applicationDEC 400xP SYSTEM

This document is an Illustrated Parts Breakdown (IPB) for the applicationDEC 400xP SYSTEM, published by Digital Equipment Corporation on September 25, 1992. Its primary purpose is to help users identify system parts and their locations.

The IPB is structured with figures illustrating the system, assemblies, and subassemblies, along with associated parts lists. Users are guided to locate an item in a figure, note its callout number, and then find detailed information in the corresponding parts list. The parts lists provide the figure and item number, a description (indicating subassemblies with asterisks), the DEC Part Number, ECO Cut-In information, a "Used On Code" for product variations, and cross-references to other figures.

Key components detailed in the document include various system configurations based on CPU speed (25 MHz, 33 MHz, 50 MHz), the Kernel Assembly (PS20A), Main Logic Module (8 Slot EISA), CPU Modules, Cache Memory Modules (64 KB, 128 KB), SIMM modules (2 MB, 4 MB, 8 MB, 16 MB), and various drives (RX23, RZ2X, RZ5X, floppy, quick tape). It also lists associated hardware such as screws, cables (floppy, SCSI, power), panels, speakers, fans, and regulatory labels. The illustrations denote "FRU (Field Replaceable Unit) Level Parts" and "Optional Parts."

The document also includes an ECO/Revision History table and comprehensive Part Number/Part Description Index sections to facilitate quick lookups. Additionally, it contains standard legal disclaimers regarding Digital Equipment Corporation's reserved rights, lack of responsibility for errors, copyright (1992), and listed trademarks.