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EK-DIV32-IN-002

October 1990

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Document:	DIV32 Hardware Installation Guide
Order Number:	EK-DIV32-IN
Revision:	002
Pages:	121
Original Filename:

OCR Text

DIV32 Hardware Installation
Guide
Order Number EK-DIV32-IN-002

digital equipment france, annecy

Second Edition, 9 October 1990
The information in this document is subject to change without notice and should
not be construed as a commitment by Digital Equipment Corporation. Digital
Equipment Corporation assumes no responsibility for any errors that may appear
in this document.
The software described in this document is furnished under a license and may
be used or copied only in accordance with the terms of such license.
No responsibility is assumed for the use or reliability of software on equipment
that is not supplied by Digital Equipment Corporation or its affiliated companies.
Restricted Rights: Use, duplication, or disclosure by the U.S. Government is
subject to restrictions as set forth in subparagraph (c) (1) (ii) of the Rights in
Technical Data and Computer Software clause at DFARS 252.227-7013.
Copyright ©1989, 1990 by Digital Equipment France
All Rights Reserved.

The following are trademarks of Digital Equipment Corporation:
DEC
DEC/CMS
DEC/MMS
DECnet
DECsystem–10
DECSYSTEM–20
DECUS
DECwriter

DIBOL
EduSystem
IAS
MASSBUS
PDP
PDT
RSTS
RSX

UNIBUS
VAX
VAXcluster
VMS
VT

This document was prepared using VAX DOCUMENT, Version 1.1

WARNING
The following installation instructions provide specific directions for the safe installation of the module kit. For your protection from possible shock or energy hazards, do not attempt to
access or disassemble parts of the equipment other than those
specified. Refer other servicing to qualified personnel.

ATTENTION
Suivre les instructions pour installer le module en toute
sécurité. Afin d’éviter tout risque d’électrocution, ne manipuler que les pièces indiquées. Pour toute autre opération, faire
appel à du personnel qualifié.

VORSICHT
Um das Modul richtig und gefahrlos zu installieren, gehen Sie
unbedingt nach den folgenden Anweisungen vor: Hantieren
Sie auf keinen Fall an anderen als den angegebenen Teilen,
oder versuchen Sie nicht, diese zu entfernen. Es könnte sonst
Berührungsspannung auftreten.
Wartungsarbeiten dürfen
ausschließlich von geschultem Fachpersonal ausgeführt werden.

PRECAUCIÓN
Las siguientes instrucciones de instalación ofrecen directrices
específicas para una segura instalación del juego de módulos.
Para evitar posibles descargas eléctricas o cualquier tipo de
riesgo, no intente acceder o desarmar ninguna parte del equipo
que no sean las especificadas. En caso de cualquier duda,
consulte a personal cualificado.

WAARSCHUWING
Volg onderstaande instructies voor het veilig installeren van de
kaart. Om risico’s of elektrische schokken te voorkomen, alleen
werkzaamheden verrichten aan de gespecificeerde onderdelen.
Laat onderhouds- en reparatiewerkzaamheden over aan gekwalificeerd personeel.

ATTENZIONE
Le seguenti istruzioni per l’installazione forniscono informazioni per una corretta installazione del modulo. Onde evitare
possibili pericoli di scariche di corrente, non tentare di accedere
o smontare parti diverse da quelle indicate. Consultare, per
qualsiasi ulteriore necessità, personale qualificato.

iii

ADVARSEL
Følgende installasjonsveiledning viser nøyaktig fremgangsmåte
for en korrekt og trygg installasjon av modulen. For å unngå
elektrisk støt eller andre personskader, er det viktig at man
ikke berører eller prøver å ta fra hverandre deler av utstyret.
Utfør bare det som er anvist i håndboken. Overlat all annen
reparasjon og service til kvalifisert fagfolk.

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VARNING

Följande installationsanvisning innehåller exakt vägledning för
en säker installation av modulen. För att undvika elektriska
stötar eller annan fara, bör man inte försöka komma åt eller
montera isär andra delar av utrustningen, än de angivna. För
övrig service, kontakta en fackman.

VAROITUS
Seuraavat asennusohjeet varmistavat moduulikitin turvallisen
asennuksen. Jotta vaaratilanteilta vältytään, ei pidä koskea
muihin laitteiston osiin kuin ohjeissa on mainittu eikä pyrkiä
purkamaan niitä. Muut ylläpitotoimet on jätettävä koulutetun
ylläpitohenkilöstön huoleksi.

ADVARSEL
Følgende installationsprocedure giver vejledning i sikker installation af modulet. Forsøg ikke at berøre eller adskille andre dele
af udstyret, da der kan være risiko for højspænding. Yderligere
service bør udføres af autoriseret personale.

AVISO
As instruções que se seguem explicam a forma de proceder, com
segurança, à instalação de um "kit" de módulo. Não tente,
de forma alguma, aceder ou abrir as partes do equipamento
que não se refiram aqui, para que não corra o risco de choques
eléctricos. Qualquer outro tipo de serviços que necessite, exija
a presença de pessoal qualificado.

USA
This equipment generates, uses, and may emit radio frequency.
The equipment has been type tested and found to comply with
the limits for a Class A computer device pursuant to Subpart
J of Part 15 of FCC rules, which are designed to provide reasonable protection against such radio frequency interference.
Operation of this equipment in a residential area may cause
interference in which case the user at his own expense will be
required to take whatever measures may be required to correct
the interference.

Contents
Preface

xiii

Chapter 1 ISDN and DIV32 Overview
1.1
1.2
1.3

1.4

1.5

CCITT Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
Country Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
The ISDN Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.3.1
Basic Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.3.2
The S-Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.3.3
ISDN Mechanical Interface . . . . . . . . . . . . . . . . . . . . . . . 1–4
1.3.4
ISDN Electrical Interface . . . . . . . . . . . . . . . . . . . . . . . . . 1–6
1.3.5
S-Bus Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6
DIV32 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8
1.4.1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8
1.4.2
Host Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9
DIV32 Versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–10

Chapter 2 Installing the DIV32-M
2.1

2.2
2.3

System Enclosures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
2.1.1
BA23 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
2.1.2
BA123 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
2.1.3
H9642 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
Pre-installation: Site Preparation . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
The Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
vii

2.4

2.5
2.6
2.7
2.8
2.9

2.3.1
Unpacking the Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.2
Software Backup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–11
Checking the System Configuration . . . . . . . . . . . . . . . . . . . . . . . 2–12
2.4.1
Bus Continuity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–17
2.4.1.1
MicroVAX Memory Interconnect . . . . . . . . . . . . 2–18
2.4.1.2
BA23 Bus Continuity . . . . . . . . . . . . . . . . . . . . . 2–19
2.4.1.3
BA123 Bus Continuity . . . . . . . . . . . . . . . . . . . . 2–20
2.4.1.4
H9642 Bus Continuity . . . . . . . . . . . . . . . . . . . . 2–21
2.4.2
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–22
2.4.3
Module Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–22
Finding CSR Addresses and Interrupt Vectors . . . . . . . . . . . . . . . 2–23
Configuring the DIV32-M Module . . . . . . . . . . . . . . . . . . . . . . . . 2–26
Operating System Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–27
Testing the Existing System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–28
Installing the DIV32-M Module . . . . . . . . . . . . . . . . . . . . . . . . . . 2–28
2.9.1
BA23 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–29
2.9.2
BA123 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–33
2.9.3
H9642 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–39

Chapter 3 Installing the DIV32-S
3.1
3.2
3.3

3.4

3.5
3.6
3.7
3.8
3.9

BA200 Series Enclosures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
Pre-installation: Site Preparation . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
The Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
3.3.1
Unpacking the Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
3.3.2
Inspecting the EMI and EOS Clips . . . . . . . . . . . . . . . . . 3–9
3.3.3
Software Backup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–10
Checking the System Configuration . . . . . . . . . . . . . . . . . . . . . . . 3–11
3.4.1
Bus Continuity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–15
3.4.2
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–15
3.4.3
Module Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–16
Finding CSR Addresses and Interrupt Vectors . . . . . . . . . . . . . . . 3–17
Configuring the DIV32-S Module . . . . . . . . . . . . . . . . . . . . . . . . . 3–20
Operating System Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–21
Testing the Existing System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–22
Relocating Modules in the BA200 Series Enclosure . . . . . . . . . . . 3–23
viii

3.10
3.11

3.9.1
Modules with Blank Covers . . . . . . . . . . . . . . . . . . . . . . 3–23
3.9.2
Modules with Handles . . . . . . . . . . . . . . . . . . . . . . . . . . 3–25
Installing the DIV32-S Module . . . . . . . . . . . . . . . . . . . . . . . . . . 3–27
Verifying the Earth Connections . . . . . . . . . . . . . . . . . . . . . . . . . 3–28

Chapter 4 Running Diagnostics and Hardware
Troubleshooting
4.1
4.2

4.3

4.4

4.5

Testing Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
DIV32 MDM Diagnostics Overview . . . . . . . . . . . . . . . . . . . . . . . . 4–3
4.2.1
Test FV1 - Self-Test and Register Read/Write Test . . . . . . 4–3
4.2.2
Test FV2 - Device Initialisation Test . . . . . . . . . . . . . . . . 4–3
4.2.3
Test FV3 - Basic Command List Test . . . . . . . . . . . . . . . . 4–3
4.2.4
Test FV4 - Interrupt Test . . . . . . . . . . . . . . . . . . . . . . . . . 4–3
4.2.5
Test FV5 - Extended Command List Test . . . . . . . . . . . . . 4–4
4.2.6
Test FV6 - Simple Data Transmission Test on channels B1
and B2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.7
Test FV7 - Buffer Addressing Test . . . . . . . . . . . . . . . . . . 4–4
4.2.8
Test FV8 - Multiple Data Transmission Test on channels B1,
B2, and D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.9
Functional Service Test FS1 - ISDN External
Loopback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.10 Exerciser Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5
4.2.11 Utility Test - Run Specified Self-Test Routine . . . . . . . . . 4–5
Running MDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5
4.3.1
Running Service Mode Tests . . . . . . . . . . . . . . . . . . . . . . 4–6
4.3.2
Running Utility Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6
DIV32-M Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6
4.4.1
DIV32-M FRUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6
4.4.2
DIV32-M MDM FRU Report . . . . . . . . . . . . . . . . . . . . . . 4–8
4.4.3
DIV32-M Troubleshooting Flowchart . . . . . . . . . . . . . . . . 4–8
DIV32-S Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–11
4.5.1
DIV32-S FRUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–11
4.5.2
DIV32-S MDM FRU Report . . . . . . . . . . . . . . . . . . . . . . 4–12
4.5.3
DIV32-S Troubleshooting Flowchart . . . . . . . . . . . . . . . 4–12

Appendix A UK Requirements for DIV32 Use
A.1
A.2
A.3

DIV32-M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–1
DIV32-S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–2
Definitions of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–2
A.3.1
Adjacent Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–2
A.3.2
Grant Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–2

Index
Figures
1–1
1–2
1–3
1–4
1–5
1–6
1–7
1–8
2–1
2–2
2–3
2–4
2–5
2–6
2–7
2–8
2–9
2–10
2–11
2–12
2–13
2–14
2–15
2–16

Basic Access Throughput . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
Electrical Connections between DIV32 and ISDN S-Bus . . 1–4
Signal Levels on ISDN Bus . . . . . . . . . . . . . . . . . . . . . . . . 1–6
Point to Point Configuration . . . . . . . . . . . . . . . . . . . . . . . 1–7
Short Passive Bus Configuration . . . . . . . . . . . . . . . . . . . . 1–7
Extended Passive Bus Configuration . . . . . . . . . . . . . . . . . 1–7
DIV32-S Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–10
DIV32-M Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–12
BA23 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
BA123 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
H9642 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
DIV32-M Kit Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
DIV32-M Cabinet Kit Contents . . . . . . . . . . . . . . . . . . . . 2–11
BA23 Configuration Worksheet . . . . . . . . . . . . . . . . . . . . 2–12
BA123 Configuration Worksheet . . . . . . . . . . . . . . . . . . . 2–13
H9642 Configuration Worksheet . . . . . . . . . . . . . . . . . . . 2–14
BA23 Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–20
BA123 Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–21
DIV32-M DIP Switch Positioning . . . . . . . . . . . . . . . . . . . 2–26
CSR Address Switch Setting Guide . . . . . . . . . . . . . . . . . 2–27
Removing the BA23 I/O Distribution Panel . . . . . . . . . . . 2–29
Installing the Module in the BA23 . . . . . . . . . . . . . . . . . . 2–30
Connecting the Cables to the Insert Panel on the BA23 . 2–32
Removing the BA123 Right Side Panel . . . . . . . . . . . . . . 2–34
x

2–17
2–18
2–19
2–20
2–21
2–22
3–1
3–2
3–3
3–4
3–5
3–6
3–7
3–8
3–9
3–10
3–11
3–12
3–13
3–14
4–1
4–2
4–3
4–4

Removing the BA123 Inner Panel . . . . . . . . . . . . . . . . . . 2–35
Removing the BA123 Card Cage Door . . . . . . . . . . . . . . . 2–36
Installing the Module in the BA123 . . . . . . . . . . . . . . . . . 2–37
Opening the H9642 Rear Door . . . . . . . . . . . . . . . . . . . . . 2–39
Lowering the H9642 Rear I/O Distribution Panel . . . . . . 2–41
Installing the Module in the H9642 . . . . . . . . . . . . . . . . . 2–42
BA200 Series Enclosures . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4
DIV32-SA Kit Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–7
DIV32-SF Kit Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–8
EOS Clips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–9
EMI Clips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–10
BA200 Series Configuration Worksheets . . . . . . . . . . . . . 3–12
Bus Grant Continuity Path . . . . . . . . . . . . . . . . . . . . . . . 3–15
DIV32-S DIP Switch Positioning . . . . . . . . . . . . . . . . . . . 3–20
CSR Address Switch Setting Guide . . . . . . . . . . . . . . . . . 3–21
Removing the Blank Covers . . . . . . . . . . . . . . . . . . . . . . . 3–24
Unlocking the Release Levers . . . . . . . . . . . . . . . . . . . . . 3–26
Inserting the Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–29
Earth Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–30
Attaching the Gap Filler Assembly . . . . . . . . . . . . . . . . . 3–32
The BC23T ISDN TE Cable and H3073 Loopback . . . . . . . 4–7
The BC23U ISDN TE Cable and H3074 Loopback . . . . . . . 4–8
DIV32-M Troubleshooting Flowchart . . . . . . . . . . . . . . . . 4–9
DIV32-S Troubleshooting Flowchart . . . . . . . . . . . . . . . . 4–13

