputers and Memories Handbook

EB-18451-20

You can order these documents from:
Digital Equipment Corporation

Accessories and Supplies Group
P.O. Box CS52008
Nashua, NH 03061

Attention: Documentation Products

Glossary Location
Glossary references are located at the end of the book. Additional glossary references are located in the glossary of common computing terms found in the owner’s

manual for your system.

The text of this document contains additional references to Digital documents.

T BAZ23-A enclosure

T BA123-A enclosure
XX

Introduction

Acronyms Used in this Document

A list of acronyms that appear in this document follows. Note that signal names,
acronyms displayed in messages, and acronyms utilized by diagnostic programs are
not included in this list.
ANSI

American National Standards Institute

ASCII

American Standard Code for Information Interchange. Also a 7or 8-bit standard for transmission of data for processing

APC

Assembled program count

BCSR

Boot control and status register

BOT

Beginning of tape

CCITT

Comité Consultatif Internationale de Téléphonie et Télégraphie
(International Telephone and Telegraph Consultative Committee)

CSR

Commercial instruction set
Central processing unit
Control status register

DIP

Dual in-line package

DMA

Direct memory access

Disk unit

ECC

Error correction code

CIS
CPU

EEPROM

Electrically erasable programmable read only memory

EIS

Electronic Industries Association
Extended instruction set

EOT

End of tape

EIA

EPROM

Erasable programmable read only memory

ERR

Error

Floating point

FPP

FRU

Floating-point processor
Field replaceable unit

1/0

Input/output

LED
LSB

LSI

LTC
LUN

MMU
MOS

Initialize polling (usually refers to an address in the CSR)

Light emitting diode
Least significant bit

Large-scale integration
Line time clock
Logical unit number
Memory management unit
Metallic oxide semiconductor

XX|

Introduction

MPCB
MSB

Main printed circuit board
Most significant bit

ODT

Mass storage control protocol
Octal debugging technique

Printed circuit

MSCP

PMG

Processor mastership grant

Purge and poll (refers to a diagnostic procedure)

PROM

Programmable read only memory

PSW

Processor status word

RAM

Random access memory

ROM

Read only memory

Starting address (refers here to a location within the CSR)

SDLC

Synchronous data-link control

SLU

Serial line unit, used here in associated with a CPU module

SYS ERR

System error

UART

Universal asynchronous receiver/transmitter. A device that
performs parallel-to-serial and serial-to-parallel conversion.

VOLT SEL

Voltage select

System Identification

1.1

IDENTIFYING THE SYSTEM (ENCLOSURE)

This manual describes the three Q22-Bus enclosures listed in Table 1-1.
Table 1-1

Q22-Bus Enclosures

Enclosure/
Illustration
BA11-S

CPU
KDF11-BA

System Name
PDP-11/23 PLUS

Enclosure
Discussion
Appendix B

BA23-A
Fig. 1-2

KDJ11-BC, BB
KDJ11-BF

MicroPDP-11/73
MicroPDP-11/83

Chapter 7
Chapter 7

BA123-A
Fig. 1-3

KDJ11-BC, BB
KDF11-BE*, BF

MicroPDP-11/73
MicroPDP-11/83

Chapter 9
Chapter 9

Fig. 1-1

KDF11-BE*, BF

MicroPDP-11/23

Chapter 7

* KDF11-BE has been replaced with KDF11-BF

These enclosures are shown in the following figures.

1-1

System ldentification

Figure 1-2

1-2

BA23-A Enclosure

System Identification

Figure 1-3

1.2

BA123-A Enclosure

|IDENTIFYING THE SYSTEM (CPU)

This manual describes the five CPU types listed in Table 1-2.
Table 1-2

Central Processing Unit (CPU) Types

CPU Type

Module

Model Name

CPU Discussion

KDF11-BA
KDF11-BE or BF
KDJ11-BB
KDJ11-BC
KDJ11-BF

M8189
M8189
M8190-AB
M8190
M8190-AE

PDP-11/23 PLUS
MicroPDP-11
MicroPDP-11/73
MicroPDP-11/73
MicroPDP-11/83

Chapter 3
Chapter 3
Chapter 2
Chapter 2
Chapter 2

The following sections tell how to identify the CPU.

1-3

System Identification

1.2.1

Identifying the CPU (System Off)

When the system is off, you can identify the CPU by any of the following:
e

The computer model name.

e The module number printed on the module handle (Table 1-3).
e The enclosure. A PDP-11/23 PLUS is mounted in a BA11-S enclosure. The
MicroPDP-11/23, MicroPDP-11/73, and MicroPDP-11/83 systems are mounted
in BA23-A or BA123-A enclosure (Figures 1-1 through 1-3).

e The ROMs installed on the KDF11-B (M8189) module (Table 1-4).
Table 1-3

Module Number Identification

CPU Type

on the Module

Module Number

KDF11-BA, BE, BF

M8189

KDJ11-BC

M8190

KDJ11-BB

M8190-AB

KDJ11-BF

M8190-AE

Table 1-4

M8189 ROMs Identification

ROMs Installed

CPU Type

23-339E2 and 23-340E2

KDF11-BA

23-238E4 and 23-239E4

KDF11-BE

23-183E4 and 23-184E4

KDF11-BF

A PDP-11/23 PLUS system (KDF11-BA) in a BA11-S enclosure can be upgraded in
the field to MicroPDP-11/23 operation (KDF11-BE or BF) by installing new ROMs
and changing jumpers on the CPU. (See Table 3-2 for jumper differences.) To
determine if the BA11-S system has been upgraded, check the ROMs on the CPU
module, the jumper settings, and/or the power-up self-test screens.

1-4

System Identification

1.2.2

Identifying the CPU (System On)

If the system is operating, you can identify the CPU by the power-up self-test
messages displayed on the terminal console as follows:

e The KDF11-BA CPU powers up in Octal Debugging Technique (ODT) and displays a very abbreviated message (Figure 1-4).

e The KDF11-BF CPU displays a “9 Step Memory Test” message (Figure 1-5).

e The KDJ11-B CPUs display a “Testing in Progress” message (Figure 1-6).

Testing Memory
256 KW
Start?

Figure 1-4

KDF11-BA Startup Message

1-5

System ldentification

KDF11-BE ROM X0.XX
128 KW Memory

9 Step Memory Test
Step 123456789

Figure 1-5

KDF11-BE or BF Startup Message

Testing in Progress - Please Wait

123456789

Starting System

Figure 1-6

1-6

KDJ11-BC Startup Message

System Identification

Once the CPU type is identified, refer to the sections in this book listed in
Table 1-5. These sections will provide a detailed discussion, diagnostics information, and configuration information for each CPU.
Table 1-5

CPU References

CPU

Discussion

Diagnostics

Configuration

KDF11-BA
KDF11-BE or BF
KDJ11-BC or BB
KDJ11-BF

Appendix B
Chapter 3
Chapter 2
Chapter 2

Chapter 4
Chapter 4
Chapter 4
Chapter 4

Appendix A
Appendix A
Appendix A
Appendix A

1-7

KDJ11-B Systems

2.1

INTRODUCTION

A BA23-A enclosure containing a KDJ11-BC or KDJ11-BB CPU module is referred
to as a MicroPDP-11/73 system. It contains the following modules:
KDJ11-BC or KDJ11-BB CPU module
MSV11-PL memory module

RQDXn controller module supporting mass storage devices
Communication module, usually a DZQ11 or DHV11

(Optional) TQK50 controller module supporting a TK50 tape drive

A BA23-A enclosure containing a KDJ11-BF CPU module is referred to as a
MicroPDP-11/83 system. It contains the following modules:
KDJ11-BF CPU module

MSV11-]JD or MSV11-JE memory module

RQDXn controller module supporting mass storage devices
Communications module, usually a DZQ11 or DHV11

(Optional) TQK50 controller module supporting a TK50 tape drive

2-1

KDJ11-B Systems

This chapter describes the following:

e KDJ1 1-B* module (MicroPDP-11/73 and MicroPDP-11/83 systems)
Baud rate select switch

Switch and jumper settings (Section 2.2)
Location of the KDJ11-B module (Section 2.2.4)

Features and use of KDJ11 dialog and setup modes (Sections 2.4 and 2.5)
MSV11-P memory module

Jumper setting

Pin settings (Section 2.6)
MSV11-] memory module

Jumper setting

Pin settings (Section 2.7)
e

MSV11-Q memory module
Jumper setting

Pin settings (Section 2.8)
NOTE

Chapter 5, Mass Storage and Backup Options, contains descriptions of the RQDX controllers and other Q22-Bus mass storage
and backup devices.

Chapter 6, Q-Bus Communications and 1/O Options, contains
descriptions of various Q22-Bus communications options.

KDJ11-B means any version of the KDJ11 CPU module

2-2

KDJ11-B Systems

2.2

KDJ11-B CPU MODULE

The KDJ11-B (M8190) module connects to a cabinet kit (DIGITAL P.N. CK-

KDJ1B-KA) containing a console Serial Line Unit (SLU) panel (Figure 2-1) and two
cables. The SLU panel is on the rear I/O distribution panel of the BA23 and BA123
enclosures. The two cables connect the module to the SLU panel. These cables
carry the signals from the module to the following:
e

Baud rate select switch

Light display

(Console terminal connector

A ribbon cable installed in J2 on the backplane assembly, carries the CPU signals to
the 20-pin connector on the front control panel. Controls and indicators on the
front control panel allow you to control CPU operations. Chapter 7, BA23-A Enclosure, contains a discussion of these controls and indicators. Figure 2-2 is a diagram
of the KDJ11-B internal cabling installed in a BA23-A enclosure.
WHEN DECIMAL POINT IS

LIT, DC POWER IS ON
DISPLAY OF

ERROR DETECTION/

CoDE

DIAGNOSTIC STATUS

BAUD RATE

~" SELECT SWITCH

J2
:

CONNECTOR FOR ~_|

BAUD RATE

SELECT AND

~a| e0eccecece

ecece0e60e@

LED DISPLAY
O0000000O0O0O0O0O0
000000000000

VIEW FROM OUTSIDE

CONNECTOR FOR

(AT REAR OF BA23 BOX)

CABLE TO CONSOLE
SWITCH

Figure 2-1

KDJ11-B SLU Display Panel

2-3

KDJ11-B Systems

e 11-006-24-01
T

‘ l

J2
J1

<—— 70-21150-02

/
Figure 2-2

KDJ11-B Internal Cabling

The KDJ11-B is a quad-height processor module for Q22-Bus systems. The following options are available:

e KDJ11-BB: 15 MHz without FP* (FP upgrade available: FPJ11-AA)
e

KDJ11-BC: 15 MHz without FP (FP upgrade not available)

KDJ11-BF: 18 MHz with FP (FPJ11-AB) and Private Memory Interconnect
(PMD

The KDJ11-B CPU modules include the following features:
PDP-11 instruction set, including Extended Instruction Set (EIS)
Four interrupt levels
Memory management

8 Kbytes of cache memory

* Floating-Point (FP) instruction set.

2-4

KDJ11-B Systems

32-Kbyte boot and diagnostic facility with LED indicators

e Console SLU
e

Line frequency clock

The KDJ11-B CPU module contains two Erasable PROMs (EPROMSs) and one Electrically Erasable PROM (EEPROM). The EPROMs contain self-test diagnostics and
boot codes. The EPROMs also contain a dialog mode program that allows selection
of boot devices and other parameters from the console terminal. These settings are
stored in an EEPROM so that they will not be lost when the system is switched
off. The general uses of the EPROMs and the EEPROM are as follows:
e

EPROM (16,348 by 16 bits in 2 EPROMs)

Power-up diagnostics for CPU and memory
Bootstrap programs

EEPROM setup program

EEPROM (2,048 by 8 bits in 1 EEPROM)
Hardware parameters

Boot device selection
Foreign language text

Optional customer bootstrap programs

See Sections 2.4 and 2.5 for further information.

Figure 2-3 shows the location of the EPROMs, the EEPROM, a Dual In-line Package (DIP) switch, diagnostic Light Emitting Diodes (LEDs), connectors, and
jumpers on the board. The DIP switch (E83) enables the baud rate select switch on
the SLU display panel (Section 2.2.2).

If you replace the 24-pin EEPROM in chip location E115, insert pin 1 of the

EEPROM in pin 3 of the socket.

Table 2-1 lists the factory setting for the E83 DIP switch (Section 2.2.3) and the

three jumpers. These jumpers are for manufacturing and factory test purposes
only.

2-5

KDJ11-B Systems

KDJ11-B Factory Setting

Table 2-1

Switch/Jumper

Setting

E83

All off

Between TP10 and TP11
Between TP20 and TP21
Between TP40 and TP41

W10
W20
W40
2.2.1

KDJ11-B LEDs

Seven LEDs on the KDJ11-B provide status information. The green LED indicates
the presence of +5 Vdc and +12 Vdc. The six red LEDs show error detection and
diagnostic status codes. These codes are also shown in octal format on the SLU
display panel. Refer to Section 4.3 for definitions of the codes and detailed diagnostic information.
CONNECTOR

CONNECTOR

FOR CABLE TO
BAUD RATE SELECT
AND LED DISPLAY

FOR CABLE TO
CONSOLE
SLU

FOR
DIP SWITCH
AND
BAUD RATE SELECT
BOOTSTRAP

m l - } E8'3/ DDDDDDD
W10

oL3~0 TP10

]

TP11

E117

ROM
(HI BYTE)

E116 J (LO BYTE)
ROM

E115

GATE

EEPROM

ARRAY

w40

TP40Q

{30

©OTP42

TP41
E35

GATE
ARRAY

w20

TP20 030

[l
Figure 2-3

2-6

©OTP22

TP21

[

KDJ11-B Module Layout

[

KDJ11-B Systems

2.2.2

KDJ11-B Baud Rate Select Switch

The baud rate select switch on the SLU display panel has 15 positions (Figure 2-1).
[t performs the following operations:

e Displays the settings (numbers 0-15) above the switch.

e Selects a baud rate (positions 0-7) and causes the system to boot as specified by
the settings in the EEPROM (Section 2.3).

e Selects (positions 8-15) the same baud rate as positions 0-7 but puts the system into dialog mode (Section 2.4). Table 2-2 lists the switch settings, baud
rate, and display mode.

Table 2-2

Baud Rate/Mode Select Switch

Switch Settings

EEPROM Selects
Baud Rate

Automatic
Boot Mode

Dialog
Mode

38,400
19,200
9,600
4,800
2,400
1,200
600
300

0
1
2%
37
4
5
6
7

8
9
10
11
12
13
14
15

* Factory setting

t Most Digital Equipment Corporation terminals are set to 4300 baud.
2.2.3

KDJ11-B DIP Switch

Figure 2-3 shows the location of the DIP switch. It contains eight switches that can
optionally be used to:

Set the SLU baud rate

Set the boot device

2-7

KDJ11-B Systems

The normal setting for all eight switches is off. The SLU baud rate switch and the

dialog mode settings stored in the EEPROM control these functions.

Setting switch 1 to on disables the console terminal. This setting is for factory use
only.*
Switches 2, 3, and 4 select the boot device. The dialog mode features described in
Section 2.5.6 allow you to define a boot device for different combinations of these
switch settings.

Table 2-3 lists the KDJ11 settings for switches 2, 3, and 4 and their functions.
Table 2-3

KDJ11 Switches 2, 3, and 4

Switch

Function

Off

Boot automatically according to the dialog mode settings

Off

Boot device V
Boot device 2 &

Off

Boot device 3 4

Off

Boot device # 3

Off

Boot device 5 <l

Off

Boot device 8 |

If switch 1 is Off, power up to ODT.

If switch 1 in On, run self test diagnostics in a loop.

When switch 5 is off, the system enters dialog mode on power-up.

Use switches 5 through 8 to set the baud rate if no SLU display panel is present.
Use switches 6, 7, and 8 to set the baud rate when the baud rate rotary switch is
disconnected from the CPU module. When the rotary switch is connected, it inter-

feres with the operation of these switches unless it is set to 7 or 15. Likewise,
these three DIP switches interfere with the proper operation of the rotary switch
unless they are all set to off.

* This feature is not implemented at this time.

2-8

KDJ11-B Systems

Table 2-4 shows the switch settings for switches 6, 7, and 8 and their corresponding baud rates.

Table 2-4

Switch Settings for Switches 6, 7, and 8

Switch

Baud Rate

38,400

Off

19,200

Off

9,600

Off

4 800

Off

2,400

Off
Off

On
Off

Off
On

600

Off

300

2.2.4

KDJ11-B Location in MicroPDP-11/73 and MicroPDP-11/83Systems

1,200

A MicroPDP-11/73 system uses the KDJ11-BC or KDJ11-BB CPU module and one
or more MSV11-P memory modules (Section 2.6). Data transfers between the CPU
and memory use the Q-Bus protocol.

Always install the KDJ11-BC or KDJ11-BB CPU module in the first slot of the
backplane assembly. The MSV11-P memory module(s) must be installed in the
slot(s) immediately following the CPU module.

A MicroPDP-11/83 system uses the KDJ11-BF CPU module and one or more
MSV11-JD or MSV11-JE memory modules (Section 2.7). Data transfers between

the CPU and memory use the PMI protocol resident on the KDJ11-BF CPU. All

other communications, whether originated by the CPU or other bus masters, use

the Q-Bus protocol. PMI is implemented through the CD-Bus on the backplane.
Always install the KDJ11-BF CPU in slot 2 or 3 of a BA23-A enclosure backplane,
or in slot 2, 3, or 4 of a BA123-A enclosure backplane. The MSV11-JD or MSV11-

JE memory module(s) must be installed immediately in front (lower slot number) of
the CPU. There can be no open slot between the CPU and memory, nor should
there be a open slot preceding the memory module. No other boards can be
inserted in the CD rows of slots 1 through 3 in a BA23-A enclosure, or in slots 1
through 4 of a BA123-A enclosure.

If the MSV11-]JD or -JE memory is installed following the KDJ1 1-BF CPU, the
CPU and memory communicate using the Q-Bus protocol.

2-9

KDJ11-B Systems

2.3

KDJ11-B AUTOMATIC BOOT MODE

When set to the factory configuration, the KDJ11-B automatically runs the diagnostic self-test every time the system is turned on or restarted.

Typing <CTRL> C during self-test stops the test and causes the system to
attempt to boot, as if the self-test had completed successfully.

After successful completion of the startup self-test (described in Section 4.2), the

ROM code loads the first 105 bytes of the EEPROM into memory beginning at
location 2000. This area in memory is referred to as the setup table. The factory
setting of the setup table (Section 2.5.2) initiates automatic boot mode, which
directs the system to take one of the following actions:
e

Boot from one or more of the previously selected devices.

Enter dialog mode (Section 2.4).

Enter console emulator mode (sometimes called halt mode). (See Section 4.5.)

The factory setting of the EEPROM code searches for and identifies available Mass

Storage Control Protocol (MSCP) devices (units 0-7) and other available devices. It
attempts to boot from the available devices in the following order:
e

MSCP devices with removable media (RX50)

MSCP devices with fixed media (RD5n)

RLO1/RLO2

TSV05/TK50

NOTE
You can change this sequence of devices with the automatic

boot setup command described in Section 2.5.4.
If no bootable medium is found, the system displays a message similar to the

following:
Testing in progress - Please wait
123456789
Waiting for media to be loaded, or drive to go ready

Press the RETURN key when ready to continue

This message indicates that the system has entered dialog mode and is waiting for

user input.

2-10

KDJ11-B Systems

If you load bootable media and press the Return key, the system returns to
automatic boot mode and boots the appropriate device.

Typing <CTRL> P while the system is booting causes the system to stop the boot
process and enter dialog mode.

If you press the Return key (without first loading media), the system displays the
following message:

Message 07

None of the selected devices were bootable
Press the RETURN key when ready to continue or to
list boot messages:

KDJ11-B DIALOG MODE

2.4

Dialog mode allows you to perform the following operations:
e

Change CPU parameters.

Select the boot source.

e Display a listing of all boot programs.
e

Enter a bootstrap program.

e List all memory and occupied register locations in the system.
e Cause the startup self-test to run in a loop.
e

Enter ROM ODT.

2.4.1

Entering Dialog Mode

The system enters dialog mode if:

e No bootable medium is available, and you follow the procedure described in
Section 2.3.

e You type <CTRL> P or <CTRL> C during the startup self-test.
e The EEPROM is programmed to enter dialog mode.

e The baud rate select switch is set to a position from 8 to 10.

2-11

KDJ11-B Systems

2.4.2

Dialog Commands

Dialog mode has the six commands HELP, BOOT, LIST, SETUP, MAP, and TEST.
"Three other functions are present:

e <CTRL> R (redisplay current input line)
e

<CTRL> U (clear current input line)

Delete

Select a command by typing the first letter of the command.

HELP - Displays a one-screen help file that provides a short description of each
command.

BOOT — Allows you to select the boot source. To select the source, enter the
device mnemonic followed by a unit number (for example, DU1). The program
assumes decimal unit numbers. To specify the unit number as an octal value, type
/O after the unit number (DU1/0). You can also assign a nonstandard CSR address
by typing /A after the unit number (DU1/A). When you use both of these switches,

do not repeat the slash; for example, type DU1/OA.
NOTE
Typing B and pressing the Return key causes the ROM code to

check for an off-board ROM at address 17773000. When an off-

board ROM exists and its first location is not zero, the ROM
code disables the internal code and jumps to address 17773000

of the off-board ROM.
LIST — Displays a list of all the boot programs available in the ROM and EEP-

ROM. The list includes the device name, unit number range, source of the program, and device type.

SETUP - Causes the system to enter setup mode. This mode allows you to
access and change the operating parameter settings and any bootstrap programs
stored in the EEPROM. Setup mode consists of 15 commands (Table 2-5). See

Sections 2.5.1 to 2.5.15 for a description of each command.
MAP - Searches for, identifies, and lists all memory in the system and all occupied register locations in the system I/O page.
TEST — Causes the ROM code startup self-test to run continuously in a loop. Use
this command for troubleshooting and analyzing intermittent CPU problems.
<CTRL> C exits the loop.

2-12

KDJ11-B Systems

2.5

KDJ11-B SETUP MODE

Table 2-5 lists the setup mode commands. A discussion of the features of each

setup command follows the table. This discussion refers to version 7 ROMs only.
Refer to Appendix G for a comparison of version 6 and version 7 ROMs. Refer to

the KDJ11-B CPU User’s Guide for more information.

Enter these commands by using the command numbers.
Table 2-5

Setup Mode Commands

Command

Description

Exit.

List/change parameters in the setup table.
List/change boot translation in setup table.

2
3

List/change the automatic boot selection in setup table.

Reserved.

List/change the switch boot selection in the setup table.

List boot programs.

Initialize the setup table.

11
12
13
14
15

Delete an EEPROM boot.
Load an EEPROM boot into memory.
Edit/create an EEPROM boot.
Save boot into the EEPROM.
Enter ROM ODT.

Save the setup table into the EEPROM.
l.oad EEPROM data into the setup table.

9
10

NOTE

ROM ODT is different from J11 micro-ODT. Refer to Section 4.6

for a discussion and listing of J11 micro-ODT hardware
commands.

2.5.1

Setup Command 1: Exit

This command returns you to dialog mode; same as <CTRL> C.

2.5.2

Setup Command 2: List/Change Parameters in the Setup Table

During system power-up, the ROM program code copies the setup parameters into
memory starting at address 2000. This area in memory 1s called the setup table.

2-13

KDJ11-B Systems

You can use this table to set 15 CPU parameters (letters A—0O). The ROM code

prints out the current status of all parameters, repeats the first parameter, and
then prompts you for input.

Keep pressing the Return key until you reach the parameter you want, or go

directly to the parameter by typing the letter shown in the setup table menu. To
change a.parameter, type in the new value and press the Return key. Type " or —
to back up to the previous parameter. If there is no change, press the Return key
to advance to the next selection. Use <CTRL> Z to exit.

This command does not save these values in the setup table in the EEPROM. Use
setup command 9 to save the setup table into the EEPROM.
Table 2-6 shows the default values of the parameters.
Table 2-6

KDJ11-B Setup Default Parameter Values

Command /Definition

Default

Enable halt on break

0 = No

1 = Yes

Disable user-friendly format

0 = No

1 = Yes

ANSI video terminal (1)

0 = No

1 = Yes

Power-up

0 = Dialog

1 = Automatic

2 = ODT

3 =24

Restart

0 = Dialog

1 = Automatic

2= 0DT

3=24

Ignore battery

0 = No

1 = Yes

PMG count

Disable clock CSR

Force clock interrupts

Clock

Enable ECC test

0 = Power supply

Disable long memory test

Disable ROM

0 =No

0 = No

1 = 50 Hz

1= Dis 165

(0-7)

1 = Yes

=
= ()

0 = No

1 = Yes

2 = 60 Hz

3=8Hz

0 = No

1 = Yes

0 = No

1 = Yes

= (

2 =Di1s 173

3 = Both

Enable trap on halt

0 = No

1 = Yes

= ()

Allow alternate boot block

0 = No

1 = Yes

A: Enable halt on break — When this parameter is set to 0 (default setting), a
break condition from the console terminal is ignored. When this parameter is set to
1, the processor halts when you press the break key on the console terminal.
B: Disable user-friendly format — When this parameter is set to 0 (default

setting), the system sends user-friendly messages to the console terminal. This
parameter is normally used with automatic boot mode.

2-14

KDJ11-B Systems

C: ANSI video terminal — Set this parameter to 1 (default setting) when the
console terminal is an ANSI video terminal such as a VT220. The delete key
erases the previous character on the screen. Set this parameter to 0 for a hard-

copy console or a non-ANSI video terminal, such as the VT52. The delete key
enters a slash character.

D: Power-up mode and E: Restart mode — (Two separate parameters.) When
the ROM code starts, it determines if the power-up or restart switch was activated. In either case, the ROM code selects the mode as shown in Table 2-7.
ROM Code Mode Selections

Table 2-7
Value

Mode

Enters dialog mode at completion of the diagnostics.

Enters automatic boot mode at completion of the diagnostics and tries

Enters ODT (on-line debugging technique) mode at completion of a
limited set of tests. The ROM code executes a halt instruction and

to boot a previously selected device (default setting).

passes control to J11 micro ODT (see Section 4.6).

Enters 24 mode. The ROM code loads the PSW (processor status word)

with the contents of location 26 and then jumps (passes control) to the
address stored in location 24. You can use this mode to recover from a
power failure when battery backup memory or nonvolatile memory 1S
present.

F: Ignore battery — The ROM program uses this parameter only when power-up
or restart mode (see D and E) is set to 3 (24 mode). When set to 0 (default

setting), the memory battery OK signal must be present to execute 24 mode. You
can set this parameter to 1 to ignore the memory battery OK signal if you have
non-volatile memory.

G: PMG (processor mastership grant) count — Make sure the parameter is
set to 7 for normal operation. Do not set this parameter to 0.

This parameter sets the PMG count in the Boot Control and Status Register

(BCSR). The PMG count allows the processor to perform a memory transfer and
thus execute instructions periodically during Direct Memory Access (DMA) transfers. Table 2-8 shows how often the processor can perform a memory transfer
during a DMA.

2-15

KDJ11-B Systems

Time for Counter to Overflow

Value

Disabled

PMG Count Settings

0.4 us

Table 2-8

0.8 us
1.6 us

6.4 us

12.8 us

3.2 us

25.6 us (newer factory setting)

H: Disable clock CSR — When this parameter is set to 0 (default setting), the
clock Control Status Register (CSR) can interrupt the system. When set to 1, the
clock CSR is disabled at address 17777546.
I: Force clock interrupts — When this parameter is set to 0 (default setting),

the clock requests interrupts only when the clock CSR is enabled (see default value
H). If you set this parameter to 1, the clock unconditionally request interrupts

when the processor priority is 5 or less. When you change the setting to 1, always

disable the clock CSR.
J: Clock select — This parameter determines the source of the clock signal as
shown in Table 2-9.
Table 2-9

Value

Clock Signal Sources

Source

Clock signal from backplane pin BR1. The power supply normally
drives this signal at 50 Hz or at 60 Hz, the default setting.

Clock signal generated internally at 50 Hz.

Clock signal generated internally at 60 Hz.

Clock signal generated internally at 800 Hz.

K: Enable ECC test — When this parameter is set to 1 (default setting), the
power-up and self-test run the Error Correction Code (ECC) memory test if the
memory is of the ECC type (bit 4 of the memory CSR is a read/write bit). When
set to 0, the ROM code bypasses the ECC test.

2-16

KDJ11-B Systems

L: Disable long memory test — When this parameter is set to 0 (default setting), the processor runs a memory address shorts data test on all available memory. When this parameter is set to 1, the memory address shorts data test 1s
bypassed for all memory above 256 Kbytes.

M: Disable ROM — The boot ROM occupies two 256-word blocks in the I/O
address space. This parameter allows you to disable the ROM after a device boots,
and to free this address space for use by special-purpose peripheral devices. Table
2-10 lists the ROM addresses that can be disabled.

ROM Addresses Disabled

Table 2-10
Parameter

Value

ROM Addresses Disabled

0*
1
2

None
17765000-17765777
17773000-17773777

17765000-17765777 and 17773000-17773777

* Default setting

N: Enable trap on halt — When this parameter is set to 0 (default setting), the
processor enters micro-ODT if it executes a halt instruction while in kernel mode.
When this parameter is set to 1, the processor jumps to location 4 if it executes a
halt instruction while in kernel mode.

O: Allow alternate boot block — The boot ROM code checks for bootable
media on a device by loading the boot block from the device into memory and
testing it. When set to 0 (default setting), the ROM code considers the medium
bootable if the word at location 0 is between 240 and 277, and the word at location
2 is between 400 and 777. If the medium is bootable, then the ROM code jumps to
location 0 of the boot block.

When set to 1, the ROM code considers the medium bootable if the word at
location O is any nonzero number. Some non-Digital Equipment Corporation operating systems may require a setting of 1 to boot properly.

2-17

KDJ11-B Systems

2.5.3

Setup Command 3: List/Change Boot Translation in the Setup Table

This command lists the contents of the translation table and allows you to specify
nonstandard addresses for boot devices. It provides the following functions:
Allows devices to be booted using nonstandard addresses.

Allows CSR address changes when two or more devices share the same address.
Allows multiple MSCP devices with different controllers to boot.
e

Handles multiple controllers of the same type.

When the boot ROM code attempts to boot from a device, it uses the standard
CSR address for that device unless a different address has been specified.
The following example shows a system with these devices:
e

RD52 fixed-disk drive

RX50 dual-diskette drive

RC25 fixed- and removable-disk drive

To change an entry, type the device name, the unit number, and the CSR address.
Press the Return key to proceed to the next entry. Type <CTRL> Z to return to

the setup mode prompt.
The RX50 dual-diskette drive and RD52 fixed-disk drive use an RQDX1 controller
module at the standard CSR address of 17772150. The RC25 controller module
also uses a standard CSR address of 17772150. Since two devices cannot use the

same CSR address, the CSR jumpers on one module must be changed. In this
example the RC25 controller is set to respond to a nonstandard address of
177760500.

The RX52 fixed-disk drive is unit 0 and the RX50 dual-diskette drive is units 1 and
2. The RC25 fixed- and removable-disk drive contains two drives, so it has two
unit numbers. On its front panel, the RC25 has a unit number select plug that is

set for units 4 and 5 (the first unit number of an RC25 is always an even number).

2-18

KDJ11-B Systems

Since the RC25 has two unit numbers, the translation table has two entries:
TT1

blank

Device name

= DU

Unit number

CSR address

= 17760500

TT1

DU4 address 17760500

TT2

blank

Device name

= DU

Unit number

CSR address

= 17760500

TT2

DU5 address 17760500

TT3

blank

Device name

2.5.4

= Press the Return key for no change

Setup Command 4: List/Change the Automatic Boot Selection in the

Setup Table

This command allows you to select the devices to be tried by the automatic boot
sequence. The table allows up to six entries. For each entry, you specify the device
mnemonic, the unit number, and the order to try to boot the devices. There are
three special single-letter device names:

A: MSCP automatic boot. Causes the ROM code to find up to eight MSCP devices
(units 0-7) at the standard CSR address. The ROM code first tries each removable
media device in turn and then tries each fixed media device.

You must select MSCP devices with a nonstandard CSR address (setup command
3) individually.

B: An off-board boot. Causes the ROM code to boot from an off-board ROM at
address 17773000. The code checks that the ROM exists and that the first word is
not zero. Then it disables the internal code and jumps to address 17773000 of the
off-board ROM.
NOTE

Device name B implements a method of supporting non-Digital
Equipment Corporation boot devices on the Q22-Bus.

2-19

KDJ11-B Systems

E: Exit automatic boot. Signals the ROM code that there are no other devices to

try. Follow the last device to be tried with this entry when fewer than six devices
exist.

2.5.5

Setup Command 5: Reserved

The command is reserved for future use.

Setup Command 6: List/Change the Switch Boot Selection
This command allows you to define the value of switches 2, 3, and 4 of the E83
DIP switch in order to select a specific boot device. You can use this command to
specify boot devices for six combinations of these switches. When these three
switches are set to OFF (default setting), the EEPROM selects the boot device.

2.5.6

When switch 5 is set to OFF and the baud rate select switch 1s set to 8 or greater,

the ROM code overrides any settings for switches 2, 3, and 4 and enters dialog
mode.

2.5.7

Setup Command 7: List Boot Programs

This command displays a list of all the boot programs in the two EPROMs and the
EEPROM. It displays the device mnemonic, unit number range, source of the program (EPROM or EEPROM), and a short device description. Same as the dialog
mode’s LIST command.

2.5.8

Setup Command 8: Initialize the Setup Table

This command sets the current parameters of the setup table in memory to the
default values. It does not affect the contents of the EEPROM itself. To save these
values in the EEPROM you must execute the SAVE command (setup command 9).
2.5.9

Setup Command 9: Save the Setup Table into the EEPROM

This command copies the parameter values of the setup table in memory to the
EEPROM. This is the only command that actually writes anything into the first
105 bytes of the EEPROM.

2.5.10

Setup Command 10: Load EEPROM Data into the Setup Table

This command restores the setup table in memory with the values actually stored
in the EEPROM.

2-20

KDJ11-B Systems

2.5.11

Setup Command 11: Delete EEPROM Boot

This command allows you to delete custom boot programs that you have stored 1n
the EEPROM. After typing the command, the program prompts you for the device
name of the EEPROM boot to be deleted. The ROM code then searches for the
first boot program in the EEPROM. If the ROM code finds the boot program, it
deletes the program and moves all of the following boot programs up to use the
space made available by the deleted program.

2.5.12 Setup Command 12: Load an EEPROM Boot into Memory
This command allows you to load an EEPROM boot program into memory to

examine or edit it. The ROM code prompts you for the device name of the EEPROM boot.

2.5.13 Setup Command 13: Edit/Create and EEPROM Boot

This command allows you to create a new EEPROM boot program or to edit a
program previously loaded with setup command 12. Use this command to change
the following:

e Device name: designated by the firmware for the device; for example, DU
(disk unit).

e Device description: normally the physical name of the device. The maximum
length allowed for this description 1s 11 characters and spaces.

e Allowable unit number range: the highest unit number defines the allowable
range of valid unit numbers for the device.

e Beginning address of the program in memory: first location of the program
In Memory.

e Ending address of the program in memory: the address of the last byte of
code used in memory.

e Starting address of the program: the address that the ROM code passes
control to.

The command lists the available space in the EEPROM for boots and prompts you
ROM
for entries. After you have made all changes, the ROM code then entersYou
must
15).
nd
comma
ODT to allow you to enter the boot program (see setup
use setup command 14 to save any changes you have made.

2-21

KDJ11-B Systems

2.5.14

Setup Command 14: Save Boot into EEPROM

This is the only command that actually writes a boot from memory into the EEPROM. Other commands only change a copy of the boot program that resides in
memory. When saving a boot program into the EEPROM, the device name of the
program must not match the name of a program already existing in the EEPROM.
If two or more programs are written into the EEPROM with the same name, only
the first one is bootable.

2.5.15

Setup Command 15: Enter ROM ODT

This command puts you into ROM ODT. The ROM code opens the address defined
by the beginning address of the program. ROM ODT is not the same as J11 microODT.

The only allowable addresses in ROM ODT are the addresses of memory from
0-28 Kwords (0-00157776). You can not access any other addresses or the I/O
page from ROM ODT. Table 2-11 provides the ROM ODT commands. (Refer to
the KDJ11-B CPU User’s Guide for further information.)
Table 2-11

ROM ODT Commands

Command

Symbol

Slash

Use
Prints contents of specified address location or
prints contents of last opened location. If opened

location 1s an odd number, prints only the contents
of the byte.

If location is even, mode is even. If location is odd,
mode 1s byte.

Assumes leading zeros. Uses only the last six octal
digits.
Examples:

ROM ODT > 200/1000000

; Open location 200

ROM ODT > 1001/240

; Open byte location 1001

ROM ODT > 77777750020/100000

; Open location 00150020

ROM ODT > 77770000/

; Illegal location > 157776

ROM ODT >
RETURN

2-22

<CR>

Closes an open location.

KDJ11-B Systems

Table 2-11

ROM ODT Commands (Cont.)

Command

Symbol

Use

LINE FEED

<LF>

Closes an open location and then opens the next

location. If in word mode, increment by 2; if in byte
mode, increment by 1.

Alternate character for line feed. This command is
|
useful when the terminal is a VT220.

Period

Up arrow

Closes an open location and then opens the previous

location. If in word mode, decrement by 2; if in byte

mode, decrement by 1.

Minus

—

Alternate character for up arrow. Useful when the

Delete

DELETE

Deletes the previous character typed.

CTRL Z

Exit ROM ODT and return to setup mode.

2.6

terminal i1s a VT200.

MSVii-P MEMORY MODULE (-PK, -PL)

The MSV11-P memory is a quad-height module that occupies the slot following the
CPU. This module contains 64 K Metallic Oxide Semiconductor (MOS) chips that
provide storage for 18-bit words (16 data bits and 2 parity bits). It also contains
parity control circuitry and a control status register. Table 2-12 shows the memory
modules and their storage capacity.

Table 2-12

MSV11-P Memory Modules
Module

Memory

Model

Number

Capacity

MSV11-PK
MSV11-PL

M8067-K
M8067-L

256 Kbytes
512 Kbytes

2-23

KDJ11-B Systems

The MSV11-P memory module is configured by means of jumpers and wire-wrap
pins. The -PK and -PL models have the same factory configuration. Figure 2-4
shows the location of jumpers and wire-wrap pins and Table 2-13 describes their
function.

45 43 44

re3

I ® 1

L-09

L--+10

e W

°14

F4-e15

Voot

| Le16
Lol

o\ | ADDRESS

L--e13

°L_J

JUMPERS

= oD | CSR ADDRESS

oC | JUMPERS
eB
A

W14

w15

W13 e{}e
w4
o{ _}e
e

W5H
o

}eel

W2
o

2-24

W11le

W12

W1.0
®

}tee{

Figure 2-4

\W3

'R,

L7232

- ‘g
L ep [ STARTING

MSV11-P Module Layout

KDJ11-B Systems

Table 2-13

MSV11-P Factory Jumper Configuration

State

Jumpers

State

Jumpered Pins

W1
W2
W3
W4
W5

I
I
R
I
I

2
3
4
6
13

toY
to9
to 10
to7
to 15

R
I
I
I
I

W9
W10

I
R

22 to 23
44 to 45

I
I

W12
W13
W14
W15

R
I
R
R

14 to 16

A
B
C
D

toE
toE
toE
toE

R
R
R
R

Ground pins

toR

8
21

N
P

toR
toR

R
R

V toY
W toY
X toY

R
R
R

Wil

R
U
Y
I

toR

= inserted

R = removed

Two LEDs indicate module status. When lit, a green LED indicates that +5 Vdc 1s
present on the module; when lit, a red LED indicates the detection of a parity
error.

2-25

KDJ11-B Systems

2.6.1

Expansion (CSR and Starting Addresses)

Additional MSV11-P modules can be added for system expansion. Each memory
module added to a system requires a specific configuration. This is done by repositioning jumpers on the module’s wire-wrap pins.

Each memory module added to the Q22-Bus must be configured to provide two
addresses:
e

(SR address

Starting address

2.6.1.1

CSR Address - Figure 2-4 shows the CSR address jumpers on the

MSV11-P. Table 2-14 lists the CSR address and corresponding jumper configurations for each memory module added to the system. The table 1s applicable to both
the -PK and -PL models.

Table 2-14

MSV11-P CSR Configuration

Board No.
in System

CSR Address
Pins to Wire-Wrap

(x=177721)

1st

None

x00

2nd

AtoE

x02

x04

3rd

BtoE

4th

AtoB,BtoE

x06

5th

Cto E

x10

6th

AtoC,CtoE

x12

7th

Bto(C,CtoE

x14

8th

AtoB,

x16

2.6.1.2

Bto(C, Cto E

Starting Address - The starting address depends on the amount of

memory already in the system. Table 2-15 lists the jumper configuration for addi-

tional MSV11-P modules.

2-26

KDJ11-B Systems

Table 2-15

MSV11-P Starting Address Configuration

Board No. in System

Pins to Wire-Wrap

MSV11-PL (512-Kbyte increments)

None
VtoY
WtoY

1st
Z2nd
3rd

Wto Y
VtoY,
XtoY
XtoY,VtoY
XtoY, Wto Y
XtoY, WtoY,VtoY

4th
5th
6th
7th
8th
MSV11-PK (256-Kbyte increments)

None
PtoR
VitoY
VtoY,
WtoY

1st
2nd
3rd
4th
5th
6th
7th

PtoR

PtoR
WtoY,
WtoY, VtoY
WtoY,VtoY, PtoR

8th

For further information, refer to the MSVI1-P User’s Guide (EK-MSVOP-UG-001).
2.7

MSV11-JD AND MSV11-JE MEMORY MODULES (M8637)

The MSV11-JD and MSV11-JE (Figure 2-5) are Metal Oxide Semiconductor
(MOS), Random Access Memory (RAM) modules. The modules have:
e Error Correction Code (ECC) for increased reliability
e A CSR to store status and error information

e Battery backup, available by resetting a jumper on the module
e Support for PMI protocol and normal Q22-Bus protocol
e [Four jumpers and two switch packs

e Starting addresses on 8 KW boundaries
e

Two LEDs

2-27

KDJ11-B Systems

The board can be configured half or fully populated with 256 K dynamic RAMs.
Maximum memory capacity is 2 Mbytes using 256 K RAMs.

S <=

o152
CSR ADDRESS
SWITCH (SP2)

TEST

CONNECTOR

Eil

S
MEMORY

ADDRESS

SWITCH (SP1)

DATA

GATE

ARRAY

ADDRESS

GATE

RAM

ARRAY

+ | RAM

'
Figure 2-5

’

MSV11-]D, -JE Memory Module

The MSV11-JD and MSV11-JE memories are quad-height Q22-Bus modules that
occupy the slot(s) immediately prior to the KDJ11-BF CPU in the backplane assembly. They are available in the factory configuration shown in Table 2-16.
Table 2-16

MSV11-JD, -JE Memory Modules*

Option

Module

Number

Designation

MSV11-JD

M8637-D

1 MB ECC using 256 K dynamic RAMs

MSV11-JE

M8637-E

2 MB ECC using 256 K dynamic RAMs

Description

* MSV11-JB, -JC modules are used on MicroPDP-11/84 Unibus systems only. They cannot
be used on Q22-Bus systems.

2-28

KDJ11-B Systems

The memory starting address can be set in any 8 KW boundary within the
2048 KW extended address space. The extended address space contains 22 address
lines.

2.7.1

Error Correction

The MSV11-JD, -JE modules contain ECC logic that detects and corrects single-bit
errors and detects double-bit errors. Detecting and correcting single-bit errors 1S
transparent to the master device accessing the memory.
2.7.2

Battery-Backup

The MSV11-JD, -JE memory modules have input for two sources of +5 V power.
These inputs are designated +5 VBB (on battery-backup power systems) and +5 V
(on non-battery-backup power systems).
NOTE

Neither the BA23-A nor the BA123-A MicroPDP-11 systems support battery backup.

In battery support mode, power is used only to refresh the MOS storage array so

that battery backup and data retention time is maximized. A green LED on the
module stays on as long as a +5 VBB is available. Modules are shipped in a nonbattery-backup configuration (Figure 2-6). The modules need a jumper change to
configure them for battery-backup applications (Figure 2-7).

MSV11-J MODULE

CONNECTOR D

Figure 2-6

CONNECTOR C

+5 V Jumper Connections

2-29

KDJ11-B Systems

BATTERY

BACK UP
SYSTEM

MSV11-J MODULE

CONNECTOR D

Figure 2-7
2.7.3

CONNECTOR C

+5 VBB Battery-Backup Jumper Connections

Private Memory Interconnect (PMI)

The MSV11-]D, -JE memories are designed for Q22-Bus systems and support the
PMI protocol of the KDJ11-BF processor. The PMI bus is specifically designed for
and used in the MicroPDP-11/83 Q22-Bus systems.
The MicroPDP-11/83 systems use the KDJ11-BF CPU module, one or more
MSV11-JD or MSV11-JE memory modules, and a selection of Q22-Bus compatible

devices. Data transfers between the KDJ11-BF CPU and the MSV11-JD or -JE
memory using the PMI protocol resident on the CPU. All other communications,

whether originated by the CPU or other bus master, use the Q22-Bus protocol.
2.7.4

Location of the MSV11-JD, -JE Memory

The location of the MSV11-JD, -JE in the MicroPDP-11/83 backplane determines
the protocol used between the KDJ11-BF processor and the memory module (Figure 2-8). To use the PMI protocol, the MSV11-JD, -JE must be located immedi-

ately in front (lower slot number) of the CPU; otherwise the memory and CPU
communicate with the Q22-Bus protocol. There must be no open slot between

memory and the CPU, nor can there be any open slots preceding the MSV11-]D,
-JE modules.

