HSC Controller Installation Manual

This document, the "HSC Controller Installation Manual" (EK-HSCMN-IN-002), provides comprehensive procedures for the installation, power-up, testing, and upgrading of various Digital Equipment Corporation Hierarchical Storage Controllers (HSC). It is primarily intended for Digital Customer Services personnel and knowledgeable customers.

Here's a summary of its key contents:

1. General Information (Chapter 1):

   • HSC Controller Family: Describes different models: HSC40 (entry-level, 800 I/O/sec, up to 3 data channels, 12 devices), HSC50 (original, 550 I/O/sec, up to 6 data channels, 24 devices, no longer manufactured), HSC60 (entry-level, like HSC90 but fewer ports, up to 20 SDI disks/12 STI tapes), HSC70 (1150 I/O/sec, up to 8 data channels, 32 devices), and HSC90 (high-end, up to 8 data channels, 48 SDI disks/24 STI tapes). All models are upgradable within the family.
   • Components & Modules: Details the various modules (Port Processor, Port LINK, Port Buffer, Disk/Tape Data Channel, Memory, M.cache) and their functions, slot locations, and part numbers. The optional M.cache module (32 MB ECC memory) for HSC60/90 is highlighted.
   • VAXcluster Integration: Explains the HSC controller's role as a high-speed storage server within a VAXcluster system, connecting to hosts via a CI (Computer Interconnect) bus and star coupler.
   • Operating Software: Notes that software for the HSC controller, including device integrity tests and utilities, is shipped separately.

2. Installation (Chapter 2):

   • Site Preparation: Covers environmental considerations (e.g., electrostatic discharge (ESD) prevention), floor space requirements, and power specifications (single-phase and three-phase AC).
   • Unpacking & Deskidding: Provides instructions for unpacking the HSC controller, removing shipping materials, and adjusting cabinet levelers.
   • Node Configuration: Details how to set unique node addresses using switches on the Port LINK modules (L0118-xx) and the importance of consistent Slot Count Timing (S3 switch) across the cluster to avoid communication issues. Specific jumper settings for different LINK module revisions are provided.
   • Cabling: Describes the installation of CI Bus cables (transmit/receive paths) to the star coupler and SDI/STI cables for disk/tape devices, including proper shielding and cable management.
   • Power Control: Explains how to install power control bus cables and set power controller switches for sequential power-up in multi-device systems.
   • Console Setup: Guides on configuring video terminals and printers for console access.

3. Power Up (Chapter 3):

   • Outlines distinct power-up procedures for HSC50 controllers versus other HSC models due to differences in power controllers. Steps involve verifying circuit breaker and DC power switch positions, connecting AC power, and checking indicator lights and fan operation.
   • UART Echo Test: Provides a basic test to verify communication between the console terminal and the HSC's I/O control processor module.

4. Device Integrity Tests (Chapter 4):

   • These tests (ILRX33, ILTU58, ILMEMY, ILCACH, ILDISK, ILTAPE, ILTCOM, ILEXER) are crucial for verifying subsystem operation post-installation. They run concurrently with other HSC processes and generally do not interfere with other devices.
   • Generic Format: All tests use a standardized prompt syntax and error message format, identifying Field Replaceable Units (FRUs).
   • Specific Test Details: Each test's purpose, system requirements, operating instructions, termination methods, and detailed error messages (including their causes and potential resolutions) are thoroughly documented. For example, ILCACH tests the cache memory module, ILDISK tests disk drive integrity, and ILTAPE tests tape device integrity. ILEXER is a multidrive exerciser for general stress testing.

5. Setting System Parameters (Chapter 5):

   • Describes how to configure essential system parameters using the SETSHO utility, such as System Identification Number, HSC Controller System Name, and Storage Allocation Class (for disk and tape). These settings are stored in the System Configuration Table (SCT) and require a reboot to take effect. OCP fault codes are also explained.

6. Upgrade Procedures (Chapters 6-9):

   • Dedicated chapters detail specific upgrade paths (e.g., HSC40 to HSC60, HSC40 to HSC70, HSC60 to HSC90, HSC70 to HSC90).
   • Common Steps: Preparation (kit verification, gathering system parameters), installing new modules (e.g., higher performance processors, memory, LINK modules), installing auxiliary power supplies (if required for the new configuration), re-cabling (e.g., 8-port K.si SDI cables), post-upgrade testing (running device integrity tests), and completing the upgrade (updating serial number labels and logos). Instructions for returning removed modules are also included.

7. Option Installations (Chapters 10-12):

   • HSC50 Auxiliary Power Supply (Chapter 10): Specific installation steps for adding an auxiliary power supply to the HSC50 controller when increasing the number of data channel modules.
   • K.si Module Options (Chapter 11): Covers the installation of 4-port (L0119-YA) and 8-port (L0119-YB) K.si modules, including restrictions, guidelines for enhanced performance (prioritizing faster devices), initialization procedures, and detailed descriptions of module LEDs and switchpack settings (which are for manufacturing/repair only).
   • M.cache Module Options (Chapter 12): Guides on installing the M.cache module for HSC60/90 controllers, including software version requirements, auxiliary power supply installation for HSC60, post-installation tests (ILMEMY, ILCACH), and descriptions of M.cache module indicators.

The document emphasizes ESD grounding precautions throughout all hardware manipulation steps and strongly recommends consulting related Digital Equipment Corporation manuals for deeper technical details or troubleshooting.