Tables
1–1
2–1
2–2
2–3
2–4
3–1
3–2
3–3
3–4

Pin Assignments for the DIV32 ISDN Connector . . . . . . . . 1–5
DIV32-M Kit Check-List . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
DIV32-M Cabinet Kit Check-List . . . . . . . . . . . . . . . . . . . 2–11
Power and Bus Load Data for DIV32-M . . . . . . . . . . . . . . 2–15
Devices Supported by SYSGEN . . . . . . . . . . . . . . . . . . . . 2–24
DIV32-SA Kit Check-List . . . . . . . . . . . . . . . . . . . . . . . . . . 3–7
DIV32-SF Kit Check-List . . . . . . . . . . . . . . . . . . . . . . . . . . 3–8
Power and Bus Load Data for DIV32-S . . . . . . . . . . . . . . 3–13
Devices Supported by SYSGEN . . . . . . . . . . . . . . . . . . . . 3–18

Preface

Intended Audience
•

Digital Field Service

•

Digital’s customers who are on Self-Maintenance contracts

•

OEMs

•

Third-party maintenance companies

The reader is assumed to be familiar with:
•

Q-Bus

•

MDM

•

Normal fault-finding procedures

xiii

For the Self-Maintenance Customer
IMPORTANT
Only qualified service personnel should remove or install
modules. If you are not qualified to perform the installation
of the DIV32 kit, call Digital Field Service to schedule an
installation.

It is your responsibility to perform a software backup before Digital Field
Service personnel arrive at the site. This step is important to ensure that
data is not lost during any installation process.
IMPORTANT
Make sure you are wearing an antistatic wrist strap connected
to an earthed antistatic work surface before you handle the
modules. The system modules can be damaged by static discharge.
Also make sure the bus grant continuity path is intact after
the installation. There must not be any empty backplane slots
between modules.

To install the DIV32 kit, carefully follow the installation procedure in
Chapter 2, Installing the DIV32-M or Chapter 3, Installing the DIV32S. If you have problems performing the installation, call Digital Field
Service for assistance.
For Digital Field Service
Make sure you take precautions against static when unpacking and
installing the module. Use the earth strap and antistatic mat found
in the Static-Dissipative Field Service Kit (part number 29-26246). The
antistatic kit is part of the Field Service tool kit, not the DIV32 kit.
To install the DIV32 kit, carefully follow the installation procedure in
Chapter 2 (-M version) or Chapter 3 (-S version).
Submit a LARS Form After the Installation. For information on
completing this form, contact your unit manager.

xiv

Conventions
The following conventions are used in this guide:
WARNING

Provides information to prevent personal injury.

IMPORTANT

Provides information to prevent damage to equipment or
software.

NOTE

Provides general information about the current topic.

Purpose of this Document
This guide describes the installation of:
•

one of the DIV32-M series kits into a BA23, BA123, or H9642 system
enclosure

•

one of the DIV32-S series kits into a BA200 system enclosure.

It also gives reference information for engineers who are tracing faults
on a DIV32 board, showing how to diagnose and replace DIV32 Field
Replaceable Units (FRUs).

Associated Documentation
Digital provides the following documentation set for the DIV32 hardware:
•

DIV32 Hardware Installation Guide

•

DIV32 Maintenance Print Set

•

DIV32 Device Driver Manual

The following documents provide reference material:
•

MicroVAX Systems Maintenance Guide, 1 EK-O01AA-MG

•

MicroVAX 3500 and MicroVAX 3600 Systems Maintenance Update 1 ,
EK-159AA-UD

•

MDM User’s Guide, AA-FM7AB-DN

Included in the MicroVAX Systems Maintenance Kit (ZNABX-GZ, C5).

United States customers may order documents from:
Digital Equipment Corporation
Peripherals and Supplies Group
P. O. Box CS2008
Nashua, NH 03061
Outside the United States, customers should contact their local Digital
sales office.

xvi

Chapter 1
ISDN and DIV32 Overview
1.1 CCITT Standards
The CCITT has defined ISDN connectivity in the following documents:
•

ISDN User-Network Interface Physical Layer Specification (CCITT
I.430, 1984 and 1988)

•

ISDN User-Network Interface Data Link Layer Specification (CCITT
I.441, 1984)

•

ISDN User-Network Interface Layer 3 Specification (CCITT I.451,
1984)

•

Interface Connector for ISDN Basic Access (ISO/DIS 8877).

The DIV32 hardware is compliant with I.430 and ISO/DIS 8877 (i.e. it
implements layer 1); layers 2 and 3 are handled by software.

1.2 Country Specifications
The countries have also defined national ISDN standards. The DIV32
complies with these national standards for the layer 1 interface for ISDN
basic rate access.

ISDN and DIV32 Overview 1–1

1.3 The ISDN Network
1.3.1 Basic Access
The Integrated Services Digital Network (ISDN) is a communications
network which can carry a huge variety of information, such as voice
(telephone conversations), fax, data, images, videotext, and so on. To do
this, the physical path is split into concatenated slots of one byte each at
64 Kbps. Depending on the number of such slots on the physical path,
access to ISDN is called either "basic access" (also named S0) or "primary
access" (also named S2 in Europe and T1 in the USA).
The one to which the DIV32 connects is the basic access. It includes
2 channels, to carry any information defined by the user. These are
called the "B" channels (B for Bearer). In addition, a third channel is
dedicated to signalling, i.e call set-up, dialling and so on. It is called
the "D" channel. The basic access also includes some more bits for frame
synchronisation and various physical layer protocol bits. These overhead
bits correspond to a throughput of 48 Kbps. In summary, the basic access
comprises:
two B-channels at 64 Kbits per second each
one D-channel at 16 Kbits per second for signalling information
overhead bits totalling 48 Kbits per second.
The aggregate throughput is 192 Kbits per second, but only 144 Kbps
of this (two B-Channels and the D-Channel) are useful. Figure 1–1
illustrates this.
The DIV32 hardware only supports layer 1 of every channel protocol. On
each B-channel, the DIV32 supports DECNET and PSI communications
using DDCMP or HDLC (single or double byte addressing). The two BChannels are independent - one may run DECNET and the other PSI
simultaneously.
The D-Channel protocol is handled by the VAX ISDN Software; the
DIV32 hardware supports LAPD on this channel.

1–2 ISDN and DIV32 Overview

Figure 1–1: Basic Access Throughput

Key:
1

48 Kbit/s overhead

16 Kbit/s D-Channel

64 Kbit/s B-Channel

total 192 Kbit/s
total 144 Kbits/s

AE-A005P-00

1.3.2 The S-Interface
The ISDN network basic access interfaces with the user through an NT
(Network Termination) device. The NT generates a bus on which up to 8
TEs (Terminal Equipment) can be connected. Several configurations are
supported, as defined in Section 1.3.5.
The NT includes 100 resistors to match the bus impedance. At the
other end of the bus, such resistors must be provided.

NOTE
The DIV32 does not provide the bus with terminating resistors.
Make sure that the S-Bus wall socket has been fitted with such
resistors.

ISDN and DIV32 Overview 1–3

Figure 1–2: Electrical Connections between DIV32 and ISDN S-Bus

ISDN
Network

DIV32-M

17-00712

ISDN Cable

H3071

DIV32-SA
or
DIV32-SF

Wall
Socket

ISDN Cable
Wall
Socket

ISDN Cable
other TE

Wall
Socket

100 ohm
Terminating Resistors
AEO-A-0006-1

1.3.3 ISDN Mechanical Interface
The interface to the ISDN Basic Access bus is via an ISDN cable, which
connects the S-Bus wall socket (jack) to the DIV32 ISDN socket (see
Figure 1–2).
The latter is located on the I/O panel (DIV32-M) or on the module handle
(DIV32-S). The physical characteristics of this connector are defined by
ISO 8877; the DIV32 pin assignments are given in Table 1–1.

1–4 ISDN and DIV32 Overview

Table 1–1: Pin Assignments for the DIV32 ISDN Connector
Pin Number

not connected

Transmit

Receive

Transmit

not connected

Polarity

Note that pins 1, 2, 7, and 8 are defined by ISO 8877 as being for optional
power supplies on the ISDN Bus. These are not used by the DIV32.

ISDN and DIV32 Overview 1–5

1.3.4 ISDN Electrical Interface
The signal levels on the bus are shown in Figure 1–3. A binary "1" is
represented by no signal (0 Volt), while "0"s are alternately represented
by +750 mV and -750 mV.
Figure 1–3: Signal Levels on ISDN Bus
+750 mV
1

0 mV
-750 mV
AE-A000A-00

1.3.5 S-Bus Configurations
The DIV32 works as a TE on the Basic Rate Access bus. It can be set
anywhere on the bus, provided that the bus configuration rules defined
by CCITT I.430 are adhered to. I.430 defines the following three possible
configurations:
1. Point to point connection—see Figure 1–4. The DIV32 is the only
TE. The line length can be up to 1 km.
2. Short passive bus—see Figure 1–5. The DIV32 can be any of the
eight TE’s on the bus; there are no constraints on the other seven
TE’s.
3. Extended passive bus—see Figure 1–6. The DIV32 can be any of
the eight TE’s on the bus; there are no constraints on the other seven
TE’s. The DIV32, like any other TE, must however be located within
the last 50 metres of the bus.

1–6 ISDN and DIV32 Overview

Figure 1–4: Point to Point Configuration

TERMINATING
RESISTOR
(100 ohms)

Max 1000 m

TE DEVICE

AE-A0009-00

Figure 1–5: Short Passive Bus Configuration

Max 150 m

TERMINATING
RESISTOR
(100 ohms)

Max 50 m

TE DEVICE

TE DEVICE
DIV32

TE DEVICE

AE-A000B-00

Figure 1–6: Extended Passive Bus Configuration

Max 500 m

Max 50 m

TE DEVICE

TERMINATING
RESISTOR
(100 ohms)

TE DEVICE
DIV32
AE-A000C-00

ISDN and DIV32 Overview 1–7

1.4 DIV32 Overview
1.4.1 General Description
This section briefly describes the architecture of the DIV32.
The DIV32 is an ISDN Basic Rate access communications controller for
Q-Bus VAX systems (i.e. MicroVAXes). It can simultaneously handle the
two B-Channels and the D-Channel defined by Basic Rate access.
The DIV32 controller provides the following features:
•

Full compliance with the CCITT I 430 Standard

•

The DIV32 supports the LAPD synchronous protocol on the DChannel (16 Kbits/sec).

•

The DIV32 supports the following synchronous protocols on the two
B-channels:
DDCMP
HDLC (single and double byte addressing)
Rate adaptation on the B-Channels is not supported: the speed is
fixed at 64 Kbits/sec.

A microprocessor controls the internal operation of the DIV32. ROMbased diagnostics, running on the microprocessor, extensively test the
module each time it is powered on or reset. An MDM diagnostic program
for MicroVAX systems is also available.
All DIV32 functions and configurations are programmable, apart from
the Q-Bus base address which is set up on DIP switches.
Data is transferred between the memory of the host system and the
DIV32’s internal data buffers by DMA transfer. Command blocks are
used to send instructions to, and receive responses from, the DIV32.
Command blocks and responses reside in DIV32 memory and are read
and written by the host via three of the registers. The DIV32 has four
registers in the Q-Bus I/O space which are used to initiate and monitor
command block processing.

1–8 ISDN and DIV32 Overview

1.4.2 Host Machine
The DIV32 must be configured on MicroVAX Q-Bus systems in accordance with the standard Q-Bus configuration rules. The DIV32 uses:
•

One Q-Bus QUAD slot

•

for the DIV32-M only: one I/O slot, size B

•

3.9 AC loads

•

One DC load

•

5.5 A maximum current at 5V.

It does not require a 12V supply.
The DIV32 Q-Bus Base address must be set, using on-board DIP
switches. The interrupt vector address is programmable.
The placement of the DIV32 on the bus must respect device-ordering
guidelines; this is important because it makes extensive use of DMA
transfers over the Q-Bus.

ISDN and DIV32 Overview 1–9

1.5 DIV32 Versions
Figure 1–7: DIV32-S Module

Edge Connector

DIV32
-SA

M7531

-PA

Safety
Warning:
"See
Instructions
for Use"

!#$

Edge Connector
Rev
nn

AEO-A-0001-3

The DIV32 is available in the following two versions:
1. The DIV32-S, which consists of:
•

A quad-height module (M7531-PA), for insertion into a BA200Series Enclosure

•

This DIV32 Hardware Installation Guide

•

Gap fillers and screws (DIV32-SF only)

1–10 ISDN and DIV32 Overview

•

A loopback plug for testing.

There are two ‘‘subspecies’’ of DIV32-S – the DIV32-SF, which is used
when installation takes place on-site, and the DIV32-SA, which is
identical to the DIV32-SF† but is installed at the factory.
The DIV32-S board is illustrated in Figure 1–7.
2. The DIV32-M, which consists of:
•

A quad-height module (M7531-00)

•

This DIV32 Hardware Installation Guide

It has three variations, depending on the enclosure used:
Enclosure

Part Number of Required Cabinet Kit

BA23

CK-DIV32-MB

BA123

CK-DIV32-MA

H9642

CK-DIV32-MF

Each cabinet kit for the DIV32-M consists of:
•

the DIV32-M interface panel H3071 (size B)

•

a 17-00712 flat cable, which goes from the DIV32 board to the
I/O panel. The length of this cable will depend on the cabinet kit
used.