CAUTION
Static charges can damage the MOS memory chips. Be careful
how you handle the module and where you lay it down.
When you install or remove the memory module, make sure

there is no dc voltage applied to the module.

2-30

KDJ11-B Systems

If the green LED is on, the module is receiving +5 V or +5 VBB power. The
power source must be off before you remove or replace a memory module.

MSV11-J

KDF11-BF

Q22-BUS

MEMORY

CPU

DEVICES

AN
DATA/ADDRESS

Figure 2-8
2.7.5

Q22-BU§>

PMI/Q22-Bus Interface

Jumper Setting

The four factory installed jumpers (Figure 2-5), W1 through W4, establish the
configuration of the module. Table 2-17 summarizes the possible MSV11-]D, -JE
jumper configurations.

Table 2-17

MSV11-JD, JE Jumper Configurations

Jumper

Description

W1 In
W1 Out

Reserved for Digital use only
256 K dynamic RAMs

W2 In
W2 Out

Half populated module
Fully populated module

W3, W4 mounted
left-right (Figure 2-7)

+5 VBB battery-backup system
(See Note)

W3, W4 mounted

up-down (Figure 2-6)

+5 V system

(Factory configuration)

NOTE

Neither the BA23-A nor the BA123-A MicroPDP-11 systems support battery-backup.

2-31

KDJ11-B Systems

2.7.6

MSV11-dD, -JE Switch Settings

The MSV11-JD, -JE modules contain two switchpacks. One is an eight-switch DIP

and one is a four-switch DIP. The eight-switch DIP selects the starting memory
address on an 8 K boundary. The four-switch DIP selects the CSR starting address.
One of 16 possible CSR addresses may be selected.

2.7.7

Memory Address Switch Settings

The memory address switch (SP1 in Figure 2-5) is an eight-switch DIP. The switch
settings are shown in Table 2-18. The table is divided into three columns as
follows:

The decimal switch setting in 8 K increments

The octal equivalent

The actual switch settings shown in binary

The least four significant switch settings (5 through 8) of the memory address
switch (SP1) represent 8 K increments as shown in the upper half of Table 2-18.
Switch settings 1 through 4 are all Os in this portion of the table and do not come
into play until 128 K is reached.
For example, if these switch settings (5 through 8) are 0s, a memory address of 0
1s represented. This assumes that switches 1 through 4 are also 0.

If switch setting 8 1s a 1 (all others being 0s), the memory address increments by
8 K.
If switch setting 7 is a 1 (all others being 0s), the memory address increments by

another 8 K.

2-32

KDJ11-B Systems

The lower half of the table represents increments of 128 K until 2 M 1s reached.
Switch settings 4 through 8 come into play here. Each increment of these switch
settings represents an increase of 128 K.
For example, if switch setting 4 is a 1 and switch settings 3 through 1 are Os, a
starting memory address range of 128 K to 248 K is selected.

The specific memory starting address selected within that range 1s determined by
switch settings 5 through 8 (indicated by Xs in the lower half of Table 2-18.

Table 2-19 shows the most common configurations for the MSV11-JD and MSV11JE memory address switches.

Table 2-18

MSV11-JD, -JE Starting Memory Address Selection

Decimal
(K Word)

Octal

Switch Setting (SP1)
2
3
4
5
6
7
8

0
8
16
24
32
40
48
56
64
72
80
88
96
104
112
120

00000000
00040000
00100000
00140000
00200000
00240000
00300000
00340000
00400000
00440000
00500000
00540000
00600000
00640000
00700000
00740000

O
O
O
O
O
O
O
O
O
O
O
O

0
0
0
0
0
0
0
0
6
0
0
0

0
0
0
0
0
0
0
0
0
0
0
0

0
0
0
0
O
0
0
0
0
0
0O
0

o0
0
O
o0
o0
o0
o0
0
1
1
1
1

0
0
0
0
1
1
1
1
0
0
0
0

o0
o0
1
1
0
0
1
1
0
0
1
1

O
1
O
1
O
1
O
1
O
1
O
1

O
O
O
o

0
0
0
0

1
1
1
1

0
0
1
1

O
1
O
1

000-120
128-248
256-376
384-504
512-632
640-760
768-888
896-1016
1024-1144

0
0
0
0
1
1

0
0
1
1
0
0

X
X
X
X
X
X

X
X
X
X
X
X
X
X
X

0
1
0
1
0
1
0
1
0

X
X
X
X
X
X

06000000-06740000
07000000-07740000
10000000-10740000

O
O
O
o
0
0o
o
0
1

1152-1272

00000000-00740000
01000000-01740000
02000000-02740000
03000000-03740000
04000000-04740000
05000000-05740000

11000000-11740000

1
1
0

X
X
X

2-33

KDJ11-B Systems

Table 2-18

MSV11-JD, -JE Starting Memory Address Selection

(Cont.)

Decimal
(K Word)

Octal

1280-1400
1408-1528
1536-1656
1664-1784

12000000-12740000
13000000-13740000
14000000-14740000
15000000-15740000

1
1
1
1

1792-1912
1920-2040

1
1

16000000-16740000
17000000-17740000

Switch Setting (SP1)
2 3 4 5 6 7 8
01
1
0
0
1
0
1
11
11

0
1
0
1
0
1

X
X
X
X
X
X

1 = switch on

0 = switch off

X = switch can be either on or off

Table 2-19

Common Memory Starting Address, MSV11-J

Starting
Address

SW2 Switches
1

1 M byte

2 M bytes

3 M bytes

1.0

MSV11-JD

MSV11-JE
0

2 M byte

2.7.8

CSR Address Switch Settings

The control and status register of the MSV11-JD, -JE allows program control of

certain ECC functions and contains diagnostic information if an error has occurred.
The CSR is a 16-bit register and has an assigned address. The CSR can be
accessed through the Q22-Bus or PMI protocol.

ECC 1s performed only on memory accesses and is not used when accessing the

CSR.

2-34

KDJ11-B Systems

There is one CSR per memory module. Each CSR can be assigned to one of 16
predetermined addresses which range from 772100 to 772136 for 18-bit systems
and from 17772100 to 17772136 for 22-bit systems.

The CSR address switch (Figure 2-5) is a four-switch DIP which allows selection of
one of these 16 CSR addresses. Table 2-20 shows the possible CSR address for
18-bit and 22-bit systems. The switch setting for a particular CSR address is the
same whether the CSR is an 18-bit or 22-bit system.

For example, the switch setting is 1110 for a 22-bit CSR address of 17772134 or
an 18-bit CSR address of 772134.

Table 2-20

22-Bit CSR
Address

18-Bit CSR
Address

Switch Setting
1 2 3 4

17772100

772100

17772102

772102

17772104

772104

17772106

772106

17772110

772110

17772112

772112

17772114

772114

17772116

772116

17772120

772120

17772122

772122

17772124

772124

17772126

772126

17772130

772130
772132

1
1

0
0

O
1

772134
772136

1
1

11
1
1

0
1

17772132
17772134
P

MSV11-J CSR Address Selection

17772136
1 = switch on

0 = switch off

2.7.9

MSV11-4dD, -JE LEDs

Two LEDs on the MSV11-JD, -JE modules indicate power and error conditions
(Figure 2-5). The green LED indicates that the module is receiving +5 V, or +5
VBB from the power supply or battery backup. The power source must be off
before you remove or replace a memory module.

2-35

KDJ11-B Systems

The red LED indicates the detection of an uncorrectable single or double error

when the module is in a read/write cycle or in diagnostic mode. Refer to the
MSV11-] MOS Memory User’s Guide (EK-MSV1]J-UG-001) for further details.
2.8

MSV11-Q MEMORY

The MSV11-Q is a Q22-Bus quad-height memory module with a 1, 2, or 4 Mbyte
capacity using either 64 K or 256 K dynamic RAMs. There are two revision levels
(Figures 2-9, 2-10) and three variants, listed in Table 2-21.
Table 2-21
Revision

MSV11-Q Variants

Model

Number

MSV11-QA

M7551-AA

C
C
*

56 K

1 MB

256 K (half pop.)
256 K (full pop.)

2 MB
4 MB

M7551-BA
M7551-CA

MSV11-QB
MSV11-QC

RAM Size

Storage

Level*

Revision level is identifiable by printed circuit board number:
A = 5017547A1 on upper right corner of component side
C = 5017547-01-C1 on upper left corner of component side

J11,J09,J7, 45

5017547-01-C1

CSR REGISTER
SELECTION

J10, J8, J6, j4

e———

279

TEST JUMPER

(USED BY

MANUFACTURING-

DO NOT REMOVE)

— 3} @—STARTING ADDRESS

—3
|
12

{(COMPONENT SIDE)

[ 55;

SWITCHES (S6 NOT USED)

ADDRESS
3}4—-———END|NG
=
SWITCHES
=|¢

J17

016

u1s

Jia

J13

412

frwenn ¥

|s—

TEST JUMPERS

BATTERY BACKUP

(USED BY MANUFACTURING —

JUMPERS

DO NOT REMOVE)

Figure 2-9
2-30

MSV11-QA Memory, Revision A

KDJ11-B Systems

5017547A1

PARITY LED

\._\{___/
o4

ONLY)

CSR REGISTER

SELECTION

\NT P,

g2z

TEST JUMPER (USED
BY MFG

ENABLE/DISABLE

CSR SELECTION

STARTING ADDRESS

SWITCHES (S6 NOT USED)

x}e—~~ENAB LE/DISABLE
BLOCK MODE

(COMPONENT SIDE)

a— ENABLE/DISABLE
EXTENDED
ERROR ADDRESS

CNDING ADDRESS
SWITCHES

—— TEST JUMPER (USED
BY MFG. ONLY)
—

ENABLE PARITY
ERROR DETECTION

NOT USED. MODULE

DOES NOT SUPPORT
BATTERY BACKUP

Figure 2-10

MSV11-QA, -QB, -QC Memory, Revision C

The MSV11-Q has a red LED. When lit, it indicates a parity error.
28.1

MSV1i1-Q Address Switches

Configure the MSV11-Q starting and ending addresses using DIP switches SW1
and SW2. Table 2-22 lists the switch settings.

Table 2-22

MSV11-Q Address Switches
Ending

Starting Address

SW1
5
4

SW2
6

Address

SW2
5
4

Version

Board No.
in System

MSV11-QA
Rev. A

1
2

0O
1

0
1

O
1

1
0

0
O

1
2

0O
1

0
1

O
1

1
0

1
1

MSV11-QA
Rev. C

3
4

0O
1

1
0

1
1

2-37

KDJ11-B Systems

Table 2-22

MSV11-Q Address Switches

(Cont.)
Ending

Starting Address

SW2
6

SW2
5
4

0O
0O

0
1

0
0

1
O

Board No.
in System

SW1
5
4

MSV11-QB
Rev. C

1
2

MSV11-QC

Version

Address

Rev. C
0 = switch on

1 = switch off

SW2 switches 1, 2, and 3 are all on.

SW1 switches 1, 2, and 3 are all on. SW1 switch 6 i1s not used.
2.8.2

MSV11-Q CSR Address

The MSV11-Q CSR address is set using jumpers. Table 2-23 lists the settings.
Table 2-23

MSV11-Q CSR Address

Board No.

CSR Address

in System

X=177721

Rev. A

Jumpers
R

Rev. C

Jumpers

J10

J11

X00 *

Out

X02

Out

X04

Out

X06

* factory configuration

2-38

KDJ11-B Systems

Table 2-24 lists the remaining jumpers and their function.

Table 2-24
Jumper

MSV11-Q Factory Jumper Settings
State

Location

Condition

In
In
In
In
In
In

W1/W2 (upper)
W5/W6 (horizontal)
A/B (lower)
C/D (vertical)
J/H (right) Enabled
K/L (lower)

Block mode enabled
Manf. test (do not remove)
CSR selection enabled
Manf. test (do not remove)
Parity error detection
22-bit addressing selected

Rev. A

W1
Wwé
B
C
H
L
Rev. C

J1 to ]2,

Manf. test (do not remove)

-QA only:
J13 to J14

Selects 64 K RAMs (do not
remove)

J15 to J16

Selects 64 K RAMs (do not
remove)

-QB, -QC:
J16 to J17

J12 to J13

Selects 256 K RAMs (do
not remove)
Selects 256 K RAMs (do
not remove)

W3, W1

Battery backup
configurationTM

Neither the BA23-A enclosure, nor the BA123-A enclosure support battery-backup.

For further information, refer to the MSV11-Q MOS Memory User’s Guide (EKMSV1Q-QG).

2-39

KDF11-B @g%gfifig‘gzfi%

3.1

INTRODUCTION

A BA23-A enclosure containing a KDF11-BE or KDF11-BF CPU module is usually
referred to as a MicroPDP-11/23 system. A MicroPDP-11/23 system contains a
KDF11-B CPU module; an MSV11-P memory module; an RQDX1, RQDX2, or
RQDX3 controller module supporting mass storage devices; and a communication
module, usually the DZV11. A TQK50 controller module supporting a TK50 tape
drive may also be present.

This chapter describes the following:
e

KDF11-B module baud rate select switch

e (Connection to the front control panel
e

Switch and jumper setting

e Features and use of KDF11 console dialog mode
NOTE

The KDF11-BE CPU module has been replaced with the KDF11BF CPU.

This chapter uses the term KDF11-B to represent all variants of the KDF11-B
CPU. Refer to Appendix B, The PDP-11/23 PLUS System, for a discussion of the
KDF11-BA jumper and switch settings.

Refer to Chapter 2, KDJ11-B Systems, for a description of the MSV1 1-P memory
modules.

Refer to Chapter 5, Mass Storage and Backup Options, for descriptions of various

Q22-Bus mass storage and backup devices.

Refer to Chapter 6, Q-Bus Communications and I/O Options, for descriptions of

various Q22-Bus communications options.

3-1

KDF11-B Systems

3.2

KDF11-B CPU ASSEMBLY

The KDF11-B module connects to a cabinet kit containing a console Serial Line
Unit (SLU) panel and two cables (Figure 3-1). The SLU is installed in the rear
Input/Output (I/O) distribution panel of the BA23-A enclosure. The two cables
carry the signals from the module to the following:
Baud rate select switch

e Console terminal connector (A0 Console)
e Additional device connector (Al)

A ribbon cable installed in J2 on the backplane assembly carries the CPU signals to
the 20-pin connector on the front control panel. Controls and indicators on the
front control panel allow you to control CPU operations (see Section 7.3).
The SLU panel contains two D-type 25-pin connectors. Refer to Table 3-1 for the

pin and signal information for these connectors. The SLU panel also contains 2

baud rate select switches which enable the independent selection of the SLU baud
rates.

SLU Connector Pin Function

Signal

Table 3-1

Transmitted Data

Protective or Earth Ground

RTS - Request to Send

DSR - Data Set Ready

Received Data

Logic or Signal Ground

DTR - Data Terminal Ready

A discussion of the KDF11-B CPU follows. Refer to Appendix B for a discussion of
the KDF11-BA CPU module. For a discussion of other variants of the KDF11-B
modules, refer to the KDF11-BA CPU User’s Guide.

3-2

KDF11-B Systems

00000000000

W00

000000000000

//jrm

A0 (CONSOLE)

Al
A\ ooooooooooooi)
O0000000000CO

\ AO

BAUD RATE

))

ROTARYTM|
SWITCH

0
1
2
3
4

50
75
110
1345
150

5
6
7

300
600
1200

8
9
10
11
12
13
14
15

1800
2000
2400
3600
4800

ROTARY
SWITCH

7200
9600
19200

Figure 3-1
3.3

KDF11-B SLU Panel

KDF11-B CPU

The KDF11-B module is a quad-height processor module for Q22-Bus systems. It

includes the following features:
e

[our interrupt levels

e Memory Management Unit (MMU) chip

e Socketed (removable) boot/diagnostic ROMs
e

Line frequency clock

e Two 40-pin chip sockets for installing an optional Floating-Point Processor (FPP)
chip and/or a Commercial Instruction Set (CIS) chip.

e Five Light Emitting Diodes (LEDs) for power and diagnostic status.

The KDF11-B module contains numerous jumpers and two Dual In-line Package
(DIP) switch units, S1 (E102) and S2 (E114). The jumpers and switches allow you
to select various module features. Figure 3-2 shows the location of these jumpers
and switches, as well as the chip socket and LED locations.

3-3

KDF11-B Systems

Install the KDF11-B CPU module in the first slot of the BA23-A backplane.
MSV11-P memory module(s) immediately follow the CPU.

Five LEDs on the KDF11-B module provide status information. The single green
LED indicates the presence of +5 Vdc. The red LEDs show error detection and
diagnostic status codes. Refer to Section 4.3.2 for a description of these four
diagnostic LEDs.

COMMERCIAL INSTRUCTION

SET (KDF11-BB OPTION)
J4s
J46

J43

| J44

SLU2

COMMERCIAL

CONSOLE

|42 Ja1

INSTRUCTION

SLU1

R339001SRR P l I J1 l

___X_______’[__‘

J21

JAO——0u s

low

J29~§@

J28 —t———o0

SLUT

sLu2]

1108

. ]

(3|

|eo

E114

Cmm |

[

E76

[

E75 “‘$ DATA AND CONTROL

E127 1508

;

]

SOCKET
(LO BYTE)

‘\]l\[ng
FLOATING POINT

DAL

[

E74

(KEF11-AA OPTION)

(DPU)

MEMORY MANAGEMENT

(MMU)

E102

(HI BYTE)

£126

o8| @] IDAL 07

|1
—¢
ROM/EPROM

SOCKET

e
J18

J14~wg

NMJ18

J15\‘0
J24

J23

o 2?2

—

bt==== ==

J33

J30\\

ROM/EPROM

02020200

)

R
J | DIAGNOSTIC DISPLAY

E77

J3S
131 :
Je

J27

e8a @

# | ao b2/

E78

S
—"°
125
l [
S

45 v PR ON LED

SET

J13 —80

W2 Wi
OLI0OLI0

e
S
J3

J17

J]z/vo
J11

o J10

SEE NOTES

07:00

o fl

rrl

NOTES:

INSTALLED JUMPERS SHOW THE

WHEN 8 K EPROMS OR 8 K MASKED ROMS ARE USED, J23 IS CONNECTED TO J24.

MicroPDP-11 CONFIGURATION.

WHEN 2 K EPROMS ARE USED, J23 ISCONNECTED TO J22. WHEN 2 K MASKED ROMS ARE
USED, J23 IS CONNECTED TO J24.

Figure 3-2

3-4

KDF11-B CPU Module

KDF11-B Systems

Table 3-2 shows the factory configuration of the jumpers.

Table 3-2

KDF11-B Module Factory Jumper Configuration

Jumpers

State

Function

J4-J5

Disables the CPU halt feature from the console SLU

Jo-J7

For manufacturing use only.

J8-J9

For manufacturing use only.

J18-J19

Enables CPU power-up mode: bootstrap from location

break key on the terminal.

773000.

J20-]J21

For manufacturing use only.

J23-J24%*

Is used with 8 K masked ROMs or 8 K EPROMs (J22-]23

J26-J27

Connects the output of the console serial line drive to the

J29-J30

One stop bit for console SLU port.

J34-]35

Connects LINMF(1H to the SLU UART reset mput.

J37-J38

One stop bit for second SLU port.

J41-J42°%*

J43-J42°%

must be removed).
serial line.

Disables DIP switches S2-1 to S2-3. Enables baud rate

rotary switches to select console SLU baud rate.

Disables DIP switches S2-5 to S2-8. Enables baud rate

rotary switches to select second SLU baud rate.

Provides bus grant continuity for the BIAK signal.
Provides bus grant continuity for the BDMG signal.

* These jumpers are out for a KDF11-BA module (PDP-11/23 PLUS). All other jumpers are
1.

3-5

KDF11-B Systems

Table 3-3 shows the factory configuration for the two switch packs.

Table 3-3

KDF11-B Module Factory Switch Configuration

Switch

State

Function

S1-8

ANSI mode console terminal

S1-7

Does quick verify memory diagnostic

S1-6

Off

S1-5

Off

S1-4

S1-3

S1-2

S1-1

Selects MSCP auto-boot

The factory configuration of J41 to J42 In, and J44 to J45 In,

disables the S2 switch pack SLU baud rate. When S2 is disabled,
use the two 16-position baud rate select switches on the SLU
panel to select the baud rate. The factory setting for S2 follows:

S2-8

Off

S2-7

Off

52-6

Off

S2-5

S2-4

Off

S2-3

Off

S2-2

Off

S2-1

Sets second SLU for 9600 baud

Sets console SLU for 9600 baud

The input controls for the diagnostic/boot ROM are the 8 DIP switches S1-1
through 51-8 (E102). All unimplemented switch configurations cause a message to

be printed and control passes to the console dialog routine.

3-6

KDF11-B Systems

Table 3-4 shows the bootstrap switch settings.

KDF11-B Diagnostic/Bootstrap Switch Settings (E102)

Table 3-4

Switch Setting

Function

Factory setting

Inhibit power on auto boot

0 X X X X X X X Consoleterminal is not an ANSI mode SCOPE
1 X X X X X X X* Console terminal is an ANSI mode SCOPE
¥ 0 X X X X X X Inhibit QUICK VERIFY MEMORY
X

DIAGNOSTICS

X X X X X X* Execute QUICK VERIFY MEMORY
0

X X 0

X
X
X
X
X

0
0
0
0
0

X
X
X
X

0
0
0
0

X X 0
X X 0
X X 0

0
0
0
0
0
0
0
0o
b

X
X
X
X
X
X
X
X
< PSS

¥
X
¥
X
¥
X
¥
X

0
0
0
0
0

0
0
0

0
0
0
0

1
1
1
1
1
1
1
1
1

0
0
0
0
0

0
0
1
1
1

DIAGNOSTICS

17 Select TS05 drive 0 or TK25

1
1
0
0
1

0
1
0
1
0

Select TUS8 drive 0
Select TUS8 drive 1
Select RX01 drive O
Select RX01 drive 1
Select RX02 drive 0

Select MSCP drive O

1
1
1
1

0
0
1
1

0
1
0
11

1
1
1

0
0
0
0
1
0
0
1

0
0
0

0
0
0
0
0
1
1
1
1

0
1
1

0
0
1
1
0
0
0
1
1

1
0
1

SelectRX02drive 1

Select MSCP drive 1
Select MSCP drive 2
Select MSCP drive 3

Select MSCP drive 4
Select MSCP drive 5
Select MSCP drive 6
Select MSCP autoboot)

Includes
RD51, RD52,
» and RC25.

0 Select RLO1/RLOZ drive 0
1 Select RLO1/RLOZ drive 1
0 Select RLO1/RLO2 drive 2
1 Select RLO1/RLOZ drive 3
0 Select TK50 drive O
O0f Select DEQNA unit 0
1t Select DEQNA unit 1
0‘}

L Reserved for future devices

Select DECnet DUV11

3-7

KDF11-B Systems

Table 3-4

KDF11-B Diagnostic/Bootstrap Switch Settings (E102)

(Cont.)

Switch Setting

Function

Select DECnet DLV11-E

Select DECnet DLV11-F

Unused

Loop self-test but do not execute memory

diagnostic
X

=on

Loop self-test and memory diagnostic

0 = off
X = does not matter

* Factory Configuration.

T For KDF11-BF only.

The XXDP+ diagnostic monitor boots only from the standard Control Status Regis-

ter (CSR) address (772150) at this time.

3.4

KDF11-B BAUD RATE SELECT SWITCHES

The baud rate select switches on the SLU insert panel:
e

Have 16 positions each (Figure 3-1).

Display the setting (numbers 0-15) above the switches.

e Select a baud rate (positions 0-15) and cause the system to be in automatic boot
mode.

Table 3-5 shows the switch setting and corresponding baud rate.

3-8

KDF11-B Systems

Table 3-5

KDF11-B Baud Rate Switch Settings

Switch
Setting

Baud
Rate

Switch
Setting

Baud
Rate

0
1
2
3
4
5
6
7

50
75
110
134.5
150
300
600
1,200

8
9
10
11
12
13
14
15

1,800
2,000
2,400
3,600
4,800
7,200
9,600
19,200

When a KDF11-BA is upgraded in the field (new ROMs installed) to a KDF1 1-BF
CPU, the baud rate for both the console SLU and the second SLU 1s set by the S2
switch pack (E114). Refer to Table 3-6 for these settings.
Table 3-6

Baud

S2 (E114) Switch Pack Settings

Rate

§2-8

50
75
110
134.5
150
300
600
1,200
1,800
2,000
2,400
3,600
4,800
7,200

On
On
On
On
On
On
On
On
Off
Off
Off
Off
Off
Off

9,600
19,200

Off
Off

Second SLLU

S8§2-7

S8S2-6

S82-5

On
On
On
On
Offt
Off
Off
Off
On
On
On
On
Off
Off

On
On
Oft
Off
On
On
Off
Otf
On
On
Off
Off
On
On

On
Off
On
Off
On
Off
On
Off
On
Off
On
Off
On
Off

Off
Off

Oftf
Off

On
Off

Console SLU

S8S2-4

8S2-3

8S2-2

8S2-1

On
On
On
On
On
On
On
On
Off
Off
Off
Off
Off
Off

On
On
On
On
Off
Off
Off
Off
On
On
On
On
Off
Off

On
On
Off
Off
On
On
Off
Off
On
On
Off
Off
On
On

On
Off
On
Off
On
Off
On
Off
On
Off
On
Off
On
Off

Off
Oftf

Off
Oft

Oftf
Off

On
Off

3-9

KDF11-B Systems

3.5

KDF11-B AUTOMATIC BOOT MODE

When set to the factory configuration, the KDF11-B automatically runs diagnostic
self-tests (described in Section 4.2). These tests run every time the system is
turned on or restarted.

Typing <CTRL> C during the self-test stops the self-test and causes the system
to attempt to boot as if the self-test had completed successfully.

After successful completion of the startup self-test, the ROM code directs the
system to take one of the following actions:
e

Boot from one or more previously selected devices.

Enter console dialog mode (Section 2.8).

KEnter console emulator mode (Section 4.5).

The ROM code searches for and identifies available Mass Storage Control Protocol
(MSCP) devices (units 0-7) and other available devices. It attempts to boot from
the available devices in the following order:

MSCP devices with removable media (RX50)

MSCP devices with fixed media (RD5n)

Other devices

The system boots when a bootable medium is found. If no bootable medium is

found, the system displays a message similar to the following:
ERROR UNIT DUO
FRR 16 NOT BOOTABLE

WISH TO REBOOT (N)?
This message indicates that the system has entered dialog mode and is waiting for
user mnput.

If you load bootable media, type Y and press the Return key, the system returns
to automatic boot mode and boots the appropriate device.
Typing <CTRL> P while the system is booting causes the system to stop the boot
process and enter console dialog mode.

3-10

KDF11-B Systems

If you respond to the message above by typing N and pressing the Return key, or
by entering a <CTRL> P, the system displays the console dialog mode menu as
follows:

128 KW MEMORY

KDF11B-BE ROM VOXX

CLOCK ENABLED

BOOT

HELP
MAP

DIAGNOSE

Press RETURN to select BOOT

Use cursor controls "UP ARROW” or 'DOWN ARROW" to select
function

Use CTRL/W to reset menu

3.6

KDF11-B CONSOLE DIALOG MODE

The system enters console dialog mode if the following conditions exist:
e The system fails to find a bootable device.

e You enter <CTRL> P while the system is booting.

The console dialog mode and the menu include the following commands:
BOOT — Allows you to select the boot source. To select a boot source use a

device name and unit number mnemonic (DUO0), an octal unit number (you must
enter the [O switch), or a nonstandard CSR address (you must enter the [A
switch).

HELP — Displays a one-screen help file that provides a brief description of each
command.

MAP — Lists CPU options installed on module. It also searches for, identifies, and
lists all memory in the system and all occupied register locations in the system /O
page.

DIAGNOSE — Executes an extended memory test that takes approximately 25
minutes for 128 Kwords of memory.

LIST — Displays (only on non-ANSI terminals) a listing of all bootable devices
present on the system. The listing includes the device name, unit number range,
source of the program, and a very short device description. (This function 1s part of
the BOOT command on ANSI terminals.)

3-11

B, \g‘; N

e f‘h P

A gNos LIS

INTRODUCTION

4.1

This chapter describes the following topics:
e Startup self-test (Section 4.2)

e KDJ11-B (M8190) testing procedures and messages (Section 4.3)
o KDF11-B (M8189) testing procedures and messages (Section 4.4)
e Console emulator mode (Section 4.5)

e Octal Debugging Technique (ODT) commands (Section 4.6)
e Tests that can be loaded from user diskettes (Section 4.7)
e Other diagnostic media (Section 4.8)

e Testing with DEC/X11 run-time exerciser (Section 4.9)
o Testing with XXDP+ diagnostic programs (Section 4.10)

e Troubleshooting procedures for the BA23 and BA123 enclosure (Section 4.11)
4.2

START-UP SELF-TEST

The factory configuration of the KDJ11-B and KDF11-B modules is set for automatic self-test and boot mode. This test runs each time the system is turned on or
restarted. The self-test tests the following:
e

CPU

Memory

o Connections between both CPU and memory modules and the Q22-Bus

The self-test begins by testing a small portion of the CPU module and then proautomatic
gressively tests more and more of the base system. The system enters 2).
When
r
Chapte
(see
test
p
startu
the
of
hoot mode upon successful completion
4-1

Diagnostics

the self-test discovers an error or failure, the system displays a message. Refer to
Section 4.3.1 for an explanation of the KDJ11-B messages. Refer to Section 4.4.1
for an explanation of the KDF11-B messages. Section 4.11 provides a flow chart to
help you isolate a failing Field Replaceable Unit (FRU).
4.3

KDJ11-B TESTING PROCEDURE

The self-test program contains 40 separate parts, beginning with test 77 and
counting down to 30 octal. The Serial Line Unit (SLU) display panel displays the
number of the current self-test. The SLU panel also displays boot messages (27 to
00 octal). Table 4-1 provides a summary of these tests and messages.
Table 4-1
Number

Self-Test Listing
Description

CPU hung or Halt switch on at power-on or restart

First CPU pretests, memory management unit (MMU) register tests

Turn MMU on and run MMU tests and CPU tests

Power-up to on-line debugging technique (ODT)

Power-up to 24/26

EEPROM checksum test

CPU ROM and page addressing test

Miscellaneous CPU and extended instruction set (EIS) tests

SLU 1 - check all four registers

SLU 2 - check receivers and transmitters maintenance mode

SLU 3 - check interrupts and errors in maintenance mode

Test MMU abort logic

Standalone CPU cache mode tests (memory off)

Line clock test

Floating-point processor (FPP)

CPU commercial instruction set (CIS) test

Standalone mode exit — check address 1776000 for guaranteed
timeout

Memory sizing test

Check for memory at address 0

Test memory from 0 to 4 K words

Cache test using memory

Memory data byte tests for all memory

Parity and error correction code (ECC) for all memory

Memory address line shorts for all memory

4-2

Diagnostics

Self-Test Listing (Cont.)

Table 4-1
Number
45 to 31

Description
*

Test exit — test completed successfully

Spare — not used

Reserved — Not used by ROM code. This code is driven by the MDM

module on UNIBUS systems. Do not use it, even if system is Q-Bus

DECNET boot (DLV11-E/F of DUV11) waiting for a reply from host
XON not received after XOFF — To correct type CTRL Q

24
23

Xmit ready bit never sets in DLART transmit CSR

Drive error

Controller error

Boot device selection was invalid (i.e., AA)

15
14

Nonexistent drive
Nonexistent controller

No tape
No disk

Invalid unit number selected

Invalid boot block
Drive not ready

11
10

For Q-Bus only. No bootable device found in automatic boot mode

Console disable by switch 1 = On and no force dialog. For V6.0 only,

APT break received and ROM code has entered ODT
Spare

Dialog mode

Off board ROM boot in progress
EEPROM boot in progress
CPU ROM boot in progress

03
02
01

Control transferred from ROM code to booted device. The display

blanks when it receives a code of 00

* These are UNIBUS tests, not run on Q22-Bus systems.
4.3.1

KDJ11-B Messages

Normally the system displays a message in three locations:

e The console terminal — displays a number and brief message. An example of a
message is shown in Section 4.3.2. Table 4-2 shows the boot/diagnostic

messages.

4-3

Diagnostics

The SLU display panel — displays a two-digit octal code.

e The M8190 module - displays a message on the red diagnostic LEDs on the
rear edge of the module. The top three LEDs (looking into the card cage)
represent the octal Most Significant Bit (MSB) and the lower three LEDs
represent the octal Least Significant Bit (LSB).

When all three display locations are working, the system displays the same information in all locations. If the console terminal is not working, refer to the SLU
display panel for information. If the SLU is not working, refer to the module itself.
Sometimes, the console terminal displays a message in the format:
000100

@
The number (000100 in this example) 1s the octal address of the next instruction to

be executed. The (@ sign indicates that the system has halted and passed control to
the console emulator mode. Make sure that the Halt button is not in, and then
restart the system using the restart button. If the system halts again, the CPU is

faulty and should be replaced.
Table 4-2

KDJ11-B Self-Test and Boot/Diagnostic ROM Messages

Error Number

Probable FRU Failure

177 to 100

(Subtract 100, and refer to the codes below.)

Halt switch, M8190, power supply.

Not a failure; selected mode is ODT.

Clock from power supply.

Memory module.

52
50
47
46

Console terminal not ready due to XOFF received from
terminal while attempting to print a message.

Any other
number

4-4

M&8190

Diagnostics

Before removing and replacing the recommended FRU, boot from the diagnostic
software and verify the fault using the diagnostic software.

To boot from a diagnostic diskette, you must restart the built-in diagnostics after
the test that found the error. To do this:

Remove all removable media containing user data.

o Write-protect all other on-line data storage devices (devices containing fixed
media).
NOTE

Restarting testing after the test that found the fault is only suggested when attempting to boot write-protected media containing software diagnostics. In this case, all other on-line data storage devices must be write-protected to prevent possible data
loss.

Install the bootable diagnostic.

Type <CTRL> O followed by a 4 and then press the Return key to restart
the testing. This restarts the built-in diagnostics.

If this restart procedure fails, the diagnostic diskettes cannot be loaded to verify
the error and the failing FRU. In this situation, replace the FRU recommended in
Table 4-2.

4.3.2

KDJ11-B Console Terminal Messages

When an error occurs during the self-test, the system displays a message on the
console terminal. Figure 4-1, parts 1 and 2, show an example of such a message.

4-5

Diagnostics

TESTING IN PROGRESS - PLEASE WAIT
MEMORY SIZE 1S 256 K BYTES

9 STEP MEMORY TEST
STEP1 2 3 4 5 6

ERROR 46

MEMORY CSR ERROR

SEE TROUBLESHOOTING DOCUMENTATION

Figure 4-1

Error Message Screen, Part 1

)

ERROR PC =173436

R1 =052525
R5 = 040000

PROGRAM LISTING ADDRESS =015436
R2=172100
R6 = 172300

COMMAND

DESCRIPTION

POWON
—

RO = 060000
R4 = 100000

PAGE=15

RERUN TEST
LOOP ON TEST
MAP MEMORY AND 1I/O PAGE
ADVANCE TO THE NEXT TEST

R3 = 172344
PAR3 = 010000

TYPE ACOMMAND THEN PRESS THE RETURN KEY:

Figure 4-1

4-6

Error Message Screen, Part 2

Diagnostics

These messages contain the following information:
1.

An error number — this is the number of the self-test that failed and is typically
an octal number from 30 to 77. Sometimes the system displays an octal number
from 130 to 177. The system displays this exception when an “‘unexpected trap
to location XXX error occurs. In this case, the failing self-test is the number
minus 100.

. An error description — this is a one-line description of the error.
. The “see troubleshooting documentation” message.

" The address of the error — this address information locates the error to the
ROM address itself and the address in the program listing.

_ The contents of RO to R6 of register set 0 and the contents of kernel PAR 3.
. For some memory tests, the system displays the expected data, found data
(wrong data), and faulty memory address.

A command line with up to four user-selectable options showing how to continue
the system testing. These options include:

e Rerun the test once and, if it passes, continue with all remaining tests.

e Loop on failing test continuously. To stop this loop, type <CTRL> C. When
stopped, the system then displays the total number of successful passes and
total number of error passes.

e Map memory and I/O page. Available for tests 56 to 30. Helps locate a
misconfigured or failing memory module in the system.

o Advance to next test. Allows the user to restart the system testing after the
failing test.

NOTE

Use the “Advance to next test” command only when attempting
to boot write-protected media containing software diagnostics.

Write-protect all other on-line data storage to prevent its possible loss.

Even if the system does not display the “Advance to next test”
command, you can call it by typing <CTRL> O followed by 4 and
the Return key.

4-7

Diagnostics

4.4

KDF11-B TESTING PROCEDURES

The automatic self-tests stored in on-board boot ROMs verify the CPU operation.
Typing <CTRL> C during the self-test causes the system to attempt to boot as if
the self-test had completed successfully.

After successful completion of the self-test, the system searches for an operating
system to boot. If a bootable operating system is found, the system displays a
message similar to the following:
BOOTING FROM DUT
Loading —————-

Please wait ...........

4.4.1

KDF11-B Messages

If any part of the self-test or boot diagnostics fail, the console terminal displays a
message. Normally the system displays a message in two locations:
e

(On the console terminal

On the KDF11-B module LEDs

The console terminal display has the following format:
nn <a message>

(where nn is a number from 00 to 23)

Table 4-3 provides a description of the possible failure and a recommended action.
For example, if the system fails to boot, the console terminal displays a message
similar to the following:
ERROR UNIT DUO

ERR 16 NOT BOOTABLE
ERROR UNIT DUZ
ERR NOT BOOTABLE
ERROR UNIT DU
ERR 16 NOT BOOTABLE
WISH TO REBOOT (N)?

Some errors cause the system to halt any type of program (Section 4.4.3). In this
case, control passes to the console emulator mode. This mode allows you to simu-

late error conditions using ODT (Section 4.6) commands.

4-8

Diagnostics

Table 4-3

KDF11-B Self-Test and Boot Diagnostic ROM Messages
Description and
Recommended FRU/Action

Number

Message

NO MEMORY

FATAL MEMORY FAULT

Errors 01 through 11 indicate a

MEMORY FAULT

faulty CPU or memory module. First

MMU ABORT

replace CPU module. Retry. If fault

TRAP 4

remains, replace memory module.

TRAP 10

TRAP 14

TRAP 20

POWER FAIL

TRAP 30

TRAP 34

NONEXISTENT
CONTROLLER

Boot device as specified by S1 not found.
Check setting of S1. Retry. If error remains,

DRIVE NOT READY

Make sure a diskette is in the drive. Make

DRIVE ERROR

Check the diskette and diskette drive.

CONTROLLER ERROR

Replace controller module.

NOT BOOTABLE

replace controller module.

sure the fixed disk is on-line.

No bootable operating system. Install
operating system.

Install diskette or disk containing bootable

NO DISK

NO TAPE

System is accessing tape drive with no tape.

NONEXISTENT UNIT

Boot device as specified by switch S1 not
found. Check setting. Retry. If error remains,

ROM E126 BAD

Replace CPU boot ROM E126.

ROM E127 BAD

Replace CPU boot ROM E127.

NO FORCED PARITY

operating system.
Mount tape.

replace controller module.

See description errors 01 through 11
(CPU and memory errors).

Diagnostics

4.4.2

KDF11-B Diagnostic LEDs

If a program fails and the console terminal does not display any messages, check
the LEDs on the KDF11-B module for the diagnostic code. Table 4-4 identifies the
possible errors.

Table 4-4

List of LED Self-Test Display Codes

Display

in Octal

Definition

Diagnostic/boot ROM not executing. Cleared by ROM code before
transferring control to secondary boot.

01
02

If not halt, then CPU test, else CPU error.
If not halt, then MEMORY test, else MEMORY error.

Waiting for XON.

Waiting for console input.

Boot device status error.

Invalid boot block.

DECnet waiting for response from host.

DECnet waiting for message completion.

DECnet processing received message.

If not halt, then MMU test, else MMU error.

Error in first 8 KW of memory. Fatal error.

Scope loop.

Extended MEMORY test in progress.

MAP function in progress.

System hung, halt switch on, or not power-up mode 2.
Set by hardware reset.

4.4.3

KDF11-B System Halt

When a program halts, the console terminal displays a message in the format:

000100

@
The number (000100 in this example) is the octal address of the next instruction to
be executed. The (@ sign indicates that the system has halted and passed control to
the console emulator mode. Use the boot ROM listing for the contents of the

instruction at which the processing stopped. Check the CPU diagnostic LEDs for
additional diagnostic information.

4-10

Diagnostics

4.5

CONSOLE EMULATOR MODE

The system enters console emulator mode when one of the following occurs:
e The programs execute a halt mstruction.

e You press the Halt button on the control panel.

This mode of operation replaces the use of control switches and indicators for
communicating directly with the system. When you type commands on the keyboard, the system displays responses on the console terminal instead of lighting
indicators on the control panel.

When the system halts, it enters console emulator mode, and displays the following
on the console terminal.
nnnnnn

The number nnnnnn is the octal location of the next instruction to be executed, and
the (@ is the ODT prompt character. At this point you can examine or modify the
contents of the system’s registers and memory by entering ODT commands. The
use of ODT commands is explained below. Refer to the Microcomputers and Memories Handbook (EB-18451-20) for a more detailed description.

A portion of the microcode on the KDJ11-B and KDF11-B modules emulates the

capability normally found on a programmer’s console. The CPU interprets streams

of ASCII characters from the console terminal as console commands. The KDF11-B
modules micro-ODT accepts 18-bit addresses, allowing it to access 2438 Kbytes of
memory and the 8-Kbyte I/O page. The KDJ11-B modules micro-ODT accepts 22bit addresses, allowing it to access 4088 Kbytes of memory and the 8-Kbyte 1/O
page.

4.6 KDJ11-B AND KDF11-B OCTAL DEBUGGING TECHNIQUE (ODT)
Octal Debugging Technique (ODT) functions only when the system is in console
emulator mode. ODT consists of a group of commands and routines for finding
error conditions and for simple communication with the system. ODT helps you
debug object programs interactively. When in ODT, express all addresses, registers, and memory location contents in octal notation. Letters and symbols make up
the command set for ODT.

4-11

Diagnostics

The hardware-implemented ODT command set is a subset of commands in a larger

software-implemented ODT program. The hardware program, which resides on the

KDJ11-B and KDF11-B modules, serves primarily for diagnosis of hardware
problems. The system’s response to ODT commands helps trace events occurring
in the system.

NOTE

The hardware ODT commands can modify programs; therefore,
remove master diskettes before using ODT.

Table 4-5 provides a basic listing of ODT commands. Both F11 micro-ODT and J11
micro-ODT use these commands. F11 micro-ODT uses 18-bit addressing only. J11
micro-ODT uses 22-bit addressing only.
Table 4-5

Console ODT Commands

Command

Symbol

Function

Slash

Prints the contents of a specified location.

Carriage

<CR>

Closes an open location.

Return

Line feed

<LF>

Closes an open location and then opens the next
contiguous location.

Internal

$ or R

Opens a specific CPU register.

Opens the PS; must follow a $ or R command.

Designator

Processor
Status Word
Designator

Starts execution of a program.

Proceed

Resumes execution of a program.

Binary dump

CTRL/S

(For manufacturing use only.)

(Reserved)

Is reserved for use by Digital Equipment Corporation.

(Causes the CPU to execute a microcode routine that,
in effect, does nothing.)

4-12

Diagnostics

4.7

USER TEST DISKETTES

The user test diskette set contains the User-Friendly Diagnostic (UFD) diskettes
and the Field Service diagnostic diskettes.

4.7.1

User-Friendly Diagnostics (UFD)

Two user-friendly diagnostic diskettes provide you with an easy way to verify the
operation of the entire system. These diskettes are labeled:
e

Micro-11 User Test #1

Micro-11 User Test #2

The complete kit has the DIGITAL P.N. ZYA03-P3.

Running the UFD does not require any knowledge of software diagnostic systems
or procedures. To run the UFD:

e Load the first diskette into the first diskette drive and boot the system.

o Select T from the User Diagnostics Menu, part 1 (Figure 4-2), and press the
Return key.

e Follow the directions on the screen which include loading scratch media in all
storage devices.

4-13

Diagnostics

USER DIAGNOSTICS MENU — V6.0 — PART 1
T — Test your System.

| — Identity System Devices.
F — Field Service Diagnostics Menu.

Type the letter then press the RETURN key. OR if you are
finished running diagnostics, remove the test media............

p
Figure 4-2

User Diagnostics Menu, Part 1

NOTE

The version number on your screen may be different.
If the tests find no errors, the system displays a “‘test passed’”’ message and testing
1s complete.

If the tests detect an error, the system automatically prompts for the installation of
the second UFD diskette and the running of additional diagnostics. Follow the
directions on the screen.
e

The system displays the User Diagnostics Menu, part 2 (Figure 4-3).

Type Y and press the Return key to run the individual tests.

4-14

Diagnostics

USER DIAGNOSTICS MENU - V6.0 - PART 2
Y - Test Individual System Devices
| - Identify System Devices

F - Field Service Diagnostics Menu

Figure 4-3

User Test Diagnostics Menu, Part 2

These additional tests locate the FRU that has failed. Refer to your MicroPDP-11
Systems Owner’s Manual, Chapter 4, Troubleshooting, for additional information.
4.7.2

Field Service Diagnostics

The user test diskettes also contain a Field Service Diagnostics Menu. When you
access this menu, the system test can be looped for ten minutes or until you stop it

by typing <CTRL> C. When stopped, the console terminal displays status and
error information.