•

a loopback plug H3072.

The DIV32-M board is illustrated in Figure 1–8.
All DIV32 versions are in the form of a QUAD Q-Bus module, the
dimensions of which are are 21.6 cm
26.5 cm (8.51 inches
10.44
inches).
The DIV32-M is connected to the ISDN lines through the ribbon cables
and the H3071 interface panel; the DIV32-S is connected directly to the
ISDN lines.
The ISDN cable is used to connect the H3071 interface panel (DIV32-M)
or module handle (DIV32-S) to the ISDN standard plate.

† except that the -SF has the gap fillers and screws

ISDN and DIV32 Overview 1–11

Edge Connector

Figure 1–8: DIV32-M Module

Safety
Warning:
"See
Instructions
for Use"

Edge Connector

AEO-A-000Q-2

1–12 ISDN and DIV32 Overview

Chapter 2
Installing the DIV32-M
This chapter concerns the -M version only. If you are installing
the DIV32 in a BA200 series enclosure, ignore this chapter; refer
instead to Chapter 3.
WARNING
The following installation instructions provide specific directions for the safe installation of the module kit. For your protection from possible shock or energy hazards, do not attempt to
access or disassemble parts of the equipment other than those
specified. Refer other servicing to qualified personnel.

Installing the DIV32-M 2–1

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VARNING

Följande installationsanvisning innehåller exakt vägledning för
en säker installation av modulen. För att undvika elektriska
stötar eller annan fara, bör man inte försöka komma åt eller

2–2 Installing the DIV32-M

montera isär andra delar av utrustningen, än de angivna. För
övrig service, kontakta en fackman.

2.1 System Enclosures
The DIV32-M is used in three types of MicroVAX enclosures.
BA23

Used in tabletop, pedestal, and rack-mounted installations

BA123

Used as a movable floor-standing unit

H9642

Used to hold large mass storage devices (tape and disk
drives)

For more information: See the MicroVAX Systems Maintenance Guide
for more information about the enclosures.

Installing the DIV32-M 2–3

2.1.1 BA23 Enclosure
The BA23 is used in tabletop, pedestal, and rack-mounted installations.
Figure 2–1 shows the pedestal version. The BA23 includes the following
components:
•

230 watt power supply

•

control panel

•

I/O distribution panel

•

two fans

•

space for two 13.3 cm (5.25 in) mass storage devices.

The backplane has eight slots for modules compatible with the Q22-bus.

2–4 Installing the DIV32-M

Figure 2–1: BA23 Enclosure

MA-X0020-88

Installing the DIV32-M 2–5

2.1.2 BA123 Enclosure
Figure 2–2: BA123 Enclosure

MA-X0021-88

The BA123 is a movable floor-standing enclosure (Figure 2–2).
BA123 includes the following components:
•

460 watt power supply

•

control panel

•

I/O distribution panel

•

two fans

2–6 Installing the DIV32-M

The

•

space for five 13.3 cm (5.25 in) mass storage devices.

The backplane has 12 slots for modules compatible with the Q22-bus.

2.1.3 H9642 Enclosure
Figure 2–3: H9642 Enclosure

MA-X0022-88

The H9642 enclosure (Figure 2–3) contains two rack-mounted BA23
enclosures. The H9642 also includes the following components:
•

two 230 watt power supplies

•

two control panels

•

one large I/O distribution panel

•

four fans
Installing the DIV32-M 2–7

•

space for four 13.3 cm (5.25 in) and two 35.6 cm (14 in) mass storage
devices

Each BA23 enclosure in the H9642 has its own 8-slot backplane. The
backplanes are connected by an expansion kit.

2.2 Pre-installation: Site Preparation
The DIV32-M uses one quad slot in the backplane. Before continuing,
check that there is one such slot available.
Check that the ISDN access point (the female connector on the wall) is
close enough to the VAX for connection with the supplied ISDN cable.

2.3 The Kits
Two kits are required for the installation of the DIV32-M:
1. The DIV32-M kit (the board itself plus this book)
2. The DIV32-M cabinet kit (ribbon cable, screws, etc.)
There are three varieties of the DIV32-M cabinet kit, one for each type
of enclosure.
Enclosure

Part Number of Required Cabinet Kit

BA23

CK-DIV32-MB

BA123

CK-DIV32-MA

H9642

CK-DIV32-MF

2.3.1 Unpacking the Kits
Unpack the shipment and check the contents as follows:
1. Look for external damage on the shipping container, such as dents,
holes, or crushed corners.
2. Do not dispose of the packing material until you have installed the
module and tested the system successfully.
IMPORTANT
Use the Static-Dissipative Field Service Kit (Part Number
29-26246) for the next step. If you have another antistatic
kit, follow the instructions with the kit.

2–8 Installing the DIV32-M

3. Put on your antistatic wrist strap. Attach the crocodile clip to the
metal chassis of the system enclosure. Place the antistatic mat on
your work surface. The earth wire has a press stud (snap) that
connects to the mat.
4. Use Table 2–1 and Table 2–2 to identify the contents of the DIV32
kit. The check-list numbers correspond to the numbered items in
Figure 2–4 and Figure 2–5.
5. Remove the DIV32 module from the antistatic bag.
6. Inspect the module for shipping damage. Carefully check for cracks,
breaks, and loose components.
7. Place the DIV32 module on the antistatic mat.
If any item is missing or damaged, contact:
•

the customer’s sales representative

•

the customer’s delivery agent.

Installing the DIV32-M 2–9

Table 2–1: DIV32-M Kit Check-List
Part Description

Part Number

DIV32-M module

M7531-00

This Installation Guide

EK-DIV32-IN-002

Figure 2–4: DIV32-M Kit Contents

1
2
g

MicroVAX
digi ta l

DIV32 Hardware
Installation Guide

AEO-A-000R-2

2–10 Installing the DIV32-M

Table 2–2: DIV32-M Cabinet Kit Check-List
Part Description

Part Number

Four screws

90-06021-01

Four washers

90-0663-00

Ribbon cable
For BA123 kit: 25 inch ribbon cable

17-00712-01

For BA23 kit: 15 inch ribbon cable

17-00712-02

For H9642 kit: 37 inch ribbon cable

17-00712-03

Interface panel

H3071

Loopback plug

H3072

Figure 2–5: DIV32-M Cabinet Kit Contents

4
5

AEO-A-002R-1

2.3.2 Software Backup
It is the customer’s responsibility to perform a software backup.
Make sure that the software has been backed up before you continue.

Installing the DIV32-M 2–11

2.4 Checking the System Configuration
Before you install the DIV32, you must complete a configuration worksheet for the enclosure that you are using (see Figure 2–6 or Figure 2–7
or Figure 2–8). This step ensures that you do not exceed the system’s
limits for power and bus loads.
Figure 2–6: BA23 Configuration Worksheet
CURRENT (AMPS)

POWER

BUS LOADS

I/O PANEL INSERTS

(WATTS)

B (2X3)

A (1X4)

BACKPLANE
SLOT
1

MODULE

+5 V

+12 V

AB
CD

MASS
STORAGE

COLUMN
TOTALS

MUST NOT
EXCEED

36 A

7 A

230 W

INSTALLING AN ADAPTOR PLATE (PN 74-27720-01) GIVES YOU THREE MORE TYPE A INSERT
PANELS, BUT DECREASES THE NUMBER OF TYPE B INSERT PANELS TO TWO.

AE-N000S-00

2–12 Installing the DIV32-M

Figure 2–7: BA123 Configuration Worksheet

REGULATOR A
SLOT
1

AB
CD

MODULE

CURRENT (AMPS)
+5 V

+12 V

0.52

REGULATOR B

POWER
(WATTS)

CURRENT (AMPS)
+5 V

+12 V

BUS LOADSI/O INSERTS
B

POWER
(WATTS)

(2X3) (1X4)

2.60

MASS
STORAGE
5
4
3

2
1

COLUMN
TOTALS
MUST NOT
EXCEED

36 A

5 A

230 W

36 A

5 A

230 W

RECOMMENDED FOUR DRIVES MAXIMUM - TWO IN SHELVES 1 AND 2, AND TWO IN SHELVES
3, 4, OR 5. INSTALLING AN ADAPTOR PLATE (PN 74-27720-01) GIVES YOU THREE MORE
TYPE A INSERT PANELS, BUT DECREASES THE NUMBER OF TYPE B INSERT PANELS TO FOUR.

AE-N000T-00

You need to gain access to the modules installed in the system backplane
before you configure the system. Refer to the system documentation for
procedures to help you remove any covers and gain access to the modules.
To check the system configuration, perform the following steps:
1. On the worksheet, list all the devices already installed in the system.
Each module has an identifying label on the cover or handle.

Installing the DIV32-M 2–13

Figure 2–8: H9642 Configuration Worksheet

BACKPLANE
SLOT
1

AB
CD

UPPER
5

AB
CD

MODULE

CURRENT (AMPS)

M9404

POWER

BUS LOADS

+5 V

+12 V

(WATTS)

B (2X3)

A (1X4)

MASS
STORAGE

I/O PANEL INSERTS

1
2
COLUMN TOTALS

MUST NOT EXCEED
1

AB
CD

LOWER

M9405-YB

36 A

7 A

230 W

MASS
STORAGE
1
2
COLUMN TOTALS

MUST NOT EXCEED

36 A

7 A

230 W

INSTALLING AN ADAPTOR PLATE (PN 74-27720-01) GIVES YOU THREE MORE TYPE A INSERT
PANELS, BUT DECREASES THE NUMBER OF TYPE B INSERT PANELS TO NINE.

AE-N000U-00

2–14 Installing the DIV32-M

2. List all the devices you plan to install in the system.
3. Fill in the information for each device, using the data listed in
Table 2–3.
4. Add up the columns. Make sure the totals are within the limits for
the enclosure.
Table 2–3: Power and Bus Load Data for DIV32-M
Current (Amps)
(Max)

Power
(Max )

Module

+5 V

+12 V

Watts

AAV11

A1009

1.8

0.0

9.0

2.1

0.5

ADV11

A1008

3.2

0.0

16.0

2.3

0.5

AXV11

A026

2.0

0.0

10.0

1.2

0.3

DELQA

M7516

2.7

0.5

19.5

2.2

0.5

DEQNA

M7504

3.5

0.50

23.5

2.2

0.5

DFA01

M3121

1.97

0.40

14.7

3.0

1.0

DHV11

M3104

4.5

0.55

29.1

2.9

0.5

DIV32

M7531

5.5

0.0

27.5

3.9

1.0

DLVJ1

M8043

1.0

0.25

8.0

1.0

DMV11-M

M8053

3.4

0.4

21.8

2.0

1.0

DMV11-N

M8064

3.4

0.4

21.8

2.0

1.0

DPV11

M8020

1.2

0.30

9.6

1.0

DRQ3B

M7658

4.5

0.0

22.5

2.0

1.0

DRV1J

M8049

1.8

0.0

9.0

2.0

1.0

DRV1W

M7651

1.8

0.0

9.0

2.0

1.0

DSV11

M3108

5.43

0.69

38.0

3.9

1.0

DZQ11

M3106

1.0

0.36

9.3

1.4

0.5

IBQ01

M3125

5.0

0.0

25.0

4.6

1.0

Bus Loads

Installing the DIV32-M 2–15

Table 2–3 (Cont.): Power and Bus Load Data for DIV32-M
Current (Amps)
(Max)

Power
(Max )

Module

+5 V

+12 V

Watts

IEQ11

M8634

3.5

0.0

17.5

2.0

1.0

KA630

M7606

6.2

0.14

32.7

2.7

1.0

KDA50-Q

M7164

6.93

0.0

34.65

3.0

0.5

KDA50-Q

M7165

6.57

0.03

33.21

–

KLESI

M7740

3.0

0.0

15.0

2.3

1.0

KMV1A

M7500

2.6

0.2

15.4

3.0

1.0

KWV11

M4002

2.2

13 mA

11.156

1.0

0.3

LPV11

M8086

1.6

0.0

8.0

1.8

0.5

5.3

0.0

26.5

0.0

M9060

Bus Loads

MRV11

M7942

1.61

0.0

8.01

3.0

0.5

MS630-AA

M7607

1.0

0.0

5.0

–

MS630-BA

M7608

1.3

0.0

6.5

–

MS630-CA

M7609

2.1

0.0

10.5

–

MS650

M7621

2.7

0.0

13.5

–

RA70

3.3

2.9

69.4

–

RC25

1.0

2.5

35.0

–

RD51

1.0

1.6

24.2

–

RD52

1.0

2.5

35.0

–

RD53

0.9

2.5

34.5

–

RD54

1.3

1.34

23.7

–

RQDX2

M8639-YB

6.4

0.1

33.2

2.0

1.0

RQDX3

M7555

2.48

0.06

13.2

1.0

1 Value is for the unpopulated module only.

2–16 Installing the DIV32-M

Table 2–3 (Cont.): Power and Bus Load Data for DIV32-M
Current (Amps)
(Max)

Power
(Max )

Module

+5 V

+12 V

Watts

M7513

0.8

0.0

4.0

1.0

0.0

RX33

0.5

0.3

5.6

–

RX50

0.85

1.8

25.9

–

TK50

1.35

2.4

35.6

0.0

TK70

1.3

2.4

35.3

–

RQDXE

Bus Loads

TQK50

M7546

2.9

0.0

14.5

2.8

0.5

TQK70

M7559

3.5

0.0

17.5

4.3

0.5

TSV05

M7196

6.5

0.0

32.5

3.0

1.0

VCB01

M7602

5.0

0.0

25.0

3.0

1.0

VCB02

M7168

3.4

0.0

17.0

0.0

VCB02

M7169

5.8

0.75

38.0

3.5

1.0

2.4.1 Bus Continuity
This section describes the bus grant continuity for the BA23, BA123, and
H9642 enclosures.
A dual-height module has connectors that fit into two rows of a backplane
slot. Two dual-height modules can occupy one backplane slot.
A quad-height module has connectors that fit into all four rows of a
backplane slot. One quad-height module occupies one backplane slot.
The DIV32-M is a quad-height module.