The Field Service Diagnostics Menu also allows access to the XXPD+ monitor.
Once in the monitor, an XXDP+ on-line help file is available by typing H.
NOTE

Only trained service personnel familiar with XXDP+ software
should access the XXDP+ monitor or use the Field Service diskettes described in Section 4.7.3.

4-15

Diagnostics

To access the Field Service Diagnostics Menu:

e Install the UFD diskette in drive 1 and boot the system.

e At the User Diagnostics Menu, type F and press the Return key.

The system displays the Field Service Diagnostics Menu (Figure 4-4). Select the
desired test by typing the appropriate character and pressing the Return key.

FIELD SERVICE DIAGNOSTICS MENU - V6.0 - PART 1

XXXX CAUTION: This Menu is intended for FIELD SERVICE use only
S - System Test is run for about 10 minutes and the complete
error and status messages are reported. This test can
be terminated by typing C.

R - Repeated System Tests are run until terminated by typing
C. Complete error and status messages are reported.
X - XXDP+ monitor is entered. Refer to the XXDP+ Users Guide.
U - Return to User Diagnostics Menu

.
Figure 4-4
4.7.3

Field Service Diagnostics Menu

Field Service Test Diskettes

A set of Field Service diskettes is provided for use by trained service personnel.
These diskettes make use of the XXDP+ software system to isolate a failing FRU.
The complete kit has the DIGITAL P.N. ZYA04-P3.
XXDP+ includes the program modules necessary to build a run-time exerciser for
the entire system (including system options). Independent device diagnostics are

also included.
An on-line help file is available on all diskettes under the name FILES.TXT. To
access this help file, type H when in the XXDP+ monitor. All diskettes also contain

a directory of all program modules. To access this directory, type D.

4-16

Diagnostics

For more information on the diagnostic system, refer to:
e The DEC/X11 User’s Manual (AC-F053-MC).

e The DEC/X11 Cross Reference Manual (AC-F055C-MC).
e The XXDP+/SUPR User’s Manual (AC-F348A-MC).
e XXDP+ DEC/X11 Programming Card (TBS).
NOTE

XXDP+ (also called version 1) is being revised and rewritten.
This major revision changes the implementation of many XXDP+

monitor features. The revision of XXDP+ will soon be in the Field
Service diskette set included with the system. Do not attempt to
use this new version of XXDP software without first reviewing

the changes.

4.8

OTHER DIAGNOSTIC MEDIA

Bootable diagnostics are available for TK25 streaming tape drives. Order DIGITAL
P.N. AU-T995A-MC for a TK25 compatible diagnostic cartridge.

Bootable diagnostics are also available for RC25 disk drives. Order DIGITAL P.N.

BK-T996A-MC for RC25 compatible removable disk media.

4.9

TESTING WITH THE DEC/X11 RUN-TIME EXERCISER

The DEC/X11 run-time exerciser consists of a group of program modules. Each
module tests a specific component of your MicroPDP-11 system.,

When the run-time exerciser detects an error, it displays a message describing the
circumstances of the error. Determine which system component failed and then:
e Run the appropriate XXDP+ diagnostic program.

e Look up the error call in the listing for the specific program module to determine what operation was in progress when the error occurred.
e Examine the parameter of the failure (processor status word, stack pointer,
program counter, etc.).

4-17

Diagnostics

You can modify program modules to:

Halt on different errors.

Provide different status displays.

Run alone or with selected other programs.

You can use ODT (Section 4.6) to examine system registers and memory locations.
4.9.1

Run-Time Exerciser Messages

The run-time exerciser provides displays of three basic types of messages:
e

System errors

Data errors

Status errors

4.9.1.1

System Error Messages - The program modules display a system

error in the following format: SYS ERR. The DEC/X11 run-time exerciser displays
a system error message when it detects one of the following:
e

A bus error trap (to location 4)

A reserved instruction trap (to location 10)

A queue overflow

If a system error occurs, run the program modules individually. If all modules pass,
run them in groups until the failure returns. Refer to Section 4.8.2 for directions.
4.9.1.2

Data Error Messages - The first line of a data error message ends

with the words DATA ERROR. The program modules display data errors in the
following format:

RQAAD PC XXXXXX APC YYYYYY PASS# NNNNN. ERR# NNNNN. DATA
ERROR CSRA AAAAAA 5/B BBBBBB WAS WWWWWW WRADR DDDDDD
RDADR EEEEEE

4-18

Diagnostics

where:

e RQAAO is the name of the failing program test module (listed as XRQAA0.OB]
in the directory).

o PC XXXXXX is the physical address of the program call that causes the message (program counter).

e APC YYYYYY is the assembled program count of the program call.

o PASS# NNNNN. is the pass number (decimal) during which the error occurred.
e ERR# NNNNN. is the error count (decimal) for the current run.

e CSRA AAAAAA is the address of the control and status register of the failing
device.

e S/B BBBBBB is the expected data (5/B, or “should be,” data).
e WAS WWWWWW is the bad data.

e WRADR DDDDDD is the address of the expected data (S/B, or “‘should be,”
data).

e RDADR EEEEEE is the address of the bad data.

You can rerun the DEC/X11 modules individually, or run the appropriate XXDP+
program. If you want to examine the message further, find the Assembled Program
Count (APC) value in the program listing. The APC location display contains the
program call that caused the error message.

4.9.1.3 Status Error Message - This message is in the same general format as
the data error message. You can recognize a status error message by the absence
of SYS ERR or DATA ERROR in the first line.

The status error message includes a STATC value. This value is the contents of
the status register of the failing device. Like a data error, a status error can be
traced to a listing by looking up the location given for the APC.
The status error message does not include:
e The S/B (“‘should be”’) message.
e The WAS (bad data) message.

4-19

Diagnostics

4.9.2

Selecting and Deselecting Program Modules

You can run programs individually or in groups by using the select (SEL) and
deselect (DES) commands. These commands allow you to:
e

Select or deselect program modules one at a time

Select or deselect all modules

These commands operate only within the system exerciser program. They cannot
be executed without first starting the exerciser. Table 4-6 shows the commands
and their function.
Table 4-6

Select/Deselect Commands

Command

Function

SEL<CR>

Selects all modules for execution.

SEL RQAAO<CR>

Selects only the RQAAO program module. The program
name must be typed as it appears in the listing.

DES<CR>

Deselects all modules.

DES RQAAO<CR>

Deselects only the RQAAO module.

You can obtain the status of a module (selected or deselected) by using the MAP
command. This command instructs the monitor program to display a list of resident

modules with their starting addresses and status. For example:
MAP<CR>

CPAFO AT 017752 STAT 040020
CPBGO AT 021502 STAT 040020
RQAAD AT 023242 STAT 150000
The second most significant octal digit of the status (STAT) message indicates
whether or not a module is selected.

When the number 1s 0, 1, 2, or 3, the module is deselected.

When the number is 4, 5, 6, or 7, the module is selected.

Refer to the DEC/X11 User’s Manual (AC-F053-MC) for further information.

4-20

Diagnostics

4.9.3

Expanding the Run-Time Exerciser

Each system has a run-time exerciser designed for that system’s configuration. If
you expand your system, you must rebuild the exerciser in order to test the added
components.

Vou must rebuild the exerciser, rather than just add to it, because it is an inferactive system of programs. Rebuilding involves selecting the program modules appropriate to the new hardware and including them with the existing program modules
in a new exerciser. Refer to the DEC/X11 User’s Manual (AC-F053-MC) for further information.

4.10

TESTING WITH THE XXDP+ PROGRAMS

The set of field service diskettes provided with your MicroPDP-11 system include
the XXDP+ diagnostic programs. Refer to Table 4-7 for a partial list of these
programs. These diskettes also contain other XXDP+ programs for testing additional options.

Table 4-7

XXDP+ Diagnostic Programs

XXDP+ Program Name

Title

JKDB??
JKDA??
JKL5??
VMAR??*
VMSA??

KDF11 basic instruction test
KDF11 MMU test
KDF11B CPU cluster test
KDF11 BOOT/ROM test
Q-Bus 22-bit address memory test

ZRQA??

RD/RX performance exerciser

OKDA??

KDJ11 CPU and cache test

VDZA??
VDZB??

DZV11 test: part one
DZV11 test: part two

ZRQB?? T

RD51 formatter program

% Revision of VM8A?? must be version FO or later.

+ This program also contains the RD52/RD53 formatter program on version 5 or later of
the field service diskettes.

The XXDP+ diagnostic software helps to isolate failures by testing the function of
the selected FRU. The system reports the results of a test on a pass/fail basis.

4-21

Diagnostics

You can modify the XXDP+ programs to perform specific functions. Modification of

these programs requires careful study of the program listings and the
XXDP+/SUPR User’s Manual (AC-F348A-MC). This manual describes the com-

mands available under the various XXDP+ utility programs, and lists specific program modifications and procedures.

The following paragraphs describe some of the more common operations.
4.10.1

XXDP+ Messages

The XXDP+ diagnostic programs do not use a universal format for messages. The
large number of parameters tested makes a variety of formats necessary. Most

formats display:
e

Several octal words, which provide the parameters at the time of the error

A mnemonic indicating what occurred

The tables or error directories of the individual program listings reference these
program-specific mnemonics.

4.10.2

Starting a Program

To start a program, type R and the first four letters of the name followed by ??.
Press the Return key. The program prompts you for responses. The question
marks allow any revision of the program to run.
4.10.3

Restarting Programs

You can configure the XXDP+ diagnostic programs to do the following:
e

Run continuously

Halt at the end of a pass

Halt (or loop) on selected errors

You can halt a program by pressing the Halt button. You can then enter appropriate ODT commands or restart the program by typing the restart address given in
the program listing. For example:

@200G
When a diskette boots and you enter the XXDP+ monitor, the system displays the

restart address in the monitor heading. If the diagnostic program has not overwrit-

ten the memory locations, return to the monitor by typing this restart address.

4-22

Diagnostics

If the diagnostic program has overwritten the memory locations of the XXDP+
monitor program, reboot the diskette to return to the monitor.
4.10.4

Modifying a Diagnostic Program

You can modify diagnostic programs to perform specialized diagnostic functions.
The individual program listings explain what to modify for each purpose. Modifying
a program requires the use of ODT commands to change the contents of certain
locations.

The following example changes the memory exerciser program so that it performs
a loop on error. The program listing directs you to change software switch register
176 to 1000 in order to do this.

Load the program with the L command instead of the R command.
L VMSA?<CR>

The system loads the program into memory and displays the . (period) prompt.
The program is not executed at this time.

e Press the Halt button on the control panel. This places the system in console
emulator mode where control passes to the ODT program. The system displays
the ODT (@ prompt.

e Open location 176 by typing 176 and pressing the [ (slash) key. The system
displays the present contents of that location.
@176/000000

e Type the number specified by the program listing after the zeros (in this case,
1000).

(@176/000000 1000<CR>
@

e Type 176/ again to make sure the change has been made. Press the Return
key.

@176/0010000<CR>
(@

e Start the program at location 200 with the ODT GO command.
@200G

es the program. When testing 1s
The system displays the program name andandexecut
starts another pass.

Complet€, the system displays END PASS

4-23

Diagnostics

Press the Halt button to terminate the program. This returns control to the
ODT program.

Press the Halt button again to exit from console emulator mode. Then press
the Restart button, which passes control back to the XXDP+ monitor program.

Modifying the program by this method affects only the system’s memory; it does
not change the program on the diskette. Therefore, it is not necessary to restore
the contents of the location after the program 1s completed.
4.11

TROUBLESHOOTING THE BA23 AND BA123 ENCLOSURES

The start-up diagnostics automatically run the CPU and memory module self-tests.
Tables 4-1, 4-2, and 4-3 list the number produced by this testing and a probable
FRU failure.

To begin the troubleshooting procedure, determine exactly what was being done
when the system failed. This includes:

Operating system being run

Application being run

Media installed

Switch setting

Indicator lights (lit or not lit)

User input

This information might prove helpful when attempting to re-create the failure.

As a second step, inspect the system for problems that can be seen. This includes
incorrect switch settings, loose cables, and incorrectly installed modules. Refer also
to the troubleshooting check list located in Chapter 4, Troubleshooting, of your

Systems Owner’s Manual.
The user test and Field Service diskettes provide further testing of the system. To
1solate the problem to a failing FRU, follow the flow chart shown in Figure 4-5.

Refer to Chapter 8 or Chapter 10, FRU Removal And Replacement Procedures,
for the appropriate removal and replacement procedures for your system.

4-24

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INTRODUCTION

This chapter describes mass storage and backup devices that can be installed with

the MicroPDP-11 systems in the BA23-A or BA123-A enclosures. This chapter
discusses the following options:
e Mass storage devices

RC25 disk subsystem (Section 5.2)

RD51, RD52, and RD53 fixed-disk drives (Section 5.3)

RQDX1, RQDX2, and RQDX3 disk controller modules (Section 5.4)
RQDX1-E and RQDXE extender modules (Section 5.5)
RX50-AA diskette drive (Section 5.6)
RLO2 disk subsystem (Section 5.7)

e Mass storage backup devices

TQK25-EP tape drive and controller module (Section 5.8)
TQK50-KA tape drive and controller module (Section 5.9)

This chapter also provides factory configuration of all switches and jumpers.
Formatting instructions for the RD51, RD52, and RD53 fixed-disk drives are provided in Section 5.3.2 and Appendix C.

Refer to the LSI Systems Service Manual (EK-LSIFS-SV-005) for additional infor-

mation for each of these mass storage and backup options.

5-1

Mass Storage and Backup Options

5.2

RC25 DISK SUBSYSTEM

The RC25, a standalone mass storage device, has a capacity of 52 Mbytes. It
contains two eight-inch, double-sided disks. One disk is fixed and one is removable.
Each disk has a capacity of 26 Mbytes. The same spindle drives both disks.
BA23-A controller kit

Factory installed:

Field upgrade:

RQC25-AB

RC25-AA (desktop drive with cartridge and KLESI-QA
cabling kit)

BA123-A controller kit

Factory installed:
Field upgrade:

RQC25-DA
RC25-DA (desktop drive with cartridge and KLESI-QA
cabling kit)

The KLESI-QA cabling kit provides the connection between the disk drive and the
enclosure. The kit contains one type A filter connector, a cable that connects the

filter to the controller module (M7740), and a round cable that connects the RC25

to the 1/O distribution panel (Figure 5-1).
The Control Status Register (CSR) address of the first M7740 adapter module is
fixed. You can change it using the Dual In-line Package (DIP) switch, E44 (Figure

5-2). Table 5-1 lists the factory setting. The interrupt vector is set under program
control.

5-2

Mass Storage and Backup Options

Table 5-1

M7740 CSR Address

Al12 A11 A10 A9
Factory

E44

— Add. Bits

Setting

— Switches

17772150

0
1

1
0

Possible addresses if second MSCP device:

17760334
1776-354

0
O

0
0

1
1

1 = switch on

0 = switch off

* () = jumper on left and center pin (module edge towards you)
T 1 = jumper on right and center pin
NOTE

The M7740 and M8639 (RQDX controller) are both Mass Storage
Control Protocol (MSCP) devices. All MSCP devices have a CSR
address of 17772150. If you install more than one MSCP device
in a system, you must change the CSR address of one of them.

Set the CSR address of the second device within the floating range. Refer to

Appendix A for further information.

5-3

Mass Storage and Backup Options

ADAPTER
MODULE

| BA23

INTERFACE

CABLE

Figure 5-1

o-4

RC25 Disk Subsystem

Mass Storage and Backup Options

m*‘/g

1
SW10

Figure 5-2

M7740 Module Layout

5-5

Mass Storage and Backup Options

5.3

RD51, RD52, AND RD53 DISK DRIVES

BAZ3-A system

Factory installed:

RD5nQ-AA (disk kit)

n=1, 2, or 3

Field upgrade:

Same as factory installed option

An RD5nQ-AA kit includes the following:
e

RDb5n-A: Disk drive

17-00282-00: 20-pin cable to signal distribution panel

17-00286-00: 34-pin cable to signal distribution panel

BA123-A system

Factory installed:

RD5nQ-BA (disk kit) n =1, 2, or 3

Field upgrade:

Same as factory installed option

RD5n-A: Disk drive

17-00282-01: 20-pin cable to signal distribution panel

17-00286-01: 34-pin cable to signal distribution panel

An RD5nQ-BA kit includes the following:

70-22393-01: Control panel assembly

The RD51, RD52, and RD53 are fixed-disk drives with formatted capacities of 11

Mbytes, 31 Mbytes, and 71 Mbytes respectively.

When you install these drives in a BA123-A enclosure, a cable from the power
supply must be connected to each drive (see Section 9.7).
CAUTION
Only one fixed-disk drive can be installed in a BA23-A

enclosure.

5-6

‘

Mass Storage and Backup Options

When you install these drives in a BA23-A enclosure in port 0 (left slot), the signal
cables connect to J2 and J7 on the backplane. When you install these drives in port
1 (right slot), the signal cables connect to J1 and J5 on the backplane.

5.3.1

Factory Configuration

The following sections provide the factory configuration for the RD5n disk drives.

53.1.1

RD51 - Table 5-2 lists the read/write board jumper setting for the RDo51

DIP shunt jumper (Figure 5-3).

Table 5-2

RD51 DIP Shunt Pack Factory Setting

Pin Numbers

Pin Connection

1 to 16

Not used

2 to 15
3to 14
4 to 13
5to 12
6 to 11
7 to 10
8to9

In
In
In
Out
In
Out
Out

53.1.2 RD52 - The RD52 read/write printed circuit board has five pairs of pins
(Figure 5-4). To configure an RD52 drive in a BA23-A enclosure as DUO (installed
in port 0), place the jumper clip on DS3. To configure an RD52 drive in a BA23-A
enclosure as DU1 (installed in port 1), place the jumper clip on DS4.
To configure an RD52 drive in a BA123-A enclosure, one (any one) of the four

pairs of pins on the left must be connected with a jumper.

In a BA123-A enclosure, a drive is selected by the position of its signal cables 1n
the M9058 signal distribution board, not by the drive select pins. See Figure 9-8
for the correct cabling.

5-7

Mass Storage and Backup Options

5.3.1.3

RD53 - The RD53 read/write printed circuit board has four switches at

its rear edge numbered as follows:
REAR OF DRIVE

To configure an RD53 installed in a BA23-A enclosure as drive DUO (installed in
port 0), depress switch 3. To configure the RD53 as DU1 (installed in port 1),
depress switch 4.

To configure an RD53 drive installed in a BA123-A enclosure, depress either
switch 3 or switch 4 on the rear edge of the read/write board.

Figure 5-3

5-8

RDb51 Disk Drive and Shunt Jumper

Mass Storage and Backup Options

FRONT OF DRIVE

Figure 5-4

RD52 Disk Drive and Jumpers

5-9

Mass Storage and Backup Options

Disk Formatting

5.3.2

Replacement disk drives must be formatted with the ZRQB?? binary program to be
compatible with the RQDX controller module. This program is part of the XXDP+
diagnostic software system which is on the Field Service test diskettes. Use version CO or later to format an RD52 or RD53 disk drive. The procedure is as
follows.

NOTE

Write down the serial number of the fixed-disk drive before
installing it. You will need it during the formatting procedure.
Symbols:
<CR> = carriage return
< > = example of a correct answer

(L) = answer with a letter (Y or N)

(D) = answer with a one digit number
(A) = answer with an alphanumeric
(def) = default — <CR> enters the listed response
Your Response

(Press Return after each
XXDP+ Prompt

response)

R ZRQB??
DRSDO
ZRQB-C-0
RD51/52 DISK FORMATTER

UNIT IS RQDX1/2 DISK DRIVE SUBSYSTEM
RSTRT ADR AAAAAA

DR>

STA

CHANGE HW (L)?

CHANGE SW (L)?

ENTER DATE <MM-DD-YYYY> (A)?

(Use the format shown)

Enter unit to format <0>: (D)?

(Enter the unit number
assigned to the drive to be

formatted)

5-10

Mass Storage and Backup Options

Use existing bad block information

<N>: (L) (N)?

Use down line-load (L) N?

N (def)

Continue if bad block information 1s

N (def)

inaccessible (L) N?

Enter 8 character serial number (A)?

Enter date in MM-DD-YY format (A)?
Format begun

(Enter the serial number of
the RD51/2)

(Use the format shown)
(This will take about 30
minutes)

Format completed, X revectored LBNs
RDRX EOP 1

0 total errs

For further information refer to:
e Appendix C

e RD52-D, -R Fixed-Disk Drive Subsystem Owner’s Manual

o 11C23-UE/11C23-UC RD52 Upgrade Installation Guide

5-11

Mass Storage and Backup Options

5.4

RQDX1, RQDX2, AND RQDX3 DISK CONTROLLERS

BA23-A enclosure

Factory installed:

CK-RQDX1-KA
CK-RQDX2-KA
CK-RQDX3-KA

Field upgrade:
Module number:

Same as factory installed option
M8639 (RQDX1)
M8639-YB (RQDX2)
M8639-YA (RQDX3)

A BA23-A RQDX1, RQDX2, or RQDX3 controller kit includes the following:
e

RQDX1, RQDX2, or RQDX3 controller module

BCO02D-ID 50-pin cable, RQDX to signal distribution panel

BA123-A enclosure

Factory installed:

CK-RQDX1-BA
CK-RQDX2-BA
CK-RQDX3-BA

Field upgrade:
Module number:

Same as factory installed option
M8639 (RQDX1)
M8639-YB (RQDX2)
M8639-YA (RQDX3)

A BA123-A RQDX1, RQDX2, or RQDX3 controller kit includes the following:

RQDX1, RQDX2, or RQDX3 controller module

17-00861-01 50-pin cable, RQPX to signal distribution panel
17-00862-01 40-pin, M9058 to four RD console boards

M9058 signal distribution board

5-12

Mass Storage and Backup Options

The optional RQDX1-E (M7512) and RQDXE (M7513) extender modules and their
associated cables provide the RQDX1, RQDX2, and RQDX3 controller signals to
any external drive connected to the host (Section 5.5).

The RQDX1, RQDX2, and RQDX3 controllers provide the interface for fixed-disk
and diskette drives to the Q22-Bus. These intelligent controllers have on-board
microprocessors. Data transfers using Direct Memory Access (DMA). Programs in
the host system communicate with the controller and drives using the MSCP.

These controllers can control a maximum of four drive units. Each fixed-disk drive
counts as one disk unit (DU). Each RX50 counts as two disk units.
The RQDX1 controls a maximum of two fixed-disk drives and an RX50 diskette
drive.

NOTE

An RQDX1 controller must be the last module installed in the
BA23-A or BA123-A backplanes. The BA123-A enclosure ships
with an RQDX2 or RQDX3 controller.

The RQDX2 and RQDX3 control a maximum of four fixed-disk drives, or two fixeddisk drives and an RX50 diskette drive.
NOTE

A BA23-A enclosure supports only one fixed-disk drive installed
at any one time.

Figure 5-5 shows the jumper and LED locations for the RQDX1 and RQDXZ controllers. The RQDX3 controller module is not shown.

5-13

Mass Storage and Backup Options

LUN7 S.......0

RQDX

D10

S~ [N
batd

R———|

[
RQDX2

A12
W‘]

[l
Figure 5-5

5-14

¢« v e c

s o0

“ o

[

RQDX1 and RQDX2 Controller Modules

Mass Storage and Backup Options

The starting address of all the RQDX modules is fixed at 177 72150. The starting
address of a second RQDX module installed in the system is a floating address and
must be set. The first RQDX controller is assigned a fixed interrupt vector of 154,
which is set under program control. If you install a second RQDX controller, the
interrupt vector floats (refer to Appendix A). Table 5-3 lists the factory
configuration.

Four Light Emitting Diodes (LEDs) on the RQDX modules provide diagnostic information. Refer to the RQDX1 Controller Module User’s Guide (EK-RQDX1-UG),
the RQDX2 Controller Module User’s Guide (EK-RQDX2-UG), or the RQDX3 Controller Module User’s Guide (EK-RQDX3-UG) for information.

RQDX1, RQDX2, and RQDX3 Factory Jumper Configuration

Table 5-3

Module

Starting

A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 — Add. Bits

17772150

Number Address

(Jumpers)

Possible settings for a second RQDX controller

17760334

17760354
17760374

0
0

o
o

0
o

0
o0

1
1

0 < factory

0
1

1
1

1 = installed

0 = removed

Logical Unit Number (LUN) jumpers 1-8 are removed.

You must also configure the LUN jumpers (0-7) on the module. The factory configuration of all jumpers removed is correct for the first module installed in a

system. If you install a second module, install a jumper onto pin 2. This assigns its
LUNs to a value of 4-7. The jumpers represent a binary weighted value and can
be configured to begin at any LUN from 0-35. Refer to Appendix D for further
discussion and examples.

5-15

Mass Storage and Backup Options

5.5

RQDX1-E (M7512) AND RQDXE (M7513) EXTENDER MODULES

The optional dual-height RQDX1-E and RQDXE extender modules carry the
RQDX1, RQDX2, and RQDX3 controller module signals to external MSCP devices.
Both these extender modules are designed primarily for use with a BA23-A enclosure. The PDP-11/23 PLUS system in a BA11-S enclosure also supports these
extender modules. Install the M7512 or the M7513 module in rows A and B of the
slot directly below the RQDX1, RQDX2, or RQDX3 controller module.
When installing an RQDX1-E extender module, use the following guidelines:
e

Use the RQDX1-E (M7512) extender module when you have an RQDX1 controller module.

Install the RQDX1-E (M7512) in the same backplane directly below the RQDX1
controller module.

Make sure that the extender module is the last module installed in the BA23
backplane.

When installing an RQDXE extender module, use the following guidelines:

Use the RQDXE (M7513) extender module when you have an RQDX2 or
RQDX3 controller module.

Install the RQDXE (M7513) in the same backplane directly below the RQDX2
controller module.

Note that neither the RQDX2 or RQDX3 nor the RQDXE module needs to be
the last module installed in the backplane.

5-16

Mass Storage and Backup Options

When you install RD51, RD52, or RD53 fixed-disk drives with an RQDX controller
and RQDX extender module in a BA23-A enclosure, the following rules apply:

e Always place the first fixed-disk drive (DUO) in port 0 (left mass storage slot) of
the enclosure containing the RQDX controller module.

e Set the device select switch to 3 (DUOQ) on any fixed-disk drive installed in port
0 of the enclosure or expansion unit. (This rule also applies to any subsystem
installed with a BA23-A enclosure.)
NOTE

A subsystem is an RX or RD desktop or rack mounted disk drive

with its own power supply.

e Set the device select switch to 4 (DU1) on any fixed-disk drive installed in port
1 (right mass storage slot) of the enclosure or expansion unit. (This rule also
applies to any subsystem installed with a BA23-A enclosure.)
e Do not set the device select switch to 1 or 2 on any fixed-disk drive. These
switch settings are reserved for RX50 diskette drives.

Refer to Appendix D, Logical Unit Number Designation, for further information.
5.5.1

RQDX1-E (M7512 Extender Module

Use the RQDX1-E extender module when you have an RQDX1 controller module
and you want to add a subsystem or a second fixed-disk drive in a BA23-C expansion box. The RQDX1 controller supports two fixed-disk drives and one RX50
diskette drive.

5-17

Mass Storage and Backup Options

Figure 5-6 shows the jumper locations on the M7512 module.

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/—]
J

)
W1-—+

Wz_—}_

ooG;

W3-___}.

W4 —F

RJR
DD
X

0003

Figure 5-6

RQDX1-E Module

Table 5-4 provides the RQDX1-E factory configuration of these jumpers. Use this
configuration with a BA23-A enclosure and a BA23-C expansion box, or with a
BA23-A enclosure/disk drive subsystem arrangement. The factory configuration is
set to connect the expansion unit or subsystem to connector J3.

5-18

Mass Storage and Backup Options

Table 5-4

RQDX1-E Factory Configuration
Factory

Jumpers
W1 - W4

JD1 - JD2
JRX1 - JDX2

Function

Configuration

Must be installed

W1 - W4

(For manufacturing use only)

Factory set; do not change

JD1 to JRX1
JD2 to JRX2

JB1 - JB8

JA1 to JC1

JA1 - JAS8

JA2 to JC2

JC1 - JC8

JA3 to JB3
JA4 to JB4

JA5 to JB5
JA6 to JB6

JA7 to JC7

JAS8 to JC8

For further information refer to the RQDX1 Controller Module User’s Guide (EKRQDX1-UG).

5-19

Mass Storage and Backup Options

5.5.2

RQDXE (M7513) Extender Module

Use the RQDXE extender module when you have an RQDX2 or RQDX3 controller
module and you want to add subsystems or an additional fixed-disk drive in a BA23C expansion box. The RQDX2 and RQDX3 modules support four fixed-disk drives
or two fixed-disk drives and an RX50 diskette drive.
NOTE

A BA23-A enclosure used as the host or a BA23-C expansion
box supports only one fixed-disk drive per enclosure, even
though the RQDX2 and RQDX3 controller and RQDXE extender
modules can support four fixed-disk drives.

Three fixed-disk drives are permissible when the RQDX2 controller and RQDXE
extender modules are used with a BA23-A enclosure and two subsystems (either
desktop or rackmounted).

The M7513 module (Figure 5-7) has three 50-pin connectors that have the following functions:

e J1 connects to the backplane.

e J2 connects directly to the RQDX2 controller module.

e J3 provides the connection to an external distribution panel.

5-20

Mass Storage and Backup Options

JUMPER

POINTS

TO BA23

F2
2

B
TO EXTERNAL

DRV ACK

Lo Sl
K3LO

M7513

C3
D1
D3

B3
C1

" O

000000 L 00000000

Al
A3

000000 2[00 000000

RDY/WRT PROT

_OJK4

EX PORT SEL

L1[O
O]L4
L3|O
O M2
M1{O

O | M4

INT PORT SEL

N o
N3 O

:
Figure 5-7

O |N4
O

[

J2 J

TO RODX?2

RQDXE (M7513) Extender Module

5-21

Mass Storage and Backup Options

Table 5-5 shows three typical fixed-disk and RX50 arrangements using the RQDX2
or RQDX3 and the RQDXE extender module. The factory jumper configuration
supports all three arrangements shown,

Table 5-6 shows the RQDXE (M7513) factory configuration. This configuration
supports one RX50 and two fixed-disks. You can use this configuration with a
BA23-A enclosure and a BA23-C expansion box, or with a BA23-A enclosure and a
subsystem.

Table 5-5
Option

Three Possible Arrangements Using the RQDXE
Port O

Port 1

(Right Slot)

Orientation

(Left Slot)

No.

Arrangement

Host*
Expansion box

RDO
RD1

RX50 —
Xt —

Front Panel
Front Panel

Host
Expansion box

RDO
RD1

X —
X —

Front Panel
Front Panel

Host
Subsystemi

RDO
RD1

RX50 —
—

Front Panel
Front Panel

* The term “Host”’ is used for simplicity. All that this implies is the enclosure in which the
RQDX2 controller resides.

t X implies the port is empty or contains a device not supported by the RQDX controller.
t A subsystem is an RX or RD desktop or rackmounted disk drive with its own power
supply.

5-22

Mass Storage and Backup Options

Table 5-6

RQDXE Jumper Setting (Factory Configuration)

RDY and
WRT PROT

Drive
SEL

Drive
ACK

External
Port SEL

Internal
Port SEL

Al to A3
B1 to B3

*E1 to E2
F1 to F3

K2 to K4

*L1 to L3
L4 to M2

N1 to N2
*N4 to P2

*F2 to F4

*H3 to H4

* These jumpers are installed to avoid floating inputs on the M7513.

Table 5-7 shows a configuration using the RQDXE (M7513) with three fixed-disk
drives.

Table 5-8 shows the RQDXE (M7513) jumper setting to support three fixed-disk
drives. Use this configuration only with a BA23-A enclosure and dual subsystems.
Table 5-7

Three Fixed-Disks With an RQDXE
Port O

Port 1

Arrangement

(Left Slot)

(Right Slot)

Orientation

Host
Dual Subsystem

RDO
RD1

X —
RD2 —

Front Panel
Front Panel(s)

(Only)

Table 5-8

RQDXE Configuration for Three Fixed-Disk Drives

RDY and
WRT PROT

Drive
SEL

Drive
ACK

External
Port SEL

Internal
Port SEL

Al to A3
B1 to B3

El to E2
F1 to F3

K1 to K3
K2 to K4

L3 to M1
L4 to M2

N1 to N2
N4 to P2

C2toC4
D2 to D4

H1 to H2
H3 to H4

Refer to Appendix E for additional configurations. Refer to the RQDXn Controller
Module User’s Guides for further information.

5-23

Mass Storage and Backup Options

5.6

RX50 DISKETTE DRIVE

BA23-A enclosure

Factory installed:

RX50-AA

Field upgrade:

Same as factory installed

Cabinet kit:

RX50-AA diskette drive
17-00285-02 34-pin RX50 cable to signal distribution
panel

BA123-A enclosure

Factory installed:

RX50-BA

Field upgrade:

Same as factory installed

Cabinet kit:

RX50-BA diskette drive
17-00867-01 34-pin RX50 cable to signal distribution
board

The RX50 (Figure 5-8) is a random-access, dual-diskette storage device that uses
two single-sided 13.3-cm (5.25-inch) RX50K diskettes. It has a total formatted
capacity of 818 Kbytes (409 per diskette). The RX50 has two access doors and
slots for diskette insertion. A light next to each diskette slot indicates when the
system is reading or writing to the diskette in that slot.

5-24

Mass Storage and Backup Options

A ribbon cable connects the RX50 to the signal distribution panel. Another cable
connects the RX50 to the power supply.

NOTE

Only one RX50 drive can be used with one RQDX controller
module.

Figure 5-8

RX50 Diskette Drive

5-25

Mass Storage and Backup Options

5.7

RLO2 DISK SUBSYSTEM

BA23-A enclosure

Factory installed:

RLV22-AP

Field upgrade:

RL02-AK disk drive

Module number:

(controller)

CK-RLV1A-KA cabinet kit

M8061

The cabinet kit contains the RLV12 controller module, a type A filter connector,
and a cable to connect it to the module.

The RLO02 disk drive is a rackmountable, removable-media, mass storage device.
Removable disks placed into the RLO2 disk drive can store 10.4 Mbytes of formatted data each.

5-26

Mass Storage and Backup Options

The RLO2 disk drive subsystem (Figure 5-9) consists of the disk drive and a
cabinet kit.

-e
Figure 5-9

RLO02 Disk Drive Subsystem

5-27

Mass Storage and Backup Options

The RLV12 controller (Figure 5-10) is a quad-height module that transfers data

between the Q22-Bus and the RL02 using DMA.

]

—
M1

+5V

M12 - A3
M13 - A4

- A5
M14

M15 - A6

T r

V16
V17

M10 M9
V7
VB

A7
A8

M18 A9

M19 A10 | ¢
Wi

M7
V5

M6
V4

A11

M5
V3

M4
V2

M3
VEC

oF
« o[Tofe]s

£93

M21A12JM20

M8
V6

- GND
M22

F
{1

[
Figure 5-10

5-28

RLV12 Module Layout

Mass Storage and Backup Options

The CSR address and interrupt vector are fixed. Tables 5-9 and 5-10 list the
factory settings.

RLV12 CSR Address

Table 5-9

Factory
Setting

Al12 A11 A10 A9 A8 A7 A6 A5 A4 A3 —
M21M20M19M18M17M16M15M14M13M12 —
1

17774400

Add Bits
Jumpers

1 = jumper connected to ground (pin M22)
0 = no connection

RI.V12 Interrupt Vector

Table 5-10

Factory
Setting

V8 V7
M10 M9

V6
M8

V5
M7

V4
M6

V3
M5

V2 — Vector Bits
M4 — Jumpers

160

1 = jumper connected to pin M3
0 = no connection

For further information, refer to the RLO1/RLO2 Disk Subsystem User’s Guide
(EK-RL012-UG-002).

5-29

Mass Storage and Backup Options

5.8

TQK25-EP TAPE DRIVE SUBSYSTEM

The TQK25 is a streaming tape drive that uses magnetic tape cartridges for
backup data storage. The TQK25 is a standalone unit that can be placed on top of
the system enclosure.

The TQK25-EP tape drive subsystem (Figure 5-11) consists of two major
components:

The TK25 drive

e The LSI-11 CPU cabinet kit (TQK25-CP)

ADAPTER

BA23

MODULE

INTERFACE

CABLE

Figure 5-11

5-30

TK25 Tape Drive Subsystem

Mass Storage and Backup Options

The TK25 drive contains the tape mechanism and the supporting electronics. The
[.SI-11 CPU cabinet kit contains the following:
Installation guide

M7605 adapter module
Ribbon cable (internal)
External cable

Type A filter connector

The M7605 adapter module (Figure 5-12) provides the interface between the tape
drive and the Q22-Bus.

J{}}\

LED

ADAPTER ADDRESS/D
SWITCH {SW2)
VECTOR

SWITCHES (SW1)

Figure 5-12

M7605 Module Layout

]

5-31

Mass Storage and Backup Options

The CSR address and interrupt vector for the M7605 adapter module are both

fixed and are set using DIP switches SW1 and SW2 (Figure 5-12). Tables 5-11 and
5-12 list the settings.

M7605 CSR Address

Table 5-11
Factory

SW2

Setting

17772520

Table 5-12

V8
Factory

— Switch

M7605 Interrupt Vector

SWI1

Setting

224

— Switches

0 = switch on
1 = switch off

For further information, refer to the following documents:

TK Tape Drive Subsystem User Guide (EK-0TK25-UG)

TK25 Tape Drive Customer Installation Guide (EK-T25TD-IN)

TQK25 Q-Bus CPU Kt Installation Guide (EK-T25QA-IN)

5-32

Mass Storage and Backup Options

5.9

TQK50-KA TAPE DRIVE SUBSYSTEM

BA23-A enclosure

Factory installed:

Field upgrade:

TK50-AA (tape drive with cartridge)

TQK50-AA controller module and 76.2-cm (30-inch)
signal cable and BA23-A specific access door
Same as factory installed option

BA123-A enclosure
Factory installed:

TK50-AA (tape drive with cartridge)

TQK50-BA controller module and 76.2-cm (30-inch)
signal cable

Field upgrade:

Same as factory installed option

NOTE

Both parts must be ordered.
BA23-A enclosure
TK50 Subsystem:

TK50-DA, -RA (120 V) or TK50-DB, -RB (240 V)
TQK50-AB controller module and 35.56-cm (14-inch)
cable with I/O insert panel

BA123-A enclosure
TK50 Subsystem:

TK50-DA, -RA (120 V) or TK50-DB, -RB (240 V)
TQK50-BB controller module and 53.34-cm (21-inch)
cable with I/O insert panel

Refer to Section 5.9.6 for additional cabinet kit information.

5-33

Mass Storage and Backup Options

The TQK50 (Figure 5-13) is a streaming tape drive subsystem that provides 100

Mbytes of backup data storage. The media is magnetic tape cartridges.

ADAPTER
MODULE

BA23

INTERFACE

CABLE

Figure 5-13

TQK50 Tape Drive Subsystem

The TK50 drive contains the tape mechanism with supporting electronics.

5-34

Mass Storage and Backup Options

5.9.1

TQK50 (M7546) Tape Controller

The TQK50 controller provides the interface for a TK50 tape drive to the Q22Bus. This intelligent controller has on-board microprocessors. Data transfers using
DMA. Programs in the host system communicate with the controller and tape drive
using MSCP.

A TQK50 can control one TK50 tape drive. Any additional TK50 tape drives
installed in the system require additional TQKS50 controllers.
Your systems owner’s manual contains TK50 operating instructions.

Figure 5-14 shows the jumpers, switches, and LEDs for the TQKS50 controller. The
CSR address for this module is 17774500. The interrupt vector is set to 260 and
is under program control.

The starting address of any additional TQK50 modules installed in your system is a
floating address of 17760nnn and is set using the jumpers. The floating address of
the M7546 module starts at 17760404 and increments by 4; for example,
17760404, 17760410, 177604 14.

The interrupt vector of any additional TQK50 module installed in the system floats.
Refer to Appendix A for additional information. Table 5-13 shows the factory configuration of the jumpers.

Table 5-13

M7546 Fixed CSR Address

Module
Number

Factory
Address

First

17774500

A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 — Add. Bits
(Jumpers¥)
1

1
1

0o
0

0
0

0
1

0
0

0
1

1
1

(factory)

Possible addresses for second controller:

Second

17760404
17760444

0
0

o
o

o0
o0

1 = jumper installed

0 = jumper removed

* The Jumper nearest the module fingers 1s A2

5-35

Mass Storage and Backup Options

REV

SWITCH BITS

00000000

34567
BER
12
NUM

:
2

04]

LEVEL

10000000
01000000

JUMPER PACK
(FACTORY SETTING)

00100000
10100000

CSR ADDRESS

11000000

4
5

. e

0= SWITCH OPEN

—

I = SWITCH CLOSED

| — OFF
2 _ OFF

3 _ OFF
4 — OFF

5 _ OFF
6 — OFF

7 — OFF
orr

[ UNIT NUM
| (FACTORY SETTING)

Figure 5-14
5.9.2

TQK50 (M7546 Jumpers And Switches

Unit Number DIP Switch

The unit number DIP switch must be set to correspond to the jumper setting.
Table 5-14 shows the unit number switch pack settings and the unit number name.
Table 5-14

Unit Number Switch Pack Settings

Jumpers Set

Unit Number

Unit

for

Switch Pack Bits

Number

Address

Name

774500

MUO (first TK50)

760nnn

MU1 (second TK50)

760nnn

MU2 (third TK50)

760nnn

1.0

MU3 (fourth TK50)

0 = switch open
1 = switch closed

5-36

Mass Storage and Backup Options

5.9.3

Revision Level DIP Switch

The revision level DIP switch is factory set. Make sure the revision level DIP
switch matches the revision level of the module. The revision level is stamped on
the back of the module. Table 5-15 shows the switch setting.

Table 5-15

Revision Level Switch Pack

Revision
Level Number

Switch Bits
1 2 3 4

0
1
2
3
4
5

O
1
O
1
O
1

0
1

0
0

O
O

1.0
01
01

0
0
0

0
0
O

0 = switch open

1 = switch closed

5.9.4

TQKS50 LEDs

Two LEDs, located on the front of the module, indicate module status. The level 1
(left) LED indicates the status of the module. This LED blinks on (red) and then
off when the system is turned on and the module is working properly. The TMSCP
INIT (right) LED indicates the status of the TK50 tape drive. This LED blinks on
(red) and then off when the TK50 tape drive is installed and working properly.
5.9.5

TK50 LEDs

The TK50 tape drive load/unload switch contains an internal red LED. There 1s a
green LED to the left of the load/unload switch. The red light indicates handle and
fault conditions. The green light indicates tape and power conditions.
Under normal operating conditions, the red LED indicates the following states:
e Red LED on always means that the handle may not be raised.
— Lights for two seconds during power-up self test.
— Remains on during operation of a tape.

— Remains on during unloading of a tape.

5-37

Mass Storage and Backup Options

e Red LED off means that it is all right to lift the handle and insert or remove a
tape cartridge.

e Red LED blinking means the tape is loading or rewinding.

— The handle can be raised slowly during the loading of a tape (10 to 15
seconds).

— The handle can be raised slowly during the rewinding of a tape.

e Fast flashing always means there is a fault condition. The handle can not be
raised.

— Press and release the load/unload button four times.

— If the problem persists, there is a hardware fault. Before any testing of the
tape drive, stop the operation of the tape drive, remove the tape drive and
manual rewind, unload and remove the tape.

Under normal operating conditions the green LED indicates the following states:
e

Green LED on indicates one of the following:

— Power is present. It is all right to lift the cartridge release handle (red LED
off).

— Tape is fully loaded (red LED on).

Green LED blinking means the tape is in motion.
— Slowly during read/write executions (red LED on).
— Slowly during rewinding of a tape (red LED blinking).

— Irregularly during calibration of a new tape (red LED off).

5-38

Mass Storage and Backup Options

5.9.6

Additional TQK50 Cabinet Kits

Table 5-16 shows the specific enclosure and the TQK50 variations that include the

M7546 Q-Bus controller module and cable. The controller accommodates the Tape
Mass Storage Control Protocol (TMSCP) on the Q-Bus. One controller handles one
TK50 tape drive.

Table 5-16
Part Number

TQK50-AA*
TQK50-ABT

TQK50-BA*

TQK50 Part Number and Description
Description

Controller, 30-inch cable and BA23 specific access
door. Used with a BA23 enclosure.

Controller and 14-inch cable with I/O panel insert.

Used with a BA23 enclosure.

Controller and 30-inch cable. Used with a BA123

enclosure.

TQK50-BBT
TQK50-CBt
TQK50-PBT
TQK50-RB*T

Controller and 21-inch cable with I/O panel nsert.

Used with a BA123 enclosure.

Controller and 36-inch cable with I/O panel insert.

Used in cabinet mount BA23 with H3490 I/O panel.
Controller and 30-inch cable with I/O panel insert.
Used in PDP-11/23-B (PLUS) with H349 [/O panel.
Controller and 120-inch cable with bracket to mount
I/O panel insert on cabinet rails. Used in non-FCC
compliant Q-Bus enclosures with no I/O panel. For field
upgrade only.

* Supports a TK50 tape drive installed in the enclosure.

¥ Supports an external TK50 tape drive installed with the enclosure.