Installing the DIV32-M 2–17

2.4.1.1 MicroVAX Memory Interconnect
Certain rows within certain slots on all the enclosures described in this
chapter are interconnected, forming a separate bus to the Q22-Bus. This
feature is termed MicroVAX Memory Interconnect. Note that the Q22Bus is only implemented on those rows which do not have MicroVAX
Memory Interconnect; thus the DIV32-M, which fills all four rows of a
slot, can only be placed in a slot which does not have any MicroVAX
Memory Interconnect rows within it.
The following table shows how the various enclosures are divided up
between Q22-Bus and MicroVAX Memory Interconnect (MMI).
Enclosure

Slot

Rows

Q-Bus or MMI

BA23

A,B

Q-Bus

BA23

C,D

MMI

BA23

A,B

Q-Bus

BA23

C,D

MMI

BA23

A,B

Q-Bus

BA23

C,D

MMI

BA23

4,5,6,7,8

all

Q-Bus

BA123

A,B

Q-Bus

BA123

C,D

MMI

BA123

A,B

Q-Bus

BA123

C,D

MMI

BA123

A,B

Q-Bus

BA123

C,D

MMI

BA123

A,B

Q-Bus

BA123

C,D

MMI

BA123

5 to 12 incl.1

all

Q-Bus

1 suitable for DIV32

2–18 Installing the DIV32-M

Enclosure

Slot

Rows

Q-Bus or MMI

BA123

all

neither

H9642

See values for BA23

2.4.1.2 BA23 Bus Continuity
The BA23 backplane has eight slots for dual- or quad-height modules
compatible with the Q22-bus. Each slot has four rows: A, B, C, and D.
Figure 2–9 shows the grant continuity for the backplane.
Rows C and D of slots 1, 2, and 3 are not on the Q-Bus (see Section 2.4.1.1). You should only install MS630 memory modules in rows C
and D of slots 2 and 3. You can install any dual-height modules in rows
A and B of slots 2 and 3. The CPU module uses slot 1.
If you install a dual-height module in any of the slots 4 to 8 inclusive, you
usually have to install another dual-height module or an M9047 grant
card in the other two rows of the slot. The exception is the last dualheight module installed on the grant continuity chain. For example, a
dual-height module installed in rows A and B of slot 6 does not need a
grant card in rows C and D, if it is the last module in the system.

Installing the DIV32-M 2–19

Figure 2–9: BA23 Backplane

D
C
B
A
1
2
3
4

5
6
7
8

MA-X0028-88

2.4.1.3 BA123 Bus Continuity
The BA123 has a 13-slot backplane. The first 12 slots of the backplane
are for dual- or quad-height modules compatible with the Q22-bus. Each
backplane slot has four rows: A, B, C, and D. Figure 2–10 shows the
grant continuity for the backplane.
The rows C and D of slots 1, 2, 3, and 4 are not on the Q-Bus (see
Section 2.4.1.1). You can use MS630 memory modules only in rows C
and D of slots 2 and 3. You can use any dual-height Q22-bus module in
the rows A and B of slots 2, 3, and 4. The CPU module uses slot 1.
As a rule, if you use any dual-height modules in slots 5 to 12 inclusive,
you must install another dual-height module or an M9047 grant card
in the other two rows of the slot. The exception is the last dual-height
module installed on the grant continuity chain. For example, if the last
dual-height module is in rows A and B of slot 9, you do not need a grant
card in rows C and D.

2–20 Installing the DIV32-M

Figure 2–10: BA123 Backplane
2
5

6
8

9
10
11
12
13

MA-X0029-88

2.4.1.4 H9642 Bus Continuity
The H9642 contains two BA23 enclosures. Each BA23 has its own
backplane (Figure 2–9). The backplanes are connected by the M9404
and M9405-YB dual-height interconnect modules. The M9404 module
must occupy the last dual-height Q22-bus slot (rows A and B, or rows
C and D) in the BA23-A (top) enclosure. The M9405-YB module must
occupy rows A and B of slot 1 in the BA23-C (bottom) enclosure. Since
the M9405-YB occupies this slot, the BA23-C cannot have a CPU module.
The locations and priorities of all other modules in the two BA23
enclosures are the same for each BA23.

Installing the DIV32-M 2–21

NOTE
If you install any devices in the BA23-C backplane, you must
install a module or grant card in all Q22-bus slots in the BA23-A
backplane. If there are any empty Q22-bus slots in the BA23-A
backplane, the devices in the BA23-C backplane will not work.

2.4.2 Power Supplies
The BA23 enclosure contains one 230 watt power supply.
The BA123 enclosure contains one 460 watt power supply with two
regulators. Regulator A supplies power to the odd-numbered slots in
the backplane. Regulator B supplies power to the even-numbered slots
in the backplane. The maximum power drawn from each regulator must
not exceed 230 watts.
The H9642 enclosure has two 230 watt power supplies, one in each BA23
enclosure.
Each power supply or power supply regulator in the enclosure must have
a minimum 4.5 amp load on the 5 volt output to maintain regulation. If
a power supply does not meet the minimum load requirement, you must
install an M9060 load module in one of the open backplane slots powered
by that power supply. Otherwise, the power supply enters an error mode
and shuts down the system.
If a power supply meets the minimum load requirement, you should
remove any existing M9060 load module.

2.4.3 Module Order
The order of modules in the backplane depends on four factors:
•

the relative use of devices in the system

•

the expected performance of each device relative to other devices

•

the ability of a device to tolerate delays between bus requests and
bus grants (delay tolerance)

•

the tendency of a device to prevent devices farther from the CPU
from accessing the bus.

2–22 Installing the DIV32-M

Use the following recommended module order as a guideline for installing
modules in a BA23, BA123, or H9642 enclosure. Read across, like normal
text.
KA620/KA630

MS630

AAV11

ADV11

AXV11

KWV11

DRV1J

TSV05

DEQNA/DELQA/DESQA

DPV11

DMV11
DIV32

DSV11

KMV1A

DZQ11

DHQ11

DFA01

LPV11

VCB02

DRV1W

IEQ11

ADQ32

DRQ3B

IBQ01

KLESI

TQK50

TQK70

KDA50

RQDX3

KFQSA

M9060

2.5 Finding CSR Addresses and Interrupt Vectors
When you add a DIV32 module to the backplane, you need to configure
the new module and reconfigure the modules already installed. Use the
following procedures to find the new CSR addresses and interrupt vectors
for the modules.
For modules in a MicroVAX system, you can either use the CONFIG
program, or you can manually calculate CSR addresses and interrupt
vectors. To calculate values manually, see Chapter 5 of the MicroVAX
Systems Maintenance Guide.
The CONFIG program is in the MicroVMS or VMS SYSGEN utility.
When you type in a list of the devices in the system, CONFIG automatically provides CSR address and interrupt vector information. Table 2–4
lists the devices supported by this utility.
If you have a non-Digital device, see the device documentation for
configuration information.

Installing the DIV32-M 2–23

Table 2–4: Devices Supported by SYSGEN
Device

Enter at DEVICE> Prompt

DHV11

DHQ11

DHV11

DELQA

QNA

DEQNA

QNA

DPV11

DRV1W

DR11W

DSV11

DIV32

DZQ11

DZ11

IEQ11

RQDX3

UDA

TQK50

TU81

TQK70

TU81

TSV05

TS11

To use the SYSGEN utility, follow these steps:
1. With VMS or MicroVMS running, log in to the system account.
2. Type the following command at the system command prompt:
MCR SYSGEN

3. Press Return . The utility responds with the prompt
SYSGEN>

4. At the prompt, type
CONFIGURE

5. Press Return . The utility responds with the prompt
DEVICE>

6. Enter the abbreviation for each system device (Table 2–4). Include
those devices already installed and those you intend to install.
2–24 Installing the DIV32-M

Enter one abbreviation per line, then press Return . The DEVICE>
prompt prompts you for another entry. If you are installing more
than one unit of a particular device, enter a space and the number
of devices after the abbreviation. For example, DHV11 2 indicates
two DHV11 modules.
7. After you have entered all devices, press Ctrl Z . The program displays
the following information for each device you entered:
CSR address and vector
the name assigned to the device by the operating system
the operating system support status (yes or no)
The program uses an asterisk (*) to indicate a floating address or
vector. If a particular device has several units, the first address
refers to the first device to be installed.
8. To exit from the SYSGEN utility, type EXIT at the SYSGEN prompt
and press Return .
9. Log out of the system account.

Installing the DIV32-M 2–25

2.6 Configuring the DIV32-M Module
You select the CSR address for the DIV32 by using the DIL switch (S1)
on the module (Figure 2–11). The CSR address is floating. The factory
setting for the DIV32 is 17761250 8 . If the system has other options with
floating addresses, you may need to change the factory setting.
Figure 2–11: DIV32-M DIP Switch Positioning

S1
1 2

3 4

5 6

7 8 9 10

Switch ON (Closed) - Binary 0

Switch OFF (Open) - Binary 1
FACTORY

SETTINGS

2–26 Installing the DIV32-M

AEO-A-0008-2

Figure 2–12: CSR Address Switch Setting Guide
EXAMPLE SETTING
= 17760640(0CTAL)

SWITCHPACK
= SWITCH ON (CLOSED) = BINARY 0

= SWITCH OFF (OPEN) = BINARY 1

INTERPRETED

DECODED

AS ALL 1s

BY DEVICE

SEE
NOTE
BIT

DEVICE
ADDRESS

0
EACH GROUP IDENTICAL
0

= 6

= 7

NOTE:
WRITE THE ADDRESS YOU
NEED IN THE BLANK ROW.

= 1

= 2

= 0

= 3

= 4

= 5

= 6

= 7

MA-X0199-88

To calculate the CSR address for the DIV32, see Section 2.5.
Figure 2–12 as a guide in setting the switches.

Use

The interrupt vector is also floating. It is set by the software and cannot
be changed by switches.

2.7 Operating System Shutdown
It is the customer’s responsibility to shut down the operating
system software.
Make sure that the operating system software has been shut down before
you continue. Leave the system power on.

Installing the DIV32-M 2–27

2.8 Testing the Existing System
You need to gain access to the system controls before you can test the
existing system. Refer to the system documentation for procedures to
help you gain access to the system controls. Test the existing MicroVAX
system as follows:
1. Insert the MicroVAX diagnostic monitor (MDM) diagnostic tape cartridge or diskette into the system drive.
2. Boot MDM.
3. Test the existing system to make sure it is running properly. See
the MicroVAX Systems Maintenance Guide for information on testing
and troubleshooting. Chapter 4 of this guide also has information on
testing and troubleshooting.
4. After the test runs successfully, remove the tape cartridge or diskette
and turn the |
power switch off (position ). Unplug the mains
(power) cable from the mains outlet.
IMPORTANT
Always remove the tape cartridge or diskette before turning
power off.

2.9 Installing the DIV32-M Module
IMPORTANT
Only qualified service personnel should remove or install modules.

Check the recommended module order listed in Section 2.4.3 to determine
which slot you should install the DIV32-M module in. If you need to
relocate modules in the backplane, keep the modules in their original
order.
The DIV32-M module connects to the ISDN network through the I/O
distribution panel. You install an insert panel for the module in a size B
cut-out on the I/O distribution panel. The insert panel is part of the kit.
The following sections provide the installation procedure for each type of
enclosure.

2–28 Installing the DIV32-M

2.9.1 BA23 Enclosure
Figure 2–13: Removing the BA23 I/O Distribution Panel

MA-X0031-88

Installing the DIV32-M 2–29

Figure 2–14: Installing the Module in the BA23

AE-A000P-00

Install the DIV32-M module in the BA23 enclosure as follows:
WARNING
For installation of the DIV32 in the UK, note the following
disclaimer:
‘‘The ports indicated do not provide isolation sufficient to satisfy
the requirements of the relevant parts of BS6301. Apparatus
connected to these ports must have either been approved to the
relevant parts of BS6301 or have previously been evaluated
against British Telecom (Post Office) Technical Guides 2 or 26

2–30 Installing the DIV32-M

and given permission to attach. Other usage will invalidate any
approval given to this apparatus.’’
The DIV32-M must be installed in enclosure type H9642, BA23
or BA123 supplied by Digital Equipment Company under the
terms of General Approval NS/G/1234/J/100003.
No card or assembly which generates or uses a voltage in excess
of 42.4V peak or DC may be fitted in adjacent Q-Bus slots of
the enclosure in which the DIV32-M is fitted.
For further details, see Appendix A.

IMPORTANT
Make sure you are wearing an earthed antistatic wrist strap
when you remove or install modules.

1. Turn the |
power switch off (
cable from the mains outlet.

) and remove the mains (power)

2. Remove the rear cover.
3. Loosen the two screws that hold the I/O distribution panel in place.
Swing the assembly open and remove the earth strap screws (Figure 2–13).
4. Connect the ribbon cable from the kit to connector J1 on the DIV32M module (Figure 2–14). The cable connector is keyed to prevent
incorrect installation. Fold the cable neatly, so it does not interfere
with other modules or cables.
5. Insert the DIV32-M module into the appropriate backplane slot
(Figure 2–14), using the recommended module order listed in Section 2.4.3.
6. Mount the H3071 interface panel in any selected position on the I/O
distribution panel (Figure 2–15).
7. Connect the other end of the ribbon cable to the H3071 interface
panel.
8. Plug the mains (power) cable into a mains outlet and turn the |
power switch on ( | ).
9. After 15 seconds, check that the module’s green self-test LED is on.
This indicates that the self-test was successful.

Installing the DIV32-M 2–31

10. If the green self-test LED does not turn on, make sure the module
is correctly inserted. If the LED still does not turn on, see Chapter
6 of the MicroVAX Systems Maintenance Guide for troubleshooting
procedures.
11. Turn the |
power switch off (
cable from the mains outlet.

) and remove the mains (power)

12. To complete the installation, reverse steps 1 to 3.
Figure 2–15: Connecting the Cables to the Insert Panel on the BA23

I/O
DISTRIBUTION
PANEL

H3071
INTERFACE
PANEL

COLOURED
STRIPE

2–32 Installing the DIV32-M

AEO-A-000N-2

2.9.2 BA123 Enclosure
Install the DIV32-M module in the BA123 enclosure as follows:
WARNING
For installation of the DIV32 in the UK, note the following
disclaimer:
‘‘The ports indicated do not provide isolation sufficient to satisfy
the requirements of the relevant parts of BS6301. Apparatus
connected to these ports must have either been approved to the
relevant parts of BS6301 or have previously been evaluated
against British Telecom (Post Office) Technical Guides 2 or 26
and given permission to attach. Other usage will invalidate any
approval given to this apparatus.’’
The DIV32-M must be installed in enclosure type H9642, BA23
or BA123 supplied by Digital Equipment Company under the
terms of General Approval NS/G/1234/J/100003.
No card or assembly which generates or uses a voltage in excess
of 42.4V peak or DC may be fitted in adjacent Q-Bus slots of
the enclosure in which the DIV32-M is fitted.
For further details, see Appendix A.

IMPORTANT
Make sure you are wearing an earthed antistatic wrist strap
when you remove or install modules.

power switch off (
1. Turn the |
cable from the mains outlet.

) and remove the mains (power)

2. Open the rear door.
3. Loosen the screw that connects the right side panel to the rear of the
BA123 (Figure 2–16).

Installing the DIV32-M 2–33

Figure 2–16: Removing the BA123 Right Side Panel

MA-X0034-88

4. Two snap fasteners hold the bottom of the panel to the BA123. Pull
the bottom of the panel out until you release the fasteners.
5. Lift the panel slightly to release it from the lip at the top of the
BA123. Remove the panel.

2–34 Installing the DIV32-M

Figure 2–17: Removing the BA123 Inner Panel

NEWER SYSTEMS
MA-X0035-88

6. Newer systems also have an inner panel. To remove, unscrew the
two 1/4-turn fasteners at the base of the panel (Figure 2–17).
7. Older systems have a card cage door instead of an inner panel
(Figure 2–18). Remove the door by releasing the two clasps at the
front end of the door and swinging the door open.

Installing the DIV32-M 2–35

Figure 2–18: Removing the BA123 Card Cage Door

OLDER SYSTEMS
MA-X0036-88

2–36 Installing the DIV32-M

Figure 2–19: Installing the Module in the BA123

COLOURED
STRIPE

AE-A000M-00

8. Connect the ribbon cable from the kit to connector J1 on the DIV32M module (Figure 2–19). The cable connector is keyed to prevent
incorrect installation. Fold the cable neatly, so it does not interfere
with other modules or cables.
9. Insert the DIV32-M module into the appropriate backplane slot
(Figure 2–19), using the recommended module order listed in Section 2.4.3.
10. Mount the H3071 interface panel in any selected position on the I/O
distribution panel (Figure 2–15).
Installing the DIV32-M 2–37

11. Connect the other end of the ribbon cable to the H3071 interface
panel.
12. Plug the mains (power) cable into a mains outlet and turn the |
power switch on ( | ).
13. After 15 seconds, check that the module’s green self-test LED is on.
This indicates that the self-test was successful.
14. If the green self-test LED does not turn on, make sure the module
is correctly inserted. If the LED still does not turn on, see Chapter
6 of the MicroVAX Systems Maintenance Guide for troubleshooting
procedures.
power switch off (
15. Turn the |
cable from the mains outlet.

) and remove the mains (power)

16. To complete the installation, reverse steps 1 to 7.

2–38 Installing the DIV32-M

2.9.3 H9642 Enclosure
Figure 2–20: Opening the H9642 Rear Door

MA-X0037-88

Install the DIV32-M module in the H9642 enclosure as follows:
WARNING
For installation of the DIV32 in the UK, note the following
disclaimer:

Installing the DIV32-M 2–39

‘‘The ports indicated do not provide isolation sufficient to satisfy
the requirements of the relevant parts of BS6301. Apparatus
connected to these ports must have either been approved to the
relevant parts of BS6301 or have previously been evaluated
against British Telecom (Post Office) Technical Guides 2 or 26
and given permission to attach. Other usage will invalidate any
approval given to this apparatus.’’
The DIV32-M must be installed in enclosure type H9642, BA23
or BA123 supplied by Digital Equipment Company under the
terms of General Approval NS/G/1234/J/100003.
No card or assembly which generates or uses a voltage in excess
of 42.4V peak or DC may be fitted in adjacent Q-Bus slots of
the enclosure in which the DIV32-M is fitted.
For further details, see Appendix A.

IMPORTANT
Make sure you are wearing an earthed antistatic wrist strap
when you remove or install modules.

power switch off (
1. Turn the |
cable from the mains outlet.

) and remove the mains (power)

2. Use the Allen key (hex wrench) supplied with the system to unlock
the rear door. Open the rear door (Figure 2–20).
3. Use a screwdriver to loosen the two 1/4-turn fasteners in the upperleft and upper-right corners of the rear I/O distribution panel. Lower
the I/O distribution panel (Figure 2–21).

2–40 Installing the DIV32-M

Figure 2–21: Lowering the H9642 Rear I/O Distribution Panel

1/4 TURN
SCREWS

MA-X0038-88

4. Connect the ribbon cable from the kit to connector J1 on the DIV32M module (Figure 2–22). The cable connector is keyed to prevent
incorrect installation. Fold the cable neatly, so it does not interfere
with other modules or cables.
5. Insert the DIV32-M module into the appropriate backplane slot
(Figure 2–22), using the recommended module order listed in Section 2.4.3.
6. Mount the H3071 interface panel in any selected position on the I/O
distribution panel (Figure 2–15).

Installing the DIV32-M 2–41

Figure 2–22: Installing the Module in the H9642

COLOURED
STRIPE

AE-A000K-00

7. Connect the other end of the ribbon cable to the H3071 interface
panel.
8. Plug the mains (power) cable into a mains outlet and turn the |
power switch on ( | ).
9. After 15 seconds, check that the module’s green self-test LED is on.
This indicates that the self-test was successful.

2–42 Installing the DIV32-M

) and remove the mains (power)

12. To complete the installation, reverse steps 1 to 3.

Installing the DIV32-M 2–43

Chapter 3
Installing the DIV32-S
This chapter concerns the -S version only. If you are not installing the DIV32 in a BA200 series enclosure, ignore this chapter; refer instead to Chapter 2.
WARNING
The following installation instructions provide specific directions for the safe installation of the module kit. For your protection from possible shock or energy hazards, do not attempt to
access or disassemble parts of the equipment other than those
specified. Refer other servicing to qualified personnel.

Installing the DIV32-S 3–1

%& 
(

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56#B78

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VARNING

Följande installationsanvisning innehåller exakt vägledning för
en säker installation av modulen. För att undvika elektriska
stötar eller annan fara, bör man inte försöka komma åt eller

3–2 Installing the DIV32-S

montera isär andra delar av utrustningen, än de angivna. För
övrig service, kontakta en fackman.

3.1 BA200 Series Enclosures
The BA200 series enclosures have a 6- or 12-slot Q22-bus backplane.
Figure 3–1 shows the 12-slot BA213 and the 6-slot BA214 enclosure
chassis. The BA213 has one or two modular power supplies, and the
BA214 has one power supply.
The backplane implements the Q22-bus on rows A and B of each slot.
The MicroVAX Memory Interconnect is implemented on rows C and D
of each slot. Fixed disk drives face the rear of the enclosure, providing

Installing the DIV32-S 3–3

Figure 3–1: BA200 Series Enclosures

BA213 ENCLOSURE

BA214 ENCLOSURE
MA-X0008-88

easy access to the drive signal and power cables. A TK tape drive faces
the front of the enclosure.
The major difference between the BA200 series enclosure and other
microsystem enclosures is the way you connect external devices to the
system. Modules in the BA200 series enclosure connect directly to
external devices through I/O connectors on the module handles. Other
enclosures require an insert panel and internal cabling between the
module and the device.
There are two main differences between the modules used in the BA200
series enclosure and the modules used in the other microsystem enclosures:

3–4 Installing the DIV32-S

1. Modules with external I/O connectors have attached bulkhead handles. These handles replace the insert panels and internal cabling
found in the BA23 and BA123 enclosures.
2. Non-I/O modules (such as memory modules) have blank bulkhead
covers.
In addition, BA200 series enclosures use a special I/O connecting cover
that fits over the CPU module. The H3600-SA cover has a two-piece
ribbon cable that plugs into the console SLU and power-up configuration
connectors on the CPU.
The module handles and blank covers form an electrical seal that complies with regulations for electromagnetic interference (EMI) for both
keeping radio frequency interference generated by the system in the enclosure, and preventing external radio frequencies from entering the enclosure. The module handles and blank covers also help guarantee proper
airflow.
For more information: See the MicroVAX Systems Maintenance Guide
to learn more about BA200 series enclosures.

3.2 Pre-installation: Site Preparation
The DIV32-S uses one quad slot in the backplane. Before continuing,
check that there is one such slot available.
Check that the ISDN access point (the female connector on the wall) is
close enough to the VAX for connection with the supplied ISDN cable.

3.3 The Kit
3.3.1 Unpacking the Kit
Unpack the shipment and check the contents as follows:
1. Look for external damage on the shipping container, such as dents,
holes, or crushed corners.
2. Do not dispose of the packing material until you have installed the
module and tested the system successfully.
IMPORTANT
Use the Static-Dissipative Field Service Kit (Part Number
29-26246) for the next step. If you have another antistatic
kit, follow the instructions with the kit.

Installing the DIV32-S 3–5

3. Put on your antistatic wrist strap. Attach the crocodile clip to the
metal chassis of the system enclosure. Place the antistatic mat on
your work surface. The earth wire has a press stud (snap) that
connects to the mat.
4. Use Table 3–1 or Table 3–2 to identify the contents of the DIV32
kit. The check-list numbers correspond to the numbered items in
Figure 3–2 or Figure 3–3.
5. Remove the DIV32 module from the antistatic bag.
6. Inspect the module for shipping damage. Carefully check for cracks,
breaks, and loose components.
7. Place the DIV32 module on the antistatic mat.
If any item is missing or damaged, contact:
•

the customer’s sales representative

•

the customer’s delivery agent.

3–6 Installing the DIV32-S

Figure 3–2: DIV32-SA Kit Contents

3
1
2
g

MicroVAX
digi ta l

DIV32 Hardware
Installation Guide

AEO-A-0003-1

Table 3–1: DIV32-SA Kit Check-List
Part Description

Part Number

DIV32-SA module

M7531-PA

This Installation Guide

EK-DIV32-IN-002

Loopback plug

H3072

Installing the DIV32-S 3–7

Figure 3–3: DIV32-SF Kit Contents

3
g

MicroVAX
digi ta l

DIV32 Hardware
Installation Guide

2
4
AEO-A-0002-1

Table 3–2: DIV32-SF Kit Check-List
Part Description

Part Number

DIV32-SF module

M7531-PA

Two gap filler assemblies, consisting of two
gap fillers and four flat-head screws

70-24505-01

This Installation Guide

EK-DIV32-IN-002

Loopback plug

H3072

3–8 Installing the DIV32-S

3.3.2 Inspecting the EMI and EOS Clips
To comply with regulations on electromagnetic interference (EMI), the
bulkhead handles, blank covers, and gap fillers have transient protection
EMI and electrical overstress (EOS) clips. These clips are earthed
through the module handle.
Figure 3–4: EOS Clips

AEO-A-000J-1

1. Check the EMI and EOS clips on the DIV32-S for residue or corrosion. Figure 3–5 shows two of the four EMI clips, seen from the
solder side of the board; Figure 3–4 shows one of the two EOS clips,
seen from the components side of the board. Also check the EMI clips
on the two gap fillers. Remove any residue or corrosion with alcohol.
2. Make sure the EMI and EOS clips are arched. When you press them
slightly, they should return to their original shape.
3. If any clip is missing or broken, replace it.
EMI clip

Part Number 12-26340-01

EOS clip

Part Number 12-26922-01

Installing the DIV32-S 3–9

4. Place the DIV32-SF module on the antistatic mat.
Figure 3–5: EMI Clips

AEO-A-000H-1

3.3.3 Software Backup
It is the customer’s responsibility to perform a software backup.
Make sure that the software has been backed up before you continue.

3–10 Installing the DIV32-S

3.4 Checking the System Configuration
Before you install the DIV32, you must complete a configuration worksheet for the BA200 series enclosure (see Figure 3–6). This step ensures
that you do not exceed the system’s limits for power and bus loads.
You need to gain access to the modules installed in the system backplane
before you configure the system. Refer to the system documentation for
procedures to help you remove any covers and gain access to the modules.
To check the system configuration, perform the following steps:
1. On the worksheet, list all the devices already installed in the system.
Each module has an identifying label on the cover or handle.
2. List all the devices you plan to install in the system.
3. Fill in the information for each device, using the data listed in
Table 3–3.
4. Add up the columns. Make sure the totals are within the limits for
the enclosure.