5-39

6.1

INTRODUCTION

This chapter describes the communication and Input/Output (I/O) options currently

supported by the BA23-A and BA123-A enclosures.

Each section describes an option and includes configuration set-ups and a description of the cabinet kit required to install the module. Detailed documentation for
each device is also listed.
NOTE

Appendix A lists the current and bus loads for these options.
Refer to Appendix H for external loopback connector
information.

6.1.1

Ordering Options

Option order numbers differ depending on whether an option is to be installed at
the factory, or by a service representative as an upgrade after delivery.

A factory-installed system option includes a base module, internal cabling, and I/O
filter connectors. For example:

Factory installed:

DRV11-BP

To upgrade a system, it is necessary to order a base module and the appropriate
cabinet kit. For example:

Field upgrade:

DRV11-B Base module

CK-DRV1B-KB Cabinet kit

0-1

Q-Bus Communications and |/O Options

6.1.2

Module Configuration

Each module in a system has a Control Status Register (CSR) address (sometimes
called base or device address) and an interrupt vector, both of which must be set
when you install the module. The CSR address and interrupt vector are either fixed
or floating.

A fixed address (or vector) is an address location reserved in memory for the
address or vector of that particular module. Modules with fixed addresses and
vectors are shipped with the correct configuration for use as the first module of
that type. If you use two modules of the same type, the factory setting for the
second module must be changed.

A floating address or vector is assigned a location within an octal range. The exact
address or vector within the range depends on the other modules in the system.
The ranges are as follows:

Floating CSR address: (1776)0010-(1776)3776

Floating interrupt vector: (00000)300-(00000)777

Appendix A provides guidelines for determining variable starting address and interrupt vector settings.

The address and vector settings are usually configured by means of switches or

jumpers on the module. For example, the 22-bit setting for a starting address of
17761540 1s as follows:
21

111

6-2

1514

1312

111110

1110

0011011

00000

Q-Bus Communications and I/O Options

It is not necessary to change bits 21-13. It is only necessary to change bits Al12A2 to set the CSR address within a typical range. A typical switch setting shows
the following switches:

Switch

Setting

—

A12 Al11 A10
0

A6
1

A5
1

A4
0

— Add Bit
A3
0

* If A12 is set to a 1, this would be a 7.

Similarly an interrupt vector of 320 is typically configured using only the following
bits:

Switch

—
Setting

V8 V7 V6 V5 V4 V3 — Vector Bits
0

NOTE

The switch layout for different modules varies. The line below
the switch setting for each module shows the octal boundaries.

6-3

Q-Bus Communications and 1/O Options

6.2

DEQNA ETHERNET INTERFACE

Factory installed:

DEQNA-KP

Module number:

M7504 (three module LEDs)

Field upgrade:

DEQNA-M Base module
CK-DEQNA-KA BA123-A Cabinet kit

CK-DEQNA-KB BA23-A Cabinet kit
The cabinet kit includes a type A filter connector and a cable that connects it to
the module.

The DEQNA is a dual-height module used to connect a Q-Bus system to a Local
Area Network (LAN) based on Ethernet. The Ethernet is a communications system
that allows data exchange between computers within a moderate distance (2.8 km /
1.74 miles). The DEQNA can transmit data at a rate of 1.2 Mbytes per second

through coaxial cable.

The module should be the highest priority Direct Memory Access (DMA) device on

the Q22-Bus - that is, the DMA device nearest to the CPU. For high Ethernet
traffic, an additional DEQNA may be installed.
Configure the module by using the three jumpers, W1 through W3 (Figure 6-1).

Figure 6-1

o-4

DEQNA Ethernet Module (M7504) Layout

Q-Bus Communications and I/O Options

Jumper 1 (W1) determines the CSR address assignment. Table 6-1 shows the
DEQNA CSR addresses.

Table 6-1

DEQNA Ethernet CSR Addresses

Module No.

CSR Address

1
2

17774440
17774460

If you install two DEQNAs, move jumper W1 of the second DEQNA onto the left
and center pins. These addresses are fixed.

The interrupt vector is written into a read/write register by software. No hardware
configuration is required. Table 6-2 shows the DEQNA interrupt vectors.

Table 6-2

DEQNA Ethernet Interrupt Vectors

Module No.

Interrupt Vector

1
2

120
floating

Jumpers 2 and 3 are set at the factory and do not need to be changed.

Jumper W2 is normally removed. When removed it provides fair access to all DMA
devices using the Q22-Bus by causing the DEQNA to wait 5 usecs before rerequesting the bus. Jumper W3 1s normally installed, it disables a sanity timer at
initialization.

6-5

Q-Bus Communications and |/O Options

Figure 6-2 shows the internal cabling for the DEQNA module.

Figure 6-2

DEQNA Ethernet Internal Cabling

For further information, refer to the DEQNA User’s Guide (EK-DEQNA-UG-001).

6-6

Q-Bus Communications and /O Options

6.3

DHV11 ASYNCHRONOUS MULTIPLEXER

Factory installed:

DHV11-AP

Module number:

M3104 (one module LED)

Field upgrade:

DHV11-M Base module
CK-DHV11-AA BA123-A Cabinet kit
CK-DHV11-AB BA23-A Cabinet kit

The cabinet kit includes two type B filter connectors and two cables that connect

them to the module.

The DHV11 (Figure 6-3) is an asynchronous multiplexer that provides support for
up to eight serial lines for data communications. It 1s a quad-height module with the
following features:

e [ull modem control
e

DMA or silo output
Silo input buffering
Split speed

The DHV11 is compatible with the following modems:
e Digital modems: DF01, DF02, and DFO03
e Bell modems: 103, 113, 203C, 202D, and 212

o-7

Q-Bus Communications and 1/O Options

LOW CHANNELS (0-3)

BERG CONNECTOR
I

HIGH CHANNELS (4-7)

DIAGNOSTIC LED

BERG CONNECTOR

[

ADDRESS

ADDRESS AND

SELECT

VECTOR SELECT

BACKPLANE CONNECTORS

Figure 6-3

6-8

DHV11 Module (M3104) Layout

Q-Bus Communications and 1/O Options

Set the CSR address and interrupt vector by using the two Dual In-line Package
(DIP) switches, E58 and E43 (Figure 6-3). The CSR address and interrupt vector
are floating. Tables 6-3 and 6-4 show the two settings.

DHV11 CSR Address

Table 6-3

CSR

Address

A12 Al11 A10 A9
E58

17760440
17760460

O
0

0
0

1
1

0
0

1
1

A4
E43

—

Add. Bits

—

Switches

0
1

1 = switch on

0 = switch off

DHV11 Interrupt Vector

Table 6-4

Vector

Setting
300
310

1
1

0
0

0
1

0
0

E43-3 -4

-5

-6

-7

-8

—

Switch

1 = switch closed

0 = switch open

The actual address and vector of the DHV11 depend on what other modules you
install in the system. Appendix A provides guidelines for setting the address and
vector.

6-9

Q-Bus Communications and 1/O Options

Iw””““—l TR —

)

MIM

Figure 6-4 shows the DHV11 internal cabling setup.

Figure 6-4

DHV11 Internal Cabling

For further information, refer to the DHVI11 Technical Manual (EK-DHV11-TM001).

6-10

Q-Bus Communications and 1/O Options

6.4

DLVE1 ASYNCHRONOUS LINE INTERFACE

Factory installed:

DLVE1-DP

Module number:

M&017

Field upgrade:

DLVE1-M Base module
CK-DLVE1-DB BA23-A Cabinet kit

The cabinet kit includes a type A filter connector and a cable that connects the
module to the connector. The external BCO5C-X (where X = length in feet) modem
cable must be ordered separately.

The DLVE1 (formerly DLV11-E) is a dual-height module that connects a Q-Bus to
a serial communications line. The DLVE1 (Figure 6-5) offers the following

features:

Full modem control — Bell 103, 113, 202C, 202D, and 212 modem compatible.
Jumper or program-selectable baud rates.
Split transmit and receive baud rates.

Provisions for user-supplied external clock inputs for baud rate control.

6-11

Q-Bus Communications and |/O Options

Py '

—B

[

)

]
p

RS
R1

—FR

TO
T1

T2
T3

(‘_‘_‘

FBE

—FD

FEEEEERREN"

[cecvocesosse

000.!

CT
A4

..........

PB
A6

é“o

A8
000000000

A9
A12

V3
V6

0000000000

OOOOOOOOO

_
Figure 6-5

DLVE1 (M8017) Module Layout

Configure the module using the jumpers shown in Figure 6-5. The CSR addresses
for two DLVE1 modules are fixed. Table 6-5 lists the settings. The interrupt
vector 1s floating. Table 6-6 shows the factory setting of the interrupt vector.

Table 6-5
Module

DLVE1 Fixed CSR Addresses

Starting

Al12 A11 A10 A9 A8 A7 A6 A5 A4 A3

Number Address

— Add. Bits
(Jumpers)

17775610

(Factory®

17776500

(1stoption)

17776510

(2nd option)

= inserted

0 = removed

The factory setting is for use with a modem.

6-12

Q-Bus Communications and /O Options

DLVE1 Interrupt Vector

Table 6-6

Factory
Setting

300

Vector Bits
(Jumpers)

—

1 = inserted

0 = removed

NOTE

The actual setting of the interrupt vector of the DLVE1 depends
on the other modules in the system. Appendix A provides guidelines for determining the interrupt vector.

Table 6-7 lists the factory setting of the other jumpers on the module.
DLVE1l Jumper Factory Setting

Table 6-7

Jumper Settings

RO
Rl
R2
R3
To
Tl
T2
T3
S1
I

1
R
1
1
1
R
R
R
R

(Notel)

BG
P
E
1
2

(Note3)

PB
C
C1
S
S1

H
B
B
FD

1
R
R
R
R

R
I
1
R
R

(Note2)
(Note 4)
(Note 4)
(Note5)
(Note 5)

FB
EF
MT
M
M1

R
R
R
R
1

R
R
R
R
R

= inserted

R = removed

Notes

Sets the receiver and transmitter baud rates to 110 baud (common speed). See
Table 6-8 for other settings.
Programmable baud rate is disabled.

Sets transmitter baud rate to 9,600 if split speed is used.
Common speed is enabled.
Split speed is disabled.

6-13

Q-Bus Communications and |/O Options

Table 6-8 lists the jumper settings required for other baud rates. Set transmit and
receive jumpers separately when split speed is enabled.

& -

R1
]

Baud
Rate
50

[—

R3
|

Receive Jumpers —
Transmit Jumpers —

g 7

DILVE1l Baud Rate Selection
o8

Table 6-8

110

134.5

6-14

e
R

R
R

300
600
1,200
1,800

2,000
2,400
4,800

7,200
—

3,600
T

250

R B R

150

9,600

Q-Bus Communications and I/O Options

Figure 6-6 shows the internal cabling.
/O DISTRIBUTION
PANEL

A
M8017

ASYNCHRONOUS LINE

INTERFACE

o(@TTTTTTe)

T .

0 o

B
®

e 1
|

Figure 6-6

)

DLVEI Internal Cabling

For further information, refer to the DLVI1I-E and DLVII-F Asynchronous Line
Interface User’s Manual (EK-DLV1 1-OP). This manual describes the same module,
but uses the old name.

6-15

Q-Bus Communications and |/O Options

6.5

DLVJ1 ASYNCHRONOUS INTERFACE

Factory installed:

DLV]J1-LP

Module number:

M8043

Field upgrade:

DLV]J1-M Base module
CK-DLV11-LA BA123-A Cabinet kit
CK-DLV11-LB BA23-A Cabinet kit

The cabinet kit contains a type B filter connector and a cable that connects it to
the module.

The DLVJ1 (formerly DLV11-J) is a dual-height module that connects a Q-Bus to
up to four asynchronous serial lines for data communications. The serial lines must
conform to EIA and CCITT standards. The DLV]J1 transmits and receives data
from a peripheral device over EIA ‘‘data leads only” lines that do not use control
lines. Data is moved under program control along the four independent serial lines.
The factory configuration sets CH-3 as the console Serial Line Unit (SLU).
Configure the DLV]J1 module by using the wire-wrap pins shown in Figure 6-7.
The CSR addresses for two DLV]J1 modules are fixed. Table 6-9 lists the factory

setting for the CSR addresses of the fist channel (CH-0). The CSR address of the
other channels 1s 10 (octal) greater. For example, if CH-0 is set at 17776500, the
CH-1 CSR address is 17776510 and CH-2 is 17776520. However, when CH-3 is
configured as the console device, its address is fixed at 17777560, regardless of

the setting of the other channels.

6-16

Q-Bus Communications and 1/O Options

DLVJ1 CSR Address

Table 6-9
Module

Starting

Number Address

17776500

17776540

Al12 A11 A10 A9

1-x

O0-x

1-x

O0x

Add. Bits

—

x-h

0-x

(factoryTM)

1=x

= jumper removed = 0
R
x-h = jumper inserted between pins x and h
0-x =0
1-x =1

* C1 and C2 are wire-wrapped on pins 1 and x. This sets the CH-3 CSR address to
17777650. To configure CH-3 as a non-console device, wire-wrap C1 and C2 on pins 0
‘

and x.

The interrupt vector is floating. The factory configuration is shown in Table 6-10.
DLVJ1 Interrupt Vector

Table 6-10

Vector Bits

Settings

—

300

—

x-h

—

(factoryTM®)

340

x-h

1-x

x-h = jumper inserted between pins x and h =1
0-x = jumper inserted between 0 and x = 0
1-x = jumper inserted between 1 and x = 1
* CH-3 interrupt vector is 60 (receive) and 64 (transmit).
NOTE

The actual interrupt vector depends on the other modules in the
system. Appendix A provides guidelines for determining the
interrupt vector.

o-17

Q-Bus Communications and 1/O Options

@INe8 ©

@ ® © EN®

-¢XE I@eN tn@Ne

WAX=L e®

JHAYX= /Y

R22

Y WK VN
®

®@ee0

z 0123

0000

8ouw

€HO

|VCO=9
=9
6@

90 -9

@. ®@ e60 CHO ®Q.

Figure 6-7

6-18

0 =9
&1 &8
O-8
&10 X

&OQ\N@9& ®

£NNe—®6| && XZ o®

DLV]J1 Module (M8043) Layout

®|=09mAawm>

Q-Bus Communications and /O Options

Figure 6-8

i
I7

Somm]

Figure 6-8 shows the internal cabling.

DLV]1 Internal Cabling

For further information, refer to the DLV11-] User’s Guide (EK-DLVIJ-UG).

0-19

Q-Bus Communications and |/O Options

6.6

DMVi1 SYNCHRONOUS CONTROLLER

Factory installed:

DMV11-M

Module numbers:

M8053 and M8064

Field upgrade:

DMV11-M Base module
CK-DMV11-XA BA123-A Cabinet kit. See Table 6-11
for possible designations of X.
CK-DMV11-XB BA23-A Cabinet kit. See Table 6-11
for possible designations of X.

The DMV11 is a quad-height module (M8064 or M8053) that supports:
e

Full-duplex or half-duplex operations

DMA

Point-to-point communications

Multipoint communications
It is available in four system options, each of which has a different interface
capability. The option you choose depends on the interface requirements of your
system.

6-20

Q-Bus Communications and I/O Options

Table 6-11 lists the four system options and their corresponding upgrade components. Table 6-12 lists the interface for each system option, and the appropriate
external cable.

Table 6-11

DMV11 Versions
I/0

System
Option

Model (Base Module +
BA123
Number Cabinet Kit)

DMV11-AP
DMV11-BP
DMV11-CP
DMV11-FP

M8053
M8053
M8064
M8053

Table 6-12

Panel

Upgrade

DMV11-M + CK-DMV11-AB
DMV11-M + CK-DMV11-BA
DMV11-M + CK-DMV11-CA
DMV11i-M + CK-DMV11-FA

BA23 Connector
-AB
-BB
-CB
-FB

J2 (of 2)
J1 (of 2)
J11 (of 2)
J1 (of 2)

Insert
Type
B
A
B
B

DMV11 Interfaces

External

System
Option

Interface

Cable

DMV11-AP
DMV11-BP
DMV11-CP

RS-232-C/CCITT V.28
CCITT V.35/DDS
Integral modem

BC22E or BC22F
BC17E*
BC55S or BC55T

DMV11-FP

RS-423-A/CCITT V.24

BC55D

* (Cable included in the -BA, -BB cabinet kit.

0-21

Q-Bus Communications and 1/O Options

Configure the CSR address and interrupt vector of the DMV11 by using the

switches shown in Figure 6-9. The CSR address and interrupt vector are both

floating. Tables 6-13 and 6-14 show the factory setting.
Table 6-13

DMV11 CSR Address

A12A11 A10 A9 A8 A7 A6 A5 A4 A3

—Add. Bits

— Switches

E54 (M8053)
E59 (M8064)

E53 (M8053)
E58 (M8064)

CSR

Address

177760340
177760360

0
0

O
O

0
O

1
1

0
1

0
0

1 = on = closed
= off = open

Table 6-14

DMV11 Interrupt Vector

Vo6

— Vector Bits

— Switches

1
1

0
0

E54

(M8053)

E59

(M8064)

Vector

300
310

0
0

Interrupt

= on = closed

0 = off = open

NOTE

The actual setting depends on the other modules in the system.
Appendix A provides guidelines for setting the CSR address and
interrupt vector.

6-22

Q-Bus Communications and /O Options

(][5

M8064

E59

EG8

~r=— b

M8053

E54
ES3

| EN

Figure 6-9 DMV1l1 Module (M8064 and M8053) Layouts

6-23

Q-Bus Communications and 1/O Options

Another DIP switch on the DMV11 controls selectable features. Table 6-14A
shows the function of this switch, and a common setting.

Table 6-14A

DMV11 Switch Selectable Settings

E107 (M8064)
E101 (M8053)

10*

Offt

Off

On = zero = function disabled

* Unused on M8064.

Switch 10 should be off for EIA interface, on for V.35. Switch 9 must be off for
integral modem (M8064) or when running above 19.2 K baud. Switches 8, 7, and 6
set the mode of operation when switch 1 is off. Switch 5 off enables remote load
detect. Switch 4 off enables power on boot. Switch 3 off enables auto answer.
Switch 2 determines unit number for booting (on for first DMV11, off for second

DMV11). Switch 1 off enables switches 8, 7, and 6 to determine mode of operation. Switch 1 on means mode of operation determined by software.
A DIP switch (E119 on M8064, E113 on M8053) determines the Digital Data

Communications Message Protocol (DDCMP) address register tributary/password.
This must be set to a unique site address. Further information is contained in the

DMV11 Synchronous Controller’s User’s Guide (EK-DMV11-UG).

6-24

Q-Bus Communications and I/O Options

Figure 6-10 shows the internal cabling set up for the M8064 and M8053 modules.
For jumper settings of various modems and additional information, refer to the
DMVI11 Synchronous Controller Technical Manual (EK-DMV11-TM-001).

TM
N

ad)!

Figure 6-10

DMV11 Internal Cabling
6-25

Q-Bus Communications and 1/O Options

6.7

DPVi1 SYNCHRONOUS INTERFACE

Factory installed:

DPV11-AP

Module number:

M&8020

Field upgrade:

DPV11-M Base module
CK-DPV11-AA BA123-A Cabinet kit
CK-DPV11-AB BA23-A Cabinet kit

The cabinet kit includes a type A filter connector and a cable that connects it to
the module.

The DPV11 is a dual-height module that connects the Q-Bus to a modem using a
synchronous serial-line. The serial-line conforms to the following EIA standards:
e

RS-232-C

RS-423-A

RS-422-A

EIA compatibility is provided for use in local communications only (timing and data
leads only). The DPV11 is intended for character-oriented protocols, such as
DDCMP, or communication protocols that are bit-oriented, such as Synchronous

Data-Link Control (SDLC).

6-20

Q-Bus Communications and I/O Options

Configure the CSR address and interrupt vector of the DPV11 using the jumpers
shown in Figure 6-11.

228
21

[

Ao 11

O 10
89
3

€6

121314151617

26
24

VECTOR
200

000000

42 OO0 43

44 OlO 45

SHIPPED

40
OO 41
O 39
380

360037
SHIPPED
33
2
ADDRESS <

C__

00 35
34

0|0

160010

30 O|0 31
[

Figure 6-11

w29

DPV11 Module (M8020) Layout

6-27

Q-Bus Communications and /O Options

The CSR address and interrupt vector are both floating. Tables 6-15 and 6-16
show the factory setting.

Table 6-15

Settings

DPV11 CSR Address

A12 A1l A10 A9

A3 — Add. Bits

W31 W30 W36 W33 W32 W39 W38 W37 W34 W35 — Pin

17760010

17760270

17760310

(factory)

1 = jumper inserted between pin Wxx and pin 29 (ground)
0 = jumper removed

Table 6-16

DPV11 Interrupt Vector

Interrupt

— Vector Bits

Vector

W34

W42

W41

W40

W44

W45

~ Pin

300

310

1 = jumper inserted between pin Wxx and pin 46 (ground)
0 = jumper removed = 0

NOTE
The actual settings depend on the other modules in the system.
Appendix A provides guidelines for setting the CSR address and
interrupt vector.

6-28

Q-Bus Communications and I/O Options

Figure 6-12 shows the internal cabling.

Figure 6-12

DPV11 Internal Cabling

For further information, refer to the DPVI1I1 Synchronous Interface User’s Manual
(EK-DPV11-UG).

6-29

Q-Bus Communications and I/O Options

6.8

DRV1i1 PARALLEL-LINE INTERFACE

Factory installed:

DRV11-LP

Module number:

M7941

Field upgrade:

DRV11 Base module

CK-DRV1B-KB BA23-A Cabinet kit

The cabinet kit includes two type A filter connectors and two cables that attach

them to the module.

The DRV11 (Figure 6-13) is a dual-height module that provides 16 I/O lines,

corresponding to the 16 data lines of the Q22-Bus.

VECTOR JUMPERS
W

TM~

(“"

(—

ADDRESS JUMPERS
O —

223

ERR
NRRRR

TMM <t WO W~

R R

Figure 6-13

6-30

GRS

DRV11 Module (M7941) Layout

S R (R &

Q-Bus Communications and I/O Options

The CSR addresses of two DRV11 modules are fixed and are set using jumpers
A12 to A3 (Figure 6-13). Table 6-17 lists the factory jumper configuration.
DRV11 CSR Address

Table 6-17

Module Starting
Number Address
17767770
1

17767760

Al12 A11 A10 A9 A8 A7 A6 A5 A4 A3 — Add. Bits
(Jumpers)
1 1 1 1 1 1 1 «— factory
1
1
O
1

0 = inserted = 0
1 = removed =1

The interrupt vector is floating. Table 6-18 shows the factory configuration.
DRV11 Interrupt Vector

Table 6-18

Factory
Setting

300

— Vector Bits
(Jumpers)

0 = inserted = 0
1 = removed =1

NOTE

The actual setting depends on the other modules in the system.
Appendix A provides guidelines for setting the interrupt vector.

6-31

Q-Bus Communications and 1/O Options

Figure 6-14 shows the internal cabling layout.

(]
J1 o J2

}

1/0 DISTRIBUTION

A
M7941
PARALLEL
LINE UNIT

PANEL
vV

'-]‘:

_—ré‘—lé’]
J R

"fl_é;m ‘
““““““L
O

N
e e
)

Figure 6-14

DRV11 Internal Cabling

For further information, refer to the DRV11 User’s Manual (EK-ADV11-OP).

6-32

Q-Bus Communications and 1/O Options

6.9

DRV11-B DMA INTERFACE

Factory installed:

DRV11-BP

Module number:

M7950

Field upgrade:

DRV11-B Base module
CK-DRV1B-KB BAZ23-A Cabinet kit

The cabinet kit includes two type A filter connectors and two cables that connect
them to the module.

The DRV11-B is a quad-height module that supports DMA. This module makes it
possible to transfer data directly between system memory and an external I/O
device. The module is programmed by the CPU to move variable length blocks of
8- or 16-bit data words to or from specified locations in the system memory.
NOTE

The DRV11-B is an 18-bit device. It can only provide DMA to the
first 256 Kbytes of memory in a system.

The DRV11-B is not supported on MicroPDP-11/73 or MicroPDP-11/83 systems.

0-33

Q-Bus Communications and |/O Options

Configure the DRV11-B CRS address and interrupt vector using the DIP switches

S2 and S1, respectively (Figure 6-15).

S T

ADDRESS

D00do0od

0000000000

SWITCHES

VECTOR

SWITCHES

]

[
Figure 6-15

6-34

]

DRV11-B Module (M7950) Layout

Q-Bus Communications and I/O Options

The CSR addresses of two DRV11-B modules are fixed. Table 6-19 lists the
settings.

Table 6-19

DRV11-B CSR Address

A12 Al11 A10 A9 A8 A7 A6 A5 A4 A3
Module

Starting S2

772410

Number Address 1

772420

3
1

4
0O

— Add. Bits

10 — Switches
1

(factory)

= on = closed

0 = off = open

The interrupt vector for the first DRV11-B is fixed. If you install a second DRV11B, it has a floating vector. Appendix A provides guidelines for setting the floating

vector. Table 6-20 lists the interrupt vector settings.
Table 6-20

DRV11-B Interrupt Vector

— Vector Bits

— Switches

(Factory)

V8
Interrupt

124

floating

Module

| Number Vector

0 = open = off
1 = closed = on
S11}-must be open.

6-35

Q-Bus Communications and |/O Options

<= C_|

LSI-11 DMA

INTERFACE

]

= A

e )

T A

e
e

Or‘@“mw

A )

M7950

[
g

% C

/0 DISTRIBUTION
PANEL

r‘]3>
/

Figure 6-16 shows the internal cabling.

o)
.

4
Figure 6-16

DRV11-B Internal Cabling

For further information, refer to the DRVI1I1-B Interface User’s Manual (EK-

DRV1B-OP-001).

6-36

Q-Bus Communications and /O Options

6.10

DRV11-J HIGH-DENSITY, PARALLEL INTERFACE

Factory installed:

DRV11-JP

Module number:

M8049 (one module LED)

Field upgrade:

DRV11-] Base module

CK-DRV1]J-KA BA123-A Cabinet kit
CK-DRV1]J-KB BA23-A Cabinet kit

The cabinet kit contains two type A 50-pin connectors and two cables that connect
them to the module.

The DRV11-J (Figure 6-17) is a dual-height module that connects a Q-Bus to 64
I/O lines. These lines are organized as four 16-bit ports, A through D. Data line
direction is selectable under program control for each 16-bit port.

w l

PORT C AND D

PORT A AND B

DWH

g
i

ADDRESS SELECTION

Figure 6-17

DRV11-] Module (M8049) Layout

6-37

Q-Bus Communications and 1/O Options

The interrupt vector is set under program control, eliminating the need for jumperdefined vectors. The CSR address of the module is fixed and is set with jumpers
W1 through W9. Table 6-21 lists the factory configuration for the CSR address.
Table 6-21

DRV11-J CSR Address

A12 All A10 A9 A8 A7 A6 A5 A4

Module

Starting

1
2

17764160 0
17764140 0

Number Address W1

1 = installed

0 = removed

6-38

— Bus
Lines

W4 W5 W6 W7 W8 W9 — Jumper

1
1

0
0

o
o

0
0

o0
o0

1
1

1
O

Q-Bus Communications and [/O Options

Figure 6-18 shows the internal cabling layout for this module.

Figure 6-18

DRV11-] Internal Cabling

For further information, refer to the DRVI11-] Interface User’s Manual (EKDRV1]J-UG).

6-39

Q-Bus Communications and 1/O Options

6.11

DUVi1 SYNCHRONOUS SERIAL-LINE INTERFACE

Factory installed:

DUV11-AP

Module number:

M7951

Field upgrade:

DUV11-M Base module
CK-DUV11-AB BA23-A Cabinet kit

The cabinet kit includes a type A filter connector and a cable that connects it to
the module.

The DUV11 (Figure 6-19) is a quad-height module used to connect any Q-Bus CPU
to a Bell 201 synchronous modem or equivalent.
It has the following features:
e

Designed for applications using character-oriented protocols.

(Controls a modem for half- or full-duplex operation.

Transmits data at rates up to 9,600 baud per second.

Interfaces synchronous and asynchronous communications data.

OPTION
SWITCHES

)
ADDRESS AND

VECTOR SWITCHES

N
Figure 6-19

6-40

)
)

]

DUV11 Module (M7951) Layout

[

Q-Bus Communications and |/O Options

The CSR address and interrupt vector of the DUV11 are both floating, and are
configured using DIP switches E38 and E39 (Figure 6-19). Tables 6-22 and 6-23
list the factory settings.

Table 6-22

DUV11 CSR Address

Setting

A3
A12 A11 A10 A9 A8 A7 A6 A5 A4
E38
E39
2
1
8
7
6
5
4
3
2
1

17760010

Factory

— Add. Bits

— Switches

1 = switch on

0 = switch off

Table 6-23

DUV11 Interrupt Vector

V7
V8
Factory E39

Setting

440

— Vector Bits
— Switches

1 = switch on

0 = switch off

NOTE

The actual setting depends on the other modules in the system.
Appendix A provides guidelines for setting the CSR address and
interrupt vector.

6-41

Q-Bus Communications and 1/O Options

Figure 6-20 shows the internal cabling layout for the module.

1A
A

M7951

LSI SYNCHRONOQUS

v
A

INTERFACE BOARD

: A

1/0 DISTRIBUTION

PANEL

S
l“”—]c@

o (@

t v

)

—V

s B

Figure 6-20

DUV11 Internal Cabling

For further information, refer to the DUVI1 Synchronous Serial Line Interface
Technical Manual (EK-DUV11-TM-001).

6-42

Q-Bus Communications and /O Options

6.12

DZQ11 ASYNCHRONOUS MULTIPLEXER - (FOUR LINES)

Factory installed:

DZQ11-M

Model number:

M3106

Upgrade:

DZQ11-M Base module

CK-DZQ11-DA BA123-A Cabinet kit
CK-DZQ11-DB BA23-A Cabinet kit

The cabinet kit includes one type B filter connector and a cable that connects it to
the module.

The DZQ11 (Figure 6-21) is a dual-height module that connects the Q22-Bus to up
to four asynchronous serial lines. It includes the following features:
e Conforms to the RS-232-C and RS-423-A interface standards.

o Permits dial-up (auto-answer) operation with modems using full-duplex operations such as Bell models 103, 113, 212 or the equivalent.

VECTOR

SWITCH-PACK
[—_
T~a

ADDRESS

SWITCH-PACK

[

E28

o
Figure 6-21

DZQ11 (M3106) Module Layout

6-43

Q-Bus Communications and |/O Options

Configure the DZQ11 using the two DIP switches E28 and E13. The CSR address

and interrupt vector of the DZQ11 are both floating. Tables 6-24 and 6-25 show

the factory and common settings.

DZQ11 CSR Address

Table 6-24

A12 A1l A10 A9 A8 A7 A6 A5 A4 A3
CSR

E28

Address

17760010

17760100

3
0

— Add. Bits

— Switches

(factory)

= switch on

1 = switch off

— Vector Bits

— Switches

DZQ11 Interrupt Vector

Table 6-25

Vector

E13

Setting

300

310

(factory)

1 = switch on

0 = switch off

E13 switch 7 is not used. E13 switch 8 must be on and E13 switches 9 and 10
must be off for normal operation.

6-44

Q-Bus Communications and I/O Options

Figure 6-22 shows the internal cabling for the DZQ11.

Figure 6-22

DZQ11 (M3106) Internal Cabling

0-45

Q-Bus Communications and |/O Options

6.13

DZVi1 ASYNCHRONOUS MULTIPLEXER

Factory installed:

DZV11-DP

Model number:

M7957

DZV11-M Base module

Upgrade:

CK-DZV11-DA BA123-A Cabinet kit
CK-DZV11-DB BA23-A Cabinet kit

The cabinet kit includes one type B filter connector and a cable that connects it to
the module.

The DZV11 (Figure 6-23) is a quad-height module that connects a Q22-Bus to up

to four asynchronous serial-lines. It includes the following features:
e

Conforms to the RS-232 interface standard.

e Permits dial-up (auto-answer) operation with modems using full-duplex
operations.

]

S
W13

W14

A12

W10

|
Figure 6-23

6-46

—

LTI

nEEC -

W11

W15

W16

0000000000

00000000

ADDRESS SWITCHES

VECTOR

SWITCHES

[

DZV11 Module (M7957) Layout

Q-Bus Communications and I/O Options

Configure the DZV11 using 16 jumpers and 2 DIP switches. The CSR address and
interrupt vector of the DZV11 are both floating. Tables 6-26 and 6-27 list the
factory settings.

DZV11 CSR Address

Table 6-26

A12 A1l A10 A9 A8 A7 A6 A5 A4 A3
CSR

E30

17760100
17760110

O
O

0
0

O
O

Address

O
0

0
0

O
O

0
0

O
1

— Add. Bits

— Switches

1 = switch on

0 = switch off

Table 6-27

DZV11 Interrupt Vector

Setting 1

0
0

1
1

0
0

v8
Vector

EZ2

300
310

— Vector Bits

— Switches
0
0

0
1

1 = switch on

0 = switch off

NOTE

The actual settings depend on the other modules in the system.

Appendix A provides guidelines for setting floating CSR
addresses and interrupt vectors.

o-47

Q-Bus Communications and |/O Options

e
1

Figure 6-24

Figure 6-24 shows the internal cabling layout for the module.

DZV11 Internal Cabling

For further information, refer to the DZV11 Asynchronous Multiplexer Technical
Manual (EK-DZV11-TM).

6-48

Q-Bus Communications and 1/O Options

6.14

LPV11 INTERFACE MODULE

LPV11-AP (includes LP25 line printer)

Factory installed:

LPV11-BP

LPV11-EP (includes LP26 line printer)
LPV11-FP

Module Number:

(controller)

M&027

Field upgrade:

LPV11-A (base module for LP25)
LPV11-B

LPV11-E (base module for LP26)
LPV11-F

CK-LPV1A-KA

BA23-A cabinet kit, includes a type A

CK-LPV1A-KB

BA123-A cabinet kit, includes a type

filter connector and internal cable.

A filter connector and internal cable.

The LPV11 is a dual-height module that controls the flow of data between the
Q22-Bus and a line printer. It is configured using jumpers (Figure 6-25).
W1l

Je0V?2
=0 V3

V5 o

&0 v5

w13

AN v

V3
Va4

=o\V4

V6 o

=0 \/6

Vg ot

&0 \/8

5 W1

w14 7 gy
O

Fo\

S——

om0

S
o

hee

Ad
w4
J1
wa

o— [0

=0 Ad

A5 0 R

Te0 A

&~0 A7

O=A8-0
o— A9 -0

o-A10-0
o A110
o A120

NOTE:

o= WIRE WRAP PIN.

Figure 6- 25

LPV11 Module (M8027) Layout

6-49

Q-Bus Communications and I/O Options

The CSR address and interrupt are both fixed. Tables 6-28 and 6-29 list the

factory configuration. Figure 6-26 shows the internal cabling set-up.

Table 6-28

LPV11 CSR Address

A12 A11 A10 A9 A8 A7 A6 A5 A4
Factory

E38

Setting

17777514

— Add. Bits

— (Jumpers)

E39

0 = nstalled
= removed

Table 6-29

LPV11 Interrupt Vector

Factory

— Vector Bits

Setting

W14

W13

W12

W11

W10

— Jumper

200

[ = installed = 0
R = removed = 1

Table 6-30 lists the factory setting of the other jumpers on the module.

Table 6-30
Jumper

LPV11 Jumper Configuration
State

F-

R = removed
[

= installed

6-50

Q-Bus Communications and I/O Options

Figure 6-26

LPV11 Internal Cabling

6-51

7.1

INTRODUCTION

The BA23-A enclosure (Figure 7-1) supports MicroPDP-11 computer systems and
a wide variety of hardware options. The fan-cooled enclosure operates in an open
office environment and includes the following major components:
e Backplane

o BA23-A frame

e Power supply and fans
e Rear I/O distribution panel

e Front control panel

e Mass storage area

Chapter 2, KDJ11-B Systems, discusses the contents of typical MicroPDP-11/73
and MicroPDP-11/83 systems. Chapter 3, KDF11-B Systems, discusses the con-

tents of a typical MicroPDP-11/23 systems.

Figure 7-1

et32\)|

8-\
& %\

A Floor-standing BA23-A Enclosure

7-1

BAZ3-A Enclosure

7.2

BA23-A FRAME

The BA23-A frame houses the power supply and the backplane assembly. It also
provides space for two 13.3-cm (5.25-inch) mass storage devices (Figure 7 -2).

POWER SUPPLY

BACKPLANE

Figure 7-2

BAZ23-A Frame

The BA23-A frame mounts in a rack or in a floor-stand. The floor-stand model can
convert to desktop use. Table 7-1 shows the dimension and weight of the various

configurations.

7-2

BAZ23-A Enclosure

Table 7-1

BA23 Enclosure Specifications

Specification

Floor-stand

Desktop

Rackmount

Height

64.2 cm
(24.5 1n)

17.7 cm
(7 1n)

13.3 cm
(5.2 1n)

Width

25.4 cm

56.2 cm

48.25 cm

(10 in)

(22.13 1n)

(19 1n)

Depth

72.6 cm
(28.6 in)

72.6 cm
(28.6 1n)

64.3 cm
(25.3 1n)

Weight

31.75 Kg

29.5 Kg

7.2.1

(65 1bs)

(70 lbs)

24 Kg

(53 1bs)

BA23-A Bezels

A removable bezel covers the front of the BA23-A frame. The floor-stand and
desktop models also have a removable rear bezel (Figure 7-3).

i
.

Figure 7-3

BAZ23-A Removable Bezels

7-3

BA23-A Enclosure

7.2.2

Air Circulation

The BA23-A frame contains two fans:
e

One above the control panel

One above the power supply

These draw air from the bottom of the enclosure (Figure 7-4).

Figure 7-4

7-4

ills
i

AIHE

Air Flow

BA23-A Enclosure

7.3

FRONT CONTROL PANEL

The front control panel of the enclosure contains the system controls and indicators
(Figure 7-5). Table 7-2 describes their functions.

AC POWER
ON/OFF

Micro

BEVENT
ENABLE

SWITCH

PDP-11/73
DC OK

Run

Restart

Halt

O
RESTART
ENABLE

Fixed disk O

Write Protect

Figure 7-5

Table 7-2

Ready

BA23-A Front Control Panel

Front Control Panel Controls and Indicators

Control/

Position/

Indicator

Condition

Description

I1/0

1/Lit

Rocker switch with integral red indicator.

O/Unlit

System ac power is off.

Lit

Green LED. Lights when all dc voltages are

DC OK

Unlit

Lights red when system ac power is on.

present and within tolerance.

The Q22-Bus BDCOK (dc bus power is OK)
signal is negated.

7-5

BAZ23-A Enclosure

Table 7-2

Front Control Panel Controls and Indicators (Cont.)

Control/
Indicator

Position/
Condition

Run

Lit

Halt

Description

Green LED. Lights when the CPU is
executing in run mode.

Unlit

The CPU is in console mode.

Out/Unlit

Push-on/push-off button with integral red
LED. Normal position for running user
software.

In/Lit

Red LED. Stops normal software operation.
Puts the CPU in console mode and the
system accepts only console commands (see
Chapter 2, KDJ11-B Systems).
Momentary-contact pushbutton. When

Restart

pressed (and enabled), causes a power-

down/power-up sequence to be simulated, to
restart CPU operation. Press and release
the Halt button twice before restarting the
system.

Fixed Disk O

Write-Protect

Out/Unlit

Push-on/push-off button with integral yellow
LED. Normal operation. Enables disk read
and write operations.

In/Lit

Lights yellow. Data cannot be written to the
disk (data can be read from the disk).

Ready

Out/Lit

Push-on/push-off button with integral green
LED. Normal operation. Enables disk reads
and writes.

In/Lit

Prevents fixed-disk read and write
operations.

7-6

BA23-A Enclosure

7.3.1

Control Panel Printed Circuit Board

The control panel printed circuit (PC) board lies behind the molded plastic front
control panel. This board provides access to +5 V and +12 V test points and to a
Line Time Clock (LTC) switch.

The PC board also contains the system buttons, LEDs, and a 20-pin connector (J1)
for the backplane assembly cable. A bracket on the rear of the molded front panel
holds the system power on/off switch.
7.3.2

LTC DIP Switch Unit

The LTC Dual In-line Package (DIP) switch unit has two switches labeled 1 and 2
(Figure 7-6). Setting switch 1 to OFF enables the Q22-Bus BEVENT timing signal
and allows the LTC to function under software control. Switch 1 is referred to as
the BEVENT/Enable switch.

POWER ON/OFF SWITCH

Micro

SWITCH 1 \\\\j

SWITCH 2 — |

PDP-11/73

LTC SWITCH \

Run

DC OK

Halt

Restart

BOARD

ON PC

()
PC

20-PIN
CONNECTOR
BOARD

gl
Fixed Disk O

Write Protect

TEST

PO!NTSV§:::

Ready

O
12

WIDE FRONT PLASTIC COVER NOT SHOWN

Figure 7-6

Control Panel with PC Board

7-7

BAZ3-A Enclosure

Setting switch 2 (Restart/Enable) to on allows the front control panel Restart
switch to function as described in Table 7-2. Setting the Restart/Enable switch to
off disables the front control panel Restart switch.
MASS STORAGE

7.4

The front bezel covers two slots used for mounting standard 13.3-cm (5.25-inch)
mass storage devices. The top (or right) slot usually contains an RX50 diskette

drive. This slot can also accommodate a TK50 tape drive. A fixed-disk drive can
also be installed in this slot (see the caution below). This slot is referred to as port
1. The bottom (or left) slot usually contains a fixed-disk drive. This slot is referred
to as port 0.

CAUTION

Never install more than one fixed-disk drive in a BA23-A enclosure. Damage to the system could result.
7.5

BACKPLANE ASSEMBLY

The backplane assembly (Figure 7-7) consists of three major parts:
e

BA23-A mass storage signal distribution panel

Sheet metal mounting bracket

Q22-Bus backplane

[

JIFIXEDDISK1 J2 FIXED DISK O

J6 REMOVABLE
DISK 142 J5 FIXED DISK 1

|
v

J7 FIXED DISK 0

(e I
"""""""""""

it ' f
1

‘

patiial

A 4,
J9

TeT

ceo]
eso] 9oJe

:
:

j @ |,

J10

‘fi\

)

\
*¥ON BACKPLANE

(SIDE
(SIDE
2)

CONTROL PANEL
CONNECTOR

Figure 7-7

/-8

POWE
R SUPPLY
)
FRONT

CONTROL PANEL CONNECTION

Signal Distribution Panel

BAZ3-A Enclosure

7.5.1

Mass Storage Signal Distribution Panel

The RX50 diskette drive and RD51, RD52, or RD53 fixed-disk drive, installed in
the BA23-A enclosure, connect to the mass storage signal distribution panel. Figure
7-8 shows the internal cabling setup for the BA23-A enclosure.

The signal distribution panel carries the signals from an RQDX controller module
installed in the Q22-Bus backplane. Six connectors on the signal distribution panel
provide the following functions:

e ]6 Removable Disk 1 and 2 - provides the signals to an RX50 diskette drive. An
RX50 diskette drive contains two disk units. When a fixed-disk drive is present,
the ROM code usually labels these as Disk Unit 1 (DU1) and Disk Unit 2 (DU2).

o J7 Fixed Disk 0 and J2 Fixed Disk 0 — provide the signals to a fixed-disk drive
installed in port O (left slot) of the BA23-A enclosure. This is also the first fixeddisk drive to be booted. The ROM code usually labels this fixed-disk drive as
Disk Unit 0 (DUO).

e J1 Fixed Disk 1 and J5 Fixed Disk 1 — provide the signals to a fixed-disk drive
installed in port 1 (right slot) of the BA23-A enclosure. This fixed-disk drive
would be the second fixed-disk drive to boot. The ROM code usually labels this
disk drive as Disk Unit 1 (DU1).
CAUTION

Never install more than one fixed-disk drive in a BA23-A enclo-

sure. Damage to the system could resulit.

e J4 — provides the signals to the control panel PC board from the mass storage
signal distribution panel.

A TK50 tape drive, installed in the BA23-A enclosure, connects directly to its
TQK50 controller module with a ribbon cable. This cable passes through the access
door on the signal distribution panel and under the Q22-Bus backplane.

7-9

BAZ3-A Enclosure

VIEW A-A

NOTES:
1.

CONNECTORS J1

2 PLACES

AND J2 ARE LOCATED

ON THE BACKPLANE (H9278-A)
ASSEMBLY.

IF DISK DRIVE IS NOT PRESENT, THE
POWER CABLE CONNECTOR SHOULD BE
PLUGGED INTO J3 ON THE DISTRIBUTION

IF DISK DRIVE IS NOT PRESENT, THE
POWER CABLE CONNECTOR SHOULD BE
PLUGGED INTO J4 ON THE DISTRIBUTION

THE

PANEL.

REAR

CABLE IS AN INTEGRAL
PART OF THE H7864 POWER SUPPLY.
INTEGRAL PART OF THE
AN
IS
CABLE
THE

REAR FAN

FAN

7020695-01 ASSEMBLY.

1917556-01

SEE NOTE 4

POWER
SUPPLY

UNIT

3020444-00

DISTRIBUTION PANEL
7019986-00

3021749-01

BACKPLANE H9278-A*

NOTE 3

NOTE 2

SEE

51 S
J7

700282-00

SEE

J10

s B

FRONT FAN

=" 1217556-01

\\\

700286-00

NOTE 1

7020435-1K

SEE N

7020449-00
-

OTE 3

__BCO2D-1D

OR
1700285-02
7020451-1C

SkE

SEE NOTE 5

NOTE
2

RD51

OR
RD52

RX50

FRONT

CONTROL
PANEL
7020695-01

Figure 7-8

Internal Cabling in a BA23-A Enclosure

* The four slot (MicroPDP/SV system) backplane has a DIGITAL P.N. of H9278-B.