Installing the DIV32-S 3–11

Figure 3–6: BA200 Series Configuration Worksheets
12 SLOT ENCLOSURE

RI G HT-H AL F POWER SU PPL Y
SL O T
( ABCD)

M O DUL E

C U R R EN T

AMPS

POWER

5 V

12 V

(WATTS)

BUS LOADS
AC

M ASS ST O RAG E
>>> T APE 1

0 .0

>>> DI SK 1

0 .0

0 .0
0 .0

1
2
3
4
5
6

TOTAL: RIGHT-HALF
PO W ER SUPPL Y
MUST NOT
EXCEED

3 3 .0

7 .0

2 3 0 .0

L EF T -H AL F POWER SU PPL Y
SL O T
( ABCD)

M O DUL E

C U R R EN T

AMPS

POWER

5 V

12 V

(WATTS)

7
8
9
10
11
12
M ASS ST O RAG E
DI SK
DI SK
DI SK
TOTAL: LEFT-HALF
PO W ER SUPPL Y
MUST NOT
EXCEED

3 3 .0

7 .0

2 3 0 .0

TOTAL BU S L OAD S
MU ST N OT EXC EED

3 5 .0 2 0 .0

6 SLOT ENCLOSURE

POWER SUPPLY
SLOT
(ABCD)

MODULE

CURRENT

AMPS

POWER

5 V

12 V

(WATTS)

33.0

7.0

230.0

BUS LOADS

1
2
3
4
5
6
T O T AL :
PO W ER SUPPL Y
MUST NOT
EXCEED

TOTAL: BUS LOADS
MUST NOT EXCEED

3 5 .0 2 0 .0

NO T E: PO WER SU PPL IES MAY D IFFER . C H EC K YOU R
PO WER SU PPL Y SPEC IFIC ATION S TO C ON FIR M TH E
M AX IMU M WATTAGE.
MA-X0012-88

3–12 Installing the DIV32-S

Table 3–3: Power and Bus Load Data for DIV32-S
Current (Amps)
(Max)

Power
(Max )

Module

+5 V

+12 V

Watts

AAV11

A1009

1.8

0.0

9.0

2.1

0.5

ADV11

A1008

3.2

0.0

16.0

2.3

0.5

AXV11

A026

2.0

0.0

10.0

1.2

0.3

CXA16-M

M3118-YA

1.6

200 mA

10.4

3.0

0.5

CXB16-M

M3118-YB

2.0

0.0

10.0

3.0

0.5

CXY08-M

M3119-YA

1.8

300 mA

12.6

3.2

0.5

DELQA

M7516

2.7

0.5

19.5

2.2

0.5

DEQNA

M7504

3.5

0.50

23.5

2.2

0.5

DFA01

M3121

1.97

0.40

14.7

3.0

1.0

DIV32

M7531

5.5

0.0

27.5

3.9

1.0

DPV11

M8020

1.2

0.30

9.6

1.0

DRQ3B

M7658

4.5

0.0

22.5

2.0

1.0

DRV1J

M8049

1.8

0.0

9.0

2.0

1.0

DRV1W

M7651

1.8

0.0

9.0

2.0

1.0

DSV11

M3108

5.5

0.7

35.4

3.9

1.0

DZQ11

M3106

1.0

0.36

9.3

1.4

0.5

IBQ01

M3125

5.0

0.0

25.0

4.6

1.0

IEQ11

M8634

3.5

0.0

17.5

2.0

1.0

KA630

M7606

6.2

0.14

32.7

2.7

1.0

KA650

M7620

6.0

0.14

33.6

2.7

1.0

KDA50-Q

M7164

6.93

0.0

34.65

3.0

0.5

KDA50-Q

M7165

6.57

0.03

33.21

–

Bus Loads

Installing the DIV32-S 3–13

Table 3–3 (Cont.): Power and Bus Load Data for DIV32-S
Current (Amps)
(Max)

Power
(Max )

Module

+5 V

+12 V

Watts

KLESI

M7740

3.0

0.0

15.0

2.3

1.0

KMV1A

M7500

2.6

0.2

15.4

3.0

1.0

KWV11

M4002

2.2

13 mA

11.156

1.0

0.3

LPV11

M8086

1.6

0.0

8.0

1.8

0.5

5.3

0.0

26.5

0.0

M9060

Bus Loads

MRV11

M7942

1.61

0.0

8.0

3.0

0.5

MS630-AA

M7607

1.0

0.0

5.0

–

MS630-BA

M7608

1.3

0.0

6.5

–

MS630-CA

M7609

2.1

0.0

10.5

–

MS650

M7621

2.7

0.0

13.5

–

RA70

3.3

2.9

69.4

–

RD53

0.9

2.5

34.5

–

RD54

1.3

1.34

23.7

–

TK50

1.35

2.4

35.6

0.0

TK70

1.3

2.4

35.3

–

TQK50

M7546

2.9

0.0

14.5

2.8

0.5

TQK70

M7559

3.5

0.0

17.5

4.3

0.5

TSV05

M7196

6.5

0.0

32.5

3.0

1.0

1 Value is for the unpopulated module only.

3–14 Installing the DIV32-S

3.4.1 Bus Continuity
Bus grant signals pass through each installed module, using the A
connectors of each slot. Figure 3–7 shows the path of the bus grant
signals. To ensure the continuity of this path, use bus grant continuity
cards (M9047) in empty backplane slots.
Figure 3–7: Bus Grant Continuity Path
12

PROCESSOR

MA-X0013-88

3.4.2 Power Supplies
The BA200 series enclosure contains one or two 230 watt power supplies.
•

A 6-slot enclosure has one power supply, to the left of the backplane.

•

A 12-slot enclosure normally has two power supplies.
–

If however there is only one power supply, it is to the right of the
backplane.

–

If there are two power supplies, the one to the right of the
backplane powers slots 1 through 6, and the one to the left of
the backplane powers slots 7 through 12.

Installing the DIV32-S 3–15

Each power supply in the enclosure must have a minimum 5 amp load
on the 5 volt output to maintain regulation. If a power supply does not
meet the minimum load requirement, you must install an M9060-YA load
module in one of the open backplane slots powered by that power supply.
Otherwise, the power supply enters an error mode and shuts down the
system.
If a power supply meets the minimum load requirement, you should
remove an existing load module. See Section 3.9 for procedures on
installing or removing a load module.

3.4.3 Module Order
The order of modules in the backplane depends on four factors:
•

the relative use of devices in the system

•

the expected performance of each device relative to other devices

•

the ability of a device to tolerate delays between bus requests and
bus grants (delay tolerance)

•

the tendency of a device to prevent devices farther from the CPU
from accessing the bus.

Use the following recommended module order as a guideline for installing
modules in a BA200 enclosure. Read across, like normal text.
KA620/KA630/KA650

MS630/MS650

AAV11

ADV11

AXV11

KWV11

DRV1J

TSV05

DEQNA/DELQA/DESQA

DPV11

DMV11
DIV32

DSV11

KMV1A

DZQ11

DFA01

CXY08

CXB16

CXA16

CXF32

LPV11

VCB02

DRV1W

IEQ11

ADQ32

DRQ3B

IBQ01

KLESI

TQK50

TQK70

KDA50

RQDX3

KFQSA

M9060

3–16 Installing the DIV32-S

3.5 Finding CSR Addresses and Interrupt Vectors
When you add a DIV32 module to the backplane, you need to configure
the new module and reconfigure the modules already installed. Use the
following procedures to find the new CSR addresses and interrupt vectors
for the modules.
For modules in a MicroVAX system, you can either use the CONFIG
program, or you can manually calculate CSR addresses and interrupt
vectors. To calculate values manually, see Chapter 5 of the MicroVAX
Systems Maintenance Guide.
The CONFIG program is in the MicroVMS or VMS SYSGEN utility.
When you type in a list of the devices in the system, CONFIG automatically provides CSR address and interrupt vector information. Table 3–4
lists the devices supported by this utility.
If you have a non-Digital device, see the device documentation for
configuration information.

Installing the DIV32-S 3–17

Table 3–4: Devices Supported by SYSGEN
Device

Enter at DEVICE> Prompt

CXA16

DHV11

CXY08

DHV11

DELQA

QNA

DEQNA

QNA

DPV11

DRV1W

DR11W

DSV11

DIV32

DZQ11

DZ11

IEQ11

RQDX3

UDA

TQK50

TU81

TQK70

TU81

TSV05

TS11

To use the SYSGEN utility, follow these steps:
1. With VMS or MicroVMS running, log in to the system account.
2. Type the following command at the system command prompt:
MCR SYSGEN

3. Press Return . The utility responds with the prompt
SYSGEN>

4. At the prompt, type
CONFIGURE

5. Press Return . The utility responds with the prompt
DEVICE>

6. Enter the abbreviation for each system device (Table 3–4). Include
those devices already installed and those you intend to install.
3–18 Installing the DIV32-S

Installing the DIV32-S 3–19

3.6 Configuring the DIV32-S Module
You select the CSR address for the DIV32 by using the DIL switch (S1)
on the module (Figure 3–8). The CSR address is floating. The factory
setting for the DIV32 is 17761250 8 . If the system has other options with
floating addresses, you may need to change the factory setting.
Figure 3–8: DIV32-S DIP Switch Positioning

S1
1 2

3 4

5 6

7 8 9 10

Switch ON (Closed) - Binary 0

Switch OFF (Open) - Binary 1
FACTORY

SETTINGS

3–20 Installing the DIV32-S

AEO-A-0007-2

Figure 3–9: CSR Address Switch Setting Guide
EXAMPLE SETTING
= 17760640(0CTAL)

SWITCHPACK
= SWITCH ON (CLOSED) = BINARY 0

= SWITCH OFF (OPEN) = BINARY 1

INTERPRETED

DECODED

AS ALL 1s

BY DEVICE

SEE
NOTE
BIT

DEVICE
ADDRESS

0
EACH GROUP IDENTICAL
0

= 6

= 7

NOTE:
WRITE THE ADDRESS YOU
NEED IN THE BLANK ROW.

= 1

= 2

= 0

= 3

= 4

= 5

= 6

= 7

MA-X0199-88

To calculate the CSR address for the DIV32, see Section 3.5.
Figure 3–9 as a guide in setting the switches.

Use

The interrupt vector is also floating. It is set by the software and cannot
be changed by switches.

3.7 Operating System Shutdown
It is the customer’s responsibility to shut down the operating
system software.
Make sure that the operating system software has been shut down before
you continue. Leave the system power on.

Installing the DIV32-S 3–21

3.8 Testing the Existing System
You need to gain access to the system controls before you can test the
existing system. Refer to the system documentation for procedures to
help you gain access to the system controls. Test the existing MicroVAX
system as follows:
1. Insert the MicroVAX diagnostic monitor (MDM) diagnostic tape cartridge or diskette into the system drive.
2. Boot MDM.
3. Test the existing system to make sure it is running properly. See
the MicroVAX Systems Maintenance Guide for information on testing
and troubleshooting. Chapter 4 of this guide also has information on
testing and troubleshooting.
4. After the test runs successfully, remove the tape cartridge or diskette
and turn the |
power switch off (position ). Unplug the mains
(power) cable from the mains outlet.
IMPORTANT
Always remove the tape cartridge or diskette before turning
power off.

3–22 Installing the DIV32-S

3.9 Relocating Modules in the BA200 Series
Enclosure
Check the recommended module order listed in Section 3.4.3 to determine
which slot you should install the DIV32-SF module in. If you need to
relocate modules in the backplane, use the following procedures and keep
the modules in their original order.

3.9.1 Modules with Blank Covers
After testing the system and switching off as described in Section 3.8,
use the following procedure to remove and install modules with blank
covers:
IMPORTANT
Make sure you are wearing an earthed antistatic wrist strap
when you remove or install modules. Place modules only on an
earthed antistatic mat.

1. Release the two 1/4-turn captive screws that hold the blank cover to
the card cage (Figure 3–10).
2. Pull the blank cover away from the card cage.
3. Note the orientation of any internal cables connected to the module.
Some connectors are not keyed. Carefully label and disconnect the
internal cables.
4. Unlock the module’s release levers by simultaneously pulling up on
the top lever and pulling down on the bottom lever (Figure 3–11).
For a module with a plastic handle, pull out on the plastic handle.
5. Carefully pull the module out of the card cage. Be careful not to
disturb any DIL switches on the module.
6. Confirm the module’s CSR address and interrupt vector (Section 3.5).
If necessary, change the module’s jumper or switch settings.
7. Install the module in its new location by reversing the steps in this
procedure. Do not fasten the 1/4-turn screws yet.

Installing the DIV32-S 3–23

Figure 3–10: Removing the Blank Covers

TO RELEASE: PUSH IN. TURN
COUNTERCLOCKWISE 1/4-TURN.
TO FASTEN: PUSH IN. TURN
CLOCKWISE 1/4-TURN.

NOTE:
THIS ILLUSTRATION SHOWS HOW TO RELEASE
CAPTIVE SCREWS ON ALL BLANK COVERS AND
BULKHEAD HANDLES.
MA-X0015-88

3–24 Installing the DIV32-S

3.9.2 Modules with Handles
Use the following procedure to remove and install modules with handles:
IMPORTANT
Make sure you are wearing an earthed antistatic wrist strap
when you remove or install modules.

1. Note the orientation of external cables connected to the module.
Carefully label the cables, then disconnect them.
2. Release the two 1/4-turn captive screws that hold the module’s handle
to the card cage (Figure 3–10).
3. Unlock the release levers by simultaneously pulling up on the top
lever and pulling down on the bottom lever (Figure 3–11).
4. Pull out on the module’s handle and remove the module from the
card cage. Be careful not to disturb any DIL switches on the module.
5. Confirm the module’s CSR address and interrupt vector (Section 3.5).
If necessary, change the module’s jumper or switch settings.
6. Install the module in its new location by reversing the steps in this
procedure. Do not fasten the 1/4-turn screws yet.