7-10

BAZ23-A Enclosure

7.5.2

Q22-Bus Backplane

The backplane implements the extended LSI-11 Bus, which uses 22-bit addressing
to support up to four megabytes of main memory. This bus 1s commonly referred
to as the Q22-Bus.

The Q22-Bus backplane supports a maximum of 38 ac loads and 20 dc loads. The
ac loading is the amount of capacitance a module presents to a bus signal line; one
ac load equals 9.35 picofarads (pF). The dc loading is the amount of dc leakage a
module presents to a bus signal line; one dc load is approximately 105
microamperes (uA). The backplane itself presents 7 ac loads and no dc loads.

Four connectors on side 2 of the backplane (Figures 7-7 and 7-8) provide the

following functions:

e J1 - provides the connection for the power supply backplane cable that carries
the dc power and signals from the power supply.

e ]2 — provides the signals to the control panel PC board from an installed CPU
module.

e ]3 and J4 — provide for termination of the mass storage power cable when no
mass storage device 1s present.

Signal

+5 Vdc from power supply regulator

Ground

+12 Vdc from power supply regulator

Signal

The backplane has an eight-layer PC board that 1s arranged as follows:

Signal

7-11

BAZ23-A Enclosure

NOTE

Section A.1 discusses the configuration rules for the backplane.

The backplane contains four rows of connectors (A-D). Each row contains eight
slots for inserting modules. Figure 7-9 shows the connectors that supply the Q22-

Bus signal to the modules.

The C and D rows of slots 1, 2, and 3 provide an interconnection between the
three slots. This interconnection is referred to as the CD bus. Any dual-height
module installed in slots 1 through 3 must be inserted in rows A and B.

H7864

CONNECTOR

(;_

Q22

CcD

Q22

—

Q22

XZ1

CONTROL

raner

CONNECTOR

SIDE1

XZ2

XZ3

XZ4

NOTES:

1.
2.

CONNECTORS J1, J2, J3, AND J4 ARE MOUNTED ON SIDE 2.
XZ21—4 ARE BACKPLANE TERMINATOR SOCKETS. THE SIP TERMINATION RESISTORS

J3AND J4 ARE NOT POWER SOURCES. THEY ARE USED TO SUPPLY POWER TO THE BACK-

MOUNTED IN XZ1—4 MUST BE REMOVED WHEN EXPANDING BEYOND THIS BACKPLANE.
PLANE WHEN THE RD51-A FIXED DISK DRIVE OR RX50-AA DISKETTE DRIVE IS NOT INSTALLED.

Figure 7-9

7-12

Backplane

BAZ23-A Enclosure

The backplane accommodates dual- or quad-height Q22-Bus-compatible modules.
Figure 7-10 shows the grant continuity lines for the Q22-Bus interrupt. Slots 4
through 8 carry the Q22-Bus signal in rows C and D, as well as rows A and B.

You can install two dual-height Q22-Bus modules in slots 4 through 8. If you install
only one dual-height module in a slot, you must install a grant continuity card
(M9047 or G7272) in the adjacent rows (A or C). The grant continuity card carries
the Q22-Bus signal to the next row or slot. If you install only one dual-height
module in slot 8, you must install it in rows A and B.
C

C-D

[

C-D

L 4

NOTE:

C+D (1-3) = CD INTERCONNECT
OTHERS = Q22 FORMAT

Figure 7-10

Backplane Grant Continuity

7-13

BAZ23-A Enclosure

7.6

POWER SUPPLY AND FANS

The power supply (Figure 7-11) features protection against excess voltages, excess

currents, and temporary fluctuations in the ac supply.

POWER SUPPLY

Figure 7-11

Location of Power Supply

The BA23-A enclosure has one of two possible power supplies:
o

H7864 (Rev. 12), a 230 W unit that supplies +5 Vdc at 4.5 A to 36.0 A and

+12 Vdc at 0.0 A to 6.0 A.
e

H7864-A (Rev. 20), a 230 W unit that supplies +5 Vdc at 4.5 A to 36.0 A and

+12 Vdc at 0.0 A to 7.0 A.
Both power supplies provide power to the following:

Backplane

Fixed-disk drive

Diskette drive

7-14

BAZ23-A Enclosure

The power supply generates three system control signals to the backplane. The
power supply asserts two of these signals, BDCOK H and BPOK H, when the
system power is stable. The third signal, BEVENT L, is an external line clock
interrupt request to the CPU. The LTC switch on the control panel PC board
enables the BEVENT L signal.

The power supply also includes two fan outputs (+10 Vdc at 0.45 A) for the front
and rear dc fans. The fan voltages can be increased to +12 Vdc by changing a
power supply jumper. However, the KDJ11-B and KDF11-B module thermal and
acoustical specifications are based on the +10 V setting. The required fan power
does not affect the 230 W output specification.
NOTE

MicroPDP-11/83 systems contain only the H7864-A (Rev. 20)
power supply.

Older versions of the BA23-A enclosure may have the H7864 power supply (Rev.
12). The difference in the +12 Vdc output current becomes important when you

configure a system (see Appendix A, Configuration). If you replace a power supply,
replace it with an identical model. (See Chapter 6, FRU Removal and Replacement
Procedures).

See Table 7-3 for the specifications for the H7864-A (Rev. 20, 30-21749-00)
power supply. See Table 7-4 for the specifications for the H7684 (Rev. 12, 3020444-00) power supply.

7-15

BAZ23-A Enclosure

Table 7-3

H7864-A Power Supply Specifications (Rev. 20)

+5 Vdc Output
Voltage

+5.1 Vdc + 2.5%

Current

36.0 Adc max.
4.5 Adc min.

(must trip)

37 A min. (averaged over 1 ms min.)
42 A max. (averaged over 1 ms min.)

Ripple and noise

50 MV peak-to-peak max.

Excess current

+12 Vdc Output
Voltage
Current

+12.1 Vdc + 2.5%
7.0 Adc max.

0.0 Adc min.

(must trip)

7.2 A min. (averaged over 1 s)
8.0 A max. (averaged over 1 s)

Startup excess current

13.0 A for 3 s

Normal excess current

(must trip)
Startup excess current

9.0 A for 10 s min.

(must not trip)

10.0 A for 5 s min.

12.5 A for 1 s min.
Ripple and Noise

7-16

75 MV peak-to-peak max.

BAZ3-A Enclosure

Table 7-4

H7864 Power Supply Specifications (Rev. 12)

+5 Vdc Output
Voltage

+5.1 Vdc + 2.5%

Current

36.0 Adc max.
4.5 Adc min.

Excess current

36 A min. (averaged over 1 ms min.)

(must trip)

44 A max. (averaged over 1 ms min.)

Ripple and noise

50 MV peak-to-peak max.

+12 Vdc Output
Voltage

+12.1 Vdc + 2.5%

Current

6.0 Adc max.
0.0 Adc min.

(must trip)

9.5 A min. (averaged over 1 s)
13.0 A max. (averaged over 1 s)

Startup excess current

13.0 A for 3 s

Normal excess current

(must trip)
Startup excess current

9.0 A for 10 s min.

(must not trip)

10.0 A for 5 s min.
12.5 A for 1 s min.

Ripple and noise

75 MV peak-to-peak max.

7-17

BAZ23-A Enclosure

The rear of the power supply contains a connector for remote power control (Fig-

ure 7-12). An ac input connector provides compatibility with international line cords
and a circuit breaker protects the input power line. The voltage select (VOLT
SEL) switch selects two ranges as follows:
e

120V = 88-128 Vac

240 V = 176-256 Vac

VOLTAGE |
SELECTOR ]

SWITCH

CIRCUIT
BREAKER

INPUT

CONNECTOR

Figure 7-12

Power Supply Rear View

The rear fan power cable is an integral part of the H7864-A and H7864 power
supplies.

The front of the power supply (Figures 1-7 and 1-8) contains four connectors that

provide the following functions:

e J7 — provides the power signal for the front control panel.
e J8 — provides the signals for the mass storage power cable. The mass storage
power cable terminates in J3 on the backplane assembly if an RX50 diskette
drive or TK50 tape drive is not present, and in J4 if an RDb5n fixed disk 1s not
present.

e J9 — provides the power and signals for the backplane power cable. The backplane power cable terminates in J1 of the backplane assembly.
e J10 — provides the signal for the front fan power cable.

7-18

BAZ23-A Enclosure

7.7

REAR I/O DISTRIBUTION PANEL

External devices connect to the system through the rear I/O distribution panel of
the BA23-A enclosure.

Each module that connects to an external device comes with an internal cable, a
filter connector, and an insert panel. Together these three items are referred to as
a cabinet kit. Chapters 5 and 6 provide cabinet kit information for mass storage,
backup, 1/O, and communications options.

The filter connectors mount in the insert panels which are installed in cutouts in
the rear 1/O distribution panel. The BA23-A rear I/O distribution panel provides a
place to install up to six insert panels, two of which can contain 50-pin connector
insert panels.

Figure 7-13 shows the rear I/O distribution panel with a typical insert panel
installed. It also shows the serial line unit display panel of the KDJ11-B CPU
module, which is typically installed in the top (or left) cutout.
CONSOLE SLU

TYPICAL, OPTIONAL

PATCH AND FILTER
PANEL

REMOVABLE METAL
INSERT

INSERT-DISPLAY
PANEL

50-PIN CONNECTOR
EXPANSION SLOTS

Figure 7-13

Rear I/O Distribution Panel (KDJ11-B SLU Display Panel Shown)

7-19

BAZ23-A Enclosure

The rear [/O distribution panel has six cutouts as follows:

o Two of type A: 2.6 X 8.1 cm (.6 X 3.2 inch)
e Four of type B: 6.2 X 8.1 cm (2.5 X 3.2 inch)

Insert panels corresponding to these I/O distribution panel cutouts follows:
e Type A: 2.5 X 10.1 cm (1 X 4 inch)

e Type B: 6.6 X 8.2 cm (2.6 X 3.2 inch)

In addition, a removable bracket between the third and fourth cutout permits
installation of three more type A insert panels by installing an adapter plate. Figure
7-14 shows typical type A and type B insert panels and the adapter plate.

7-20

BA23-A Enclosure

Figure 7-14

1/O Insert Panels and Adapter Plate

7-21

TRIT Remaval and Replacement Procedures
A
Removal
FRU
BA23-A
and

MATDZ

8.1

Renlacement Procedures

INTRODUCTION

This chapter describes the removal and replacement procedures for the Field
Replaceable Units (FRUs) in the BA23-A enclosure. Figure 8-1 shows the major
FRUs as seen from the front of the enclosure. Table 8-1 lists the FRUs and their
part numbers.

CAUTION

Static electricity can damage modules installed in the BA23-A
enclosure and in mass storage devices. Always use a grounded
wrist strap (DIGITAL P.N. 29-11762-00) and grounded work surface when you access any internal part of a microcomputer
system.

NOTE

Only qualified service technicians should perform any of these
removal and replacement procedures.

8-1

BA23-A FRU Removal and Replacement Procedures

Table 8-1

Field Replaceable Units

Component

DIGITAL P.N.

H7864 power supply
H7864-A

30-20444-00*
30-21749-01*

Power supply ac power cable with

70-20434-01

ac switch

Dc fan
Dc fan power cable
Backplane assembly
Q22-Bus backplane (8-slot)
Q22-Bus backplane (4-slot)

12-17556-01
70-20449-00
70-19986-00
H9278-A
H9278-B

Signal distribution panel

54-15633-00

Backplane dc power cord

70-20450-01

Diskette drive

RX50-AAT

RX/RD power cable

70-20435-1K

RD51 fixed-disk drive

RD51-AAT

RD52 fixed-disk drive RD52-AAT

30-21721-02 or
30-23227-02

RD51 read/write module

29-24665-00

RD52 read/write module

29-24992-00

RD51 DIP shunt

29-24115-00

RX50 signal cable

17-00285-02

RD5n signal cable (20-wire)

17-00282-00

RD5n signal cable (34-wire)

17-00286-00

Front control panel

70-20695-01

Control panel cable

70-20451-1C

KDF11 SLU panel

54-15422

KDJ11 SLU panel

70-21150-02

SLU cable 10-pin

17-00624-01

LED cable 20-pin

17-00712-02

* A replacement power supply must have the same part number as the power supply you
removed.

T If you are adding one of these drives to a previously diskless system, you need to use the
RX50Q-AA, RD51Q-AA, RD52Q-AA, and RD53Q-AA options. These options contain the
drive and the signal cables.

8-2

BA23-A FRU Removal and Replacement Procedures

Table 8-1

Field Replaceable Units (Cont.)

Component

DIGITAL P.N.

Adapter plate
I/O distribution panel
Front bezel (rackmount)
Front bezel (floor/table)
Rear bezel
Pedestal (floor)
Enclosure plastic skins
Chassis support kit
Loopback connectors
KDF11-BE
KDF11-BP
KDJ11-BC
MSV11-PK
DZV11

74-28684-01
70-19979-0
74-29501-01
74-29559-0
74-27560-0
74-27012-0
70-20469-01
70-20761-01
12-15336-00
M&189
M&189
M8190
M&067
M7957

DLV]J1

M8043

DEQNA

M7504

RQDX1

M8639

RQDX1-E

M7512

DZV11 cabinet kit

DLV]J1 cabinet kit
DEQNA cabinet kit

CK-DZV11-DB

CK-DLV]J1-LB
CK-DEQNA-KB

RQDX?2

M8639-YA

RQDX1-E cabinet kit
Grant card
Grant card

CK-RQDX
M9047
G7272

8-3

BA23-A FRU Removal and Replacement Procedures

This chapter presents FRU procedures from the front to the rear of the enclosure.

NOTE
Unless otherwise specified, replace FRUs by reversing the order

of the removal procedures.

Notes to Figure 8-1:

. Connectors J1 and J2 are located on the backplane (H9278-A) assembly.
. If disk drive is not present, the power cable connector should be plugged into

J3 on the distribution panel.
. If disk drive is not present, the power cable connector should be plugged into
J4 on the distribution panel.
. The rear fan cable is an integral part of the H7864 power supply.

. The cable is an integral part of the 7020695-01 assembly.

8-4

BA23-A FRU Removal and Replacement Procedures
VIEW A-A

2 PLACES

REAR FAN
1217556-01

SEE NOTE 4

POWER

SUPPLY
UNIT

3020444-00
.
OR

DISTRIBUTION PANEL
7019986-00

3021749-01

BACKPLANE H9278-A*

SE®

SEE

NOTE 3
\
J1

NOTE
2
|
'

s d5J1
—

FRONT FAN

& 1217556-01

700282-00

700286-00

NOTE 1

7020449-00

7020435-1K

SEE NOTE 3

BCO2D-1D
OR

1700285-02
7020451-1C

SEE

NOTE

NOTE
2

RD51

RX50

FRONT
CONTROL

RD52

PANEL

7020695-01

Figure 8-1

BA23-A Enclosure FRUs

* For four-slot MicroPDP-11/SV systems, the backplane part number is H9278-B.

8-5

Dl\f)fj

Eml I

nr\mf\\lfil

r\r\t\l

mf\v\’r\r\r\Mf\m*

nvt\f\r\r\] lllll

BA23-A FRU Removal and Replacement Procedures

8.2

CONTROL PANEL REMOVAL

Use the following procedure to remove the control panel (Figure 8-2).
1.

Unplug the ac power cord from the wall socket.

. Remove the front plastic cover by holding each end and pulling the cover away
from the system.

. Remove the front chassis retaining bracket.

. Push the subsystem forward.

. Remove the subsystem storage cover.

. Remove the four screws retaining the control panel assembly.

. Disconnect the 20-pin connector from the control panel.
. Remove the power supply connector from J7 on the power supply.

Use the following procedure to install a replacement control panel.
1. Reverse steps 1 through 8.

2. Make sure that the Line Time Clock (LTC) switch and the Restart/Enable

switch on the control panel printed circuit board are set correctly (see Section
7.3.2).

8-6

BA23-A FRU Removal and Replacement Procedures

Figure 8-2

Control Panel Removal

8-7

BA23-A FRU Removal and Replacement Procedures

8.3

RX50 DISKETTE DRIVE AND TK50 TAPE DRIVE REMOVAL

Use the following procedures to remove the RX50 diskette drive or the TK50 tape
drive (Figure 8-3, RX50 shown).
NOTE

The RX50 diskette drive and TK50 tape drives are single FRUs.
Do not disassemble the diskette or tape drives or remove any of
the printed circuit boards. All adjustments must be made in a
special test configuration.

Only use formatted RX50K diskette and TK50 compact tapes
available from Digital Equipment Corporation and its licensed
distributors.
1 . Remove both covers and the ac power cord.

2 . Remove the front chassis retaining bracket.

3. Push the subsystem forward.
4. Remove the subsystem storage cover.
5.

Disconnect the signal cable and the dc power cable from the diskette drive by
pulling straight up on the connectors.

6. Push down on the release tab, slide the RX50 diskette drive forward, and
remove the drive.

NOTE

Remove the cardboard shipping insert from a newly installed
RX50 diskette drive.

8-8

BA23-A FRU Removal and Replacement Procedures

Figure 8-3

RX50 Diskette Drive Removal

8-9

BA23-A FRU Removal and Replacement Procedures

8.3.1

TK50/TQK50 INTERCONNECT CABLE REMOVAL

The TK50 tape drive connects to its TQK50 controller module through an interconnect cable. This cable runs through the access cover on the signal distribution

panel, and underneath the modules installed in the backplane.

Use the following procedure to remove the TK50/TQK50 interconnect cable (Figure 8-4).

1. Remove the front and rear covers and all cables. Label the cables for reinstallation later.

2. Remove the rear retaining bracket and slide the subsystem completely out
through the back.

3. Remove the subsystem storage cover, the Q22-Bus module cover, and all mass
storage devices.

4. Release the interconnect cable from the wire tie holding it to the access cover
on the signal distribution panel.

5. Remove the two screws retaining the access cover and remove the cover.

Figure 8-4

8-10

Access Cover Removal

BA23-A FRU Removal and Replacement Procedures

7. Disconnect the RQDX controller cable from side two of the backplane and move
it to the side to provide working room.

8 Remove the module in slot 8 (bottom slot) of the backplane (Section 8.9).

9. Pull the TK50/TQK50 interconnect cable (from the back) through the signal
distribution panel, backplane, and card cage.

To install a replacement TK50/TQK50 interconnect cable, reverse steps 1 through
9 with the following exceptions:

e Push the replacement cable through the backplane assembly from the front to
the rear of the enclosure.

e Be sure to observe the “THIS SIDE UP” marking on the cable. As a check, the
striped side of the cable should be nearest the front fan of the enclosure.
e If you are installing a TK50 tape drive in a BA23-A enclosure which did not
previously contain a tape drive, be sure to install the mew access cover shipped
with the TK50. Do not try to use the access cover originally shipped with the
system.

8-11

BAZ23-A FRU Removal and Replacement Procedures

8.4

RD5n FIXED-DISK DRIVE REMOVAL

Use the following procedure to remove an RDbn fixed-disk drive (Figure 8-5):
CAUTION

Handle any fixed-disk drive with care. Dropping or bumping the

drive can damage the disk surface.

Package any disk drive to be returned in the replacement disk drive’s shipping
carton. If the shipping carton is not available, one may be ordered (DIGITAL P.N.
99-90045-01).
NOTE

You must format a newly installed RD5n disk drive before testing the system and using the drive. Refer to Appendix C for
formatting instructions for your system.
1. Remove both covers and the ac power cord.
2. Remove the front chassis retaining bracket.
3. Push the subsystem forward.
4. Remove the subsystem storage cover.

CAUTION
The RD51 fixed-disk drive has an exposed head positioner flag
on the front right side. Do not touch this area. Doing so can
cause the head positioner flag to rotate, resulting in damage to
the drive.

An RD52 or RD53 disk drive does not have an exposed head
positioner flag.

5. Remove the power plug and two ribbon cables from the RD5n drive.
6. Push down on the release tab, slide the RDb5n disk drive forward, and remove

the drive.

8-12

BA23-A FRU Removal and Replacement Procedures

Figure 8-5 RDb5n Fixed-Disk Drive Removal (RD51 Disk Drive Shown)

8-13

BA23-A FRU Removal and Replacement Procedures

7. To configure an RD52 drive as DUO (installed in port 0), make sure the jumper

clip is set at DS3 (Figure 8-6). To configure an internal RD52 drive as DU1
(installed in port 1), place the jumper clip on DS4. Refer to Sections 5.3 and 5.5

for further information.

i
FRONT OF DRIVE

DDDD

’

Figure 8-6

RD52 Jumper Clip Setting

NOTE

Only format a fixed-disk drive when you replace a complete
RD5n drive assembly. Refer to Appendix C for instructions.
Before you format a newly installed RD5n disk drive, write-protect any other RD5n
disk drives that may be present. Remember to write-enable these additional RD5n
disk drives when the formatting procedure is complete.

8-14

BA23-A FRU Removal and Replacement Procedures

8.4.1

RD51 Disk Drive Read/Write Board Removal

The RD51 read/write board is the only part of an RD51 drive that 1s replaceable.
Always try replacing the read/write board before you replace an entire RD51 disk
drive.

1. Remove the four Phillips screws retaining the skid plate. Set the skid plate
aside (Figure 8-7).

Figure 8-7

RD51 Disk Drive Skid Plate Removal

8-15

BAZ23-A FRU Removal and Replacement Procedures

2. Using a 3/32-inch Allen wrench, remove the four screws that hold the

read/write printed circuit board to the fixed-disk drive (Figure 8-8).

3. Disconnect connector P5 from the side of the board.

Figure 8-8

8-16

RD51 Disk Drive Allen Screws and Connector P5 Removal

BA23-A FRU Removal and Replacement Procedures

. Disconnect connectors P6, P7, and P8 from the front of the read/write printed
circuit board (Figure 8-9).

. Disconnect connector P4, a two-wire connector found on the rear of the
read/write printed circuit board next to the dc power connector.

. Remove the fixed-disk drive read/write board.

Figure 8-9

RD51 Disk Drive Connectors P6, P7, P8, and P4

8-17

BAZ3-A FRU Removal and Replacement Procedures

7. Make sure the jumper configuration of the 14-pin Dual In-line Package (DIP)
shunt pack matches the listing in Table 8-2.

Table 8-2

RD51 Jumper Configuration

Pin Numbers

Pin Connection

1 to 16

Not used*

2 to 15

3 to 14

4 to 13

5to 12

Out

6 to 11

7 to 10

Out

8to9

Out

* Place the 14-pin DIP jumper pack in the rear 14 receptacles of the 16-pin socket (Figure
8-10).

8-18

BAZ23-A FRU Removal and Replacement Procedures

REA
OF DRIVE
R

8 — |0 CmO
p|— 9
/ — |4 Cm p|—19

6 —1g =3 p|—!
° —|
) pl—!2
f—g=ap-1s3

il B

2
—j =3 p|—1>
T__

_16

VNOTUSED
FRONT OF DRIVE

Figure 8-10

DIP Shunt Pack Setting

NOTE
You do not need to format an RD51 disk drive when you replace

only the read/write board.

8-19

BA23-A FRU Removal and Replacement Procedures

8.4.2 RD52 Main Printed Circuit Board Removal
NOTE

Replace the Main Printed Circuit Board (MPCB) only on RD52
disk drives with a DIGITAL P.N. of 30-21721-02.

Screws located on the slide plate and MPCB are different sizes. Make sure

reinstall the screws in their proper location.

you

1. Remove the four Phillips screws retaining the slide plate and ground clip. Set
the slide plate aside (Figure 8-1 1).

Figure 8-11

8-20

Slide Plate Removal

BA23-A FRU Removal and Replacement Procedures

2. Unplug the two-pin connector (Figure 8-12).

3. Remove the two Phillips screws that attach the front bezel to the drive.

Figure 8-12

Two-Pin Connector and Screw Removal

4 Remove the front bezel by pulling it away from the drive. The bezel is held in
place with pop fasteners (Figure 8-13).

Figure 8-13

Front Bezel Removal

5 Remove the three Phillips screws from the heatsink, the grounding strip, and
the corner opposite the heatsink (Figure 8-14).

8-21

BA23-A FRU Removal and Replacement Procedures

Figure 8-14

Removal of Phillips Screws from Heatsink

6. Lift the MPCB straight up until it clears the chassis. This disconnects P4, a 12pin fixed plug (Figure 8-15).

7. Disconnect P5, a 10-pin connector.
P5

Figure 8-15

8-22

MPCB Removal

BA23-A FRU Removal and Replacement Procedures

8.4.3

RD53 Disk Drive Read/Write Board Removal

The RD53 read/write board is the only part of an RD53 drive that is replaceable.
Always try replacing the board before you replace an entire RD53 disk drive.

1. Remove the four Phillips screws retaining the slide plate and ground clip. Set
the slide plate aside (Figure 8-16).

2. Loosen the two captive screws holding the board in place.

3. Rotate the board upward (the board pivots in hinge slots at the front of the
drive). Tilt the board until it comes to rest against the outer frame. Be careful
not to strain any connectors or cables.

4. Disconnect the motor control board connector J8 and the preamplifier board
connector J9 from the read/write board. Handle these with care.
5. Lift the read/write board out of the hinge slots.

8-23

BA23-A FRU Removal and Replacement Procedures

NOTE

Be sure to set the jumpers and switches for the new board to

the same position as on the old board.

READ/WRITE

S MOTOR CONTROL
BOARD SCREWS

PREAMPLIFIER BOARD
AND SHIELD

BEZEL SCREWS

Figure 8-16

8-24

RD53 Read/Write Board Removal

BA23-A FRU Removal and Replacement Procedures

8.4.4

RQDX Interconnect Cable Removal

RD5n and RX50 disk drives connect to the signal distribution panel, which in turn

connects to the RQDX controller module through an interconnect cable. This cable
runs from the signal distribution panel underneath the modules to the back of the
RQDX controller module.

Use the following procedure to remove the RQDX interconnect cable.

1. Remove the front and rear covers and all cables. Label the cables for reinstallation later.

2 Remove the rear retaining bracket and slide the subsystem completely out
through the back.

3. Remove the subsystem storage cover, the Q22-Bus module cover, and all mass
storage devices.

4 Release the TK50 interconnect cable (if present) from the wire tie holding 1t
to the access cover on the signal distribution panel.

8-25

BA23-A FRU Removal and Replacement Procedures

Remove the two screws retaining the access cover and remove the cover
(Figure 8-17).

Figure 8-17

7.
8.

Access Cover Removal

Move the TQK50 cable (if present) to the side to provide working room.
Disconnect the RQDX cable, which was exposed when you removed the access

cover, from side two of the backplane.
9.
10.

Remove the module in slot 8 (bottom slot) of the backplane (Section 8.9).
Pull the RQDX interconnect cable (from the back) through the signal distribution panel, backplane, and card cage. you may also have to remove the TQK50
interconnect cable (if present) to remove the RQDX interconnect cable (Sec-

tion 8.3.1)

To install a replacement RQDX interconnect cable, reverse steps 1 through 10.
Note, however, that it is easier to push the replacement cable through the backplane assembly from the front to the rear of the enclosure.

8-26

BA23-A FRU Removal and Replacement Procedures

8.5

BACKPLANE ASSEMBLY REMOVAL

Use the following procedure to remove the backplane assembly.

1. Remove the front and rear covers and all cables. Label the cables for reinstallation later.

2. Remove the rear retaining bracket and slide the subsystem completely out
through the back.

3. Remove both the subsystem storage cover and the Q22-Bus module cover
(Figure 8-18).

Figure 8-18

Backplane Access

8-27

BA23-A FRU Removal and Replacement Procedures

Open the rear I/O panel assembly by loosening the two captive screws. Dis-

connect any cables attached to the I/O panel. Label them for reinstallation
later. Note the orientation of the red stripe on any cables you remove.
Remove all modules (Figure 8-19). Refer to Section 8.9 for instructions.
Remove the cowling (if present) from the front fan.

Remove any RX50 and RD5n disk drives that may be present (see Sections
8.3 and 8.4).

Remove the RX50 and RD5n disk drive sfgnal cables from J6, J2, and J7 on

the signal distribution panel.

Remove all power supply connectors and front control panel connectors from
J1, J4, and J2 on the signal distribution panel and from J9 on the power supply.

8-28

BA23-A FRU Removal and Replacement Procedures

Figure 8-19 Cables and Module Removal

8-29

BA23-A FRU Removal and Replacement Procedures

10. Loosen the two screws retaining the small access cover. Remove the cover
and disconnect the cable from side two of the backplane (Figure 8-20).

11. Remove the four screws holding the backplane assembly to the chassis.

Figure 8-20

8-30

Access Cover and Screw Removal

BAZ23-A FRU Removal and Replacement Procedures

12. Pivot the CD side of the backplane assembly 45 degrees toward the rear and
lift it straight up (Figure 8-21).

Figure 8-21

Backplane Removal

8-31

BA23-A FRU Removal and Replacement Procedures

8.6

POWER SUPPLY (H7864-A/H7864) REMOVAL

‘Use the following procedure to remove the power supply (Figure 8-22).
NOTE

The H7864-A and H7864 power supplies are not adjustable, nor
do they contain replaceable printed circuit boards. The +5 Vdc
and +12 Vdc regulators are fixed. Voltage tolerance is +5.1 Vdc
(+.13 V) for the +5 Vdc regulator, and +12.1 Vdc (+.13 V) for the
+12 Vdc regulator. Ripple is 50 mV peak to peak at +5 Vdc, and
75 mV peak-to-peak at +12 Vdc.

Remove the front and rear covers and all cables.

Remove the rear chassis retaining bracket and slide the subsystem completely
out through the back.
Remove the subsystem storage cover.

Remove the fan cowling and cowling holder (if present).

Disconnect the backplane power connector from J9 on the power supply and J1

on the signal distribution panel.

Disconnect the mass storage power connector from J8.

Disconnect the front fan power connector, and the front control panel power
connector, from J10 and J7. These connectors are keyed and have a locking
assembly.

Remove the five screws holding the power supply to the chassis.

8-32

BA23-A FRU Removal and Replacement Procedures

NOTE:

REPLACE A POWER SUPPLY WITH ONE THAT
HAS AN IDENTICAL PART NUMBER.

Figure 8-22

Power Supply Removal

8-33

BA23-A FRU Removal and Replacement Procedures

9. Lift the power supply assembly out of the chassis and rest it on top of the
Q22-Bus module cover (Figure 8-23).

10. Disconnect the power connector from the rear cooling fan.

Figure 8-23

8-34

Power Supply and Fan Connector Removal

BA23-A FRU Removal and Replacement Procedures

Use the following procedure to install a replacement power supply.
1. Place the replacement power supply on top of the Q22-Bus module cover and
connect the rear fan power cable.
CAUTION

The rear fan power cable is not keyed. Observe the polarity of
the connector. The curve of the connector must match the curve
of the fan housing (Figure 8-24).

Figure 8-24

Rear Fan Power Cable Installation and Routing

2. Place the power supply in position. Make sure you route the rear fan cable over
the top of the rear fan (Figure 8-24).

3. Reverse steps 1 through 8 of the removal procedure to finish installing the
power supply.

8-35

BA23-A FRU Removal and Replacement Procedures

8.7 REAR COOLING FAN REMOVAL

Use the following procedure to remove the rear cooling fan (Figure 8-25).
1. Remove the front and rear covers and all cables.

9 Remove the rear retaining bracket and remove the subsystem from the
enclosure.

3. Remove the power supply unit and disconnect the rear fan power connector
(refer to Section 8.6).

4 Remove the four screws and spacers that hold the fan to the chassis and remove
the fan.

Figure 8-25

8-36

Removal of Fan from Chassis

BA23-A FRU Removal and Replacement Procedures

Use the following procedure to install a rear replacement fan.

1. Relocate the four screws and place the fan guard on the screws. Make sure the
cross members of the fan guard face the inside of the unit (Figure 8-26).
2. Place the spacers on the screws and secure the fan. Make sure the fan 1s
oriented as shown in Figure 8-26. The airflow must be away from the power
supply.

3. Reverse steps 1 through 3 of the removal procedure.
CAUTION

The rear fan power cable is not keyed. Observe the polarity of
the connector. The curve of the connector must match the curve
of the fan housing as shown in Figure 8-24.

Figure 8-26

Rear Fan Installation

8-37

BA23-A FRU Removal and Replacement Procedures

8.8

FRONT FAN REMOVAL

Use the following procedure to remove the front fan (Figure 8-27).
. Disconnect the ac power cable and remove the front cover.
A

. Remove the front retaining bracket and push the subsystem forward.

. Remove the subsystem storage cover.

O B

. Remove the front fan cowling (if present).

. Disconnect the front fan power cord from J10 on the power supply and from the
fan.

6. Remove the four screws and spacers that hold the fan and fan guard to the
chassis and remove the fan (Figure 8-28).

8-38

BA23-A FRU Removal and Replacement Procedures

Figure 8-27

Front Cooling Fan Disconnection

8-39

BA23-A FRU Removal and Replacement Procedures

Figure 8-28

Front Cooling Fan Removal

Use the following procedure to install a replacement front fan.

1. Remove the power cable and fan guard (if present) from the intake side of the
old fan and fit them to the replacement fan (Figure 8-29).
CAUTION

The front fan power cable is not keyed. Observe the polarity of
the connector. The curve of the connector must match the curve
of the fan housing as shown in Figure 8-29.

Figure 8-29

8-40

Front Fan Power Cable and Fan Guard Connection

BA23-A FRU Removal and Replacement Procedures

2. Relocate the four screws and place the fan guard on the screws. Make sure the
cross members of the fan guard face the inside of the unit (Figure 8-30).
3. Place the spacers on the screws and secure the fan. Make sure the fan is
oriented as shown. The airflow must be away from the mass storage area.

4. Reverse steps 1 through 6 of the removal procedure to finish installing the front
cooling fan.

Figure 8-30

Replacement Fan Installation

8-41

BA23-A FRU Removal and Replacement Procedures

8.9

MODULE REMOVAL

Use the following procedure to remove modules from the BA23-A enclosure (Figure 8-31).

CAUTION

Static electricity can damage modules. Always use a grounded

wrist strap and grounded work surface when working with or
around modules.

Remove and install modules carefully to prevent damaging the
module components, damaging other modules, or possibly

changing the switch settings.

Replacement modules come wrapped in special antistatic packaging material. A
silica gel packet is also included to prevent damage from moisture. Use this antistatic packaging material and silica gel packet to protect any modules you store,
transport, or return.

If you install dual-height modules in slots 1, 2, or 3 of the BA23-A backplane, you
must install them in rows A and B.

If you install dual-height modules in slots 4 through 8 of the BA23-A backplane,
you must install a grant continuity card (M9407) in rows A or C if a second dualheight module is not installed in the same slot.

1. Remove the ac power cable from the wall outlet.

2. Remove the rear cover and all cables. Label all cables for reinstallation later.
3. Loosen the two screws retaining the rear I/O panel assembly. Swing the assembly open and remove the ground strap screws.

4. Disconnect any cables attached to the back of the I/O panel assembly. Note their
specific location and the orientation of the red stripe on each cable.
5. Slide the modules partially out of the backplane and remove any cables that are
present. Note the orientation of the red stripe on each cable.
6. Remove the module from the chassis.

8-42

BA23-A FRU Removal and Replacement Procedures

Figure 8-31

Module Removal

Q22-Bus quad-height modules have levers at each end used to lock the module in
place and to assist in releasing the module from the backplane. Figure 8-32 shows
the operation of these ejector levers.

8-43

BA23-A FRU Removal and Replacement Procedures

Figure 8-32

Quad-Height Module Ejector Levers

Use the following procedure to install modules.

1. Make sure you set the jumper and switch configuration of the replacement
modules correctly. Check the setting against the old module, or refer to the
user’s guide or installation guide supplied with the new module.

2. Reverse steps 1 through 6 of the removal procedure.

3. Retest the system to confirm that it is working correctly. Refer to Chapter 3,
Troubleshooting of your Systems Owner’s Manual for instructions.

8-44

BA23-A FRU Removal and Replacement Procedures

8.10

REAR I/O INSERT PANEL REMOVAL

Use the following procedure to remove a rear I/O insert panel (Figure 8-33).
1. Remove the ac power cord from the wall outlet.

2 Remove the rear cover and all cables attached to the insert that is to be
removed. Label the cables for reinstallation later.

3. Loosen the two screws retaining the rear I/O panel assembly. Swing the assembly open and remove the ground strap screws.

4. Disconnect any cables attached to the insert panel. Note the orientation of the
red stripe on each cable (not shown).

5. Remove the four screws holding the panel insert to the rear I/O panel assembly
and remove the insert.

Figure 8-33

Rear I/O Insert Panel Removal

8-45

EFnclosure

9.1

INTRODUCTION

The BA123-A enclosure (Figure 9-1), a floor-standing unit, supports microcomputer
systems and a wide variety of hardware options. The fan-cooled enclosure operates
in an open office environment. It includes the following major components:
e BA123-A frame

e Backplane assembly

e Front control panel

e Power supply

e Mass storage area

e Rear I/O distribution panel

Figure 9-1

BA123-A Enclosure

9-1

BA123-A Enclosure

9.2

ENCLOSURE FRAME

The BA123-A enclosure frame houses the power supply and the backplane assembly. It also provides mounting space for five 13.3-cm (5.25-inch) mass storage
devices. It is mounted on four shock isolating castors. The dimensions of the enclosure frame are as follows:

Height: 62.2 cm (24.5 inches)

Width: 33.0 cm (13.0 inches)

Depth: 70.0 cm (27.5 inches)

Removable panels (Figure 9-2) cover the front, right, and left sides of the
enclosure.

The BA123-A enclosure contains three doors:
e

(Control panel door on the front

[/O panel door at the rear

(ard-cage door inside the right-side panel
NOTE

For panel removal procedures, see Section 10.2.

9-2

BA123-A Enclosure

/0 PANEL DOOR

LEFT-SIDE PANEL

—

S
[

CONTROL

PANEL

]

DOOR

\\\J

‘

‘\\\

FRONT PANEL

RIGHT—SIDE PANEL

L~
Figure 9-2

BA123-A Removable Panels and Doors

9-3

BA123-A Enclosure

9.2.1

Air Circulation

The BA123-A enclosure contains three fans:
e

One below the module card cage

One behind the control panel

One inside the power supply

These fans draw air in from the top of the enclosure (Figure 9-3).

=
.

MASS STORAGE
FAN

Figure 9-3

9-4

Air Flow

BA123-A Enclosure

9.2.2

Temperature Sensors

A Printed Circuit (PC) board above the card cage contains two temperature sensors
(Figure 9-4):

e One sensor regulates the speed of the card-cage fan at the minimum level
required to maintain a constant temperature within the card cage.

e One sensor shuts down the system at high temperatures.

The card-cage door encloses the area surrounding the modules. Removal of this
door triggers a switch, which increases the speed of the card-cage fan to maximum.
If the proper temperature within the card cage cannot be maintained, even at
maximum fan speed, the over-temperature sensor causes the system to shut down.
The system also shuts down if the card-cage fan fails.

9-5

BA123-A Enclosure

Figure 9-4

9-6

Temperature Sensor PC Board

BA123-A Enclosure

9.3

CONTROL PANEL

The control panel contains six cutouts to provide space for control circuits:
e One for a CPU console board (Section 9.3.1)

e Five for mass storage console boards (Section 9.4.2)

Removable plates cover any unused cutouts. Figure 9-5 shows the relation between

the cutouts and the mass storage shelves.

Figure 9-5

Mass Storage Shelves

9-7

BA123-A Enclosure

9.3.1

CPU Console Board

The CPU console board (Figure 9-6) attaches to the back of the control panel. A
ribbon cable connects the CPU console board to the backplane and provides the
connection between the CPU and the CPU console board.

DC OK

ALY

[

RN
LED

LED

(REGULATOR A)

(REGULATOR B)

Figure 9-6

CPU Console Board

The front of the CPU console board contains a DC OK indicator light and two
buttons that allow the user to halt or restart the system. These buttons and indicator are visible on the control panel. Table 9-1 describes their function.

9-8

BA123-A Enclosure

Table 9-1

CPU Console Board Controls and Indicators

Control/

Position/

Indicator

Condition

Description

Halt

Out/Unlit

Push-on/push-off button with integral red
LED. Normal position for running software.

In/Lit

Red LED. Stops normal software operation.
Puts the CPU in console emulator mode and
the system accepts only ODT commands
(see Section 4.5).

Momentary-contact pushbutton. When

Restart

pressed (and enabled), causes a power-

down/power-up sequence to be simulated, to
restart CPU operation. Press and release
the Halt button twice before restarting the
system.

DC OK

Lit

Green LED. Lights when all dc voltages are

present and within tolerance.

9-9

BA123-A Enclosure

There are two LEDs on the CPU console board that can be seen by removing the

left-side panel of the enclosure. If the DC OK indicator on the control panel is not
lit, these LEDs indicate which regulator from the power supply to the backplane
has failed:
e

Regulator A: left LED

Regulator B: right LED

LED is on: +5 Vdc to the backplane is OK

e LED is off: regulator or connection to regulator has failed
NOTE

There should be at least one module in both an odd- and evennumbered backplane slot to draw enough current to start each
regulator (Section 9.5).

9.3.2

LTC DIP Switch Unit

The LTC DIP unit, located to the left of the LEDs, contains two switches labeled 1
and 2. Setting switch 1 to off enables the Q22-Bus BEVENT timing signal and
allows the LTC to function under software control. Switch 1 is referred to as the
BEVENT Enable switch.
Setting switch 2 (Restart/Enable) to on allows the front control panel Restart
switch to function as described in Table 9-1. Setting the Restart/Enable switch to
off disables the front control panel Restart switch.

9-10

BA123-A Enclosure

9.4

MASS STORAGE SHELVES

The front panel covers five shelves used for mounting 13.3-cm (5.25-inch) mass

storage and backup devices (Figure 9-5). Install mass storage and backup devices in
the following sequence:

e Two in shelves 1 and 2
e Two in shelves 3 and 4

e One (usually an RX50 diskette drive) in shelf 5
NOTE

Only four mass storage devices can be in operation at any one
time.

Removable plates in front of shelves 1, 2, and 3 allow access to removable-media
devices. Devices normally occupy the shelves as shown in Figure 9-7.

9-11

BA123-A Enclosure

LEGEND:

1
DISK DRIVE

2. DISK DRIVE 2

4. TAPE DRIVE
5. DISKETTE DRIVE

3. DISK DRIVE
3

Figure 9-7
9.4.1

Typical Arrangement of Devices

Signal Distribution Board

The signal distribution board (M9058, Figure 9-8) is mounted in the bottom two (C
and D) rows of backplane slot 13.

Four fixed-disk drives, or an RX50 diskette drive and two fixed-disk drives, can be
connected to the signal distribution board (Figure 9-9).
The signal distribution board connects to an RQDX2 controller module (M8639-YB)
in the card cage with a 50-pin connector ribbon cable. Another ribbon cable con-

nects the signal distribution board and the RD console boards behind the control
panel.

9-12

BA123-A Enclosure

9.4.2

RD Console Board

The RD console board attaches to the back of the control panel. A ribbon cable
(Figure 9-9) connects the RD console board to the signal distribution board.

The front edge of the RD console board contains two buttons that control the
status of the fixed-disk drive. Table 9-2 describes their function.

Table 9-2

RD Console Board Controls and Indicators

Control/

Position/

Indicator

Condition

Write-Protect

Out/Unlit

Description

Push-on/push-off button with integral yellow

LED. Normal operation. Enables disk read
and write operations.

In/Lit

Ready

Out/Lit

In/Unlit

LED lights yellow. Data cannot be to the
disk (data can be read from the disk).

Push-on/push-off button with integral green

LED. Normal operation. Lights green.
Enables disk reads and writes.

Prevents disk read and write operations.

9-13

BA123-A Enclosure

m—

Figure 9-8

Signal Distribution Board

_17-00867-01

M7546°

’\

54-16596-01

CPU CONSOLE BOARD
TO BACKPLANE

54-16244-02

T
/

[

17-00860-01

[ m8639-YB"

\ 17-00861-01
17-00282-01
17-00286-01

Figure 9-9

9-14

Signal Distribution Board Cabling

BA123-A Enclosure

9.5

BACKPLANE

The BA123 has a four-row by 13-slot backplane that measures 27.9 X 19.9 cm (11
% 7.85 inches). The backplane implements the extended LSI-11 bus, which uses
22-bit addressing. This bus is usually referred to as the Q22-Bus.

Figure 9-10 shows the grant lines for the Q22-Bus interrupt and for Direct Memory Access (DMA). The C and D rows of slots 1-4 implement a separate CD
interconnect.

FRONT OF
SYSTEM

SLOTS
6
7

REAR OF
SYSTEM

Y27

aly

R
0
W

Figure 9-10

|§

Backplane Grant Continuity

The first 12 slots of the backplane accommodate dual- or quad-height Q22-Buscompatible modules.

A dual-height module has connectors that fit into two rows of a backplane slot.
Two dual-height modules can occupy one backplane slot.
NOTE

Dual-height modules in slots 5-11 and rows C and D of slot 12
require another dual-height module or an M8047 grant card in

the other two rows of the slot.

9-15

BA123-A Enclosure

A quad-height module has connectors that fit into all four rows of a backplane slot.
One quad-height module occupies one backplane slot.

Four 120-ohm resistor packs between backplane slots 12 and 13 terminate the
Q22-Bus.