Installing the DIV32-S 3–25

Figure 3–11: Unlocking the Release Levers

NOTE:
THIS ILLUSTRATION SHOWS HOW TO UNLOCK
RELEASE LEVERS AND REMOVE ALL MODULES
WITH ATTACHED HANDLES.
MA-X0016-88

3–26 Installing the DIV32-S

3.10 Installing the DIV32-S Module
Install the DIV32-S module as follows:
WARNING
For installation of the DIV32 in the UK, note the following
disclaimer:
‘‘The ports indicated do not provide isolation sufficient to satisfy
the requirements of the relevant parts of BS6301. Apparatus
connected to these ports must have either been approved to the
relevant parts of BS6301 or have previously been evaluated
against British Telecom (Post Office) Technical Guides 2 or 26
and given permission to attach. Other usage will invalidate any
approval given to this apparatus.’’
The DIV32-S must be installed in enclosure type BA213, BA214
or BA215 supplied by Digital Equipment Company under the
terms of General Approval NS/G/1234/J/100003.
No card or assembly which generates or uses a voltage in excess
of 42.4V peak or DC may be fitted in adjacent Q-Bus slots of
the enclosure in which the DIV32-S is fitted.
For further details, see Appendix A.

IMPORTANT
Be careful not to snag the module’s components on the card
guides or adjacent modules.

power switch off (
1. Turn the |
cable from the mains outlet.

) and remove the mains (power)

2. Insert the DIV32-S module into the appropriate slot, using the
recommended module order listed in Section 3.4.3.
3. Grasp the module’s top and bottom release levers. Lock the module
in place by simultaneously pushing the top lever down and pulling
the bottom lever up (Figure 3–12).
4. Do not fasten the 1/4-turn captive screws yet.
5. Plug the mains (power) cable into a mains outlet and turn the |
power switch on ( | ).
6. After 15 seconds, check that the module’s green self-test LED is on.
This indicates that the self-test was successful.

Installing the DIV32-S 3–27

7. If the green self-test LED does not turn on, make sure the module
is correctly inserted. If the LED still does not turn on, see Chapter
6 of the MicroVAX Systems Maintenance Guide for troubleshooting
procedures.
8. Turn the |
power switch off (
cable from the mains outlet.

) and remove the mains (power)

3.11 Verifying the Earth Connections
When you install a module with a blank cover or flush handle next to a
recessed-handle module, you must install a gap filler assembly between
the modules to meet EMI regulations. Without the gap filler, circuitry
on the blank-cover or flush-handle module is exposed.
Two gap filler assemblies (Part Number 70-24505-01) are provided with
the kit. Each gap filler assembly includes one gap filler and two screws.
Use as many of the assemblies as you need for your configuration. You
may not need any.
Check that the earth connections are correctly in place as follows:
1. Check the backplane to see if any recessed-handle module is next to
a module with a blank cover or a flush handle. There should not be
any open spaces between modules in the backplane.

3–28 Installing the DIV32-S

Figure 3–12: Inserting the Module

NOTE:
THIS ILLUSTRATION SHOWS HOW TO
INSERT ALL MODULES WITH ATTACHED HANDLES
AND LOCK RELEASE LEVERS.
MA-X0017-88

Installing the DIV32-S 3–29

Figure 3–13: Earth Connections

GAP FILLER

SCREWS

BLANK COVER

RECESSED HANDLE

GAP FILLER

NOTE:
THE GAP FILLER IS MOUNTED ONTO THE BLANK
COVER TO CLOSE THE OPEN SPACE BETWEEN
THE RECESSED MODULE AND THE BLANK COVER.
MA-X0018-88

2. If so, make sure a gap filler assembly is installed on the side of
the blank cover or flush handle that is next to the recessed-handle
module (Figure 3–13).

3–30 Installing the DIV32-S

NOTE
There should not be any open spaces between the modules
in the backplane.

a. If there are no open spaces, you do not need the gap filler
assemblies. Fasten the 1/4-turn captive screws on all handles
and covers in the backplane.
b. If there are open spaces, make sure a gap filler assembly is
installed on the side of the blank cover or flush handle that is
next to the recessed-handle module (Figure 3–13).
Figure 3–12 shows how to insert the module.
3. Install the gap filler assembly, if needed, as follows:
a. Fit the gap filler (Part Number 70-24505-01) onto the side of the
blank cover or flush-handle module that is next to the recessedhandle module. Make sure the gap filler’s tabs fit into the tab
indentations on the blank cover or flush handle (Figure 3–14).
Use the two screws that come with the assembly to attach the
gap filler at the top and bottom.
b. If you have a blank cover, place the blank cover with the gap
filler over the card cage slot.
If you have a flush-handle module, insert the module into the
card slot.
c.

Make sure there is correct earth (no open spaces) between the
two modules.

d. Fasten the 1/4-turn captive screws on all handles and covers in
the backplane.

Installing the DIV32-S 3–31

Figure 3–14: Attaching the Gap Filler Assembly

I/4 INCH
SCREW

GAP FILLER
ASSEMBLY

1/4 INCH
SCREW

SINGLE-WIDTH
BLANK BULKHEAD
COVER

GAP FILLER ASSEMBLY
MOUNTED ON BLANK
BULKHEAD COVER

MA-X0019-88

3–32 Installing the DIV32-S

Chapter 4
Running Diagnostics and Hardware
Troubleshooting
WARNING
Always unplug the ISDN TE lead before touching components
on the DIV32.

4.1 Testing Overview
This section describes the tests you should use to make sure the DIV32
and the MicroVAX system are operating correctly.
Use the CPU ROM-based diagnostics and the MicroVAX diagnostic
monitor (MDM) to test a MicroVAX system. Release 129 or later of
MDM supports the DIV32. The name by which the DIV32 is known
to the diagnostics is NADIA. The MDM software provides the following
five groups of menu-driven tests:
Verify mode functional tests

user or Field Service

Verify mode exerciser tests

user or Field Service

Service mode functional tests

Field Service

Service mode exerciser tests

Field Service

Utility tests

Field Service

Running Diagnostics and Hardware Troubleshooting 4–1

NOTE
For BA214 enclosures, use the Ethernet Server Kit (part number ZNA07-CM, -CP, or -C5) to test the system.

To verify the system, do the following:
1. Plug the mains (power) cable into the wall outlet and turn the |
power switch on (position | ).
Do not connect the ISDN TE cable to the DIV32.
2. After 15 seconds, check that the module’s green self-test LED is on.
This indicates that the self-test was successful. If the green self-test
LED did not turn on, make sure the module is correctly inserted.
If the LED still does not turn on, refer to Section 4.4, DIV32-M
Troubleshooting or Section 4.5, DIV32-S Troubleshooting.
3. Insert the MDM tape cartridge or diskette into the drive.
4. Boot the MDM drive.
5. Type 2 at the main menu to display a list of devices in the system.
Look at the list of devices displayed to make sure the new module
is listed along with the existing modules and devices. If not, repeat
the installation sequence and make sure you have set the module
switches correctly. Check the list to make sure the new module is
included. If not, repeat the installation sequence and make sure you
have set the module switches correctly.
6. Type 1 at the main menu to run the basic system test.
This test should complete without error. If an error occurs, see Section 4.4, DIV32-M Troubleshooting or Section 4.5, DIV32-S Troubleshooting.
7. Return to the main menu and type 1 , to select the DIV32 Functional
Service Test. Connect the loopback plug and run this test. If the test
fails, refer to Section 4.4, DIV32-M Troubleshooting or Section 4.5,
DIV32-S Troubleshooting; if the test succeeds, remove the loopback
plug.
8. Connect the ISDN TE cable to the DIV32. If this cable has been
provided by Digital, connect the ISDN loopback (provided with the
cable) to the network end of the cable.

4–2 Running Diagnostics and Hardware Troubleshooting

Run the DIV32 Functional Service Test again. If it fails, then one or
more of the following must be true:
•

the cable is not connected properly

•

the cable is faulty

•

the ISDN female connector is faulty.

Refer to Section 4.4, DIV32-M Troubleshooting or Section 4.5, DIV32S Troubleshooting. If the test succeeds, remove the loopback connector and connect the cable to the ISDN network wall socket (jack).
9. Remove the tape cartridge or diskette from the drive.
10. Turn the |

power switch off (position

4.2 DIV32 MDM Diagnostics Overview
"FV" stands for "Functional Verify" in the following tests.

4.2.1 Test FV1 - Self-Test and Register Read/Write Test
This test checks that the Self-Test works correctly and that the reset
without Self-Test works. It also checks the DIV32 registers and access
to the DIV32 internal command memory.

4.2.2 Test FV2 - Device Initialisation Test
This test checks that the DIV32 can be initialised for the processing of
commands.

4.2.3 Test FV3 - Basic Command List Test
This test checks that the DIV32 can read command blocks from the command list and properly place them on the response list after processing.
It also checks that the Commands Available, Command Queue Valid and
Responses Available flags in the flags register work correctly.

4.2.4 Test FV4 - Interrupt Test
This test checks that the DIV32 interrupts through the correct vector
when the interrupt enable flag is set. It also checks that clearing the
interrupt enable flag prevents the DIV32 from generating any more
interrupts.

Running Diagnostics and Hardware Troubleshooting 4–3

4.2.5 Test FV5 - Extended Command List Test
This test checks that the DIV32 can start processing commands with
a non-empty response list and that it processes multiple commands
correctly.

4.2.6 Test FV6 - Simple Data Transmission Test on channels
B1 and B2
This test checks that a block of data can be transferred through the
internal loopback at FIFO level, on channel B1 and B2, and received
without the data being corrupted.
A 512-byte block of data is transmitted and received on each channel.
The DDCMP protocol is used.

4.2.7 Test FV7 - Buffer Addressing Test
This test checks that bits 0 to 17 (the low 18 bits) of the Q-Bus DMA
address register in the QIC can be set to both 0 and 1.
In this test two 65535-byte data buffers are allocated and a maximum
size data block is transferred via the internal loopback over the BChannels, using the HDLC protocol.

4.2.8 Test FV8 - Multiple Data Transmission Test on channels
B1, B2, and D
This test checks that a block of data can be transferred and received
without the data being corrupted, through internal loopback at SBC
level.

4.2.9 Functional Service Test FS1 - ISDN External Loopback
There is only one Functional Service test.
The ISDN external loopback allows the diagnostics to check the signal
continuity from the ISDN line driver/receiver up to the user connector.
This ensures that the signal path is neither cut, nor has shorts. However,
this does not check the interface in its normal mode of operation.
NOTE
This test requires either one of the ISDN external loopbacks
to be fitted. It must be done first with the loopback plug, and
repeated with the loopback socket (jack) at the end of the DIV32
TE cable to isolate failures on this cable.

4–4 Running Diagnostics and Hardware Troubleshooting

4.2.10 Exerciser Test
The same exerciser test is used by both Service and Verify modes of
MDM.
The aim of the Exerciser test is to operate the MicroVAX system in a way
similar to normal system operation. By running several exerciser tests
together, faults in system design and operational problems can usually
be isolated and corrected.
The Exerciser test will simulate the normal operation of the DIV32 by
using the following features in internal loopback mode:
1. Interrupts (same as test FV4)
2. Multiple data transfers on the three channels simultaneously.

4.2.11 Utility Test - Run Specified Self-Test Routine
This test is useful only for people in Manufacturing or Repair centres,
to isolate faults to the logic level and to aid in the repair of the faulty
modules. There is no need to run the Utility test at installation time or
when repairing the DIV32 on site.

4.3 Running MDM
The MicroVAX system manuals describe how to load MDM into the
MicroVAX and run MDM diagnostics. All Verify mode diagnostics and
Service mode diagnostics, including Utility tests, can be run from the test
menus that are displayed when MDM is booted. You will only need to
use the command line interface to MDM (selected from the service menu)
if you need to run individual tests, or if the system is not configured with
all devices at their correct floating addresses.
The rest of this section describes operation of the diagnostics with release
128 of MDM. Later releases of MDM may operate slightly differently.
Refer to the MicroVAX Diagnostic Monitor Users Guide for full details of
MDM.

Running Diagnostics and Hardware Troubleshooting 4–5

4.3.1 Running Service Mode Tests
The service mode functional and exerciser tests are executed by making
the following menu selections from the MDM Main Menu:
1. Select "Display the service menu" from the Main Menu.
2. Select "Display the device menu" from the Service Menu.
3. Select the DIV32 unit to test from the Device Menu.
4. Select either "Perform all functional tests" or "Perform the exerciser
test" from the selected device menu.
The Service Setup is executed when service mode tests are run for the
first time after loading the MDM system, or after selecting the "Display
system configuration and devices" from the Main Menu.
The service setup prompts the operator to connect the H3072 loopback
plug and press the RETURN key.

4.3.2 Running Utility Tests
The Utility tests are executed by making the following menu selections
from the MDM Main Menu:
1. Select "Display the service menu" from the Main Menu.
2. Select "Display the device menu" from the Service Menu.
3. Select the DIV32 unit to test from the Device Menu.
4. Select "Display the device utilities menu" from the selected device
menu.
5. Select "Run specified self-test" from the device utilities menu.

4.4 DIV32-M Troubleshooting
4.4.1 DIV32-M FRUs
The DIV32-M comprises the following items:
•

the M7531-00 module

•

one 17-00712 flat cable

•

the H3071 interface panel

•

the H3072 loopback plug

4–6 Running Diagnostics and Hardware Troubleshooting

As a separate order, any of the following items can be ordered:
•

The BC23T ISDN TE cable, for use outside Germany. This is
available in two lengths: 10 feet and 25 feet, the full part numbers
being BC23T-10 and BC23T-25 respectively.

•

The H3073 loopback female connector, for use outside Germany.

•

The BC23U ISDN TE cable, for use in Germany only. This is
available in two lengths: 10 feet and 25 feet, the full part numbers
being BC23U-10 and BC23U-25 respectively.

•

The H3074 loopback female connector, for use in Germany only.

Alternatively, a TE cable from another vendor may be used with the
DIV32.
These optional items are illustrated in Figure 4–1 and Figure 4–2.
Figure 4–1: The BC23T ISDN TE Cable and H3073 Loopback

AEO-A-0004-1

Running Diagnostics and Hardware Troubleshooting 4–7

Figure 4–2: The BC23U ISDN TE Cable and H3074 Loopback

!"$

!#$

!"#$

AEO-A-0005-2

4.4.2 DIV32-M MDM FRU Report
Any of the above-mentioned parts may be the cause of a DIV32 failure.
However, as the H3071 interface panel provides the M7531 module with
the ISDN interface clock, there is no way for the diagnostics to isolate a
failure among the module, the flat cable and the H3071 interface panel
(and the loopback), should the ISDN interface fail.

4.4.3 DIV32-M Troubleshooting Flowchart
For systematic troubleshooting of the DIV32-M, use the following
flowchart:

4–8 Running Diagnostics and Hardware Troubleshooting

Figure 4–3:

DIV32-M Troubleshooting Flowchart

START

Swap M7531-00

Run Power-up
Self-Test

Passed?

Yes
Has the
M7531 been
swapped?

Boot MDM
Diagnostics

Yes
At main menu, select
"Test the System"
Yes

Yes
Connect H3072 loopback

Has the
17-00712
cable been
swapped?

Passed?

2
No
At the MDM main menu,
select (in sequence):
"Display the Service Menu"
"Display the device menu"
DIV32
"Perform all functional tests"

Swap H3071 panel
or 17-00712 cable
or H3072 loopback

Swap the
17-00712
cable

1
Does
MDM report the
M7531 as the
failed FRU?

Yes

No
Tests
Passed?
Yes
3

Does MDM
report that the M7531
or the 17-00712 cable or the
H3071 panel is the
failed FRU?

Yes

MDM bug. Escalate problem
AE-A000F-01

Figure 4–3 Cont’d. on next page
Running Diagnostics and Hardware Troubleshooting 4–9

Figure 4–3 (Cont.):

DIV32-M Troubleshooting Flowchart

Has
the H3071
panel been
swapped?
Yes

Swap
H3071
panel

Is it
physically
No
possible to connect
the loopback socket to the
end of the BC23x*
cable?
System is OK
(though BC23x*
cable has not
been tested)

Yes

1
One of the spares
is bad. Restart the
entire troubleshooting
procedure; assume
nothing has been
tested already.

Replace the H3072 by the
BC23x* cable and attach
H3073 or H3074 loopback
socket to the network end
of the BC23x* cable

At the MDM main menu,
select (in sequence):
"Display the Service Menu"
"Display the device menu"
DIV32
"Perform all functional tests"

* The full part number of the
cable is one of the following:
BC23U-10 BC23U-25
BC23T-10 BC23T-25

Tests
Passed?

Yes
5

No
Swap BC23x* cable or
H3073 or H3074 loopback
AE-A000G-02

Figure 4–3 Cont’d. on next page

4–10 Running Diagnostics and Hardware Troubleshooting

Figure 4–3 (Cont.):

DIV32-M Troubleshooting Flowchart
5

Remove H3073 or H3074 loopback

Tests
Passed?

System
(including the
BC23x* cable)
is OK

Yes
* The full part number of the
cable is one of the following:
BC23U-10 BC23U-25
BC23T-10
BC23T-25

Swap BC23x* cable

6
AE-A002T-00

Once the FRU has been identified and replaced, the MDM diagnostics
must be run again, in case there is another faulty FRU.

4.5 DIV32-S Troubleshooting
4.5.1 DIV32-S FRUs
The DIV32-S comprises the following items:
•

the M7531-PA module

•

the H3072 loopback plug

As a separate order, any of the following items can be ordered:
•

The BC23T ISDN TE cable, for use outside Germany. This is
available in two lengths: 10 feet and 25 feet, the full part numbers
being BC23T-10 and BC23T-25 respectively.

•

The H3073 loopback female connector, for use outside Germany.

•

The BC23U ISDN TE cable, for use in Germany only. This is
available in two lengths: 10 feet and 25 feet, the full part numbers
being BC23U-10 and BC23U-25 respectively.

Running Diagnostics and Hardware Troubleshooting 4–11

•

The H3074 loopback female connector, for use in Germany only.

Alternatively, a TE cable from another vendor may be used with the
DIV32.
These optional items are illustrated in Figure 4–1 and Figure 4–2.

4.5.2 DIV32-S MDM FRU Report
Any of the above-mentioned parts may be the cause of a DIV32 failure.

4.5.3 DIV32-S Troubleshooting Flowchart
For systematic troubleshooting of the DIV32-S, use the following
flowchart:

4–12 Running Diagnostics and Hardware Troubleshooting

Figure 4–4:

DIV32-S Troubleshooting Flowchart
START
Swap M7531-PA

Run Power-up
Self-Test

Passed?

Yes
Boot MDM Diagnostics

At main menu, select
"Test the System"

Yes

Connect H3072 loopback

At the MDM main menu,
select (in sequence):
"Display the Service Menu"
"Display the device menu"
DIV32
"Perform all functional tests"

Tests
Passed?

Passed?
No

M7531-PA
failed?

Yes

No
Refer to
Troubleshooting Information
for the failed device

Yes
A
AE-A000D-01

Figure 4–4 Cont’d. on next page
Running Diagnostics and Hardware Troubleshooting 4–13

Figure 4–4 (Cont.):

DIV32-S Troubleshooting Flowchart

Is it
physically
No
possible to connect
the loopback socket to the
end of the BC23x*
cable?

System is OK
(though BC23x*
cable has not
been tested)

Yes
Replace the H3072 by the
BC23x* cable and attach
H3073 or H3074 loopback
socket to the network end
of the BC23x* cable
* The full part number of the
cable is one of the following:
BC23U-10 BC23U-25
BC23T-10
BC23T-25

At the MDM main menu,
select (in sequence):
"Display the Service Menu"
"Display the device menu"
DIV32
"Perform all functional tests"

Tests
Passed?

Yes

No
Swap BC23x* cable or H3073 or H3074 loopback
AE-A000E-02

Figure 4–4 Cont’d. on next page

4–14 Running Diagnostics and Hardware Troubleshooting

Figure 4–4 (Cont.):

DIV32-S Troubleshooting Flowchart
B

Remove H3073 or H3074 loopback

Tests
Passed?

System
(including the
BC23x* cable)
is OK

Yes
* The full part number of the
cable is one of the following:
BC23U-10 BC23U-25
BC23T-10
BC23T-25

Swap BC23x* cable

C
AE-A002U-00

Once the FRU has been identified and replaced, the MDM diagnostics
must be run again, in case there is another faulty FRU.

Running Diagnostics and Hardware Troubleshooting 4–15

Appendix A
UK Requirements for DIV32 Use
BABT is the British Approvals Board for Telecommunications.
Note
Failure to meet the following requirements will automatically
cancel the BABT approval for connection of a DIV32 to the ISDN
Network.

A.1 DIV32-M
For BABT approval for connection on the ISDN Network, the DIV32-M
system configuration must meet the following criteria:
1. The adjacent boards (see Section A.3.1) to the DIV32 must not carry
voltages in excess of 42.4V peak or DC.
2. The adjacent boards (see Section A.3.1) to the DIV32 must meet the
following specifications:
•

The maximum component ‘‘skyline’’ height must not exceed 0.344
in. for uninsulated parts, and 0.375 in. for insulated parts.

•

On the other side of the board, leads must not protrude by more
than 0.062 in.

•

The printed circuit board must be no thicker than 0.065 in.

UK Requirements for DIV32 Use A–1

If the adjacent board does not meet these specifications, it must
be moved at least one slot away from the DIV32. Then either
another board meeting these specifications or a grant module (see
Section A.3.2) must be inserted between the DIV32 and the nonconformant board.

A.2 DIV32-S
For BABT approval for connection on the ISDN Network, the DIV32-S
system configuration must meet the following criteria:
1. The adjacent boards (see Section A.3.1) to the DIV32 must not carry
voltages in excess of 42.4V peak or DC.
2. The adjacent boards (see Section A.3.1) to the DIV32 must meet the
following specifications:
•

The maximum component ‘‘skyline’’ height must not exceed 0.7
in. for uninsulated parts, and 0.75 in. for insulated parts.

•

On the other side of the board, leads must not protrude by more
than 0.070 in.

•

The printed circuit board must be no thicker than 0.065 in.

A.3 Definitions of Terms
A.3.1 Adjacent Boards
Boards which are inserted into the system in the Q-Bus slot on either
side of the DIV32 are called ‘‘adjacent boards’’. These are the closest
modules to the DIV32.

A.3.2 Grant Modules
A grant module is a board which has no components. It comprises a
blank printed circuit board with no tracks except for those which ensure
the interrupt acknowledge and DMA grant signal continuity to the next
board.

A–2 UK Requirements for DIV32 Use

Index
A
adjacent boards, A–2
associated documentation, xv to
xvi

B
BA123, 2–6 to 2–7, 2–33 to 2–38
backplane, 2–20
bus continuity, 2–20 to 2–21
card cage door, removal of, 2–35
configuration worksheet, 2–12
inner panel, removal of, 2–34
right side panel, removal of,
2–33
BA200 series, 3–3 to 3–5
configuration worksheets, 3–11
relocating modules in, 3–23
BA23, 2–4 to 2–5, 2–29 to 2–32
backplane, 2–19
bus continuity, 2–19 to 2–20
configuration worksheet, 2–12
I/O distribution panel, removal of,
2–29
insert panel cabling, 2–32
Basic Access, 1–2
BC23T ISDN TE cable
see ISDN connector and cable
BC23U ISDN TE cable
see ISDN connector and cable
blank covers, removal of, 3–23

bus continuity, 2–17, 3–15
bus grant continuity path, 3–15
bus load data
for DIV32-M, 2–15
for DIV32-S, 3–11

C
cabinets, 2–3 to 2–8, 3–3 to 3–5
CCITT standards, 1–1
configuring
DIV32-M module, 2–26
DIV32-S module, 3–20
conventions, xv
country specifications, 1–1
CSR addresses, 2–23 to 2–27,
3–16 to 3–21

D
diagnostics, 4–1 to 4–15
DIV32
ISDN connector, pin assignments,
1–4
MDM diagnostics, 4–3 to 4–6
overview, 1–8 to 1–9
versions, 1–10 to 1–11
DIV32-M, 1–11
cabinet kit contents, 2–11
configuring, 2–26
DIP switch positioning, 2–26
FRUs, 4–6 to 4–11

Index–1

DIV32-M (cont’d.)
installation, 2–1 to 2–43
kit contents, 2–10
MDM FRU report, 4–8
troubleshooting, 4–6 to 4–11
troubleshooting flowchart, 4–8
DIV32-S, 1–10
configuring, 3–20
DIP switch positioning, 3–20
FRUs, 4–11 to 4–15
installation, 3–1 to 3–32
MDM FRU report, 4–12
troubleshooting, 4–11 to 4–15
troubleshooting flowchart, 4–12
DIV32-SA, 1–11
kit contents, 3–7
DIV32-SF, 1–11
kit check-list, 3–8
kit contents, 3–8

E
earth connections, 3–28
EMI, 3–5
EMI clips, 3–9 to 3–10
EOS clips, 3–9 to 3–10
exerciser test, 4–5
extended passive bus configuration,
1–7

F
field service, xiv
functional service test FS1 - ISDN
external loopback, 4–4

G
gap filler assembly, 3–31
grant modules, A–2
ground connections
See earth connections

Index–2

H
H3073 loopback, 4–7
H3074 loopback, 4–8
H9642, 2–7 to 2–8, 2–39 to 2–43
bus continuity, 2–21 to 2–22
configuration worksheet, 2–13
installing the module, 2–41
lowering rear I/O distribution
panel, 2–40
opening rear door, 2–39
hardware troubleshooting, 4–1 to
4–15
host machine, 1–9

I
installing the DIV32-M module,
2–28 to 2–43
installing the DIV32-S module,
3–27 to 3–32
intended audience, xiii to xiv
interrupt vectors, 2–23 to 2–27,
3–16 to 3–21
ISDN, 1–1 to 1–7
connector and cable, 1–4 to 1–5,
4–7, 4–8
electrical interface, 1–6
mechanical interface, 1–4 to
1–6

M
MDM, 4–3 to 4–6
Service Mode tests, 4–6
Utility tests, 4–6
MicroVAX memory interconnect,
2–18
module order, 2–22, 3–16

N
NADIA, 4–1

O
operating system shutdown, 2–27,
3–21

P
point to point configuration, 1–7
power requirements
for DIV32-M, 2–15
for DIV32-S, 3–11
power supplies, 2–22, 3–15
protocols, 1–8

R
relocating modules in the BA200
series enclosure, 3–23

test FV4 - interrupt test, 4–3
test FV5 - extended command list
test, 4–4
test FV6 - simple data transmission
test on channels B1 and B2,
4–4
test FV7 - buffer addressing test,
4–4
test FV8 - multiple data
transmission test on channels
B1, B2, and D, 4–4
testing overview, 4–1 to 4–3
testing the existing system, 2–28,
3–22
troubleshooting, 4–1 to 4–15

U
UK requirements for DIV32 use,
A–1 to A–2
Utility test - run specified Self-Test
routine, 4–5
Utility tests, 4–6

S-Bus configurations, 1–6 to 1–7
Self-Maintenance customers, xiv
Service Mode tests, 4–6
Service setup, 4–6
short passive bus configuration, 1–7
signal levels on ISDN bus, 1–6
S-Interface, 1–3 to 1–6
site preparation, 2–8, 3–5
software backup, 2–11, 3–10
system configuration, 2–12, 3–11
system enclosures, 2–3 to 2–8, 3–3
to 3–5

T
test FV1 - Self-Test and register
Read/Write test, 4–3
test FV2 - device initialisation test,
4–3
test FV3 - basic command list test,
4–3

Index–3