Slot 13 of the backplane provides space for two dual-height modules (rows A and B
and rows C and D). The Q22-Bus is not implemented in this slot. Slot 13 provides
+5 Vdc, +12 Vdc, ground, and a signal (DC OK) that indicates that the dc voltage
from the power supply is stable.

The signal distribution board is installed in rows C and D. Rows A and B are
available for future use.
NOTE

This backplane is a bounded system. An additional backplane
cannot be connected to a BA123-A enclosure.
The backplane supports a maximum of 38 ac loads and 20 dc loads. Ac loading is
the amount of capacitance a module presents to a bus signal line; one ac load

equals 9.35 picofarads (pF). Dc loading is the amount of dc leakage a module
presents to a bus signal line; one dc load is approximately 105 microamperes (uA).
The backplane itself presents 7 ac loads and no dc loads.

The backplane balances the load on each of the power supply’s two regulators.
Three connectors on the backplane (Figure 9-11) provide the following functions:
e J1 - An 18-pin connector, receives the dc power and signals from regulator A in
the power supply, and supplies the odd-numbered backplane slots and the resistor packs.
e

J2 — An 18-pin connector, receives the dc power and signals from regulator B in
the power supply, and supplies the even-numbered backplane slots.

e J3 — A 10-pin connector, provides the connection for the CPU console board
cable.

O-16

BA123-A Enclosure

Figure 9-11

Backplane Connectors

The backplane has an eight-layer PC board , that is arranged as follows:
1

Signal

3 +5 Vdc from regulator A
4 Ground

5 Ground

6 +5 Vdc from regulator B
7 Signal
8 Signal

Appendix A discusses the configuration rules for the backplane.

9-17

BA123-A Enclosure

9.6

POWER SUPPLY

The power supply (Figure 9-12) is a 460-watt unit consisting of two regulators.
Each regulator supplies power to one-half of the slots in the backplane (Section

9.5), and to mass storage devices inside the system.

Figure 9-12

9-18

Power Supply

BA123-A Enclosure

The power supply provides protection against excess voltage and current, and protection against temporary fluctuations in the ac supply. Table 9-3 lists the minimum
and maximum currents supplied by each regulator.

Table 9-3

Regulators A and B Current and Power

Regulator

Power

Current at +5 Vdc

Current at +12 Vdc

230 W max.

4.5 A min. 36.0 A max.

0.0 A min. 7.0 A max.

230 W max.

4.5 A min. 36.0 A max.

0.0 A min. 7.0 A min.

NOTE

Total power used from each regulator must not exceed 230
watts. This means that maximum current at +5 Vdc and +12 Vdc
cannot be drawn at the same time. Refer to Figure A-2 for further information.

The power supply also has two separate +12 Vdc outputs that are independent of
the main 460-watt output. These outputs provide power to the two fans that are
external to the power supply, and to the temperature sensor above the card cage.
The rear of the power supply contains a connector for remote power control (Figure 9-13). An ac input connector provides compatibility with international line cords
and a circuit breaker protects the input power line. The voltage select (VOLT
SEL) switch selects two ranges as follows:
e

120 V = 88-128 Vac

240 V = 176-256 Vac

9-19

BA123-A Enclosure

NOTE

In order to compensate for line-cord voltage drop when the sys-

tem is operating at maximum load, a minimum of 90 Vac (88-128
volt setting) should be present at the outlet for low-line
operation.

CIRCUIT

BREAKER TMTM—]

REMOTE
CONTROL

CONNECTOR
VOLTAGE

SELECT

SWITCH

AC POWER ]
CONNECTOR

Figure 9-13

9-20

Circuit Breaker, Voltage Select Switch, Connectors (Rear View)

BA123-A Enclosure

9.7

ELECTRICAL DISTRIBUTION

Figure 9-14 shows the electrical power distribution of the enclosure and the part
numbers of the power cables.

POWER

SUPPLY

(SEE NOTE 1)

ON/OFF

SWITCH

REGULATOR

JBA

17-00911-01

o] MASS-STORAGE DEVICES
L
& INSHELVES 3,4, AND
5

17-00865-01

JIA

BACKPLANE J1

(ODD-NUMBER SLOTS)
prce

s—c——

——

o—

REGULATOR

J8B
J9B

MASS-STORAGE DEVICES

| 17-00870-01

o] INSHELVES 1 AND 2
L

17-00865-01

# BACKPLANE J2

(EVEN-NUMBERED SLOTS)

T
T

17-00863-01
CARD CAGE FAN

J10

TEMPERATURE SENSOR | (SEENOTE 2)
PC BOARD

INTERLOCK

SWITCH

17-00864-01

MASS-STORAGE FAN

A CPOWER CORD
NOTES:
1 - (INCLUDES

THE ON/OFF SWITCH) 17-00859-01
17-00942-01

2 - (INCLUDES INTERLOCK SWITCH)

Figure 9-14

Electrical Distribution

9-21

BA123-A Enclosure

9.8

1/O DISTRIBUTION PANEL

External devices connect to the system through the rear I/O distribution panel of
the BA123-A enclosure. The rear door provides access to the I/O distribution panel
(Figure 9-15).

Each module that connects to an external device comes with an internal cable, a
filter connector, and an insert panel. Together, these three items are referred to
as a cabinet kit. Chapters 5 and 6 provide cabinet kit information for modules that
support external devices.

Filter connectors mount in the insert panels and the insert panels are installed in

cutouts in the I/O distribution panel (Figure 9-15). The CPU Serial Line Unit
(SLU) distribution panel insert is typically mounted in cutout A. Removable plates
cover unused cutouts. The BA123-A rear I/O distribution panel provides a place to
install up to ten insert panels, four of which can contain 50-pin connector insert
panels.

9-22

BA123-A Enclosure

o]
TYPE "B’

——]

TM
F

g
B

D
C

F
d

fF @

TYPE

A" —_|

YO Y[ ©® W

Hllo

\e /J\e/\e/)

Figure 9-15

Rear I/O Panel

The rear I/O panel has ten cutouts as follows:

e Four type A cutouts: 5 X 8.1 cm (.6 X 3.2 inches)

e Six type B cutouts: 5.7 X 8.1 cm (2.25 X 3.2 inches)

Insert panels correspond to the 1/O panel cutouts as follows:
e Type A: 2.5 X 10.2 cm (1 X 4 inches)

e Type B: 6.3 X 8.1 cm (2.5 X 3.3 inches)

In addition, a removable bracket post between the bottom two type B cutouts
allows for the addition of three more type A cutouts by installing an adapter plate
(DIGITAL P.N. 74-27720-01).

9-23

BA123-A Enclosure

Figure 9-16 shows typical type A and type B connectors, and the adapter plate.

ADAPTER
PLATE

REMOVABLE
BRACKET

POST

Figure 9-16

9-24

Filter Connectors and Adapter Plate

BA123-A FRU Removal and Replacement Procedures
10.1

INTRODUCTION

This chapter describes the removal and replacement procedures for the Field
Replaceable Units (FRUs) in the BA123-A enclosure (Table 10-1, Figure 10-1).
Table 10-1

BA123-A FRUs

Part Number

Description

17-00859-01

Switch, ac power to power supply, and cable from

17-00860-01

Cable, backplane to CPU console board

switch to power supply
54-16596-01

17-00862-01

CPU console board

Cable, signal distribution board to 4 RD consoles

17-00286-01

Cable, 20 conductor, RD drive
Cable, 40 conductor RD drive

54-16244-02

RD52 console

17-00282-01

17-00861-01

17-00867-01

70-22300-01
54-16674-01
12-23395-01

12-22271-01

17-00942-01
54-16665-01

17-00863-01

Cable, 50 conductor, RQDX to signal distribution board
Cable, signal distribution board to RX50

Cable, TK50-A/TQK50 interconnect
Signal distribution board (M9058)
Fan, 12.7-cm, 5-inch (card-cage)
Fan, 11.4-cm, 4.5-inch (mass storage)

Switch, door interlock, and cable from switch to

temperature sensor board
Temperature sensor board

Cable, power supply to card-cage fan and temperature
sensor

10-1

BA123-A FRU Removal and Replacement Procedures

Table 10-1

BA123-A FRUs (Cont.)

Part Number

Description

17-00864-01

Cable, power supply to mass storage fan

17-00865-01
17-00865-01
17-00870-01
17-00911-01
30-23616-01

70-22019-00

Cable, regulator “A” to backplane
Cable, regulator “B” to backplane
Cable, regulator “A” to 2 drives via 2 plugs
Cable, regulator “B”’ to 3 drives via 3 plugs
Power supply

Q22-Bus backplane, 13 slot, quad-height

NOTE

Unless otherwise specified, FRUs are replaced by reversing the

order of the removal procedures.

10-2

NV ,

‘ 4NV

BA123-A FRU Removal and Replacement Procedures

S YI JOVHOLS ie

10-3

BA123-A FRU Removal and Replacement Procedures

10.2

REMOVAL OF THE EXTERIOR PANELS

The exterior panels must be taken off before beginning most removal and replacement procedures. The following two sections describe the removal of these panels.
These sequences are referenced in the procedures that follow.
10.2.1

Removal of the Right-Side Panel

1. Turn the system off and unplug the ac power cord from the wall socket.
2. Open the rear door.

3. Loosen the captive screw that connects the right-side panel to the rear of the
enclosure frame (Figure 10-2).

4. Pull the bottom of the panel out. This releases it from two snap fasteners.
5. Lift the panel slightly to release it from the lip at the top of the frame and
remove the panel (Figure 10-3).

Figure 10-2

10-4

Right-Side Panel Unhooking

BA123-A FRU Removal and Replacement Procedures

Figure 10-3

Right-Side Panel Removal

10-5

BA123-A FRU Removal and Replacement Procedures

10.2.2

Removal of the Left-Side Panel

1. Turn the system off and unplug the ac power cord from the wall socket.
2. Open the control panel door.

3. Loosen the screw that connects the left-side panel to the front of the enclosure
frame (Figure 10-4).

4. Pull the bottom of the panel out. This releases it from two snap fasteners.

5. Lift the panel slightly to release it from the lip at the top of the frame and
remove the panel (Figure 10-5).

£l

\\;f

\,
Figure 10-4

10-6

Left-Side Panel Unhooking

BA123-A FRU Removal and Replacement Procedures

Figure 10-5

Left-Side Panel Removal

10-7

BA123-A FRU Removal and Replacement Procedures

10.3

ON/OFF SWITCH REMOVAL

1. Remove the left-side panel as described in Section 10.2.2.

2. Unplug the on/off switch cable from the power supply.

3. Remove the nut that holds the cable’s ground lead to the enclosure frame.
Disconnect the ground lead.

4. Press the top and bottom of the on/off switch and push the switch and its cable
out from the inside of the front panel (Figure 10-6).

Figure 10-6

10-8

On/Otf Switch Removal

BA123-A FRU Removal and Replacement Procedures

10.4

CPU CONSOLE BOARD REMOVAL

1. Remove the left-side panel as described in Section 10.2.2.

2. Disconnect the ribbon cable from the CPU console board (Figure 10-7).

3. Remove the two screws that hold the CPU console board assembly to the control panel.

4. Remove the board from the plastic brackets.

Figure 10-7

CPU Console Board Removal

10-9

BA123-A FRU Removal and Replacement Procedures

10.5

MASS STORAGE DEVICE REMOVAL

The following procedure applies to both removable- and fixed-media drives.
CAUTION

Handle any RX50 diskette drive, RD5n fixed-disk drive, and TK50
tape drive with care. Dropping or bumping a drive can damage
it.

Package any disk or tape drive to be returned in the replacement drive’s shipping
carton. If the fixed-disk drive shipping carton is not available, one may be ordered

(DIGITAL P.N. 99-90045-01). Make sure you insert the cardboard shipping card in

any diskette drive before transporting the drive.
NOTE

You must format a newly installed RD5n disk drive before testing the system and using the drive. Refer to Appendix C for
formatting instructions for your system.

. Remove both side panels as described in Sections 10.2.1 and 10.2.2.

. Pull the front panel straight out. This releases it from four snap fasteners
attached to the enclosure.

. Disconnect all signal cables and dc power cables from the device.

. Press the release tab below the front of the device and slide the device out of
the shelf.

Use the following procedure to install an RD52 or RD53 fixed-disk drive
1. Make sure the jumper clip on a replacement RD52 fixed-disk drive is set to

match the one you removed (Figure 10-8). Do not install a jumper clip on DSO;
this setting is reserved for RX50 diskette drives.

. Make sure you set the drive select switch on the rear of the read/write board of
a replacement RD53 disk drive to match the one that you removed.

. Reverse the removal procedure.

10-10

BA123-A FRU Removal and Replacement Procedures

= 3
FRONT OF DRIVE

o
1 5% 1,

1Epas

REAR OF DRIVE

[

Figure 10-8

TIT

RD52 Jumper Clip Setting

NOTE

Only format a fixed-disk drive when you replace a complete
RD5n drive assembly. Refer to Appendix C for instructions.

Before you format a newly installed fixed-disk drive, write-protect any other RDbn
disk drives that may be present. Remember to write-enable these additional RDo5n
disk drives when the formatting procedure is complete.

10-11

BA123-A FRU Removal and Replacement Procedures

10.5.1

RD52 Main Printed Circuit Board (MPCB) Removal

NOTE

Replace the Main Printed Circuit Board (MPCB) only on RD52

disk drives with a part number of 30-21721-02.

Screws located on the slide plate and MPCB are different sizes. Make sure you
reinstall the screws in their proper location.

1. Remove the four Phillips screws retaining the slide plate and ground clip. Set
the slide plate aside (Figure 10-9).

Figure 10-9

10-12

Slide Plate Removal

BA123-A FRU Removal and Replacement Procedures

2. Unplug the two-pin connector (Figure 10-10).

3. Remove the two Phillips screws that attach the front bezel to the drive.

Figure 10-10

Two-Pin Connector and Screw Removal

10-13

BA123-A FRU Removal and Replacement Procedures

4 Remove the front bezel by pulling it away from the drive. The bezel is held in
place with pop fasteners (Figure 10-11).

Figure 10-11

Front Bezel Removal

5. Remove the three Phillips screws from the heatsink, the grounding strip, and
the corner opposite the heatsink (Figure 10-12).

Figure 10-12

10-14

Removal of Phillips Screws from Heatsink

BA123-A FRU Removal and Replacement Procedures

6. Lift the MPCB straight up until it clears the chassis. This disconnects P4, a 12pin fixed plug (Figure 10-13).

7. Disconnect P5, a 10-pin connector.

Figure 10-13

Main Printed Circuit Board Removal

10-15

BA123-A FRU Removal and Replacement Procedures

10.5.2

RD53 Disk Drive Read/Write Board Removal

The RD53 read/write board is the only part of an RD53 drive that is replaceable.
Always try replacing the board before you replace an entire RD53 disk drive.
1. Remove the four Phillips screws retaining the slide plate and ground clip. Set
the slide plate aside (Figure 10-14).

2. Loosen the two captive screws holding the board in place.

4. Disconnect the motor control board connector J8 and the preamplifier board
connector J9 from the read/write board. Handle these with care.

5. Lift the read/write board out of the hinge slots.
NOTE

Be sure to set the jumpers and switches for the new board to
the same position as the old one.

10-16

BA123-A FRU Removal and Replacement Procedures

MOTOR CONTROL BOARD

READ/WRITE

BOARD SCREWS

PREAMPLIFIER BOARD
AND SHIELD

Figure 10-14

RD53 Read/Write Board Removal

10-17

BA123-A FRU Removal and Replacement Procedures

FAN REMOVAL

10.6

The following two sections list the procedures for removing the card-cage fan and

the mass storage fan. The fan in the power supply i1s not an FRU.
10.6.1

Mass Storage Fan Removal

1. Remove the left-side panel as described in Section 10.2.2.
NOTE

Observe the alignment of the fan and power cable before removing them. Be sure to align the replacement fan and the power
cable in the same direction.

2. Disconnect the dc power cable from the fan.

3. Remove the three screws that connect the fan’s metal base plate to the enclosure frame (Figure 10-15).

4. Remove the four screws that connect the fan to the metal base plate.

10-18

BA123-A FRU Removal and Replacement Procedures

Figure 10-15

Mass Storage Fan Removal

10-19

BA123-A FRU Removal and Replacement Procedures

10.6.2

Card-Cage Fan Removal

1. Remove the right-side panel, as described in Section 10.2.1.

2. Remove the card-cage door by releasing the two clasps at the front end of the
door and swinging the door open.

3. Slide the tray below the card cage partially out (Figure 10-16).

4. Note that the cable’s dc power plug is contoured to fit along the side of the fan.
Disconnect the cable from the fan. When replacing the fan, be sure to align the
cable the same way.

5. Remove the four screws that connect the fan to the tray.

10-20

BA123-A FRU Removal and Replacement Procedures

Figure 10-16

Card-Cage Fan Removal

10-21

BA123-A FRU Removal and Replacement Procedures

10.7

MODULE REMOVAL

1. Remove the right-side panel as described in Section 10.2.1.

2. Remove the card-cage door by releasing the two clasps at the front end of the
door and swinging the door open.
CAUTION

Static electricity can damage modules. Always use a grounded
wrist strap and grounded work surface when working with or
around modules.

3. Slide the module partially out of the backplane (Figure 10-17).

4. Disconnect the cables. Make note of the alignment of any cables attached to the
module.

5. Remove the module from the enclosure.
NOTE

Make sure the jumper and switch settings on the replacement
module match the settings on the module you removed.
Before removing a module from the backplane, be sure to note
the position of all modules and the alignment of any cables that
you disconnect.

When removing modules from the card cage, carefully but firmly pull the levers
that hold the module in place. When installing modules, make sure the levers latch
properly to seat the module in the backplane.
Remove and install modules carefully to prevent damaging module components,

damaging other modules, or changing the switch settings.
Replacement modules come wrapped in special antistatic packaging material. A
silica gel packet is also included to prevent damage from moisture. Use this antistatic packaging material and silica gel packet to protect any modules you store,
transport, or return.

10-22

BA123-A FRU Removal and Replacement Procedures

Figure 10-17

Module Removal

NOTE

If you install a dual-height module in slots 1 through 4 of the
backplane, install it in the AB rows. A grant continuity card is
not needed in the adjacent CD rows.

If you install dual-height modules in slots 4 through 12 of the
backplane, install a grant continuity card (M9407) or a second
dual-height module in the other two rows of the slot.

10-23

BA123-A FRU Removal and Replacement Procedures

10.8

DOOR SWITCH REMOVAL

1. Remove the right-side panel as described in Section 10.2.1.

2. Remove the card-cage door by releasing the two clasps at the front end of the
door and swinging the door open.

3. Disconnect the cable connecting the switch to the temperature sensor as shown
in Figure 10-18.

4. Remove the two screws that connect the switch to the side of the card cage and
remove the switch and the cable.
10.9

TEMPERATURE SENSOR REMOVAL

1. Remove the right-side panel, as described in Section 10.2.1.
2. Remove the card-cage door by releasing the two clasps at the front end of the

door and swinging the door open.

3. Disconnect the cable connecting the switch to the temperature sensor (Figure
10-18).
4. Disconnect the cable connecting the temperature sensor to the power supply.

5. Remove the temperature sensor from the four plastic brackets connecting it to
the enclosure frame.

10-24

BA123-A FRU Removal and Replacement Procedures

TEMPERATURE

DOOR INTERLOCK

SWITCH

‘:}, o

SENSOR

Figure 10-18

Temperature Sensor/Door Switch

10-25

BA123-A FRU Removal and Replacement Procedures

10.10

POWER SUPPLY REMOVAL

1. Remove the left-side panel as described in Section 10.2.2.

2. Disconnect the ac power cable at the rear of the system and all cables from the
power supply. Note the location and alignment of all cables attached to the
power supply.

3. Remove the four 1/4-turn fasteners holding the power supply to the enclosure
frame and remove the power supply (Figure 10-19).
CAUTION
Before installing a new power supply, verify that the voltage

select switch at the rear of the power supply is set for the correct ac voltage. Damage to the system could resuit if the switch
is not properly set.

10-26

BA123-A FRU Removal and Replacement Procedures

Figure 10-19

Power Supply Removal

10-27

BA123-A FRU Removal and Replacement Procedures

10.11

BACKPLANE REMOVAL

1. Remove both side panels, as described in Sections 10.2.1 and 10.2.2.

2. Slide all modules partially out of the backplane, including the signal distribution
board.

3. Remove the power supply as described in Section 10.10.

4. Remove from the enclosure frame the six screws that hold the metal plate
located between the backplane and the power supply.
5. Lift the metal plate and the backplane out of the back of the card cage (Figure
10-20).

6. Remove the screws that hold the metal plate to the backplane.
Use the following procedure to replace the backplane:
1. Insert the screws that hold the metal plate to the backplane.
2. Place the backplane and the metal plate at the back of the card cage.

3. Insert a module in the first and the last card guide of the card cage.
4. Align the backplane so that the two modules can be fully inserted into the

backplane. Insert the modules.

10-28

BA123-A FRU Removal and Replacement Procedures

5. Insert the six screws that hold the metal plate to the enclosure frame.
6. Check the alignment of the backplane by inserting all of the system modules in
their original slots.

7. Replace the power supply by reversing the procedure described in Section
10.10.

Figure 10-20

Backplane Removal

10-29

- BA123-A FRU Removal and Replacement Procedures

10.12
1.

FILTER CONNECTOR AND INSERT PANEL REMOVAL

Turn the system off and unplug the ac power cord from the wall socket.

2. Open the rear door.
3. Disconnect any cables attached to the filter connector. Note where the

cables

were attached.

. Remove the right-side panel as described in Section 10.2.1.

. Remove the card-cage door by releasing the two clasps at the front end of the
door and swinging the door open.
NOTE

Some of the internal cables that connect to the back of filter
connectors may not be keyed. Observe the alignment of the

internal cables. Make sure you reconnect them the same way.

. Disconnect any cables that connect the filter connector insert to modules inside
the enclosure.

. Remove the screws that hold the filter connector to the rear I/O panel (Figure
10-21).

. Remove the filter connector.

. Remove the four screws holding the panel insert to the rear I/O panel assembly
and remove the insert.

10-30

BA123-A FRU Removal and Replacement Procedures

REMOVABLE
BRACKET

POST

Figure 10-21

Filter Connector Removal

10-31

Appendix A

Configuration
A.1

CONFIGURATION RULES

When you configure a MicroPDP-11/23, MicroPDP-11/73, or MicroPDP-11/83 in a
BA23-A or BA123-A enclosure, you must consider the following factors:
e Module physical priority
e Backplane expansion space
e

Power requirement

e I/O distribution panel expansion space

e Module CSR addresses and interrupt vectors
NOTE

If the option has Q/CD jumpers, check the options documentation for the correct Q/CD jumper configurations. An incorrect

jumper configuration can cause damage.

A-1

Configuration

A.2

MODULE PHYSICAL PRIORITY

The order in which you place modules in the backplane affects system perform-

ance. Install modules according to the following rules:

e Install the KDF11-BF and KDJ11-BC, -BB CPUs in slot 1.

e Install the KDJ11-BF CPU in slot 2 or 3.

e Install MSV11-P memory module(s) following the KDJ11-BB, -BC CPUs.
e Install MSV11-] memory module(s) immediately prior to the KDJ11-BF CPU.
e Install any dual-height modules in the A/B rows of slots 1 through 3 (slots 1
through 4 in a BA123-A enclosure). No grant continuity card is necessary.

e Install dual-height modules in either the A/B or C/D rows of slots 4 through 8
(slots 5 through 12 in a BA123-A enclosure). The opposite row must contain

either another dual-height module or a grant continuity card (M9047 or G7272)

in rows A or C.

e Install modules following the CPU and memory using the sequence shown in
Table A-1.

The relative priority of these options is based on their preferred interrupt and
DMA priority.

A-2

Configuration

Table A-1

Order of Modules in the BA23-A and BA123-A Backplane

Order

Type of Device

Option

Module

Comments

Communications

DEQNA
DPV11

DRV11-]

M7504
M8020
M&8049

Ethernet
Synchronous
General purpose — no silos

DRV11-B

M7950

LPV11

M8027

Line printer

Communications

Tape controller

Disk controller

MSCP controller

DLVE1
DLV]J1
DZV11
DHV11
DMV11-M
DMV11-N
DUV11

M8017
M8043
M7957
M3104
M8053
MB8064
M7951

TQK25

M7605

TQK50

M7951

KLESI

M7740

RLV12

M8061

~ RQDX1

M8639

RQDX?2

Asynchronous — no silos

Asynchronous — no silos
Asynchronous — with silos
Asynchronous — with silos
Synchronous - DMA
Synchronous - DMA
Bisynchronous

Last occupied slot

M8639-YB

A-3

Configuration

A.3

BACKPLANE EXPANSION SPACE

‘The BA23-A backplane has eight slots available for you to install Q22-Bus compatible modules: the BA123-A backplane has 12 slots. The system configuration examples in this chapter show the slots occupied by modules and the number of open
slots remaining.

A.4

BA23-A AND BA123-A POWER AND CURRENT REQUIREMENTS

Use the configuration worksheets (Figure A-1 for BA23-A systems, Figure A-2 for

BA123-A systems) to keep track of the total current and power used to be sure
you do not overload the system. The current is measured at +5 and +12 Vdc. The
current and power requirements of each module must not exceed the limits shown
in Table A-2. Table A-3 lists the current drawn by the Q22-Bus for each module.
Table A-2

BA23-A Current and Power Limits

BA23-A Systems

BA123-A Systems

H7864-A power supply

30-23616-01 power supply

Current:
at +5 Vdc = 36 amps
at +12 Vdc = 7 amps

Power:

230 watts

230 watts maximum for each regulator.

H7864 power supply
Current:
at +5 Vdc

= 36 amps

at +12 Vdc = 6 amps
Power:
230 watts

A-4

Configuration

A.5

REAR I/O DISTRIBUTION PANEL

The BA23-A rear 1/O distribution panel contains two type A (1 X 4) and four type

B (2 X 3) cutouts for mounting I/O panel inserts. The BA123-A has four type A,

and six type B cutouts. You can convert the bottom two type B cutouts to provide

for three additional type A cutouts. Table A-3 lists the type of inserts used for
each module. Use the configuration worksheets (Figures A-1 or A-2) to keep track
of the number of available inserts for your system.

Table A-3

BA23-A Power Requirements, Bus Loads, I/O Panel
I/0 Inserts

Current

Power

Bus

LoadsA=1 X 4,

Option

Module

+5V +12 V (Watts)

B=2 X 3

KDJ11-BC
KDF11-BE
MSV11-PK
MSV11-PL
DEQNA-KP
DPV11-DP
DRV11-JP
DRV11-BP
DRV11-LP
LPV11-XP
DLEV1-DP
DLVJ1-LP
DZV11-DP
DHV11-AP

M&8190
M&189
MB8067-K
MB8067-L
M7504
M&8020
M8049
M7950
M7941
M8027
M&8017
M&8043
M7957
M3104

55
55
3.45

23
2.3
20
20
22
1.0
20
3.3
2.8
1.4
1.6
1.0
3.9
29

11
1.1
1.0
1.0
05
1.0
1.0
1.0
1.0
1.0
1.0
1.0
10
05

1XxB
1 XB
1xXA
1XA
2xA
2XxXA
2xA
1XA
1XA
1XB
1xB
1xB

DMV11-AP
DMV11-BP
DMV11-CP
DMV11-FP
DUV11-DP
TQK25-KA
TQK50
KLESI-QA

MS8053-MA
M8053-MA
MB8064-MA
MS8053-MA
M7951
M7605
M7546
M7740

3.6

3.5
1.2
1.8
1.9
0.9
0.8
1.0
1.0
1.2
4.5
34
34
3.35
34

1.2
4.0
2.2
3.0

0.1
0.1
0.5
0.3
1.5
0.25
0.39
055

0.38
0.38
0.26
038
0.39
-

28.7
28.7
17.25
17.5
23.5
9.6
9.0
9.5
4.5
4.0
23.0
8.0
10.7
29.1

21.6
21.6
19.9
21.6
10.7
20.0
11.0
15.0

20
20
20
20
30
20
20
2.3

10
1.0
10
1.0
1.0
1.0
10
1.0

1xB
1xA
1xB
2xA
1xA
1xA
1xA
1xA

A-5

Configuration

BA23-A Power Requirements, Bus Loads, I/O Panel (Cont.)

Table A-3

I/0 Inserts

Current

Power

Option

Module

RLV12-AP

M&8061

+5V 412 V (Watts)
26.2
0.10
50

RX50-AA
RD51-A
RD52-A
RD53-A
TK50-AA

—
—~
-

0.85
1.0
1.0
0.9
1.35

RQDX1
RQDX2

M8639-YA
M8639-YB

6.4
6.4

0.25
0.25
1.8
1.6
2.5
2.5
24

35.0
35.0

25.9
24.2
35.0
33.5
34.5

Bus

LoadsA=1 X 4,

=
-

—
—

20
20

1.0
1.0

B=2 X 3
1XxXA

1. Write the module and mass storage device name in the columns beside the
backplane slot and mass storage space numbers.

2. Refer to Table A-3. Enter the +5 V and +12 V currents, power and I/O panel
insert size for each module and mass storage device.

3. The column totals must not exceed the limits listed at the bottom.
NOTE

After you complete the worksheet for your system (Figure A-1 or

A-2), go to Section A.6 to continue configuring your system.

A-6

Configuration

ADD THESE COLUMNS
A

l
BACKPLANE
SLOT
1

MODULE

CURRENT (AMPS)
5V

+12V

36.0

7.0

;

POWER

/O PANEL INSERTS

(WATTS)

B (2
x 3)

A (1x4)

CD
AB

(621

CcD
AB

CD
AB

CD
MASS

STORAGE
2

TOTAL THESE

COLUMNS:
MUST NOT
EXCEED:

230

*|F MORE THAN TWO TYPE A FILTER CONNECTORS ARE REQUIRED, AN ADAPTER
TEMPLATE (PN 74-27740-01) MAY BE USED. THISWiLL ALLOW THREE ADDITIONAL
TYPE A FILTER CONNECTORS, BUT WILL REDUCE THE AVAILABLE TYPE B
CUTOUTS TO TWO.

Figure A-1

BA23-A Configuration Worksheet

Configuration

ADD THESE COLLUMNS

{

}

REGULATOR A

CURRENT
SLOT
1

MODULE|

+5 vDC

(AMPS)
|

REGULATOR B

POWER

+12VDC | (WATTS)

CURRENT
| | +5VDC

(AMPS)

vy
I/O INSERTS

POWER

(2 X 3)

(1 X4)

| +12VDC
| (WATTS) ||

CD
CD
CD|

CD
CD
CD

CD
CD
10

CD
CD

13 AB | SIGNAL

CD | DIST.

.52

MASS STORAGE

260
L

SHELF | DEVICE
5*

3
2
1

TOTAL THESE

COLUMNS:

—_

MUST NOT

EXCEED:

36A

*RECOMMENDED FOUR DRIVES

230W

36A

230W

MAXIMUM -TWO IN SHELVES 1 AND 2, TWO IN 3, 4 OR 5.

**IF MORE THAN FOUR 1x 4 1/0 PANELS ARE REQUIRED, AN ADAPTER TEMPLATE MAY BE USED.

Figure A-2

A-8

BA123-A Configuration Worksheet

4**

Configuration

MODULE CSR ADDRESSES/INTERRUPT VECTORS

A.6

Modules must be set to the correct CSR address and interrupt vector. Use Table
A-4 to determine the correct settings. You must observe the following rules:
e Check off all the options to be installed in the system.

e If there is a V in the vector column, the device has a floating vector. Assign a
vector to each option to be installed, starting at 300 and continuing in the
following sequence:

300, 310, 320, 330, 340, 350, 360, 370

e If your system contains a KDF11-B CPU module, the floating vectors begin at
310.

o If there is an F in the address column, the device has a floating CSR address.
Use Table A-5 to determine the correct addresses for these devices.
A.6.1

Floating CSR Addresses

Table A-5 shows the floating CSR address for some common combinations of
devices that require reconfiguration.

Check off all the devices in the system you want to reconfigure and find the
column in Table A-5 that makes the best match. In most cases, if you do not install
4 device listed in the middle of the column, the address of the device that follows
changes. Observe the following rules:

e Check the box for each module installed in the system.

e Find the column that corresponds to all the installed modules, where:
number = installed

*number = may be installed or not
NOTE

When an address is preceded by an asterisk (*), the address of
the following device(s) does not change.

o Assign the floating CSR address according to the numbers shown in Table A-5.
The address is 17760nnn. The numbers in the figure are the last three digits of
the address for the module.

A-9

Configuration

Address/Vector Worksheet

Table A-4

Option

Unit

Check Octal
Size in
if in

Module No.

SystemBytes Vector CSR Address (N=177)

MS8190

MSV11-PL
MSV11-PL
MSV11-PL
MSV11-PL

MS8067
M8067
M8067
M8067

1
2
3
4

DEQNA
DEQNA
DPV11
DRV11-JP
DRV11-JP

M7504
M7504
M8020
M8049
M8049

1
2
1
1
2

KDJ11-BC

10
10
10

~
-

N72100 start add.=0
N72102 start add.=512
N72104 start add.=1024

120
120
V
V
V

N74440
N74460
F
N64120
N64140

N72106 start add.=1536

DRV11-B

M7950

124

N72410

DRV11-B

M7950

N72420

LPV11

M8027

200

N77514

DLVE1

M8017

N75610
N76500

DLV]J1

M8043

DLV]J1

M8043

N76510

DZV11

M7957

DHV11

M3104

DMV11-CP

MS8064

DUV11

M7951

N60440

TQK25

M7605

224

N72520

TQK50

M7546

TQK50

M7546

260

N74500

260

N60404

KLESI-QA

M7740

154

N72150

RLV12

M8061

160

N74400

RQDX1,2

M8639

154

N72150

* The DLV]J1 vector can only be configured at 300, 340, 400, 440 etc. If the first available
floating vector is 310 (or 320, 330), set the DLV]J1 to 340 and the next device to 400.

NOTE
If a module has a floating vector and CSR address, additional

modules of the same type also have a floating vector and CSR

address.

A-10

Configuration

Substitute numbers below for the nnn in address 17760nnn to find the floating CSR
address.

Table A-5

Floating CSR Address Chart
Common

Option

Configurations

DZQ/V 1
DZQ/V 2
DZQ/V 3

100
*110
*120

DPV11

DMV11
2nd MSCP
2nd TK50
DHV11 1
DHV11 2

*¥270

*404

440
460

*270
334
*444
500
520

NOTE

*270

320
*354
*444
500
520

*444
500
520

100
*110

100
110
120

*310

*330

354

374
*504
540

500
520

100
*110

*310

340
374
*504
540

100
110
120
*330
360
414
504

If the system you wish to configure does not resemble any of
these common configurations, refer to the following list and Section A.9 for directions.

- Configuration

A.6.2

Floating Address Guidelines

The first DUV11 CSR address 1s 17760040.

The first DZV11 CSR address is 17760100 if no DUV11s are present.

The first DPV11 CSR address is 17760270 if no DUV11s or DZV11s are
present.

The first DMV11 CSR address is 17760320 if no DUV11s, DZV11s, or DPV11s
are present.

The first disk Mass Storage Control Protocol (MSCP) CSR address is always
17772150.

The second disk MSCP CSR address is 17760334 if no DUV11s, DZV11s,
DPV11s, or DMV11s are present.

The first tape MSCP CSR address is always 17774500.

The second tape MSCP CSR address is 17760404 if no DUV11s, DZV11s,
DPV11s, or DMV11s are present and no more than one DISK MSCP is present.
The first DHV11 CSR address 1s 17760440 if no DUV11s, DZV11s, DPV11s,
or DMV11s are present, no more than one disk MSCP is present, and no more

than one tape MSCP is present.

A-12

Configuration

A.7

CONFIGURATION EXAMPLES

The BA23-A and BA123-A enclosures can be used in a variety of configurations.

The following examples show typical base and advanced system configurations.
e

Section A.7.1 - BA23-A system configuration

e Section A.7.2 - BA23-A advanced system configuration
e Section A.7.3 - BA123-A system configuration

Section A.7.4 — BA123-A advanced system configuration

A.7.1

BAZ23-A System Configuration

Figure A-3 shows the cabling layout of a BA23-A base system in the following
sequence:

Backplane — cabinet kit — I/O distribution panel

Figure A-4 shows the backplane setup for a system that can be expanded at a later
time.
BACKPLANE
(54-71507)

M8190

| MBO67-LA

3 | M3104
4

CABINET
KIT

/O PANEL

EXTERNAL
CABLE

EXTERNAL
DEVICE

BC22D-10

| TERMINAL
NO. 2-5 |

CK-KDJ1B-KA

E=—]}—=——#{ TERMINALNO.1

cK -DHV11- A

1700861-01

| M8639-YB

3¢
20-PIN
17000282-01

V9058

34-PIN
17-000-286-01

{ RD52 i
Figure A-3

SIGNAL

DISTRIBUTION

BOARD

34-PIN
17-00867-01

! RX50 i
Cable Connections for a BA23-A System

A-13

Configuration

MASS STORAGE DEVICE:

RX50
RD52

BACKPLANE
SLOT NO.

ROW
B

KDJ11-BC (QUAD) CPU

MSV11-PL (QUAD) 512 KB MEMORY

DHV11 (QUAD) 8- LINE MULTIPLEXER

RQDX1 (QUAD) RD/RX CONTROLLER

[/O CUTOUTS
(STANDARD 1/0)
(223)
(1 ;4)
1
2

5
6
7
8

Figure A-4
A.7.2

BA23-A Backplane Setup for an Expandable System

BA23-A Advanced System Configuration

Figure A-5 shows the cabling layout for an advanced system configuration in the
following sequence:

Backplane — cabinet kit — I/O distribution panel — external cable — external
device

Figure A-6 shows the expandability of the BA23-A enclosure. It includes the following features:

1 Mbyte of main memory

1 RD52 fixed-disk drive

1 eight-line asynchronous multiplexer
A DEQNA module to connect to Ethernet
An LPV11 module for the LP25 printer
A TQKS50 tape drive for backup and restore

A-14

Configuration

BACKPLANE
i

/0 PANEL

[wsoo7.im

M8067-LA

4ab | M7504
dcd

Scd | M7546
A
|

|Cickoueka

[

8C22010

fFerwinar vy

]

CR DEORARA

+| H4000 TRANSCEIVER|

CRLPVAK

| LP25 PRINTER

TQRS0A8

> TK50 TAPE DRIVE

cKOHVITAA

M9047

sab | M8027

SEVICE

BC220-10 T

mse39-vB

20-PIN

SIGNAL DISTRIBUTION PANEL

34-PIN

1700282-0-0|

34-PIN

| 17-00286-00

17-00285-02

i RD5N !

Figure A-5
MASS STORAGE DEVICE:

Cable Connections for an Advanced Configuration
RX50
RDb2

BACKUP DEVICE:

TQKbO-AA

BACKPLANE

SLOT NO.
1

ROW

1/0 CUTOUTS

(STANDARD 1/0)

(1 x4)

23]
1

KDJ11-BC (QUAD) CPU

MSV11-PL (QUAD) 512 KB MEMORY

DEQNA NET (DUAL)

M9047 GRANT CARD

LPV11 PRT (DUAL)

TQK50 CONT (DUAL)

DHV11 (QUAD) 8 - LINE MULTIPLEXER

RQDX1 (QUAD) RD/RX CONTROLLER

Figure A-6

TOTAL USED:

AVAILABLE :

BA23-A Advanced System

A-15

Configuration

A.7.3

BA123-A System Configuration

Figure A-7 shows the cabling layout of a BA123-A base system in the following
sequence:

Backplane — cabinet kit — I/O distribution panel

Figure A-8 shows the backplane setup for a system that can be expanded at a later
time.

I/O PANEL

CABINET
KIT

BACKPLANE
(54-71507)

EXTERNAL
CABLE

EXTERNAL
DEVICE

BC22D-10

CK-KDJ1B-KA

= 1}—="——] TERMINALNO.1

3 | M3104

CK-DHV11-AA

—
J}—=""—"®!
TERMINAL NO. 2-5 |

|_1700861-01

mM8190

| M8067-LA

| wseag.vs

BC22D-10

5
6
7

SCD

20-PIN
17000282-01|

A-16

SIGNAL

le
——DISTRIBUTION
BOARD

34-PIN
|17-000-286-01

| RD52 l
Figure A-7

9058

34-PIN
|17-00867-01

i RX50 l

Cable Connections for a BA123-A System

Configuration

MASS STORAGE DEVICE:

RX50
RD52

I/0 CUTOUTS
(STANDARD 1/0)

ROW

BACKPLANE
SLOT NO.

;

KDJ11-BC (QUAD) CPU

MSV11-PL (QUAD) 512 KB MEMORY

DHV11 (QUAD) 8 LINE MULTIPLEXER

RQDX2 (QUAD) RD/RX CONTROLLER

a2
1
2

5
6
7

8
9
10

TOTAL USED:
AVAILABLE:

Figure A-8

0
4

w w

BA123-A Backplane Setup for an Expandable System

A-17

Configuration

A.7.4

BA123-A Advanced System Configuration

Figure A-9 shows the cabling layout for an advanced system configuration in the
following sequence:

Backplane — cabinet kit — I/O distribution panel — external cable — external
device

Figure A-10 shows the expandability of the BA23-A enclosure. It includes the
following features:
e

2 Mbytes of main memory

2 RD52 fixed-disk drives, providing 60 Mbytes of mass storage

2 eight-line asynchronous multiplexers, providing ports for 16 terminals

A DEQNA module to connect to Ethernet

A DPV11 module to connect to a modem
An LPV11 module for the LP25 printer

A TQK50 tape drive for backup and restore

A-18

Configuration

E::j___________g_chzzmo TERMINAL # 1

6AB | M8020

CK-DPV11-AA

6CD | M7504

CKDEANA
KA

Je——} & H4000 TRANSCEIVER|

7a8 | M8027

CLPVIAK

el (P25 PRINTER

Ims190

1 MBO67-LA

T M8067-LA

1 MBO67-LA

| MBO67-LA

1 vstos

§ M8639-YB

13CD | M9058

—

LLT—}

BC26L-25

#| MODEM

22D-1
-B22D19
plrepminac #10-17
|

= |

BCIEN09

CK-DHV11-AA

______j

17000286-01

EXTERNAL
DEVICE

CK-KDJ1B-KA

8 | M3104

34-PIN

EXTERNAL
CABLE

/O PANEL

CABINET
KIT

BACKPLANE
(54-71507)

SIGNAL

DISTRIBUTION
BOARD

20-PIN

17-000282-01

17000867-01

20-PIN

34-PIN

17000286-01

117000282-01

l RD52 l

l RX50 !

Figure A-9 BA123-A Cable Connections for an Advanced Configuration

A-19

Configuration

MASS STORAGE DEVICES:

RX50
RD52
RDb2

BACKUP DEVICE:

TAK50-AA

/0 CUTOUTS
(STANDARD 1/0)

BACKPLANE
ROW

BACKPLANE
SLOT NO.
R

KDJ11-B (QUAD) CPU

MSV11-PL (QUAD) 512 KB MEMORY

(1:4)

(223)

MSV11-PL (QUAD) 512 KB MEMORY

DPV11 COM (DUAL) DEQNA NET (DUAL)

LPV11 PRT (DUAL) TQK50 CONT. (DUAL)

DHV11 (QUAD) 8 LINE MUX.

RQDX2 (QUAD) RD/RX CONTROLLER

TOTAL USED:

AVAILABLE:
Figure A-10

A.8

BA123-A Advanced System

PREPARE THE SETUP TABLE AND THE OPERATING SYSTEM

When your system is fully configured:
e

Enter any devices you want to boot in the setup table (see Section 2.5.3).

Prepare your operating system.

To prepare your operating system to recognize the devices installed in the system,
perform a one time SYSGEN (system generation) of CONFIG (configure) operation.
Refer to the operating system software documentation for instructions.

A-20

Configuration

A.9

BLANK CONFIGURATION WORKSHEET (SAMPLE)

This section provides instructions and a sample worksheet for generating floating

CSR addresses for modules installed in Q-Bus systems. Samples are shown in Table
A-6 for the following systems:

Sample 1

CSR

Sample 2

CSR

Sample 3

CSR

DPV11
MSCP
DHV11

17760270
17760334
17760520

DZV11
DPV11
DMV11

17760100
17760310
17760340

1ST DZV11
2ND DZV11
3RD DZV11

17760100
17760110
17760120

DPV11
DMV11

17760330
17760360

DMSCP*
DHV11

17760374
17760540

DMSCP

17760414

TMSCPY

17760504

DHV11

17760540

* DMSCP - Disk Mass Storage Control Protocol Device.
TMSCP - Tape Mass Storage Control Protocol Device.

Table A-7 is a blank worksheet for you to copy and use when you determine the

configuration of a system.
A.9.1

Instructions

Use the following procedure for generating floating CSR addresses for Q-Bus
systems.

Table A-6 is ranked from 1 to 34 where rank one is the highest rank. The octal
value for each rank is located in the column labeled “Octal Size in Bytes.” Use the
following rules when you are adding octal values of 20 and 40.

A.9.2

Rules for Adding Octal Values of 20 and 40

1. When the octal value of a rank is 20, you can only enter an address of n00, n20,
n40 or n60. Enter the next possible address for that rank. See the examples in
Table A-6, at ranks 11 and 12, 23 and 24, and 30 and 31.

9 When the octal value of a rank is 40, you can only enter an address of n00 or
n40. Enter the next possible address for that rank. See the example in Table A6 at ranks 26 and 27.

A-21

Configuration

A.9.3
1.

Procedure

Find the highest ranking module with a floating CSR to be installed in the
system. Assign this module its first possible floating address. Table A-6 shows
the CSR address of installed modules in square brackets ([ ).

. If you are installing more than one module of the same type, assign a CSR
address to each additional module. Determine these CSR addresses by adding
the octal value for that module to the previous address you assigned.

Table A-6, sample 3, shows the CSR addresses for three DZV11 modules
installed in a system.

. Assign a “blank” value after the last module of each type that you install.
Determine the “blank’ value by adding the octal size value for that module to
the last address you have assigned for the module. “Blank’ values are shown in
braces ({ }) (see the entries at rank 8, Table A-6).
. Add the octal size value of the next lower rank to the “blank’ value and enter
the sum. This number becomes your new working number. Make sure you
observe the rules for octal values of 20 and 40.
. Add the octal size value for each rank as you move down the list to the next

module you are installing in your system. Observe the rules for octal values of
20 and 40.
. If the sum of your working number and the next octal size value exceeds n74,
the next entry starts the next block of 100s. For example, if the sum equals
280, your next entry is 300.
A.10

BLANK WORKSHEET

Use Table A-7 to configure your system if it does not match the common configurations shown in Table A-5.

A-22

Configuration

Sample Worksheet for Generating CSR Addresses

Table A-6

First

Rank
No.

Module
1
2
3
4
5
6
7

First
Fixed

Address

DUVI11 n/a

8 DZV11 n/a
9
10
11
12
13
14
15
16
17
18
19
20
21

17774400

17777170

22 DPV11 n/a
23

24 DMV11 n/a
25

26 DMSCP 17772150

Possible
Floating

Octal
Size in

Address

Bytes

17760010
17760020
17760030
17760040

10
20
10
10

17760050
17760060
17760070

10
10
10

17760110
17760120
17760130
17760140
17760150
17760160
17760200
17760210
17760220
17760230
17760240
17760250
17760260

10
10
10
20
10
10
20
10
10
10
10
10
10

17760300

Sample 1

Sample 2

Sample 3

[100]{110} [100]{110} [1201{130}

[2701{300} [310]{320} [330]{340}

17760320

320

17760334

17760100

17760270

17760330

310

330

120
130
140
160
170
200
220
230
240
250
260
270
300

140
150
160
200
210
220
240
250
260
27
300
310
320

330

350

370

410

[340]{360} [360]{400}

[3341{340} [374]{400} [414]{420}

27
28
29

17760340
17760360
17760400

40
20
20

400
420
460

440
460
500

17760420

500

520

33
34

17760500
17760540

30 TMSCP 17774500
32 DHV11 n/a

17760404

17760440

40
40

464

504

[5041{510}

[5201{540} [5401{560} [5401{560}
600
640

600
640

A-23

Configuration

Table A-7

Rank No.
Module

Blank Worksheet for Generating CSR Addresses

First Fixed
Address

First Possible
Floating Address

Octal Size in
Bytes Sample

17760010

17760020
17760030
17760040
17760050

20
10
10
10

17760060

7
8
9

17760070
17760100
17760110

10
10
10

17760120

17760130

17760140

1
2
3
4
5

DUV11

DZV11

n/a

17760150

17760160

17760200

17760210

17760220

17774400

17777170

17760230

17760240

17760250

17760260

n/a

17760270

17760300

n/a

17760320

17760330

17772150

17760334

4
40

22 DPV11
23

24 DMV11
25
26 DMSCP
27

17760340

17760360

17760400

17760404

30 TMSCP

17774500

32 DHV11

n/a

17760420

17760440

17760500

17760540

A-24

Appendix B

The PDP-11/23 PLUS System
B.1

IDENTIFYING A PDP-11/23 PLUS SYSTEM

The PDP-11/23 Plus system contains a KDF11-BA CPU mounted in a BA11-5
enclosure. The KDF11-BA (M8189) has diagnostic bootstrap ROMs, 23-339E2 and
23-340E2 installed. On startup, the system does a self-test and enters Octal
Debugging Technique (ODT).

B.2

UPGRADING A PDP-11/23 PLUS SYSTEM

A KDF11-BA CPU can be field upgraded to MicroPDP-11/23 operation (KDF11-BE
or BF) by installing new ROMs and changing jumpers.
B.3

FACTORY CONFIGURATION

Table B-1 shows the factory configuration of switches E102 and E114. Table B-2
shows the factory jumper configuration of the KDF11-BA and the jumper differences between the KDF11-BA and the KDF11-BE.

B-1

The PDP-11/23 PLUS System

Table B-1
Switch S1

KDF11-BA Factory Switch Configurations

Number

(E102) Setting

Bootstrap/Diagnostic Control Function

1
2
3

On
On
Off
On

Execute CPU diagnostic
Execute memory diagnostic
DECnet boot disabled
Console test and dialog

Off

6
7
8

Off
On
Off

RLO2 bootstrap program
~

LD DD

Off

CO =3 O

Switch S2 (E114) SLU Baud Rate Speed Select

Off

Second SLU baud rate

Off

9,600

Console SLU baud rate

Off

9,600

Off

On = one = closed
Off = zero = open

B-2

The PDP-11/23 PLUS System

Table B-2

KDF11-BA Factory Jumper Configuration

Jumper

State

Function

J4 to J5

Disables CPU HALT from console SLU break.

J18 to J19

J6 to J7
J8 to J9

In
In

For manufacturing use.
For manufacturing use.

J20 to J21

For manufacturing use.

J29 to J30

CPU power-up mode = boot from location
773000.

J22 to J23*
J26 to J27

J34 to J35

J37 to J38
J42 to J43*

J45 to J46*

In
In

ROMs are used (J23 to J24 must be removed).
Connects output of console serial line driver to
serial line.

One stop bit for console SLU port.

Connects LINMF(1)H to console SLU UART
reset input.

In
In

One stop bit for second SLU port.
On-board baud rate generator controls console
SLU baud rate. External clock input from

connector J1 is disabled.

On-board baud rate generator controls second
SLU baud rate. External clock input from

connector J2 is disabled.

W1
W2

In
In

Provides grant continuity for BIAK signal.
Provides grant continuity for BDMG signal.

* These jumpers are out for a KDF11-BE and -BF module. See Chapter 3 for more
information.

All other jumpers are out.

B-3

The PDP-11/23 PLUS System

B.4

JUMPER SWITCH FUNCTION DESCRIPTION

Tables B-3 to B-9 describe the function of the KDF11-BA jumpers and switches.
Table B-3

Break on Halt Jumper Configurations

Jumpers
J3 to J4

J4 to J5

Break on Halt
Feature

Out

Enabled

Out

Disabled

Stake J3 = DL1 FE H

Stake J4 = RQ HLT H
Stake J5 = ground
In = inserted

Out = not inserted

Table B-4

On-Board Device Selection Jumpers

Stake Number

Stake Name

Function

J10

Ground

Ground for other wire-wrap stakes.

J11

LTC ENBJ L

When grounded, the line clock interrupt

enable flip-flop 1s set, and the LSI-11 bus
BEVENT signal, not dependent on any

other conditions, requests program
interrupts.
J12

DL2 ADRJ L

When not grounded, the second SLU
device and its vector addresses are as

follows.
Device Address Interrupt Vector

RCSR 17776500 Receiver 300
RBUF 17776502

XCSR 17776504 Transmitter 304
XBUF 17776506

B-4

The PDP-11/23 PLUS System

On-Board Device Selection Jumpers (Cont.)
Stake Number

Stake Name

Function

When grounded, the device and vector
addresses are as follows.
Device Address Interrupt Vector
RCSR 17776540 Receiver 340
RBUF 17776542

XCSR 17776544 Transmitter 344
XBUF 17776546

DL2 DISJ L

When grounded, second serial line
registers are disabled. When not
grounded, device and vector addresses
for the second SLU are determined by

the status of jumper DL2 ADR]J L.
DL1 DISJ L

When grounded, console serial registers
are disabled. When not grounded, the
device and vector addresses for the
console SLU are as follows.

Device Address

Interrupt Vector

RCSR 1777560

Receiver 060

RBUF 1777562

XCSR 1777564

Transmitter 064

XBUF 1777566

If DL1 DISJ L is grounded, the break on
halt feature must be disabled.
BDK DISJ L

When grounded, the boot/diagnostic
ROMs, and the line clock registers are
disabled.

B-5

The PDP-11/23 PLUS System

Table B-5

Halt/Trap Jumper Configuration

Processor

Jumper

Mode

Out

Kernel

User

Function

Processor enters console ODT microcode

when it executes a HALT instruction.

Processor traps to location 10(8) when it
executes a HALT instruction.

HALT instruction decodes results to

location 10(8) in a trap regardless of the
status of the halt/trap jumper.

In = nserted

Out = not inserted
X = does not matter

Table B-6

Power-Up Mode Jumper Configurations

Jumpers
J17 to J18

J18 to J19

Mode
Number

Mode Name

Out
In
Out
In

Out
Out
In
In

0
1
2
3

PC@24, PC(@26
Console ODT
Bootstrap
Extended Microcode

In = mnserted

Out = not inserted

B-6

The PDP-11/23 PLUS System

ROM or EPROM Jumper Configurations

Table B-7

Memory Type

Jumper

Installed

From

ROM

EPROM

J22

J23

QOut

J23

J24

Out

Function

Connects +5 Vdc to pin 21 of
the two ROM sockets.

Connects BTRA 13 H to pin 21

of the two ROM sockets.

In = inserted

Out = not inserted

Table B-8

SLU Character Format Jumper Configurations

Console SLU

Second SLU

Character Format Selected

from Stake

J367T

J287

In*
Out

Parity check enabled
Parity check disabled

J37
In*
Out

J29
In*
Out

One-stop bit
Two-stop bit

J397

J317

In*
Out

7-bit characters
8-bit characters

J40
In*
Out

J32
In*
Out

Odd parity if J36(28) is in
Even parity if J36(28) is in

In*
Out

In = inserted

Out = not inserted

* Stake J38 is ground. When a jumper is in, it is connected from the named stake to J38.
T If J39(31) to J38 is out selecting 8-bit characters, J36(28) to J38 controlling parity must
be out.

B-7

The PDP-11/23 PLUS System

Switch S2 (E114) SLU Baud Rate Speed Select

Table B-9

Baud
Rate

Console SLU
S2-2
S2-1

50
75

On
Oft

On
On

S2-3

S2-4

Second SLLU
8S2-6
S2-5

On
On

On
On
On
On

On
Off
On
Off

On
On
On
On
Off
Off
Off
Off
Off
Off
Off
Off

Off
Off
On
On
Off

On
On
Off
Off
Off

Oftf
On
Oft

Off
On
On

2,400

Off

3,600
4,800

Off
On

Off

On
Off

7,200
9,600%*
19,200

Oft
On
Off

On
Oft
Off

Off
Off
Off

110
134.5
150
300
600

On
Off
On
Off
On

1,200
1,800
2,000

On = one = closed
Off = zero = open

* Standard baud rate set by manufacturing.

B-8

S2-7

S2-8

On
On

Off
Off

On
On
On
On

On
Off
On
Offt
On

On
On
Oft
Off
On

Off
Off
Off
Off
On

On
On
On
On
Off

Off
On

On
Off

Off
Off

Off

Off
On
Off

On
Off
Off

On
On
On
Off
Off
Off
Off

Off

Off
Off
Off
Off

The PDP-11/23 PLUS System

B.5

BA11-S ENCLOSURE

The BA11-S enclosure is both a mounting box and an expander box designed for
use with the PDP-11/23 PLUS system and extended LSI-11 (Q22-Bus) modules.
The BA11-S enclosure mounts in a standard 48.3-cm (19-inch) wide equipment
rack.

Each BA11-S enclosure comes with two cooling fans (a 70-CFM (Cubic Feet per
Minute) fan cools the logic boards and a 100-CFM fan cools the power supply), an
H403-B ac input unit, a power supply, and a nine-slot backplane that accepts both
dual- and quad-height Q22-Bus modules (Figure B-1). The terms extended LSI-11

and Q22-Bus are used synonymously. The term Q22-Bus is used in the rest of this
chapter.
FANS

H403-8
AC INPUT

H7861 POWER SUPPLY

BEZEL ASSEMBLY
PRINTED CIRCUIT BOARD

BOX

(70 CFM)

(100 CFM)

CARD FRAME ASSEMBLY

H9276 BACKPLANE

Figure B-1

BA11-S Major Assemblies

The BA11-S enclosure is available for both 120 V and 240 V systems. Either a

front bezel equipped with operating switches and indicators, or a blank front bezel
(for expander box use) is available.

B-9

The PDP-11/23 PLUS System

B.6

BA11-S SPECIFICATIONS

Dimensions (Including Bezel)

Width

48.3 cm (19 1n)

Height

13.2 ¢cm (5.19 1n)

Depth

(Without mounting

brackets)

57.8 cm (22.75 1n)

Environmental Conditions

Operating Temperature®

5° to 60°C (41° to 140°F)

Operating Humidity

10% to 95%, with a maximum wet bulb temperature of
32°C (90°F) and a minimum dew point of 2°C (36°F)

Input Voltage

BA11-SA, SC, SE

120 Vac

BA11-SB, SD, SF

240 Vac

Input Current

BA11-SA, -SC, -SE

6 A max.

BA11-SB, -SD, -SF

3 A max.

Output Voltage

+5Vat2Ato35A

+12 Vat0.0Ato5A
When the equipment is being operated at the maximum allowable temperature, air
flow must maintain air temperature rise to a maximum of 7°C (44.5°F).

The maximum allowable operating temperature is based on operation at sea level. Reduce
the maximum operating temperature by a factor of 1.8°C/100 m (1.0°F/100 ft) for opera-

tion at higher altitude sites.

B-10

The PDP-11/23 PLUS System

B.7

BA11-S DESCRIPTION

Figure B-2 shows the BA11-S with the enclosure cover removed. The ac input box,
power supply, and H9276 logic assembly (which includes the fans and the backplane) attach to the enclosure base. The front bezel attaches to the power supply.
The power supply assembly is hinged to the base and can be swung open to expose
the internal components.

The complete assembly can be removed from the base and replaced. The H349 1/O
distribution panel drops down to allow installation of Q22-Bus modules in the
backplane.

H9276B LOGIC ASSEMBLY

S
CARD FRAME,
(INCLUDE
AND FANS)
BACKPLANE,
H403B

AC INPUT BOX

FRONT BEZEL

Figure B-2

BA11-S Enclosure with Cover Removed

The PDP-11/23 PLUS System

When the enclosure is mounted in an equipment rack, the cover attaches to the
rack with mounting hardware. The enclosure base slides into the rackmounted
cover. A restraint cable attaches between the H403-B ac input box and the rack
frame to prevent the base from being pulled completely out of the cover.
B.7.1

Controls

The BA11-S enclosure can have either a blank front bezel or one equipped with a
control panel that consists of three switches and three indicators. Figure B-3 shows

the front bezel switches and indicators (the spare indicator is not used by
PDP-11/23 PLUS systems). Table B-10 lists the switches and indicators and
describes the function of each.

Q\) dlilgliltiall

C%)

\\ PWR ! OK

RUN

Figure B-3

B-12

\
SPARE

/
RESTART

/
.. /}
AUX ON
HALT

Front Panel Switches and Indicators

The PDP-11/23 PLUS System

Table B-10

BA11-S Front Panel Controls and Indicators

Controls/
Indicators

Function

AUX ON/OFF

Can be used for any needed function (switch 1s rated at
48 Vdc, 1 A). Two specific functions follow:
When the BA11-S is wired to control system power,
the AUX switch turns the power on and off.

When the BA11-S is not wired to control system
power, the switch can control the LTC signal, disabling
the signal when the switch is in the off position.
HALT

In the down position, the HALT switch forces the CPU
to suspend usual program execution, enables console
ODT microcode operation, and permits singleinstruction execution.

To continue program execution, return the HALT
switch to the up position and enter a P command from
the console terminal. Refer to the Microcomputer
Processor Handbook for a description of console ODT
commands.

RESTART

When you press the momentary RESTART switch, the
CPU automatically carries out a power-up sequence.

You can then reboot the CPU from the front panel.
PWR OK

The PWR OK indicator is lit when the power supply 1s
generating the correct dc voltages.

RUN

The RUN indicator is lit when the CPU is executing
programs.

In addition to the front panel switches and indicators, there is an on/off switch and

a primary voltage selection switch, both on the ac input box.

If you use a power controller to apply primary power to the BA11-S enclosure, the

on/off switch stays in the on position.

If a power controller is not used, you can use the switch to turn power on and off.

B-13

The PDP-11/23 PLUS System

Bezel Assembly Printed Circuit Board

B.7.2

The bezel assembly printed circuit board (Figure B-4) contains four jumper positions: W1, W2, W3, and W4. The factory configuration has jumpers inserted 1n
positions W1, W2, and W4; W3 is left blank. Table B-11 describes the condition
under which jumpers can be inserted or removed.
SIDE 2

o
Wio--0

W2o -0

‘

o -0 -0

(@]

SWITCH CONTACTS
(S3,S2, S1)

(RUN, PWR OK)

°©

Figure B-4
Table B-11

LED CONTACTS

NOTES:

1. VIEW IS FROM THE REAR OF THE BEZEL
WHEN THE BOARD IS MOUNTED ON THE
BEZEL.

2. JUMPERS ARE MOUNTED ON SIDE 1.

Bezel Assembly Printed Circuit Board

Bezel Assembly Jumpers

Jumper

Jumper(s) In

Jumper(s) Out

W1, W2

When the bezel AUX ON/OFF
switch 1s used to control the
power supply-generated LTC

When the bezel AUX ON/OFF
switch is used to turn the system

power controller on and off.

signal. (When the switch 1s in

the AUX ON position, LTCinitiated interrupts are enabled.

When the bezel 1s to be

When the bezel 1s part of the

mounted on an expander box.

main box containing the CPU.

(W3 permits the HALT switch
to light the RUN indicator.)
W4

When the bezel i1s part of the

When the bezel is mounted on an

main box. (W4 enables the S

expander box.

RUN L signal to light the RUN
indicator.)

The PDP-11/23 PLUS System

The bezel assembly attaches to two brackets mounted on the power supply frame.
Figure B-5 shows the bracket on the right front side and the hardware that holds
the bezel to the bracket. Do not open the power supply to remove the bezel
assembly; it is shown open in Figure B-5 for illustration purposes only.

BEZEL ASSEMBLY

MOUNTING BRACKET

BEZEL ASSEMBLY

PRINTED CIRCUIT
BOARD

/ BEZEL ASSEMBLY
MOUNTING HARDWARE

Figure B-5

B.7.3

Bezel Assembly

Ac Input Box (H403-B)

The ac input box is located in the rear of the BA11-S enclosure and 1s bolted to
both the base and the door assembly. Power to the H403-B comes from the ac
mains by either a 120 V line cord or a 240 V line cord.

The ac input box (Figure B-6 ) includes an ac mput connector, a circuit breaker,
and a line filter. It also includes a voltage select switch that makes the correct
connections to the fans and the power supply for both the 120 Vac and 240 Vac
line voltages.

B-15

The PDP-11/23 PLUS System

VOLTAGE

SELECT
SWITCH

RESTRAINING

a—

CABLE STUD

Figure B-6

o &

BA11-S Voltage Selection Switch

The output of the box is taken to the fans and the power supply by an ac power
harness. Connectors P1 and P4 of the harness are 12-pin and 9-pin connectors in
that order. P2 and P3 are molded ac plugs that break out of the harness to plug
into terminals on the fans.
B.7.4

H7861 Power Supply

The H7861 power supply is located on the front of the BA11-S enclosure. It
attaches to the enclosure with two screws and two hinges. When you remove the
two screws, you can tip open the power supply on the hinges, allowing access to
the printed circuit boards mounted within the power supply.
To remove the power supply, remove the screws, unlatch the hinges, and discon-

nect a maximum of four cables (three, if a blank front panel is used).
Refer to Table B-12 for H7861 power supply specifications.

B-16

The PDP-11/23 PLUS System

Table B-12

H7861 Power Supply Specifications

Item

Current Rating

Specifications

55 A at 120 V rms
2.7 A at 240 V rms

Inrush Current

100 A peak, for Y2 cycle at 128 V rms or 256 V rms

Apparent Power

630 VA

Power Factor

The ration of input power to apparent power shall be
greater than 0.6 at full load and low mput voltage

Output Power

+5 Vdc 150 mV, at 36 A (a minimum of 2 A of +5
Vdc power must be drawn to ensure that the +12 Vdc
supply regulates correctly)

Power Up/Down
Characteristics

+12 Vdc, at £360 mV, at 5 A

Static performance
Power up

BDCOK H goes high: at 75 Vac
BPOK H goes high: at 85 Vac

Power down

BPOK H goes low: at 80 Vac
BDCOK H goes low: at 75 Vac

Dynamic performance
Power up

3 ms (min.) from dc power within specification to
BDCOK H asserted

70 ms (min.) from BDCOK H asserted to BPOK
asserted

Power down

4 ms (min.) from ac power Odd to BPOK H negated
4 ms (min.) from BPOK H negated to BDCOK H
negated

5 us (min.) from BDCOK H negated to dc power out of
specification

B-17

The PDP-11/23 PLUS System

Three printed circuit boards contain all the power supply components. The control

board and the power monitor board are installed in connectors on the master

board.

B.7.4.1 Control Board - The control board circuits monitor the regulated output voltages from the master board, compare them to reference voltages, and feed
them back to the main converter. If either regulated voltage varies, the appropriate
control circuit varies the duty cycle of the rectangular-wave as needed. Adjustment
potentiometers are provided in each control circuit.

The signals generated on the control board are sent to the backplane and to the
front bezel assembly by two different cable assemblies.

B.7.4.2 Power Monitor Board — The power monitor board generates the BPOK
H and BDCOK H signals that enable the CPU to carry out specific power-up and
power-down operations. A clock generator produces the line-time clock signal. This
signal generates vectored (at the line frequency) at the CPU.
B.7.4.3

Master Board - The H7861 power supply master board contains an ac

input circuit, the +5 V and +12 V regulators, and a +12 V start-up supply. The ac
input includes a thermostat that protects the supply from too much heat. The

regulated dc voltages generated on the master board are sent to the H9276 backplane through a dc harness that connects on both ends to screw terminals.
B.7.5

H9276 BACKPLANE

The H9276 backplane accepts both dual- and quad-height modules and contains

nine slots of four rows of connectors each. Rows A and B of each slot supply the
Q22-Bus signal. The pins of the C and D rows are not bussed; however, the pins of
adjacent slots are connected.
The backplane supports Q-Bus modules that support 18-bit and 22-bit addressing.
There are three jumpers (Figure B-7) on the H9276 backplane; W1, W2, and W3.
Table B-13 summarizes the jumper settings.

B-18

The PDP-11/23 PLUS System

AC CABLE CONNECTOR

Figure B-7

Table B-13

H9276 Backplane Jumpers

H9276 Backplane Jumper Settings

Jumper

Jumper(s) In

When the H7861 power-

Jumper(s) Out

When the line time clock should not

supply-generated LTC signal source BEVENT L, such as when an
is used to assert the Q22-Bus external source is used instead
BEVENT L signal (inserted
for CPU box)

W2, W3

Usually unused

Unused

B-19

The PDP-11/23 PLUS System

When a BA11-S enclosure is used in multiple-box systems, the W1 jumper must be
inserted in the backplane of the first box in the system, and removed from all
others.

B.7.6

H349 1/O Distribution Panel

External devices connect to the PDP-11/23 PLUS through the rear H349 I/O
distribution panel mounted on a BA11-S enclosure (Figure B-8).

REAR VIEW

[
O CABLE
IO

CABLE

T (TO LOWER DRIVE)
| RLO2
DRIVE
0

| circuIT

BREAKER

DISTRIBUTION
PANEL

]

(SEE FIGURE
3-4)

CONSOLE

CONNECTOR

|l L —+— TERMINATOR

SHIPPING

BRACKET

RLOZ

DRIVE

ON
OFF

FROM DRIVES

ANDPDP]]Q3B\\\\

DC POWER CONTROL

MAN

q:{i:]

PWR CORD

TO LOCAL
POWER

Figure B-8

B-20

AC INPUT

PgneR

ore

DEMOTE Q) ooeht

]fll //

\lfl

ACCIRCUIT

MONITOR

BREAKER

LAMP

(TO FRONT PANEL)

1 874POWER
L4l

CONTROLLER

PDP-11/23 PLUS System (Rear View)

The PDP-11/23 PLUS System

The following terms, which appear in other documents, are interchangeable with
the term “I/O distribution panel.”
o

Bulkhead

/O Connector Panel

Connector Panel

Patch and Filter Panel

Distribution Panel

Filter Connector Panel

B.7.6.1 Insert Panels and Filter Connectors - The H349 I/O distribution
panel has 10 cutouts that provide a place to install up to 15 insert panels (Figure
B-9). Mounting locations J6 and J7 accommodate the two KDF11-BA or KDF11-BF
serial line connectors (one assembly).

DVP11

DRV11-J

G
DLV11-J

2
-

&<
KDF11-B—

|J7

J6|

MXV 11

CONSOLE

B/C

J11

|
/

CONNECTOR

?DZVH

____@/_C________B_/_C_____

'B/C

J13~——~~B-/—C———— J14————B/—C———— J15~———BLC—~——
__BIC
B/C

]

Figure B-9

BCc

B/C

LB/C
B/C

H349 I/O Distribution Panel

B-21

The PDP-11/23 PLUS System

The mounting locations accept nine type A, 40-pin or 50-pin filter connectors and

four type B, four-channel EIA insert panels (Figure B-10). There is one large
opening for a variety of user applications.
NOTE

Cover plates must be installed over unused openings on the 1/O
distribution panel to prevent RF leakage.

TYPE B

DLV1J-LP CONNECTOR ASSEMBLY
WITH FOUR D-SUBMINIATURE FILTER
CONNECTORS

DZV11-DP FILTER CONNECTOR
ASSEMBLY WITH FOUR
D-SUBMINIATURE FILTER
CONNECTORS

TYPE A
X
50-PIN FILTER CONNECTOR

Figure B-10
B.7.6.2

E
JILEH
40-PIN FILTER CONNECTOR

Filter Connectors and Filter Connector Assemblies

Internal Cables — The PDP-11/23 PLUS system uses 76.2-cm (30-inch)

internal cables to connect the option modules to the inner side of the I/O distribution panel. System options purchased for the PDP-11/23 PLUS are supplied with

the correct cable length for internal connections.

B-22

The PDP-11/23 PLUS System

B.7.6.3 External Cables — To comply with FCC regulations, all cables exiting a
PDP-11/23 PLUS system must be shielded cables connected to filter connectors on
the I/O distribution panel.

B.8

MODULE AND FILTER CONNECTOR INSTALLATION

To access the rear of the H349 I/O distribution panel and install modules and filter

connector assemblies, use the following procedure:

o Switch off the PDP-11/23 PLUS system and unplug it from its wall outlet or
power controller.

e Open the 1/O distribution panel with a Ya-inch key and swing it to expose the
inside of the I/O distribution panel.

e Install any options in the backplane and corresponding filter connector assem-

blies in the I/O distribution panel. Refer to Chapters 5 and 6 or documentation
provided with the options for details.

e Connect the internal option cable(s) from each option module to the rear of the
I/O distribution panel as diagrammed in Figure B-11.

e Connect any shielded ground wires, if present, to the chassis ground studs.
OPTION MODULE
BACKPLANE
PERIPHERAL
)2

SYSTEM

UNIT

OPTION
CABLE
H349 BULKHEAD
PANEL

FILTER

CONNECTOR

PDP-11/23 PLUS CABINET

Figure B-11

PDP-11/23 PLUS Internal Cabling

B-23

The PDP-11/23 PLUS System

Figure B-12 shows how a PDP-11/23 PLUS system may look when cabled to a

printer and a video terminal, plus the routing of the I/O and power cables.

VIDEO TERMINAL

)

B-24

O
O

PDP-11/23 PLUS External Cable Routing

—

Figure B-12

s e A (S S S 2 . S

———

——

T iW

PRINTER

C.1

PROCEDURE

Before you start formatting a MicroPDP-11 system, make sure you write-protect
any other fixed-disk drives present in the system.

User responses in this procedure are shown in color.

Insert the Field Service Test Diskette 4 (CZXD4D0) in drive 1. Press the Return
key

Type R ZRQB?? after the . (period) prompt. Press the Return key.

This runs the diagnostic program. The question marks allow any revision of the
program to be used. When formatting an RD52 make sure you have Version CO or
later. Earlier versions format the RD52 as though it is an RD51 (11 Mbytes).
A response similar to the following appears on the terminal:
DR>

You must respond to this prompt with a command to run the program. Type
START. Press the Return key. Then, answer the following questions.
CHANGE HW (L)?

This is a program that answers hardware questions and is prebuilt to format unit 0
with default answers. Type N (no) and press the Return key.
CHANGE SW (L)

This program answers software questions. Type N and press the Return key.

C-1

Formatting a MicroPDP-11 System

ENTER DATE (in mm-dd-yy format) (A)?

Type the current date. For example, 06-15-85. Press the Return key.
ENTER UNIT NUMBER TO FORMAT <0>

This is usually either drive unit 0 or 1. Answer 0 if you are formatting the fist
fixed-disk drive installed on the system; answer 1 if you are formatting the second
disk drive installed on the system.

Type O or 1. Press the Return key.

USE EXISTING BAD BLOCK INFORMATION?

This activates the reformat mode — reads the manufacturer’s information on the
disk and cylinder.

Type Y (yves). Press the Return key.
NOTE

The program takes approximately 12 minutes to format an RD51,
and approximately 30 minutes to format an RD52, or RD53. The
N (no) response doubles the time taken to format the disk drive.
CONTINUE IF BAD BLOCK INFORMATION IS INACCESSIBLE
Type Y and press the Return key.
ENTER A NON-ZERO SERIAL NUMBER:

Type your serial number (located on the top of the disk drive). Press the Return
key.

The system displays a message similar to the following:
FORMAT BEGUN

After about 12 minutes, the system displays a completion message similar to the
following:
FORMAT COMPLETED

Remove the diskette. If formatting is not successful, the system displays a message
when the error occurs.

C-2

Formatting a MicroPDP-11 System

C.2

FORMATTING HELP AND INFORMATION

The following is a list of messages generated by the formatter, their probable
cause, and what to do. Errors 1, 2, and 3 occur almost immediately, error 4 can
occur up to one minute after starting, error 5 from one to ten minutes, and errors
6 and 7 after ten minutes.

(1) UNIT IS NOT WINCHESTER OR CANNOT BE SELECTED

Unit selected is either unavailable or is an RX50. Check to make sure the fixed
disk is not write-protected.

Make sure the jumper on the disk drive is set correctly (see Chapters 8 and 10,

FRU Removal and Replacement Procedures).
(2) INITIAL FAILURE ACCESSING FCT

The Format Control Table (FCT) cannot be read. Try reconstruct mode; see Section C.3 for information. If that fails, replace the disk.

(3) FACTORY BAD BLOCK INFORMATION IS INACCESSIBLE

Occurs only in reformat mode when bad block data is not accessible. Run in reconstruct mode. See Section C.3 for information.

(4) SEEK FAILURE DURING ACTUAL FORMATTING

There is a hardware error; check for hardware problems.
(5) REVECTOR LIMIT EXCEEDED
The disk is bad; replace the disk.

C-3

Formatting a MicroPDP-11 System

(6) RCT WRITE FAILURE

Write to disk failed after successful formatting and surface analysis. Check writeprotect status.

(7) FAILURE CLOSING FCTS
Disk is marked as unformatted.
C.3

FORMATTING MODE

Three questions select the type of format mode that is run: reformat, restore, or

reconstruct mode. In order, the three questions are:
1. Use existing bad block information?
2. Down-line load?

3. Continue if bad block information is inaccessible?

The first two questions determine which mode is run. The second question does
not appear unless the first question is answered N (no). An answer of N to question three causes the diagnostic to stop and print a message if a bad spot is found.
e Reformat Mode — If your answer to question one is Y, no further questions
are asked. The format program reads the manufacturer’s bad blocks from a
block on the disk. It then formats all of the disk except for these bad blocks.
This takes about 12 minutes. If it fails, try restore mode.

e Restore Mode - If your answer to question one is N, the program asks you to
type in a list of the bad blocks. It then formats all of the disk except for the bad
blocks you specify. You can input the bad blocks using the list that comes with
the drive. It asks you for the serial number. This number is found on the top of
the RD52 disk drive. The program only allows you to type in the last eight
digits of the serial number. Restore mode takes about 15 minutes.

Reconstruct Mode - If you answer N to both questions one and two, the
program searches the disk and identifies all of the bad blocks. It does not use
the manufacturer’s bad block information. It then formats all of the disk except
for the bad blocks it identifies. This takes about 30 minutes.

C-4

Appendix D

Logical Unit Number Designation
D.1

LOGICAL UNIT NUMBERS

The Logical Unit Numbers (LUN) and the LUN jumpers provide for future expan-

sion of more than one RQDX module per system. Jumpers on the RQDX controller
module select the LUN. These jumpers determine the lowest unit number assigned
to any RDb5n and RX50 disk drives present in the system.

The RQDX module automatically sizes the logical unit configuration during initial-

ization of the system to determine how many of the four possible units are actually
present. The microcode automatically assigns disk unit numbers to any drives that

are present. An RX50 diskette drive is two units. Table D-1 shows the standard
LUN jumper configuration.

D-1

Logical Unit Number Designation

Table D-1

RQDX Standard LUN Configuration

LUN Jumper

State

Unit Number

LUN 0

Out

0-3*

Out
Out
Out
Out
Out
Out
Out

LUN 1
LUN 2
LUN 3
LUN 4
LUN 5
LUN 6
LUN 7

* Indicates that logical unit numbers 0-3 are assigned to this controller module. The controller automatically determines if less than four logical units are present. The system
software displays these as DUO-DU3 on the screen.

The LUN jumper format allows you to set the starting number as anywhere from
zero and up. Only one jumper setting per module is allowed. Use the format in
Table D-2 to configure a module with a starting LUN of other than zero.
Table D-2

RQDX Logical Unit Number Jumper Configuration

Jumper Setting

7
(128

6
64

5
32

4
16

3
8

2
4

1
2

0
1)

First Unit
Number

0
0
0
0
0

0
0
0
0
0
0
0
0

0
0
0
0
0

0
0
0
0
0
0
0
0

0
0
0
0
1
1
1
1

0
0
1
1
0
0
1
1

0
1
0
1
0

0
1
2
3
4

1
1

0
0

1
0
1
0
1

5
6
7
8
9

0
0
0
-0
0

D-2

0
0
0
0
0

0
0

0
0
0
0
0

Logical Unit Number Designation

Table D-3 shows an example of unit number designation when LUN jumper 4 1s
installed.

Table D-3

RQDX Unit Number And Jumper Format

Jumper
Installed

Unit Number
Specified

16 = first unit
17 = second unit

18 = third unit
19 = fourth unit

D-3

Appendix E

urations

M7513) Jumper Config
E.1

INTRODUCTION

Use the RQDXE extender module when you have an RQDX2 or RQDX3 controller
module and you want to add an RX50 or fixed-disk drive subsystem, or an additional disk drive in a BA23-C expansion box.
NOTE

The BA23-A supports only one fixed-disk drive installed in the
enclosure. Never install two fixed-disk drives in a BA23-A enclosure used as a host or in a BA23-C expansion box.

The RQDX2 and RQDX3 controller modules support four fixed-disk drives or two

fixed-disk drives and an RX50 diskette drive.

The RQDXE supports a variety of arrangements of additional disk drives. This
appendix provides the jumper configurations for these arrangements.

Refer to Section 5.5 for guidelines when you install an RQDXE extender module.

E-1

RQDXE (M7513) Jumper Configurations

RQDXE (M7513) JUMPER CONFIGURATIONS (COMMON

ARRANGEMENTS)

In the following examples, the term ‘“Host” is used for simplicity. The “Host”
referred to is the enclosure in which the RQDX2 or RQDX3 controller module
resides.

In the following illustrations, Port O is on the left, and Port 1 is on the right. Make
sure the jumpers on the fixed-disk drives are set correctly. Refer to Section 5.3 for
information.

The letter X implies that the port is empty or contains a device not supported by

the RQDX2 or RQDX3 controller module.

Subsystems, available from Digital Equipment Corporation, are desktop or
rackmounted RX50 diskette drive units, or RD fixed-disk drive units. Each subsystem contains its own power supply and is designed to communicate with the host
computer through an extender module installed in the host’s backplane.

E-2

RQDXE (M7513) Jumper Configurations

E.2.1

Factory Configuration

Figure E-1 shows three fixed-disk drive and RX50 diskette drive arrangements

using the RQDX2 or RQDX3 controller and the RQDXE extender modules. The
factory configuration supports all three arrangements shown.

Table E-1 shows the RQDXE factory configuration. This configuration supports one

RX50 and two fixed-disk drives. You can use this configuration with dual BA23

systems or with a subsystem.

BA23-A

RDO

HOST

BA23-C
BOX
EXPANSION

BA23-A
HOST

BA23-C

BOX
EXPANSION

BA23-A

FRONT PANEL

RDO

RD1

L L

| RX50

RD-D,
-R

RDT

SUBSYSTEM

Figure E-1

L L

RD1

RDO

HOST

| RX50

L L

| [~

FRONT PANEL

Three Possible Disk Drive Arrangements (Factory Setting)

Table E-1

RQDXE Jumper Setting (Factory Configuration)

RDY and
WRT PROT

Drive
SEL

Drive
ACK

External
Port SEL

Internal
Port SEL

Al to A3
B1 to B3

E1 to E2
F1to F3

K2 to K4

L1toL3
L4 to M2

N1 to N2
N4 to P2

F2 to F4

H3 to H4

E-3

RQDXE (M7513) Jumper Configurations

E.2.2

Jumper Setting for Three Fixed-Disk Drives

Figure E-2 shows a configuration using the RQDXE extender module with three
fixed-disk drives, one in the BA23-A enclosure and two subsystems. Table E-2
shows the RQDXE jumper setting to support three RD5n(s).
BA23-A
HOST

RD-D, -R

SUBSYSTEMS

RDO

L L
_ [

RD1

| RD2

| [ [

|=—

FRONT PANEL

|e—

FRONT PANEL

(ONLY)

Three Fixed-Disk Drives with an RQDXE (Arrangement 1)

Figure E-2
Table E-2

RQDXE Jumper Setting for Three RD5n Disk Drives

(Arrangement 1)

RDY and
WRT PROT

Drive
SEL

Drive
ACK

External
Port SEL

Internal
Port SEL

Al to A3
B1 to B3

El to E2
F1 to F3

K1 to K3
K2 to K4

L3 to M1
L4 to M2

N1 to N2
N4 to P2

C2 to C4

H1 to H2

D2 to D4

H3 to H4

E-4

RQDXE (M7513) Jumper Configurations

E.3

ADDITIONAL RQDXE JUMPER SETTINGS

The following examples show a variety of arrangements of fixed-disk drives and

RX50 diskette drives using the RQDX2 or RQDX3 controller and RQDXE extender
modules. The jumper configurations provided in the following tables, support the
disk drive arrangements shown in the accompanying illustrations.
E.3.1

Additional Arrangements, Example 1

Figure E-3 shows a configuration using an RQDXE with an RX50 and a fixed-disk
drive. Table E-3 shows the jumper configuration to support this arrangement.
L L

|<— FRONT PANEL

[=— FRONT PANEL

BA23-A

HOST

RX60 | ~

BA23-C

RDO

EXPANSION BOX

Figure E-3

_ L

An RX50 and a Fixed-Disk Drive with an RQDXE

Table E-3

RQDXE Jumper Setting for an RX50 and Fixed-Disk Drive

RDY and
WRT PROT

Drive
SEL

Drive
ACK

External
Port SEL

Internal
Port SEL

Al to A2
Bl to B2

E1 to E2
F3 to F4

K1 to K2

L3 to L4
M2 to M4

N1 to N3
N4 to P2

H3 to H4

E-5

RQDXE (M7513) Jumper Configurations

E.3.2

Additional Arrangements, Example 2

Figure E-4 shows a configuration using an RQDXE with an RX50 and two fixeddisk drive subsystems. Table E-4 shows the jumper configuration to support this
arrangement.

BA23-A
HOST

RD-D, -R

SUBSYSTEMS

RDO

RX50

[ L L

RD1

L L

<—

FRONT PANEL

<e——

FRONT PANEL

(ONLY)

Figure E-4

Table E-4

An RX50 and Two RD5n Disk Drives with an RQDXE
(Arrangement 1)

RQDXE Jumper Setting for an RX50 and Two

Fixed-Disk Drives (Arrangement 1)

RDY and
WRT PROT

Drive
SEL

Drive
ACK

External
Port SEL

Internal
Port SEL

Al to A2
A3 to A4

El to E2
F1to F2

K1 to K2
K3 to K4

L3 to L4
M1 to M2

N1 to N3
N4 to P2

B1 to B2

F3 to F4

B3 to B4

H3 to H4

E-6

RQDXE (M7513) Jumper Configurations

E.3.3

Additional Arrangements, Example 3

Figure E-5 shows a configuration using an RQDXE with a fixed-disk drive and an
RX50 in a BA23-C expansion box or as subsystems. Table E-5 shows the jumper
configuration to support this arrangement.

BA23-A

HOST

BA23-C

EXPANSION BOX

(RD/RX-D, -R

RDO | RX50 |

L L

—

<¢——

FRONT PANEL

<¢—

FRONT PANEL

SUBSYSTEM)

Figure E-5

A Fixed-Disk Drive and an RX50 in a BA23-C Expansion Box

Table E-5

RQDXE Jumper Setting for a Fixed-Disk Drive and an

RDY and
WRT PROT

Drive
SEL

Drive
ACK

External
Port SEL

Internal
Port SEL

Al to A2
B1 to B2

E2 to E4
F3 to F4

K1 to K2

L3 to L4
M2 to M4

N1 to N3
N4 to P2

RX50 in a BA23-C Expansion Box

C3 to C4

H1 to H3

D3 to D4

E-7

RQDXE (M7513) Jumper Configurations

E.3.4

Additional Arrangements, Example 4

Figure E-6 shows an alternate configuration using an RQDXE with an RX50 and
two fixed-disk drive subsystems. Table E-6 shows the jumper configuration to support this arrangement.

BA23-A

HOST

RX50 | | |

RD1

RDO

RD-D, -R

e«

FRONT PANEL

@—

FRONT PANEL

SUBSYSTEM

L L

(ONLY)

Figure E-6
Table E-6

An RX50 and Two Fixed-Disk Drives (Arrangement 2)

RQDXE Jumper Setting for a RX50 and Two Fixed-Disk

Drives (Arrangement 2)

RDY and

Drive

External

Internal

WRT PROT

SEL

ACK

Port SEL

Al to A3

E1l to E2

K1 to K3

L3 to M1

N1 to N3

A2 to A4

F1 to F3

K2 to K4

L4 to M2

N4 to P2

B1 to B3

F2 to F4

B2 to B4

H3 to H4

E-8

RQDXE (M7513) Jumper Configurations

E.3.5

Additional Arrangements, Example 5

Figure E-7 shows another alternate configuration using an RQDXE with two fixeddisk drives and an RX50 diskette drive in a BA23-C expansion box or subsystems.
Table E-7 shows the jumper configuration to support this arrangement.
BA23-A
HOST

RDO

L L
_ L

[*—

FRONT PANEL

RD1

RX50

Lo b
L L

4—

FRONT PANEL

BA23-C

EXPANSION BOX
(RD/RX-D, -R
SUBSYSTEMS)

Figure E-7

Two Fixed-Disk Drives and an RX50 (Arrangement 3)

Table E-7

RQDXE Jumper Setting for Two Fixed-Disk Drives and an

RDY and
WRT PROT

Drive
SEL

Drive
ACK

External
Port SEL

Internal
Port SEL

Al to A3
B1 to B2

E2 to E4
F1 to F3

K1 to K2

L1 to L3
L4 to M2

N1 to N2
N4 to P2

RX50 (Arrangement Three)

C3 to C4

H1 to H3

D3 to D4

E-9

RQDXE (M7513) Jumper Configurations

E.3.6

Additional Arrangements, Example 6

Figure E-8 shows an alternate configuration using an RQDXE with three fixed-disk
drives, one in a BA23-A enclosure and two as subsystems. Table E-8 shows the

jumper configuration to support this arrangement.

HOST

RDO

RD SUBSYSTEM

RD2

RD1

Figure E-8

Table E-8

L L

<¢——

FRONT PANEL

<.—

FRONT PANEL

Three Fixed-Disk Drives (Arrangement 2)

RQDXE Jumper Setting for Three Fixed-Disk Drives

(Arrangement 2)

RDY and

Drive

External

Internal

WRT PROT

SEL

ACK

Port SEL

A3 to A4

E1 to E2

K1 to K2

L3 to L4

N1 to N2

B3 to B4

F1to F2

K3 to K4

M1 to M2

N4 to P2

C3to C4

F3 to H1

E-10

F.1

PURPOSE

The tables in this appendix form a worksheet. This worksheet should be used to
report and confirm the setup parameters to be contained in the setup EEPROM on
the KDJ11-BC CPU module.
F.2

FUNCTION

This worksheet should be filled out (at installation of a KDJ11-BC CPU module) to
contain all pertinent information about changes made to the setup parameters and
programming for any future replacement KDJ11-BC CPU modules. Once filled out,
it is to be left with the system for future use.

Use a pen to fill out the current blocks and a pencil for the new blocks.
NOTE

Use setup command 1 to exit and setup command 7 to list current values (at the time of a change) to ensure that the changes
made have been programmed correctly.

Use setup command 9 to copy any changes you make to the

setup table into the EEPROM.

Use setup command 14 to write a boot from memory into the
EEPROM.

F-1

Setup Parameters Worksheet

Table F-1

Setup Command 2

CEZEZO

TEIOIETOT
R

Default Current New

F-2

Disable User friendly format
ANSI Video terminal (1)

Power-up
Restart

0 = Dialog
0 = Dialog

Ignore battery

PMG count

1 = Yes

0 = No

Enable Halt on break

0 = No

0= No

1 = Yes

1 = Automatic
1 = Automatic

0 = No

2 = ODT
2 = ODT

3 =24
3 =24

=1
=1

1 = Yes

(0-7)

Disable clock CSR

0 = No

Force Clock interrupts

1 = Yes

0 = No

1 = Yes

Clock 0 = Power supply 1 = 50 Hz 2 = 60 Hz 3 = 80 Hz

Enable ECC test

0 = No

1 = Yes

Disable long memory test

0 = No

1 = Yes

Disable ROM 0 = No 1 = Dis 165 2 = Dis 173 3 = Both

Enable trap on halt

0 = No

Allow alternate boot block

1 = Yes

0 = No

1 = Yes

Setup Parameters Worksheet

Table F-2

Setup Command 3
Current

New

Device name

Unit number

CSR address
TT2
Device name

Unit number
CSR address
TT3

Device name

Unit number

CSR address

TT4

Device name

Unit number

CSR address

TT5
Device name

Unit number

CSR address

TT6

Device name

Unit number

CSR address

TT7

Device name

Unit number

CSR address

TT8

Device name

Unit number

F-3

Setup Parameters Worksheet

Table F-2

Setup Command 3 (Cont.)
Current

CSR address

New

TT9

Device name

Unit number

CSR address

Table F-3

Setup Command 4
Current

Boot 1
Device name
Boot 2
Device name
Boot 3

Device name
Boot 4

Device name
Boot 5
Device name

Boot 6
Device name

F-4

New

Setup Parameters Worksheet

Table F-4

Setup Command 6 — Switches 2, 3, and 4

(SPECIAL)

Current

Off

(SB1)

Off

(SB2)

Off

(SB3)

Off

(SB4)

Off

(SB5)

Off

(NORMAL)

New

Use the following sheets to record any other changes, additions, or deletions you
make to the setup of the KDJ11-B module.

F-5

Setup Parameters Worksheet

NOTES

F-6

Setup Parameters Worksheet

NOTES

F-7

Setup Parameters Worksheet

NOTES

F-8

Appendix G

Version 7 and Version 6 ROM Differences
G.1

INTRODUCTION

The KDJ11-B CPU modules (M8190) are currently shipping with an enhancement

to the EPROMs. These new ROMs (Version 7.0) can be ordered (by Digital Equipment Corporation part number) to upgrade earlier (Version 6.0) KDJ11-B CPU
modules.

When you enter setup mode from dialog mode, the system displays the version of
the ROM code in the upper right corner of the screen.

Table G-1 lists the ROM version and Digital Equipment Corporation part numbers.
Table G-1

KDJ11-CPU ROM Part and Version Numbers

Socket Location

on CPU (M8190)

V7.0 Part Number

V6.0 Part Number

E116 (Low Byte)
E117 (High Byte)

23-116E5-00
23-117E5-00

23-077E5-00
23-078E5-00

G.2

DIFFERENCES BETWEEN VERSION 7.0 AND VERSION 6.0

The following sections describe the differences between Version 6 and Version 7
KDJ11-B CPU EPROMs.

G.2.1

Boot Support for Tape MSCP Devices (TK50)

Version 7.0 contains a built-in tape MSCP boot program for the TK50. The device
name 1s MU.

Version 6.0 does not contain this feature.

G-1

Version 7 and Version 6 ROM Differences

G.2.2

Disable Setup Mode Parameter

Version 7.0 contains an added setup mode parameter that allows the user to disable entry into setup mode if force dialog mode is not selected. This prevents
unauthorized entry into setup mode.

This change assumes the force dialog switch is controlled, or that switch 5 on the
KDJ11-B CPU is on to prevent unauthorized access to setup mode. When setup

mode is disabled and the ROM code is in dialog mode, all references to the SETUP
command are eliminated. Typing SETUP causes an invalid command response from
the ROM code.

In Version 6.0, setup mode can always be entered from dialog mode.
G.2.3

Disable All Testing Parameter

Version 7.0 has an added parameter to parameters command 2. This parameter
disables all memory and cache testing if force dialog is not set. Force dialog causes
all testing to be run.

Version 6.0 does not contain this feature.
G.2.4

Edit/Create Command

In the Version 7.0 setup mode edit/create command for EEPROM boots, the highest unit number entry is decimal.

In Version 6.0, the user types an octal number which converts to a decimal value.
G.2.5

Disk MSCP Autoboot Routine

In Version 7.0 MSCP autoboot, the boot program tries to boot removable media
from units 0 to 255, then tries fixed-media units from 0 to 255.

The boot program attempts to boot each unit using the standard disk MSCP
address. If this fails, the program attempts to boot the same unit number using the
first floating MSCP device (if present) before continuing to the next unit number.
The first floating MSCP address is 17760334 if there are no floating devices from
17760010 to 17760330 (see Appendix A).

In Version 6.0 MSCP autoboot, the boot program tries to boot removable media
from: units O to 7, then tries fixed-media units 0 to 7. The program tries only
drives attached to the controller at the standard disk MSCP address (17772150).

G-2

Version 7 and Version 6 ROM Differences

G.2.6

Disk MSCP Boot Differences

In the Version 7.0 dialog mode boot command, the ROM code automatically tries

the first floating controller if the standard controller reports an error. If an error
exists on both controllers, the system displays an error message for each controller. The system does not display nonexistent error messages unless the unit is
nonexistent on both controllers.

If the second controller does not exist at the proper floating address, the ROM
code prints only messages associated with the standard controller,
If the translation table or the /A switch is used, only one controller is tried regard-

less of the existence of two or more controllers.

In the Version 6.0 dialog mode boot command, the ROM code tries only the standard controller. The system displays a nonexistent error message 1if the unit 1s not
present on the standard controller.

In Version 6.0, a floating controller can boot MSCP devices under software control.
G.2.7

Initialize Command

In Version 7.0, the initialize command sets the PMG count value to 7. In Version
6.0, the initialize command sets the PMG count value to 0.
NOTE

The recommended value for the PMG count is 7 for all
KDJ11-Bs.

G.2.8

Memory Testing

In Version 7.0, all consecutive memory starting from location 0 is written at least
once at power-up unless all testing has been disabled.

In Version 6.0, memory above 248 KB cannot be written if the long memory test
is disabled or <CTRL> C is typed.

G-3

Version 7 and Version 6 ROM Differences

G.2.9

Power-Up Set to 3 with Battery-Backup Memory

For Version 7.0, if the selected mode is 3 at power-up, the battery indicates that
the voltages are lost and the Ignore Battery function is not set. Execute the restart
mode selection if it is not mode 3. Otherwise, go to dialog mode.

For Version 6.0, if the selected mode is 3 at power-up, the battery indicates that
the voltages are lost, and the Ignore Battery function 1s not set. Go to Dialog mode
regardless of the restart mode selection.
G.2.10

Enabling Halt On Break

In Version 7.0, the Halt on Break bit is set immediately after the “Testing in
progress — Please wait message” is printed out. Since Halt on Break is generally
enabled only in a single-user environment, this feature was not needed and has
been removed. This allows the ROM code to ignore the break that often comes

from certain terminals when they are powered up.

In Version 6.0, the Halt on Break bit in the BCSR is not enabled until one of the
following occurs

e One break has been received and discarded.

e Any valid character has been received except XON.
e The ROM code has given up control of the CPU.
G.2.11

<CTRL> R and <CTRL> U Echoing

Version 7.0 does not echo the <CTRL> R and <CTRL> U inputs. Version 6.0
echoes these inputs as "R and "U.

G-4

Version 7 and Version 6 ROM Differences

G.2.12

Setup Command 5

In Version 7.0, setup mode command 5 has been deleted. If the command is typed
it 1s 1gnored.

In Version 6.0, setup mode command 5 (List/Change Terminal Setup Message)
allows the user to specify an octal message of up to ten characters to be sent to
the console terminal. Use this command if the console terminal does not power-up
with the current language characters.

G.2.13

Automatic Boot Sequence Message

In Version 7.0, the ROM code prints a message indicating when the automatic boot
sequence starts if autoboot mode is selected. This message indicates that all tests
are complete, that the ROM code is starting the autoboot sequence, and the name
and unit number of the device booted (Figure G-1).

Testing in progress - Please wait
Memory size is 512 K Bytes
9 Step memory test

Step 123456789
Starting automatic boot

Starting system from DUO

Figure G-1

G.2.14

Sample Autoboot Display

Boot Command List Addition

In Version 7.0, “L’” has been added to the boot command list. L causes the automatic boot sequence to continuously loop until one of the selected devices boots.
Normally, the last device in the autoboot table is followed with an E which terminates the table.

If no devices are bootable, the ROM code prints an error message and requests
input before proceeding. The ROM code continuously tries every device in the
table until one boots or the operator types <CTRL> C.

Version 6.0 ROMs do not contain this feature. However, it can be implemented by

writing a small EEPROM boot.

G-5

Version 7 and Version 6 ROM Differences

G.2.15

Local Language Support

Version 7.0 supports local language translations. Version 6.0 does not support local
language translations.

G-b

Access time

The total time taken to find data in a storage location. For disks, the access

time is equal to the sum of the average latency time and the average
seektime.
ANSI

The acronym for American National Standards Institute.
Answerback

A preprogrammed response from a terminal.
Assembled program count

The address of an instruction relative to the starting address of the program.
BOT

The acronym for beginning of transmission.

The acronym for beginning of tape.

Buffer

A storage area meant to temporarily hold data being transferred between two
devices.
Bus error trap

A high-priority interrupt that halts the processor routine and initiates a subroutine. The interrupt occurs because of an error on the bus (for example, a
device fails to answer at its expected address), and usually indicates a faulty
CPU or memory module.

Glossary-1

Glossary

Bus grant

Comprises two signals which are used by the CPU to acknowledge requests
for the bus:

The bus interrupt acknowledged (BIAK) signal acknowledges an interrupt
request.

The bus direct-memory-access grant (BDMG) signal acknowledges a DMA
request.

A device receiving one of these signals will pass the signal on to the next
device on the backplane, only if it does not require the bus itself. Therefore
devices closer to the CPU have priority over those farther down the
backplane.

CCITT

The acronym for Comité Consultatif Internationale de Téléphonie et
Télégraphie (International Telephone and Telegraph Consultative Committee).
Channel

A path for electrical transmission between two points.
Control status register

A register that contains status information about a device.
CRC

The acronym for cyclic redundancy check. A method of detecting errors.
Default

The value of a selection assumed by the computer when a specific value is not
supplied by the user.
Delimiter

A character that terminates a character string or message, or separates it
from surrounding text.
DMA

The acronym for direct memory access. A facility that allows mput/output

transfers to bypass the CPU’s general registers and go directly to and from
memory.

Glossary
-2

Glossary

DTR

The acronym for data terminal ready. A control signal that enters a modem
from the terminal or communications device that is using the modem. When
the signal is set, it informs the modem that the terminal is ready to transmit
or receive data. When the signal is clear, the terminal is not ready.
Dual-height module

An option for Q22-Bus systems that requires half a slot on the backplane.
Duplex

In communications, simultaneous, two-way, independent transmission in both

directions; also called full-duplex.
EIA

The acronym for Electronic Industries Association.
EIA interface

The standard code defined by the Electronic Industries Association for use in
data exchange.

EOT

The acronym for end of transmission.

The acronym for end of tape.

EPROM

The acronym for erasable programmable read only memory. A ROM that can

be reprogrammed by a user.
FCC

The acronym for the Federal Communications Commission, Washington D.C.

Firmware

A program of instructions that is in read only memory (ROM) so it will not be
changed. For example, the MicroPDP-11 and MicroVAX systems firmware
includes the self-test program that runs every time you turn the computer on.

First address range

The range within which the starting address of a memory module must occur.
The actual starting address is determined by the combination of the first
address range and the partial starting address.

Glossary-3

Glossary

Floating-point processing

A method of calculation that automatically moves the decimal point.

FRU

The acronym for field replaceable unit.
Full-duplex

A form of data transmission in which messages can pass through a circuit, in
both directions, simultaneously.

Half-duplex

A form of data transmission in which messages can pass through a circuit in
both directions. However, transmission in both directions cannot take place
simultaneously.

Hertz (Hz)

A unit of frequency equal to one cycle per second.
Instruction set

A group of commands that tells the computer what operation to perform.
interrupt

A break in a program, caused by an external source, which requires that
control should pass temporarily to another program.
/O page address

The physical address of a device register.
ISAM

" The acronym for index sequential access method. The technique for accessing
records in files that have an indexed sequential organization.
Jumper

An electrical conductor used to complete a circuit and so affect the logic of
the circuit board.
Latency time

The delay while waiting for data on a rotating disk to reach the disk head. The
average latency is equal to half the time taken for one revolution of the disk.
LED

The acronym for light emitting diode.

Glossary-4

Glossary

LSI

The acronym for large-scale integration.
Memory management unit

A device that extends the amount of memory that the CPU can access to 64 K
bytes or more. The memory management unit also protects and organizes
areas of memory.
Mode

A state, such as line or local mode, or method of operation, such as console
dialog mode.
Modem

The acronym for modulator-demodulator. A telecommunications device that
provides an interface between a computer and a communications link.
The acronym for metallic-oxide semiconductor.
MSCP

The acronym for mass storage control protocol.
Nonvolatile memory

A storage medium that retains its data in the absence of power.
The acronym for on-line debugging technique.
Parity bit

An extra bit added to a byte or word to ensure that there is always either an
even or odd number of bits, according to the logic of the system.

Parity error

An error caused when the value calculated for the parity bit is not equal to the
actual value of the parity bit.

Partial starting address

The starting address of a memory module relative to the first address range
for that module. The actual starting address of the module is determined by
the combination of the first address range and the partial starting address.

Glossary-5

Glossary

Processor status word

A register in some computers that indicates the current priority of CPU operation, the condition of the previous operation, and other basic control items.

Program counter

A register in the CPU that holds the address of the next instruction (except in
the case where the current instruction causes a jump).

PROM

The acronym for programmable read only memory. A ROM that can be

programmed by a user.
Protocol

A formal set of conventions governing the format and relative timing of message exchange between two communicating processes.

Q22-Bus

An extended version of the LSI-Bus that allows 22-bit addressing.
Quad-height module

An option for Q22-Bus systems that requires a full slot on the backplane.
RAM

The acronym for random access memory. A memory in which the CPU can

access all locations with equal facility.
Random access

Pertaining to a storage device from which data or blocks of data can be read
in any order.
Real-time

Refers to the actual time during which a process takes place.
Reserved instruction

An instruction that is not available to the system. For example, instructions
relating to floating-point operations will not be available to systems that do not
have a floating-point option installed.
Reserved instruction trap

A jump to a specified location that occurs when the system attempts to execute a reserved instruction.

Glossary-6

Glossary

ROM

The acronym for read only memory. Preprogrammed memory that can be read
from, but not written to.
RTS

The acronym for request to send. A signal sent from a terminal to a modem to
inform the modem that the terminal is ready to transmit data.
Seektime

The time taken for the disk read/write heads to move to the required track on
the disk.

Serial line unit

A device that provides an interface between a serial communications line and
the CPU module.

Serial transmission

A method of transferring data in which the bits of the characters are sent
sequentially on a single path.
Stop bits

In serial transmission, one or two bits that are transmitted at the end of a data
word. The stop bits give the receiver time to ready itself for the next word.
Synchronous

Having identical time periods.

A communications format in which each data character uses the same
time period. The data, including blank time, is controlled by an external
clock device or modem.

System mapping routine

A program that finds and displays the hardware addresses of the devices in a
system.

Glossary-7

Glossary

Trap

A conditional jump to a known memory location, performed automatically by
hardware. The jump occurs when the execution of an instruction causes an

unexpected result. The address location from which the jump is made 1s stored
in the status register. (A trap is distinguished from an interrupt in that an
interrupt is caused by an external event.)

Track

A path on a diskette, disk, or tape that holds data.
UART

The acronym for universal asynchronous receiver/transmitter. A device that

performs parallel-to-serial and serial-to-parallel conversion.
Utility program

A program used to perform some frequently required process in the operation
of a computer.

Glossary-8

Ac input box, B-15

BA11-S enclosure

backplane, 7-11

Ac input box (H403-B), B-15
backplane, discussion, B-9, B-18

definition, 7-11

bezel

Ac load

Access cover, removal, 8-30
Acronyms, list of, xxi
Address. See also CSR address
configuration example, 6-2
fixed, definition, 6-2
floating, definition, 6-2
typical switch settings, 6-3
Advance to next test

explanation, 4-7
when to use, 4-7

Air circulation

BA123 enclosure, 9-4
BA23 enclosure, 7-4
Allow alternate boot block
command, 2-17
use, 2-17

ANSI video terminal
command, 2-15
use, 2-15

Automatic boot mode
boot sequence, 2-10
discussion, 2-10-2-11
enter, 2-15

forcing dialog mode, 2-11
KDF11-B, 3-10

KDJ11-B, 2-10

messages, 2-11, 3-11

assembly removal, B-15
printed circuit board, B-14
controls, B-12, B-13
description B-9-B-24
general discussion, B-9
[/O distribution panel, B-20
identification, 1-1, 1-2
insert panels, B-21
physical description, B-11
power supply
control board, B-18
discussion, B-16
harness, B-16
location, B-11

master board, B-18
monitor board, B-18
specifications, B-17
specifications, B-10
voltage, B-9

VOLT SEL switch, B-15, B-16
BA123 enclosure. See also FRU
backplane, 9-15-9-17

configuration examples, A-16-A-20
control panel 9-7-9-10

controls and indicators, 9-8-9-9
CPU console board, 9-8
description, 9-1-9-24

Index-1

Index

doors, 9-2

BA123-A

discussion 9-15-9-17

electrical distribution, 9-21

FRU procedure, 10-28

frame, 9-2

FRU procedures, 10-1-10-31

BA23-A

discussion, 7-1-7-21

I/O distribution panel, 9-22
identification, 1-1, 1-3

FRU procedure, 8-27-8-31

mass storage, 9-11

CD bus, 9-16

part numbers, 10-1

configuration, A-1-A-20
expansion space, A-4
grant continuity, 7-13, 8-42, 9-15

power supply, 9-18-9-21
printed circuit board, 9-4

RD console board, 9-13

H9276, B-18

RDb5n fixed-disk drive, 5-6

install modules 1n, 7-13, 9-15, 9-16

signal distribution board, 9-12

installation, BA123, 10-28

temperature sensors, 9-4

order of modules, A-3

troubleshooting flow chart, 4-25
BA23 enclosure. See also FRU
air circulation, 7-4

backplane assembly, 7-8-7-13
bezels, 7-3

Q22-Bus connectors, 7-12, 7-13
resistor pack, 9-16

signal distribution panel, 7-9
Backup devices
description, 5-30-5-39

configuration examples A-12-A-15

TQK25-EP tape drive, 5-30-5-32

control panel, 7-5

TQK50 tape drive subsystem,

controls and indicators, 7-5
description, 7-1-7-21
dimensions, 7-3

5-33-5-39
Battery backup
memory, jumper setting, 2-29

fans, 7-14

MSV11-JD, -JE memory, 2-29

frame, 7-2

using set-up commands, 2-15

FRU procedure 8-1-8-45

Baud rate switch

I/O distribution panel, 7-19

KDF11-B, 3-8-3-9

identification, 1-1, 1-2

KDJ11-B, 2-6-2-8

LTC DIP switch, 7-7

set-up command 6, 2-20

mass storage, 7-8

BEVENT timing switch, 7-7, 9-10

part numbers 8-2-8-3

Bezel

power supply 7-14-7-18

BA11-S

printed circuit board, 7-7

assembly jumpers, B-14

RDb5n fixed-disk drive, 5-6

assembly removal, B-15

troubleshooting flow chart, 4-25
Backplane. See also configuration
access cover removal, 8-30

BA11-S

installation, B-12
printed circuit board, B-14

BA23-A enclosure, 7-3

Boot. See also automatic boot mode

jumper setting, B-18, B-19

delete EEPROM, 2-21

location in enclosure, B-18

from

Index-2

Index

diagnostic diskette, 4-4-4-5
off board ROM, 2-12, 2-19
non-Digital devices, 2-19

nonstandard address, 2-18
KDF11-B

dialog command, 3-11
error table, 4-9

KDJ11-B

dialog command, 2-12
error table, 4-4-4-5

save into EEPROM, 2-22
self-test error table, 4-4-4-5, 4-9

Change parameters

command, 2-13
use, 2-13

Circuit breaker, 7-18, 9-20
Clock select
command, 2-16

LTC switch, 7-7

signal sources, 2-16
use, 2-16

Command line
explanation, 4-7
options, 4-7

Communications. See also specific
module

Caution
definition, x

fan power cable
front, 8-40
rear, 8-37

fixed-disk drive handling, 8-12,
10-10

module removal, 8-42

number disk drive in BA23, 5-6
power supply voltage, 10-26
RD51 fixed-disk drive, 8-12
RX50 diskette drive handling, 10-10
static electricity, 8-1, 8-42, 10-22

CD bus

PMI implementation, 2-9
use, 2-9

Change automatic boot
command, 2-19
use, 2-19

Change boot switch selection
baud rate, 2-20
command, 2-20

default setting, 2-20
use, 2-20

Change boot translation
command, 2-18-2-19
example, 2-18-2-19
use, 2-18-2-19

cabinet kit part number, 6-4-6-51
module layout and cabling, 6-4-6-51
options 6-4-6-51

Configuration. See also worksheet
BA123-A

cabling, A-16-A-20
power requirement, A-8

worksheet, A-10
BA23-A

cabling, A-12-A-15
worksheet, A-7, A-10

blank worksheet, sample, A-21A-24

common arrangements, table, A-11
CSR addresses, A-9
examples, A-12-A-20
expansion space, A-4
floating CSR
addresses, A-9
common arrangements, A-11
guidelines, A-11
interrupt vectors, A-9
KDF11-BA CPU
baud rate switch, B-8
break on halt, B-4

device select, B-4
halt/trap, B-6

Index-3

Index

power-up mode jumpers, B-6
ROM jumper, B-7

SLU format jumper, B-7
operating system, A-20
order of modules table, A-3
PDP-11/23 PLUS, B-1
power

requirements,A-4
worksheet, A-7, A-8

prepare set-up table, A-20
RD5n fixed-disk drive, 8-14, 10-11
rules, A-1

sample worksheet, A-23
Console dialog mode. See Dialog

table, use of, 7-5, 9-9

write-protect, 7-6, 9-13
CPU console board
discussion, 9-8

FRU procedure, 10-9
LEDs, 9-10

CSR address. See also specific module
floating, A-9

guidelines, A-11
how to configure, A-9
MSV11-P memory, 2-26

RQDXn disk controllers, 5-15
TQK50 tape controller, 5-35
worksheet, A-10

mode,

KDF11-B CPU, KDJ11-B CPU
Console emulator mode
entering, 4-11
KDF11-B, 4-8

Data error message, 4-18
Dc load

backplane, 7-11
definition, 7-11

KDJ11-B, 4-4

DC OK indicator, 7-5, 9-8

modify registers, 4-11

DEC/X11 run-time exerciser

ODT commands, 4-12

data error message format, 4-18

system halt, 4-8

deselect

using, 4-8

using ODT, 4-11-4-12

commands, 4-20
modules, 4-20

Console messages, KDJ11-B, 4-5-4-7

expansion, 4-21

Control panel

message types, 4-18

BA11-S enclosure, B-12, B-13
controls and indicators, 7-5-7-6,
9-8-9-9

select
commands, 4-20
modules, 4-20

FRU procedure, 8-6

status error message, 4-19

installation, 8-6

system error message, 4-18

LEDs, 7-7

Controls and indicators

using, 4-17

Delete EEPROM boot

baud rate switch, 2-7-2-9

command, 2-21

DC OK, 7-5, 9-7, 9-8

use, 2-21

Halt, 7-6, 9-9

DEQNA Ethernet interface

RD console board, 9-13

CSR address, 6-5

Ready, 7-7. 9-13

description, 6-4

Restart, 7-6, 9-9

internal cabling, 6-6

Run, 7-5, 7-6

interrupt vector, 6-5

Index-4

Index

part numbers, 6-4

Deselect program modules, 4-20
DHV11 asynchronous multiplexer
CSR address, 6-9

description, 6-7

internal cabling, 6-10
interrupt vector, 6-9
part numbers, 6-7

Diagnose, dialog command, 3-11
Diagnostic self-test, 2-10, 3-10

Diagnostic/bootstrap switch, KDF11-B,
3-7-3-8

Diagnostics. See also XXDP+
boot ROM error, 4-4-4-5, 4-9
console emulator mode, 4-4
data error message, 4-18
DEC/X11 run-time exerciser, 4-17
deselect

commands, 4-20
modules, 4-20

error code table, 4-2, 4-3
field service diskettes
discussion, 4-13
part number, 4-16
using, 4-16

XXDP+ software, 4-16
message

format, 4-4, 4-7

location, 4-3
types, 4-18

RC25 disk drive, 4-17
restart testing, 4-5

self-test description, 4-2
select

commands, 4-20
modules, 4-20

status error message, 4-19
system error message, 4-13
TK25 tape drive, 4-17
troubleshooting flow chart, 4-25
user friendly diskettes

part number, 4-13
using, 4-13
User Test, 4-13

XXDP+ software

message format, 4-22
modifying a program, 4-23
programs, 4-21

restart a program, 4-22
start a program, 4-22
Dialog mode

entering, 2-11, 3-11
KDF11-B
commands, 3-11
menu, 3-11

KDJ11-B

commands, 2-12
discussion, 2-11-2-23
uses, 2-11

Disable, command and use
clock CSR, 2-16

long memory test, 2-17
ROM, 2-17

user friendly format, 2-14

Disk controller module. See RQDXn
disk controllers

Disk drive. See RC25 disk subsystem,
RD5n fixed-disk drives, RL0O2
disk subsystem, RX50 diskette
drive

Diskette drive. See RX50 diskette
drive

Diskettes

field service

diagnostic, 4-13

part number 4-16

user friendly
part number, 4-13
user test, 4-13

DLVE1 asynchronous interface
baud rate selection, 6-14
CSR address, 6-12

Index-5

Index

description, 6-11

internal cabling, 6-15
interrupt vector, 6-13
jumper settings, 6-13
part numbers, 6-11

DLV]J1 asynchronous interface
CSR address, 6-17
description, 6-16
internal cabling, 6-19

interrupt vector, 6-17

part numbers, 6-16

DMV11 synchronous controller
CSR address, 6-21

description, 6-37

internal cabling, 6-39
interrupt vector, 6-38
part numbers, 6-37

DUV11 synchronous serial interface
CSR address, 6-41
description, 6-40

internal cabling, 6-42
interrupt vector, 6-41
part numbers, 6-40

DZQ11 asynchronous multiplexer
CSR address, 6-44

description, 6-43

description, 6-20

internal cabling, 6-45

DIP switch settings, 6-24

interrupt vector, 6-44

internal cabling, 6-25
interrupt vector, 6-22
part numbers, 6-20, 6-21
Door switch,

part numbers, 6-43

DZV11 asynchronous multiplexer
CSR address, 6-47
description, 6-46

discussion, 9-4

internal cabling, 6-48

FRU procedure, 10-24

interrupt vector, 6-47

DPV11 synchronous interface

part numbers, 6-46

CSR address, 6-28
description, 6-26

internal cabling, 6-29

Edit/Create EEPROM boot
command, 2-21

interrupt vector, 6-28

definition of prompts, 2-21

part numbers, 6-26

use, 2-21

DRV11 parallel-line interface
CSR address, 6-31

EEPROM, features and use, 2-5
Ejector levers, 8-43

description, 6-30

Electrical distribution, 9-21

internal cabling, 6-32

Enable ECC test. See also MSV11-]D,

interrupt vector, 6-31

part numbers, 6-30

DRV11-B DMA interface

CSR address, 6-35
description, 6-33

-JE memory
command, 2-16
memory type, 2-16
use, 2-16

Enable halt on break

internal cabling, 6-36

command, 2-14

interrupt vector, 6-35

use, 2-14

part numbers, 6-33
DRV11-J high density interface

CSR address, 6-38

Index-6

Enable trap on halt
command, 2-17

use, 2-17

Index

Enclosure. See BA11-S, BA123
enclosure, BA23 enclosure
Enter ROM ODT
command, 2-22
use, 2-22

EPROM, features and use, 2-5
Error code
KDF11-B

LED display table, 4-10
ROM messages 4-9

KDJ11-B self-test, 4-2, 4-3
tables, 4-2-4-3, 4-9-4-10
Error message

DEC/X11

data error, 4-18
format, 4-18

status error, 4-19

system error, 4-18
description, 4-7
KDF11-B boot, 4-8
KDJ11-B format, 4-6

Error number, explanation, 4-7
Exit, set-up command 1, 2-13
Expansion space

backplane, A-4
I/O distribution panel, A-5

Exterior panels
FRU procedure, 10-3-10-7
left side, 10-6
right side, 10-3
Fan

caution, power cable, 8-37, 8-40

cowling removal, 8-28
FRU procedure
card-cage fan, 10-20
front, 8-38

mass storage fan, 10-18
rear, 8-36

installation
front, 8-40

rear, 8-37

location, 9-4

power cable alignment, 8-37, 8-40,
10-18, 10-10

power connector, 7-18
power signals, 7-14
voltage, 7-15

Field service diagnostics, part number,
|

4-16

Filter connector, removal, 8-45, 10-30
Fixed-disk drives. See RDbn fixed-disk
drive

Floating CSR addresses
common arrangements, A-11
guidelines, A-11
how to configure, A-9
Floating point
KDF11-B, 3-3

KDJ11-BB,-BC,-BF 2-4

Floppy disk drive. See RX50 diskette
drive

Flow chart

troubleshooting BA123 enclosure,
4-25

troubleshooting BA23 enclosure,
4-25

Force clock interrupts
command, 2-16
use, 2-16
Format

help, C-3

messages, C-3
mode C-4

RD5n procedure, C-1-C-2
RD5n, 5-10

FRU

access cover, 8-30

BA123 procedures 10-1-10-31
BA23 procedures, 8-1-8-45
backplane assembly, 8-27-8-31,
10-28

Index-7

Index

control panel, 8-6

CPU console board, 10-9

H349 I/O panel opening, B-11. See

also BA11-S enclosure

door switch, 10-24

Halt switch, 7-6, 9-9

exterior panels, 10-3-10-7

Help

fan

card-cage, 10-20
cowling, 8-28
front, 8-38

mass storage, 10-18
rear, 8-36

filter connector, 10-30
flow chart, 4-25

I/O distribution panel, 8-45, 10-30
[/O insert panel removal, 8-45,
10-30

dialog command, 2-12, 3-11
XXDP+ on line, 4-16
Host, definition, E-2
I/O distribution panel
BA11-S enclosure, B-20-B-22
cabinet kit, 7-19, 9-22

cutout specification, 7-20, 9-23
expansion space, A-5
FRU procedure, 8-45, 10-30
H349

mass storage devices, 10-10

discussion, B-20-B-22

modules, 8-42. 10-22

insert panel, B-21

on/off switch, 10-8
parts list, BA23, 8-2-8-3, 10-1

power supply, 8-32-8-35, 10-26

insert panel

discussion, 7-19, 7-20, 9-22
FRU procedure, 8-45, 10-30

Q22-Bus module cover, 8-27

PDP-11/23 PLUS, B-20-B-22

RDb51 read/write board, 8-15-8-19

removable bracket, 7-20, 9-23

RD52 read/write board removal,
8-19, 10-12

SLU display, 7-20, 9-22
Ignore battery

RD53 read/write board, 8-23, 10-16

command, 2-15

RDbn fixed-disk drive, 8-12

use, 2-15

RQDX interconnect cable, 8-25
RX50 diskette drive, 8-8

Indicator

BA11-S enclosure, B-13

subsystem storage cover, 8-6

DC OK, 7-5, 9-8

temperature sensor, 10-24

Halt

TK50 interconnect cable, 8-10

Ready, 9-13

TK50 tape drive, 8-8

Run, 7-6
Write-protect, 9-13

Grant continuity

Initialize the set-up table

card installation, 8-42

command, 2-20

discussion, 7-12, 7-13

use, 2-20

Grounded wrist strap
part number, 8-1
use, 8-1

Index-8

Insert panel. See I/O distribution panel
Installation
KDF11-B guidelines, 3-4

Index

KDJ11-B guidelines, 2-9

ODT addressing, 4-11, 4-12

MSV11-JD, -JE guidelines, 2-30

ROM identification, 1-4

MSV11-P guidelines, 2-9
Interconnect cable

self-test, 4-8
startup message, 1-5

RQDX FRU procedure, 8-25

system halt, 4-10

TK50 FRU procedure, 8-10

testing procedures, 4-8

Interrupt vector

how to configure, A-9

worksheet, A-10

KDF11-B CPU

automatic boot mode, 3-10-3-11
baud rate switch, 3-8-3-9
description, 3-1-3-11

J11 micro-ODT. See also ODT
addressing, 4-11, 4-12
commands, table, 4-12
in set-up mode, 2-15

Jumper setting. See also the specific
module

diagnostic/bootstrap switch, 3-6, 3-7
dialog mode, 3-11
DIP switch, 3-4
E102, 3-6

features, 3-3

floating point, 3-3

KDF11-B CPU factory, 3-5

jumper setting, 3-4, 3-5

KDF11-BA CPU factory, 3-5, B-3

LED display, 3-3, 3-4, 4-10

KDJ11-B CPU, 2-6

MMU chip, 3-3

module, 8-44

SLU

connectors, 3-2

MSV11-P memory factory, 2-25
Q/CD setting, A-1
RD52 fixed-disk drive, 10-11

switch setting, 3-6

RDb5n fixed-disk drive, 8-14

where to install, 3-4

RQDX1-E module, 5-19
RQDXE module, 5-22
RQDXn, 5-15

TQK50 tape controller, 5-35

panel, 3-2

KDF11-BA CPU

baud rate switch, B-8

break on halt jumper function, B-4
device selection jumpers, B-4
factory

KDF11-B. See also KDF11-B CPU,
KDF11-BA CPU
boot

diagnostics, 4-8

ROM , 4-9

console emulator mode, 4-11
message

diagnostic ROM, 4-9

jumper setting, 3-5, B-3
switch setting, B-2

halt/trap jumper config., B-6
jumper settings

configuration, B-3
power-up mode, B-6

ROM configuration, B-7
SLU format, B-7

format, 4-8

KDJ11-B. See also KDJ11-B CPU

location, 4-8

boot ROM message, 4-4-4-5
console emulator mode, 4-11

module identification, 1-1, 1-3
octal display, 4-10

message

Index-9

Index

diagnostic ROM, 4-4-5

format, 4-4, 4-6
location, 4-3

octal address, 4-4
module identification, 1-1, 1-3
octal display
message, 4-4

ODT addressing, 4-11, 4-12
self-test error table, 4-2, 4-3
startup message, 1-5, 1-6
testing procedure, 4-2

KDJ11-B CPU. See also version 7/6
ROM

automatic boot mode, 2-10
baud rate switch, 2-7-2-9

RQDXn disk controllers, 5-15

TQK50 tape controller, 5-37
List

dialog command, 2-12, 3-11
parameters, 2-13
List boot programs

command, 2-20
use, 2-20
List parameters

command, 2-13
use, 2-13

Load EEPROM boot in memory
command, 2-21
use, 2-21

Load EEPROM data in set-up table

cache, 2-4

command, 2-20

description, 2-2-2-23

use, 2-20

dialog mode, 2-11-2-23

Location 0, 2-17

difference between

Location 26, 2-15

MicroPDP-11/73 and

Logical unit number. See LUN

MicroPDP-11/83, 2-4

LPV11 interface

DIP switch, 2-5, 2-7

additional jumpers, 6-50

EEPROM, 2-5

CSR address, 6-50

features, 2-4

description, 6-49

hertz, 2-4

internal cabling, 6-51

lustration, 2-9

interrupt vector, 6-50

LEDs, 2-6

part numbers, 6-49

prevent access to set-up, G-2

LSI-11 bus. See Q22-Bus backplane

ROM part numbers, G-1

LTC switch, 7-7, 9-10

ROM, version 7 and 6 difference,

LUN

G-1-G-5
SLU display panel, 2-3

configuration example, D-3
jumpers, D-1

where to install, 2-9

RQDXn jumper setting, 5-15

KDJ11-B CPU 2-2-2-23

standard configuration, D-2

Kernel mode, 2-17

unit number jumpers, D-2

LEDs

Map

control panel, 7-7

dialog command, 2-12, 3-11

CPU console board, 9-10

module status, 4-20

KDF11-B display, 3-4, 4-10
KDJ11-B CPU, 2-6

Index-10

Mass storage
BA123 enclosure, 9-11

Index

BA23 enclosure, 7-8

CPU installation, 2-9

devices, 5-1-5-29

definition, 2-1

FRU procedure, 10-10

hertz, 2-4

options, 5-1-5-29

identification, 1-1,1-3

signal distribution board, 9-12
signal distribution panel, 7-9

KDJ11-B CPU, 2-2-2-23
memory installation, 2-9

Memory battery OK, 2-15
Memory management unit, 3-3

startup message, 1-5, 1-6
Mode

Memory module. See MSV11-P,
MSV11-]D,-JE, MSV11-Q

automatic boot, 2-10, 3-10
console emulator, 4-4, 4-8, 4-11

Message

dialog, 2-11-2-23

formatting, C-3

enter 24 mode, 2-15

XXDP+ message format, 4-22

KDF11-B

Micro-ODT. See also J11 Micro-ODT,
ODT

addressing, 4-11, 4-12
commands,table, 4-12

MicroPDP-11/23. See also KDF11-B
CPU, KDF11-BA CPU
automatic boot mode, 3-10

automatic boot, 3-10

console emulator, 4-8, 4-11
dialog, 3-11
KDJ11-B

automatic boot, 2-10-2-10
console emulator, 4-4, 4-11
dialog mode, 2-11-2-23

definition, 2-1

kernel, 2-17

description, 3-1

power-up, 2-15

dialog mode, 3-11

reconstruct, C-5

identification, 1-1,1-3

reformat, C-4

message location, 4-8
startup message, 1-5

restart, 2-15

testing procedures, 4-8

MicroPDP-11/73. See also KDJ11-B,
KDJ11-B CPU

automatic boot mode, 2-10
CPU installation, 2-9

restore, C-5

set-up, 2-13-2-23

Modifying a program, 4-23
Module. See also specific module
caution, removal, 8-42

identification, 1-1,1-3
KDJ11-B CPU, 2-2-2-23

communication options, 6-1-6-51
configuration instructions, 6-2
control register, 6-2
CPU identification, 1-1, 1-3
CSR address,to configure, A-9

memory installation, 2-9
self-test error code, 4-2, 4-3

fixed address, 6-2

definition, 2-1
hertz, 2-4

startup message, 1-5, 1-6
testing procedure, 4-2

MicroPDP-11/83. See also KDJ11-B,
KDJ11-B CPU

ejector levers, 8-43
vector, 6-2

vector, to configure, A-9
floating address, 6-2, A-9
vector, 6-2, A-9

Index-11

Index

vector, to configure, A-9

FRU procedure, 8-42, 10-22
grant continuity, 8-42
installation guidelines, 8-42, 8-44,
10-22, 10-23, A-2
installation precautions, 8-44
jumper and switch settings, 10-22
KDF11-B CPU, 3-1-3-11
KDJ11-B CPU, 2-2-2-23

where to install, 2-9

MSV11-Q memory

CSR address setting, 2-38
description, 2-36

jumper setting, 2-39
memory address setting, 2-37
storage capacity, 2-36
Notes, definition, X

mass storage. See particular device
MSV11-]D,-JE-, 2-27-2-36

MSV11-P memory, 2-23

MSV11-Q memory, 2-36-2-39
physical priority, A-2
RQDX1-E, 5-16
RQDXE, 5-16

RQDXn disk controllers, 5-12-5-15

Octal display

console emulator mode, 4-4
what to do, 4-4
Octal values

adding, A-21

configuration worksheet, A-21
ODT. See also J11 micro-ODT, ROM
ODT

status, 4-20

status register, 6-2

TQK50 tape controller, 5-35-5-38
MSV11-]D,-JE- memory

commands,table, 4-12
enter, 2-15
J11 micro, 2-15

battery backup, 2-29

ROM, 2-22-2-23

CSR address setting, 2-34, 2-35

using, 4-11-4-12

description, 2-27

On/off switch removal, 10-8

discussion, 2-27-2-36

Options

error correction, 2-29

backup devices, 5-30-5-39

jumper setting, 2-31

communications, 6-1-6-51

LEDs, 2-35, 2-36

mass storage 5-1-5-29

location, 2-28, 2-30

to order, 6-1

memory address
setting, 2-32-2-34

Part numbers, 8-2-8-3, 10-1-10-2

table, 2-33

PDP-11/23 PLUS. See also BA11-S

storage capacity, 2-28

where to install, 2-9
MSV11-P memory

enclosure

external cabling example, B-23,
B-24

additional modules, 2-26

factory configuration, B-1

CSR address setting, 2-26

filter connector installation, B-23

description, 2-23

identification, 1-1

factory jumper setting, 2-25

internal cabling, B-22

starting address setting, 2-26-2-27

module installation, B-23

storage capacity, 2-23

startup message, 1-5

Index-12

Index

system identification, B-1
upgrading, B-1
PMG count

command, 2-15
use, 2-15

PMI

use, 2-15

Private memory interconnect. See PMI
Processor mastership grant, 2-15

Program modules

deselect commands, 4-20
select commands, 4-20

CD bus, 2-9

PSW, 2-15

data transfer, 2-30
KDJ11-Bf CPU, 2-4

Q22-Bus

location of memory module, 2-30
use, 2-9, 2-30

Power requirements, A-4, A-5
Power supply
BA11-S

control board, B-18
location in enclosure, B-11
monitor board, B-18
power master board, B-18
removal, B-16

specifications, B-17

BA123, 9-18-9-21
BA23, 7-14-7-18
cable removal, 8-28
caution, voltage, 10-26
circuit breaker, 9-20
connectors, 7-18, 9-19
control signals, 7-15

FRU procedure, 8-32-8-35, 10-26
installation, 8-35

line cord voltage drop, 9-20
part number 7-15, 8-2
regulator LEDs, 9-10

regulators, 8-32, 9-18, 9-19
replacement, 8-2

specification, BA23-A, 7-16-7-17

VOLT SEL, 7-18, 9-19
voltage

distribution, 7-15, 9-19
tolerance, 8-32

Power-up mode
command, 2-15

Q22-Bus backplane
BA123-A enclosure, 9-15-9-17
BA23-A enclosure 7-11
CD bus, 7-12

connectors, 7-11, 7-12, 9-16
discussion, 7-11-7-13
grant continuity, 7-13, 8-42, 9-15
module installation, 7-12, 7-13

Q22-Bus module cover removal, 8-27
RC25 disk subsystem

CSR address guidelines, 5-3

description, 5-2
interrupt vector, 5-3

number of MSCP devices, 5-3
part numbers, 5-2
RD console board

controls and indicators, 9-13
location 9-13

RD51 fixed-disk drive. See also RD5n
fixed-disk drive
DIP shunt setting, 5-7

read/write board removal, 8-158-19

RD52 fixed-disk drive. See also RDb5n
fixed-disk drive
jumper setting, 8-14, 10-11

MPCB FRU procedure, 8-20-8-22,
10-12

RD53 fixed-disk drive. See also RDb5n
fixed-disk drive
jumper setting, 5-8, 10-16

Index-13

Index

read/write board removal, 8-23,
10-16

RDb5n fixed-disk drive
additional, 8-2

RILO2 disk subsystem

controller, 5-26
description, 5-26
part numbers, 5-26

connectors, 7-9

RLV12 controller
CSR address, 5-29
description, 5-28
interrupt vector, 5-29

description, 5-6

ROM

cables, 5-6, 5-7

caution, handling, 10-10
caution, head positioner, 8-12

FRU procedure, 8-12, 10-10

boot from off board, 2-19
disable ROM address, 2-17

installation, 10-10

KDF11-B

formatting instruction, 5-8, C-1-C-2

part numbers, 5-6

boot error table, 4-9
identification, 1-4

RD51 factory configuration, 5-7

part number, 1-4

jumper clip, 8-14, 10-11

RD52 configuration, 5-7

RD53 configuration, 5-8
replacement guideline, 8-2

shipping carton part number, 8-12,
10-10

signal distribution panel, 7-9
when to format, 8-12, 8-16, 10-10

Read/write board

KDJ11 boot error table, 4-4-4-5
ODT commands, 2-22, 2-23
ROM ODT
enter, 2-22
guidelines, 2-22

table of commands, 2-22-2-23

RQDX1-E extender module
description, 5-17

RD51 removal, 8-15-8-19

installation guidelines, 5-16

RD52 removal, 8-20-8-22, 10-12

jumper setting, 5-19

RD53 removal, 8-23, 10-16
Ready

use, 5-13, 5-17

RQDXE extender module

indicator, 7-7, 9-13

description, 5-20

switch, 7-7, 9-13

drive arrangements,factory setting,

Reconstruct mode, C-5

Reformat mode, C-4

E-3

factory

Regulator, power supply, 8-32, 9-10

configuration, E-3